TWI612080B - Transparent resin for encapsulation material and encapsulation material and electronic device including the same - Google Patents

Abstract

The present invention discloses a transparent resin for encapsulating materials, an encapsulating material, and an electronic component comprising the same, the transparent resin comprising a first polyoxyalkylene oxide and a second polyoxyalkylene oxide, wherein the first polyoxyalkylene oxide is The end thereof contains hydrogen (Si-H) bonded to ruthenium, and the second polyoxy siloxane contains an oxime-bonded alkenyl group (Si-Vi) at its end, wherein the bond with ruthenium Hydrogen (Si-H) and the oxime-bonded alkenyl group (Si-Vi) are present in a ratio of from about 1 to about 1.2 (Si-H/Si-Vi).

Description

Transparent resin for packaging material and packaging material and electronic component containing the same Field of invention

The present application discloses a transparent resin for encapsulating materials, an encapsulating material including the same, and an electronic component (electronic device).

Background of the invention

Light-emitting elements such as light-emitting diodes (LEDs), organic light-emitting elements (OLEDs), photoluminescence (PL) elements, and the like have been variously used in household electric devices, lighting devices, display devices, various automatic devices, and the like.

The light-emitting element may display an intrinsic color of the light-emitting material such as blue, red, and green using a light emitter, or may display white by combining light-emitting bodies that display different colors.

Such a light-emitting element can generally have a package or package structure.

Such a package or package structure may be made of an encapsulating material containing a transparent resin that can pass light emitted from the illuminant from the outside. Since the transparent resin is positioned in a position in which light passes, the characteristics of the transparent resin such as light transmittance and heat resistance may affect light efficiency. Further, the transparent resin is provided in a structure covering the illuminant, so that it can be provided on the surface of the illuminating element. Thus, it may be exposed during processing (processing, process).

Summary of invention

One embodiment of the present invention provides a transparent resin for an encapsulating material which enhances workability and prevents deterioration of light efficiency by improving physical properties of the transparent resin.

Another embodiment of the present invention provides an encapsulating material comprising the transparent resin.

Yet another embodiment of the present invention provides an electronic component including the encapsulating material.

According to one embodiment, there is provided a transparent resin for a packaging material, the transparent resin comprising a first polyoxyalkylene oxide and a second polyoxyalkylene oxide, the first polyoxyalkylene oxide comprising a hydrazone bond at an end thereof a hydrogen (Si-H) comprising a fluorene-bonded alkenyl group (Si-Vi) at its end, wherein the hydrazine-bonded hydrogen (Si-H) The alkenyl group (Si-Vi) bonded to the oxime is present in a ratio of from about 1 to about 1.2 (Si-H/Si-Vi).

The first polyoxyalkylene can be represented by the following Chemical Formula 1.

[Chemical Formula 1]

(R ₁ R ₂ R ₃ SiO _1/2 ) _M1 (R ₄ R ₅ SiO _2/2 ) _D1 (R ₆ SiO _3/2 ) _T1 (SiO _4/2 ) _Q1

T1<1，0

Q1<1，且M1+D1+T1+Q1=1。In Chemical Formula 1, R ₁ to R ₆ are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, Substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 alkynyl, substituted or Unsubstituted C1 to C30 alkoxy, substituted or unsubstituted C1 to C30 carbonyl, hydroxy, or a combination thereof, at least one of R ₁ to R ₆ includes hydrogen, 0 < M1 < 1, 0 < D1 < 1 ,0

T1<1,0

Q1 < 1, and M1 + D1 + T1 + Q1 = 1.

The second polyoxyalkylene can be represented by the following Chemical Formula 2.

[Chemical Formula 2]

(R ₇ R ₈ R ₉ SiO _1/2 ) _M2 (R ₁₀ R ₁₁ SiO _2/2 ) _D2 (R ₁₂ SiO _3/2 ) _T2 (SiO _4/2 ) _Q2

Q2<1，且M2+D2+T2+Q2=1。In Chemical Formula 2, R ₇ to R ₁₂ are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substitution or Unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 alkenyl, substituted or unsubstituted a C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxyl group, or a combination thereof, at least one of R ₇ to R ₁₂ including a substituted or unsubstituted group C2 to C30 alkenyl, 0 < M2 < 1, 0 < D2 < 1, 0 < T2 < 1, 0

Q2<1, and M2+D2+T2+Q2=1.

The hydrazine-bonded hydrogen (Si-H) and the fluorene-bonded alkenyl group (Si-Vi) may be present in a ratio of from about 1.05 to about 1.15 (Si-H/Si-Vi).

