TWI624905B - Multi-die press - Google Patents

Abstract

A multi-die press machine comprises: a substrate, a horizontal moving stage and a gantry bracket, wherein the horizontal moving stage is mounted on the base, and can be precisely moved in a horizontal direction, and the horizontal moving stage is additionally mounted independently a rotating three-grain rotating table and a substrate rotating table; the gantry bracket is erected on the base and does not interfere with the movement of the horizontal moving stage, the gantry bracket is mounted with a lifting mechanism, and the lifting mechanism can be controlled Lifting and lowering of the suction head at the bottom, the suction head includes at least one suction unit and a rotating unit from bottom to top; and the horizontal rotating stage accurately moves the die rotating table or the substrate rotating table at different times for the suction Under the head, the lifting mechanism timely controls the suction head to descend, allowing the suction head to suck a plurality of micro-grains on the crystal rotating table at a time, or pressurizing the plurality of micro-grains on the substrate rotating table. Receiving substrate.

Description

Multi-die pressing machine

The invention relates to the technical field of a multi-grain pressing machine, in particular to a design for extracting a large number of micro-grains and performing a pressure welding operation at a time under the condition of a micron pitch.

LED elements are currently the most widely used light-emitting elements. If three different wavelengths of RGB LEDs are placed together and the light intensity of each LED is controlled by the light intensity, various colors of light can be emitted. At present, large-scale LED signboards for outdoor or indoor use are composed of three colors of RGB to form a light source (about 2 ~ 4mm in size), and a plurality of light sources are arranged in an array with a pitch (about 5 ~ 15mm) to produce Large screen for long distance viewing. As more light sources are distributed within the cell area, the higher the resolution.

Similarly, if micro-sized (about 0.01 ~ 0.1mm) RGB micro LED dies are assembled together to form a light source of about 0.05 ~ 0.25mm, a plurality of light sources are distributed in an array manner with a pitch (about 0.05 ~ 0.5mm). It can form a high-resolution LED screen. For example, the resolution pitch of 4k scan lines for a 50-inch TV is 1000mm / 4000 = 0.25mm, so the resolution of a pitch of 0.1mm will be higher than that of a 4k * 2k TV. It can be applied to various special display applications such as wearable device displays, VR displays, etc.

However, how to place small LED microchips with a size of 0.01mm ~ 0.1mm on the screen substrate in RGB three colors and weld the positive and negative electrodes of each LED microchip is a technical bottleneck encountered by the LED industry at present. . For example, in a 4K TV, a light source with a size of 0.05mm on a 50-inch screen requires more than 100 million RGB LED micro-dies. If one welding process is used, the efficiency is poor and there are no commercial benefits. Therefore, manufacturers are constantly developing various types of equipment in the hope that the equipment can perform the extraction and welding of 100 to 10,000 micro-grains at a time.

The main purpose of the present invention is to provide a multi-die pressing machine, which is mainly to provide a LED chip that can absorb 100 ~ 10000 LED micro-dies at a time and transfer it to a receiving substrate with positive and negative wiring and lines. For a display substrate or a lighting substrate, etc., the micro crystal grains are accurately positioned and pressed, and the crystal grains are soldered to the receiving substrate at a high temperature.

To achieve the above object, the present invention includes: a base plate, a horizontal moving stage and a gantry bracket. The horizontal moving stage is mounted on the base and can be precisely moved in the horizontal direction. Rotating three die rotation stage and a substrate rotation stage; the gantry bracket stands on the base and does not interfere with the movement of the horizontal moving stage. The gantry bracket is equipped with a lifting mechanism which can control a suction The lifting of the head, the suction head from bottom to top includes at least a suction unit and a rotation unit; the horizontal movement stage accurately moves the die rotation stage or the substrate rotation stage under the suction head at different times, The lifting mechanism timely controls the suction head to descend, so that the suction head can suck a plurality of micro crystal grains on the crystal grain rotating table at one time, or press the plurality of micro crystal grains to a receiving substrate mounted on the substrate rotary table. .

Since the present invention mounts micro-dies on the receiving substrate at a micrometer pitch, in order to overcome the limitation of the positioning accuracy of the array elements of conventional packaging equipment to 10 μm, the accuracy of the horizontal position of the present invention is the responsibility of the horizontal moving stage. The accuracy of the stage can reach nanometer level, and the lifting mechanism is only responsible for the ascent of the suction head, so it can meet the operation of mounting micro-dies on the receiving substrate at a micron pitch.

Furthermore, the suction head of the present invention further includes a suction unit, a heating unit, a heat insulation unit, and a rotation unit which are sequentially combined from bottom to top, and the suction unit can suck a large number of micro crystal grains at a time, and drop in another one. At the right time, the heating unit can heat in a timely manner, so that the heat energy is transmitted to the micro crystal grains through the suction unit to complete the purpose of welding to the receiving substrate, which is an innovative and practical special suction head design.

