TWI584174B - Touch module and manufacturing method thereof - Google Patents

Description

Touch module and manufacturing method thereof

The present invention relates to an electronic device and a method of manufacturing the same. In particular, it relates to a touch module and a method of manufacturing the same.

With the rapid development of electronic technology, touch modules have been widely used in various electronic devices, such as mobile phones, tablets, and the like.

A typical touch module can be disposed on the display screen, for example, and includes a plurality of touch electrodes. When an object (finger or touch pen, etc.) approaches or touches the display screen, the corresponding touch electrode generates an electrical signal, thereby achieving touch sensing.

In the manufacturing process, the conductive material between the touch electrodes is generally removed by etching to pattern the touch electrodes and insulate the touch electrodes from each other. However, the removal of a portion of the conductive material and the removal of only a portion of the conductive material result in a non-uniform refractive index of the touch module, which affects the optical consistency of the appearance of the touch module.

Therefore, in order to avoid uneven light refractive index of the touch module, a touch module is provided in one aspect of the present invention. According to an embodiment of the present invention, the touch module includes a substrate, at least two first touch electrodes, at least two second touch electrodes, an insulating block, at least one electrode channel, and at least one bridge. The first touch electrodes are formed on the substrate. The second touch electrodes are formed On the substrate. The insulating block is embedded in the substrate and located between the first touch electrode and the second touch electrode. The electrode channel is formed on the substrate for electrically connecting the second touch electrodes. The bridge is disposed on the substrate for electrically connecting the first touch electrodes. The first touch electrodes are electrically insulated from the second touch electrodes.

According to an embodiment of the present invention, the first touch electrodes, the second touch electrodes, the electrode channels and the insulating blocks are formed of the same conductive material layer and have the same conductive material, and the insulating blocks The insulating material is separated by a dispersion of a conductive material to have a separated conductive material.

According to an embodiment of the present disclosure, the insulating block is located around the first touch electrodes and the second touch electrodes.

According to an embodiment of the present invention, the orthographic projection of the insulating block on a surface of the substrate is between the first touch electrodes and the orthographic projections of the second touch electrodes on the surface of the substrate.

According to an embodiment of the present invention, the first touch electrodes, the second touch electrodes, the electrode channels, and the orthographic projection of the insulating block on a surface of the substrate do not overlap.

According to an embodiment of the present invention, the touch module further includes a plurality of masks disposed on the first touch electrodes, the second touch electrodes, and the electrode channels.

According to an embodiment of the present disclosure, the masks disposed on the first touch electrodes further include a plurality of contact holes. The bridge is electrically connected to the first touch electrodes through the contact holes.

According to an embodiment of the present invention, the masks disposed on the first touch electrodes further include a plurality of conductive members respectively located in the contact holes. The bridge is electrically connected to the first touch electrodes through the conductive members.

According to an embodiment of the present invention, the bridge is electrically insulated from the electrode channel by the mask disposed on the electrode channel.

According to an embodiment of the present invention, the touch module further includes a plurality of wires electrically connected to the first touch electrodes and the second touch electrodes.

According to an embodiment of the present invention, the touch module further includes a plurality of auxiliary wires respectively located under the wires and electrically connected to the wires.

According to an embodiment of the present disclosure, the touch module further includes a plurality of contact pads and a plurality of wires. The contact pads are respectively disposed on a portion of the first touch electrode and a portion of the second touch electrode. The wires are electrically connected to the contact pads.

According to an embodiment of the present invention, the first touch electrodes are disposed along a first direction, the second touch electrodes are disposed along a second direction, and the first direction is different from the second direction.

In addition, another aspect of the present invention provides a method of manufacturing a touch module. According to an embodiment of the present invention, the manufacturing method includes: forming at least two first touch electrodes, at least two first touch electrodes, and at least one electrode channel on a substrate, and simultaneously embedding to form an insulating block in the substrate The insulating block is located between the first touch electrodes and the second touch electrodes, and the electrode channels are electrically connected to the second touch electrodes; and at least one bridge is disposed on the substrate. The bridge is configured to electrically connect the first touch electrodes. The first touch electrodes are electrically insulated from the second touch electrodes.

According to an embodiment of the present invention, the steps of forming the first touch electrodes, the first touch electrodes, and the electrode channels on the substrate and simultaneously embedding the insulating blocks in the substrate include: providing a conductive a material layer on the substrate; providing a plurality of masks on the conductive material And insulating a portion of the conductive material layer to form the first touch electrodes, the second touch electrodes, the electrode channels, and the insulating blocks.

According to an embodiment of the present invention, the manufacturing method further includes: insulating a portion of the conductive material layer to form the first touch electrodes, the second touch electrodes, the electrode channels, and the insulating region Prior to the block, a plurality of wires are provided on the layer of electrically conductive material.

According to an embodiment of the present invention, the step of insulating a portion of the conductive material layer to form the first touch electrodes, the second touch electrodes, the electrode channels, and the insulating block further comprises: dispersing the a conductive material in the conductive material layer exposed to the mask and a first portion other than the wires to insulate the first portion of the conductive material layer to form the insulating block and The plurality of second portions of the conductive material layer under the masks respectively form the first touch electrodes, the second touch electrodes, and the electrode channels.

According to an embodiment of the present invention, the dispersing the conductive material in the conductive material layer exposed to the mask and a first portion other than the wires comprises: providing an embedding liquid exposed in the conductive material layer The first portion of the mask and the first portion of the conductive material are dispersed outside the mask to disperse the conductive material in the first portion of the conductive material layer.

According to an embodiment of the present invention, the step of insulating a portion of the conductive material layer to form the first touch electrodes, the second touch electrodes, the electrode channels, and the insulating block further comprises: A plurality of third portions of the layer of electrically conductive material underlying the plurality of conductors form a plurality of auxiliary conductors.

According to an embodiment of the present invention, the manufacturing method further includes: insulating a portion of the conductive material layer to form the first touch electrode, the second touch electrode, the electrode channel, and the insulating block Providing a plurality of contact pads on the layer of conductive material.

According to an embodiment of the present invention, the step of insulating a portion of the conductive material layer to form the first touch electrodes, the second touch electrodes, the electrode channels, and the insulating block further comprises: dispersing the a conductive material in the conductive material layer exposed to the mask and a first portion other than the contact pads to insulate the first portion of the conductive material layer to form the insulating block, and The plurality of second portions of the conductive material layer under the masks respectively form the first touch electrodes, the second touch electrodes, and the electrode channels.

According to an embodiment of the present invention, the manufacturing method further includes: providing a plurality of wires on the conductive material layer, and electrically connecting the contact pads respectively.

According to an embodiment of the present invention, the plurality of contact holes corresponding to the first touch electrodes are disposed on the masks, and the bridges are electrically connected to the first touch electrodes through the contact holes.

According to an embodiment of the present invention, the manufacturing method further includes: forming a plurality of conductive members, wherein the conductive members are respectively located in the contact holes, and the bridge is electrically connected to the first touch electrodes through the conductive members.

According to an embodiment of the present invention, the orthographic projection of the insulating block on a surface of the substrate is between the first touch electrodes and the orthographic projections of the second touch electrodes on the surface of the substrate.

According to an embodiment of the present invention, the first touch electrodes, the second touch electrodes, the electrode channels, and the orthographic projection of the insulating block on a surface of the substrate do not overlap.

In summary, a touch module can be implemented by applying the above embodiment. The touch electrodes can be insulated from each other by forming insulating blocks in the substrate. In this way, the touch electrode can be prevented from being patterned by etching, and the optical refractive index of the touch module is not uniform, thereby affecting the optical consistency of the appearance of the touch module.

