TWI545141B - Epoxy resin compound and radiant heat circuit board using the same - Google Patents

Description

Epoxy resin composition and heat dissipation circuit board using the same

The present invention relates to an epoxy resin composition, particularly an epoxy resin composition used for an insulating layer of a heat dissipation circuit board.

The circuit board includes an electrically insulating substrate and a circuit pattern formed on the electrically insulating substrate. This board is used to mount components such as electronic components thereon.

The electronic component may include a heat generating device such as a light emitting diode (LED) and the heat generating device emits a large amount of heat. Increasing the temperature of the board from heat generated by a heat generating device causes a problem of malfunction and reliability of the heat generating device.

Therefore, a heat dissipation structure that radiates heat from the electronic component to the outside of the circuit board is very important, and the thermal conductivity of the insulating layer formed on the circuit board greatly affects heat dissipation. In order to increase the thermal conductivity of the insulating layer, it is necessary to fill the inorganic filler in the high-density layer. It is recommended to use the low-viscosity epoxy resin as the inorganic filler.

In general, resins such as bisphenol A epoxy resin or bisphenol F epoxy resin are widely used as low viscosity epoxy resins. Since these epoxy resins are liquid at room temperature, they are difficult to handle and adversely affect heat resistance, mechanical strength and toughness.

Embodiments of the present invention provide an epoxy resin composition having a new composition ratio.

Embodiments of the present invention provide a heat dissipation circuit board having improved heat dissipation efficiency.

Embodiments of the present invention provide an epoxy resin composition including an epoxy resin, a hardener, and an inorganic filler, wherein the epoxy resin includes an epoxy resin of the following chemical equation.

Embodiments of the present invention also provide a heat dissipation circuit board including a metal plate and an insulation layer Formed on a metal plate, and a circuit pattern formed on the insulating layer, wherein the insulating layer is formed of a cured epoxy resin composition, the epoxy resin composition includes an epoxy resin, a hardener, and an inorganic filler as a main component This epoxy resin includes an epoxy resin of the above chemical equation.

According to the present invention, an epoxy resin having a mesogen structure is used to favor crystallizability, so that the heat transfer coefficient is increased. In addition, a high heat dissipation circuit board using an epoxy resin as an insulating material can be used for a printed circuit board.

Further, the epoxy resin has high heat conductivity, low water absorption, low thermal expansion, and high heat resistance.

Details of one or more embodiments are set forth in the accompanying drawings and the description below. Other features will be apparent from the description, illustration and patent application scope.

100‧‧‧ Thermal circuit board

110‧‧‧Metal plates

120‧‧‧Insulation

125‧‧‧Inorganic filler

130‧‧‧ circuit pattern

150‧‧‧heating device

1 is a cross-sectional view illustrating a heat dissipation circuit board in accordance with an embodiment of the present invention.

The present invention will now be described in detail with reference to the preferred embodiments of the invention, However, the spirit and scope of the invention may be embodied in many different forms and not limited to the spirit and scope of the present disclosure.

In the present specification, when it is described as a "comprises" (or includes or has elements), it should be understood that it may include (or include or have) only those elements. Or other elements may be included (or included or have) and it is assumed that the elements are not specifically limited.

In the drawings, for clarity of description, the regions that are not relevant to the disclosure of the present invention are eliminated, and the dimensions of the layers and regions are exaggerated for clarity of illustration. Throughout the specification, all elements are denoted by reference numerals.

It can be understood that when a film layer, a film, a region or a plate is referred to as being "on" another film layer, film, region or plate, it can also be present on another film layer. The film, region or plate is "directly on", or an intervening film, film, region or plate may also be present. However, if a film, film, region or plate is referred to as being "directly above" another film, film, region or plate, it means that there is no intervening film, film, region or plate.

The present invention provides a good thermal conductivity system due to high crystallization characteristics. A number of epoxy resin compositions.

The crystalline epoxy resin composition disclosed in the present invention includes an epoxy resin, a hardener, and an inorganic filler as a main component.

The epoxy resin may include at least 12% by weight of crystalline epoxy resin. For example, the epoxy resin can include at least 50% by weight of crystalline epoxy resin.

The crystalline epoxy resin is represented by the following chemical equation.

In this chemical equation, n can be an integer from 0 to 10.

If the content of the crystalline epoxy resin is less than the above value, for example, the effect of increasing the thermal conductivity is reduced because the epoxy resin does not crystallize during the hardening process.

