TWI541821B - Electronic device and dynamic random access memory thereof - Google Patents
Electronic device and dynamic random access memory thereof Download PDFInfo
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- TWI541821B TWI541821B TW104136191A TW104136191A TWI541821B TW I541821 B TWI541821 B TW I541821B TW 104136191 A TW104136191 A TW 104136191A TW 104136191 A TW104136191 A TW 104136191A TW I541821 B TWI541821 B TW I541821B
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- 239000000758 substrate Substances 0.000 claims description 34
- 239000004922 lacquer Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 description 10
- 239000003973 paint Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005282 brightening Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F23/00—Advertising on or in specific articles, e.g. ashtrays, letter-boxes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/18—Edge-illuminated signs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Planar Illumination Modules (AREA)
Description
本發明有關於一種電子裝置及其動態隨機存取記憶體。 The invention relates to an electronic device and a dynamic random access memory thereof.
如TWM448772所揭露之電子裝置及其動態隨機存取記憶體包含一本體、至少一發光二極體以及一至少半透明之導光體。該發光二極體設於該本體且與該本體電性連接,該本體設有一記憶體模組,該導光體係設於該本體並覆蓋該發光二極體,且該發光二極體之光源能穿透出該導光體。 The electronic device and the dynamic random access memory thereof as disclosed in TWM448772 comprise a body, at least one light emitting diode, and an at least translucent light guide. The light emitting diode is disposed on the body and electrically connected to the body. The body is provided with a memory module. The light guiding system is disposed on the body and covers the light emitting diode, and the light source of the light emitting diode Can penetrate the light guide.
然而,此類電子裝置及其動態隨機存取記憶體於實際使用時,需要另外設置覆設於發光二極體之導光體,如此一來,整體裝置容易過厚、且製造成本較高。 However, when such an electronic device and its dynamic random access memory are actually used, it is necessary to separately provide a light guide body that is disposed on the light emitting diode. As a result, the overall device is likely to be too thick and has a high manufacturing cost.
因此,有必要提供一種新穎且具有進步性之電子裝置及其動態隨機存取記憶體,以解決上述之問題。 Therefore, it is necessary to provide a novel and progressive electronic device and its dynamic random access memory to solve the above problems.
本發明之主要目的在於提供一種電子裝置及其動態隨機存取記憶體,可不用另外設置導光部,僅需利用基板本身結構以及於漆層另設有出射透光部,即可達到同樣之發亮效果,如此一來,可減少整體厚度 並節省製造成本。 The main object of the present invention is to provide an electronic device and a dynamic random access memory thereof, which can be achieved by using a separate light guiding portion, and only by using the structure of the substrate itself and additionally providing a light transmitting portion in the paint layer. Brightening effect, which reduces overall thickness And save manufacturing costs.
為達成上述目的,本發明提供一種動態隨機存取記憶體。該動態隨機存取記憶體包括一本體及一傳輸埠。該本體具有一基板部及一發光部,該基板部包括一基板及一第一漆層,該基板具有一透光部及一第一面,該第一漆層覆設於該第一面,該第一漆層設有一對應於該透光部之出射透光部,該發光部之光源可經該透光部後由該出射透光部而射至該動態隨機存取記憶體之外部,該基板部設有一記憶體模組;該傳輸埠設於該基板部,且電性連接該記憶體模組。 To achieve the above object, the present invention provides a dynamic random access memory. The dynamic random access memory includes a body and a transport port. The substrate has a substrate portion and a light emitting portion. The substrate portion includes a substrate and a first lacquer layer. The substrate has a light transmitting portion and a first surface. The first lacquer layer is disposed on the first surface. The first lacquer layer is provided with an outgoing light transmitting portion corresponding to the light transmitting portion, and the light source of the light emitting portion can pass through the light transmitting portion and be emitted to the outside of the dynamic random access memory by the outgoing light transmitting portion. The substrate portion is provided with a memory module; the transmission device is disposed on the substrate portion and electrically connected to the memory module.