The first polyoxyalkylene oxide may be included in less than about 50% by weight based on the total amount of the transparent resin, and the second polyoxyalkylene oxide may be greater than about 50 based on the total amount of the transparent resin. Wt% is included.

The transparent resin may further comprise a ruthenium hydrogenation catalyst.

According to another embodiment, an encapsulating material prepared by curing the above-described transparent resin for encapsulating material is provided.

The encapsulating material can have a light transmittance (T) of about 80% to 100% at a wavelength of about 450 nm.

After heating at about 120 ° C for about 500 hours, the encapsulating material can have a light transmittance reduction rate (ΔT) of less than about 15%.

After heating at about 180 ° C for about 150 hours, the encapsulating material may have a light transmittance reduction rate (ΔT) of less than about 15%.

The encapsulating material can have a tackiness of less than about 100 kgf.

According to yet another embodiment, an electronic component comprising the encapsulating material is provided.

The electronic component may include a light emitting diode, an organic light emitting element, a photoluminescent element, and a solar cell.

Heat resistance and viscosity can be significantly improved.

Detailed description

Exemplary embodiments of the invention are described in detail below. However, these embodiments are merely exemplary and do not limit the invention. The described embodiments may be modified in various different ways, without departing from the spirit or scope of the invention.

As used herein, when a definition is not otherwise provided, the term "substituted" refers to hydrogen substituted with a compound selected from at least one substituent selected from the group consisting of halogen (F, Br, Cl or I). a hydroxyl group, an alkoxy group, a nitro group, a cyano group, an amine group, an azide group, a fluorenyl group, a fluorenyl group, a fluorenylene group, a carbonyl group, an amine carbaryl group, a thiol group, an ester group, a carboxyl group or a salt thereof, Sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C1 to C30 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C30 aryl group, a C7 to C30 aralkyl group, a C1 to C30 alkoxy group C1 to C20 heteroalkyl, C3 to C20 heteroarylalkyl, C3 to C30 cycloalkyl, C3 to C15 cycloalkenyl, C6 to C15 cycloalkynyl, C3 to C30 heterocycloalkyl, and combinations thereof.

As used herein, when a definition is not otherwise provided, the prefix "hetero" refers to comprising from 1 to 3 heteroatoms selected from N, O, S and P.

Hereinafter, a transparent resin for an encapsulating material according to one embodiment will be described.

The transparent resin for encapsulating material according to one embodiment comprises a first polyoxyalkylene oxide and a second polyoxyalkylene oxide, the first polyoxyalkylene oxide comprising hydrogen (Si-H) bonded to the oxime at its end The second polyoxyalkylene contains an alkenyl group (Si-Vi) bonded to the oxime at its end.

The first polyoxyalkylene can be represented by the following Chemical Formula 1.

[Chemical Formula 1]

(R ₁ R ₂ R ₃ SiO _1/2 ) _M1 (R ₄ R ₅ SiO _2/2 ) _D1 (R ₆ SiO _3/2 ) _T1 (SiO _4/2 ) _Q1

T1<1，0

Q1<1，且M1+D1+T1+Q1=1。In Chemical Formula 1, R ₁ to R ₆ are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, Substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 alkynyl, substituted or Unsubstituted C1 to C30 alkoxy, substituted or unsubstituted C1 to C30 carbonyl, hydroxy, or a combination thereof, at least one of R ₁ to R ₆ is hydrogen, 0 < M1 < 1, 0 < D1 < 1 ,0

T1<1,0

Q1 < 1, and M1 + D1 + T1 + Q1 = 1.

M1, D1, T1 and Q1 each represent a molar ratio.

The second polyoxyalkylene can be represented by the following Chemical Formula 2.

[Chemical Formula 2]

(R ₇ R ₈ R ₉ SiO _1/2 ) _M2 (R ₁₀ R ₁₁ SiO _2/2 ) _D2 (R ₁₂ SiO _3/2 ) _T2 (SiO _4/2 ) _Q2

Q2<1，且M2+D2+T2+Q2=1。In Chemical Formula 2, R ₇ to R ₁₂ are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substitution or Unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 alkenyl, substituted or unsubstituted a C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxyl group, or a combination thereof, at least one of R ₇ to R ₁₂ being substituted or unsubstituted C2 to C30 alkenyl, 0 < M2 < 1, 0 < D2 < 1, 0 < T2 < 1, 0

Q2<1, and M2+D2+T2+Q2=1.

