TWI565380B - Display device and fabricating method thereof - Google Patents

Description

Display device and method of manufacturing same

The present invention relates to a display device and a method of fabricating the same, and more particularly to a flexible display device and a method of fabricating the same.

As various display technologies continue to flourish, after continuous research and development, flat displays using hard carrier boards (such as glass substrates), such as liquid crystal displays (LCDs), organic light-emitting diode displays (organic) Products such as light emitting diode display (OLED display), plasma display panel (PDP), and electrophoretic display (EPD) have been gradually commercialized and applied to display devices of various sizes and various sizes. Since flexible displays made of flexible substrates have the characteristics of being thin, flexible, impact resistant, high in safety, and convenient to carry, in recent years, flexible displays have been studied, and how to produce good process yields. The flexible display is an important subject that must be overcome.

The invention provides a display device and a manufacturing method thereof, which can maintain a good process yield during the manufacturing process.

The display device of the present invention includes a substrate, a plurality of pixel units, a plurality of signal lines, a barrier layer, and a cover. The substrate has a display area and a peripheral area disposed on at least one side of the display area, and the peripheral area has an external signal bonding area. The pixel unit array is arranged on the display area of the substrate. The signal line is located between the external signal junction area and the display area, wherein the signal line is electrically connected to the pixel unit. The barrier layer is located at least above the portion of the signal line. The cover plate is disposed opposite to the substrate, wherein the cover plate covers the pixel unit and exposes the external signal bonding region.

The method of manufacturing the display device of the present invention includes the following steps. First, an upper plate is provided, wherein the upper plate includes a first rigid substrate and a first substrate. The first substrate is disposed on the first rigid substrate and has a pre-cut line. Next, a lower plate is provided, wherein the lower plate includes a second rigid substrate, a second substrate, a plurality of pixel units, a plurality of signal lines, and a barrier layer. The second substrate is disposed on the second rigid substrate and has a display area and a peripheral area on which at least one side of the display area is disposed, wherein the peripheral area has an external signal bonding area. The pixel unit array is arranged on the display area of the second substrate. The signal line is located between the external signal bonding area and the display area, and is electrically connected to the pixel unit. The barrier layer is located at least above the portion of the signal line. Next, a bonding process is performed to group the upper and lower plate bonding pairs, wherein the pre-cut lines and the barrier layer at least partially overlap in a vertical projection direction. Thereafter, a first stripping process is performed to separate the first hard substrate from the first substrate.

Based on the above, in the display device of the present invention, the transmission is above the signal line. The barrier layer is provided so that during the process of manufacturing the display device, the signal line can be prevented from being damaged by the laser light used in the stripping process or the cutting process, thereby improving the process yield and display quality of the display device.

The above described features and advantages of the invention will be apparent from the following description.

10, 20‧‧‧ display device

100, 202, 302‧‧‧ substrates

102‧‧‧ display area

104‧‧‧The surrounding area

106‧‧‧External signal junction area

108‧‧‧Drop area

110‧‧‧ scan line

120‧‧‧Information line

130‧‧‧ pixel unit

132‧‧‧ drive components

133‧‧‧Insulation

134‧‧‧First electrode layer

135‧‧‧Isolation

136‧‧‧Lighting layer

137‧‧‧Encapsulation layer

138‧‧‧Second electrode layer

139‧‧‧Adhesive layer

140‧‧‧Signal line

150, 150’‧‧‧ barrier

160‧‧‧ joint pad

170‧‧‧ cover

200, 300‧‧‧ board

201, 221, 301, 321‧‧‧ hard substrates

202A‧‧‧ Covering Department

202B‧‧‧ Sacrifice

210, 370‧‧‧ cutting procedure

220, 320‧‧‧ lower board

230, 330‧‧‧ display elements

240, 340‧‧‧ Peripheral membrane structure

250, 350‧‧‧ joint procedure

260, 270, 360, 380‧ ‧ stripping procedures

A‧‧‧ area

CHR‧‧‧ passage area

CL, CL’‧‧‧ pre-cut line

CO‧‧‧ incision

G‧‧‧ gate layer

GI‧‧‧ brake insulation

H1, H2, H3‧‧‧ openings

IL‧‧‧ dielectric layer

ILD‧‧‧ interlayer dielectric layer

M1, M2‧‧‧ conductor layer

PL‧‧‧flat layer

PS‧‧‧ Polycrystalline layer

S‧‧‧ side

SD‧‧‧ source bungee layer

SDR‧‧‧ source bungee area

T‧‧‧ active components

1 is a schematic view of a display device according to an embodiment of the present invention.

