TWI538964B - Ink for inkjet - Google Patents
Ink for inkjet Download PDFInfo
- Publication number
- TWI538964B TWI538964B TW098145010A TW98145010A TWI538964B TW I538964 B TWI538964 B TW I538964B TW 098145010 A TW098145010 A TW 098145010A TW 98145010 A TW98145010 A TW 98145010A TW I538964 B TWI538964 B TW I538964B
- Authority
- TW
- Taiwan
- Prior art keywords
- ink
- inkjet
- acrylate
- meth
- acid
- Prior art date
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 80
- 239000000758 substrate Substances 0.000 claims description 43
- 239000000178 monomer Substances 0.000 claims description 42
- 238000007747 plating Methods 0.000 claims description 38
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 25
- 238000005530 etching Methods 0.000 claims description 23
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 22
- 239000003085 diluting agent Substances 0.000 claims description 22
- 239000003999 initiator Substances 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 10
- 229920001665 Poly-4-vinylphenol Polymers 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical class C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 6
- 239000000470 constituent Substances 0.000 claims description 5
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 229930185605 Bisphenol Natural products 0.000 claims 1
- 150000002632 lipids Chemical class 0.000 claims 1
- 239000000976 ink Substances 0.000 description 146
- 150000001875 compounds Chemical class 0.000 description 35
- -1 β-carboxyethyl Chemical group 0.000 description 31
- 239000002253 acid Substances 0.000 description 20
- 239000000203 mixture Substances 0.000 description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- 229920000647 polyepoxide Polymers 0.000 description 14
- 239000004094 surface-active agent Substances 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 13
- CJDPJFRMHVXWPT-UHFFFAOYSA-N barium sulfide Chemical compound [S-2].[Ba+2] CJDPJFRMHVXWPT-UHFFFAOYSA-N 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 10
- 239000003513 alkali Substances 0.000 description 10
- 239000003112 inhibitor Substances 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 9
- 239000010931 gold Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 8
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 7
- 239000003086 colorant Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 150000002148 esters Chemical class 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 150000007519 polyprotic acids Polymers 0.000 description 7
- 150000003254 radicals Chemical class 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 239000011976 maleic acid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 5
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 4
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 3
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 3
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 3
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 3
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 3
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 3
- 229940018557 citraconic acid Drugs 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 229950000688 phenothiazine Drugs 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- SZTBMYHIYNGYIA-UHFFFAOYSA-N 2-chloroacrylic acid Chemical compound OC(=O)C(Cl)=C SZTBMYHIYNGYIA-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 2
- PGDIJTMOHORACQ-UHFFFAOYSA-N 9-prop-2-enoyloxynonyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCOC(=O)C=C PGDIJTMOHORACQ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- ACFZWYXIENXRMX-UHFFFAOYSA-N COCC1OCC1.C=CC Chemical compound COCC1OCC1.C=CC ACFZWYXIENXRMX-UHFFFAOYSA-N 0.000 description 2
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- VLVZXTNDRFWYLF-UHFFFAOYSA-N [2-ethyl-2-(prop-2-enoyloxymethyl)hexyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CC)(CCCC)COC(=O)C=C VLVZXTNDRFWYLF-UHFFFAOYSA-N 0.000 description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 2
- KUIDSTKCJKFHLZ-UHFFFAOYSA-N [4-(prop-2-enoyloxymethyl)cyclohexyl]methyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCC(COC(=O)C=C)CC1 KUIDSTKCJKFHLZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229930016911 cinnamic acid Natural products 0.000 description 2
- 235000013985 cinnamic acid Nutrition 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- LPEKGGXMPWTOCB-UHFFFAOYSA-N methyl 2-hydroxypropionate Chemical compound COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 2
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 2
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000001384 succinic acid Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NIDNOXCRFUCAKQ-UMRXKNAASA-N (1s,2r,3s,4r)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1[C@H]2C=C[C@@H]1[C@H](C(=O)O)[C@@H]2C(O)=O NIDNOXCRFUCAKQ-UMRXKNAASA-N 0.000 description 1
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- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 229960002903 benzyl benzoate Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- YGWAFVKXCAQAGJ-UHFFFAOYSA-N bis(2-methylpentan-2-yl) 4-[3,4-bis(2-methylpentan-2-ylperoxycarbonyl)benzoyl]benzene-1,2-dicarboperoxoate Chemical compound C1=C(C(=O)OOC(C)(C)CCC)C(C(=O)OOC(C)(C)CCC)=CC=C1C(=O)C1=CC=C(C(=O)OOC(C)(C)CCC)C(C(=O)OOC(C)(C)CCC)=C1 YGWAFVKXCAQAGJ-UHFFFAOYSA-N 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- VAYWPKMCRNUCND-UHFFFAOYSA-N butane-1,1,1-triol prop-2-enoic acid Chemical compound C(C=C)(=O)O.C(C=C)(=O)O.OC(CCC)(O)O VAYWPKMCRNUCND-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- VFGRALUHHHDIQI-UHFFFAOYSA-N butyl 2-hydroxyacetate Chemical compound CCCCOC(=O)CO VFGRALUHHHDIQI-UHFFFAOYSA-N 0.000 description 1
- IWPATTDMSUYMJV-UHFFFAOYSA-N butyl 2-methoxyacetate Chemical compound CCCCOC(=O)COC IWPATTDMSUYMJV-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 229920006184 cellulose methylcellulose Polymers 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
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- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
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- 238000009792 diffusion process Methods 0.000 description 1
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- WNIHNYUROPJCLW-UHFFFAOYSA-N ethyl 2-ethoxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)OCC WNIHNYUROPJCLW-UHFFFAOYSA-N 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
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- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 1
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 description 1