100‧‧‧ touch module

110‧‧‧Substrate

120‧‧‧ Conductive material layer

MT‧‧‧Metal wire

TR‧‧‧Transparent wire

PD‧‧‧ transparent contact pads

CD‧‧‧Transparent conductive parts

MD‧‧‧Metal conductive parts

X‧‧‧Auxiliary wire

SNW‧‧Nee silver wire

P‧‧‧The first part of the conductive material layer

Q‧‧‧Second part of the conductive material layer

The third part of the R‧‧‧ conductive material layer

SF1‧‧‧ surface

E1‧‧‧first touch electrode

C‧‧‧electrode channel

BG‧‧ ‧ Bridge

MSK1‧‧‧ mask

MSK2‧‧‧ mask

I‧‧‧Insulated block

A-a‧‧ ‧ line segment

T‧‧‧ contact hole

200‧‧‧Manufacture method

S1-S2‧‧‧ steps

1A-5A are schematic views of a method for manufacturing a touch module according to an embodiment of the present invention; and FIGS. 1B-5B are cross-sectional views of the touch module of FIG. 1A-5A along a line Aa direction; 6 is a cross-sectional view showing a touch electrode and an insulating block according to a comparative example of the present invention; and FIGS. 7A-9A are schematic views showing a method of manufacturing a touch module according to an embodiment of the present invention; 9B is a cross-sectional view of the touch module of FIG. 7A-9A along the direction of the line Aa; FIG. 10A-14A is a schematic diagram of a method for manufacturing the touch module according to an embodiment of the present invention; 14B is a cross-sectional view of the touch module of FIG. 10A-14A along the direction of the line Aa; FIG. 15A-19A is a schematic diagram of a method for manufacturing the touch module according to an embodiment of the present invention; 19B is a cross-sectional view of the touch module of FIG. 15A-19A along the direction of the line Aa; FIG. 20A-23A is a step of the method for manufacturing the touch module according to an embodiment of the present disclosure. Figure 20B-23B is a cross-sectional view of the touch module of Figure 20A-23A along the direction of the line Aa; Figure 24A-28A FIG. 24B-28B is a cross-sectional view of the touch module of FIG. 24A-28A along the line Aa direction; FIG. 29A-32A is a schematic view of a method for manufacturing a touch module according to an embodiment of the present invention; FIG. 29B-32B are cross-sectional views of the touch module of FIG. 29A-32A along the direction of the line Aa according to an embodiment of the present invention; 33A-34A are schematic views of a method for manufacturing a touch module according to an embodiment of the present invention; and FIGS. 33B-34B are cross-sectional views of the touch module of FIG. 33A-34A along a line Aa direction; 35A-39A are schematic views of a method for manufacturing a touch module according to an embodiment of the present invention; and FIGS. 35B-39B are cross-sectional views of the touch module of FIG. 35A-39A along a line Aa direction; 40A-43A are schematic views of a method for manufacturing a touch module according to an embodiment of the present invention; and FIGS. 40B-43B are cross-sectional views of the touch module of FIG. 40A-43A along a line Aa direction; 44A-47A are schematic views of a method for manufacturing a touch module according to an embodiment of the present invention; and FIGS. 44B-47B are cross-sectional views of the touch module of FIG. 44A-47A along a line Aa direction; 48A-50A are schematic views of a method for manufacturing a touch module according to an embodiment of the present invention; and FIGS. 48B-50B are cross-sectional views of the touch module of FIG. 48A-50A along a line Aa direction; 51A-54A are schematic diagrams showing a method of fabricating a touch module according to an embodiment of the present invention; and FIGS. 51B-54B are FIG. 51A-5. FIG. 55A-57A is a schematic diagram of a method for manufacturing a touch module according to an embodiment of the present invention; FIG. 55B-57B is FIG. 55A- a cross-sectional view of the touch module in the direction of the line Aa in the 57A; FIG. 58 is a flow chart of a method of fabricating a touch module according to an embodiment of the present invention.

The spirit and scope of the present disclosure will be apparent from the following description of the preferred embodiments of the present disclosure. Modifications do not depart from the spirit and scope of the disclosure.

The use of the terms "first", "second", ", etc." as used herein does not specifically mean the order or the order, and is not intended to limit the present invention. It is merely to distinguish between elements or operations described in the same technical terms.

Regarding the directional terms used in this article, such as: up, down, left, right, front or back, etc., only refer to the direction of the additional schema. Therefore, the directional terminology used is used to illustrate that it is not intended to limit the creation.

The terms "including", "including", "having", "containing", etc., as used in this document are all open terms, meaning, but not limited to.

With respect to "and/or" as used herein, it is meant to include any or all combinations of the recited.

The terms used in this document, unless otherwise specified, generally have the usual meaning of each term used in the art, in the context of the disclosure, and in the particular content. Certain terms used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the disclosure.

One embodiment of the present invention is a method of manufacturing a touch module. In the following paragraphs, the present case will be described by using the following first to fourteenth embodiments as an example, but this The case is not limited to the details in the following embodiments, and other embodiments are also within the scope of the present invention.

First embodiment

1A-5A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 1B-5B are cross-sectional views of the touch module 100 of FIGS. 1A-5A taken along line A-A.

First, referring specifically to FIGS. 1A and 1B, in a first step, a conductive material layer 120 is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120.

In one embodiment, an embedding solvent containing a conductive additive is provided on the upper surface SF1 of the substrate 110 to partially embed the conductive additive in the substrate 110 to form a conductive material layer. 120. That is, the conductive material layer 120 is partially embedded on the upper surface SF1 of the substrate 110.

In one embodiment, the substrate 110 is, for example, polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), cyclic olefin. It is realized by a suitable polymer material such as a cycloolefin polymer (COP). In one embodiment, the embedding fluid containing the conductive additive is achieved, for example, by dissolving the conductive additive in a specific solvent, wherein the solubility parameter of the specific solvent is close to the dissolution of the material of the substrate 110. The parameter is such that the conductive additive dissolved in the specific solvent penetrates into the substrate 110 to achieve an embedding effect. In one embodiment, the conductive additive is, for example, a suitable conductive material such as a carbon nanotube, a nanowire, a conductive paste, a conductive polymer, a graphite thinner, or a nano metal.

Providing a matrix formed of a polymer material by providing an embedding liquid containing a conductive additive On the upper surface SF1 of the board 110, a portion of the substrate 110 adjacent to the upper surface SF1 may be expanded to allow a portion of the conductive additive to penetrate into the substrate 110 to achieve a partial embedding effect.

In order to clarify the description, in the following paragraphs, the above-mentioned conductive additive will be described by taking a silver nanowire as an example, but the present invention is not limited thereto.

In one embodiment, the first mask MSK1 is used to pattern the first touch electrode E1 in a subsequent step, and the second mask MSK2 is used to pattern the second touch electrode E2 in a subsequent step.

In one embodiment, a layer of transparent material is first formed on the conductive material layer 120, and then a portion of the transparent material layer is removed to form a first mask MSK1 and a second mask MSK2. In an embodiment, the removal process can be implemented by yellow etching or dry etching, but the present invention is not limited thereto.

In an embodiment, the first mask MSK1 and the second mask MSK2 can be implemented, for example, by a photoresist material or other transparent conductive or non-conductive materials, but the present invention is not limited thereto.

In one embodiment, a plurality of contact holes T are present on the first mask MSK1, and the contact holes T expose a portion of the conductive material layer 120.

2A and 2B, in a third step, a plurality of transparent conductive members CD are provided in the contact holes T and on the conductive material layer 120.

In an embodiment, the transparent conductive member CD has the same size as the contact hole T in plan view. In an embodiment, the size of the transparent conductive member CD on the top surface may be larger or smaller than the size of the contact hole T on the top surface.

In an embodiment, the transparent conductive member CD may be formed of a transparent conductive material.

Next, with particular reference to FIG. 3A and FIG. 3B, in a fourth step, a plurality of numbers are provided. The strip metal wires MT are on the conductive material layer 120 and the first mask MSK1 and the second mask MSK2.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2 and the metal wires MT, a second portion Q located under the masks MSK1, MSK2 and the transparent conductive member CD, and a bit Under the metal wire MT and in contact with the third portion R of the metal wire MT.

4A and 4B, in a fifth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an electrode channel C, Auxiliary wire X, and insulating block I.

Further, in the fifth step, the conductive material in the first portion P of the conductive material layer 120 exposed to the masks MSK1, MSK2, and the transparent conductive member CD, and the metal wires MT is dispersed (for example, a nano silver wire), and further depositing and dispersing the conductive material into the substrate 110 to form the insulating block I, and placing the conductive material layer 120 under the first mask MSK1 and the transparent conductive member CD and Contacting the first mask MSK1 and the second portion Q of the transparent conductive member CD to form the first touch electrode E1, and the second portion of the conductive material layer 120 under the second mask MSK2 and contacting the second mask MSK2 Forming a second touch electrode E2 and an electrode channel C between the second touch electrodes E2, and forming a third portion of the conductive material layer 120 under the metal wire MT and contacting the metal wire MT to form an auxiliary wire X.

In one embodiment, the first layer P outside the masks MSK1, MSK2 and the metal wires MT is exposed in the conductive material layer 120 by providing an embedding liquid containing no conductive additive to disperse the conductive material layer. The conductive material in the first portion P of 120 causes the conductive material to further sink and disperse into the substrate 110 to form an embedded insulating block I in the substrate 110.

For example, refer to Figure 6 in particular. As shown in FIG. 6, the plurality of nano silver wires SNW under the first mask MSK1 are connected to each other to form a first touch electrode E1 having conductivity. In addition, the nano silver wires SNW exposed to the transparent conductive member CD corresponding to the first mask MSK1 and the first mask MSK1 and the metal wires MT are not connected to each other because they are dispersed by the embedding liquid containing no conductive additive. To form an insulating block I that is not electrically conductive. In other words, the touch electrodes E1, E2, the electrode channel C and the auxiliary wire X have electrically conductive substances electrically connected to each other, and the insulating block 1 has conductive substances which are dispersed and electrically isolated from each other.

In one embodiment, the embedding fluid without the conductive additive is achieved, for example, by the aforementioned specific solvent having specific dissolution parameters.

In one embodiment, the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, the insulating block I is also formed around the touch electrodes E1 and E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Next, referring to FIG. 5A and FIG. 5B, in a sixth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent transparent conductive members CD through the contact holes T to electrically connect the two adjacent first touch electrodes E1. In an embodiment, the bridging BG is electrically insulated from the electrode channel C by a mask MSK2 disposed on the electrode channel C.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110, the touch electrodes E1, E2, the electrode channel C, the auxiliary wire X and the insulating block I may be on the substrate 110. There is substantially no gap or roughly between the orthographic projections on the upper surface SF1 Do not overlap. That is, the orthographic projection of the touch electrodes E1, E2, the electrode channel C, the auxiliary wire X and the insulating block I on the upper surface SF1 of the substrate 110 can form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

It is noted that the term "roughly" in this case is used to modify the amount of slight variations and the slight errors caused by the manufacturing process, but such slight variations and slight errors do not change their nature. For example, in the process of forming the insulating block I, an error may occur, so that there is a slight gap between the touch electrodes E1, E2, the metal wires MT, and the orthographic projection of the insulating block I on the upper surface SF1 of the substrate 110. Or slightly overlapping. However, some of the slight errors caused by the manufacturing process are also within the scope of this case.