Figure 2 is an enlarged schematic view of a region A of Figure 1.

Fig. 3 is a schematic cross-sectional view taken along line I-I' and line II-II' of Fig. 2;

4A to 4G are schematic cross-sectional views showing a manufacturing flow of a display device according to an embodiment of the present invention.

5A to 5G are schematic cross-sectional views showing a manufacturing process of a display device according to another embodiment of the present invention.

Fig. 6 is a schematic view of a display device according to another embodiment of the present invention.

Figure 7 is an enlarged schematic view of a region A of Figure 6.

Fig. 8 is a schematic cross-sectional view taken along line I-I' and line II-II' of Fig. 7.

1 is a schematic view of a display device according to an embodiment of the present invention. Figure 2 is an enlarged schematic view of a region A of Figure 1. Figure 3 is a cross-sectional view taken along line I-I' and line II-II' of Figure 2 A schematic view of the line.

Referring to FIG. 1 , the display device 10 includes a substrate 100 , a plurality of scan lines 110 , a plurality of data lines 120 , a plurality of pixel units 130 , a plurality of signal lines 140 , a barrier layer 150 , a plurality of bonding pads 160 , and a cover plate . 170. In the present embodiment, the display device 10 is an organic light emitting diode display device.

The substrate 100 has a display area 102 and a peripheral area 104 disposed on at least one side of the display area 102. The peripheral area 104 has an external signal bonding area 106 therein and has a trace between the external signal bonding area 106 and the display area 102. Area 108. In the present embodiment, the substrate 100 is a flexible substrate, and the material of the flexible substrate is, for example, Polyimide (PI), Polycarbonate (PC), Polyethylene terephthalate (PET). , but not limited to, polyethersulfone (PES), Cyclic Olefin Copolymer (COC), Cyclo Olefin Polymer (COP), or a combination thereof.

The scan line 110 and the data line 120 are disposed on the display area 102 of the substrate 100. In the present embodiment, the scan line 110 extends in the X direction, and the data line 120 extends in the Y direction to define the area where the pixel unit 130 is located. The material of the scanning line 110 and the data line 120 is, for example, metal.

The array of pixel units 130 is arranged on the display area 102 of the substrate 100. In detail, referring to FIG. 1 to FIG. 3 simultaneously, the pixel unit 130 includes a driving element 132 , an insulating layer 133 , a first electrode layer 134 , an isolation layer 135 , a light emitting layer 136 , a second electrode layer 138 , and an encapsulation layer 137 . It is worth noting that, for the convenience of composition, Figure 2 is omitted. A portion of the film layer is illustrated, such as the isolation layer 135, the second electrode layer 138, the encapsulation layer 139, the cap plate 170, and the like.

In this embodiment, the driving component 132 is electrically connected to the corresponding scan line 110 and the data line 120, and the driving component 132 includes an active component T and a capacitor (not shown). In detail, the active device T includes a polysilicon layer PS, a gate insulating layer GI, a gate layer G, an interlayer dielectric layer ILD, and a source drain layer SD. As shown in FIG. 3, the polysilicon layer PS is disposed on the substrate 100 and includes a channel region CHR and a source drain region SDR; the gate insulating layer GI covers the polysilicon layer PS; and the gate layer G is located above the channel region CHR of the polysilicon layer PS. On the gate insulating layer GI; the interlayer dielectric layer ILD covers the gate layer G, and the interlayer dielectric layer ILD and the gate insulating layer GI have an opening H1 that together exposes the source drain region SDR of the partial polysilicon layer PS; the source 汲The pole layer SD is located on the interlayer dielectric layer ILD and is connected to the source drain region SDR via the opening H1.