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- FJAKCEHATXBFJT-UHFFFAOYSA-N ethyl 2-oxobutanoate Chemical compound CCOC(=O)C(=O)CC FJAKCEHATXBFJT-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- UKDLORMZNPQILV-UHFFFAOYSA-N ethyl 3-hydroxypropanoate Chemical compound CCOC(=O)CCO UKDLORMZNPQILV-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- LJUJMKJGPIXNAK-UHFFFAOYSA-N ethyl 4-[2-(2-chlorophenyl)-1-[2-(2-chlorophenyl)-4,5-bis(4-ethoxycarbonylphenyl)imidazol-2-yl]-5-(4-ethoxycarbonylphenyl)imidazol-4-yl]benzoate Chemical compound C1=CC(C(=O)OCC)=CC=C1C1=NC(N2C(=C(N=C2C=2C(=CC=CC=2)Cl)C=2C=CC(=CC=2)C(=O)OCC)C=2C=CC(=CC=2)C(=O)OCC)(C=2C(=CC=CC=2)Cl)N=C1C1=CC=C(C(=O)OCC)C=C1 LJUJMKJGPIXNAK-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- WHRIKZCFRVTHJH-UHFFFAOYSA-N ethylhydrazine Chemical compound CCNN WHRIKZCFRVTHJH-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- RMIODHQZRUFFFF-UHFFFAOYSA-M methoxyacetate Chemical compound COCC([O-])=O RMIODHQZRUFFFF-UHFFFAOYSA-M 0.000 description 1
- PPFNAOBWGRMDLL-UHFFFAOYSA-N methyl 2-ethoxyacetate Chemical compound CCOCC(=O)OC PPFNAOBWGRMDLL-UHFFFAOYSA-N 0.000 description 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 description 1
- GSJFXBNYJCXDGI-UHFFFAOYSA-N methyl 2-hydroxyacetate Chemical compound COC(=O)CO GSJFXBNYJCXDGI-UHFFFAOYSA-N 0.000 description 1
- AKWHOGIYEOZALP-UHFFFAOYSA-N methyl 2-methoxy-2-methylpropanoate Chemical compound COC(=O)C(C)(C)OC AKWHOGIYEOZALP-UHFFFAOYSA-N 0.000 description 1
- ZGYTYDNWEZVHEL-UHFFFAOYSA-N methyl 2-tert-butylperoxycarbonyl-4-(4-tert-butylperoxycarbonyl-3-methoxycarbonylbenzoyl)benzoate Chemical compound C1=C(C(=O)OOC(C)(C)C)C(C(=O)OC)=CC=C1C(=O)C1=CC=C(C(=O)OOC(C)(C)C)C(C(=O)OC)=C1 ZGYTYDNWEZVHEL-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- RFJIPESEZTVQHZ-UHFFFAOYSA-N oxirane;prop-2-enoic acid Chemical compound C1CO1.OC(=O)C=C RFJIPESEZTVQHZ-UHFFFAOYSA-N 0.000 description 1
- UTFDIQRYDCRFOT-UHFFFAOYSA-N oxirane;prop-2-enoic acid Chemical compound C1CO1.OC(=O)C=C.OC(=O)C=C UTFDIQRYDCRFOT-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000011088 parchment paper Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- OJNNAJJFLWBPRS-UHFFFAOYSA-N phenyl-[(2,4,6-trimethylphenyl)methyl]-[(2,4,6-trimethylphenyl)methylidene]phosphanium Chemical compound CC1=C(C=P(C2=CC=CC=C2)=CC2=C(C=C(C=C2C)C)C)C(=CC(=C1)C)C OJNNAJJFLWBPRS-UHFFFAOYSA-N 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 description 1
- CYIRLFJPTCUCJB-UHFFFAOYSA-N propyl 2-methoxypropanoate Chemical compound CCCOC(=O)C(C)OC CYIRLFJPTCUCJB-UHFFFAOYSA-N 0.000 description 1
- ILPVOWZUBFRIAX-UHFFFAOYSA-N propyl 2-oxopropanoate Chemical compound CCCOC(=O)C(C)=O ILPVOWZUBFRIAX-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- RSVDRWTUCMTKBV-UHFFFAOYSA-N sbb057044 Chemical compound C12CC=CC2C2CC(OCCOC(=O)C=C)C1C2 RSVDRWTUCMTKBV-UHFFFAOYSA-N 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- MVQLEZWPIWKLBY-UHFFFAOYSA-N tert-butyl 2-benzoylbenzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 MVQLEZWPIWKLBY-UHFFFAOYSA-N 0.000 description 1
- DPPBKURCPGWRJU-UHFFFAOYSA-N tert-butyl 4-(4-tert-butylperoxycarbonylbenzoyl)benzenecarboperoxoate Chemical compound C1=CC(C(=O)OOC(C)(C)C)=CC=C1C(=O)C1=CC=C(C(=O)OOC(C)(C)C)C=C1 DPPBKURCPGWRJU-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本發明是關於一種可利用鹼性(alkali)水溶液進行剝離的噴墨(ink jet)用墨水,更詳細而言,是關於一種適用於可用作印刷配線板(printed circuit board)等電子電路基板製作用阻劑(resist)的具有耐蝕刻性的抗蝕劑(etching resist)、或具有耐鍍敷性的抗鍍敷劑(plating resist)等的噴墨用墨水。The present invention relates to an ink for ink jet which can be peeled off using an alkaline aqueous solution, and more particularly to an electronic circuit substrate suitable for use as a printed circuit board or the like. An inkjet ink such as an etching resist having an etching resistance or a plating resist having a plating resistance.
先前,於印刷配線板、可撓性配線板(flexible print circuit board)、半導體封裝(package)基板等電子電路基板的製造中,採用使用阻劑(photoresist)的光微影(photolithography)法。於利用該光微影法的電子電路基板的製造方法中,例如於印刷配線板時,於銅箔積層板的銅箔上形成光阻層,經由光罩等對其表面進行曝光,其後除去未硬化部分而形成光阻圖案(resist pattern)。黏接,藉由蝕刻除去未被光阻圖案所覆蓋的部分的銅箔,再除去光阻圖案,藉此可獲得印刷配線板。Conventionally, in the manufacture of an electronic circuit board such as a printed wiring board, a flexible print circuit board, or a semiconductor package substrate, a photolithography method using a photoresist has been used. In the method of manufacturing an electronic circuit board using the photolithography method, for example, when a wiring board is printed, a photoresist layer is formed on a copper foil of a copper foil laminate, and the surface thereof is exposed through a mask or the like, and then removed. An uncured portion forms a resist pattern. By bonding, the copper foil of the portion not covered by the photoresist pattern is removed by etching, and the photoresist pattern is removed, whereby a printed wiring board can be obtained.
然而,上述印刷配線板的製造方法於製作光罩時需要花費較長的時間與較多的費用,故設備投資金額增大。另外,由於需要使用光罩的圖案曝光,故步驟複雜,操作亦繁瑣。However, the method for manufacturing a printed wiring board described above requires a long time and a large cost in the production of the photomask, so that the amount of investment in equipment increases. In addition, since the pattern exposure of the photomask is required, the steps are complicated and the operation is cumbersome.
近年來,為了解決這些問題,正在開發使用噴墨方式,將阻抗材料直接塗佈於基板上而形成光阻圖案的方法(例如參照日本專利特開昭56-66089號公報(專利文獻1)、日本專利特開昭62-181490號公報(專利文獻2)、日本專利特開平6-237063號公報(專利文獻3)、日本專利特開平7-131135號公報(專利文獻4))。該方法可不需要先前所需要的圖案曝光,故設備投資金額較少,另外,就材料的良率較高等方面而言,正受到期待。In order to solve these problems, a method of forming a photoresist pattern by directly applying an impedance material to a substrate by using an inkjet method has been developed (see, for example, Japanese Laid-Open Patent Publication No. SHO 56-66089 (Patent Document 1) Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. This method does not require the pattern exposure required previously, so the investment amount of the equipment is small, and in view of the high yield of the material, it is expected.
上述噴墨法中所使用的阻抗材料可列舉抗蝕劑、抗鍍敷劑等,一般要求抗蝕劑具有耐蝕刻性特性,抗鍍敷劑具有耐鍍敷性特性。迄今為止,可用於噴墨法的阻抗材料提出有各種墨水組合物(日本專利特開平7-170053號公報(專利文獻5)、日本專利特開2004-353027號公報(專利文獻6)、日本專利特開2005-057018號公報(專利文獻7)),但由這些墨水所形成的阻膜不具有充分的耐蝕刻性或耐鍍敷性,同時不具有優異的鹼性剝離性。The resist material used in the above-described inkjet method may, for example, be a resist or a plating resist. Generally, the resist is required to have etching resistance, and the plating resist has plating resistance. Various kinds of ink compositions which can be used for the ink jet method have been proposed so far (Japanese Patent Laid-Open No. Hei 7-170053 (Patent Document 5), Japanese Patent Laid-Open No. 2004-353027 (Patent Document 6), Japanese Patent JP-A-2005-057018 (Patent Document 7)), but the resist film formed of these inks does not have sufficient etching resistance or plating resistance, and does not have excellent alkali peelability.