The following describes the embodiments of the present invention in more detail with reference to the drawings and component symbols, so that those skilled in the art can implement them after studying this specification.

The embodiments of the present invention describe a multi-die pressing machine. In various embodiments, they are described with reference to schematic diagrams. The components in the diagrams are shown in simple blocks in their positions and their spatial patterns. The detailed mechanism, machine and structure of each component are specifically drawn. Such components can be realized concretely using the current actual machine, but the scope is not limited. The term "micro" grains used in this study is a descriptive size of certain elements or structures according to embodiments of the present invention, and the reference size ranges from 5 μm to 200 μm. The receiving substrate is used for mounting the micro-dies in an array arrangement. The receiving substrate refers to a substrate for a display screen.

As shown in FIG. 1 and FIG. 2, it is a schematic diagram of a side structure and a plan view of a base of the present invention, respectively. The multi-die pressing machine of the present invention comprises: a base 1, a horizontal moving carrier 2 and a gantry bracket 3. The horizontal moving stage 2 is mounted on the base 1, and carries three die rotating stages 21, 22, 22 and a substrate rotating stage 24 that can rotate independently. The gantry bracket 3 is erected above the base 1, and a lifting mechanism 31 is installed. The lifting mechanism 31 can control the lifting of a suction head 4. In this way, the horizontal moving stage 2 is used to accurately move and adjust the position of each rotary table, and the suction head 4 is raised and lowered in time, so that the micro crystal grains can be sequentially picked up, waited, lowered, and heated by pressure to be fixed. Because the structure of the present invention can accurately control the position of each component, the welding operation of 100 to 1000 grains can be completed at one time. Under the condition of micron pitch, it is satisfied to complete the tens or millions of micro grains on the receiving substrate. Welding and fixing operations.

Then explain the operation mode and structure of each component:

The base 1 is a Huagangyan platform to ensure that the machine is not affected by microseisms.

The horizontal moving stage 2 is mounted on the base 1 and can accurately move in the horizontal (X-Y axis) direction. The horizontal moving stage 2 is also mounted with three die rotating tables 21, 22, 23 and a substrate rotating table 24 which can rotate independently. The die rotation stage 21, 22, 23 can precisely control its rotation angle, and is used to carry three die carriers (not shown), and the three die carriers are respectively placed with red light micro Die, green micro-die, and blue micro-die. The present invention utilizes the characteristic that the crystal grain rotary table 21, 22, 23 can rotate accurately to further correct its orientation. The substrate rotating table 24 can also precisely control its rotation angle to carry the receiving substrate (not shown in the figure). The receiving substrate is used for placing miniature crystal grains of different colors. In this embodiment, both the mobile stage and the rotary stage are high-precision machines, which are commonly used in the industry, so they will not be described in detail. In addition, the horizontal moving stage 2 is also installed with a first alignment lens group 25. The first alignment lens group 25 is photographed in an upward direction, for capturing an image of the suction head 4, and analyzing the operation through internal software. Then, the suction head 4 is driven to rotate to correct its position.

The gantry bracket 3 is a U-shaped, and is erected over the base 1 without interfering with the movement of the horizontal moving platform 2. A lifting mechanism 31 is installed at the center of the gantry bracket 3, and the lifting mechanism 31 is used to control the lifting of the suction head 4 located at the bottom thereof. The suction head 4 has two functions: one is to accurately suck 100 to 1000 micro-grains at one time, and the second is to perform pressure and heating welding operations during the lowering process. In addition, the gantry bracket 3 is additionally equipped with a second alignment lens group 33. The second alignment lens group 33 is photographed downward. When the die rotation table 21, 22, 23 or the substrate rotation table 24 is horizontally When the moving stage 2 moves to the lower position, the image is captured by the second alignment lens group 33, and the operation and analysis of the internal software drive the die rotation stage 21, 22, 23 or the substrate rotation stage 24 to rotate. To correct its position, then align the origin and record the origin position by computer.

