TWI588968B - Display panel and method of manufacturing same - Google Patents
Display panel and method of manufacturing same Download PDFInfo
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- TWI588968B TWI588968B TW105112454A TW105112454A TWI588968B TW I588968 B TWI588968 B TW I588968B TW 105112454 A TW105112454 A TW 105112454A TW 105112454 A TW105112454 A TW 105112454A TW I588968 B TWI588968 B TW I588968B
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- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000004020 conductor Substances 0.000 claims description 110
- 239000000758 substrate Substances 0.000 claims description 78
- 229910052751 metal Inorganic materials 0.000 claims description 73
- 239000002184 metal Substances 0.000 claims description 73
- 239000000463 material Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 6
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 231
- 239000010949 copper Substances 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- 229910052802 copper Inorganic materials 0.000 description 18
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 12
- 238000009413 insulation Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 5
- 229910052733 gallium Inorganic materials 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- -1 but not limited to Chemical class 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- ZPZCREMGFMRIRR-UHFFFAOYSA-N molybdenum titanium Chemical compound [Ti].[Mo] ZPZCREMGFMRIRR-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
本發明是有關於一種顯示面板及其製造方法,且特別是有關於顯示面板之電晶體陣列基板結構及其製造方法。 The present invention relates to a display panel and a method of fabricating the same, and more particularly to a transistor array substrate structure and a method of fabricating the same.
不論在工作處理學習上或是個人休閒娛樂上,具顯示面板的電子產品,包括智慧型手機(SmartPhone)、平板電腦(Pad)、筆記型電腦(Notebook)、顯示器(Monitor)到電視(TV)等許多相關產品,已是現代人不可或缺的必需品。其中又以簡潔、輕盈、易攜帶、和低價的液晶顯示面板最為廣泛使用。液晶顯示面板同時提供多樣性包括尺寸、形狀、解析度等多種選擇。 Electronic products with display panels, including smart phones, tablets, notebooks, monitors, and televisions, whether for work or study or personal entertainment. Many related products are already indispensable for modern people. Among them, the liquid crystal display panel which is simple, light, portable, and low-priced is most widely used. The liquid crystal display panel also provides a variety of options including size, shape, resolution, and the like.
銅製程為目前大尺寸顯示面板常用之製程技術,而顯示面板之基板中以半導體(例如氧化銦鎵鋅,IGZO)做為薄膜電晶體(例如IGZO TFT)之主動層,由於具有高場效移動率及大面積製程之可行性,應用於大尺寸顯示器具極大優勢。而目前以銅做為金屬導線時,由於其與底層絕緣膜之附著性不佳,需於銅與絕緣層之間增加一中介金屬層(如鉬),以增加金屬與絕緣層之附著性,另一方面,此中介金屬層可做為擴散阻擋層,以防止銅離子 進入主動層而影響元件可靠性。目前常見的金屬導線和中介金屬層之組合為:銅/鉬(Cu/Mo),銅/鈦(Cu/Ti),和銅/鉬鈦合金(Cu/Mo:Ti)等。在IGZO薄膜電晶體結構中,當主動層為IGZO層時,鉬或鈦等金屬接觸IGZO時容易搶IGZO內的氧而造成主動層導電性的改變。因此,於第二金屬層定義完成後(即形成源極汲極)和沉積保護層如氧化矽(SiOx)於第二金屬層上之前,目前製程會使用氧化氮(N2O)電漿對主動層表面進行表面處理來補氧,但此道步驟同時也容易造成銅導線表面嚴重氧化。 The copper process is a commonly used process technology for large-size display panels, and a semiconductor (such as indium gallium zinc oxide, IGZO) is used as an active layer of a thin film transistor (such as IGZO TFT) in the substrate of the display panel due to high field effect movement. The feasibility of the rate and large-area process is greatly advantageous for large-size display devices. At present, when copper is used as the metal wire, due to its poor adhesion to the underlying insulating film, an intermediate metal layer (such as molybdenum) is added between the copper and the insulating layer to increase the adhesion between the metal and the insulating layer. On the other hand, the intervening metal layer can act as a diffusion barrier to prevent copper ions from entering the active layer and affecting component reliability. The combination of common metal wires and intermediate metal layers is: copper/molybdenum (Cu/Mo), copper/titanium (Cu/Ti), and copper/molybdenum titanium alloy (Cu/Mo:Ti). In the IGZO thin film transistor structure, when the active layer is an IGZO layer, when a metal such as molybdenum or titanium contacts IGZO, it is easy to grab oxygen in the IGZO to cause a change in conductivity of the active layer. Therefore, prior to the completion of the definition of the second metal layer (ie, the formation of the source drain) and the deposition of a protective layer such as yttrium oxide (SiOx) on the second metal layer, the current process uses a nitrogen oxide (N 2 O) plasma pair. The surface of the active layer is surface treated to supplement oxygen, but this step is also prone to severe oxidation of the copper wire surface.
本發明係有關於一種顯示面板及其製造方法,其電晶體陣列基板結構設計,可防止導線之金屬離子進入主動層而改變元件電子特性,影響元件之可靠性,但又可避免導線表面在製程中產生氧化。 The invention relates to a display panel and a manufacturing method thereof. The structure of the transistor array substrate prevents the metal ions of the wire from entering the active layer and changes the electronic characteristics of the component, thereby affecting the reliability of the component, but avoiding the surface of the wire in the process. Oxidation occurs.