另一方面,使用聚乙烯苯酚及其衍生物的阻劑(日本專利特開昭61-291606號公報(專利文獻8)、日本專利特開平8-211610(專利文獻9)、日本專利特開昭60-15636號公報(專利文獻10)、日本專利特開昭60-17739號公報(專利文獻11)、日本專利特開昭60-17740號公報(專利文獻12))的耐鍍敷性、鹼性剝離性優異,可用於光微影法。然而,使用高分子量的聚乙烯苯酚及其衍生物作為噴墨用墨水時,會產生噴出不良。On the other hand, a resist of a polyvinyl phenol and a derivative thereof is used (Japanese Patent Laid-Open Publication No. SHO 61-291606 (Patent Document 8), Japanese Patent Laid-Open No. Hei 8-211610 (Patent Document No. 9), and Japanese Patent Special Publication No. Plating resistance, alkali, etc., in Japanese Patent Laid-Open Publication No. SHO 60-17739 (Patent Document 11), and Japanese Patent Laid-Open Publication No. SHO 60-17740 (Patent Document No. 12) Excellent in peelability and can be used in photolithography. However, when high molecular weight polyvinyl phenol and its derivative are used as inkjet inks, ejection failure occurs.
[專利文獻1]日本專利特開昭56-66089號公報[Patent Document 1] Japanese Patent Laid-Open No. 56-66089
[專利文獻2]日本專利特開昭62-181490號公報[Patent Document 2] Japanese Patent Laid-Open No. 62-181490
[專利文獻3]日本專利特開平6-237063號公報[Patent Document 3] Japanese Patent Laid-Open No. Hei 6-237063
[專利文獻4]日本專利特開平7-131135號公報[Patent Document 4] Japanese Patent Laid-Open No. Hei 7-131135
[專利文獻5]日本專利特開平7-170053號公報[Patent Document 5] Japanese Patent Laid-Open No. 7-170053
[專利文獻6]日本專利特開2004-353027號公報[Patent Document 6] Japanese Patent Laid-Open Publication No. 2004-353027
[專利文獻7]日本專利特開2005-057018號公報[Patent Document 7] Japanese Patent Laid-Open Publication No. 2005-057018
[專利文獻8]日本專利特開昭61-291606號公報[Patent Document 8] Japanese Patent Laid-Open Publication No. SHO 61-291606
[專利文獻9]日本專利特開平8-211610號公報[Patent Document 9] Japanese Patent Laid-Open No. Hei 8-211610
[專利文獻10]日本專利特開昭60-15636號公報[Patent Document 10] Japanese Patent Laid-Open Publication No. SHO 60-15636
[專利文獻11]日本專利特開昭60-17739號公報[Patent Document 11] Japanese Patent Laid-Open No. 60-17739
[專利文獻12]日本專利特開昭60-17740號公報[Patent Document 12] Japanese Patent Laid-Open No. 60-17740
於上述狀況下,要求一種取得耐蝕刻性或耐鍍敷性與鹼性剝離性等的平衡的阻膜、以及可形成具有上述特性的阻膜的噴墨用墨水。Under the above circumstances, a resist film which achieves a balance between etching resistance, plating resistance, alkaline peelability, and the like, and an ink jet ink which can form a resist film having the above characteristics are required.
本發明者等人對噴墨用墨水的構成成分進行各種研究,結果發現,含有以通式(1)所表示的重量平均分子量為1,000~8,000的樹脂(A)的噴墨用墨水具有優異的特性。進而發現,除了樹脂(A)以外,還含有具有大於等於1個羧基的單體或低聚物(B)、稀釋劑(C)、及光聚合起始劑(D)的噴墨用墨水特別是噴射(jetting)性與耐蝕刻性或耐鍍敷性優異,可形成可進行鹼性剝離的硬化膜,並根據該見解而完成本發明。本發明提供如下所述的噴墨用墨水、由噴墨用墨水所得的硬化膜及其形成方法等。As a result of various studies on the constituent components of the inkjet ink, the inventors of the present invention have found that the inkjet ink containing the resin (A) having a weight average molecular weight of 1,000 to 8,000 represented by the general formula (1) is excellent. characteristic. Further, it has been found that, in addition to the resin (A), an inkjet ink containing a monomer or oligomer (B) having at least one carboxyl group, a diluent (C), and a photopolymerization initiator (D) is particularly included. It is excellent in jetting property, etching resistance, and plating resistance, and can form a cured film which can be alkaline-peeled, and the present invention has been completed based on this finding. The present invention provides an inkjet ink as described below, a cured film obtained from the inkjet ink, a method for forming the same, and the like.
本發明包含以下的項。The present invention encompasses the following items.
[1]一種噴墨用墨水,其含有以下述通式(1)所表示的重量平均分子量為1,000~8,000的樹脂(A):[1] An ink for inkjet comprising a resin (A) having a weight average molecular weight of 1,000 to 8,000 represented by the following general formula (1):
(於式(1)中,X為源自自由基聚合性單體的構成單元,m為大於等於1的整數,n為0~100的數)。(In the formula (1), X is a constituent unit derived from a radical polymerizable monomer, m is an integer of 1 or more, and n is a number of 0 to 100).
[2]如項[1]所述之噴墨用墨水,其中於樹脂(A)中,n為0。[2] The ink for inkjet according to [1], wherein n is 0 in the resin (A).
[3]如項[1]至[2]中任一項所述之噴墨用墨水,其中樹脂(A)的重量平均分子量為1,600~6,000。[3] The inkjet ink according to any one of [1] to [2] wherein the resin (A) has a weight average molecular weight of 1,600 to 6,000.
[4]如項[1]至[3]中任一項所述之噴墨用墨水,其中進而含有:具有大於等於1個羧基的單體或低聚物(B)、稀釋劑(C)、及光聚合起始劑(D)。[4] The inkjet ink according to any one of [1] to [3] further comprising: a monomer or oligomer (B) having a carboxyl group of at least one or more, and a diluent (C) And photopolymerization initiator (D).
[5]如項[4]所述之噴墨用墨水,其中樹脂(A)的含量為0.5 wt%~20 wt%。[5] The ink for inkjet according to [4], wherein the content of the resin (A) is from 0.5 wt% to 20 wt%.
[6]如項[4]或[5]所述之噴墨用墨水,其中具有大於等於1個羧基的單體或低聚物(B)為單官能(甲基)丙烯酸酯或多官能(甲基)丙烯酸酯。[6] The inkjet ink according to [4] or [5] wherein the monomer or oligomer (B) having one or more carboxyl groups is a monofunctional (meth) acrylate or polyfunctional ( Methyl) acrylate.
[7]如項[4]至[6]中任一項所述之噴墨用墨水,其中具有大於等於1個羧基的單體或低聚物(B)為酸改質環氧(甲基)丙烯酸酯。[7] The ink for inkjet according to any one of [4] to [6] wherein the monomer or oligomer (B) having one or more carboxyl groups is an acid-modified epoxy (methyl) )Acrylate.
[8]如項[4]至[7]中任一項所述之噴墨用墨水,其中具有大於等於1個羧基的單體或低聚物(B)為重量平均分子量為300~12,000的酸改質環氧丙烯酸酯。[8] The ink for inkjet according to any one of [4], wherein the monomer or oligomer (B) having one or more carboxyl groups is a weight average molecular weight of 300 to 12,000. Acid modified epoxy acrylate.
[9]如項[4]至[8]中任一項所述之噴墨用墨水,其中具有大於等於1個羧基的單體或低聚物(B)為雙酚F型酸改質環氧丙烯酸酯。[9] The ink for inkjet according to any one of [4] to [8] wherein the monomer or oligomer (B) having one or more carboxyl groups is a bisphenol F type acid modified ring. Oxy acrylate.