In an embodiment, the orthographic projection of the insulating block I on the upper surface SF1 of the substrate 110 is between the touch projection electrodes E1, E2 and the orthographic projection of the electrode channel C on the upper surface SF1 of the substrate 110. In an embodiment, the orthographic projection of the insulating block I on the upper surface SF1 of the substrate 110 is located around the orthographic projection of the touch electrodes E1, E2 and the electrode channel C on the upper surface SF1 of the substrate 110.

In the present embodiment, the first touch electrode E1 is disposed, for example, along the x-axis direction in FIG. 5A. The two adjacent first touch electrodes E1 are electrically connected to each other through the bridge BG. The bridging BG spans the electrode channel C. The bridge BG and the electrode channel C are blocked by the mask MSK2, so they are not in electrical contact with each other. In one embodiment, the first touch electrode E1 is located under the mask MSK1, and the bridge BG is located on the mask MSK1.

Further, the second touch electrode E2 is disposed, for example, in the y-axis direction (perpendicular to the x-axis direction) in FIG. 5A. The two adjacent second touch electrodes E2 are electrically connected to each other through the electrode channel C. In an embodiment, the touch electrode E2 and the electrode channel C are both under the mask MSK2.

Furthermore, in this embodiment, the first touch electrode E1 and the second touch electrode E2 Both are roughly diamond shaped. It should be noted that the above embodiments are merely illustrative, and the touch electrodes E1 and E2 of other shapes are also in the scope of the present case, and thus the present invention is not limited thereto.

In an embodiment, the mask MSK1 is disposed, for example, along the x-axis direction in FIG. 5A, and the mask MSK2 is disposed, for example, along the y-axis direction in FIG. 5A. In one embodiment, the masks MSK1, MSK2 are each substantially diamond shaped. It should be noted that the above embodiments are merely illustrative, and other shapes of masks MSK1 and MSK2 are also included in the scope of the present case, and thus the present invention is not limited thereto.

In an embodiment, the masks MSK1, MSK2 are separated from one another. In an embodiment, the masks MSK1, MSK2 do not overlap each other between the orthographic projections on the upper surface SF1 of the substrate 110.

In an embodiment, at least a portion of the mask MSK1 and the mask MSK2 can be selectively removed after the touch electrodes E1 and E2 are formed. Therefore, the present invention is not limited to the above embodiment.

In an embodiment, the auxiliary wire X is located below the metal wire MT. In an embodiment, the auxiliary wires X are electrically connected to the metal wires MT, and are electrically connected to the touch electrodes E1 and E2, respectively. In an embodiment, the auxiliary wire X can assist the metal wire MT to transmit the touch signal.

In an embodiment, the auxiliary wire X, the electrode channel C, the insulating block I, and the touch electrodes E1, E2 have the same conductive material.

It should be noted that, in the above embodiment, the touch electrodes E1 and E2 are formed on the same substrate 110. However, in different embodiments, the touch electrodes E1 and E2 may be separately formed on different substrates, and then The substrates are stacked to form the touch module 100. Therefore, the present case is not limited to the foregoing embodiments.

On the other hand, it should be noted that in a variant embodiment of the present disclosure, the substrate 110 may include an active layer (not shown) and a bottom layer (not shown). The active layer is disposed on the bottom layer, and the touch electrodes E1, E2, the electrode channel C, and the auxiliary wire X are partially embedded in the substrate 110. The insulating layer I is formed in the active layer of the substrate 110.

In one embodiment, the bottom layer can be a rigid or soft material, such as glass, polyethylene terephthalate (PET), and/or polycarbonate (PC). The active layer can be realized, for example, by a suitable polymer material such as polymethyl acrylate, polyvinyl chloride (PVC), and/or polystyrene.

In one embodiment, since the first touch electrode E1, the second touch electrode E2, the electrode channel C, and the insulating block I are formed of the same conductive material layer 120, they have the same conductive material. The insulating block I has a conductive material separated from the conductive material layer 120 by an insulating treatment of the conductive material in the dispersed conductive material layer 120 (i.e., the aforementioned embedding process).

Second embodiment

Another method of manufacturing the touch module 100 will be provided below through the second embodiment. This manufacturing method is substantially the same as the manufacturing method in the first embodiment, except that the transparent conductive member is replaced with the metal conductive member MD, so that the step of providing the metal conductive member MD is integrated with the step of providing the metal wire MT. Therefore, in the following description, the repeated portions will not be described again.

The first step and the second step of the embodiment are substantially the same as the first step and the second step of the first embodiment (refer to FIGS. 1A and 1B), and thus are not described herein.

Referring to FIGS. 7A and 7B, in a third step, a plurality of metal conductive members MD may be provided in the contact holes T and on the conductive material layer 120, and the metal wires MT are provided on the masks MSK1, MSK2 and the conductive material layer 120. on. In an embodiment, the metal conductive member MD can fill the contact hole T.

In an embodiment, the step of providing the metal conductive member MD and the metal wire MT may be integrated into a single process. In various embodiments, the metal conductive member MD is attached to the metal wire MT Available in different processes.

In an embodiment, the metal conductive member MD and the metal wire MT may be implemented by the same metal material. In various embodiments, the metal conductive member MD and the metal wire MT can be implemented with different metal materials.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2, the metal conductive member MD, and the metal wires MT, and a second portion under the masks MSK1, MSK2, and the metal conductive member MD. Part Q, and a third portion R located under the metal wire MT and contacting the metal wire MT.

Next, referring to FIG. 8A and FIG. 8B, in a fourth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an electrode channel C, and an auxiliary. Wire X, and insulating block I.

Further, in the fourth step, the conductive material in the first portion P of the conductive material layer 120 exposed to the mask MSK1, MSK2, the metal conductive member MD, and the metal wire MT is dispersed. a silver wire), and further depositing and dispersing the conductive material into the substrate 110 to form the insulating block I, and placing the conductive material layer 120 under the first mask MSK1 and the metal conductive member MD and contacting The first mask MSK1 and the second portion Q of the metal conductive member MD form the first touch electrode E1, and the second portion of the conductive material layer 120 under the second mask MSK2 and contacting the second mask MSK2 The Q is formed to form the second touch electrode E2 and the electrode channel C between the second touch electrodes E2, and the third portion R of the conductive material layer 120 under the metal wire MT and contacting the metal wire MT forms the auxiliary wire X. .

In the present embodiment, the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the mask MSK1, MSK2, the metal conductive member MD, and the metal wire MT For the details of the quality, refer to the preceding paragraphs, so it will not be described here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Then, referring to FIG. 9A and FIG. 9B, in a fifth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent metal conductive members MD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110, the touch electrodes E1, E2, the auxiliary conductive line X and the insulating block I can be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the orthographic projection of the touch electrodes E1, E2, the auxiliary wires X and the insulating block I on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the details of the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the masks MSK1, MSK2, the bridging BG, and the auxiliary wires X are substantially as described above with reference to the foregoing embodiments. Therefore, I will not go into details here.

Third embodiment

Another method of manufacturing the touch module 100 will be provided below through the third embodiment. This manufacturing method is substantially the same as the manufacturing method in the first embodiment, except for the order in which the transparent conductive member CD and the masks MSK1, MSK2 are formed. Therefore, in the following description, the repeated parts will not be described.

10A-14A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 10B-14B are cross-sectional views of the touch module 100 of FIG. 10A-14A taken along line A-a.

Referring specifically to FIGS. 10A and 10B, in a first step, a layer 120 of conductive material is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of transparent conductive members CD conductive material layer 120 are provided.

In the present embodiment, the details of the substrate 110, the conductive material layer 120 and the transparent conductive member CD can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring to FIG. 11A and FIG. 11B, in a third step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120.

In the present embodiment, the masks MSK1, MSK2 have contact holes T to expose the transparent conductive member CD.

In the present embodiment, the details of the masks MSK1 and MSK2 can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring to FIG. 12A and FIG. 12B, in a fourth step, a plurality of metal wires MT are provided on the conductive material layer 120 and the first mask MSK1 and the second mask MSK2.

At this time, the conductive material layer 120 includes the masks MSK1, MSK2, and is transparent. a first portion P other than the conductive member CD and the metal wire MT, a second portion Q located under the masks MSK1, MSK2, the transparent conductive member CD, and a portion under the metal wire MT and contacting the metal wire MT The third part is R.

Referring to FIG. 13A and FIG. 13B, in a fifth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an electrode channel C, and an auxiliary. Wire X, and insulating block I.

Further, in the fifth step, the conductive material in the first portion P of the conductive material layer 120 exposed to the mask MSK1, MSK2, the transparent conductive member CD, and the metal wire MT (such as Nai) a silver wire), and further depositing and dispersing the conductive material into the substrate 110 to form the insulating block I, and placing the conductive material layer 120 under the first mask MSK1 and the transparent conductive member CD and contacting The first mask MSK1 and the second portion Q of the transparent conductive member CD form the first touch electrode E1, and the second portion of the conductive material layer 120 under the second mask MSK2 and contacting the second mask MSK2 The Q is formed to form the second touch electrode E2 and the electrode channel C between the second touch electrodes E2, and the third portion R of the conductive material layer 120 under the metal wire MT and contacting the metal wire MT forms the auxiliary wire X. .