根據本發明,係提出一種顯示面板,包括一第一基板、與第一基板相對設置的一第二基板,和設置於第一基板與第二基板之間的一顯示介質層。第一基板包括交錯設置的複數條第一導線、複數條第二導線和複數電晶體設置在一基材上以定義出複數個畫素區域,且第一導線和第二導線分別沿第一方向和第二方向延伸。各畫素區域之電晶體包含:設置在基材上之一閘極電極、設置在閘極電極上之一第一絕緣層、設置在第一絕緣層上之一主動層、設置在該主動層上並與主動層電性連接之一第一電極和一第二電極。主動層包含一通道區,且通道區位於第一電極和 第二電極之間。第一電極係由雙層透光導電材料組成,包括一第一透光導電材料層形成於主動層上方和一第二透光導電材料層形成於第一透光導電材料層上,其中與第一電極連接之第二導線係包括一第三透光導電材料層、一金屬層與一第四透光導電材料層,金屬層設置於第三透光導電材料層和第四透光導電材料層之間。於一實施例中,各畫素區域的第一電極之第一透光導電材料層和第二透光導電材料層係延伸至對應之第二導線的金屬層並包覆金屬層,以分別形成第三透光導電材料層與第四透光導電材料層。 According to the present invention, a display panel includes a first substrate, a second substrate disposed opposite the first substrate, and a display medium layer disposed between the first substrate and the second substrate. The first substrate includes a plurality of staggered first wires, a plurality of second wires, and a plurality of transistors disposed on a substrate to define a plurality of pixel regions, and the first wires and the second wires are respectively in the first direction And extending in the second direction. The transistor of each pixel region includes: one gate electrode disposed on the substrate, one first insulating layer disposed on the gate electrode, one active layer disposed on the first insulating layer, and disposed on the active layer And electrically connecting one of the first electrode and the second electrode to the active layer. The active layer includes a channel region, and the channel region is located at the first electrode and Between the second electrodes. The first electrode is composed of a double-layer light-transmitting conductive material, and includes a first light-transmissive conductive material layer formed on the active layer and a second light-transmitting conductive material layer formed on the first light-transmitting conductive material layer, wherein The second wire connected to the electrode includes a third light-transmissive conductive material layer, a metal layer and a fourth light-transmitting conductive material layer, and the metal layer is disposed on the third light-transmitting conductive material layer and the fourth light-transmitting conductive material layer between. In one embodiment, the first light-transmissive conductive material layer and the second light-transmissive conductive material layer of the first electrode of each pixel region extend to the metal layer of the corresponding second wire and cover the metal layer to form respectively. a third light-transmissive conductive material layer and a fourth light-transmitting conductive material layer.
根據本發明,係提出一種顯示面板之製造方法,包含形成一第一基板,提供一第二基板並與第一基板對組,以及提供一顯示介質層於第一基板與第二基板之間。其中形成第一基板包括:形成第一金屬層於一基材,圖案化第一金屬層以形成複數條第一導線與複數個閘極電極,該些第一導線沿第一方向延伸並連接相對應之閘極電極;形成第一絕緣層覆蓋於該些閘極電極與該些第一導線上;形成複數個主動層於第一絕緣層上;形成一第一透光導電材料層於第一絕緣層上;形成複數條金屬層於第一透光導電材料層上;形成一第二透光導電材料層於該些金屬層與第一透光導電材料層上;圖案化第一透光導電材料層與第二透光導電材料層以形成複數條第二導線於基材上並沿第二方向延伸、複數第一電極和複數第二電極,其中每一第二導線包括一由第一透光導電材料層形成之第一透光導電層、金屬層、一由第二透光導 電材料層形成之第二透光導電層,且該些第二導線與該些第一導線交錯設置以定義出複數個畫素區域;其中,於各畫素區域中第一電極和第二電極在主動層上,且通道區位於第一電極和第二電極之間。第一電極係由一第一透光導電材料層和一第二透光導電材料層組成。 According to the present invention, a method of manufacturing a display panel includes forming a first substrate, providing a second substrate and pairing the first substrate, and providing a display dielectric layer between the first substrate and the second substrate. The forming the first substrate includes: forming a first metal layer on a substrate, patterning the first metal layer to form a plurality of first wires and a plurality of gate electrodes, the first wires extending in a first direction and connecting the phases Corresponding gate electrode; forming a first insulating layer covering the gate electrodes and the first wires; forming a plurality of active layers on the first insulating layer; forming a first transparent conductive material layer in the first Forming a plurality of metal layers on the first light-transmissive conductive material layer; forming a second light-transmitting conductive material layer on the metal layer and the first light-transmitting conductive material layer; patterning the first light-transmitting conductive layer The material layer and the second light-transmissive conductive material layer form a plurality of second wires on the substrate and extend in the second direction, the plurality of first electrodes and the plurality of second electrodes, wherein each of the second wires comprises a first through a first light-transmissive conductive layer formed by the photoconductive material layer, a metal layer, and a second light-transmitting guide a second light-transmissive conductive layer formed by the layer of electrical material, and the second wires are staggered with the first wires to define a plurality of pixel regions; wherein the first electrode and the second electrode are in each pixel region On the active layer, and the channel region is between the first electrode and the second electrode. The first electrode is composed of a first light-transmissive conductive material layer and a second light-transmitting conductive material layer.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式,作詳細說明如下: In order to provide a better understanding of the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings
S1‧‧‧第一基板 S1‧‧‧ first substrate
10‧‧‧基材 10‧‧‧Substrate
12‧‧‧閘極電極 12‧‧‧ gate electrode
13‧‧‧第一絕緣層 13‧‧‧First insulation
14‧‧‧主動層 14‧‧‧Active layer
ACH‧‧‧通道區 A CH ‧‧‧ passage area
141‧‧‧主動層之上表面 141‧‧‧Top surface of the active layer
E1‧‧‧第一電極 E1‧‧‧first electrode
E2‧‧‧第二電極 E2‧‧‧second electrode
151‧‧‧第一透光導電材料層 151‧‧‧First light-transmissive conductive material layer
152‧‧‧第二透光導電材料層 152‧‧‧Second light-transmissive conductive material layer
15E‧‧‧延伸部 15E‧‧‧Extension
16‧‧‧金屬層 16‧‧‧metal layer
160‧‧‧金屬層之底面 160‧‧‧ underside of the metal layer
161、162‧‧‧金屬層之側壁 161, 162‧‧‧ side walls of metal layers
163‧‧‧金屬層之上表面 163‧‧‧Top surface of the metal layer
17‧‧‧蝕刻阻擋層 17‧‧‧ etching barrier
18‧‧‧第二絕緣層 18‧‧‧Second insulation
19‧‧‧第三絕緣層 19‧‧‧ Third insulation
19h‧‧‧孔洞 19h‧‧‧ hole
PE‧‧‧畫素電極 PE‧‧‧ pixel electrode
SL‧‧‧掃描線 SL‧‧‧ scan line
DL‧‧‧資料線 DL‧‧‧ data line
PX‧‧‧畫素區域 PX‧‧‧ pixel area
DE‧‧‧延伸寬度 D E ‧‧‧Extended width
17h1‧‧‧第一開口 17h 1 ‧‧‧First opening
17h2‧‧‧第二開口 17h 2 ‧‧‧second opening
DC1‧‧‧第一接觸寬度 D C1 ‧‧‧first contact width
DC2‧‧‧第二接觸寬度 D C2 ‧‧‧second contact width
S2‧‧‧第二基板 S2‧‧‧second substrate
LC‧‧‧液晶層 LC‧‧‧Liquid layer
D1‧‧‧第一方向 D1‧‧‧ first direction
D2‧‧‧第二方向 D2‧‧‧ second direction
第1A圖係為本揭露第一實施例中顯示面板之基板的簡單俯視圖。 FIG. 1A is a simplified plan view showing a substrate of a display panel in the first embodiment.
