TWI577271B - Heat dissipating module - Google Patents

Description

Thermal module

The invention relates to a heat dissipation module, in particular to a heat dissipation module for heat dissipation.

With the current gradual appeal of electronic devices, all components must be reduced in size, but the heat generated by the shrinking of electronic devices has become a major obstacle to the improvement of performance of electronic devices and systems. Therefore, in order to effectively solve the problem of heat dissipation of components in electronic equipment, the industry has proposed a Vapor chamber and a heat pipe with better heat conduction performance to effectively solve the current heat dissipation problem.

The Vapor chamber is a rectangular casing (or plate body), and a capillary structure is arranged on the inner wall of the casing, and the inside of the casing is filled with working liquid, and one side of the casing ( That is, the evaporation zone is attached to a heating element (such as a central processing unit, a north-south bridge chip, a transistor, an MCU, or other heating element, etc.) to adsorb the heat generated by the heating element, so that the liquid working liquid is in the housing. The evaporation zone is converted into a vapor state by evaporation to conduct heat to the condensation zone of the casing, and the vaporous working liquid is cooled and condensed into a liquid state in the condensation zone, and the liquid working fluid is recirculated through gravity or capillary structure to The vaporization zone continues the vapor-liquid circulation to effectively achieve the effect of uniform temperature dissipation.

The principle and theoretical structure of the heat pipe is the same as that of the temperature equalizing plate. The hollow part of the heat pipe of the circular pipe is filled with metal powder (or woven mesh-like capillary) and sintered. The inner wall of the heat pipe forms an annular capillary structure, after which the heat pipe is evacuated and filled with a working liquid, and finally closed to form a heat pipe structure. When the working liquid is evaporated by the evaporation portion and evaporated to the condensation end, and the working liquid is in a vapor state in the evaporation portion, when the evaporation portion is separated and diffused toward the condensation end, it is gradually cooled and condensed into a liquid state, and then It is returned to the evaporation portion through the capillary structure.

Comparing the method of heat conduction between the temperature equalizing plate and the heat pipe is different, the heat conduction mode of the temperature equalizing plate is two-dimensional, which is the heat conduction mode of the surface, but the heat conduction mode of the heat pipe is a one-dimensional heat conduction mode.

How to use these two heat transfer units more efficiently is the current efforts of the industry.

Therefore, in order to effectively solve the above problems, an object of the present invention is to provide a first housing through which a plurality of second housings are respectively connected via a plurality of heat pipes, so that working fluids in the second housings are respectively connected via respective heat pipes. Flow to the single first housing to dissipate heat.

Another object of the present invention is to provide that the first housing is located above the second housings, and the second housings are respectively connected under the first housing via a heat pipe to work in the second housing. After the fluid is evaporated by heat to the first casing through the heat pipe, the fluid is returned to the second casing from the first casing by gravity and capillary force.

Another object of the present invention is to provide a heat pipe having a closed inner side of a first housing chamber in which the open end abuts the first housing, and a housing inner side in the second housing chamber of the second housing, The heat pipe capillary structure of the heat pipe is connected to the first casing capillary structure and the second casing capillary structure via the open end.

Another object of the present invention is to provide a heat pipe having two open ends extending into abutment of two housing chambers, and two extension portions of the heat pipes extending into the two housing chambers are respectively opened. The through port is such that the heat pipe passage of the heat pipe communicates with the two casing chambers.

Another object of the present invention is to provide a plurality of second housings having a small heat absorption area via a plurality of heat pipes, respectively, by using a first housing having a large heat dissipation area, so that the working fluid in the second housing is passed through the heat pipes. The large heat dissipation area of the first housing dissipates heat.

Another object of the present invention is to provide a heat pipe having a plurality of ribs disposed on the inner surface of the pipe wall, and a groove between the adjacent ribs, wherein the heat pipe capillary structure is formed on the rib and the groove, thereby Increase the area of the heat pipe capillary structure to enhance the capillary channel in the heat pipe channel.