It should be noted that although the active device T of the present embodiment is a top gate type low temperature poly-silicon thin film transistor (LTPS TFT), the present invention does not limit the form of the active device. In other embodiments, the active device may also be a bottom gate type transistor, an amorphous silicon TFT (a-Si TFT), a microcrystalline silicon transistor (micro-Si TFT) or a metal. Oxide transistor, etc.

The insulating layer 133 is located on the substrate 100 and covers the active device T, and the insulating layer 133 has an opening H2 exposing a portion of the source drain layer SD. Specifically, in the present embodiment, the insulating layer 133 is composed of the dielectric layer IL and the flat layer PL. The first electrode layer 134 in which the flat layer PL is provided can be formed on a flat surface. The first electrode layer 134 is located on the insulating layer 133 and is connected to the source drain layer SD via the opening H2. The isolation layer 135 is on the first electrode layer 134, and the isolation layer 135 has an opening H3 to expose a portion of the first electrode layer 134. The light emitting layer 136 is located in the opening H3 and is in contact with the first electrode layer 134 exposed by the opening H3. The second electrode layer 138 is located on the first electrode layer 134, and the second electrode layer 138 covers the light emitting layer 136 and the isolation layer 135. The encapsulation layer 137 is on the second electrode layer 138. In the present embodiment, the light-emitting layer 136 is, for example, a white light-emitting material layer, that is, the display device 10 is, for example, a white light organic light-emitting diode device.

The signal line 140 is located in the routing area 108, wherein the signal line 140 is electrically connected to the pixel unit 130. Specifically, referring to FIG. 1 and FIG. 2 , the signal line 140 is electrically connected to the pixel unit 130 by being connected to the scan line 110 and the data line 120 . However, the invention is not limited thereto. In other embodiments, the signal line can also be electrically connected to the pixel unit by being connected to the gate driving circuit and the common line.

In addition, referring to FIG. 2, the signal line 140 in the area A is connected to each other through a continuous conductive pattern with the scan line 110 (ie, the signal line 140 and the scan line 110 belong to the same film layer). However, the invention is not limited thereto. In other embodiments, the signal line can be connected to the scan line, the data line, the gate drive circuit, and the common line through any connection.

The barrier layer 150 is located above the signal line 140. In detail, as shown in FIG. 3, the barrier layer 150 in the region A is located on the interlayer dielectric layer ILD and the dielectric layer IL above the signal line 140. However, the invention is not limited thereto. In other embodiments, The barrier layer 150 may also be located between the interlayer dielectric layer ILD and the dielectric layer IL or between the signal line 140 and the interlayer dielectric layer ILD. That is to say, the position of the barrier layer of the present invention between the film layers is not limited as long as the barrier layer is located above the signal line in the Z direction, which falls within the scope of the present invention.

In another aspect, the barrier layer 150 is disposed adjacent one of the sides S of the cover plate 170, and the side S of the cover plate 170 at least partially overlaps the barrier layer 150. That is, in the present embodiment, the cover plate 170 covers a portion of the barrier layer 150 to expose another portion of the barrier layer 150.