The epoxy resin further includes a generally amorphous epoxy resin having at least two epoxy group molecules and a crystalline epoxy resin having an important constituent.

Examples of non-crystalline epoxy resins include bisphenol A, 3,3',5,5'-tetramethyl-4,4'-dihydroxydiphenylmethane (3,3',5, 5'-tetramethyl-4,4'-dihydroxydiphenylmethane), 4,4'-dihydroxydiphenylsulfone, 4,4'-dihydroxydiphenylsulfide 4,4'-dihydroxydiphenylketone, fluorenebisphenol, 4,4'-bisphenol, 3,3',5,5'-tetramethyl-4 , 4'-dihydroxybiphenyl (3,3',5,5'-tetramethyl-4,4'-dihydroxybiphenyl), 2,2'-bisphenol (2,2'-biphenol), resorcinol ( Resorcin), catechol, t-butylcatechol, hydroquinone, t-butylhydroquinone, 1,2-dihydroxynaphthalene (1,2-dihydroxynaphthalene), 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1, 8-Dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8- Polyhydroxylation of dihydroxynaphthalene, allylated compounds or dihydroxynaphthalene Compounds, divalent phenols such as propylene bisphenol A, propylene bisphenol F, phenol novolac, trivalent or higher phenols such as novolac ( Phenol novolac), bisphenol A novolac, o-cresol novolac, m-cresol novolac, p-cresol novolac , xylenol novolac, poly-p-hydroxystyrene, tris-(4-hydroxyphenyl)methane, 1,1,2, 2-tetrakis(4-hydroxypheny)ethane, fluoroglycinol, pyrogallol, tert-butyl phthalate Triphenylphenol (t-butylpyrogallol), allyl pyrogallol, polyallylated pyrogallol, 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, aryl phenolaralkyl resin, naphthol aralkyl resin, dicyclophenadiene base tree , With a glycidyl ether (glycidyl etherficated) compound derived as tetrabromobisphenol A (tetrabromobisphenol A) from a halogenated bisphenol (halogenated bisphenols). For example, the epoxy resin may include a combination of two or more of the above amorphous epoxy resins.

Any hardener of the conventional epoxy resin hardener can be used as a hardener for the epoxy resin composition disclosed herein. For example, the hardener may be a phenol based hardener.

The phenol-based hardener includes a phenol resin other than a phenol compound.

Examples of the phenol-based hardener include bisphenol A, bisphenol F, 4,4'-dihydroxydiphenylmethane, 4,4'-di Hydroxyether (4,4'-dihydroxydiphenylether), 1,4-bis(4-hydroxyphenoxy)benzene, 1,3-bis(4-hydroxyphenoxy) Benzene (1,3-bisphenoxy)benzene, 4,4'-dihydroxydiphenylsulfide, 4,4'-dihydroxybenzophenone (4, 4'-dihydroxydiphenylketone), 4,4'-dihydroxydiphenylsulfone, 4,4'-dihydroxybiphenyl, 2,2'-dihydroxy Biphenyl (2,2'-dihydroxybiphenyl), 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide (10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide), phenol novolac, bisphenol A novolac, o-cresol novolac ( O-cresol novolac), m-cresol novolac, p-cresol novolac, xylenol novolac, poly-p-polystyrene Hydroxystyrene), hydroquinone, resorcin, catechol, t-butylcatechol, t-butyl hydroquinone ), fluoroglycinol, pyrogallol, t-butylpyrogallol, pyrogallol, polypropylene pyrogallol Pyrogallol), 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, 1,2-dihydroxy 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1 , 8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-di Hydroxy-naphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8-dihydroxynaphthalene, propylene-based compound or dihydroxynaphthalene-based polypropylene compound, propylene bisphenol A, propylene bisphenol F, propylene baseline phenolic, and propylene pyrogallol.

At least two hardeners may be mixed and then used as the hardener.

Meanwhile, a conventional hardener other than a phenol-based hardener can be used. Examples of conventional hardeners include amine-based hardeners, acid anhydride-based hardeners, phenol-based hardeners, and polymercaptan-based hardeners. A polyaminoamide-based hardener, an isocyanate-based hardener, and a blocked isocyanate-based hardener. The mixing ratio of the above hardeners may be appropriately selected depending on the type of the hardener or appropriately determined by the physical properties of the thermally conductive epoxy resin product.