Another object of the present invention is to provide a support cylinder in a heat pipe passage of a heat pipe, and a support column capillary structure layer on the outer surface thereof, and between the first casing and the second casing via the heat pipe and the support cylinder Supporting force and a capillary return path between the first housing chamber and the second housing chamber by the heat pipe capillary structure and the support cylinder capillary structure.

To achieve the above objective, the present invention provides a heat dissipation module including: a first housing defining a first housing chamber, and having a plurality of first openings communicating with the first housing chamber, the first housing chamber Having a first housing capillary structure; a plurality of second housings each defining a second housing chamber and having at least one second opening communicating with the second housing chamber, the second housing The working chamber has a working fluid and a second housing capillary structure, and each of the second housings is connected to the first housing via a heat pipe having a heat pipe passage respectively communicating with the second housing chamber and the first The housing chamber, a heat pipe capillary structure is disposed in the heat pipe passage and respectively capillaryly connects the first housing capillary structure and the second housing capillary structure.

In one implementation, the first housing has a first outer top surface defining a heat dissipation area, and each of the second housings has a second outer bottom surface defining a heat absorption area, and the first housing has a heat dissipation area larger than either The heat absorbing area of the second casing.

In one implementation, the first housing has a first outer top surface defining a heat dissipation area, and each of the second housings has a second outer bottom surface defining a heat absorption area, and the heat dissipation area of the first housing is greater than the first housing The sum of the heat absorbing areas of the second casing.

In one implementation, the first housing is located above the second housing.

In one implementation, the second housings are located below the first housing and are arranged side to side.

In one embodiment, the heat pipe has a pipe wall and the opposite first extension portion forms a first open end and a second extension portion forms a second open end, and the heat pipe passage and the heat pipe capillary structure are disposed in the pipe wall And located between the first open end and the second open end.

In one implementation, the first extension extends from the first opening into the first housing chamber such that the first open end abuts the first housing capillary structure inside a housing in the first housing chamber The second extension The portion extends from the second opening into the second housing chamber such that the second open end abuts the second housing capillary structure inside a housing in the second housing chamber.

In one implementation, the heat pipe capillary structure capillaryly joins the first housing capillary structure and the second housing capillary structure via the first open end and the second open end.

In one embodiment, the first extending portion and the second extending portion are respectively provided with a first through hole and a second through opening through the pipe wall, and the heat pipe passage communicates with the first through the first through hole and the second through hole a housing chamber and the second housing chamber.

In one implementation, the tube wall has an inner surface facing the heat pipe passage, the inner surface is provided with a plurality of ribs spaced apart, and a groove is formed between adjacent ribs, and the ribs and the groove are staggered And extending along a long direction of the heat pipe.

In one embodiment, a support cylinder is disposed in the heat pipe passage along a long direction of the heat pipe, and the support cylinder has opposite ends respectively abutting the first shell on the top side of the inner wall of the first casing chamber a body capillary structure and a second housing capillary structure on the bottom side of the inner wall of the second housing chamber.

In one implementation, the support column system is made of metal and an outer surface of the support cylinder is provided with a support column capillary structure layer.

In one implementation, the support column system is formed by forming a metal sintered powder, and the first casing and the second casing are a uniform temperature plate or a flat plate isothermal heat pipe.

11‧‧‧First housing

111‧‧‧First housing chamber

1111‧‧‧The top side of the inner wall

112‧‧‧ first outer bottom

113‧‧‧First outer top surface

114‧‧‧First opening

115‧‧‧First shell capillary structure

12‧‧‧ second housing

121‧‧‧Second housing chamber

1211‧‧‧ bottom side of the inner wall

122‧‧‧Second outer bottom

123‧‧‧Second outer top surface

124‧‧‧Second opening

125‧‧‧Working fluid

126‧‧‧Second shell capillary structure

13‧‧‧heat pipe

131‧‧‧ wall

132‧‧‧First Extension

1321‧‧‧First open end

1322‧‧‧first through opening

133‧‧‧Second extension

1331‧‧‧ second open end

1332‧‧‧second through opening

134‧‧‧heat pipe passage

135‧‧‧heat pipe capillary structure

136‧‧‧ inner surface

137‧‧‧ ribs

138‧‧‧ trench

14‧‧‧Support column

141‧‧‧Support column capillary structure

21, 21a, 21b‧‧‧ radiator

The following drawings are intended to provide a more complete understanding of the invention, and are in the The specific embodiments of the present invention are described in detail by reference to the specific embodiments herein,