In the present embodiment, the barrier layer 150 is capable of absorbing laser light having a wavelength of 380 nm or less. From another point of view, the barrier layer 150 can block the aforementioned laser light having an energy of 100 mJ/cm ² or more. In an embodiment, the wavelength of the laser light is, for example, 248 nm, 308 nm, 351 nm or 355 nm. In addition, the barrier layer 150 includes tantalum, an acrylic resin, a polyimide resin, a metal, a metal oxide, a metal stack layer, or a stacked layer of a metal and a metal oxide. For example, in a case where the material of the barrier layer 150 is 矽, the barrier layer 150 can block a laser light having a wavelength of 308 nm or more having a wavelength of 100 mJ/cm ² or more and a thickness of 400 Å or more; and the material of the barrier layer 150 is a poly layer. In the case of the imide resin, the barrier layer 150 can block a laser light having a wavelength of 308 nm or more having a wavelength of 100 mJ/cm ² or more and a thickness of 1 μm or more; and in the case where the material of the barrier layer 150 is an acrylic resin, the barrier layer 150 The thickness of the laser light having a wavelength of 308 nm or more capable of blocking energy of 100 mJ/cm ² or more is 1 μm or more; and in the case where the barrier layer 150 is a stacked layer of indium tin oxide and silver, the barrier layer 150 can block energy of 100 mJ/ The indium tin oxide of laser light having a wavelength of 308 nm or more of cm ² or more and a thickness of silver of 150 Å or more.

In addition, although FIG. 1 illustrates that the barrier layer 150 is only located above a portion of the signal line 140, the invention is not limited thereto. In other embodiments, the barrier layer 150 may also cover the entire signal line. That is to say, the barrier layer of the present invention is only required to be located at least partially above the signal line.

In addition, although FIG. 1 illustrates that the barrier layer 150 is a long strip pattern and intersects the signal line 140, the present invention is not limited thereto. In other embodiments, the barrier layer 150 may also be a plurality of island patterns, or any geometric pattern, as long as the barrier layer 150 can cover at least part of the signal lines 140.

A plurality of bonding pads 160 are disposed in the external signal bonding region 106 , wherein the signal wires 140 are electrically connected to the bonding pads 160 and the pixel unit 130 . Specifically, the external signal bonding region 106 is, for example, an IC bonding area, a COF bonding area, or a FPC bonding area. That is, in the present embodiment, the pixel unit 130 is connected to the bonding pad 160 via the signal line 140, thereby being electrically connected to an external circuit (for example, an integrated circuit or a flexible printed circuit) through the bonding pad 160, thereby receiving Drive signal from an external circuit.

Specifically, referring to FIG. 3 , the bonding pad 160 in the region A is electrically connected to the signal line 140 through the conductor layer M1 and the conductor layer M2 , wherein the conductor layer M1 and the signal line 140 are a continuous conductive pattern (ie, The conductor layer M1 and the signal line 140 belong to the same film layer, and the conductor layer M2 and the source drain layer SD belong to the same film layer. However, the invention is not limited thereto. In other embodiments, the bonding pad 160 is transparent The signal line 140 is electrically connected to any connection mode.

The cover plate 170 is disposed opposite to the substrate 100. In the present embodiment, the cover plate 170 is a flexible substrate, wherein the material of the flexible substrate is, for example, polyamine, polycarbonate, polyethylene terephthalate, polyether oxime, cycloolefin copolymer, and cyclic olefin polymerization. Or a combination thereof, but not limited to this. In addition, the cover plate 170 is, for example, a color filter substrate. That is to say, the cover plate 170 is further provided with a color filter (not shown). In the display device 10 of the present invention, by simultaneously providing the substrate 100 and the cover plate 170 provided with a color filter (not shown), the stress of the display device 10 is uniform even when the display device 10 is flexed. However, the pixel unit 130 is prevented from being damaged, and the problem of ambient light reflection can be effectively improved.

In addition, referring to FIG. 1 to FIG. 3 simultaneously, the cover plate 170 covers the pixel unit 130 in the display area 102 and exposes the bonding pad 160 in the external signal bonding area 106, whereby the cover plate 170 can protect the pixel unit 130. It also enables the exposed bond pads 160 to be connected to external circuitry.

In addition, in the present embodiment, the display device 10 may further include an adhesive layer 139 between the cap plate 170 and the pixel unit 130. In detail, as shown in FIG. 3, the cover plate 170 is formed on the encapsulation layer 137 by adhesion through the adhesive layer 139 to be bonded to the substrate 100. However, the present invention is not limited thereto. In other embodiments, a sealant (not shown) may be applied to the periphery of the cover plate 170 and the substrate 100 such that the cover plate 170 and the substrate 100 are joined together.