Examples of the amine-based hardener include aliphatic amines, polyether polyamines, cycloaliphatic amines, and aromatic amines. Examples of aliphatic amines include ethylene diamine, 1,3-diaminopropane, 1,4-diaminopropane, and hexamethylenediamine. Amine (hexamethylenediamine), 2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine, diethylenetriamine, aminobispropylamine, (hexamethylene)triamine (bis(hexamethylene)triamine), triethylenetetramine, tetraethylenephentamine, pentaethylenehexamine, N-hydroxyethylethylenediamine, and tetrakis Ethyl (diethyl) ethylenediamine. Examples of polyether polyamines include triethyleneglycoldiamine, tetraethyleneglycoldiamine, diethyleneglycolbis (propylamine), polyoxypropylenediamine. And polyoxypropylene triamine (polyoxypropylenetriamine). Examples of cycloaliphatic amines include isophorone diamine, metacendiamine, N-aminoethylpiperazine, and bis(4-amino-3-methyldicyclohexylmethane). (bis(4-amino-3-methyldicyclohexyl)methane), bis(aminomethyl)cyclohexane, 3,9-di(3-aminopropyl) 2,4,8,10 - 3,9-bis(3-aminopropyl) 2,4,8,10-tetraoxaspiro (5,5) undecane, and norbornen diamine. Examples of aromatic amines include tetrachloro-p-xylylenediamine, m-xylylenediamine, p-xylylenediamine, m-phenylenediamine. (m-phenylenediamine), o-phenylenediamine, p-phenylenediamine, 2,4-diaminoanisole, 2,4-toluenediamine (2,4-toluenediamine), 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'- Diethyl-1,2-diphenylethane, 2,4-diaminodiphenylsulfone, 4,4'-di 4,4'-diaminodiphenylsulfone, m-aminophenol, m-aminobenzylamine, benzyldimethylamine, 2-dimethylaminomethyl 2-dimethylaminomethyl phenol, triethanolphenol, methylbenzylamine, α-(m-aminophenyl)ethylamine, α-(p-aminophenyl)ethyl Amine (α-(p-aminophenyl)ethylamin e), diaminodiethyldimethyldiphenylmethane, and α,α'-bis(4-aminophenyl)-p-diisopropylbenzene (α,α'-bis(4-aminophenyl)- P-diisopropylbenzene).

Examples of acid anhydride hardeners include dodecene succinic anhydride (dodecenyl succinic anhydride), polyadipic acid anhydride, polyazellainc acid anhydride, polysebacic acid anhydride, poly(ethyloctadecanoic acid anhydride) (poly(ethyloctadecanoicic) Acid), poly(phenylhexadecanoic acid) anhydride, methyltetrahydrophthalic anhydride, methylhexahydro phthalic anhydride, six Hexahydro phthalic anhydride, anhydrous methyl hymic acid, tetrahydro phthalic anhydride, trialkyltetrahydrophthalic anhydride Anthracene, methylcyclohexenedicarbonic acid anhydride, methylcyclohexenetetracarbonic acid anhydride, phthalic anhydride, anhydrous hydrotrimethylene anhydride (anhydrous trimellitic anhydride), anhydrous Anhydrous pyromellitic acid, benzophenone tetracarboxylic acid (benzophenone tetracarbonic acid anhydride), ethylene glycol bistrimellitate, hetic anhydride, nadic anhydride, anhydrous hydronorsernic acid (anhydrous methyl nadic acid), 5-(2) ,5-dihydrotetrahydro-3-furan)-3-methyl-3-cyclohexane-1,2-dicarboxylic acid anhydride (5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl -3-cyclohexane-1,2-dicarbonic acid anhydride), 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene succinic dianhydride (3,4-dicarboxy-1,2, 3,4-tetrahydro-1-naphthalene succinic acid dianhydride), with 1-methyl-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene succinic dianhydride (1-methyl-dicarboxy-1, 2,3,4-tetrahydro-1-naphthalene succinic acid dianhydride).

This epoxy resin composition includes 40% by weight to 97% by weight of an inorganic filler.

When the content of the inorganic filler is less than the above range, it may be difficult to attain the effects such as high thermal conductivity, low thermal expansion, and high heat resistance disclosed in the present invention. The inclusion of more inorganic fillers will achieve the above effects, but does not increase the effectiveness of the inorganic filler by the proportion of the volume fraction. That is to say, the above-mentioned effects of the inorganic filler from a certain content are remarkably improved. The above mentioned effects are due to the influence of a controlled high order structure in the polymer state. Seems to be high The secondary structure is mainly present on the surface of the inorganic filler, so a certain amount of inorganic filler is required. Meanwhile, when the content of the inorganic filler is larger than the above range, the viscosity of the epoxy resin composition increases, making it difficult for the epoxy resin composition to form a desired shape.