第1B圖為第1A圖中圈選處之局部放大圖。 Fig. 1B is a partial enlarged view of the circled portion in Fig. 1A.
第1C圖為沿第1B圖之剖面線1C-1C繪示第一實施例之顯示面板的剖面示意圖。 1C is a cross-sectional view showing the display panel of the first embodiment along a section line 1C-1C of FIG. 1B.
第2A-2F圖係為製作第一實施例顯示面板之電晶體陣列基板的流程示意圖。 2A-2F is a schematic flow chart showing the fabrication of the transistor array substrate of the display panel of the first embodiment.
第3圖係繪示本揭露第一實施例顯示面板之另一基板的剖面示意圖。 3 is a cross-sectional view showing another substrate of the display panel of the first embodiment of the present disclosure.
第4圖為本揭露第二實施例顯示面板之基板的剖面示意圖。 4 is a cross-sectional view showing a substrate of a display panel according to a second embodiment of the present invention.
第5圖係繪示本揭露第二實施例顯示面板之另一基板的剖面示意圖。 FIG. 5 is a cross-sectional view showing another substrate of the display panel of the second embodiment of the present disclosure.
本揭露之實施例係提出一種顯示面板,其關於電晶體陣列基板的特殊結構設計,其導線(例如金屬銅)包括側面係以透光導電材料覆蓋,如此所製得之導線(例如資料線)可避免產生銅氧化。再者,於在各畫素區域中的電極例如源極電極和汲極電極僅由透光導電材料所組成,如此可避免銅擴散至主動層而造成電子特性改變。以下係參照所附圖式詳細敘述本揭露之實施例。本揭露之實施例可應用於具不同形態的電晶體陣列基板之顯示面板,例如是背通道蝕刻型電晶體(BCE-type TFT)陣列基板和蝕刻停止型電晶體(Etch Stop-type TFT)陣列基板等的液晶顯示面板。需注意的是,實施例所提出的實施態樣之結構和內容僅為舉例說明之用。本揭露並非顯示出所有可能的實施例,相關領域者可在不脫離本揭露之精神和範圍內對實施例之結構加以變化與修飾,以符合實際應用所需。因此,未於本揭露提出的其他實施態樣也可能可以應用。再者,圖式係已簡化以利清楚說明實施例之內容,圖式上的尺寸比例並非按照實際產品等比例繪製。因此,說明書和圖示內容僅作敘述實施例之用,而非作為限縮本揭露保護範圍之用。再者,實施例中相同或類似的標號係用以標示相同或類似之部分。 Embodiments of the present disclosure provide a display panel with a special structural design of a transistor array substrate, wherein a wire (for example, metallic copper) includes a side surface covered with a light-transmitting conductive material, and the thus obtained wire (for example, a data line) Copper oxidation can be avoided. Furthermore, the electrodes in the respective pixel regions, such as the source electrode and the drain electrode, are composed only of the light-transmitting conductive material, so that the diffusion of copper to the active layer can be prevented to cause a change in electronic characteristics. The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. The embodiments of the present disclosure are applicable to display panels having different shapes of transistor array substrates, such as a back channel etched type transistor (BCE-type TFT) array substrate and an etch stop type transistor (Etch Stop-type TFT) array. A liquid crystal display panel such as a substrate. It should be noted that the structures and contents of the embodiments proposed in the embodiments are for illustrative purposes only. The disclosure does not show all possible embodiments, and the structure of the embodiments may be modified and modified to meet the needs of practical applications without departing from the spirit and scope of the disclosure. Therefore, other implementations not presented in the present disclosure may also be applicable. In addition, the drawings have been simplified to clearly illustrate the contents of the embodiments, and the dimensional ratios in the drawings are not drawn in proportion to actual products. Therefore, the description and illustration are for illustrative purposes only and are not intended to be limiting. In the embodiments, the same or similar reference numerals are used to designate the same or similar parts.
另外,說明書與請求項中所使用的序數例如”第一”、”第二”、”第三”等之用詞,以修飾請求項之元件,其本身並不意含及代表該請求元件有任何之前的序數,也不代表某一請求元件與另一請求元件的順序、或是製造方法上的順序,該些序數 的使用僅用來使具有某命名的一請求元件得以和另一具有相同命名的請求元件能作出清楚區分。 In addition, the terms used in the specification and the claims, such as "first", "second", "third" and the like, are used to modify the elements of the claim, which are not intended to represent any of the claim elements. The previous ordinal does not represent the order of a request element and another request element, or the order of the manufacturing method. The use of only one request element with a certain name can be clearly distinguished from another request element with the same name.
第一實施例係以背通道蝕刻型電晶體陣列基板之顯示面板做說明。第1A圖係為本揭露第一實施例中顯示面板之基板的簡單俯視圖。第1B圖為第1A圖中圈選處之局部放大圖。第1C圖為沿第1B圖之剖面線1C-1C繪示第一實施例之顯示面板的剖面示意圖。請同時參照第1A-1C圖。 The first embodiment is described with a display panel of a back channel etched type transistor array substrate. FIG. 1A is a simplified plan view showing a substrate of a display panel in the first embodiment. Fig. 1B is a partial enlarged view of the circled portion in Fig. 1A. 1C is a cross-sectional view showing the display panel of the first embodiment along a section line 1C-1C of FIG. 1B. Please also refer to Figure 1A-1C.
