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TWI626739B - LED panel display structure - Google Patents

LED panel display structure Download PDF

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Publication number
TWI626739B
TWI626739B TW106116314A TW106116314A TWI626739B TW I626739 B TWI626739 B TW I626739B TW 106116314 A TW106116314 A TW 106116314A TW 106116314 A TW106116314 A TW 106116314A TW I626739 B TWI626739 B TW I626739B
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Taiwan
Prior art keywords
pin
base
panel display
display structure
led panel
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TW106116314A
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Chinese (zh)
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TW201901948A (en
Inventor
林韋丞
蕭建仁
曾士修
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關鍵禾芯科技股份有限公司
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Priority to TW106116314A priority Critical patent/TWI626739B/en
Priority to CN201710364183.9A priority patent/CN107958638A/en
Priority to US15/609,045 priority patent/US20180336815A1/en
Application granted granted Critical
Publication of TWI626739B publication Critical patent/TWI626739B/en
Publication of TW201901948A publication Critical patent/TW201901948A/en

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
    • G06F3/0421—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04104—Multi-touch detection in digitiser, i.e. details about the simultaneous detection of a plurality of touching locations, e.g. multiple fingers or pen and finger
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0439—Pixel structures
    • G09G2300/0452—Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2354/00—Aspects of interface with display user
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Multimedia (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

一種LED面板顯示器結構，係包含：一基部；該基部設有一第一電極 層、一第二電極層、複數開關元件、複數發光二極體元件、一控制芯片；該第一、二電極層分別縱向及橫向設置於前述基部；該等開關元件具有一第一接腳及一第二接腳及一第三接腳，該第一、二接腳分別與前述第一、二電極層電性連接；該等發光二極體元件具有一第一腳位及一第二腳位，該第一腳位與前述第三接腳電性連接，該第二腳位與一接地端電性連接；該控制芯片與前述第一、二電極層電性連接，透過本發明係可僅透過單一控制芯片即可控制複數發光二極體元件藉此達到節省成本及實現提升單位解析度之優點者。 An LED panel display structure includes: a base; the base is provided with a first electrode a layer, a second electrode layer, a plurality of switching elements, a plurality of light emitting diode elements, and a control chip; the first and second electrode layers are respectively disposed longitudinally and laterally on the base; the switching elements have a first pin and a first pin and a third pin, wherein the first and second pins are electrically connected to the first and second electrode layers respectively; the light emitting diode elements have a first pin and a second leg The first pin is electrically connected to the third pin, and the second pin is electrically connected to a ground; the control chip is electrically connected to the first and second electrode layers, and the system is The utility of the plurality of light-emitting diode elements can be controlled by a single control chip, thereby achieving the advantages of cost saving and improved unit resolution.

Description

LED面板顯示器結構 LED panel display structure

一種LED面板顯示器結構，尤指一種僅透過單一控制芯片即可控制複數發光二極體元件，藉此達到節省成本及實現提升單位解析度的LED面板顯示器結構。 The invention relates to an LED panel display structure, in particular to an LED panel display structure capable of controlling a plurality of light-emitting diode components through a single control chip, thereby achieving cost saving and achieving unit resolution improvement.

液晶顯示器訊號掃描方式為一次一列，並且逐列而下。Gate Driver IC連結至電晶體之Gate端，負責每一列電晶體的開關，掃描時一次打開一整列的電晶體。當電晶體打開(ON)時，Source Driver IC才能夠逐行將控制亮度、灰階、色彩的控制電壓透過電晶體Source端、Drain端形成的通道進入Panel的畫素中。因為Gate Driver IC負責每列電晶體的開關，所以又稱為Row Driver或Scan Driver。當Gate Driver逐列動作時，Source Driver IC負責在每一列中將資料電壓逐行輸入，因此又稱為Column Driver或Data Driver。 The LCD signal scanning method is one column at a time and is listed column by column. The Gate Driver IC is connected to the Gate of the transistor and is responsible for the switching of each column of transistors. When scanning, an array of transistors is turned on at a time. When the transistor is turned ON, the Source Driver IC can control the brightness, gray level, and color control voltages through the channels formed by the source and Drain terminals of the transistor into the pixels of the panel. Because the Gate Driver IC is responsible for the switching of each column of transistors, it is also called Row Driver or Scan Driver. When the Gate Driver moves column by column, the Source Driver IC is responsible for inputting the data voltage line by line in each column, so it is also called Column Driver or Data Driver.