It should be noted that, in the embodiment, by providing the barrier layer 150, the signal line 140 can be prevented from being damaged during the process of manufacturing the display device 10, and further The display device 10 is made to have good manufacturing yield and display quality. Hereinafter, the aforementioned effects will be explained with reference to FIGS. 4A to 4G and FIGS. 5A to 5G.

4A to 4G are schematic cross-sectional views showing a manufacturing flow of a display device according to an embodiment of the present invention.

First, referring to FIG. 4A, an upper board 200 is provided. The upper board 200 includes a rigid substrate 201 and a substrate 202 disposed on the rigid substrate 201. The substrate 202 has a pre-cut line CL for subsequent cutting process. The hard substrate 201 is, for example, a glass substrate, and the substrate 202 is a flexible substrate. The material of the flexible substrate is, for example, polyamine, polycarbonate, polyethylene terephthalate, polyether oxime, cycloolefin copolymer, ring. Olefin polymer or a combination thereof, but not limited thereto.

Next, an adhesive layer 139 is further formed on the substrate 202 to perform a bonding process in a subsequent step.

Next, referring to FIG. 4B, a cutting process 210 is performed on the substrate 202 according to the pre-cut line CL to form a local port CO in the substrate 202. In detail, the slit CO exposes the hard substrate 201 and causes the substrate 202 to be divided into a cover portion 202A and a sacrificial portion 202B, wherein the cover portion 202A of the substrate 202 is the aforementioned cover plate 170 (shown in FIG. 1). In the present embodiment, the cutting program 210 performs cutting using, for example, a cutting device such as a cutter wheel or laser light.

Next, referring to FIG. 4C, a lower plate 220 is provided, wherein the lower plate 220 includes a rigid substrate 221, a substrate 100, a display element 230, a peripheral film layer structure 240, and a barrier layer 150. The hard substrate 221 is, for example, a glass substrate. The display element 230 is located on the display area 102 of the substrate 100, and the display element 230 includes the aforementioned scan line 110, The data line 120 and the pixel unit 130 (shown in Figure 1). The peripheral film structure 240 is located on the peripheral region 104 of the substrate 100, and the peripheral film structure 240 includes the foregoing gate insulating layer GI, the signal line 140, the conductor layer M1, the interlayer dielectric layer ILD, the dielectric layer IL, and the conductor layer M2. And the bonding pad 160, wherein the detailed arrangement relationship of the film layers is referred to the cross section of the line II-II' of FIG. The barrier layer 150 is located on the peripheral film layer structure 240.

Thereafter, a bonding process 250 is performed to bond the upper plate 200 and the lower plate 220 together to form a structure as shown in FIG. 4D. In detail, the slit CO overlaps at least a portion of the barrier layer 150 in the vertical projection direction. Further, on the vertical projection surface, the barrier layer 150 completely covers the slit CO. That is, the barrier layer 150 of the present invention not only partially overlaps the side S of the cover plate 170, but at least partially overlaps the slit CO. In the present embodiment, the bonding process 250 is performed by bonding the cover plate 170 and the display element 230 using the adhesive layer 139.

Next, referring to FIG. 4E, a peeling process 260 is performed to separate the hard substrate 201 from the cap plate 170 to form a structure as shown in FIG. 4F. In the present embodiment, the peeling process 260 is performed by, for example, a laser lift-off method in which the energy of the laser light separating the hard substrate 201 from the cap plate 170 is, for example, 100 mJ/cm ² or more, and the wavelength is For example, it is 308 nm. It should be noted that in the stripping process 260, when the laser light is scanned to the slit CO, the laser light cannot be absorbed and directly irradiates onto the substrate 100. However, even if the signal line 140 corresponding to the slit CO is not The cause was destroyed as follows. As described above, the barrier layer 150 can block laser light having an energy of 100 mJ/cm ² or more and a wavelength of 380 nm or less, and therefore, in the stripping process 260, is disposed above the signal line 140 and at least partially with the slit CO in the vertical projection direction. The overlapping barrier layer 150 is capable of absorbing laser light that is incident on the substrate 100 while avoiding damage to the signal line 140 corresponding to the slit CO. In this way, the cover plate 170 exposing the bonding pad 160 can be smoothly separated from the hard substrate 201 by the peeling process 260 without breaking the signal line 140 connecting the pixel unit 130 and the bonding pad 160.