如第1A、1B圖所示,實施例之顯示面板包括一陣列基板,包括複數條第一導線例如掃描線SL與複數條第二導線例如資料線DL交錯設置,以定義出陣列的多個畫素區域PX,其中第一導線(例如掃描線SL)沿第一方向D1(即X方向)延伸,第二導線例如資料線DL係沿第二方向D2(即Y方向)延伸。而各畫素區域PX中係包含至少一開關元件例如是薄膜電晶體,以獨立控制所屬畫素區域PX。 As shown in FIGS. 1A and 1B, the display panel of the embodiment includes an array substrate including a plurality of first wires such as scan lines SL and a plurality of second wires such as data lines DL interlaced to define a plurality of pictures of the array. The region PX, wherein the first wire (for example, the scanning line SL) extends in the first direction D1 (ie, the X direction), and the second wire such as the data line DL extends in the second direction D2 (ie, the Y direction). Each of the pixel regions PX includes at least one switching element such as a thin film transistor to independently control the associated pixel region PX.
如第1C圖所示,一實施例之顯示面板包括一第一基板S1、與第一基板S1相對設置一第二基板S2和設置於第一基板S1與第二基板S2之間之一顯示介質層。第一實施例中,第一基板S1例如是一電晶體陣列基板,第二基板S2例如是一彩色濾光基板,顯示介質層例如是液晶層LC。第一實施例係以源極電極和汲極電極直接形成於半導體層(i.e.主動層)上且位於通道區ACH之兩側為例作第一基板S1之結構說明。 As shown in FIG. 1C, the display panel of an embodiment includes a first substrate S1, a second substrate S2 disposed opposite to the first substrate S1, and a display medium disposed between the first substrate S1 and the second substrate S2. Floor. In the first embodiment, the first substrate S1 is, for example, a transistor array substrate, the second substrate S2 is, for example, a color filter substrate, and the display medium layer is, for example, a liquid crystal layer LC. The first embodiment is characterized in that the source electrode and the drain electrode are directly formed on the semiconductor layer (ie active layer) and are located on both sides of the channel region A CH as an example of the structure of the first substrate S1.
如第1C圖所示,設置在一基材10上的多個電晶體其中之一係包含一閘極電極12(例如是金屬銅或其他適合金屬材料)設置在基材10上,一第一絕緣層13設置在閘極電極12上,一主動層14(i.e.半導體層)設置在第一絕緣層13上且主動層14包含一通道區ACH,一第一電極E1(例如源極電極)和一第二電極E2(例如汲極電極)設置在主動層14上,通道區ACH位於第一電極E1和第二電極E2之間。於一實施例中,主動層14的材料包含氧化物半導體(或金屬氧化物半導體),例如是氧化鋅(zinc oxide,ZnO)、氧化銦鋅(indium zinc oxide,IZO)、氧化銦鎵鋅(indium gallium zinc oxide,IGZO)。另外,電晶體更包括一第二絕緣層18覆蓋第一電極E1和第二電極E2,以及位於第二絕緣層18上的一第三絕緣層19。要說明的是,第二絕緣層18、第三絕緣層19可以是單層、雙層、或兩層以上的膜層組成,例如,於本實施例中,第二絕緣層18是包含氧化矽、氮化矽兩種膜層。於各畫素區域中,更包括一畫素電極PE(材料例如是ITO)透過第二絕緣層18和第三絕緣層19的孔洞19h而電性連接第二電極E2,如第1B、1C圖所示。 As shown in FIG. 1C, one of the plurality of transistors disposed on a substrate 10 includes a gate electrode 12 (for example, metallic copper or other suitable metal material) disposed on the substrate 10, a first The insulating layer 13 is disposed on the gate electrode 12, an active layer 14 (ie semiconductor layer) is disposed on the first insulating layer 13 and the active layer 14 includes a channel region A CH and a first electrode E1 (eg, a source electrode) And a second electrode E2 (for example, a drain electrode) is disposed on the active layer 14, and the channel region A CH is located between the first electrode E1 and the second electrode E2. In one embodiment, the material of the active layer 14 comprises an oxide semiconductor (or metal oxide semiconductor), such as zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (indium gallium zinc oxide). Indium gallium zinc oxide, IGZO). In addition, the transistor further includes a second insulating layer 18 covering the first electrode E1 and the second electrode E2, and a third insulating layer 19 on the second insulating layer 18. It is to be noted that the second insulating layer 18 and the third insulating layer 19 may be composed of a single layer, a double layer, or a film layer of two or more layers. For example, in the embodiment, the second insulating layer 18 includes yttrium oxide. And two layers of tantalum nitride. In the pixel region, a pixel electrode PE (such as ITO) is electrically connected to the second electrode E2 through the holes 19h of the second insulating layer 18 and the third insulating layer 19, as shown in FIGS. 1B and 1C. Shown.
本揭露並不侷限於第1A~1C圖所繪示之細部結構,例如於第一實施例中雖繪示第一方向D1與第二方向D2垂直,但於其他實施例中第一方向D1亦可與第二方向D2形成一夾角,其範圍例如是在75度至90度之間。再者,第二基板S2亦省略了其他元件,以利清楚顯示本揭露。 The disclosure is not limited to the detailed structure shown in FIGS. 1A-1C. For example, in the first embodiment, the first direction D1 is perpendicular to the second direction D2, but in other embodiments, the first direction D1 is also An angle may be formed with the second direction D2, which is, for example, between 75 and 90 degrees. Furthermore, the second substrate S2 also omits other components to clearly show the disclosure.