以SXGA為例，解析度為1,280 x 1,024，意思為有效顯示區間之畫素矩陣共有1,280行與1,024列，由於單一畫素要呈現彩色則必須包括R、G、B三原色，因此SXGA必須要有1,280 x 3=3,072個Column data。如果Gate Driver IC腳數為256pin，Source Driver IC腳數為384pin，要驅動SXGA的液晶顯示面板則需要1,024/256=4顆Gate Driver IC與1,280 x3/384=10顆Source Driver IC。以相同腳數之驅動IC來驅動XGA(1,024 x 768)，則需要3顆Gate Driver IC與8顆Source Driver IC，這是目前最常用的組合。 Taking SXGA as an example, the resolution is 1,280 x 1,024, which means that the pixel matrix of the effective display interval has 1,280 rows and 1,024 columns. Since the single pixel must be colored, it must include the three primary colors of R, G, and B. Therefore, the SXGA must have 1,280 x 3=3,072 Column data. If the Gate Driver IC has 256 pins and the Source Driver IC has 384 pins, the LCD panel that drives the SXGA requires 1,024/256=4 Gate Driver ICs and 1,280 x3/384=10 Source Driver ICs. Driving the XGA (1,024 x 768) with the same number of drive ICs requires 3 Gate Driver ICs and 8 Source Driver ICs, which is the most common combination.

即表示若解析度越高則所需的驅動IC則需要越多，在有限的單位面積中則無法設置如此多的驅動IC，如此無法實現小面積高解析度之顯示器。 That is, if the resolution is higher, the required driver IC is required to be larger, and it is impossible to provide so many driver ICs in a limited unit area, and thus it is impossible to realize a small-area, high-resolution display.

爰此，為解決上述習知技術之缺點，本發明之主要目的，係提供一種可降低生產成本及透過單一控制芯片控制整體LED面板顯示器藉以實現小面積面板，高解析度的LED面板顯示器結構。 Accordingly, in order to solve the above disadvantages of the prior art, the main object of the present invention is to provide a high-resolution LED panel display structure that can reduce production cost and control an overall LED panel display through a single control chip.

為達上述之目的，本發明係提供一種LED面板顯示器結構，係包含：一基部、一第一電極層、一第二電極層、複數開關元件、複數發光二極體元件、一控制芯片；所述基部具有一第一側及一第二側；該第一電極層具有複數第一電極線路縱向延伸設置於前述基部之第一側；該第二電極層具有複數第二電極線路橫向延伸設置於前述基部之第一側，並與前述第一電極線路相互跨接。 In order to achieve the above object, the present invention provides an LED panel display structure, comprising: a base portion, a first electrode layer, a second electrode layer, a plurality of switching elements, a plurality of light emitting diode elements, and a control chip; The base has a first side and a second side; the first electrode layer has a plurality of first electrode lines extending longitudinally on a first side of the base; the second electrode layer has a plurality of second electrode lines extending laterally The first side of the base portion and the first electrode line are connected to each other.

該等開關元件設置於前述基部之第一側，該等開關元件具有一第一接腳及一第二接腳及一第三接腳，該第一、二接腳分別與前述第一、二電極線路電性連接。 The switching elements are disposed on the first side of the base portion, and the switching elements have a first pin and a second pin and a third pin, and the first and second pins are respectively associated with the first and second The electrode lines are electrically connected.

該等發光二極體元件設置於前述基部之第一側，該等發光二極體元件具有一第一腳位及一第二腳位，該第一腳位與前述第三接腳電性連接，該第二腳位與一接地端電性連接。 The light emitting diode elements are disposed on the first side of the base portion, and the light emitting diode elements have a first pin position and a second pin position, and the first pin position is electrically connected to the third pin The second pin is electrically connected to a ground.

該控制芯片與前述第一、二電極層電性連接。 The control chip is electrically connected to the first and second electrode layers.

透過本發明LED面板顯示器結構，使用單一控制芯片控制LED面板顯示器整體係大幅降低生產製造成本，並且因透過整合LED面板顯示器整體之發光二極體元件之控制由單一控制芯片控制，進而省略複數控制芯片之設置，令小面積面板中具有高解析度之顯示效能並同時具有觸控與指紋辨識功能得以實現。 Through the LED panel display structure of the present invention, the use of a single control chip to control the LED panel display as a whole substantially reduces the manufacturing cost, and the control of the LED component through the integration of the LED panel display is controlled by a single control chip, thereby omitting the complex control The chip is set to enable high-resolution display performance in a small-area panel with both touch and fingerprint recognition.