In the present embodiment, details of the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the masks MSK1, MSK2, the transparent conductive member CD, and the metal wires MT can be referred to the foregoing paragraphs. I will not go into details here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Then, referring to FIG. 14A and FIG. 14B, in a sixth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent transparent conductive members CD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110, the touch electrodes E1, E2, the auxiliary conductive line X and the insulating block I can be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the orthographic projection of the touch electrodes E1, E2, the auxiliary wires X and the insulating block I on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the details of the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the masks MSK1, MSK2, the bridging BG, and the auxiliary wires X are substantially as described above with reference to the foregoing embodiments. Therefore, I will not go into details here.

Fourth embodiment

Another method of manufacturing the touch module 100 will be provided below through the fourth embodiment. This manufacturing method is substantially the same as the manufacturing method in the third embodiment, except for the order in which the metal wires MT and the masks MSK1, MSK2 are formed. Therefore, in the following description, the repeated parts will not be described.

15A-19A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 15B-19B are cross-sectional views of the touch module 100 of FIGS. 15A-19A taken along line A-a.

Referring particularly to Figures 15A and 15B, in a first step, a layer 120 of conductive material is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of transparent conductive members CD are provided on the conductive material layer 120.

In the present embodiment, the details of the substrate 110, the conductive material layer 120 and the transparent conductive member CD can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring specifically to FIGS. 16A and 16B, in a third step, a plurality of metal wires MT are provided on the conductive material layer 120.

Next, referring to FIG. 17A and FIG. 17B, in a fourth step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120 and the metal wires MT.

In one embodiment, a plurality of contact holes T are present on the first mask MSK1, and the contact holes T expose the transparent conductive member CD.

In the present embodiment, the details of the masks MSK1 and MSK2 can be referred to the foregoing paragraphs, and thus will not be described herein.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2, the transparent conductive member CD, and the metal wires MT, and a second portion under the masks MSK1, MSK2 and the transparent conductive member CD. Part Q, and a third portion R located under the metal wire MT and contacting the metal wire MT.

Referring to FIG. 18A and FIG. 18B, in a fifth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, and an electrode. Channel C, auxiliary wire X, and insulating block I.

Further, in the fifth step, the conductive material in the first portion P of the conductive material layer 120 exposed to the mask MSK1, MSK2, the transparent conductive member CD, and the metal wire MT (such as Nai) a silver wire), and further depositing and dispersing the conductive material into the substrate 110 to form the insulating block I, and placing the conductive material layer 120 under the first mask MSK1 and the transparent conductive member CD and contacting The first mask MSK1 and the second portion Q of the transparent conductive member CD form the first touch electrode E1, and the second portion of the conductive material layer 120 under the second mask MSK2 and contacting the second mask MSK2 The Q is formed to form the second touch electrode E2 and the electrode channel C between the second touch electrodes E2, and the third portion R of the conductive material layer 120 under the metal wire MT and contacting the metal wire MT forms the auxiliary wire X. .

In the present embodiment, details of the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the masks MSK1, MSK2, the transparent conductive member CD, and the metal wires MT can be referred to the foregoing paragraphs. I will not go into details here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Then, referring to FIG. 15A and FIG. 15B, in a sixth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent transparent conductive members CD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

The touch module 100 can be realized by the above manufacturing method. On the substrate 110 The insulating block I is formed to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110, the touch electrodes E1, E2, the auxiliary conductive line X and the insulating block I can be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the orthographic projection of the touch electrodes E1, E2, the auxiliary wires X and the insulating block I on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the details of the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the masks MSK1, MSK2, the bridging BG, and the auxiliary wires X are substantially as described above with reference to the foregoing embodiments. Therefore, I will not go into details here.

Fifth embodiment

A method of manufacturing another touch module 100 will be provided below through the fifth embodiment. This manufacturing method is substantially the same as the manufacturing method in the second embodiment, except for the order in which the metal wires MT and the masks MSK1, MSK2 are formed. Therefore, in the following description, the repeated parts will not be described.

20A-23A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 20B-23B are cross-sectional views of the touch module 100 of FIGS. 20A-23A taken along line A-a.

Referring specifically to FIGS. 20A and 20B, in a first step, a layer 120 of conductive material is provided on the upper surface SF1 of the substrate 110. Next, in a second step, providing a plurality of metals The wire MT and the plurality of metal conductive members MD are on the conductive material layer 120.

In an embodiment, the step of providing the metal conductive member MD and the metal wire MT may be integrated into a single process. In various embodiments, the metal conductive member MD and the metal wire MT are provided in different processes.

In the present embodiment, the details of the substrate 110, the conductive material layer 120, the metal conductive member MD and the metal wire MT can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring to FIG. 21A and FIG. 21B, in a third step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120 and the metal conductive member MD.

In one embodiment, a plurality of contact holes T are present on the first mask MSK1, and the contact holes T expose the metal conductive members MD.

In the present embodiment, the details of the masks MSK1 and MSK2 can be referred to the foregoing paragraphs, and thus will not be described herein.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2, the metal conductive member MD, and the metal wires MT, and a second portion under the masks MSK1, MSK2, and the metal conductive member MD. Part Q, and a third portion R located under the metal wire MT and contacting the metal wire MT.

Referring to FIG. 22A and FIG. 22B, in a fourth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, and an electrode channel C. Auxiliary wire X, and insulating block I.

Further, in the fourth step, the first portion of the dispersed conductive material layer 120 exposed to the mask MSK1, MSK2, the metal conductive member MD, and the metal wire MT a conductive material (such as a nano silver wire) in P, and further sinking and dispersing the conductive material into the substrate 110 to form an insulating block I, and placing the conductive material layer 120 in the first mask MSK1 And forming a first touch electrode E1 under the metal conductive member MD and contacting the first mask MSK1 and the second conductive portion of the metal conductive member MD, so that the conductive material layer 120 is located under the second mask MSK2 and contacts the first The second portion Q of the second mask MSK2 forms the second touch electrode E2 and the electrode channel C between the second touch electrodes E2, and the conductive material layer 120 is located under the metal wire MT and contacts the metal wire MT. The third portion R forms the auxiliary wire X.

In the present embodiment, the details of the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the masks MSK1, MSK2, the metal conductive member MD, and the metal wires MT can be referred to the foregoing paragraphs. I will not go into details here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Next, referring to FIG. 23A and FIG. 23B, in a fifth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent metal conductive members MD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110, the touch electrodes E1, E2, the auxiliary conductive line X and the insulating block I can be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the orthographic projection of the touch electrodes E1, E2, the auxiliary wires X and the insulating block I on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the details of the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the masks MSK1, MSK2, the bridging BG, and the auxiliary wires X are substantially as described above with reference to the foregoing embodiments. Therefore, I will not go into details here.

Sixth embodiment

Another method of manufacturing the touch module 100 will be provided below through the sixth embodiment. This manufacturing method is substantially the same as the manufacturing method in the fourth embodiment, except that the sixth embodiment adds the transparent wiring TR. Therefore, in the following description, the repeated parts will not be described.

24A-28A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 24B-28B are cross-sectional views of the touch module 100 of FIGS. 24A-28A taken along line A-a.

Referring specifically to Figures 24A and 24B, in a first step, a layer 120 of conductive material is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of transparent conductive members CD and a plurality of transparent wires TR are provided on the conductive material layer 120.

In an embodiment, the step of providing the transparent conductive member CD and the transparent wire TR may be integrated into a single process. In various embodiments, the transparent conductive member CD and the transparent conductive wire TR are provided in different processes.

In the present embodiment, the details of the substrate 110, the conductive material layer 120 and the transparent conductive member CD can be referred to the foregoing paragraphs, and thus will not be described herein.

In an embodiment, the transparent wire TR can be realized with a transparent conductive material that is the same as the transparent conductive member CD. In various embodiments, the transparent wire TR can be realized with a transparent conductive material different from the transparent conductive member CD.

Next, referring specifically to FIGS. 25A and 25B, in a third step, a plurality of metal wires MT are provided on the transparent wires TR.

Next, referring to FIG. 26A and FIG. 26B, in a fourth step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120 and the metal wires MT.

In the present embodiment, the details of the masks MSK1 and MSK2 can be referred to the foregoing paragraphs, and thus will not be described herein.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2, the transparent conductive member CD, the transparent conductive line TR, and the metal wire MT, and is located in the mask MSK1, MSK2, and the transparent conductive member CD. The lower second portion Q, and the third portion R under the transparent wire TR and contacting the transparent wire TR.

Next, referring to FIG. 27A and FIG. 27B, in a fifth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an electrode channel C, and an auxiliary. Wire X, and insulating block I.

Further, in the fifth step, the conductive material in the conductive material layer 120 is exposed to a first portion P of the mask MSK1, MSK2, the transparent conductive member CD, the transparent conductive line TR, and the metal wire MT. a substance (such as a nano silver wire), and further sinking and dispersing the conductive material into the substrate 110 to form the insulating block I, and placing the conductive material layer 120 in the first The second portion Q under the mask MSK1 and the transparent conductive member CD and contacting the first mask MSK1 and the transparent conductive member CD form the first touch electrode E1, and the conductive material layer 120 is located under the second mask MSK2. And contacting the second portion Q of the second mask MSK2 to form the second touch electrode E2 and the electrode channel C between the second touch electrodes E2, and the conductive material layer 120 is located under the transparent conductive line TR and is transparent. The third portion R of the wire TR forms the auxiliary wire X.