根據本揭露,顯示面板的顯示區中,第一電極E1(例如源極電極)和一第二電極E2(例如汲極電極)係由透光導電材料所組成;而與兩電極其中一者連接的導線例如資料線DL,其組成則包括一金屬層和兩層透光導電材料。第一實施例中,第一電極E1(例如源極電極)係由雙層透光導電材料組成,包括一第一透光導電材料層151形成於主動層14上方,和第二透光導電材料層152形成於第一透光導電材料層151上。與第一電極E1連接之第二導線例如資料線DL,係包括一第三透光導電材料層、一金屬層16與一第四透光導電材料層,金屬層16設置於第三透光導電材料層和第四透光導電材料層之間;而於一實施例中,各畫素區域的第一電極E1之第一透光導電材料層151和第二透光導電材料層152係延伸至對應之第二導線的金屬層16並包覆金屬層16,以分別形成第三透光導電材料層與第四透光導電材料層。如第1C圖所示,第二導線如資料線DL係包括一金屬層16設置於第一透光導電材料層151和第二透光導電材料層152之間。類似地,第二電極E2(ex汲極電極)亦由形成於主動層14上方的第一透光導電材料層151和形成於第一透光導電材料層151上的第二透光導電材料層152所組成。需說明的是,雖然實施例之第一電極E1與第二電極E2都包括有第一透光導電材料層151和第二透光導電材料層152,但第一電極E1與第二電極E2之間並沒有物理性上地連接。 According to the disclosure, in the display area of the display panel, the first electrode E1 (eg, the source electrode) and the second electrode E2 (eg, the drain electrode) are composed of a light-transmitting conductive material; and are connected to one of the two electrodes. The wire, such as the data line DL, consists of a metal layer and two layers of light-transmissive conductive material. In the first embodiment, the first electrode E1 (eg, the source electrode) is composed of a double-layer transparent conductive material, including a first light-transmissive conductive material layer 151 formed over the active layer 14, and a second light-transmitting conductive material. The layer 152 is formed on the first light-transmitting conductive material layer 151. The second wire connected to the first electrode E1, such as the data line DL, includes a third light-transmissive conductive material layer, a metal layer 16 and a fourth light-transmitting conductive material layer, and the metal layer 16 is disposed on the third light-transmitting conductive layer. Between the material layer and the fourth light-transmissive conductive material layer; and in an embodiment, the first light-transmitting conductive material layer 151 and the second light-transmitting conductive material layer 152 of the first electrode E1 of each pixel region extend to Corresponding to the metal layer 16 of the second wire and covering the metal layer 16 to form a third light-transmissive conductive material layer and a fourth light-transmitting conductive material layer, respectively. As shown in FIG. 1C, the second wire, such as the data line DL, includes a metal layer 16 disposed between the first light-transmissive conductive material layer 151 and the second light-transmitting conductive material layer 152. Similarly, the second electrode E2 (ex-electrode electrode) is also composed of a first light-transmitting conductive material layer 151 formed over the active layer 14 and a second light-transmitting conductive material layer formed on the first light-transmitting conductive material layer 151. 152 composition. It should be noted that, although the first electrode E1 and the second electrode E2 of the embodiment both include the first light-transmitting conductive material layer 151 and the second light-transmitting conductive material layer 152, the first electrode E1 and the second electrode E2 are There is no physical connection between them.
如第1C圖所示,各畫素區域的第一電極E1之第一 透光導電材料層151和第二透光導電材料層152係延伸至對應之金屬層16並包覆金屬層16,以形成第二導線例如資料線DL。其中金屬層16係形成於第一透光導電材料層151上,包括金屬層16的底面160與第一透光導電材料層151直接接觸;而第二透光導電材料層152則形成於金屬層16上,直接接觸並覆蓋金屬層16之側壁161、162和上表面163。 As shown in FIG. 1C, the first electrode E1 of each pixel region is the first The light-transmissive conductive material layer 151 and the second light-transmitting conductive material layer 152 extend to the corresponding metal layer 16 and coat the metal layer 16 to form a second wire such as the data line DL. The metal layer 16 is formed on the first light-transmissive conductive material layer 151, and the bottom surface 160 including the metal layer 16 is in direct contact with the first light-transmitting conductive material layer 151; and the second light-transmitting conductive material layer 152 is formed on the metal layer. On the 16th, the side walls 161, 162 and the upper surface 163 of the metal layer 16 are directly contacted and covered.
於一實施例中,第一透光導電材料層151和第二透光導電材料層152為金屬氧化物,例如是(但不限制是)IZO或ITO材料層,而且第一透光導電材料層151和第二透光導電材料層152可以使用相同或不同的透光導電材料。一實施例中,金屬層16例如是金屬銅層,因此在各畫素區域中源極電極和汲極電極僅由透光導電材料(ex:IZO)所組成(亦即主動層14上面沒有金屬材料層),但資料線DL是由透光導電材料包覆金屬銅(ex:IZO/Cu/IZO)所組成。 In one embodiment, the first light-transmissive conductive material layer 151 and the second light-transmitting conductive material layer 152 are metal oxides, such as, but not limited to, IZO or ITO material layers, and the first light-transmitting conductive material layer The same or different light-transmitting conductive materials may be used for the 151 and the second light-transmitting conductive material layer 152. In one embodiment, the metal layer 16 is, for example, a metal copper layer, so that the source electrode and the drain electrode are composed of only a light-transmitting conductive material (ex: IZO) in each pixel region (that is, there is no metal on the active layer 14). Material layer), but the data line DL is composed of a light-transmissive conductive material coated with metallic copper (ex: IZO/Cu/IZO).
再者,於資料線DL處,金屬層16包括相對之兩側壁161和162分別鄰近與遠離主動層14。第一透光導電材料層151和第二透光導電材料層152於金屬層16之遠離主動層14的側壁162處係重合並可形成一延伸部15E,此延伸部15E具有一延伸寬度DE。一實施例中,延伸寬度DE約0.1μm-4μm之範圍。相關技藝者當知,前述數值與範圍係作示例與參考,可因應用產品的規格不同而做適當選擇。因此該些數值與範圍係做參考之用,而非限制本揭露之用。 Moreover, at the data line DL, the metal layer 16 includes two opposite sidewalls 161 and 162 adjacent to and away from the active layer 14, respectively. The first light-transmissive conductive material layer 151 and the second light-transmissive conductive material layer 152 are combined at the side wall 162 of the metal layer 16 away from the active layer 14 to form an extension portion 15E having an extended width D E . In one embodiment, the extension width D E is in the range of about 0.1 μm to 4 μm. It is to be understood by those skilled in the art that the foregoing numerical values and ranges are set forth as examples and references, and may be appropriately selected depending on the specifications of the application. Therefore, the values and ranges are for reference purposes and are not intended to limit the disclosure.