As shown in FIG. 3, it is a schematic side structural diagram of a suction head according to the first embodiment of the present invention. The suction head 4 includes a rotation unit 41, a heat insulation unit 42, a heating unit 43, and a suction unit 44 which are sequentially combined from top to bottom. The rotation unit 41 is a high-precision rotation axis, and further controls the orientation of the suction unit 44. The heat insulation unit 42 includes a cooling plate 421 and a heat insulation layer 422 connected from top to bottom. The heat insulation layer 422 is made of a material having a poor thermal conductivity coefficient to prevent heat energy from being transmitted upward. The cooling plate 421 is further connected with a cooling pipe (not shown in the figure), so that the cooling plate 421 has a cooling effect and avoids affecting the operation of the rotating unit 41. The heating unit 43 is used to quickly raise the temperature of the suction unit 44 to facilitate the micro-grain welding operation. The heating methods of the heating unit 43 include contact heating and non-contact heating. The contact heating system is equipped with an electric heating device (not shown in the figure) inside the heating unit 43, and the rest of the interior is made of a metal with good heat transfer properties, thereby rapidly heating up. The non-contact heating further includes a laser emission unit 45 (as shown in FIG. 4). The heating unit 43 has a blind hole 431 at a position corresponding to the laser emission unit 45. The bottom of the blind hole 431 is located at The central position of the heating unit 43 emits a light source with a specific wavelength into the blind hole 431 through the laser emitting unit 45, so that the heating unit 43 can quickly heat up, and the heating efficiency is faster in this way. Since the suction unit 44 and the heating unit 43 are combined together, when the temperature of the heating unit 43 increases rapidly, the suction unit 4 also rises simultaneously.

As shown in FIGS. 3 and 4, the suction unit 44 includes a porous suction cup 441 and a metal indenter 442 connected from bottom to top. As shown in FIGS. 5 and 6, the porous suction cup 441 has a plurality of longitudinal air channels 4411 inside and a plurality of contact pads 4412 on the bottom surface, and each of the forward air channels 4411 corresponds to a contact pad 4412. The porous suction cup 441 and the Where the metal indenter 442 meets, there are a plurality of lateral air channels 4413 at the top of the longitudinal air channel 4411, thereby communicating the longitudinal air channels 4411. The metal indenter 442 has a pipe 4421 inside which can be connected to an external vacuum pumping device (not shown in the figure). The plurality of longitudinal air passages 4411 are connected to the pipe 4421 to generate a vacuum in time to suck the crystal grains. The contact pad 4412 may be made of pure gold, and the pitch size is the same as that of the micro-die.

Then a brief description of the operation mode of the present invention:

This embodiment is used to make an LED display screen. The micro-sized (about 0.01 ~ 0.1mm) R, G, B micro LED die are assembled together to form a light source of about 0.05 ~ 0.25mm. The light emitting sources are arranged in an array manner with a pitch (about 0.05 to 0.5 mm), thereby forming a high-resolution LED screen.

Three die carriers carrying red light micro-dies, green light micro-dies, and blue light micro-dies are placed on the corresponding die turntables 21, 22, and 23 respectively. The receiving substrates to be mounted are Placed on the substrate rotating table 24.

First, the calibration operation is performed. The horizontal moving stage 2 sequentially moves the die rotation stage 21, 22, 23 and the substrate rotation stage 24 directly below the second alignment lens group 33 to confirm the carried die load. Whether the position of the disc and the receiving substrate are correct. If they are not correct, start the rotary table to rotate an angle to correct the correct orientation. Similarly, move the first alignment lens group 25 from the horizontal moving stage 2 directly below the suction head 4 to confirm whether the position of the suction unit 44 is correct. If it is not correct, the rotation unit 41 rotates an angle to correct The suction unit 44 is in the correct orientation.

Next, the crystal grain transfer operation is performed: first, the crystal grain rotating table 21 carrying the red light micro crystal grains is moved directly below the suction unit 44; the lifting mechanism 31 controls the suction head 4 to descend, and the suction unit 44 is used once Absorb 100 ~ 1000 red light micro-crystal grains and rise to standby after aspiration.

Then, the substrate rotating table 24 is moved directly below the suction head 4 by the horizontal moving stage 2.

The lifting mechanism 31 is actuated again to lower the suction head 4 so that the red light micro-crystal grains can be mounted on the receiving substrate with positive and negative wiring and lines, and the receiving substrate is also provided with a paste or solder at a relative position. After that, the heating unit 43 heats up, and the suction unit 44 heats up synchronously, so that the red crystal grains are welded to the receiving substrate. After the vacuum suction state of the suction unit 44 is released, the suction head 4 rises again.

In the same way, the grain rotating table 22 carrying the green light micro-crystals is then moved from the horizontal moving stage 4 directly below the suction unit 4, and the micro-crystals are sequentially picked up, waited, and then fused and welded to the On the receiving substrate, the welding operation of green light micro-crystal grains is completed. In the same way, the blue light micro-crystal grains also complete the welding operation in the same way. Of course, it is also possible to weld micro-crystal grains of a specific color to the receiving substrate, and then perform welding operations of micro-crystal grains of other colors. With the present invention, a large number of micro-grains can be welded at one time. After multiple operations, a large number of light-emitting diodes are commercially processed and formed on a display screen, and finally a high-resolution light-emitting diode screen is reached. Production purpose.

