TWI561836B - - Google Patents
Info
- Publication number
- TWI561836B TWI561836B TW105119955A TW105119955A TWI561836B TW I561836 B TWI561836 B TW I561836B TW 105119955 A TW105119955 A TW 105119955A TW 105119955 A TW105119955 A TW 105119955A TW I561836 B TWI561836 B TW I561836B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105119955A TW201809697A (zh) | 2016-06-24 | 2016-06-24 | 電子元件之壓接單元的溫控裝置及其應用的測試設備 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105119955A TW201809697A (zh) | 2016-06-24 | 2016-06-24 | 電子元件之壓接單元的溫控裝置及其應用的測試設備 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI561836B true TWI561836B (zh) | 2016-12-11 |
| TW201809697A TW201809697A (zh) | 2018-03-16 |
Family
ID=58227294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105119955A TW201809697A (zh) | 2016-06-24 | 2016-06-24 | 電子元件之壓接單元的溫控裝置及其應用的測試設備 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201809697A (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI641842B (zh) * | 2017-08-14 | 2018-11-21 | 鴻勁精密股份有限公司 | Crimp of electronic component crimping mechanism and test classification device thereof |
| CN109116879A (zh) * | 2018-10-19 | 2019-01-01 | 苏州华兴源创科技股份有限公司 | 一种温控器 |
| TWI875362B (zh) * | 2023-12-06 | 2025-03-01 | 鴻勁精密股份有限公司 | 接合機構、測試裝置及作業機 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI779622B (zh) * | 2021-05-21 | 2022-10-01 | 謝德風 | 用以預燒預冷的測試裝置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201007721Y (zh) * | 2006-12-27 | 2008-01-16 | 中茂电子(深圳)有限公司 | 具有风道散热装置的半导体构件测试机台 |
| TW201219802A (en) * | 2010-11-05 | 2012-05-16 | Hon Tech Inc | providing heat conduction mechanism for full-scale cold/heat exchange to greatly enhance cooling performance during testing and ensure testing quality |
| TW201346293A (zh) * | 2012-05-11 | 2013-11-16 | Hon Tech Inc | 電子元件壓接裝置、應用壓接裝置之測試設備及壓接控制方法 |
| TW201423899A (zh) * | 2012-12-14 | 2014-06-16 | Hon Tech Inc | 電子元件壓取機構及其應用之測試設備 |
| TW201530161A (zh) * | 2014-01-28 | 2015-08-01 | Hon Tech Inc | 電子元件測試設備 |
| TW201614249A (en) * | 2014-10-14 | 2016-04-16 | Hon Tech Inc | Electronic component testing apparatus and test equipment using the same |
-
2016
- 2016-06-24 TW TW105119955A patent/TW201809697A/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201007721Y (zh) * | 2006-12-27 | 2008-01-16 | 中茂电子(深圳)有限公司 | 具有风道散热装置的半导体构件测试机台 |
| TW201219802A (en) * | 2010-11-05 | 2012-05-16 | Hon Tech Inc | providing heat conduction mechanism for full-scale cold/heat exchange to greatly enhance cooling performance during testing and ensure testing quality |
| TW201346293A (zh) * | 2012-05-11 | 2013-11-16 | Hon Tech Inc | 電子元件壓接裝置、應用壓接裝置之測試設備及壓接控制方法 |
| TW201423899A (zh) * | 2012-12-14 | 2014-06-16 | Hon Tech Inc | 電子元件壓取機構及其應用之測試設備 |
| TW201530161A (zh) * | 2014-01-28 | 2015-08-01 | Hon Tech Inc | 電子元件測試設備 |
| TW201614249A (en) * | 2014-10-14 | 2016-04-16 | Hon Tech Inc | Electronic component testing apparatus and test equipment using the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI641842B (zh) * | 2017-08-14 | 2018-11-21 | 鴻勁精密股份有限公司 | Crimp of electronic component crimping mechanism and test classification device thereof |
| CN109116879A (zh) * | 2018-10-19 | 2019-01-01 | 苏州华兴源创科技股份有限公司 | 一种温控器 |
| TWI875362B (zh) * | 2023-12-06 | 2025-03-01 | 鴻勁精密股份有限公司 | 接合機構、測試裝置及作業機 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201809697A (zh) | 2018-03-16 |