In the present embodiment, the details of the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the mask MSK1, MSK2, the transparent conductive member CD, the transparent conductive line TR, and the metal wire MT can be referred to The foregoing paragraphs are not described here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Next, referring to FIG. 28A and FIG. 28B, in a sixth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent transparent conductive members CD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, the touch electrodes E1 and E2, the auxiliary wires X and the insulating blocks can be formed by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110. I have substantially no gap or substantially no overlap between the orthographic projections on the upper surface SF1 of the substrate 110. That is, the orthographic projection of the touch electrodes E1, E2, the auxiliary wires X and the insulating block I on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the transparent wire TR is located between the auxiliary wire X and the metal wire MT, and is electrically connected to the touch electrodes E1 and E2, the auxiliary wire X, and the metal wire MT. In an embodiment, the transparent wire TR can assist the metal wire MT to transmit the touch signal.

In this embodiment, the details of the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the masks MSK1, MSK2, the bridging BG, and the auxiliary wires X are substantially as described above with reference to the foregoing embodiments. Therefore, I will not go into details here.

Seventh embodiment

Another method for manufacturing the touch module 100 will be provided through the seventh embodiment. This manufacturing method is substantially the same as the manufacturing method in the sixth embodiment, except for the order in which the metal wires MT and the masks MSK1, MSK2 are formed. Therefore, in the following description, the repeated portions will not be described again.

The first step and the second step of the embodiment are substantially the same as the first step and the second step of the sixth embodiment (refer to FIG. 24A and FIG. 24B), and thus are not described herein.

Referring to FIGS. 29A and 29B, in a third step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120.

In one embodiment, a plurality of contact holes T are present on the first mask MSK1, and the contact holes T expose the transparent conductive member CD.

In the present embodiment, the details of the masks MSK1, MSK2 can be referred to the aforementioned paragraphs. Therefore, I will not go into details here.

Next, referring to FIGS. 30A and 30B, in a fourth step, a plurality of metal wires MT are provided on the transparent wires TR and the masks MSK1, MSK2.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2, the transparent conductive member CD, the transparent conductive line TR, and the metal wire MT, and is located in the mask MSK1, MSK2, and the transparent conductive member CD. The lower second portion Q, and the third portion R under the transparent wire TR and contacting the transparent wire TR.

Referring to FIG. 31A and FIG. 31B, in a fifth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an electrode channel C, Auxiliary wire X, and insulating block I.

Further, in the fifth step, the conductive material in the conductive material layer 120 is exposed to a first portion P of the mask MSK1, MSK2, the transparent conductive member CD, the transparent conductive line TR, and the metal wire MT. a substance (such as a nano silver wire), and further sinking and dispersing the conductive material into the substrate 110 to form the insulating block I, and placing the conductive material layer 120 in the first mask MSK1 and the transparent conductive member CD And contacting the first mask MSK1 and the second portion Q of the transparent conductive member CD to form the first touch electrode E1, such that the conductive material layer 120 is located under the second mask MSK2 and contacts the second mask MSK2. The second portion Q forms the second touch electrode E2 and the electrode channel C between the second touch electrodes E2, and places the conductive material layer 120 under the transparent conductive line TR and contacts the third portion R of the transparent conductive line TR. An auxiliary wire X is formed.

In the present embodiment, the details of the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the mask MSK1, MSK2, the transparent conductive member CD, the transparent conductive line TR, and the metal wire MT can be referred to The foregoing paragraphs are not described here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Then, referring to FIG. 32A and FIG. 32B, in a sixth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent transparent conductive members CD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110, the touch electrodes E1, E2, the auxiliary conductive line X and the insulating block I can be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the orthographic projection of the touch electrodes E1, E2, the auxiliary wires X and the insulating block I on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the details of the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the masks MSK1, MSK2, the bridging BG, the auxiliary wires X, the metal wires MT, and the transparent wires TR are The corresponding relationship can be roughly referred to the foregoing embodiment, and therefore will not be described herein.

Eighth embodiment

Another method for manufacturing the touch module 100 will be provided through the eighth embodiment. This manufacturing method is substantially the same as the manufacturing method in the seventh embodiment, and the only difference lies in the manufacturing procedure of the metal wires MT and the insulating conductive material layer 120. Therefore, in the following description, the repeated portions will not be described again.

The first step, the second step, and the third step of the embodiment are substantially the same as the first step, the second step, and the third step of the sixth embodiment (refer to FIG. 24A, FIG. 24B, FIG. 29A, FIG. 29B). Therefore, I will not go into details here.

Referring to FIG. 33A and FIG. 33B, in a fourth step, the first portion P of the conductive material layer 120 is insulated to form the first touch electrode E1, the second touch electrode E2, the electrode channel C, and the auxiliary line X. And the insulating block I.

Further, in the fourth step, the conductive material in the conductive material layer 120 is exposed to a first portion P of the mask MSK1, MSK2, the transparent conductive member CD, the transparent conductive line TR, and the metal wire MT. a substance (such as a nano silver wire), and further sinking and dispersing the conductive material into the substrate 110 to form the insulating block I, and placing the conductive material layer 120 in the first mask MSK1 and the transparent conductive member CD And contacting the first mask MSK1 and the second portion Q of the transparent conductive member CD to form the first touch electrode E1, such that the conductive material layer 120 is located under the second mask MSK2 and contacts the second mask MSK2. The second portion Q forms the second touch electrode E2 and the electrode channel C between the second touch electrodes E2, and places the conductive material layer 120 under the transparent conductive line TR and contacts the third portion R of the transparent conductive line TR. An auxiliary wire X is formed.

In the present embodiment, the details of the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the masks MSK1, MSK2, the transparent conductive member CD, and the transparent conductive line TR can be referred to the foregoing paragraphs. I will not go into details here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Next, referring to FIG. 34A and FIG. 34B, in a sixth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent transparent conductive members CD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

Further, in the sixth step, a plurality of metal wires MT are also provided on the transparent wires TR.

In an embodiment, the steps of providing the bridging BG and the metal wires MT can be integrated into a single process. In various embodiments, the bridging BG and the metal wire MT are provided in different processes.

In an embodiment, the bridging BG and the metal wire MT can be implemented with the same metal material. In various embodiments, the bridging BG and the metal wire MT can be implemented with different metal materials.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110, the touch electrodes E1, E2, the auxiliary conductive line X and the insulating block I can be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the touch electrodes E1, E2, the auxiliary wires X, and the insulating block I are on the upper surface SF1 of the substrate 110. The orthographic projection can form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the details of the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the masks MSK1, MSK2, the bridging BG, the auxiliary wires X, the metal wires MT, and the transparent wires TR are The corresponding relationship can be roughly referred to the foregoing embodiment, and therefore will not be described herein.

Ninth embodiment

A method of manufacturing another touch module 100 will be provided below through the ninth embodiment. This manufacturing method is substantially the same as the manufacturing method in the foregoing embodiment, and therefore, in the following description, the repeated portions will not be described again.

35A-38A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 35B-38B are cross-sectional views of the touch module 100 of FIGS. 35A-38A taken along line A-a.

Referring specifically to FIGS. 35A and 35B, in a first step, a layer 120 of conductive material is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of transparent wires TR are provided on the conductive material layer 120.

In the present embodiment, the details of the substrate 110, the conductive material layer 120 and the transparent conductive line TR can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring to FIG. 36A and FIG. 36B, in a third step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120 and the transparent wires TR.

In one embodiment, a plurality of contact holes T are present on the first mask MSK1, and the contact holes T expose a portion of the conductive material layer 120.

In the present embodiment, the details of the masks MSK1, MSK2 can be referred to the aforementioned paragraphs. Therefore, I will not go into details here.

Next, referring specifically to FIGS. 37A and 37B, in a fourth step, a plurality of metal conductive members MD are provided in the contact holes T of the mask MSK1 and on the conductive material layer 120.

In addition, in the fourth step, a plurality of metal wires MT are also provided on the transparent wires TR and the masks MSK1, MSK2.

In an embodiment, the step of providing the metal conductive member MD and the metal wire MT may be integrated into a single process. In various embodiments, the metal conductive member MD and the metal wire MT are provided in different processes.

In the present embodiment, the details of the metal conductive member MD and the metal wire MT can be referred to the foregoing paragraphs, and thus will not be described herein.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2, the metal conductive member MD, the transparent wires TR, and the metal wires MT, and the transparent conductive materials at the masks MSK1, MSK2 and their corresponding ones. The second portion Q under the CD and the third portion R under the transparent wire TR and contacting the transparent wire TR.

Referring to FIG. 38A and FIG. 38B, in a fifth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an electrode channel C, and an auxiliary. Wire X, and insulating block I.

Further, in the fifth step, the conductive material in the conductive material layer 120 is exposed to a first portion P of the mask MSK1, MSK2, the metal conductive member MD, the transparent conductive line TR, and the metal wire MT. a substance (such as a nano silver wire), and further sinking and dispersing the conductive material into the substrate 110 to form the insulating block I, and the conductive material layer 120 is located in the first mask MSK1 and the metal conductive member MD Underneath and contact the first mask MSK1 and metal conductive parts The second portion Q of the MD forms the first touch electrode E1, and the second portion Q of the conductive material layer 120 under the second mask MSK2 and contacting the second mask MSK2 forms the second touch electrode E2 and The electrode channel C is located between the second touch electrodes E2, and the third portion R of the conductive material layer 120 under the transparent wire TR and contacting the transparent wire TR forms the auxiliary wire X.