As shown in FIG. 7, it is a schematic side structural view of a suction head according to a third embodiment of the present invention. In this embodiment, the suction head 4 includes a rotation unit 41, a heat insulation unit 42, and a combination of the top and bottom in order. A suction unit 44 does not have the structure of the heating unit in this embodiment. Therefore, in this embodiment, the suction head 4 is mainly responsible for placing the dies on the receiving substrate, and subsequently heating the dies and the receiving substrate. Since the welding and curing operation is performed, the heat insulation unit 42 may be omitted.

The above are only used to explain the preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Therefore, any modification or change related to the present invention made under the same spirit of the invention Should still be included in the scope of the present invention.

1‧‧‧ base

2‧‧‧Horizontal mobile carrier

21, 22, 22‧‧‧ Grain Rotary Table

24‧‧‧ substrate rotation stage

25‧‧‧First registration lens group

3‧‧‧ Gantry bracket

31‧‧‧Lifting mechanism

33‧‧‧Second registration lens group

4‧‧‧ Suction head

41‧‧‧rotating unit

42‧‧‧Insulation unit

421‧‧‧cooling plate

422‧‧‧ Insulation

43‧‧‧Heating unit

431‧‧‧blind hole

44‧‧‧ Suction unit

441‧‧‧Porous suction cup

4411 ‧ ‧ 緃 towards the airway

4412‧‧‧ contact pad

4413‧‧‧ Lateral airway

4412‧‧‧ contact pad

442‧‧‧ metal indenter

45‧‧‧Laser Launch Unit

FIG. 1 is a schematic side structural view of the present invention; FIG. 2 is a top structural schematic view of a base and a horizontal moving stage of the present invention, and the position of the gantry bracket is indicated by an imaginary line; FIG. 3 is a suction head of the first embodiment of the present invention Fig. 4 is a side structural schematic view of a suction head according to a second embodiment of the present invention; Fig. 5 is a bottom view of a suction unit of the present invention; Fig. 6 is a schematic partial sectional view of a porous suction cup of the present invention; Schematic side view of the suction head of the third embodiment.

Claims (8)

A multi-die pressing machine includes: a base; a horizontal moving carrier mounted on the base, which can be precisely moved in a horizontal direction; and the horizontal moving carrier is further installed with three crystals capable of independent rotation. A particle rotating table and a substrate rotating table; and a gantry bracket, which is fixed on the base and does not interfere with the movement of the horizontal moving carrier. A lifting mechanism is installed on the gantry bracket, which can control a suction Lifting of the head, the suction head includes at least a suction unit and a rotation unit from bottom to top; wherein the horizontal movement stage is further installed with a first alignment lens group, the first alignment lens group is directed upward Photographing to correct the position of the pick-up head; a second alignment lens group is installed at the gantry bracket, and the second alignment lens group is photographed downwards to correct the crystal grain rotary table and the substrate below The position of the rotating table; the horizontally moving stage accurately moves the crystal grain rotating table or the substrate rotating table below the suction head, and the lifting mechanism controls the suction head to descend in time to allow the suction A plurality of micro chip suction of the die table rotation, or pressing the plurality of micro chip mounted on the substrate rotating stage receiving the substrate. The multi-grain pressing machine according to item 1 of the patent application scope, wherein the suction unit includes a porous suction cup and a metal indenter connected from bottom to top, the porous suction cup has a plurality of longitudinal air channels inside and the bottom surface has A plurality of contact pads, each of which is located at a corresponding one of the contact pads, and the plurality of longitudinal air passages are in communication with a pipeline located in the metal head, which is connected to an external vacuum device for timely Create a vacuum. The multi-die pressing machine described in item 2 of the scope of patent application, wherein the contact pad is made of pure gold. The multi-die pressing machine as described in item 1 of the patent application scope, wherein the suction head further includes a heat insulation unit, so the structure of the suction head is sequentially from the suction unit to the heat insulation unit And the rotating unit, the heat insulation unit includes a heat insulation layer and a cooling plate connected from bottom to top, and the cooling plate is additionally connected with a cooling pipe. The multi-die pressing machine as described in item 1 of the scope of patent application, wherein the suction head further includes a heat insulation unit and a heating unit, so the structure of the suction head is sequentially from the suction unit to the bottom, The heating unit, the heat insulation unit, and the rotation unit are configured. The multi-die pressing machine according to item 5 of the scope of patent application, wherein an electric heating device is installed inside the heating unit. The multi-die pressing machine according to item 5 of the patent application scope, wherein the suction head further comprises a laser emitting unit, the heating unit is made of metal, and the laser emitting unit emits a light source with a specific wavelength to the heating Unit, which can make the heating unit heat up quickly. The multi-die pressing machine according to item 5 of the scope of patent application, wherein the heating unit has a blind hole at a position corresponding to the laser emitting unit, and the bottom of the blind hole is located at the center of the heating unit. The laser emitting unit must emit a light source with a specific wavelength in the blind hole.