1A is a perspective exploded view of the present invention; FIG. 1B is a perspective exploded view of another perspective of the present invention; FIG. 2 is a schematic perspective view of the present invention; 3A is a schematic partial plan view of the present invention; FIG. 3B is a partial cross-sectional view of the present invention; FIG. 4A is a top plan view showing another alternative embodiment of the heat pipe of the present invention; FIG. 4B is another heat pipe of the present invention. 5A is a top plan view of another alternative embodiment of the heat pipe of the present invention; FIG. 5B is a partial cross-sectional view showing another alternative embodiment of the heat pipe of the present invention; 1 is a schematic cross-sectional view showing a first embodiment of the present invention; and FIG. 6B is a cross-sectional view showing a first embodiment of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

The present invention provides a heat dissipation module comprising: a first housing having a first housing chamber and a first housing capillary structure formed on an inner wall of the first housing chamber; and a plurality of second housings Each of the second housings defines a second housing chamber having a working fluid and a second housing capillary structure, the plurality of second housings being respectively connected to the first via a heat pipe a lower portion of the housing, and each of the second housing chambers communicates with the first housing chamber via the heat pipe, wherein the working fluid in each of the second housing chambers flows into the first housing chamber via the respective connected heat pipes The heat is dissipated and returned to each of the second housing chambers via each heat pipe.

In the following, various embodiments of the present invention will be described in detail, with reference to the drawings,

1A is a perspective exploded view of the present invention; FIG. 1B is a perspective exploded view of another perspective of the present invention; FIG. 2 is a schematic perspective view of the present invention; FIG. 3A is a top plan view of the present invention; The drawings are a partial cross-sectional view of the present invention. As shown in the figure, a heat dissipation module includes a first housing 11 and a plurality of second housings 12, the first housing 11 is located above the second housings 12, and the second housings 12 are in the present embodiment. Representing two second housings 12 located at the The first casing 11 is disposed below and arranged in the left and right. The first casing 11 and the second casings 12 are preferably made of a metal having good thermal conductivity such as gold, silver, copper or an alloy thereof. The first housing 11 and the second housings 12 are embodied as a temperature equalizing plate or a flat type isothermal heat pipe.

The first housing 11 defines a first housing chamber 111 and has a first outer bottom surface 112 and a first outer top surface 113 and a plurality of first openings 114 extending through the first outer bottom surface 112. a first housing capillary 111 is disposed on an inner wall of the first housing chamber 111. The first housing chamber 111 has an inner wall top side 1111 spaced apart from the first opening. 114. The first outer top surface 113 is used as heat dissipation and defines a heat dissipation area. The heat dissipation area is the surface area of the first top surface 113. For example, the first top surface 113 is rectangular in shape and has a first surface area. The length of the face 113 is x. In another implementation, if the first top surface 113 is circular, the surface area is the square of the radius of the first top surface × 3.14.

The second housing 12 defines a second housing chamber 121, and has a second outer bottom surface 122 and a second outer top surface 123. The second outer surface 122 defines at least one second opening 124. The second housing chamber 121 is connected to the first outer bottom surface 112 of the first housing 11 . The second housing chamber 121 has a working fluid 125 and a second portion. A housing capillary structure 126 is disposed on an inner wall of the second housing chamber 121. The second housing chamber 121 has an inner wall bottom side 1211 spaced apart from the second opening 124. The second housings 12 are respectively connected to the first housing 11 via a heat pipe 13 such that the second housing chambers 121 are respectively connected to the single first housing 11 by the respective connected heat pipes 13 A housing chamber 111. The second outer bottom surface 122 is shown as a downwardly convex surface in the figure, and is used as an endothermic heat and defines a heat absorbing area which is the surface area of the second outer bottom surface 122, such as shown in the figure. The second outer bottom surface 122 is rectangular and has a surface area that is the length x width of the second outer bottom surface 122. In another implementation, if the second outer bottom surface 122 is circular, the surface area is the square of the radius of the second outer bottom surface 122 × 3.14.