[10]如項[4]至[9]中任一項所述之噴墨用墨水,其中稀釋劑(C)於25℃下的黏度為0.1 mPa.s~100 mPa.s。[10] The ink for inkjet according to any one of [4] to [9] wherein the diluent (C) has a viscosity of 0.1 mPa at 25 ° C. s~100 mPa. s.
[11]如項[4]至[10]中任一項所述之噴墨用墨水,其中稀釋劑(C)為不含羧基的單官能(甲基)丙烯酸酯或多官能(甲基)丙烯酸酯。[11] The ink for inkjet according to any one of [4] to [10] wherein the diluent (C) is a monofunctional (meth) acrylate or polyfunctional (methyl) having no carboxyl group. Acrylate.
[12]如項[4]至[11]中任一項所述之噴墨用墨水,其中稀釋劑(C)為以通式(2)所表示的不含羧基的單官能(甲基)丙烯酸酯:[12] The ink for inkjet according to any one of [4], wherein the diluent (C) is a monofunctional (methyl) group having no carboxyl group represented by the formula (2). Acrylate:
(於通式(2)中,R1為氫或碳數為1~3的烷基,R2為可具有環狀結構的碳數為1~12的亞烷基,n為1~30的整數)。(In the formula (2), R 1 is hydrogen or an alkyl group having 1 to 3 carbon atoms, and R 2 is an alkylene group having 1 to 12 carbon atoms which may have a cyclic structure, and n is 1 to 30. Integer).
[13]如項[4]至[12]中任一項所述之噴墨用墨水,其中樹脂(A)為重量平均分子量為4,000~6,000的聚乙烯苯酚,具有大於等於1個羧基的單體或低聚物(B)為重量平均分子量為500~11,000的雙酚F型酸改質環氧丙烯酸酯,稀釋劑(C)為(甲基)丙烯酸-2-羥基乙酯,光聚合起始劑(D)為2,4,6-三甲基苯甲醯基二苯基氧化膦。[13] The ink for inkjet according to any one of [4], wherein the resin (A) is a polyvinylphenol having a weight average molecular weight of 4,000 to 6,000, and has a single or more carboxyl group. The bulk or oligomer (B) is a bisphenol F type acid modified epoxy acrylate having a weight average molecular weight of 500 to 11,000, and the diluent (C) is 2-hydroxyethyl (meth)acrylate, which is photopolymerized. The starting agent (D) is 2,4,6-trimethylbenzimidyldiphenylphosphine oxide.
[14]如項[1]至[13]中任一項所述之噴墨用墨水,其於25℃下的黏度為2 mPa.s~200 mPa.s。[14] The ink for inkjet according to any one of [1] to [13] which has a viscosity at 25 ° C of 2 mPa. s~200 mPa. s.
[15]一種硬化膜形成方法,其是藉由噴墨方式將如項[1]至[14]中任一項所述之噴墨用墨水塗佈於基板上,並對所塗佈的墨水照射光,藉此形成硬化膜。[15] A method of forming a cured film by applying an inkjet ink according to any one of [1] to [14] onto a substrate by an inkjet method, and coating the applied ink Light is irradiated, thereby forming a cured film.
[16]一種硬化膜,其是由如項[1]至[14]中任一項所述之噴墨用墨水所得。[16] A cured film obtained by the inkjet ink according to any one of [1] to [14].
[17]如項[16]所述之硬化膜,其形成為圖案狀。[17] The cured film according to [16], which is formed in a pattern shape.
[18]一種基板的製造方法,其包含:形成使用如項[17]所述之硬化膜的抗蝕膜或抗鍍敷膜的步驟;其後的蝕刻步驟或鍍敷步驟;以及其後的剝離上述膜的步驟。[18] A method of producing a substrate, comprising: a step of forming a resist film or a plating resist film using the cured film according to [17]; an etching step or a plating step thereafter; and thereafter The step of peeling off the above film.
[19]一種電子零件,其具有藉由如項[18]所述之方法所得的基板。[19] An electronic component having a substrate obtained by the method according to [18].
[20]一種顯示元件,其具有如項[19]所述之電子零件。[20] A display element having the electronic component according to [19].
另外,於本說明書中,為了表示丙烯酸酯與甲基丙烯酸酯兩者,有以「(甲基)丙烯酸酯」的方式進行標記的情況。In addition, in the present specification, in order to show both an acrylate and a methacrylate, it is a case where it is labeled with "(meth)acrylate.
根據本發明的較好態樣的噴墨用墨水,可提供一種墨水的噴出性、膜的硬化性、耐蝕刻性、及耐鍍敷性優異的可進行鹼性剝離的噴墨用墨水。According to a preferred embodiment of the inkjet ink of the present invention, it is possible to provide an inkjet ink which can be subjected to alkaline peeling, which is excellent in ink discharge property, film curability, etching resistance, and plating resistance.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
1.發明的噴墨用墨水1. Invented inkjet ink
本發明的噴墨用墨水若含有以通式(1)所表示的重量平均分子量為1,000~8,000的樹脂(A),則並無特別限制。進而,亦可視需要含有具有大於等於1個羧基的單體或低聚物(B)、稀釋劑(C)、及光聚合起始劑(D)。本發明的噴墨用墨水可為無色,亦可為有色。The inkjet ink of the present invention is not particularly limited as long as it contains the resin (A) having a weight average molecular weight of 1,000 to 8,000 represented by the formula (1). Further, a monomer or oligomer (B) having at least one carboxyl group, a diluent (C), and a photopolymerization initiator (D) may be contained as needed. The ink for inkjet of the present invention may be colorless or colored.
本發明的噴墨用墨水除了上述成分以外,亦可視需要進而含有環氧樹脂、界面活性劑、著色劑、聚合抑制劑等。The inkjet ink of the present invention may further contain an epoxy resin, a surfactant, a colorant, a polymerization inhibitor, or the like, in addition to the above components.
此處,本說明書中的重量平均分子量是使用Polymer Laboratories製造的THF系管柱作為管柱,藉由GPC(gel permeation chromatography,凝膠滲透層析)法(管柱溫度:35℃、流速:1 ml/min)所求出的以聚苯乙烯換算的值。另外,本說明書中的市售品的重量平均分子量為目錄刊登值。Here, the weight average molecular weight in the present specification is a THF-based column manufactured by Polymer Laboratories as a column by GPC (gel permeation chromatography) method (column temperature: 35 ° C, flow rate: 1) The value obtained in polystyrene obtained by ml/min). In addition, the weight average molecular weight of the commercial item in this specification is a catalogue value.
1.1樹脂(A)1.1 Resin (A)
本發明的噴墨用墨水含有以上述式(1)所表示的樹脂(A)。樹脂(A)為由含有乙烯苯酚的單體所得的聚合物,且為OH相對於主鏈成為對位、鄰位或間位的聚乙烯苯酚系聚合物。The inkjet ink of the present invention contains the resin (A) represented by the above formula (1). The resin (A) is a polymer obtained from a monomer containing a vinyl phenol, and is a polyvinylphenol-based polymer in which OH is in a para, ortho or meta position with respect to the main chain.
式中,X為源自自由基聚合性單體的構成單元,m為大於等於1的整數,n為0~100的數。m大於等於2時,式(1)的[ ]內的構成單元的重複單元可為相同結構,亦可為不同結構。即可為n的數不同的結構的重複,亦可為n的數相同的結構的重複。n較好的是0~10,更好的是0~5,特別好的是n=0。In the formula, X is a constituent unit derived from a radical polymerizable monomer, m is an integer of 1 or more, and n is a number of 0 to 100. When m is 2 or more, the repeating unit of the constituent unit in [ ] of the formula (1) may have the same structure or may have a different structure. It can be a repetition of a number of different structures of n, or a repetition of a structure of the same number of n. n is preferably 0 to 10, more preferably 0 to 5, and particularly preferably n = 0.