1‧‧‧LED面板顯示器結構 1‧‧‧LED panel display structure

11‧‧‧基部 11‧‧‧ base

11a‧‧‧觸控區 11a‧‧‧ touch area

11b‧‧‧非觸控區 11b‧‧‧ non-touch area

111‧‧‧第一側 111‧‧‧ first side

112‧‧‧第二側 112‧‧‧ second side

12‧‧‧第一電極層 12‧‧‧First electrode layer

121‧‧‧第一電極線路 121‧‧‧First electrode line

13‧‧‧第二電極層 13‧‧‧Second electrode layer

131‧‧‧第二電極線路 131‧‧‧Second electrode line

14‧‧‧開關元件 14‧‧‧Switching elements

141‧‧‧第一接腳 141‧‧‧first pin

142‧‧‧第二接腳 142‧‧‧second pin

143‧‧‧第三接腳 143‧‧‧ third pin

15‧‧‧發光二極體元件 15‧‧‧Lighting diode components

15a‧‧‧紅色發光二極體 15a‧‧‧Red LED

15b‧‧‧綠色發光二極體 15b‧‧‧Green LED

15c‧‧‧藍色發光二極體 15c‧‧‧Blue LED

15d‧‧‧紅外線(IR)發光二極體 15d‧‧‧Infrared (IR) light-emitting diode

15e‧‧‧可偵測紅外線(IR)二極體 15e‧‧‧Detectable infrared (IR) diodes

15f‧‧‧顯示區塊 15f‧‧‧ display block

15g‧‧‧感應區塊 15g‧‧‧Induction block

151‧‧‧第一腳位 151‧‧‧First position

152‧‧‧第二腳位 152‧‧‧second foot

16‧‧‧控制芯片 16‧‧‧Control chip

17‧‧‧接地端 17‧‧‧ Grounding

18‧‧‧絕緣層 18‧‧‧Insulation

19‧‧‧軟性電路板 19‧‧‧Soft circuit board

20‧‧‧電路走線 20‧‧‧Circuit trace

第1圖係為本發明LED面板顯示器結構之第一實施例之俯視圖；第2圖係為本發明LED面板顯示器結構之第一實施例之組合剖視圖；第3圖係為本發明LED面板顯示器結構之第二實施例之組合圖；第4圖係為本發明LED面板顯示器結構之第三實施例之組合圖。 1 is a plan view of a first embodiment of an LED panel display structure of the present invention; FIG. 2 is a combined cross-sectional view of a first embodiment of the LED panel display structure of the present invention; and FIG. 3 is a LED panel display structure of the present invention. The combination diagram of the second embodiment; Fig. 4 is a combination diagram of the third embodiment of the LED panel display structure of the present invention.

本發明之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

請參閱第1、2圖，係為本發明LED面板顯示器結構之第一實施例之俯視圖及組合剖視圖，如圖所示，本發明LED面板顯示器結構1，係包含：一基部11、一第一電極層12、一第二電極層13、複數開關元件14、複數發光二極體元件15、一控制芯片16；所述基部11具有一第一側111及一第二側112，所述基部11係為玻璃或薄膜或可撓式基材其中任一。 1 and 2 are a plan view and a combined cross-sectional view of a first embodiment of an LED panel display structure of the present invention. As shown in the figure, the LED panel display structure 1 of the present invention comprises: a base 11 and a first An electrode layer 12, a second electrode layer 13, a plurality of switching elements 14, a plurality of light emitting diode elements 15, and a control chip 16; the base portion 11 has a first side 111 and a second side 112, the base 11 It is either a glass or a film or a flexible substrate.