第2A-2F圖係為製作第一實施例顯示面板之電晶體陣列基板的流程示意圖。亦可同時參考第1A-1C圖。第2A-2F圖與第1A-1C圖中相同元件係沿用相同標號,以利清楚說明。如第2A圖所示,首先提供一基材10,並形成第一金屬層於基材10上以及對第一金屬層進行圖案化,以定義出複數條相互平行之第一導線例如掃描線SL和定義出閘極電極12,其中掃描線SL係沿第一方向D1(X方向)延伸。此第一金屬層又可稱為閘極金屬導線。此導線可為銅金屬或其他其他具低電阻之金屬材料。 2A-2F is a schematic flow chart showing the fabrication of the transistor array substrate of the display panel of the first embodiment. It is also possible to refer to Figure 1A-1C at the same time. The same elements in the 2A-2F and 1A-1C drawings are denoted by the same reference numerals for clarity. As shown in FIG. 2A, a substrate 10 is first provided, and a first metal layer is formed on the substrate 10 and the first metal layer is patterned to define a plurality of first wires parallel to each other, such as a scan line SL. And defining a gate electrode 12, wherein the scan line SL extends in the first direction D1 (X direction). This first metal layer can also be referred to as a gate metal wire. This wire can be copper metal or other metal material with low electrical resistance.
如第2B圖所示,形成第一絕緣層13於基材上並覆蓋閘極電極12,其中第一絕緣層13係整面鍍製,並做為閘極絕緣層。接著,鍍製一氧化物半導體層並進行顯影蝕刻製程,以形成複數個主動層14於第一絕緣層13上。氧化物半導體層的材料泛指以離子鍵結之半導體材料,例如是氧化鋅(ZnO)、氧化銦鋅(IZO)、氧化銦鎵鋅(IGZO)或其他適合材料。 As shown in FIG. 2B, the first insulating layer 13 is formed on the substrate and covers the gate electrode 12, wherein the first insulating layer 13 is entirely plated and serves as a gate insulating layer. Next, an oxide semiconductor layer is plated and a development etching process is performed to form a plurality of active layers 14 on the first insulating layer 13. The material of the oxide semiconductor layer generally refers to a semiconductor material that is ionically bonded, such as zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), or other suitable materials.
之後,第一透光導電材料層151(如IZO)係整面鍍製並覆蓋於第一絕緣層和主動層14上方;並鍍製金屬(例如銅金屬)和定義金屬走線區,包括移除通道區域、畫素區域及其他不需要導線區域之金屬,以形成多條金屬層16之走線,而第一透光導電材料層151則全面留下,如第2C圖所示。 Thereafter, a first light-transmissive conductive material layer 151 (such as IZO) is plated over the entire insulating layer and the active layer 14; and is plated with a metal (such as copper metal) and defines a metal trace region, including In addition to the channel region, the pixel region, and other metals that do not require the wire region, the traces of the plurality of metal layers 16 are formed, and the first light-transmissive conductive material layer 151 is entirely left as shown in FIG. 2C.
接著,整面覆蓋第二透光導電材料層152(如IZO)於第一透光導電材料層151上,且第二透光導電材料層152並覆蓋該些金屬層16,並對第一透光導電材料層151和第二透光導電 材料層152同時圖案化,以定義金屬走線區,包括薄膜電晶體的源極區、汲極區和金屬層16,以及金屬層16的側面161、162也被第二透光導電材料層152覆蓋,如第2D圖所示。再者,於此定義步驟中,亦使各畫素區域中之通道區ACH暴露出對應之主動層14的上表面。因此前述(第1C圖)之第二導線如資料線DL是由第一透光導電材料層151和第二透光導電材料層152包覆金屬層16(材料例如是IZO/Cu/IZO)所組成。而從上視圖來看,透明導電層面積(如第二透光導電材料層152)會大於金屬層16(ex:銅導線)的面積。 Then, the entire surface of the second light-transmissive conductive material layer 152 (such as IZO) is covered on the first light-transmissive conductive material layer 151, and the second light-transmissive conductive material layer 152 covers the metal layer 16 and is transparent to the first layer. The photoconductive material layer 151 and the second light-transmissive conductive material layer 152 are simultaneously patterned to define a metal wiring region including a source region, a drain region and a metal layer 16 of the thin film transistor, and a side surface 161 of the metal layer 16, 162 is also covered by the second light-transmissive conductive material layer 152 as shown in FIG. 2D. Moreover, in the defining step, the channel area A CH in each pixel area is also exposed to the upper surface of the corresponding active layer 14. Therefore, the second wire of the foregoing (FIG. 1C), such as the data line DL, is covered with the first light-transmissive conductive material layer 151 and the second light-transmitting conductive material layer 152 (the material is, for example, IZO/Cu/IZO). composition. From the top view, the area of the transparent conductive layer (such as the second light-transmissive conductive material layer 152) is larger than the area of the metal layer 16 (ex: copper wire).
之後,於第二透光導電材料層152上方形成第二絕緣層18和第三絕緣層19(做為絕緣保護層(Passivation)),並定義接觸孔洞,例如形成孔洞19h貫穿第三絕緣層19和第二絕緣層18以暴露出第二電極E2之第二透光導電材料層152的上表面,如第2E圖所示。 Thereafter, a second insulating layer 18 and a third insulating layer 19 are formed over the second light-transmissive conductive material layer 152 (as an insulating protective layer), and a contact hole is defined, for example, a hole 19h is formed through the third insulating layer 19 And a second insulating layer 18 to expose the upper surface of the second light-transmissive conductive material layer 152 of the second electrode E2, as shown in FIG. 2E.
於各畫素區域中鍍製畫素電極層(材料例如是ITO),而形成如第2F圖所示之畫素電極PE,其中畫素電極PE係透過孔洞19h(例如與第二透光導電材料層152接觸)而電性連接第二電極E2。 A pixel electrode layer (material such as ITO) is plated in each pixel region to form a pixel electrode PE as shown in FIG. 2F, wherein the pixel electrode PE is transmitted through the hole 19h (for example, with the second light-transmitting conductive layer). The material layer 152 is in contact with) and electrically connected to the second electrode E2.