In a preferred implementation, the heat dissipation area of the first housing 11 is greater than the heat absorption area of any of the second housings 12. In another preferred embodiment, the heat dissipation area of the first housing 11 is greater than the sum of the heat absorption areas of the second housings 12.

The heat pipe 13 has a tube wall 131 and an opposite first extending portion 132 forming a first open end 1321 and a second extending portion 133 forming a second open end 1331. The tube wall 131 is provided with a heat pipe passage 134 and a The heat pipe capillary structure 135 is between the first open end 1321 and the second open end 1331. The first extension 132 of the heat pipe 13 extends from the first opening 114 into the first housing chamber 113 such that the first open end 1321 abuts the top side of the inner wall in the first housing chamber 113 The first housing capillary structure 115 of the 1111 further causes the heat pipe capillary structure 135 at the first open end 1321 to capillaryly join the first housing capillary structure 115 on the inner wall top side 1111. At the same time, the first open end 1321 is closed by the inner wall top side 1111 in the first housing chamber 113.

In addition, the second extending portion 132 of the heat pipe 13 extends from the second opening 124 into the second housing chamber 121, so that the second open end 1331 abuts the bottom wall of the second housing chamber 121. The second housing capillary structure 126 of the side 1211, in turn, causes the heat pipe capillary structure 135 at the second open end 1331 to capillaryly join the second housing capillary structure 126 on the inner wall bottom side 1211. At the same time, the second open end 1331 is closed by the inner wall bottom side 1211 of the second housing chamber 121.

A first through hole 1322 and a second through hole 1332 are respectively formed in the first extending portion 132 and the second extending portion 133 of the heat pipe 13 through the pipe wall 131. The heat pipe passage 134 passes through the first through hole 1322 and the The second through hole 1332 communicates with the first housing chamber 113 and the second housing chamber 121.

In one embodiment, the tube wall 131 of the heat pipe 13 has an inner surface 136 facing the heat pipe passage 134 as shown in Figs. 3A and 3B. The inner surface 136 is a flat inner annular surface, and the heat pipe capillary structure 135 is disposed at The inner surface 136 is on. However, in another alternative embodiment, as shown in FIGS. 4A and 4B, the inner surface 136 is provided with a plurality of ribs 137 spaced apart, and a groove 138 is formed between adjacent ribs 137, the ribs 137 and the The grooves 138 are staggered and extend along a longitudinal direction of the heat pipe 13, and the heat pipe capillary structure 135 is formed on the rib 137 and the groove 138, thereby increasing the area of the heat pipe capillary structure 135.

The first and second housing capillary structures 115, 126 and the heat pipe capillary structure 135 are, for example, sintered metal powder bodies or mesh braids or grooves or bundle fibers, etc., and the structure having a porous structure can provide capillary force to drive the work. Fluid 125 flows.

The term "capillary connection" as used in the present invention means that the first and second housing capillary structures 115, 126 are substantially in contact with or abutted or connected to the heat pipe capillary structure 135 such that the first and second housing capillary structures 115, 126 are The pores communicate with the porosity of the heat pipe capillary structure 135 such that capillary forces can be transferred or extended from the heat pipe capillary structure 135 to the first and second housing capillary structures 115, 126, and the cooled working fluid 125 can be utilized by the capillary force The first housing chamber 113 is recirculated into the second housing chamber 121.

In use, the second outer bottom surface 122 of the second housing 12 respectively contacts a heat source (such as a CPU, an MCU, a graphics processor or other electronic components, etc.), and the heat of each heat source passes through each second. The outer bottom surface 122 is transferred into each of the second housing chambers 121. After the working fluid in the second housing chamber 121 is converted into steam by heat, the second through hole 1332 flows to the heat pipe passage 134, and then passes through the heat pipe passage 134. The first through hole 1322 then flows to the first housing chamber 113 and then dissipates heat through the first outer top surface 113.