所述第一電極層12具有複數第一電極線路121縱向延伸設置於前述基部11之第一側111：所述第二電極層13具有複數第二電極線路131橫向延伸設置於前述基部11之第一側111，並與前述第一電極線路121相互跨接；所述第一、二電極層12、13係透過蝕刻製程或印刷其中任一之方式設置於該基部11上，該等第一電極線路121係為源極訊號導線線路，所述該等第二電極線路131係為閘極訊號導線。 The first electrode layer 12 has a plurality of first electrode lines 121 extending longitudinally on the first side 111 of the base portion 11: the second electrode layer 13 has a plurality of second electrode lines 131 extending laterally from the base portion 11 a first side 111 and a first electrode line 121 are connected to each other; the first and second electrode layers 12 and 13 are disposed on the base 11 through an etching process or printing, the first electrodes The line 121 is a source signal wire line, and the second electrode lines 131 are gate signal wires.

該等開關元件14設置於前述基部11之第一側111，該等開關元件14具有一第一接腳141及一第二接腳142及一第三接腳143，該第一、二接腳141、142分別與前述第一、二電極線路121、131電性連接；該等開關元件14係為薄膜電晶體，該等開關元件14主要係作為訊號切換之功能使用。 The switching elements 14 are disposed on the first side 111 of the base portion 11. The switching elements 14 have a first pin 141 and a second pin 142 and a third pin 143. The first and second pins 141 and 142 are electrically connected to the first and second electrode lines 121 and 131 respectively. The switching elements 14 are thin film transistors, and the switching elements 14 are mainly used as a function of signal switching.

該等發光二極體元件15設置於前述基部11之第一側111，該等發光二極體元件15具有一第一腳位151及一第二腳位152，該第一腳位151與前述第三接腳143電性連接，該第二腳位152與一接地端17電性連接；該等發光二極體元件15具有紅色發光二極體15a、綠色發光二極體15b、藍色發光二極體15c、紅外線(IR)發光二極體15d、可偵測紅外線(IR)二極體15e，並且間隔排列設置，該等發光二極體元件15形成複數顯示區塊15f，該等顯示區塊15f係可為一5X5或一5X5以上的陣列區塊，由前述該等發光二極體15及該等紅外線發光二極體15d及該等可偵測紅外線二極體15e間隔陣列排列所組成，每一陣列的區塊係沿基部縱向及橫向延伸複數區塊，該等發光二極體元件15中之紅外線(IR)發光二極體15d、可偵測紅外線(IR)二極體15e構成複數顯示感應區塊15g，該感應區塊15g主要可進行觸控點位偵測以及指紋辨識之功能。 The light emitting diode elements 15 are disposed on the first side 111 of the base portion 11. The light emitting diode elements 15 have a first pin 151 and a second pin 152. The first pin 151 and the foregoing The third pin 143 is electrically connected, and the second pin 152 is electrically connected to a ground end 17; the LED body 15 has a red LED 15a, a green LED 15b, and blue light. The diode 15c, the infrared (IR) light-emitting diode 15d, and the infrared-detectable (IR) diode 15e are arranged at intervals, and the light-emitting diode elements 15 form a plurality of display blocks 15f. The block 15f can be a 5×5 or a 5×5 array block, and the array of the above-mentioned light emitting diodes 15 and the infrared light emitting diodes 15d and the detectable infrared diodes 15e are arranged in an array. The block of each array extends a plurality of blocks along the longitudinal and lateral directions of the base, and the infrared (IR) light-emitting diode 15d and the detectable infrared (IR) diode 15e of the light-emitting diode elements 15 Forming a plurality of display sensing blocks 15g, the sensing block 15g is mainly capable of performing touch point detection and The pattern recognition function.

所述基部11具有一觸控區11a及一非觸控區11b所述控制芯片16係選擇設置於前述觸控區11a或該非觸控區11b其中任一 The base 11 has a touch area 11a and a non-touch area 11b. The control chip 16 is selectively disposed on any of the touch area 11a or the non-touch area 11b.

當系統偵測欲進行指紋或掌紋識別工作時，紅外線(IR)發光二極體15d會發射紅外線波段，當物體(指頭之指紋或手掌之掌紋)接近時，紅外線(IR)發光二極體15d產生的紅外線波段會反射給設置於鄰近的可偵測紅外線(IR)二極體15e。 When the system detects fingerprint or palmprint recognition, the infrared (IR) LED 15d emits an infrared band. When the object (the fingerprint of the finger or the palm of the palm) is close, the infrared (IR) LED 15d The generated infrared band is reflected to the adjacent detectable infrared (IR) diode 15e.