如上述完成第一基板S1後,再與第二基板S2(第1C圖)對組,並提供一顯示介質層(如第1C圖所示之液晶層LC)於第一基板S1與第二基板S2之間,完成顯示面板之製作。 After the first substrate S1 is completed as described above, it is paired with the second substrate S2 (FIG. 1C), and a display dielectric layer (such as the liquid crystal layer LC shown in FIG. 1C) is provided on the first substrate S1 and the second substrate. Between S2, the production of the display panel is completed.
另外,如第1C圖所示,第一電極E1之第一透光導 電材料層151係與主動層14之上表面141具有第一接觸寬度DC1,第二電極E2之第一透光導電材料層151係與主動層14之上表面141具有第二接觸寬度DC2,第一接觸寬度DC1可與第二接觸寬度DC2相同。 In addition, as shown in FIG. 1C, the first light-transmissive conductive material layer 151 of the first electrode E1 has a first contact width D C1 with the upper surface 141 of the active layer 14 and the first light-transmitting conductive material of the second electrode E2. The layer 151 has a second contact width D C2 with the upper surface 141 of the active layer 14, and the first contact width D C1 may be the same as the second contact width D C2 .
但本揭露並不僅限於此,亦可變化兩側的接觸寬度使其不同。第3圖係繪示本揭露第一實施例顯示面板之另一基板的剖面示意圖。於另一實施態樣中,第一接觸寬度DC1係與第二接觸寬度DC2不同。如此設計是閘極/畫素電極電容(Cg pixel)較大,閘極/汲極電容(Cgd)較小,而較小的閘極/汲極電容可使資料線電容(Cdata)下降。 However, the disclosure is not limited to this, and the contact width on both sides may be varied to make it different. 3 is a cross-sectional view showing another substrate of the display panel of the first embodiment of the present disclosure. In another embodiment, the first contact width D C1 is different from the second contact width D C2 . The design is such that the gate/pixel electrode capacitance (Cg pixel) is large, the gate/drain capacitance (Cgd) is small, and the smaller gate/drain capacitance reduces the data line capacitance (Cdata).
第4圖為本揭露第二實施例顯示面板之基板的剖面示意圖。第二實施例係以蝕刻停止型電晶體(Etch Stop-type TFT)陣列基板之顯示面板做說明。第4圖與第1C圖中相同元件係沿用相同標號,以利清楚說明。且第二實施例與第一實施例相同元件的結構、材料與設置等相關細節,請參看前述,在此不再贅述。 4 is a cross-sectional view showing a substrate of a display panel according to a second embodiment of the present invention. The second embodiment will be described with a display panel of an Etch Stop-type TFT array substrate. The same components in Fig. 4 and Fig. 1C are denoted by the same reference numerals for clarity of explanation. For details of the structure, material, and arrangement of the components of the second embodiment and the first embodiment, refer to the foregoing, and no further details are provided herein.
第二實施例中,與第一實施例不同的是,各畫素區域之電晶體更包含一蝕刻阻擋層17,位於主動層14和第一電極E1與第二電極E2之間,且蝕刻阻擋層17於第一電極E1和第二電極處E2處分別具有第一開口17h1和第二開口17h2。第二實施例中,第一透光導電材料層151經由第一開口17h1和第二開口17h2與主動層14接觸。而兩開口之寬度決定了第一透光導電材 料層151與主動層14之上表面141的接觸寬度。亦即,第一電極E1之第一透光導電材料層151與主動層14之上表面141具有第一接觸寬度DC1(對應之第一開口17h1的大小),第二電極E2之第一透光導電材料層151與主動層14之上表面141具有第二接觸寬度DC2(對應之第二開口17h2大小的)。另外,主動層14對應第一開口17h1和第二開口17h2處的厚度小於通道區ACH的厚度。 In the second embodiment, different from the first embodiment, the transistor of each pixel region further includes an etch barrier layer 17 between the active layer 14 and the first electrode E1 and the second electrode E2, and is etched and blocked. The layer 17 has a first opening 17h 1 and a second opening 17h 2 at the first electrode E1 and the second electrode E2, respectively. In the second embodiment, the first light-transmitting conductive material layer 151 is in contact with the active layer 14 via the first opening 17h 1 and the second opening 17h 2 . The width of the two openings determines the contact width of the first light-transmissive conductive material layer 151 and the upper surface 141 of the active layer 14. That is, the first light-transmissive conductive material layer 151 of the first electrode E1 and the upper surface 141 of the active layer 14 have a first contact width D C1 (corresponding to the size of the first opening 17h 1 ), and the first of the second electrode E2 The light-transmitting conductive material layer 151 and the upper surface 141 of the active layer 14 have a second contact width D C2 (corresponding to the size of the second opening 17h 2 ). In addition, the thickness of the active layer 14 corresponding to the first opening 17h 1 and the second opening 17h 2 is smaller than the thickness of the channel region A CH .
如第4圖所示,第一開口17h1可與第二開口17h2相同;亦即,第一接觸寬度DC1可與第二接觸寬度DC2相同。當然,但本揭露並不僅限於此,亦可變化兩側的開口寬度使其不相等。第5圖係繪示本揭露第二實施例顯示面板之另一基板的剖面示意圖。類似前述第一實施例之第3圖所示之態樣,第二實施例中,第一開口17h1與第二開口17h2不同;亦即,第一接觸寬度DC1係與第二接觸寬度DC2不同。如第5圖所示,第一開口17h1小於第二開口17h2,如此設計是閘極/畫素電極電容(Cg pixel)較大,閘極/汲極電容(Cgd)較小,而較小的閘極/汲極電容可使資料線電容(Cdata)下降。 As shown in FIG. 4, the first opening 17h 1 may be identical to the second opening 17h 2 ; that is, the first contact width D C1 may be the same as the second contact width D C2 . Of course, the disclosure is not limited to this, and the width of the openings on both sides may be changed to make them unequal. FIG. 5 is a cross-sectional view showing another substrate of the display panel of the second embodiment of the present disclosure. Similar to the aspect shown in FIG. 3 of the foregoing first embodiment, in the second embodiment, the first opening 17h 1 is different from the second opening 17h 2 ; that is, the first contact width D C1 and the second contact width D C2 is different. As shown in FIG. 5, the first opening 17h 1 is smaller than the second opening 17h 2 , so that the gate/pixel capacitance (Cg pixel) is larger and the gate/drain capacitance (Cgd) is smaller. A small gate/drain capacitor reduces the data line capacitance (Cdata).