Next, referring to FIG. 4G, a stripping process 270 is performed to separate the hard substrate 221 from the substrate 100, and the aforementioned display device 10 (shown in FIGS. 1 to 3) is completed. In the present embodiment, the peeling process 270 is performed by, for example, a laser lift-off method in which the energy of the laser light that separates the hard substrate 221 from the substrate 100 is, for example, 100 mJ/cm ² or more, and the wavelength is, for example, 308 nm.

5A to 5G are schematic cross-sectional views showing a manufacturing process of a display device according to another embodiment of the present invention.

First, referring to FIG. 5A, an upper plate 300 is provided. The upper plate 300 includes a rigid substrate 301 and a substrate 302 disposed on the rigid substrate 301, wherein the substrate 302 has a pre-cut line CL'. Next, an adhesive layer 139 is further formed on the substrate 302. The upper plate 300, the rigid substrate 301, the substrate 302, and the pre-cut line CL' are the same as those in the embodiment of Figs. 4A to 4G, and will not be repeated here.

Thereafter, a lower plate 320 is provided, wherein the lower plate 320 includes a rigid substrate 321, a substrate 100, a display element 330, a peripheral film layer structure 340, and a barrier layer 150. Similarly, the lower plate 320, the rigid substrate 321, the display element 330, and the peripheral film layer structure 340 are the same as those in the embodiments of FIGS. 4A to 4G, and will not be repeated herein.

After the upper plate 300 and the lower plate 320 are provided, a bonding process 350 is performed to join the upper plate 300 and the lower plate 320 together to form a structure as shown in FIG. 5B. In detail, the pre-cut line CL' and the barrier layer 150 at least partially overlap in the vertical projection direction. That is, on the vertical projection surface, the barrier layer 150 completely covers the pre-cut line CL'. Similarly, the bonding procedure 350 is the same as that of the embodiment of FIGS. 4A to 4G and will not be repeated here.

Next, referring to FIG. 5C, a peeling process 360 is performed to separate the hard substrate 301 from the substrate 302 to form a structure as shown in FIG. 5D. Similarly, the stripping program 360 is the same as the counterpart in the embodiment of FIGS. 4A to 4G and will not be repeated here.

Next, referring to FIG. 5E, a cutting process 370 is performed on the substrate 302 via the pre-cut line CL' to form a cap plate 170 (as shown in FIG. 5F). In detail, the cutting program 370 performs cutting using, for example, laser light, wherein the energy of the laser light is, for example, 100 mJ/cm ² or more, and the wavelength is, for example, 355 nm. It should be noted that, as described above, since the barrier layer 150 can block laser light having a wavelength of 100 mJ/cm ² or more and a wavelength of 380 nm or less, in the cutting program 370, it is disposed above the signal line 140 and on the vertical projection surface. The barrier layer 150 that completely overlaps the pre-cut line CL' is capable of absorbing the laser light irradiated to the substrate 100 while avoiding damage to the signal line 140 corresponding to the pre-cut line CL'. In this way, the cover plate 170 exposing the bonding pad 160 can be smoothly formed through the cutting program 370 without breaking the signal line 140 connecting the pixel unit 130 and the bonding pad 160.

Thereafter, referring to FIG. 5G, a stripping process 380 is performed to make the hard base The board 321 is separated from the substrate 100 to complete the aforementioned display device 10 (as shown in FIGS. 1 to 3). Similarly, the stripping procedure 380 is the same as that of the embodiment of FIGS. 4A to 4G, and will not be repeated here.

In addition, after the production of the display device 10 is completed, a touch panel (not shown) or other film layers and components may be attached to the display device 10 as needed to complete the device having the desired function.