該等紅色發光二極體15a、綠色發光二極體15b、藍色發光二極體15c及該等紅外線(IR)發光二極體15d及該等可偵測紅外線(IR)二極體15e外部尺寸長度係為1um~100um，寬度係為1um~100um。 The red light emitting diode 15a, the green light emitting diode 15b, the blue light emitting diode 15c, and the infrared (IR) light emitting diode 15d and the outside of the detectable infrared (IR) diode 15e The length is 1um~100um and the width is 1um~100um.

所述控制芯片16係設於前述基部11之第一側111並與前述第一、二電極層12、13電性連接。 The control chip 16 is disposed on the first side 111 of the base portion 11 and electrically connected to the first and second electrode layers 12 and 13 .

請參閱第3圖，係為本發明LED面板顯示器結構之第二實施例組合圖，如圖所示，本實施例部分結構係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例之差異在於本實施例之第一、二電極層12、13之間具有 一絕緣層18，所述絕緣層18覆蓋前述第一電極層12及該基部11之第一側111，該第二電極層13設置於前述絕緣層18上。 Referring to FIG. 3, it is a combination of the second embodiment of the LED panel display structure of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be further described herein. The difference between this embodiment and the foregoing first embodiment is that the first and second electrode layers 12 and 13 of the embodiment have An insulating layer 18 covers the first electrode layer 12 and the first side 111 of the base 11. The second electrode layer 13 is disposed on the insulating layer 18.

請參閱第4圖，係為本發明LED面板顯示器結構之第三實施例組合圖，如圖所示，本實施例部分結構係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例之差異在於具有一軟性電路板19，所述控制芯片16係透過(Chip On Board)之製程設置於該軟性電路板19上，並透過複數電路走線20與前述第一、二電極層12、13電性連接。 Referring to FIG. 4, it is a combination of the third embodiment of the LED panel display structure of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein. The difference between this embodiment and the foregoing first embodiment is that a flexible circuit board 19 is provided. The control chip 16 is disposed on the flexible circuit board 19 through a chip on board process, and passes through the plurality of circuit traces 20 and The first and second electrode layers 12 and 13 are electrically connected.

本發明該等發光二極體元件15及該等開關元件14及該控制芯片16係透過(Chip On Board)或(Chip On Glass)其中任一製程設置於該基部11上。 The light-emitting diode elements 15 and the switching elements 14 and the control chip 16 of the present invention are disposed on the base 11 by any one of a Chip On Board or a Chip On Glass process.

本發明主要透過將習知每一發光二極體元件15所需控制芯片16整合為一體僅由單一控制芯片16並搭配複數開關元件14(薄膜電晶體)進行控制，當解析度相當高2K或4K畫質時單位面積中可節省更多空間進行設置發光二極體元件15不僅可降低成本提升解析度外，本發明亦將觸控及指紋辨識功能同時整合於顯示螢幕中，不僅具有高解析度之顯示畫質外同時顯示螢幕兼具觸控及指紋辨識之功能。 The present invention mainly controls the integration of the control chip 16 required for each of the light-emitting diode elements 15 by a single control chip 16 and with a plurality of switching elements 14 (thin film transistors), when the resolution is relatively high 2K or 4K image quality can save more space per unit area. Setting the light-emitting diode component 15 not only reduces the cost and improves the resolution, but also integrates the touch and fingerprint recognition functions into the display screen at the same time, which not only has high resolution. At the same time, the display quality of the screen is combined with the function of touch and fingerprint recognition.

Claims (10)