The inorganic filler may be spherical. The shape of the inorganic filler is not particularly limited to a spherical inorganic filler. For example, the inorganic filler may have a shape of an elliptical cross section. However, if the shape of the inorganic filler is close to a perfect spherical shape, the fluidity of the epoxy resin composition can be improved.

The inorganic filler may be a chemical component such as alumina, aluminum nitride, tantalum nitride, boron nitride or crystalline germanium or the like. Further, the inorganic filler may be used in combination of two or more different inorganic fillers.

The inorganic filler may have an average particle size of less than 30 microns. When the average particle diameter is larger than the above range, the fluidity and strength of the epoxy resin composition are deteriorated.

Conventional curing accelerators can be combined with the epoxy resin compositions disclosed herein. Examples of the hardening accelerator include amines, imidazoles, organic phosphines, and Lewis acids. In particular, examples of the hardening accelerator may include: tertiary amines such as 1,8-diazabicyclo(5,4,0)undecene-7 (1,8-diazabicyclo (5,4) , 0) undecene-7), triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris(dimethylaminomethyl)phenol (tris) Dimethylaminomethyl)phenol); imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole And 2-heptadecylimidazole; organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine With phenylphosphine; and tetrasubstituted phosphonium. tetra substituted borate such as tetraphenylphosphonium. tetraphenylborate, tetraphenylphosphonium tetraphenylphosphonium. Ethyltriphenylborate) with tetrabutyl ‧ tetrabutylphosphonium. tetrabutylborate; and tetraphenylboron salts such as 2-ethyl-4-methylimidazole. tetraphenylborate and N- N-methylmorphorlin.tetraphenylborate.

In the epoxy resin composition disclosed in the present invention, a conventional wax can be used as a release agent for the epoxy resin composition. Examples of the wax include stearic acid, montanic acid, montanic acid ester, and phosphoric acid ester.

In the epoxy resin composition disclosed in the present invention, it can be used in a conventional coupling agent in an epoxy resin composition to improve the adhesion strength between the inorganic filler and the resin component. For example, examples of coupling agents include epoxy decane.

When the epoxy resin composition disclosed in the present invention includes an epoxy resin, a hardener, and an inorganic filler as a main component, the epoxy resin composition includes 3 wt% to 60 wt% of an epoxy resin, and 40 wt% to 97 wt% of an inorganic binder. The filler is mixed with 0.5% by weight to 5% by weight of a hardener. The epoxy resin, hardener and other ingredients are dissolved in a solvent such as acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), isopropanol (IPA), butanol or toluene, followed by heating and stirring. Then, the inorganic filler is further added to the solution and uniformly mixed with a machine such as a stirrer. Thereafter, a coupling agent is added to the mixture in this mixture and kneaded using a machine such as a heating roll or a kneader. The order of mixing the above components is not limited thereto.

At this time, the amount of the solvent may be from 10% by weight to 20% by weight based on the total weight of the epoxy resin composition.

The epoxy resin composition disclosed in the present invention can be applied to the heat dissipation circuit board 100 shown in FIG.

Referring to FIG. 1 , the heat dissipation circuit board 100 disclosed in the present invention includes a metal plate 110 , an insulating layer 120 formed on the metal plate 110 , and a circuit pattern 130 formed on the insulating layer 120 .

The metal plate 110 may be formed of one of copper, aluminum, nickel, gold, platinum, and an alloy of such materials having good thermal conductivity properties.

The metal plate 110 may include a metal projection (not shown) to form a mounting pad and is mounted on the heat generating device 150.

The metal bumps may extend vertically from the metal plate 110. The heat generating device 150 is mounted on a portion of the upper end of the metal bump, and a portion of the upper end of the metal bump has a width set in advance for mounting solder balls.

The insulating layer 120 is disposed on the metal plate 110.

The insulating layer 120 may include a plurality of insulating layers. The insulating layer 120 is disposed between the metal plate 110 and the circuit pattern 130.

The insulating layer 120 can be formed by curing the above crystalline epoxy resin composition. The inorganic filler 125 is uniformly distributed in the insulating layer 120.

The circuit pattern 130 is formed on the insulating layer 120.

Since the insulating layer 120 is formed using the above-described crystalline epoxy resin composition, the thermal conductivity of the insulating layer 120 is improved, and heat generated from the heat generating device 150 can be conducted to the metal plate 110 via the insulating layer 120.