Further, in the above-described embodiment, the display device 10 has been described by taking an organic light emitting diode display device as an example, but the present invention is not limited thereto. In other embodiments, the display device of the present invention may also be a liquid crystal display device.

In addition, in FIGS. 1 to 3, the barrier layer 150 in the display device 10 is disposed adjacent to one side S of the cover plate 170, and overlaps the side S on the vertical projection surface, but the invention is not limited thereto. this. In other embodiments, the sides of the cover in the display device can also be placed in line with the barrier layer. Hereinafter, a detailed description will be given with reference to FIGS. 6 to 8.

Fig. 6 is a schematic view of a display device according to another embodiment of the present invention. Figure 7 is an enlarged schematic view of a region A of Figure 6. Fig. 8 is a schematic cross-sectional view taken along line I-I' and line II-II' of Fig. 7. In addition, the embodiments of FIGS. 6 to 8 are similar to the above-described embodiments of FIGS. 1 to 3, and therefore the same elements are denoted by the same reference numerals and the description thereof will not be repeated.

Referring to FIG. 8 and FIG. 3 simultaneously, the display device 20 of the present embodiment is different from the display device 10 of the embodiment of FIG. 3 only in that the barrier layer 150' in the display device 20 and the side S of the cover plate 170 Cut together. In this way, in addition to the barrier layer The method of fabricating the display device 20 can be made with reference to FIGS. 4A to 4G and FIGS. 5A to 5G.

Further, the barrier layer 150' capable of blocking laser light having a wavelength of 100 mJ/cm ² or more and having a wavelength of 380 nm or less is disposed in line with the side S of the cover 170, in the process of manufacturing the display device 20. When the laser light is used for the stripping process (please refer to FIG. 4E) or the cutting process (please refer to FIG. 5E), the barrier layer 150' can effectively absorb the laser light irradiated to the substrate 100, thereby preventing the signal line 140 from being damaged, thereby The display device 20 has good yield and display quality.

In summary, in the display device of the present invention, by providing a barrier layer capable of absorbing laser light having a wavelength of 380 nm or less above the signal line, it is possible to prevent the signal line from being subjected to the stripping process or during the process of manufacturing the display device. The laser light used in the cutting process is destroyed, thereby improving the process yield and display quality of the display device.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧ display device

100‧‧‧Substrate

102‧‧‧ display area

104‧‧‧The surrounding area

106‧‧‧External signal junction area

108‧‧‧Drop area

110‧‧‧ scan line

120‧‧‧Information line

130‧‧‧ pixel unit

140‧‧‧Signal line

150‧‧‧Block

160‧‧‧ joint pad

170‧‧‧ cover

A‧‧‧ area

S‧‧‧ side

Claims (20)