於本發明中,作為用作X的原料的自由基聚合性單體,並無限制,可使用各種具有聚合性不飽和鍵的化合物。例如可列舉:苯乙烯、α-甲基苯乙烯等苯乙烯系單體,(甲基)丙烯腈,(甲基)丙烯酸,(甲基)丙烯酸甲酯等(甲基)丙烯酸酯,丙烯醯胺等丙烯酸系單體,乙基乙烯醚等乙烯醚類,馬來酸酐,乙酸乙烯酯,乙烯基吡啶。In the present invention, the radical polymerizable monomer used as a raw material of X is not limited, and various compounds having a polymerizable unsaturated bond can be used. Examples thereof include styrene monomers such as styrene and α-methylstyrene, (meth)acrylonitrile, (meth)acrylic acid, (meth)acrylic acid ester (meth)acrylate, and the like. An acrylic monomer such as an amine, a vinyl ether such as ethyl vinyl ether, maleic anhydride, vinyl acetate or vinyl pyridine.
上述聚乙烯苯酚系聚合物可通過商業方式獲得。例如可列舉:丸善石油化學製造的Maruka Lyncur M(聚-對乙烯苯酚)、Maruka Lyncur CMM(對乙烯苯酚/甲基丙烯酸甲酯共聚物)、Maruka Lyncur CHM(對乙烯苯酚/甲基丙烯酸-2-羥基乙酯共聚物)、Maruka Lyncur CST(對乙烯苯酚/苯乙烯共聚物)。另外,樹脂(A)亦可混合使用大於等於2種。The above polyvinylphenol-based polymer can be obtained commercially. For example, Maruka Lyncur M (poly-p-vinylphenol) manufactured by Maruzen Petrochemical, Maruka Lyncur CMM (p-vinylphenol/methyl methacrylate copolymer), Maruka Lyncur CHM (p-vinylphenol/methacrylic acid-2) - hydroxyethyl ester copolymer), Maruka Lyncur CST (p-vinylphenol/styrene copolymer). Further, the resin (A) may be used in combination of two or more.
本發明的樹脂(A)的以聚苯乙烯換算的重量平均分子量較好的是1,000~8,000,更好的是1,600~6,000,進而好的是4,000~6,000。若為該範圍,則膜的硬化性良好,耐蝕刻性或耐鍍敷性等膜特性優異,噴射特性亦良好。另外,所得的硬化膜對鹼的溶解性亦良好。The polystyrene-equivalent weight average molecular weight of the resin (A) of the present invention is preferably from 1,000 to 8,000, more preferably from 1,600 to 6,000, and still more preferably from 4,000 to 6,000. When it is this range, the film has good hardenability, and is excellent in film characteristics, such as etching resistance and plating resistance, and is excellent in ejection characteristics. Further, the obtained cured film also has good solubility in alkali.
樹脂(A)的含量若為噴墨用墨水固體成分的0.1 wt%~50 wt%,則耐蝕刻性或耐鍍敷性與鹼性剝離性及噴射特性的平衡變好,故較好,更好的是0.5 wt%~20 wt%,進而好的是0.5 wt%~10 wt%,特別好的是1 wt%~10 wt%。When the content of the resin (A) is from 0.1 wt% to 50 wt% of the solid content of the ink for inkjet, the balance between the etching resistance and the plating resistance, the alkaline peelability, and the ejection property is improved, so that it is preferable. Preferably, it is 0.5 wt% to 20 wt%, and further preferably 0.5 wt% to 10 wt%, particularly preferably 1 wt% to 10 wt%.
1.2具有大於等於1個羧基的單體或低聚物(B)1.2 A monomer or oligomer having one or more carboxyl groups (B)
為了提高鹼性剝離性,本發明的噴墨用墨水可含有具有羧基的單體或低聚物(B)。此處,「具有羧基的低聚物」為大於等於2個單體鍵結而成的聚合性化合物中,具有大於等於至少1個羧基的化合物。In order to improve the alkali peelability, the inkjet ink of the present invention may contain a monomer or oligomer (B) having a carboxyl group. Here, the "oligomer having a carboxyl group" is a compound having at least one carboxyl group or more among the polymerizable compounds in which two or more monomers are bonded.
具有羧基的單體或低聚物(B)若具有羧基,則並無特別限定,例如耐蝕刻性或耐鍍敷性優異,同時為了進一步提高鹼性剝離性,較好的是酸改質環氧(甲基)丙烯酸酯。The monomer having a carboxyl group or the oligomer (B) is not particularly limited as long as it has a carboxyl group. For example, it is excellent in etching resistance and plating resistance, and in order to further improve alkali peelability, an acid modified ring is preferred. Oxy (meth) acrylate.
本發明的酸改質環氧(甲基)丙烯酸酯是於1分子中具有大於等於2個聚合性雙鍵及大於等於1個羧基的化合物。此處,所謂聚合性雙鍵,是指可進行聚合的碳-碳雙鍵。具有聚合性雙鍵的基團例如可列舉:丙烯醯基、甲基丙烯醯基、烯丙基、乙烯基、或馬來醯亞胺基。聚合性雙鍵可為熱聚合性,亦可為光聚合性,較好的是具有光聚合性的雙鍵。The acid-modified epoxy (meth) acrylate of the present invention is a compound having two or more polymerizable double bonds and one or more carboxyl groups in one molecule. Here, the polymerizable double bond means a carbon-carbon double bond which can be polymerized. Examples of the group having a polymerizable double bond include an acryloyl group, a methacryl group, an allyl group, a vinyl group, or a maleimine group. The polymerizable double bond may be thermally polymerizable or photopolymerizable, and is preferably a photopolymerizable double bond.
酸改質環氧(甲基)丙烯酸酯的以聚苯乙烯換算的重量平均分子量較好的是300~12,000,更好的是500~11,500,進而好的是900~11,000,尤其好的是900~8,000,特別好的是900~6,000。若為該範圍,則耐蝕刻性或耐鍍敷性等膜特性優異,噴射特性亦良好。另外,所得的硬化膜對鹼的溶解性亦良好。The polystyrene-equivalent weight average molecular weight of the acid-modified epoxy (meth) acrylate is preferably from 300 to 12,000, more preferably from 500 to 11,500, and further preferably from 900 to 11,000, particularly preferably 900. ~8,000, especially good is 900~6,000. When it is this range, film characteristics, such as etching resistance and plating resistance, are excellent, and injection characteristics are also favorable. Further, the obtained cured film also has good solubility in alkali.
酸改質環氧(甲基)丙烯酸酯的具體例可列舉:使具有羧基的(甲基)丙烯酸酯及(甲基)丙烯酸與環氧化合物反應,再使反應所得的環氧(甲基)丙烯酸酯與多元酸或多元酸酐反應而得的物質。Specific examples of the acid-modified epoxy (meth) acrylate include an epoxy group obtained by reacting a (meth) acrylate having a carboxyl group and (meth) acrylic acid with an epoxy compound, and then reacting the epoxy group. A substance obtained by reacting an acrylate with a polybasic acid or a polybasic acid anhydride.