M2, D2, T2 and Q2 are each a molar ratio.

The degree of crosslinking bonding and curing of the transparent resin can be controlled by including both a first polyoxyalkylene oxide and a second polyoxyalkylene oxide, the first polyoxyalkylene oxide having a bond with the oxime at its end Hydrogen (Si-H), which contains an oxime-bonded alkenyl group (Si-Vi) at its end.

The transparent resin has a ratio of 矽-bonded hydrogen (Si-H) and fluorene-bonded alkenyl group (Si-Vi) of about 1 to 1.2 (Si-H/Si-Vi). Within the range, the hydrazine-bonded hydrogen (Si-H) and the hydrazone-bonded alkenyl group (Si-Vi) are at a ratio of about 1.05 to 1.15, for example about 1.10 (Si- H/Si-Vi) exists.

By the presence of the hydrazine-bonded hydrogen (Si-H) and the hydrazone-bonded alkenyl group (Si-Vi) in a ratio within the range (Si-H/Si-Vi) Improve the heat resistance and viscosity of the cured transparent resin and maintain its light transmittance.

For example, the ratio of the europium-bonded hydrogen (Si-H) and the europium-bonded alkenyl group (Si-Vi) contained in the range (Si-H/Si-Vi) The transparent resin may have a light transmittance of about 80% to about 100% with respect to a wavelength of about 450 nm after curing, and may have a light transmittance of less than about 15% even when exposed for a long time at a high temperature. Rate (△T). In other words, the transparent resin ensures heat resistance, so that even when exposed to a high temperature for a long time, it can prevent significant deterioration of light transmittance due to yellowing.

In addition, a transparent resin containing a ruthenium-bonded hydrogen (Si-H) and a ruthenium-bonded alkenyl group (Si-Vi) in a defined ratio (Si-H/Si-Vi) after curing It may have a viscosity of less than about 100 kgf. The tackiness refers to the degree of adhesion on the surface of the cured transparent resin. When the viscosity is strong, since the adjacent encapsulating materials adhere to each other during preparation of the encapsulating material provided by curing the transparent resin, processing difficulty may be caused.

According to one embodiment, the first polyfluorene comprising an alkenyl group (Si-Vi) bonded to a fluorene at the end and the first poly comprising a hydrogen (Si-H) bonded to the oxime at the end In the transparent resin of decane, the ratio of hydrogen (Si-H) bonded to hydrazine to the olefin group bonded to hydrazine (Si-Vi) (Si-H/Si-Vi) was confirmed. Control within this range significantly improves heat resistance and viscosity.

The first polyoxyalkylene oxide may have a weight average molecular weight of from about 100 g/mol to about 10,000 g/mol, specifically from about 100 g/mol to about 3,000 g/mol.

The first polyoxyalkylene oxide may be included in less than about 50 wt%, such as from about 1 wt% to 35 wt%, based on the total amount of the transparent resin.

The second polyoxyalkylene has a weight average molecular weight of from about 1,000 g/mol to about 100,000 g/mol, specifically from about 1,000 g/mol to about 20,000 g/mol.

The second polyoxyalkylene can be included at greater than about 50 wt%, such as from about 65 wt% to about 99 wt%, based on the total amount of the transparent resin.

In the case where the first polyoxyalkylene oxide and the second polyoxyalkylene oxide are respectively in the range of the weight average molecular weight and the amount, the reactivity of the resin can be controlled.

The transparent resin may further comprise a ruthenium hydrogenation catalyst. The hydrazine hydrogenation catalyst may promote a hydrazine-bonded hydrogen (Si-H) moiety of the first polyoxyalkylene and a fluorene-bonded alkenyl group (Si-Vi) moiety of the second polyoxyalkylene oxide. An hydrazine hydrogenation reaction, and it may include, for example, platinum, rhodium, palladium, iridium, osmium, or a combination thereof.

The rhodium hydrogenation catalyst may be included in an amount of from about 0.1 ppm to about 1000 ppm based on the total amount of the transparent resin.

The resin may also comprise a catalyst inhibitor. The catalyst inhibitor may be included in an amount of from about 0.001 wt% to about 1 wt%, based on the total amount of the resin.

In addition to the above ingredients, the encapsulating material may further comprise a adhesion promoter (tackifier), and the adhesion promoter may include, for example, glycidoxypropyl trimethoxy decane, vinyl triethoxy decane, Glycidoxypropyltriethoxydecane, and the like.