如上述圖示之結構與製程(例如提出底閘極五道光罩製程及製得結構),是用以敘述本揭露之部分實施例,而非用以限制本揭露之範圍。其他不同結構態樣之實施例,例如不同形態的開關如TFT和顯示面板、做為S/D電極之雙層透光導電材料層其邊界是否齊平或有段差等以符合製程需求、兩電極之第一透光導電材料層與主動層之間的接觸寬度、畫素電極連接用的接觸孔 洞之位置變化以符合連結所需、或是蝕刻阻擋層對應電極處的開口位置和大小...等等,都是屬本揭露之保護範圍。通常知識者當知,應用本揭露之相關結構和製程係視實際應用之產品需求而可能有相應的調整,但調整後仍可符合應用產品的操作規格(例如電晶體的充電能力和電容負載仍符合一般應用產品的需求),而可維持顯示面板良好的電子特性。 The structure and process of the above-described illustrations (e.g., the fabrication of the bottom gate five reticle process and the resulting structure) are used to describe some of the embodiments of the present disclosure, and are not intended to limit the scope of the disclosure. Other embodiments of different structural aspects, such as switches of different forms such as TFTs and display panels, layers of double-layer transparent conductive material as S/D electrodes, whether the boundaries are flush or have a step, etc., to meet the process requirements, the two electrodes a contact width between the first light-transmitting conductive material layer and the active layer, and a contact hole for connecting the pixel electrodes It is within the scope of the present disclosure to change the position of the hole to meet the position or size of the opening at the corresponding electrode of the barrier layer. Generally, the knowledge holder knows that the relevant structure and process of applying the disclosure may be adjusted according to the product requirements of the actual application, but the adjustment may still conform to the operating specifications of the application product (for example, the charging capacity of the transistor and the capacitive load are still Meet the needs of general application products), and maintain the good electronic characteristics of the display panel.
根據上述,本揭露提出之顯示面板之電晶體陣列基板結構設計,其導線例如金屬銅層係以透光導電材料覆蓋,例如金屬層16上下分別以第二透光導電材料層152和第一透光導電材料層151覆蓋,且第二透光導電材料層152更包覆了金屬層16之側面161、162,如此所製得之導線例如資料線DL(ex:IZO/Cu/IZO)可避免後續製程(例如於電極定義後沈積保護層前,使用N2O電漿對主動層14表面進行處理)所造成的銅表面氧化。再者,於在各畫素區域中第一電極E1(ex:源極電極)和第二電極E2(ex:汲極電極)僅由透光導電材料(ex:IZO)所組成(亦即主動層14上面沒有金屬材料如銅),如此可避免銅擴散至主動層14(半導體材料)而造成電子特性改變。再者,實施例所提出之基板製程步驟簡易不耗時,在製作上十分適合量產。 According to the above, the structure of the transistor array substrate of the display panel of the present disclosure is such that the wires, for example, the metal copper layer are covered with a light-transmitting conductive material, for example, the metal layer 16 is vertically etched with the second light-transmitting conductive material layer 152 and the first transparent layer. The photoconductive material layer 151 is covered, and the second light-transmissive conductive material layer 152 further covers the side faces 161, 162 of the metal layer 16, so that the prepared wires such as the data line DL (ex: IZO/Cu/IZO) can be avoided. Oxidation of the copper surface caused by subsequent processes (eg, treatment of the surface of the active layer 14 with N2O plasma prior to deposition of the protective layer after electrode definition). Furthermore, in each pixel region, the first electrode E1 (ex: source electrode) and the second electrode E2 (ex: drain electrode) are composed only of a light-transmitting conductive material (ex: IZO) (ie, active) There is no metal material such as copper on the layer 14, so that copper diffusion to the active layer 14 (semiconductor material) is prevented to cause a change in electronic characteristics. Furthermore, the substrate manufacturing process proposed in the embodiment is simple and time-consuming, and is very suitable for mass production in production.
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
S1‧‧‧第一基板 S1‧‧‧ first substrate
10‧‧‧基材 10‧‧‧Substrate
12‧‧‧閘極電極 12‧‧‧ gate electrode
13‧‧‧第一絕緣層 13‧‧‧First insulation
14‧‧‧主動層 14‧‧‧Active layer
ACH‧‧‧通道區 A CH ‧‧‧ passage area
141‧‧‧主動層之上表面 141‧‧‧Top surface of the active layer
E1‧‧‧第一電極 E1‧‧‧first electrode
E2‧‧‧第二電極 E2‧‧‧second electrode
151‧‧‧第一透光導電材料層 151‧‧‧First light-transmissive conductive material layer
152‧‧‧第二透光導電材料層 152‧‧‧Second light-transmissive conductive material layer
15E‧‧‧延伸部 15E‧‧‧Extension
16‧‧‧金屬層 16‧‧‧metal layer
160‧‧‧金屬層之底面 160‧‧‧ underside of the metal layer
161、162‧‧‧金屬層之側壁 161, 162‧‧‧ side walls of metal layers
163‧‧‧金屬層之上表面 163‧‧‧Top surface of the metal layer
18‧‧‧第二絕緣層 18‧‧‧Second insulation
19‧‧‧第三絕緣層 19‧‧‧ Third insulation
19h‧‧‧孔洞 19h‧‧‧ hole
PE‧‧‧畫素電極 PE‧‧‧ pixel electrode
DE‧‧‧延伸寬度 D E ‧‧‧Extended width
DC1‧‧‧第一接觸寬度 D C1 ‧‧‧first contact width
DC2‧‧‧第二接觸寬度 D C2 ‧‧‧second contact width
S2‧‧‧第二基板 S2‧‧‧second substrate
LC‧‧‧液晶層 LC‧‧‧Liquid layer
DL‧‧‧資料線 DL‧‧‧ data line
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