為達成上述目的,本發明另提供一種電子裝置,包括上述之動態隨機存取記憶體,另包括一殼部。該殼部蓋設於該動態隨機存取記憶體之相對二側面且至少遮蔽該發光部,該殼部還設有一對應於該出射透光部之殼體透光部,由該出射透光部射出之光源可經由該殼體透光部而射至該電子裝置之外部。 In order to achieve the above object, the present invention further provides an electronic device comprising the above dynamic random access memory, further comprising a shell portion. The shell portion is disposed on opposite sides of the DRAM and at least shields the illuminating portion, and the shell portion is further provided with a shell light transmitting portion corresponding to the outgoing light transmitting portion, and the light emitting portion is emitted from the shell The emitted light source can be emitted to the outside of the electronic device via the light transmitting portion of the housing.
1‧‧‧動態隨機存取記憶體 1‧‧‧Dynamic random access memory
10‧‧‧本體 10‧‧‧ Ontology
20‧‧‧基板部 20‧‧‧Parts Department
21‧‧‧第一漆層 21‧‧‧First paint layer
210‧‧‧出射透光部 210‧‧‧Output light transmission
22‧‧‧第二漆層 22‧‧‧second paint layer
220‧‧‧入射透光部 220‧‧‧Injection and light transmission
23‧‧‧基板 23‧‧‧Substrate
230‧‧‧透光部 230‧‧‧Transmission Department
231‧‧‧第一面 231‧‧‧ first side
232‧‧‧第二面 232‧‧‧ second side
233‧‧‧記憶體模組 233‧‧‧ memory module
30‧‧‧發光部 30‧‧‧Lighting Department
31‧‧‧發光二極體 31‧‧‧Lighting diode
40‧‧‧傳輸埠 40‧‧‧Transportation
50‧‧‧殼部 50‧‧‧Shell Department
51‧‧‧殼體透光部 51‧‧‧The light transmission part of the shell
52‧‧‧反射結構 52‧‧‧Reflective structure
100‧‧‧電子裝置 100‧‧‧Electronic devices
圖1為本發明一較佳實施例之立體圖。 1 is a perspective view of a preferred embodiment of the present invention.
圖2為本發明一較佳實施例之分解圖。 2 is an exploded view of a preferred embodiment of the present invention.
圖3為本發明一較佳實施例之動態隨機存取記憶體後視圖。 3 is a rear elevational view of a dynamic random access memory in accordance with a preferred embodiment of the present invention.
圖4為本發明圖1之剖面圖。 Figure 4 is a cross-sectional view of Figure 1 of the present invention.
以下僅以實施例說明本發明可能之實施態樣,然並非用以限制本發明所欲保護之範疇,合先敘明。 The following is a description of the possible embodiments of the present invention, and is not intended to limit the scope of the invention as claimed.
請參考圖1至4,其顯示本發明之一較佳實施例之電子裝置100及其動態隨機存取記憶體1,該動態隨機存取記憶體1包括一本體10及一傳輸埠40。 Referring to FIG. 1 to FIG. 4, an electronic device 100 and a dynamic random access memory 1 thereof are shown in a preferred embodiment of the present invention. The dynamic random access memory 1 includes a body 10 and a transport port 40.
該本體10具有一基板部20及一發光部30。該基板部20設有一記憶體模組233,該傳輸埠40設於該基板部20,且該傳輸埠40電性連接該記憶體模組233,更詳細地說,該發光部30亦電性連接該傳輸埠40(當然亦可將發光部另外電性連接至例如主機板等其它外部電源)。可理解的是,該傳輸埠40不僅可以傳輸電力、亦可傳輸資料。 The body 10 has a substrate portion 20 and a light emitting portion 30. The substrate portion 20 is provided with a memory module 233. The transmission port 40 is disposed on the substrate portion 20, and the transmission port 40 is electrically connected to the memory module 233. In more detail, the light-emitting portion 30 is also electrically The transmission port 40 is connected (of course, the light-emitting portion can be additionally electrically connected to other external power sources such as a motherboard). It can be understood that the transmission port 40 can not only transmit power but also transmit data.