In the present embodiment, the details of the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the mask MSK1, MSK2, the metal conductive member MD, the transparent conductive line TR, and the metal wire MT can be referred to The foregoing paragraphs are not described here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Next, referring to FIG. 39A and FIG. 39B, in a sixth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent metal conductive members MD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110, the touch electrodes E1, E2, the auxiliary conductive line X and the insulating block I can be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. also That is, the orthographic projection of the touch electrodes E1, E2, the auxiliary wires X and the insulating block I on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the details of the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the masks MSK1, MSK2, the bridging BG, the auxiliary wires X, the metal wires MT, and the transparent wires TR are For the corresponding relationship, reference may be made to the foregoing embodiments, and therefore no further details are provided herein.

Tenth embodiment

A method of manufacturing another touch module 100 will be provided below through the tenth embodiment. This manufacturing method is substantially the same as the manufacturing method in the ninth embodiment, and differs only in the order in which the masks MSK1, MSK2 and the metal conductive member MD and the metal wires MT are formed, so in the following description, the repeated portions Will not go into details.

The first step and the second step of the embodiment are substantially the same as the first step and the second step of the ninth embodiment (refer to FIG. 35A and FIG. 35B), and thus are not described herein.

Referring to FIGS. 40A and 40B, in a third step, a plurality of metal conductive members MD may be provided on the conductive material layer 120.

Further, in the third step, a plurality of metal wires MT may be provided on the transparent wires TR.

In an embodiment, the step of providing the metal conductive member MD and the metal wire MT may be integrated into a single process. In various embodiments, the metal conductive member MD and the metal wire MT are provided in different processes.

In the present embodiment, the details of the metal conductive member MD and the metal wire MT can be referred to the foregoing paragraphs, and thus will not be described herein.

Next, referring to FIG. 41A and FIG. 41B, in a fourth step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120 and the metal wires MT.

In one embodiment, a plurality of contact holes T are present on the first mask MSK1, and the contact holes T expose the metal conductive members MD.

In the present embodiment, the details of the masks MSK1 and MSK2 can be referred to the foregoing paragraphs, and thus will not be described herein.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2, the metal conductive member MD, the transparent conductive line TR, and the metal wire MT, and is located under the masks MSK1, MSK2 and the metal conductive member MD. The second portion Q is located under the transparent wire TR and contacts the third portion R of the transparent wire TR.

Referring to FIG. 42A and FIG. 42B, in a fifth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an electrode channel C, and an auxiliary. Wire X, and insulating block I.

Further, in the fifth step, the conductive material in the conductive material layer 120 is exposed to a first portion P of the mask MSK1, MSK2, the metal conductive member MD, the transparent conductive line TR, and the metal wire MT. a substance (such as a nano silver wire), and further sinking and dispersing the conductive material into the substrate 110 to form the insulating block I, and the conductive material layer 120 is located in the first mask MSK1 and the metal conductive member MD And contacting the first mask MSK1 and the second portion Q of the metal conductive member MD to form the first touch electrode E1, such that the conductive material layer 120 is under the second mask MSK2 and contacts the second mask MSK2. The second portion Q forms the second touch electrode E2 and the electrode channel C between the second touch electrodes E2, and places the conductive material layer 120 under the transparent conductive line TR and contacts the third portion R of the transparent conductive line TR. An auxiliary wire X is formed.

In the present embodiment, the details of the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the mask MSK1, MSK2, the metal conductive member MD, the transparent conductive line TR, and the metal wire MT can be referred to The foregoing paragraphs are not described here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Next, referring to FIG. 43A and FIG. 43B, in a sixth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent metal conductive members MD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110, the touch electrodes E1, E2, the auxiliary conductive line X and the insulating block I can be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the orthographic projection of the touch electrodes E1, E2, the auxiliary wires X and the insulating block I on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the substrate 110, the insulating block I, the touch electrodes E1, E2, and the electric For the corresponding relationship between the details of the polar channel C, the masks MSK1, the MSK2, the bridging BG, the auxiliary wires X, the metal wires MT, and the transparent wires TR, reference may be made to the foregoing embodiments, and thus will not be described herein.

Eleventh embodiment

Another method of manufacturing the touch module 100 will be provided through the eleventh embodiment. This manufacturing method is substantially the same as the manufacturing method in the foregoing embodiment, and therefore, in the following description, the repeated portions will not be described again.

44A-47A are schematic diagrams showing a method of fabricating a touch module 100 according to an embodiment of the present invention. 44B-47B are cross-sectional views of the touch module 100 of FIGS. 44A-47A taken along line A-a.

Referring specifically to FIGS. 44A and 44B, in a first step, a layer 120 of conductive material is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of transparent conductive members CD are provided on the conductive material layer 120.

In addition, in the second step, a plurality of transparent contact pads PD may also be provided on the conductive material layer 120.

In an embodiment, the step of providing the transparent conductive member CD and the transparent contact pad PD may be integrated into a single process. In various embodiments, the transparent conductive member CD and the transparent contact pad PD are provided in different processes.

In the present embodiment, the details of the conductive material layer 120 and the transparent conductive member CD can be referred to the foregoing paragraphs, and thus will not be described herein.

In an embodiment, the transparent contact pad PD can be implemented with a transparent conductive material that is the same as the transparent conductive member CD. In various embodiments, the transparent contact pad PD can also be implemented with a transparent conductive material that is different from the transparent conductive member CD.

Next, referring to FIG. 45A and FIG. 45B, in a third step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120.

In one embodiment, a plurality of contact holes T are present on the first mask MSK1, and the contact holes T expose the transparent conductive member CD.

In the present embodiment, the details of the masks MSK1 and MSK2 can be referred to the foregoing paragraphs, and thus will not be described herein.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2, the transparent conductive member CD, and the transparent contact pad PD, and the transparent conductive members located in the masks MSK1, MSK2 and their corresponding transparent conductive members. The second portion Q under the CD and the transparent contact pad PD.

Referring to FIG. 46A and FIG. 46B, in a fourth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, and an electrode channel C. And insulating block I.

Further, in the fourth step, the conductive material in the first portion P of the conductive material layer 120 exposed to the mask MSK1, MSK2, the transparent conductive member CD, and the transparent contact pad PD is dispersed (eg Nano silver wire), and the conductive material is further sunk and dispersed into the substrate 110 to form the insulating block I, and the conductive material layer 120 is located in the first mask MSK1, the transparent conductive member CD, and the transparent The second portion Q under the contact pad PD and contacting the first mask MSK1, the transparent conductive member CD, and the transparent contact pad PD forms the first touch electrode E1, and the conductive material layer 120 is located in the second mask MSK2. And contacting the second portion Q of the second mask MSK2 to form the second touch electrode E2 and the electrode channel C between the second touch electrodes E2.

In this embodiment, the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the mask MSK1, MSK2, the transparent conductive member CD, and the transparent contact pad PD For details, please refer to the preceding paragraphs, so it will not be described here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Next, referring to FIG. 47A and FIG. 47B, in a fifth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent transparent conductive members CD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

In addition, in the fifth step, a plurality of metal wires MT are also provided on the transparent contact pads PD and the insulating block 1. In this way, the short circuit of the metal wire MT due to contact with the conductive material in the substrate 110 can be avoided.

In an embodiment, the steps of providing the bridging BG and the metal wires MT can be integrated into a single process. In various embodiments, the bridging BG and the metal wire MT are provided in different processes.

In an embodiment, the bridging BG and the metal wire MT can be implemented with the same metal material. In various embodiments, the bridging BG and the metal wire MT can be implemented with different metal materials.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, the touch electrodes E1, E2 and the insulating block I can be on the substrate 110 by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110. There is substantially no gap or substantially no overlap between the orthographic projections on the upper surface SF1. That is, the orthographic projection of the touch electrodes E1, E2 and the insulating block I on the upper surface SF1 of the substrate 110 can form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the transparent contact pad PD is located between the metal wire MT and the first touch electrode E1, and is electrically connected to the metal wire MT and the first touch electrode E1.

In this embodiment, the corresponding relationship between the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the masks MSK1, MSK2, the bridge BG, and the metal wires MT can be substantially referred to the foregoing implementation. For example, it is not described here.

Twelfth embodiment

Another method of manufacturing the touch module 100 will be provided through the twelfth embodiment. This manufacturing method is substantially the same as the manufacturing method in the eleventh embodiment, and the only difference is the order in which the metal wires MT are formed. Therefore, in the following description, the repeated portions will not be described again.

The first step, the second step, and the third step of the embodiment are substantially the same as the first step, the second step, and the third step of the eleventh embodiment (refer to FIGS. 44A-45A, 44B-45B), I will not go into details here.

Referring to FIGS. 48A and 48B, in a fourth step, a plurality of metal wires MT may be provided on the transparent contact pads PD and the upper conductive material layer 120.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2, the transparent conductive member CD, the transparent contact pad PD, and the metal wires MT, and is located in the masks MSK1, MSK2 and their corresponding transparent portions. The second portion Q under the conductive member CD and the third portion R located under the metal wire MT and contacting the metal wire MT.

Referring to FIG. 49A and FIG. 49B, in a fifth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an electrode channel C, and an auxiliary. Wire X, and insulating block I.