The transparent resin is cured to be used as an encapsulating material for electronic components. . For example, the curing may be performed by coating a resin on a substrate at a thickness of about 0.01 mm to 3 mm, and then heat-treating the coated resin at a temperature of about 100 ° C to 300 ° C for about 1 to 10 hour. The electronic component may include, for example, a light emitting diode, an organic light emitting element, a photoluminescent element, and a solar cell, but is not limited thereto.

The encapsulating material prepared using the transparent resin can prevent yellowing or deterioration when exposed to a high temperature for a long period of time, and has high light transmittance, thereby ensuring heat resistance and improving workability due to low viscosity.

The following examples illustrate the invention in more detail. However, they are exemplary embodiments of the invention and are not limiting.

Synthesis of the first polyoxyalkylene

Water and toluene were mixed at a weight ratio of 5:5 to prepare a mixed solvent. 1 kg of the mixed solvent was placed in a 3-necked flask, and while maintaining the flask at 23 ° C, diphenyldichlorodecane and tetramethyldioxane having a molar ratio of 40:60 were added thereto. alkyl. After the completion of the dropwise addition, the mixture was heated and refluxed at 50 ° C to carry out a polycondensation reaction for 3 hours. The resulting reaction mass was cooled to room temperature, and the aqueous layer was removed therefrom to prepare a solution in which the polymer was dissolved in toluene. The polymer solution is washed with water to remove the reaction by-product chlorine. Then, the neutralized polymer solution was distilled under reduced pressure to remove toluene, thereby preparing a liquid polyoxyalkylene.

The weight average molecular weight of the polyoxyalkylene was measured by gel permeation chromatography and the molecular weight converted to polystyrene was determined to be 750 g/mol. The polysiloxane was identified to have the structure of Chemical Formula A using H-NMR, Si-NMR, and an elemental analyzer. Here, "Me" represents a methyl group, "Ph" represents a phenyl group, "Si" represents hydrazine, and "H" represents hydrogen.

[Chemical Formula A]

(Me ₂ HSiO _1/2 ) ₂ (Ph ₂ SiO _2/2 )

Synthesis of second polyoxyalkylene oxide

A mixed solvent prepared by mixing 1 kg of water and toluene in a weight ratio of 5:5 was placed in a 3-necked flask, and then allowed to stand at 23 °C. Subsequently, phenyl trichlorodecane, phenylmethyl dichlorodecane and vinyl dimethyl chlorodecane were mixed at a molar ratio of 27:55:18. The mixture was heated and refluxed at 90 ° C to carry out a polycondensation reaction for 3 hours. The resulting reaction mass was cooled to room temperature, and the aqueous layer was removed therefrom to prepare a solution in which the polymer was dissolved in toluene. The polymer solution is washed with water to remove the reaction by-product chlorine. Subsequently, the neutralized polymer solution was distilled under reduced pressure to remove toluene and obtain a liquid polyoxyalkylene.

The weight average molecular weight of the obtained polyoxymethane was measured by gel permeation chromatography and determined to have a molecular weight of 2,500 g/mol converted into polystyrene. The polysiloxane was determined to have a structure represented by Chemical Formula B using H-NMR, Si-NMR, and an elemental analyzer. Here, "Me" represents a methyl group, "Ph" represents a phenyl group; "Vi" represents a vinyl group, and "Si" represents oxime.

[Chemical Formula B]

(Me ₂ ViSiO _1/2 ) _0.13 (PhSiO _3/2 ) _0.3 (PhMeSiO _2/2 ) _0.57

Preparation of transparent resin Example 1

13.6 wt% of the first polyoxyalkylene represented by the chemical formula A, and 86.4 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS as a hydrogenation catalyst was added (by Unicore manufacture) to provide a Pt amount of 2 ppm. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present at a ratio of about 1.00 (Si-H/Si-Vi).

The mixed solution was coated on the substrate at a thickness of 1 mm, and heated at 150 ° C for 2 hours and cured to provide a cured sample.

Example 2

14.2 wt% of the first polyoxyalkylene represented by the chemical formula A, and 85.8 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present in a ratio of about 1.05 (Si-H/Si-Vi).

The mixed solution was coated on the substrate at a thickness of 1 mm, and heated at 150 ° C for 2 hours and cured to provide a cured sample.

Example 3

14.8 wt% of the first polyoxyalkylene represented by the chemical formula A, and 85.2 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present at a ratio of about 1.10 (Si-H/Si-Vi).