環氧化合物可列舉:苯酚酚醛清漆型、甲酚酚醛清漆型、雙酚A型、雙酚F型、雙酚S型、三苯酚甲烷型、四苯酚乙烷型環氧樹脂等。其中較好的是苯酚酚醛清漆型、甲酚酚醛清漆型、雙酚A型、雙酚F型,進而好的是雙酚A型、雙酚F型,就耐鍍敷性方面而言,特別好的是雙酚F型。Examples of the epoxy compound include a phenol novolak type, a cresol novolak type, a bisphenol A type, a bisphenol F type, a bisphenol S type, a trisphenol methane type, and a tetraphenol ethane type epoxy resin. Among them, preferred are phenol novolak type, cresol novolac type, bisphenol A type, and bisphenol F type, and further preferably bisphenol A type and bisphenol F type, in terms of plating resistance, special Good is bisphenol F type.
具有羧基的(甲基)丙烯酸酯及(甲基)丙烯酸例如可列舉:(甲基)丙烯酸、β-羧基(甲基)丙烯酸乙酯、ω-羧基聚己內酯單(甲基)丙烯酸酯、琥珀酸單[2-(甲基)丙烯醯氧基乙基]酯、馬來酸單[2-(甲基)丙烯醯氧基乙基]酯、鄰苯二甲酸酐與(甲基)丙烯酸羥基乙酯的反應物(例如鄰苯二甲酸單(甲基丙烯酸羥基乙酯))、或六氫鄰苯二甲酸酐與(甲基)丙烯酸羥基乙酯的反應物。Examples of the (meth) acrylate having a carboxyl group and (meth)acrylic acid include (meth)acrylic acid, β-carboxyethyl (meth)acrylate, and ω-carboxypolycaprolactone mono(meth)acrylate. , succinic acid mono [2-(methyl) propylene methoxyethyl] ester, maleic acid mono [2-(methyl) propylene methoxyethyl] ester, phthalic anhydride and (methyl) A reactant of hydroxyethyl acrylate (e.g., phthalic acid mono(hydroxyethyl methacrylate)) or a reaction of hexahydrophthalic anhydride with hydroxyethyl (meth)acrylate.
多元酸或多元酸酐例如可列舉:鄰苯二甲酸、均苯四甲酸、琥珀酸、偏苯三甲酸、四氫鄰苯二甲酸、六氫鄰苯二甲酸、馬來酸、衣康酸(itaconic acid)、檸康酸(citraconic acid)、甲基六氫鄰苯二甲酸、六氫偏苯三甲酸、內亞甲基四氫鄰苯二甲酸、甲基內亞甲基四氫鄰苯二甲酸或苯乙烯-馬來酸共聚物等多元酸;鄰苯二甲酸酐、均苯四甲酸酐、琥珀酸酐、偏苯三甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、馬來酸酐、衣康酸酐、檸康酸酐、甲基六氫鄰苯二甲酸酐、六氫偏苯三甲酸酐、偏苯三甲酸酐、內亞甲基四氫鄰苯二甲酸酐、甲基內亞甲基四氫鄰苯二甲酸酐或苯乙烯-馬來酸酐共聚物等多元酸酐。Examples of the polybasic acid or polybasic acid anhydride include phthalic acid, pyromellitic acid, succinic acid, trimellitic acid, tetrahydrophthalic acid, hexahydrophthalic acid, maleic acid, and itaconic acid (itaconic). Acid), citraconic acid, methylhexahydrophthalic acid, hexahydrotrimellitic acid, endomethylenetetrahydrophthalic acid, methyl endomethylenetetrahydrophthalic acid Or a polybasic acid such as a styrene-maleic acid copolymer; phthalic anhydride, pyromellitic anhydride, succinic anhydride, trimellitic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, horse Anhydride, itaconic anhydride, citraconic anhydride, methylhexahydrophthalic anhydride, hexahydrotrimellitic anhydride, trimellitic anhydride, endomethylenetetrahydrophthalic anhydride, methylene A polybasic anhydride such as a tetrahydrophthalic anhydride or a styrene-maleic anhydride copolymer.
本發明中所使用的環氧化合物、具有羧基的(甲基)丙烯酸酯、多元酸或多元酸酐可為1種化合物,亦可為大於等於2種化合物的混合物。The epoxy compound, the (meth) acrylate having a carboxyl group, the polybasic acid or the polybasic acid anhydride used in the present invention may be one compound or a mixture of two or more compounds.
酸改質環氧(甲基)丙烯酸酯的市售品可列舉:日本化藥股份有限公司製造的KAYARAD CCR-1159H(分子量:7500、酸值:101 mgKOH/g)、KAYARAD CCR-1285H(酸值:82 mgKOH/g)、KAYARAD ZFR-1401H(分子量:12000、酸值:99 mgKOH/g)、KAYARAD ZFR-1491H(酸值:100 mgKOH/g)、KAYARAD ZFR-1492H(酸值:102 mgKOH/g)、KAYARAD TCR-1310H(分子量:4500、酸值:104 mgKOH/g);Japan U-pica股份有限公司製造的NEOPOL 8430(分子量:10000、酸值:88 mgKOH/g)、NEOPOL 8432(分子量:8000、酸值:92 mgKOH/g)、NEOPOL 8470(分子量:10000、酸值:100 mgKOH/g)、NEOPOL 8472(分子量:7000、酸值:105 mgKOH/g)、NEOPOL 8475(分子量:10000、酸值:101 mgKOH/g)、NEOPOL 8476(分子量:5000、酸值:101 mgKOH/g)、NEOPOL 8477(分子量:10000、酸值:94 mgKOH/g)、NEOPOL 8371、NEOPOL 8316、NEOPOL 8317、NEOPOL 8310(分子量:1000、酸值:104 mgKOH/g)等。另外,本段落中的「分子量」表示重量平均分子量。Commercially available products of the acid-modified epoxy (meth) acrylate include KAYARAD CCR-1159H (molecular weight: 7,500, acid value: 101 mgKOH/g) manufactured by Nippon Kayaku Co., Ltd., KAYARAD CCR-1285H (acid Value: 82 mgKOH/g), KAYARAD ZFR-1401H (molecular weight: 12,000, acid value: 99 mgKOH/g), KAYARAD ZFR-1491H (acid value: 100 mgKOH/g), KAYARAD ZFR-1492H (acid value: 102 mgKOH) /g), KAYARAD TCR-1310H (molecular weight: 4500, acid value: 104 mgKOH/g); NEOPOL 8430 (molecular weight: 10000, acid value: 88 mgKOH/g) manufactured by Japan U-pica Co., Ltd., NEOPOL 8432 ( Molecular weight: 8000, acid value: 92 mgKOH/g), NEOPOL 8470 (molecular weight: 10000, acid value: 100 mgKOH/g), NEOPOL 8472 (molecular weight: 7000, acid value: 105 mgKOH/g), NEOPOL 8475 (molecular weight: 10000, acid value: 101 mgKOH/g), NEOPOL 8476 (molecular weight: 5000, acid value: 101 mgKOH/g), NEOPOL 8477 (molecular weight: 10000, acid value: 94 mgKOH/g), NEOPOL 8371, NEOPOL 8316, NEOPOL 8317, NEOPOL 8310 (molecular weight: 1000, acid value: 104 mgKOH/g), and the like. In addition, "molecular weight" in this paragraph means a weight average molecular weight.
其他具有羧基的單體或低聚物(B)可列舉以下物質。Other monomers or oligomers (B) having a carboxyl group include the following.