該基板部20包括一基板23及一第一漆層21。進一步說,該基板23具有一透光部230及一第一面231,該第一漆層21覆設於該第一面231,該基板23係一體成型有該透光部230,該第一漆層21設有一對應於該透光部230之出射透光部210,該發光部30之光源可經過該透光部230後由該出射透光部210而射至該動態隨機存取記憶體1之外部。於本實施例,該基板23還具有一相異於該第一面231之第二面232,更明確地說,該第一面231係相對該第二面232,該基板部20包括一覆設於該第二面232之第二漆層22,該第二漆層22設有一對應於該透光部230之入射透光部220,該發光部30之光源可經由該入射透光部220而射至該透光部230。於其它實施例,亦可不用設置第二漆層及入射透光部,同樣可讓發光部之光源通過;抑或是,發光部之光源可不經由第二面入射而經由基板之其他區域(例如相異於第二面之其他側面)入射。 The substrate portion 20 includes a substrate 23 and a first lacquer layer 21. Further, the substrate 23 has a transparent portion 230 and a first surface 231. The first lacquer layer 21 is disposed on the first surface 231. The substrate 23 is integrally formed with the transparent portion 230. The lacquer layer 21 is provided with an outgoing light transmitting portion 210 corresponding to the light transmitting portion 230. The light source of the light emitting portion 30 can pass through the light transmitting portion 230 and be emitted from the outgoing light transmitting portion 210 to the dynamic random access memory. 1 outside. In the embodiment, the substrate 23 further has a second surface 232 different from the first surface 231. More specifically, the first surface 231 is opposite to the second surface 232. The substrate portion 20 includes a cover. The second lacquer layer 22 is disposed on the second lacquer layer 22, and the second lacquer layer 22 is provided with an incident light transmitting portion 220 corresponding to the transparent portion 230. The light source of the illuminating portion 30 can pass through the incident light transmitting portion 220. The light is transmitted to the light transmitting portion 230. In other embodiments, the second lacquer layer and the incident light transmitting portion may not be disposed, and the light source of the illuminating portion may be passed through; or the light source of the illuminating portion may pass through other regions of the substrate without being incident through the second surface (for example, phase Irrespective of the other side of the second side) incident.
於本實施例,該第一漆層21及該第二漆層22即為一般電路板上之絕緣漆層,該入射透光部220及該出射透光部210係為不上漆之鏤空 結構;於其它實施例,入射及出射透光部亦可為透光材料層,同樣可使光透過。進一步說,該出射透光部210係為透光圖文部(例如商標等圖文),從外部觀視時可較醒目與美觀(當然入射透光部亦可為對應於出射透光部之圖文部)。 In this embodiment, the first lacquer layer 21 and the second lacquer layer 22 are insulating varnish layers on a general circuit board, and the incident light transmitting portion 220 and the outgoing light transmitting portion 210 are unpainted hollows. In other embodiments, the incident and outgoing light transmitting portions may also be light transmissive material layers, which may also transmit light. Further, the outgoing light transmitting portion 210 is a light-transmissive image portion (for example, a logo or the like), and can be more conspicuous and beautiful when viewed from the outside (of course, the incident light transmitting portion may also correspond to the outgoing light transmitting portion. Ministry of Graphic and Art).
進一步說,該發光部30係設於該基板部20,且該發光部30鄰設於該入射透光部220,該發光部30包括複數概沿該入射透光部220之輪廓而設於該基板部20之發光二極體31,可使從該出射透光部210透出之光線較明亮與均勻。於其它實施例,發光部亦可不設於基板部,只要發光部之光源可直接或間接入射至該透光部即可。 Further, the light-emitting portion 30 is disposed on the substrate portion 20, and the light-emitting portion 30 is disposed adjacent to the incident light-transmitting portion 220. The light-emitting portion 30 includes a plurality of outlines along the incident light-transmitting portion 220. The light-emitting diode 31 of the substrate portion 20 can make the light transmitted from the light-emitting and transmitting portion 210 brighter and more uniform. In other embodiments, the light emitting portion may not be disposed on the substrate portion, and the light source of the light emitting portion may be directly or indirectly incident on the light transmitting portion.