The mixed solution was coated on the substrate at a thickness of 1 mm, and heated at 150 ° C for 2 hours and cured to provide a cured sample.

Example 4

15.3 wt% of the first polyoxyalkylene represented by the chemical formula A, and 84.7 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present in a ratio of about 1.15 (Si-H/Si-Vi).

The mixed solution was coated on the substrate at a thickness of 1 mm, and heated and cured at 150 ° C for 2 hours to provide a cured sample.

Example 5

15.9 wt% of the first polyoxyalkylene represented by the chemical formula A, and 84.1 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present at a ratio of about 1.20 (Si-H/Si-Vi).

The mixed solution was coated on the substrate at a thickness of 1 mm, and heated and cured at 150 ° C for 2 hours to provide a cured sample.

Comparative example 1

11.2 wt% of the first polyoxyalkylene represented by the chemical formula A, and 88.8 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present in a ratio of about 0.8 (Si-H/Si-Vi).

The mixed solution was coated on the substrate at a thickness of 1 mm, and heated and cured at 150 ° C for 2 hours to provide a cured sample.

Comparative example 2

19.1 wt% of the first polyoxyalkylene represented by the chemical formula A, and 80.9 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present in a ratio of about 15.00 (Si-H/Si-Vi).

The mixed solution was coated on the substrate at a thickness of 1 mm, and heated and cured at 150 ° C for 2 hours to provide a cured sample.

Evaluation-1

The initial light transmittance and heat resistance of the various cured transparent resins obtained from Examples 1 to 5 and Comparative Examples 1 and 2 were measured.

The initial light transmittance was determined by measuring the cured transparent resin at a wavelength of 450 nm using a UV-spectrophotometer (Shimadzu, UV-3600).

The heat resistance was determined by heating the cured transparent resin at 120 ° C for 500 hours and measuring the light transmittance according to the same method.

The results are described with reference to Table 1.

Referring to Table 1, it was confirmed that the transmittance of the transparent resin according to Examples 1 to 5 between the initial light transmittance and the light transmittance after heating at 120 ° C for 500 hours was within about 15%.

In addition, in an exemplary embodiment, the transparent resins according to Examples 2, 3, and 4 have an excellent light transmittance reduction rate of about 7% or less; and the transparent resin according to Example 3 has the most excellent properties of about 1.3%. Light transmittance reduction rate.

On the other hand, after heating at 120 ° C for 500 hours, the transparent resins according to Comparative Examples 1 and 2 had a light transmittance lowering ratio of about 20% or more.

From the results, it was confirmed that the transparent resins according to Examples 1 to 5 improved the heat resistance.

Evaluation-2

The heat resistance of the cured transparent resins according to Examples 1 to 5 and Comparative Examples 1 and 2 was measured again under higher temperature conditions.

The initial transmittance was measured according to the same procedure as above.

After the cured transparent resin was heated at 180 ° C for 150 hours, heat resistance was determined by measuring the light transmittance according to the same method.

The results are described with reference to Table 2.

Referring to Table 2, it was confirmed that the transmittance of the transparent resin according to Examples 1 to 5 between the initial light transmittance and the light transmittance after heating at 180 ° C for 150 hours was within about 15%. In addition, in the exemplary embodiment, the transparent resins according to Examples 2, 3, and 4 have a more excellent light transmittance reduction rate of about 7% or less, and the transparent resin according to Example 3 has the highest excellentness of about 1.9%. The rate of decrease in light transmittance.

On the other hand, after heating at 180 ° C for 150 hours, the transparent resin according to Comparative Example 1 had a light transmittance reduction rate of about 23%.

From the results, it was confirmed that the transparent resins according to Examples 1 to 5 improved the heat resistance.

Evaluation-3

The tackiness of the cured transparent resins according to Examples 1 to 5 and Comparative Examples 1 and 2 was measured.

Viscosity was determined by applying a constant load (load) to the cured transparent resin using TopTac 2000A and measuring the force during removal of the load.

Details as follow:

- Device: TopTac 2000A

- Zig test: 1 inch hemisphere, SS, compression load 300.00 gf

- Test speed: target displacement 10.00 mm

Drop 0.08 mm / sec

Keep 300 gf for 10 seconds

Rise by 0.1 mm/sec

The results are described with reference to Table 3.

Referring to Table 3, the cured transparent resin according to Examples 1 to 5 had a viscosity of about 100 kgf or less, which is satisfactory.

Further, in the exemplary embodiment, the transparent resins according to Examples 2, 3, and 4 have remarkably low viscosity, and the transparent resin according to Example 3 has a minimum viscosity of about 21 kgf.