具有羧基的單體可列舉:(甲基)丙烯酸、(甲基)丙烯酸二聚物、丁烯酸、α-氯丙烯酸、肉桂酸、馬來酸、富馬酸、衣康酸、檸康酸、甲基反丁烯二酸(mesaconic acid)、β-羧基(甲基)丙烯酸乙酯、ω-羧基聚己內酯單(甲基)丙烯酸酯、琥珀酸單[2-(甲基)丙烯醯氧基乙基]酯、馬來酸單[2-(甲基)丙烯醯氧基乙基]酯、鄰苯二甲酸酐與(甲基)丙烯酸羥基乙酯的反應物(例如鄰苯二甲酸單(甲基丙烯酸羥基乙酯))、或六氫鄰苯二甲酸酐與(甲基)丙烯酸羥基乙酯的反應物。Examples of the monomer having a carboxyl group include (meth)acrylic acid, (meth)acrylic acid dimer, crotonic acid, α-chloroacrylic acid, cinnamic acid, maleic acid, fumaric acid, itaconic acid, and citraconic acid. , mesaconic acid, β-carboxyethyl (meth) acrylate, ω-carboxy polycaprolactone mono (meth) acrylate, succinic acid mono [2-(methyl) propylene a reaction of a methoxyethyl]ester, a mono[2-(methyl) propylene methoxyethyl] maleate, a phthalic anhydride with a hydroxyethyl (meth) acrylate (eg, phthalic acid) A reaction product of formic acid mono(hydroxyethyl methacrylate) or hexahydrophthalic anhydride with hydroxyethyl (meth)acrylate.
具有羧基的單體或低聚物(B)的含量若為噴墨用墨水固體成分的1 wt%~70 wt%,則耐蝕刻性或耐鍍敷性與鹼性剝離性及噴射特性的平衡變好,故較好,更好的是2 wt%~65 wt%,進而好的是3 wt%~60 wt%,特別好的是4 wt%~55 wt%。When the content of the monomer having a carboxyl group or the oligomer (B) is from 1 wt% to 70 wt% of the solid content of the ink for inkjet, the etching resistance or plating resistance is balanced with the alkali peelability and the ejection property. It is better, so it is better, more preferably 2 wt% ~ 65 wt%, and further preferably 3 wt% ~ 60 wt%, particularly preferably 4 wt% ~ 55 wt%.
具有羧基的單體或低聚物(B)可為1種化合物,亦可為大於等於2種不同化合物的混合物。The monomer or oligomer (B) having a carboxyl group may be one compound or a mixture of two or more different compounds.
1.3稀釋劑(C)1.3 thinner (C)
為了提高各種特性,本發明的噴墨用墨水可含有稀釋劑(C)。本發明的稀釋劑(C)並無特別限定,較好的是於25℃下的黏度為0.1 mPa.s~100 mPa.s,可列舉具有自由基聚合性的單體或溶劑。作為具有自由基聚合性的單體,較好的是不含羧基的單官能(甲基)丙烯酸酯或多單官能(甲基)丙烯酸酯,更好的是以上述通式(2)所表示的單官能(甲基)丙烯酸酯。In order to improve various characteristics, the ink for inkjet of the present invention may contain a diluent (C). The diluent (C) of the present invention is not particularly limited, and it is preferred that the viscosity at 25 ° C is 0.1 mPa. s~100 mPa. The s may be a monomer or a solvent having a radical polymerizable property. As the monomer having a radical polymerizable property, a monofunctional (meth) acrylate or a polymonofunctional (meth) acrylate having no carboxyl group is preferred, and it is more preferably represented by the above formula (2). Monofunctional (meth) acrylate.
1.3(1)單官能聚合性單體1.3(1) Monofunctional polymerizable monomer
具有自由基聚合性的化合物若為單官能聚合性單體,則由於噴射性良好,故特別好。When the compound having a radical polymerizable property is a monofunctional polymerizable monomer, it is particularly preferable because it has good sprayability.
關於單官能聚合性單體的具體例,通式(2)的化合物可列舉:(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、(甲基)丙烯酸-4-羥基丁酯;其他化合物可列舉:1,4-環己烷二甲醇單(甲基)丙烯酸酯、N-羥基乙基(甲基)丙烯醯胺、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸-3,4-環氧環己酯、(甲基)丙烯酸甲基縮水甘油酯、3-甲基-3-(甲基)丙烯醯氧基甲基氧雜環丁烷、3-乙基-3-(甲基)丙烯醯氧基甲基氧雜環丁烷、3-甲基-3-(甲基)丙烯醯氧基乙基氧雜環丁烷、3-乙基-3-(甲基)丙烯醯氧基乙基氧雜環丁烷、對乙烯基苯基-3-乙基氧雜環丁烷-3-基甲基醚、2-苯基-3-(甲基)丙烯醯氧基甲基氧雜環丁烷、2-三氟甲基-3-(甲基)丙烯醯氧基甲基氧雜環丁烷、4-三氟甲基-2-(甲基)丙烯醯氧基甲基氧雜環丁烷、(甲基)丙烯酸、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯、苯乙烯、甲基苯乙烯、氯甲基苯乙烯、(甲基)丙烯酸(3-乙基-3-氧雜環丁基)甲酯、N-環己基馬來醯亞胺、N-苯基馬來醯亞胺、乙烯基甲苯、(甲基)丙烯酸三環[5.2.1.02,6]癸酯、(甲基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸異冰片酯、(甲基)丙烯酸苯酯、甘油單(甲基)丙烯酸酯、聚苯乙烯巨單體(macromonomer)、聚甲基丙烯酸甲酯巨單體、(甲基)丙烯酸-5-四氫糠氧基羰基戊酯、月桂醇的環氧乙烷加成物的(甲基)丙烯酸酯、(甲基)丙烯酸、丁烯酸、α-氯丙烯酸、肉桂酸、馬來酸、富馬酸、衣康酸、檸康酸、甲基反丁烯二酸、ω-羧基聚己內酯單(甲基)丙烯酸酯、琥珀酸單[2-(甲基)丙烯醯氧基乙基]酯、馬來酸單[2-(甲基)丙烯醯氧基乙基]酯、環己烯-3,4-二甲酸單[2-(甲基)丙烯醯氧基乙基]酯、(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N,N-二甲基胺基丙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-丙烯醯基嗎啉、N-苯基馬來醯亞胺、N-環己基馬來醯亞胺。Specific examples of the monofunctional polymerizable monomer include a compound of the formula (2): 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and (meth)acrylic acid. -4-hydroxybutyl ester; other compounds may be exemplified by 1,4-cyclohexanedimethanol mono(meth)acrylate, N-hydroxyethyl(meth)acrylamide, glycidyl (meth)acrylate , (meth)acrylic acid-3,4-epoxycyclohexyl ester, methyl glycidyl (meth)acrylate, 3-methyl-3-(methyl)propenyloxymethyloxetane , 3-ethyl-3-(methyl)propenyloxymethyloxetane, 3-methyl-3-(methyl)propenyloxyethyloxetane, 3-B 3-(methyl)propenyloxyethyloxetane, p-vinylphenyl-3-ethyloxetan-3-ylmethylether, 2-phenyl-3- (Meth) propylene methoxymethyl oxetane, 2-trifluoromethyl-3-(methyl) propylene methoxymethyl oxetane, 4-trifluoromethyl-2- (Meth) propylene methoxymethyl oxetane, (meth)acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, (methyl ) Butyl olefinate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, styrene, methylstyrene, chlorine Methylstyrene, (3-ethyl-3-oxetanyl)methyl (meth)acrylate, N-cyclohexylmaleimide, N-phenylmaleimide, vinyl toluene , (meth) acrylate, tricyclo [5.2.1.0 2,6] decyl (meth) acrylate, dicyclopentenyloxyethyl acrylate, (meth) acrylate, (meth) acrylate, phenyl Glycerol mono (meth) acrylate, polystyrene macromonomer, polymethyl methacrylate macromonomer, (meth)acrylic acid-5-tetrahydrofurfuryloxycarbonylpentyl ester, lauryl alcohol ring Oxyethane adducts of (meth) acrylate, (meth) acrylate, crotonic acid, α-chloroacrylic acid, cinnamic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, methyl Fumaric acid, ω-carboxypolycaprolactone mono(meth)acrylate, succinic acid mono[2-(methyl)propenyloxyethyl]ester, maleic acid mono[2-(methyl ) propylene methoxyethyl] ester, cyclohexene-3,4-dicarboxylic acid mono [2-(methyl) propylene Oxyethyl]ester, (meth) acrylamide, N,N-dimethyl(meth) acrylamide, N,N-diethyl(meth) decylamine, N,N-di Methylaminopropyl (meth) acrylamide, N-isopropyl (meth) acrylamide, N-propenyl morpholine, N-phenyl maleimide, N-cyclohexyl Come to imine.