<example>

The scope and spirit of the present invention will be described in detail below with reference to examples.

(Example 1)

3.8 wt% of bisphenol F, 4.2 wt% of crystalline epoxy resin of Chemical Formula 1, 1.0 wt% of biphenyl hardener, 0.1 wt% of triphenylphosphine oxide curing accelerator, and 0.9 wt% The BYK-W980 additive was all mixed; stirred at 40 ° C for 10 minutes; then 90.0 wt% of alumina inorganic filler was added; and then stirred at room temperature for 20 minutes to 30 minutes to obtain the crystalline epoxy resin composition of Example 1. .

The thermal conductivity of the epoxy resin composition was measured by an unsteady hot wire method using a NTZ447 type heat conduction analyzer of NETZSCH.

The glass transition temperature of the epoxy resin composition was measured by using a TAC Q100 thermo-mechanical measuring device of TA Instruments at a heating rate of 10 ° C / min.

(Example 2)

3.8 wt% of bisphenol A o-cresol novolak, 4.2 wt% of chemical epoxy of chemical formula 1, 1.0 wt% of biphenyl hardener, 0.1 wt% of triphenylphosphine oxide curing accelerator, and 0.9 wt% of BYK-W980 additive was mixed; stirred at 40 ° C for 10 minutes; then 83.2 wt% of alumina inorganic filler was added; and then stirred at room temperature for 20 minutes to 30 minutes to obtain the crystalline ring of Example 2. Oxygen resin composition.

(Example 3)

12.4 wt% of bisphenol F, i3.6 wt% of crystalline epoxy of chemical equation 1 Resin, 3.0 wt% of biphenyl hardener, 0.3 wt% of triphenylphosphine oxide curing accelerator, and 0.7 wt% of BYK-W980 additive were all mixed; stirred at 40 ° C for 10 minutes; then added 70.0 wt % alumina inorganic filler; and then stirred at room temperature for 20 minutes to 30 minutes to obtain the crystalline epoxy resin composition of Example 3.

(Example 4)

8.1 wt% of bisphenol F, 8.9 wt% of crystalline epoxy resin of Chemical Formula 1, 2.0 wt% of biphenyl hardener, 0.2 wt% of triphenylphosphine oxide curing accelerator, and 0.8 wt% The BYK-W980 additive was all mixed; stirred at 40 ° C for 10 minutes; then 80.0 wt% of alumina inorganic filler was added; and then stirred at room temperature for 20 minutes to 30 minutes to obtain the crystalline epoxy resin composition of Example 4. .

(Example 5)

8.1 wt% of bisphenol F, 8.9 wt% of crystalline epoxy resin of Chemical Formula 1, 2.0 wt% of novolac hardener, 0.2 wt% of 2-methylimidazolyl curing accelerator, and 0.2 wt% The BYK-W980 additive was all mixed; stirred at 40 ° C for 10 minutes; then 80.0 wt% of alumina inorganic filler was added; and then stirred at room temperature for 20 minutes to 30 minutes to obtain the crystalline epoxy resin composition of Example 5. .

(Example 6)

1.9 wt% of bisphenol F, 4.2 wt% of crystalline epoxy resin of Chemical Formula 1, 1.0 wt% of biphenyl hardener, 0.1 wt% of triphenylphosphine oxide curing accelerator, and 0.9 wt% The BYK-W980 additive was all mixed; stirred at 40 ° C for 10 minutes; then 90.0 wt% of alumina inorganic filler was added; and then stirred at room temperature for 20 minutes to 30 minutes to obtain the crystalline epoxy resin composition of Example 6. .

(Comparative example 1)

3.8 wt% of bisphenol F, 4.2 wt% of o-cresol novolak, 1.0 wt% of biphenyl hardener, 0.1 wt% of triphenylphosphine oxide curing accelerator, and 0.9 wt% of BYK-W980 additive All were mixed; stirred at 40 ° C for 10 minutes; then 90.0 wt% of an alumina inorganic filler was added; and then stirred at room temperature for 20 minutes to 30 minutes to obtain an epoxy resin composition of Comparative Example 1.

(Comparative example 2)

3.8 wt% bisphenol A, 4.2 wt% o-cresol novolac, 1.0 wt% biphenyl a hardener, 0.1 wt% of a triphenylphosphine oxide curing accelerator, and 0.9 wt% of BYK-W980 additive are all mixed; stirred at 40 ° C for 10 minutes; then 90.0 wt% of an alumina inorganic filler; Then, the mixture was stirred at room temperature for 20 minutes to 30 minutes to obtain an epoxy resin composition of Comparative Example 2.