On the other hand, the transparent resins according to Comparative Examples 1 and 2 have high viscosity.

From the results, it was confirmed that the transparent resins according to Examples 1 to 5 remarkably improved the viscosity.

From these results, it is understood that the ratio of the 矽-hydrogen bond (Si-H) and the 矽-alkenyl group bond (Si-Vi) of the first polyoxyalkylene and the second polyoxyalkylene (Si-H) /Si-Vi) The adjustment is markedly improved in heat resistance and viscosity.

Although the present invention has been described in connection with the exemplary embodiments of the present invention, it is understood that the invention is not limited to the disclosed embodiments, and, instead, Various improvements and equivalent arrangements within the scope.

Claims (9)

A transparent resin for encapsulating material, comprising: a first polyoxyalkylene, comprising hydrogen (Si-H) bonded to ruthenium at the end of the first polyoxyalkylene, based on the total amount of the transparent resin The first polyoxyalkylene is included in less than about 50% by weight but greater than 0%, and the second polyoxyalkylene contains an oxime-bonded alkenyl group at the end of the second polyoxyalkylene ( Si-Vi), based on the total amount of the transparent resin, the second polyoxyalkylene is included in more than about 50% by weight but less than 100%, a hydrogenation catalyst, and an adhesion promoter, wherein The hydrogen (Si-H) bonded to the oxime and the oxime-bonded alkenyl group (Si-Vi) are present at a ratio of about 1.05 to about 1.15 (Si-H/Si-Vi), and the transparency The resin forms an encapsulating material having a light transmittance (T) in the range of 80% to 100% at a wavelength of 450 nm. The transparent resin for encapsulating material according to claim 1, wherein the first polyoxyalkylene is represented by the following Chemical Formula 1: [Chemical Formula 1] (R ₁ R ₂ R ₃ SiO _1/2 ) _M1 (R ₄ R ₅ SiO _2/2 ) _D1 (R ₆ SiO _3/2 ) _T1 (SiO _4/2 ) _Q1 wherein, in Chemical Formula 1, R ₁ to R ₆ are each independently hydrogen, substituted or unsubstituted C1 to C30 alkyl, substituted or unsubstituted C3 to C30 cycloalkyl, substituted or unsubstituted C6 to C30 aryl, substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 a heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxyl group, or a combination thereof, at least one of R ₁ to R ₆ includes hydrogen, 0 < M1 < 1, 0 < D1 < 1, 0 T1<1,0 Q1 < 1, and M1 + D1 + T1 + Q1 = 1. The transparent resin for encapsulating material according to claim 1, wherein the second polyoxyalkylene is represented by the following Chemical Formula 2: [Chemical Formula 2] (R ₇ R ₈ R ₉ SiO _1/2 ) _M2 (R ₁₀ R ₁₁ SiO _2/2 ) _D2 (R ₁₂ SiO _3/2 ) _T2 (SiO _4/2 ) _Q2 wherein, in Chemical Formula 2, R ₇ to R ₁₂ are each independently a substituted or unsubstituted C1 To C30 alkyl, substituted or unsubstituted C3 to C30 cycloalkyl, substituted or unsubstituted C6 to C30 aryl, substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkane , substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 alkenyl, substituted or unsubstituted C2 to C30 alkynyl, substituted or unsubstituted C1 to C30 alkoxy, substituted Or an unsubstituted C1 to C30 carbonyl group, a hydroxyl group, or a combination thereof, at least one of R ₇ to R ₁₂ includes a substituted or unsubstituted C 2 to C 30 alkenyl group, 0 < M 2 < 1, 0 < D 2 < 1, 0 <T2<1,0 Q2<1, and M2+D2+T2+Q2=1. An encapsulating material prepared by curing a transparent resin for encapsulating materials as described in claim 1 of the patent application. The encapsulating material according to claim 4, wherein the light transmittance reduction rate (ΔT) is less than about 15% after heating at about 120 ° C for about 500 hours. The encapsulating material of claim 4, wherein the light transmittance reduction rate (ΔT) is less than about 15% after heating at about 180 ° C for about 150 hours. The encapsulating material of claim 4, wherein the encapsulating material has a viscosity of less than about 100 kgf. An electronic component comprising the encapsulating material as described in claim 4 of the patent application. The electronic component according to claim 8, wherein the electronic component comprises a light emitting diode, an organic light emitting element, a photoluminescent element, and a solar cell.