該電子裝置100除包括如上所述的動態隨機存取記憶體1、還另包括一殼部50。 The electronic device 100 further includes a case portion 50 in addition to the dynamic random access memory 1 as described above.
該殼部50蓋設於該動態隨機存取記憶體1之相對二側面且至少遮蔽該發光部30,可防止該發光部30之光線過強而傷害人眼。該殼部50還設有一對應於該出射透光部210之殼體透光部51,由該出射透光部210射出之光源可經由該殼體透光部51而射至該電子裝置100之外部,可理解的是,該殼體透光部51可為鏤空結構或透光材料層,使光源可順利透出。 The shell portion 50 is disposed on opposite sides of the DRAM 1 and at least shields the illuminating portion 30, thereby preventing the light of the illuminating portion 30 from being excessively strong and injuring the human eye. The housing portion 50 is further provided with a housing transparent portion 51 corresponding to the outgoing light transmitting portion 210. The light source emitted from the outgoing light transmitting portion 210 can be incident on the electronic device 100 via the housing transparent portion 51. Externally, it can be understood that the housing light transmitting portion 51 can be a hollow structure or a light transmissive material layer, so that the light source can be smoothly penetrated.
較佳地,該殼部50對應於該發光部30處設有一反射結構52,該反射結構52將部分該發光部30之光源反射至該透光部230,更明確地說,該反射結構52係為凹凸結構(當然亦可為平坦反光面),可使光源不規則地反射後均勻地射至該透光部230。於本實施例,該殼部50係為散熱殼部(例如金屬材質),可避免該動態隨機存取記憶體1過熱。 Preferably, the housing portion 50 is provided with a reflective structure 52 corresponding to the light-emitting portion 30. The reflective structure 52 reflects a portion of the light source of the light-emitting portion 30 to the light-transmitting portion 230. More specifically, the reflective structure 52. It is a concave-convex structure (which may of course be a flat reflective surface), and the light source may be irregularly reflected and uniformly incident on the light transmitting portion 230. In the embodiment, the shell portion 50 is a heat dissipation shell portion (for example, a metal material), and the dynamic random access memory 1 can be prevented from being overheated.
綜上,本發明之電子裝置及其動態隨機存取記憶體可不用另 外設置導光部,僅需利用基板本身結構以及於漆層另設有出射透光部,即可達到同樣之發亮效果,如此一來,可減少整體厚度並節省製造成本。 In summary, the electronic device of the present invention and its dynamic random access memory can be used without another The light guiding portion is provided separately, and the same brightening effect can be achieved by using only the structure of the substrate itself and the outgoing light transmitting portion in the lacquer layer, thereby reducing the overall thickness and saving the manufacturing cost.
綜上所述,本發明之整體結構設計、實用性及效益上,確實是完全符合產業上發展所需,且所揭露之結構發明亦是具有前所未有的創新構造,所以其具有「新穎性」應無疑慮,又本發明可較之習知結構更具功效之增進,因此亦具有「進步性」,其完全符合我國專利法有關發明專利之申請要件的規定,乃依法提起專利申請,並敬請 鈞局早日審查,並給予肯定。 In summary, the overall structural design, practicability and efficiency of the present invention are indeed fully in line with the needs of industrial development, and the disclosed structural invention is also an unprecedented innovative structure, so it has "novelty" should Undoubtedly, the invention can be more effective than the conventional structure, and therefore has "progressiveness", which fully complies with the requirements of the application requirements of the invention patents of the Chinese Patent Law, and is filed according to law, and please The bureau will review it early and give it affirmation.