The heat-dissipating working fluid 125 is converted into a liquid, and then capillaryly connected through the first casing capillary structure 115 in the first casing chamber 111 and the heat pipe capillary structure 135 of the first open end 1321 of the heat pipe 13 to be branched to each heat pipe. The passage 134 is then returned to the second open end 1331 of the heat pipe 13 by the capillary force of the gravity and heat pipe capillary structure 135, and then is wickedly connected to the second shell capillary structure 126 by the heat pipe capillary structure 135 to the second shell. Inside the body chamber 121. That is, the working fluid 125 of the plurality of second casings 12 is transferred to the first casing 11 through the heat pipe 13 to dissipate heat, and the heat-dissipated working fluid 125 is diverted from the first casing 11 through each heat pipe 13 to the second casing. 12.

Furthermore, as shown in FIGS. 5A and 5B, another alternative embodiment of the present invention is provided. As shown in the drawing, the heat pipe passage 134 of the heat pipe 13 is provided with a support pillar 14 extending along a longitudinal direction of the heat pipe 13, The opposite ends of the support cylinder 14 respectively abut the inner wall top side 1111 of the first housing chamber 111 and the inner wall bottom side 1211 of the second housing chamber 121. The outer surface of the support cylinder 14 can be provided with a support. Column capillary structure layer 141 such as sintered gold It is a powder and or groove formation. The support column capillary structure layer 141 abuts the first housing capillary structure 115 and the second housing chamber 121 of the inner wall top side 1111 of the first housing chamber 111 respectively. A second housing capillary structure 126 of the bottom side 1211. Therefore, the first housing 11 and the second housing 12 are supported by the heat pipe 13 and the support cylinder 14 , and the working fluid 125 cooled in the first housing chamber 111 passes through the The heat pipe capillary structure 135 and the support column capillary structure layer 141 are respectively returned into the respective second housing chambers 121.

The cross section of the support cylinder 14 and the support column capillary structure layer 141 is preferably circular like the cross section of the heat pipe 13 and the cross sections of the support cylinder 14 are concentric, and the cross section diameter of the support cylinder 14 is preferably smaller than that of the heat pipe 13 The cross-sectional diameter is such that there is a flow space between the inner surface 136 of the tube wall of the heat pipe 13 and the outer surface of the support column 14 and the support column capillary structure layer 141 to provide flow of the working fluid 125 within the heat pipe passage 134. The aforementioned support cylinder 14 is made of metal such as copper or the like. However, in another alternative embodiment, the support cylinder 14 is made of sintered metal powder, and the support cylinder 14 itself is a capillary structure, so that the aforementioned support column capillary structure layer 141 can be omitted.

As shown in FIG. 6A and FIG. 6B, a first heat dissipation unit such as a heat sink or a fan is disposed on the first outer top surface 113 of the first casing 11. In a preferred embodiment, a heat sink 21 is provided. 6A)). However, in another embodiment, two heat sinks 21a, 21b are provided on the first outer top surface 113 of the first housing 11, and the two heat sinks 21a, 21b are arranged separately and correspond to two The second housing 12. Since the heat sinks 21, 21a, 21b have a plurality of fins to increase the area in contact with the air, the heat of the first outer top surface 113 is rapidly dissipated through the heat sinks 21, 21a, 21b.

With the above arrangement, the working fluids in the plurality of second housings 12 respectively flow to the single first housing 11 via the respective connected heat pipes, and then the first outer surface 113 of the first housing 11 dissipates heat. Then, the first casing 11 is returned to each of the second casings 12 through each heat pipe 13 by gravity and capillary force, because the double action of gravity and capillary force accelerates the return flow rate of the working fluid 125, and the vapor-liquid circulation As efficiency increases, heat dissipation efficiency increases. On the other hand, since the first outer top surface 113 of the first casing 11 has a large heat dissipation area The heat absorption area of the second outer bottom surface 122 of any of the second casings 12, or the sum of the heat absorption areas of the second casings 12, so that the working fluids 125 of the second casings 12 flow to the first casing After the collection, the heat dissipation efficiency is improved by the heat dissipation of the large heat dissipation area of the first casing 11.