一種LED面板顯示器結構，係包含：一基部，具有一第一側及一第二側；一第一電極層，具有複數第一電極線路縱向延伸設置於前述基部之第一側；一第二電極層，具有複數第二電極線路橫向延伸設置於前述基部之第一側，並與前述第一電極線路相互跨接；複數開關元件，設置於前述基部之第一側，該等開關元件具有一第一接腳及一第二接腳及一第三接腳，該第一、二接腳分別與前述第一、二電極線路電性連接；複數發光二極體元件，設置於前述基部之第一側，該等發光二極體元件具有一第一腳位及一第二腳位，該第一腳位與前述第三接腳電性連接，該第二腳位與一接地端電性連接；一控制芯片，與前述第一、二電極層電性連接。 An LED panel display structure comprising: a base having a first side and a second side; a first electrode layer having a plurality of first electrode lines extending longitudinally on a first side of the base; a second electrode a layer having a plurality of second electrode lines extending laterally on a first side of the base portion and interfacing with the first electrode line; a plurality of switching elements disposed on a first side of the base portion, the switching elements having a first a first leg and a second pin are respectively electrically connected to the first and second electrode lines; and the plurality of light emitting diode elements are disposed at the first base The first LED pin has a first pin and a second pin. The first pin is electrically connected to the third pin, and the second pin is electrically connected to a ground. A control chip is electrically connected to the first and second electrode layers. 如申請專利範圍第1項所述之LED面板顯示器結構，其中該等發光二極體元件及該等開關元件及該控制芯片係透過(Chip On Board)或(Chip On Glass)其中任一製程設置於該基部上。 The LED panel display structure of claim 1, wherein the LED components and the switching components and the control chip are configured by any one of Chip On Board or Chip On Glass. On the base. 如申請專利範圍第1項所述之LED面板顯示器結構，其中該等發光二極體元件具有紅色發光二極體、綠色發光二極體、藍色發光二極體、紅外線(IR)發光二極體、可偵測紅外線(IR)二極體。 The LED panel display structure of claim 1, wherein the light emitting diode elements have a red light emitting diode, a green light emitting diode, a blue light emitting diode, and an infrared (IR) light emitting diode. Body, infrared (IR) diodes can be detected. 如申請專利範圍第1項所述之LED面板顯示器結構，其中該等第一、電極係為源極訊號導線線路，所述該等第二電極係為閘極訊號導線。 The LED panel display structure of claim 1, wherein the first electrodes are source signal conductor lines, and the second electrodes are gate signal wires. 如申請專利範圍第1項所述之LED面板顯示器結構，其中該等開關元件係為薄膜電晶體。 The LED panel display structure of claim 1, wherein the switching elements are thin film transistors. 如申請專利範圍第1項所述之LED面板顯示器結構，其中該等發光二極體元件構成複數顯示感應區塊。 The LED panel display structure of claim 1, wherein the light emitting diode elements constitute a plurality of display sensing blocks. 如申請專利範圍第1項所述之LED面板顯示器結構，其中具有一軟性電路板，所述控制芯片設置於該軟性電路板上。 The LED panel display structure of claim 1, wherein the LED panel display structure has a flexible circuit board, and the control chip is disposed on the flexible circuit board. 如申請專利範圍第1項所述之LED面板顯示器結構，其中所述基部係為玻璃或薄膜或可撓式基材其中任一。 The LED panel display structure of claim 1, wherein the base is any one of a glass or a film or a flexible substrate. 如申請專利範圍第1項所述之LED面板顯示器結構，其中所述基部具有一觸控區及一非觸控區所述控制芯片係選擇設置於前述觸控區或該非觸控區其中任一。 The LED panel display structure of claim 1, wherein the base has a touch area and a non-touch area, and the control chip is selectively disposed in any of the touch area or the non-touch area. . 一種LED面板顯示器結構，係包含：一基部，具有一第一側及一第二側；一第一電極層，具有複數第一電極線路縱向延伸設置於前述基部之第一側；一絕緣層，覆蓋前述第一電極層及該基部之第一側；一第二電極層，具有複數第二電極線路橫向延伸設置於前述絕緣層上；複數開關元件，設置於前述基部之第一側，該等開關元件具有一第一接腳及一第二接腳及一第三接腳，該第一、二接腳分別與前述第一、二電極線路電性連接；複數發光二極體元件，設置於前述基部之第一側，該等發光二極體元件具有一第一腳位及一第二腳位，該第一腳位與前述第三接腳電性連接，該第二腳位與一接地端電性連接；一控制芯片，與前述第一、二電極層電性連接。 An LED panel display structure comprising: a base having a first side and a second side; a first electrode layer having a plurality of first electrode lines extending longitudinally on a first side of the base; an insulating layer, Covering the first electrode layer and the first side of the base; a second electrode layer having a plurality of second electrode lines extending laterally on the insulating layer; and a plurality of switching elements disposed on the first side of the base, The switching element has a first pin and a second pin and a third pin, wherein the first and second pins are electrically connected to the first and second electrode lines respectively; and the plurality of light emitting diode elements are disposed on The first side of the base has a first pin and a second pin. The first pin is electrically connected to the third pin, and the second pin is grounded. The terminal is electrically connected; a control chip is electrically connected to the first and second electrode layers.
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