10‧‧‧本體 10‧‧‧ Ontology
22‧‧‧第二漆層 22‧‧‧second paint layer
220‧‧‧入射透光部 220‧‧‧Injection and light transmission
30‧‧‧發光部 30‧‧‧Lighting Department
31‧‧‧發光二極體 31‧‧‧Lighting diode
Claims (10)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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TW104136191A TWI541821B (en) | 2015-11-03 | 2015-11-03 | Electronic device and dynamic random access memory thereof |
GB1613347.2A GB2544137A (en) | 2015-11-03 | 2016-08-03 | Electronic device and dynamic random access memory thereof |
DE102016116532.8A DE102016116532A1 (en) | 2015-11-03 | 2016-09-05 | Electronic device and its DRAM |
NL1042104A NL1042104B1 (en) | 2015-11-03 | 2016-10-14 | Electronic device and dynamic random access memory thereof |
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TW104136191A TWI541821B (en) | 2015-11-03 | 2015-11-03 | Electronic device and dynamic random access memory thereof |
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TW201606787A TW201606787A (en) | 2016-02-16 |
TWI541821B true TWI541821B (en) | 2016-07-11 |
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TW104136191A TWI541821B (en) | 2015-11-03 | 2015-11-03 | Electronic device and dynamic random access memory thereof |
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DE (1) | DE102016116532A1 (en) |
GB (1) | GB2544137A (en) |
NL (1) | NL1042104B1 (en) |
TW (1) | TWI541821B (en) |
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TWI557358B (en) * | 2015-11-03 | 2016-11-11 | 宇帷國際股份有限公司 | Electronic device and circuit module thereof |
TWI672988B (en) * | 2016-10-07 | 2019-09-21 | 芝奇國際實業股份有限公司 | A memory device and assembling method thereof |
CN108538325B (en) * | 2017-03-03 | 2019-10-25 | 宇瞻科技股份有限公司 | Reflecting heat radiator |
CN108536237B (en) * | 2017-03-03 | 2019-10-18 | 宇瞻科技股份有限公司 | Heat radiator with adjustable reflecting part |
TWI632455B (en) * | 2017-03-03 | 2018-08-11 | 宇瞻科技股份有限公司 | Heat dissipation device having adjustable reflector member |
TWI632456B (en) * | 2017-03-03 | 2018-08-11 | 宇瞻科技股份有限公司 | Reflective heat dissipation device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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DE10253420A1 (en) * | 2002-11-15 | 2004-06-03 | Honeywell B.V. | Printed circuit board with display element |
EP1696404A1 (en) * | 2005-02-25 | 2006-08-30 | Electrovac, Fabrikation elektrotechnischer Spezialartikel Gesellschaft m.b.H. | Light emitting diode assembly |
US7498521B2 (en) * | 2005-06-30 | 2009-03-03 | Intel Corporation | Method and apparatus for marking a printed circuit board |
TWM448772U (en) * | 2012-09-04 | 2013-03-11 | Avexir Technologies Corp | Dram |
TWM508102U (en) * | 2015-05-08 | 2015-09-01 | Avexir Technologies Corp | Solid state drive |
CN204629173U (en) * | 2015-05-21 | 2015-09-09 | 宇帷国际股份有限公司 | Circuit module |
-
2015
- 2015-11-03 TW TW104136191A patent/TWI541821B/en not_active IP Right Cessation
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2016
- 2016-08-03 GB GB1613347.2A patent/GB2544137A/en not_active Withdrawn
- 2016-09-05 DE DE102016116532.8A patent/DE102016116532A1/en not_active Withdrawn
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DE102016116532A1 (en) | 2017-05-04 |
NL1042104B1 (en) | 2017-12-13 |
GB2544137A (en) | 2017-05-10 |
GB201613347D0 (en) | 2016-09-14 |
TW201606787A (en) | 2016-02-16 |
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