請參照第一圖至第六圖，本發明電連接器100係用於測試晶片模組200，其包括基座10、安裝於基座的第一滑動板20、第二滑動板30以及套設於基座的外殼40。 Referring to the first to sixth figures, the electrical connector 100 of the present invention is used for testing the wafer module 200, which includes a base 10, a first sliding plate 20 mounted on the base, a second sliding plate 30, and a sleeve. The outer casing 40 of the base.

請參照第二圖至第四圖，基座10呈方形，其保持有複數導電端子11。導電端子11具有保持於基座的基部111、自基部向下延伸的焊接部112及向上延伸的接觸部113。焊接部112向下突出於基座下表面，以焊接至印刷電路板並實現電性連接。 Referring to the second to fourth figures, the susceptor 10 has a square shape and holds a plurality of conductive terminals 11. The conductive terminal 11 has a base portion 111 held by the base, a welded portion 112 extending downward from the base portion, and an upwardly extending contact portion 113. The soldering portion 112 protrudes downward from the lower surface of the base to be soldered to the printed circuit board and electrically connected.

基座10前後兩側設有開口向上的兩對滑槽12，第一滑動板20設有 突出其下表面的兩對滑動臂21，滑槽12在左右方向上的長度大於滑動臂21，而使滑動臂可在滑槽12內左右滑動。 Two pairs of sliding slots 12 are formed on the front and rear sides of the base 10, and the first sliding plate 20 is provided Two pairs of sliding arms 21 projecting from the lower surface thereof, the length of the chute 12 in the left-right direction is larger than that of the sliding arm 21, so that the sliding arm can slide left and right in the chute 12.

第二滑動板30位於第一滑動板20上方，其兩側設有的兩對固定臂31可固定於基座對應位置設有的兩對固定孔13內，固定孔13位於基座10的左右兩側。 The second sliding plate 30 is located above the first sliding plate 20, and the two pairs of fixing arms 31 disposed on both sides of the sliding plate 30 are fixed in the two pairs of fixing holes 13 provided at corresponding positions of the base. The fixing holes 13 are located on the left and right sides of the base 10. On both sides.

基部10靠近角落處還設有四個保持孔14，用於收容彈性件50。外殼40具有套設於彈性件50且向下突伸的柱體41，從而實現外殼的上下運動。外殼40前後兩側分別設有向下突出的一對導引臂42，基座10設有貫穿其前後側面的導引槽15，導引臂42隨外殼40上下運動，保證運動方向不發生偏移。導引臂42內側還設有驅動部43，而第一滑動板20前後兩側均設有一對突出的扇形部22，驅動部43相對扇形部22的弧面221滑動，外殼40被導引槽15限制而只能豎直運動，迫使第一滑動件左右滑動，即帶動滑動臂21在滑槽12內左右滑動，彈簧51則用於提供彈性回復力。 The base portion 10 is further provided with four holding holes 14 near the corners for receiving the elastic member 50. The outer casing 40 has a cylinder 41 that is sleeved on the elastic member 50 and protrudes downward, thereby realizing the up and down movement of the outer casing. The front and rear sides of the outer casing 40 are respectively provided with a pair of guiding arms 42 protruding downward. The base 10 is provided with a guiding groove 15 extending through the front and rear sides thereof, and the guiding arm 42 moves up and down with the outer casing 40 to ensure that the moving direction is not biased. shift. A driving portion 43 is further disposed on the inner side of the guiding arm 42 , and a pair of protruding scallops 22 are disposed on the front and rear sides of the first sliding plate 20 , and the driving portion 43 slides relative to the curved surface 221 of the scallop 22 , and the outer casing 40 is guided by the groove The restriction is only vertical movement, forcing the first sliding member to slide left and right, that is, driving the sliding arm 21 to slide left and right in the sliding slot 12, and the spring 51 is used to provide an elastic restoring force.

導電端子11的基部111保持於基座垂直設有的保持槽16內，保持槽16包括第一子槽161及位於第一子槽161下方的第二子槽162，其中第二子槽162由複數上下延伸的突肋163圍成。導電端子基部111包括均自焊接部112向上延伸且彼此分離的第一臂114、第二臂115及連接兩臂的連接部110，形成U型。第一臂及第二臂被限制在相鄰的突肋163之間，且位於突肋之間的第一臂114與第二臂115因被擠壓而部分接觸，從而形成新的導通線路，有利於信號的傳輸。 The base portion 111 of the conductive terminal 11 is held in the holding groove 16 vertically disposed on the base. The retaining groove 16 includes a first sub-slot 161 and a second sub-slot 162 located below the first sub-slot 161. A plurality of protruding ribs 163 extending up and down are enclosed. The conductive terminal base portion 111 includes a first arm 114, a second arm 115, and a connecting portion 110 that connect the two arms and extend from the soldering portion 112 to form a U-shape. The first arm and the second arm are constrained between the adjacent protruding ribs 163, and the first arm 114 and the second arm 115 located between the protruding ribs are partially contacted by being pressed, thereby forming a new conductive line. Conducive to the transmission of signals.