Further, in the fifth step, the conductive material in the conductive material layer 120 is exposed to a first portion P of the mask MSK1, MSK2, the transparent conductive member CD, the transparent contact pad PD, and the metal wire MT. a substance (such as a nano silver wire), and further sinking and dispersing the conductive material into the substrate 110 to form the insulating block I, and placing the conductive material layer 120 in the first mask MSK1 and the transparent conductive member CD And forming a first touch electrode E1 under the transparent contact pad PD and contacting the first mask MSK1, the transparent conductive member CD and the transparent contact pad PD, so that the conductive material layer 120 is located in the second mask MSK2 And contacting the second portion Q of the second mask MSK2 to form the second touch electrode E2 and the electrode channel C between the second touch electrodes E2, and the conductive material layer 120 is located under the metal wire MT and The third portion R contacting the metal wire MT forms the auxiliary wire X.

In this embodiment, the details of the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the mask MSK1, MSK2, the transparent conductive member CD, the transparent contact pad PD and the metal wire MT can be referred to The foregoing paragraphs are not described here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Next, referring to FIG. 50A and FIG. 50B, in a sixth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent ones. The first touch electrode E1. In one embodiment, the bridging BG electrically contacts two adjacent transparent conductive members CD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110, the touch electrodes E1, E2, the auxiliary conductive line X and the insulating block I can be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the orthographic projection of the touch electrodes E1, E2, the auxiliary wires X and the insulating block I on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the details of the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the masks MSK1, MSK2, the bridging BG, the auxiliary wires X, the transparent contact pads PD, and the metal wires MT are The corresponding relationship between the two can be referred to the foregoing embodiment, and therefore will not be described herein.

Thirteenth embodiment

A method of manufacturing another touch module 100 will be provided through the thirteenth embodiment. This manufacturing method is substantially the same as the manufacturing method in the eleventh embodiment, and differs only in the order in which the masks MSK1, MSK2, the transparent conductive member CD, and the transparent contact pad PD are formed, so in the following description, the repeated steps are repeated. Some will not go into details.

51A-54A illustrate a touch module 100 according to an embodiment of the present disclosure. Schematic diagram of the manufacturing method. 51B-54B are cross-sectional views of the touch module 100 of FIGS. 51A-54A taken along line A-a.

Referring specifically to FIGS. 51A and 51B, in a first step, a layer 120 of conductive material is provided on the upper surface SF1 of the substrate 110. Next, in a second step, a plurality of first masks MSK1 and second masks MSK2 are provided on the conductive material layer 120.

In one embodiment, a plurality of contact holes T are present on the first mask MSK1, and the contact holes T expose a portion of the conductive material layer 120.

In the present embodiment, details of the substrate 110, the conductive material layer 120, and the masks MSK1, MSK2 can be referred to the foregoing paragraphs, and thus are not described herein.

Next, referring specifically to FIGS. 52A and 52B, in a third step, a plurality of transparent conductive members CD are provided in the contact holes T of the mask MSK1.

In addition, in the third step, a plurality of transparent contact pads PD may also be provided on the conductive material layer 120.

In an embodiment, the step of providing the transparent conductive member CD and the transparent contact pad PD may be integrated into a single process. In various embodiments, the transparent conductive member CD and the transparent contact pad PD are provided in different processes.

In the present embodiment, the details of the transparent conductive member CD and the transparent contact pad PD can be referred to the foregoing paragraphs, and thus will not be described herein.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2, the transparent conductive member CD, and the transparent contact pad PD, and the transparent conductive members located in the masks MSK1, MSK2 and their corresponding transparent conductive members. The second portion Q under the CD and the transparent contact pad PD.

Next, referring specifically to FIG. 53A and FIG. 53B, in a fourth step, insulation is performed. The first portion P of the conductive material layer 120 forms the first touch electrode E1, the second touch electrode E2, the electrode channel C, and the insulating block 1.

Further, in the fourth step, the conductive material in the first portion P of the conductive material layer 120 exposed to the mask MSK1, MSK2, the transparent conductive member CD, and the transparent contact pad PD is dispersed (eg Nano silver wire), and the conductive material is further sunk and dispersed into the substrate 110 to form the insulating block I, and the conductive material layer 120 is located in the first mask MSK1, the transparent conductive member CD, and the transparent The second portion Q under the contact pad PD and contacting the first mask MSK1, the transparent conductive member CD, and the transparent contact pad PD forms the first touch electrode E1, and the conductive material layer 120 is located in the second mask MSK2. And contacting the second portion Q of the second mask MSK2 to form the second touch electrode E2 and the electrode channel C between the second touch electrodes E2.

In the present embodiment, details of the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the masks MSK1, MSK2, the transparent conductive member CD, and the transparent contact pad PD can be referred to the foregoing paragraphs. Therefore, I will not go into details here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Next, referring to FIG. 54A and FIG. 54B, in a fifth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent transparent conductive members CD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

In addition, in the fifth step, a plurality of metal wires MT are also provided for transparent connection. The contact pad PD is on the insulating block I. In this way, the short circuit of the metal wire MT due to contact with the conductive material in the substrate 110 can be avoided.

In an embodiment, the steps of providing the bridging BG and the metal wires MT can be integrated into a single process. In various embodiments, the bridging BG and the metal wire MT are provided in different processes.

In an embodiment, the bridging BG and the metal wire MT can be implemented with the same metal material. In various embodiments, the bridging BG and the metal wire MT can be implemented with different metal materials.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, the orthographic projection of the touch electrodes E1, E2 and the insulating block I on the upper surface SF1 of the substrate 110 can be performed by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110. There is roughly no gap or substantially no overlap between them. That is, the orthographic projection of the touch electrodes E1, E2 and the insulating block I on the upper surface SF1 of the substrate 110 can form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the corresponding relationship between the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the mask MSK1, the MSK2, the bridging BG, the transparent contact pad PD, and the metal wire MT The foregoing embodiments can be referred to generally, and therefore are not described herein.

Fourteenth embodiment

Another method of manufacturing the touch module 100 will be provided below through the fourteenth embodiment. This manufacturing method is substantially the same as the manufacturing method in the thirteenth embodiment, and the difference is only In the order in which the metal wires MT are formed, in the following description, the repeated portions will not be described again.

The first step, the second step, and the third step of the embodiment are substantially the same as the first step, the second step, and the third step of the thirteenth embodiment (refer to FIGS. 51A-52A, 51B-52B), I will not go into details here.

Referring to FIGS. 55A and 55B, in a fourth step, a plurality of metal wires MT may be provided on the transparent contact pads PD and the upper conductive material layer 120.

At this time, the conductive material layer 120 includes a first portion P exposed to the masks MSK1, MSK2, the transparent conductive member CD, the transparent contact pad PD, and the metal wires MT, and is located in the masks MSK1, MSK2 and their corresponding transparent portions. The second portion Q under the conductive member CD and the third portion R located under the metal wire MT and contacting the metal wire MT.

Referring to FIG. 56A and FIG. 56B, in a fifth step, the first portion P of the conductive material layer 120 is insulated to form a first touch electrode E1, a second touch electrode E2, an electrode channel C, and an auxiliary. Wire X, and insulating block I.

Further, in the fifth step, the conductive material in the conductive material layer 120 is exposed to a first portion P of the mask MSK1, MSK2, the transparent conductive member CD, the transparent contact pad PD, and the metal wire MT. a substance (such as a nano silver wire), and further sinking and dispersing the conductive material into the substrate 110 to form the insulating block I, and placing the conductive material layer 120 in the first mask MSK1 and the transparent conductive member CD And forming a first touch electrode E1 under the transparent contact pad PD and contacting the first mask MSK1, the transparent conductive member CD and the transparent contact pad PD, so that the conductive material layer 120 is located in the second mask MSK2 And contacting the second portion Q of the second mask MSK2 to form the second touch electrode E2 and the electrode channel C between the second touch electrodes E2, and the conductive material layer 120 is located under the metal wire MT and Contacting the third portion R of the metal wire MT to form an auxiliary wire X.

In this embodiment, the details of the conductive material in the first portion P of the dispersed conductive material layer 120 exposed to the mask MSK1, MSK2, the transparent conductive member CD, the transparent contact pad PD and the metal wire MT can be referred to The foregoing paragraphs are not described here.

In one embodiment, at least a portion of the insulating block I is formed between the touch electrodes E1 and E2 to insulate the touch electrodes E1 and E2 from each other. In an embodiment, at least a portion of the insulating block 1 is formed around the touch electrodes E1, E2. In an embodiment, the insulating block I is exposed to the upper surface SF1 of the substrate 110.

Next, referring to FIG. 57A and FIG. 57B, in a sixth step, at least one bridge BG is provided, wherein the bridge BG is disposed across the electrode channel C to electrically connect two adjacent first touch electrodes E1. In one embodiment, the bridging BG electrically contacts two adjacent transparent conductive members CD through the contact holes T to electrically connect the two adjacent first touch electrodes E1.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrode E1 from the touch electrode E2 and the electrode channel C. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In other words, by the method of dispersing the conductive material of the conductive material layer 120 to form the insulating block I in the substrate 110, the touch electrodes E1, E2, the auxiliary conductive line X and the insulating block I can be on the upper surface SF1 of the substrate 110. The upper orthographic projections have substantially no gaps or substantially no overlap. That is, the orthographic projection of the touch electrodes E1, E2, the auxiliary wires X and the insulating block I on the upper surface SF1 of the substrate 110 may form a complete plane. In this way, the optical consistency of the appearance of the touch module 100 can be avoided due to the uneven refractive index.