<Experimental example>

Thermal conductivity measurement

The thermal conductivity of each of the examples and comparative examples was determined by a transient hotline method using a LFM447 type thermal conductivity meter from Nexus, and the results of the measurements are shown in Table 1.

Melting heat measurement

The heat of fusion was measured using a scanning thermal differential (TA product QC Q100) at a heating rate of 10 ° C / minute and the results thereof are shown in Table 1. The melting heat values of the respective examples and comparative examples are similar.

Glass transition temperature

The glass transition temperature was measured at a heating rate of 10 ° C / min, using a DSC Q100 thermo-mechanical measuring device of TA Corporation and the results thereof are shown in Table 1. The glass transition temperature is at least 100 °C. That is to say, although the crystalline epoxy resin is added, other characteristics are not deteriorated.

Referring to Table 1, in Example 1, Comparative Example 1 and Comparative Example 2, the same content of inorganic filler was used, and the thermal conductivity of the sample 1 crystalline epoxy resin composition including the crystalline epoxy resin was higher than that of Comparative Example 1 and compared. Example 2 Thermal Conductivity of Epoxy Resin Composition.

While the embodiment has been described with reference to a number of illustrative embodiments thereof, it should be inferred by those skilled in the art that many other modifications and embodiments are within the spirit and scope of the invention. In particular, various variations and modifications are possible in the scope of the invention and the scope of the invention. In addition to varying and modifying components and/or permutations, various alternative uses will also be apparent to those skilled in the art.

100‧‧‧ Thermal circuit board

110‧‧‧Metal plates

120‧‧‧Insulation

125‧‧‧Inorganic filler

130‧‧‧ circuit pattern

150‧‧‧heating device

Claims (15)

An epoxy resin composition comprising: an epoxy resin; a hardener; and an inorganic filler, wherein the epoxy resin comprises an epoxy resin of the following chemical formula: Wherein n is an integer from 2 to 10, wherein the epoxy resin comprises an amorphous epoxy resin. The epoxy resin composition of claim 1, wherein the epoxy resin composition comprises the epoxy resin of the chemical formula of at least 50% by weight based on the total weight of the epoxy resin. The epoxy resin composition according to claim 1, wherein the epoxy resin composition comprises the inorganic filler in an amount of 40% by weight to 97% by weight based on the total weight of the epoxy resin composition. The epoxy resin composition according to claim 1, wherein the inorganic filler is at least one of alumina, boron nitride, aluminum nitride, crystalline germanium and tantalum nitride. The epoxy resin composition according to claim 1, wherein the epoxy resin composition comprises 3 to 60% by weight of the epoxy resin based on the total weight of the epoxy resin composition. The epoxy resin composition according to claim 1, wherein the epoxy resin composition comprises 0.5% by weight to 5% by weight of the hardener based on the total weight of the epoxy resin composition. The epoxy resin composition according to claim 1, wherein the epoxy resin composition is used as an insulating material for a circuit board. The epoxy resin composition according to claim 1, wherein the epoxy resin composition further comprises a curing accelerator and a coupling agent. The epoxy resin composition of claim 1, wherein the epoxy resin composition comprises at least two amorphous epoxy resins. The epoxy resin composition according to claim 9, wherein the amorphous epoxy resin comprises bisphenol A and bisphenol F. The epoxy resin composition according to claim 1, wherein the epoxy resin of the chemical equation is a crystalline epoxy resin. A heat dissipation circuit board comprising: a metal plate; an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, wherein the insulating layer is formed by curing an epoxy resin composition, the ring The oxy-resin composition comprises an epoxy resin, a hardener, an inorganic filler, and the epoxy resin is represented by the following chemical equation: Wherein n is an integer from 2 to 10, wherein the epoxy resin comprises an amorphous epoxy resin. The heat dissipation circuit board of claim 12, wherein the epoxy resin composition comprises 40% by weight to 97% by weight of the inorganic filler based on the total weight of the epoxy resin composition. The heat dissipation circuit board of claim 12, wherein the inorganic filler is at least one of alumina, boron nitride, aluminum nitride, crystalline germanium and tantalum nitride. The heat dissipation circuit board of claim 12, wherein the epoxy resin of the chemical equation is a crystalline epoxy resin, and the epoxy resin composition is included in at least 12 wt% of the total weight of the epoxy resin composition. The chemical equation of the epoxy resin.