導電端子11的接觸部113係自第一臂114及第二臂115延伸形成，其包括一對動手臂116及至少一個靜手臂117，在本實施例中，優 選兩個靜手臂117，且四個手臂大致位於正方形的四角處。兩個動手臂及兩個靜手臂之間均形成狹槽118，即第一、二臂114、115鄰近其上末端處被分裂成兩部分，從成形成上述兩動手臂116及兩靜手臂117，第一、二臂116、117彼此相對而無偏移，相對現有產品之偏移結構，更能有效利用材料，且挾持錫球的力量也比較均勻。第一臂114及第二臂115經由第一滑動板20及第二滑動板30，而使動手臂116及靜手臂117的自由末端突出於第二滑動板30的上側。第一滑動板靠近前後兩側設有貫穿其上下表面的端子槽23，每個導電端子11對應四個端子槽23，端子槽用於收容動手臂116及靜手臂117。特別參看第五圖至第七圖，端子槽23由複數前後延伸的第一隔壁231與左右延伸的第二隔壁232相交圍成，第一隔壁231互相平行，第二隔壁232也互相平行，相對於現有的端子槽結構，因彼此平行，模具注塑成形相對容易多了。前述第一隔壁231定義了相反的第一側面234及第二側面235，動手臂116抵靠於第一側面234，靜手臂117則與第二側面235接觸，且與相鄰的第一隔壁231a間隔一定距離，以在第二滑動板30左右運動時預留部分空間。而狹槽恰好收容第二隔壁232。同一接觸部113的兩個動手臂116及靜手臂117分別相對於第二隔壁117對稱。第二滑動板30設有貫穿其上表面的凹口32，其與動手臂116及靜手臂117的頂端(即自由末端)共同圍成容納晶片模組錫球的收容部。 The contact portion 113 of the conductive terminal 11 is formed by extending from the first arm 114 and the second arm 115, and includes a pair of moving arms 116 and at least one static arm 117. In this embodiment, Two static arms 117 are selected, and the four arms are located approximately at the four corners of the square. A slot 118 is formed between the two moving arms and the two static arms, that is, the first and second arms 114, 115 are split into two parts adjacent to the upper end thereof, and the two movable arms 116 and the two static arms 117 are formed. The first and second arms 116 and 117 are opposite to each other without offset, and the material is more effectively utilized than the offset structure of the prior art, and the force of holding the solder ball is relatively uniform. The first arm 114 and the second arm 115 extend the free ends of the movable arm 116 and the static arm 117 to the upper side of the second slide plate 30 via the first slide plate 20 and the second slide plate 30. The first sliding plate is provided with terminal slots 23 extending through the upper and lower surfaces thereof on the front and rear sides. Each of the conductive terminals 11 corresponds to four terminal slots 23 for receiving the movable arm 116 and the static arm 117. Referring particularly to the fifth to seventh embodiments, the terminal groove 23 is formed by intersecting a plurality of first partition walls 231 extending forward and backward with a second partition wall 232 extending left and right. The first partition walls 231 are parallel to each other, and the second partition walls 232 are also parallel to each other. In the existing terminal groove structure, since the parallel to each other, the injection molding of the mold is relatively easy. The first partition wall 231 defines an opposite first side surface 234 and a second side surface 235. The movable arm 116 abuts against the first side surface 234, and the static arm 117 contacts the second side surface 235, and the adjacent first partition wall 231a A certain distance is spaced to reserve a part of the space when the second sliding plate 30 moves left and right. The slot just receives the second partition 232. The two moving arms 116 and the stationary arms 117 of the same contact portion 113 are respectively symmetrical with respect to the second partition wall 117. The second sliding plate 30 is provided with a notch 32 extending through the upper surface thereof, and together with the top end (ie, the free end) of the movable arm 116 and the static arm 117, surrounds the receiving portion of the wafer module solder ball.

動手臂116與第一側面接觸且兩者之間幾乎沒有作用力，當外殼40受壓而驅動第一滑動板20左右滑動時，凸部231向左運動而迫使動手臂116向左彈性擺動，使動手臂116與靜手臂117之間的距離增大，從而實現晶片模組的錫球以零插入力與接觸部113對接。四個手臂116、117的設計相對現有結構來說，可實現更好的電 性接觸，且在測試時，四個手臂也提供了足夠的錫球保持力。 The movable arm 116 is in contact with the first side surface with almost no force therebetween. When the outer casing 40 is pressed to drive the first sliding plate 20 to slide left and right, the convex portion 231 moves to the left to force the moving arm 116 to elastically swing to the left. The distance between the moving arm 116 and the static arm 117 is increased, so that the solder ball of the wafer module is docked with the contact portion 113 with zero insertion force. The design of the four arms 116, 117 allows for better power than existing structures Sexual contact, and during testing, the four arms also provide enough solder ball retention.

第八圖及第九圖揭示了另一種實施方式，其中導電端子的接觸部113a也可以由一個靜手臂117a與兩個動手臂116a(或一個動手臂與兩個靜手臂)組成，隔壁236向左運動而帶動動手臂116a，使動手臂116a與靜手臂的間隔變大，以供晶片模組的錫球對接。 8 and 9 show another embodiment, wherein the contact portion 113a of the conductive terminal can also be composed of a static arm 117a and two moving arms 116a (or one moving arm and two static arms), and the partition 236 is directed The left arm moves the arm 116a to increase the distance between the moving arm 116a and the static arm for docking the solder balls of the wafer module.

綜上所述，本發明符合發明專利要件，依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，本發明之範圍並不以前述實施例為限，舉凡熟習本案技藝之人士依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the foregoing embodiments, and equivalent modifications or variations made by those skilled in the art in accordance with the spirit of the present invention should be It is covered by the following patent application.