In this embodiment, the details of the substrate 110, the insulating block I, the touch electrodes E1, E2, the electrode channel C, the masks MSK1, MSK2, the bridging BG, the auxiliary wires X, the transparent contact pads PD, and the metal wires MT are The corresponding relationship between the two can be referred to the foregoing embodiment, and therefore will not be described herein.

FIG. 58 is a flow chart of a method 200 of manufacturing a touch module according to an embodiment of the present invention. The manufacturing method 200 can be used to fabricate the touch module 100 in the first to the fourteenth embodiments, but not limited thereto. In the following paragraphs, the description of the manufacturing method 200 is performed by using the touch module 100 in the first embodiment as an example. However, the present invention is not limited thereto. Manufacturing method 200 includes the following steps.

In step S1, at least two first touch electrodes E1, at least two first touch electrodes E2, and at least one electrode channel C are formed on a substrate 110, and are simultaneously embedded to form an insulating block I in the substrate 110. The insulating block I is located between the first touch electrode E1 and the second touch electrode E2 for electrically connecting the second touch electrode E2.

In the step S2, at least one bridge BG is disposed on the substrate 110, wherein the bridge BG is electrically connected to the first touch electrode E1. The first touch electrode E1 is electrically insulated from the second touch electrode E2.

The touch module 100 can be realized by the above manufacturing method. The insulating block I is formed in the substrate 110 to insulate the touch electrodes E1 and E2 from each other. In this way, the touch electrodes E1 and E2 can be prevented from being patterned by etching, and the optical refractive index of the touch module 100 can be prevented from being uneven, thereby affecting the optical consistency of the appearance of the touch module 100.

In summary, an embodiment of the present disclosure discloses a touch module. The touch module includes a substrate, at least two first touch electrodes, at least two second touch electrodes, an insulating block, and One less electrode channel and at least one bridge. The first touch electrode is formed on the substrate. The second touch electrode is formed on the substrate. The insulating block is embedded in the substrate and located between the first touch electrode and the second touch electrode. The electrode channel is formed on the substrate for electrically connecting the second touch electrode. The bridge is disposed on the substrate for electrically connecting the first touch electrodes. The first touch electrode is electrically insulated from the second touch electrode.

Another embodiment of the present disclosure discloses a method of manufacturing a touch module. The manufacturing method includes: forming at least two first touch electrodes, at least two first touch electrodes, and at least one electrode channel on the substrate, and simultaneously embedding to form an insulating block in the substrate, wherein the insulating block is located at the first touch The electrode and the second touch electrode are connected to each other, and the electrode channel is electrically connected to the second touch electrode; and at least one bridge is disposed on the substrate, wherein the bridge is electrically connected to the first touch electrode. The first touch electrode is electrically insulated from the second touch electrode.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present case. Anyone skilled in the art can make various changes and refinements without departing from the spirit and scope of the present case. The scope defined in the patent application is subject to change.

100‧‧‧ touch module

110‧‧‧Substrate

MT‧‧‧Metal wire

CD‧‧‧Transparent conductive parts

X‧‧‧Auxiliary wire

E1‧‧‧first touch electrode

C‧‧‧electrode channel

BG‧‧ ‧ Bridge

MSK1‧‧‧ mask

MSK2‧‧‧ mask

I‧‧‧Insulated block

Claims (24)

A touch module includes: a substrate; at least two first touch electrodes are formed on the substrate; at least two second touch electrodes are formed on the substrate; and an insulating block is embedded in the substrate Between the first touch electrode and the second touch electrode; at least one electrode channel is formed on the substrate for electrically connecting the second touch electrodes; and at least one bridge spanning the The electrode channel is electrically connected to the first touch electrodes; wherein the first touch electrodes are electrically insulated from the second touch electrodes; wherein the insulating block is positive on a surface of the substrate The projection is between the first touch electrodes and the orthographic projections of the second touch electrodes on the surface of the substrate. The touch module of claim 1, wherein the first touch electrodes, the second touch electrodes, the electrode channels, and the insulating block are formed of the same conductive material layer. The same conductive material, and the insulating block has a separate conductive material by an insulating treatment of a dispersed conductive material. The touch module of claim 1, wherein the insulating block is located around the first touch electrodes and the second touch electrodes. The touch module of claim 1, wherein the first touch electrodes, the second touch electrodes, the electrode channels, and the insulating block are positive on a surface of the substrate There is no overlap between the projections. The touch module of claim 1, further comprising: a plurality of masks disposed on the first touch electrodes, the second touch electrodes, and the electrode channels. The mask of the first touch electrode further includes: a plurality of contact holes; wherein the bridge is electrically connected to the contact holes through the contact holes Some first touch electrodes. The mask of the first touch electrode further includes: a plurality of conductive members respectively located in the contact holes; wherein the bridge passes through The conductive members are electrically connected to the first touch electrodes. The touch module of claim 5, wherein the bridge is electrically insulated from the electrode channel by the mask disposed on the electrode channel. The touch module of claim 1, further comprising: a plurality of wires electrically connected to the first touch electrode and the second touch electrode. The touch module of claim 9, further comprising: a plurality of auxiliary wires respectively located under the wires and electrically connected to the wires. The touch module of claim 1, further comprising: a plurality of contact pads respectively disposed on the portion of the first touch electrode and a portion of the second touch electrode; and a plurality of wires, respectively Electrically connecting the contact pads. The touch module of claim 1, wherein the first touch electrodes are along a The first direction is set, the second touch electrodes are disposed along a second direction, and the first direction is different from the second direction. A method for manufacturing a touch module includes: forming at least two first touch electrodes, at least two first touch electrodes, and at least one electrode channel on a substrate, and simultaneously embedding to form an insulating block in the substrate The insulating block is located between the first touch electrodes and the second touch electrodes, and the electrode channels are electrically connected to the second touch electrodes; and at least one bridge is disposed across the electrodes. a channel, wherein the bridge is electrically connected to the first touch electrodes; wherein the first touch electrodes are electrically insulated from the second touch electrodes; wherein the insulating block is on a surface of the substrate The orthographic projection is between the first touch electrodes and the orthographic projections of the second touch electrodes on the surface of the substrate. The method for manufacturing a touch module according to claim 13 , wherein the first touch electrodes, the first touch electrodes, and the electrode channels are formed on the substrate, and are embedded in the same manner to form the insulation. The step of: arranging a layer of a conductive material on the substrate; providing a plurality of masks on the layer of conductive material; and insulating a portion of the layer of conductive material to form the first a touch electrode, the second touch electrodes, the electrode channel, and the insulating block. The method of manufacturing the touch module of claim 14, further comprising: insulating a portion of the conductive material layer to form the first touch electrodes and the second touch electrodes Providing a plurality of wires before the electrode channel and the insulating block On the layer of conductive material. The method of manufacturing the touch module of claim 15 , wherein a portion of the conductive material layer is insulated to form the first touch electrodes, the second touch electrodes, and the electrodes The step of the channel and the insulating block further includes: dispersing a conductive material in the conductive material layer exposed to the mask and a first portion other than the wires to insulate the layer of the conductive material layer Forming the insulating block, and forming a plurality of second portions of the conductive material layer under the masks to form the first touch electrodes, the second touch electrodes, And the electrode channel. The method of manufacturing a touch module according to claim 16, wherein the step of dispersing the conductive material in the conductive material layer exposed to the mask and a first portion other than the wires comprises Providing an embedding liquid in the conductive material layer exposed on the first portion outside the mask and outside the wires to disperse the conductive material in the first portion of the conductive material layer . The method of manufacturing the touch module of claim 15 , wherein a portion of the conductive material layer is insulated to form the first touch electrodes, the second touch electrodes, and the electrodes The step of the channel and the insulating block further includes: forming a plurality of third portions of the conductive material layer under the plurality of wires to form a plurality of auxiliary wires. The method of manufacturing the touch module of claim 14, further comprising: insulating a portion of the conductive material layer to form the first touch electrode, the second touch electrode, and the Providing a plurality of contact pads before the electrode channel and the insulating block On the layer of conductive material. The method of manufacturing the touch module of claim 19, wherein a portion of the conductive material layer is insulated to form the first touch electrodes, the second touch electrodes, and the electrodes The step of the channel and the insulating block further includes: dispersing a conductive material in the conductive material layer exposed to the mask and a first portion other than the contact pads to insulate the conductive material layer The first part is formed to form the insulating block, and the plurality of second portions of the conductive material layer under the mask respectively form the first touch electrodes and the second touch electrodes And the electrode channel. The method for manufacturing a touch module according to claim 20, further comprising: providing a plurality of wires on the conductive material layer, and electrically connecting the contact pads respectively. The method of manufacturing the touch module of claim 14, wherein the mask has a plurality of contact holes corresponding to the first touch electrodes, and the bridge is electrically connected through the contact holes. The first touch electrodes. The method of manufacturing the touch module of claim 22, further comprising: forming a plurality of conductive members, wherein the conductive members are respectively located in the contact holes, and the bridge is electrically connected to the conductive members Connecting the first touch electrodes. The method of manufacturing the touch module of claim 13, wherein the first touch electrodes, the second touch electrodes, the electrode channels, and the insulating block are on a surface of the substrate There is no overlap between the orthographic projections on the top.