A display device includes: a substrate having a display area and a peripheral area disposed on at least one side of the display area, the peripheral area having an external signal bonding area; and a plurality of pixel units arranged in the substrate a plurality of signal lines between the external signal junction area and the display area, wherein the signal lines are electrically connected to the pixel units; and a barrier layer is located at least partially above the signal lines; a cover plate disposed opposite the substrate, the cover plate substantially covering the pixel units and substantially not overlapping the external signal bonding region, the cover plate substantially overlapping a portion of the barrier layer and substantially not Overlap another portion of the barrier layer. The display device according to claim 1, wherein the barrier layer is for absorbing laser light having a wavelength of 380 nm or less. The display device according to claim 2, wherein the barrier layer blocks the laser light having an energy of 100 mJ/cm ² or more. The display device of claim 1, wherein the barrier layer comprises tantalum, an acrylic resin, a polyimide resin, a metal, a metal oxide, a metal stack layer, or a stacked layer of a metal and a metal oxide. . The display device of claim 1, further comprising a plurality of bonding pads disposed on the external signal bonding region, wherein the signal wires are electrically connected to the bonding pads and the pixel units. The display device of claim 1, wherein the barrier layer is provided Placed adjacent to one side of the cover and intersecting at least a portion of the signal lines. The display device of claim 1, wherein one side of the cover plate at least partially overlaps the barrier layer. The display device of claim 1, wherein the substrate or the cover is a flexible substrate. The display device of claim 1, wherein each pixel unit comprises: an active component; a first electrode layer electrically connected to the active component; and a light emitting layer on the first electrode layer And a second electrode layer covering the luminescent layer. A method of manufacturing a display device, comprising: providing an upper plate, wherein the upper plate comprises: a first hard substrate; and a first substrate disposed on the first hard substrate, the first substrate having a pre-cut line Providing a lower plate, wherein the lower plate comprises: a second hard substrate; a second substrate disposed on the second hard substrate, the second substrate having a display area and a week disposed on at least one side of the display area a peripheral area having an external signal bonding area; a plurality of pixel units arranged on the display area of the second substrate; a plurality of signal lines located between the external signal bonding area and the display area and electrically connected to the pixel units; and a barrier layer at least partially above the signal lines; performing a bonding process to enable the The upper plate and the lower plate are joined together, wherein the pre-cut line and the barrier layer at least partially overlap in a vertical projection direction; and a first peeling process is performed to make the first hard substrate and the first Separating the substrate, wherein the first substrate is subjected to a cutting process according to the pre-cut line to form a cavity in the first substrate, the slit exposing the first hard substrate and causing the first substrate A substrate is divided into a cover portion and a sacrificial portion. The method of manufacturing a display device according to claim 10, wherein the barrier layer absorbs laser light having a wavelength of 380 nm or less. The method of manufacturing a display device according to claim 11, wherein the barrier layer blocks the laser light having an energy of 100 mJ/cm ² or more. The method of manufacturing a display device according to claim 10, wherein the barrier layer comprises ruthenium, an acrylic resin, a polyimide resin, a metal, a metal oxide, a metal stack layer, or a metal and a metal oxide. Stacked layers. The method of manufacturing a display device according to claim 10, wherein the first peeling process is performed such that the first rigid substrate is separated from the cover portion of the first substrate to form a cover. The board substantially covers the pixel units and does not substantially overlap the external signal bonding area, the cover substantially overlapping the resistance One of the barrier layers is partially and substantially non-overlapping to another portion of the barrier layer. The method of manufacturing the display device of claim 14, further comprising performing a second stripping process to separate the second rigid substrate from the second substrate. The method of manufacturing a display device according to claim 15, wherein the first peeling process and the second peeling process comprise a laser peeling process, and the cutting program comprises a laser cutting program. A method of manufacturing a display device, comprising: providing an upper plate, wherein the upper plate comprises: a first hard substrate; and a first substrate disposed on the first hard substrate, the first substrate having a pre-cut line Providing a lower plate, wherein the lower plate comprises: a second hard substrate; a second substrate disposed on the second hard substrate, the second substrate having a display area and a week disposed on at least one side of the display area a peripheral area having an external signal bonding area; a plurality of pixel units arranged on the display area of the second substrate; and a plurality of signal lines located between the external signal bonding area and the display area, And electrically connecting the pixel units; and a barrier layer at least over the portion of the signal lines; performing a bonding process to cause the upper plate and the lower plate to be joined together Wherein the pre-cut line and the barrier layer at least partially overlap in a vertical projection direction; and performing a first stripping process to separate the first hard substrate from the first substrate, wherein after performing the first stripping process And cutting a first substrate through the pre-cut line to form a cover, wherein the cover substantially covers the pixel units and exposes the external signal connection region. The method of manufacturing a display device according to claim 17, further comprising performing a second stripping process to separate the second rigid substrate from the second substrate. The method of manufacturing a display device according to claim 18, wherein the first peeling process and the second peeling process comprise a laser peeling process, and the cutting program comprises a laser cutting program. The method of manufacturing the display device of claim 17, wherein the cover plate does not substantially overlap the external signal bonding region, and the cover plate substantially overlaps a portion of the barrier layer and does not substantially overlap Another part of the barrier layer.