It is to be understood that the above-described methods, shapes, configurations, and devices of the present invention are intended to be included within the scope of the present invention.

11‧‧‧First housing

112‧‧‧ first outer bottom

113‧‧‧First outer top surface

12‧‧‧ second housing

122‧‧‧Second outer bottom

123‧‧‧Second outer top surface

124‧‧‧Second opening

13‧‧‧heat pipe

131‧‧‧ wall

132‧‧‧First Extension

1321‧‧‧First open end

1322‧‧‧first through opening

133‧‧‧Second extension

1331‧‧‧ second open end

1332‧‧‧second through opening

Claims (14)

A heat dissipation module includes: a first housing defining a first housing chamber, and having a plurality of first openings communicating with the first housing chamber, the first housing chamber having a first housing capillary structure The first housing chamber has an inner wall top side spaced apart from the first openings; a plurality of second housings, each second housing defining a second housing chamber and having at least one second opening a hole communicating with the second housing chamber, the second housing chamber having a working fluid and a second housing capillary structure, the second housing chamber having an inner wall bottom side spaced apart from the second opening, each of the openings a second housing is connected to the first housing via a heat pipe. The heat pipe has a heat pipe passage respectively communicating with the second housing chamber and the first housing chamber. A heat pipe capillary structure is disposed in the heat pipe passage and is respectively capillary The first housing capillary structure and the second housing capillary structure are coupled. The heat dissipation module of claim 1, wherein the first housing has a first outer top surface defining a heat dissipation area, and each of the second housings has a second outer bottom surface defining a heat absorption area, the first The heat dissipation area of the housing is greater than the heat absorption area of any of the second housings. The heat dissipation module of claim 1, wherein the first housing has a first outer top surface defining a heat dissipation area, and each of the second housings has a second outer bottom surface defining a heat absorption area, the first The heat dissipation area of the housing is greater than the sum of the heat absorption areas of the second housings. The heat dissipation module of claim 1, wherein the first housing is located above the second housing. The heat dissipation module of claim 4, wherein the second housings are located below the first housing and arranged in a left-right direction. The heat dissipation module of claim 1, wherein the heat pipe has a pipe wall and the opposite first extension portion forms a first open end and a second extension portion forms a second open end, the heat pipe passage and the heat pipe The capillary structure is disposed within the tube wall and between the first open end and the second open end. The heat dissipation module of claim 6, wherein the first extension extends from the first opening into the first housing chamber such that the first open end abuts the inner wall of the first housing chamber a first housing capillary structure, the second extension portion extending from the second opening into the second housing chamber, the second open end abutting the bottom side of the inner wall of the second housing chamber The second housing capillary structure. The heat dissipation module of claim 7, wherein the heat pipe capillary structure is wickedly coupled to the first housing capillary structure and the second housing capillary structure via the first open end and the second open end. The heat dissipation module of claim 8, wherein the first extension portion and the second extension portion are respectively provided with a first through hole and a second through hole through the tube wall, and the heat pipe passage passes through the first through hole and the The second through port communicates with the first housing chamber and the second housing chamber. The heat dissipation module of claim 9, wherein the tube wall has an inner surface facing the heat pipe passage, the inner surface is provided with a plurality of ribs spaced apart, and a groove is formed between adjacent ribs. The ribs and the grooves are staggered and extend along a long direction of the heat pipe. The heat dissipation module according to any one of claims 1 to 9, wherein the heat pipe passage is provided a support cylinder extending along a longitudinal direction of the heat pipe, the support cylinder having opposite first ends respectively abutting the first casing capillary structure on the top side of the inner wall of the first casing chamber and the second casing chamber The second housing capillary structure on the bottom side of the inner wall. The heat dissipation module of claim 11, wherein the support column system is made of metal and an outer surface of the support cylinder is provided with a support column capillary structure layer. The heat dissipation module of claim 11, wherein the support column system is formed of a metal sintered powder. The heat dissipation module of claim 1, wherein the first housing and the second housing are a uniform temperature plate or a flat type isothermal heat pipe.