這些單官能聚合性單體可為1種化合物,亦可為大於等於2種不同化合物的混合物。These monofunctional polymerizable monomers may be one type of compound or a mixture of two or more different compounds.
其中,例如若為(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、(甲基)丙烯酸-4-羥基丁酯、1,4-環己烷二甲醇單(甲基)丙烯酸酯等,則由於可提高墨水的相容性、墨水固體成分的溶解性,進而墨水噴附至基板後的液體的擴散較小而可實現高精細化,因此更好。Wherein, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 1,4-cyclohexanedimethanol In the case of a single (meth) acrylate or the like, the compatibility of the ink and the solubility of the solid content of the ink can be improved, and the diffusion of the liquid after the ink is sprayed onto the substrate is small, so that high definition can be achieved, which is preferable.
這些具有羥基的單官能聚合性單體可為1種化合物,亦可為大於等於2種不同化合物的混合物。These monofunctional polymerizable monomers having a hydroxyl group may be one type of compound or a mixture of two or more different compounds.
作為稀釋劑(C)的單官能聚合性單體的含量若為噴墨用墨水總量的1 wt%~70 wt%,則可調整為符合所使用的用途的黏度,故較好,若考慮到與其他特性的平衡,則更好的是2 wt%~65 wt%,進而好的是3 wt%~60 wt%,特別好的是4 wt%~55 wt%。When the content of the monofunctional polymerizable monomer as the diluent (C) is from 1 wt% to 70 wt% of the total amount of the ink for inkjet, it can be adjusted to conform to the viscosity of the use to be used, so it is preferable if considering To the balance with other characteristics, it is better from 2 wt% to 65 wt%, and further preferably from 3 wt% to 60 wt%, particularly preferably from 4 wt% to 55 wt%.
1.3(2)多官能聚合性單體1.3(2) Polyfunctional polymerizable monomer
稀釋劑(C)亦可為多官能聚合性單體。The diluent (C) may also be a polyfunctional polymerizable monomer.
多官能聚合性單體的具體例可列舉:雙酚F環氧乙烷改質二丙烯酸酯、雙酚A環氧乙烷改質二丙烯酸酯、異三聚氰酸環氧乙烷改質二丙烯酸酯、聚乙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、季戊四醇二丙烯酸酯、季戊四醇二丙烯酸酯單硬脂酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、1,9-壬二醇二丙烯酸酯、1,4-環己烷二甲醇二丙烯酸酯、2-正丁基-2-乙基-1,3-丙二醇二丙烯酸酯、三羥甲基丙烷二丙烯酸酯、二季戊四醇二丙烯酸酯、改質異三聚氰酸環氧乙烷改質二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯單硬脂酸酯、季戊四醇三(甲基)丙烯酸酯、三羥甲基丙烷二(甲基)丙烯酸酯、二季戊四醇二(甲基)丙烯酸酯、二季戊四醇三(甲基)丙烯酸酯、二季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、雙酚F環氧乙烷改質二丙烯酸酯、雙酚A環氧乙烷改質二丙烯酸酯、聚乙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、1,9-壬二醇二丙烯酸酯、1,4-環己烷二甲醇二丙烯酸酯、2-正丁基-2-乙基-1,3-丙二醇二丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、環氧乙烷改質三羥甲基丙烷三(甲基)丙烯酸酯、環氧丙烷改質三羥甲基丙烷三(甲基)丙烯酸酯、表氯醇(epichlorohydrin)改質三羥甲基丙烷三(甲基)丙烯酸酯、二(三羥甲基丙烷)四(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、表氯醇改質甘油三(甲基)丙烯酸酯、二甘油四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、己內酯改質二季戊四醇六(甲基)丙烯酸酯、環氧乙烷改質磷酸三(甲基)丙烯酸酯、三[(甲基)丙烯醯氧基乙基]異三聚氰酸酯、己內酯改質三[(甲基)丙烯醯氧基乙基]異三聚氰酸酯、(甲基)丙烯酸胺基甲酸酯。Specific examples of the polyfunctional polymerizable monomer include bisphenol F ethylene oxide modified diacrylate, bisphenol A ethylene oxide modified diacrylate, and isomeric cyanuric acid ethylene oxide modified Acrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, pentaerythritol diacrylate, pentaerythritol diacrylate monostearate, 1,4-butanediol diacrylate, 1,6-hexanediol Diacrylate, 1,9-nonanediol diacrylate, 1,4-cyclohexanedimethanol diacrylate, 2-n-butyl-2-ethyl-1,3-propanediol diacrylate, trihydroxyl Methyl propane diacrylate, dipentaerythritol diacrylate, modified iso-cyanuric acid ethylene oxide modified di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol di(meth)acrylic acid Ester monostearate, pentaerythritol tri(meth)acrylate, trimethylolpropane di(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, two Pentaerythritol tetra(meth) acrylate, dipentaerythritol penta (meth) acrylate, bisphenol F oxirane Diacrylate, bisphenol A ethylene oxide modified diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol Acrylate, 1,9-nonanediol diacrylate, 1,4-cyclohexanedimethanol diacrylate, 2-n-butyl-2-ethyl-1,3-propanediol diacrylate, trishydroxyl Propane tri(meth)acrylate, ethylene oxide modified trimethylolpropane tri(meth)acrylate, propylene oxide modified trimethylolpropane tri(meth)acrylate, epichlorohydrin (epichlorohydrin) modified trimethylolpropane tri (meth) acrylate, di (trimethylolpropane) tetra (meth) acrylate, glycerol tri (meth) acrylate, epichlorohydrin modified glycerol (Meth) acrylate, diglycerin tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, caprolactone modified dipentaerythritol hexa (meth) acrylate Ethylene oxide modified tris(meth)acrylate, tris[(meth)propenyloxyethyl]isocyanate, caprolactone modified tris[(methyl)propene oxime Base B ] Iso cyanurate, (meth) acrylate, urethane.
這些多官能聚合性單體可為1種化合物,亦可為大於等於2種不同化合物的混合物。These polyfunctional polymerizable monomers may be one type of compound or a mixture of two or more different compounds.
作為稀釋劑(C)的多官能聚合性單體的含量若為噴墨用墨水總量的0.1 wt%~60 wt%,則符合所使用的用途的黏度的調整與其他特性的平衡較好,更好的是0.5 wt%~55 wt%,進而好的是0.8 wt%~50 wt%,特別好的是1 wt%~45 wt%。When the content of the polyfunctional polymerizable monomer as the diluent (C) is from 0.1 wt% to 60 wt% of the total amount of the ink for inkjet, the balance between the adjustment of the viscosity in accordance with the use used and the other characteristics is good. More preferably, it is 0.5 wt% to 55 wt%, and further preferably 0.8 wt% to 50 wt%, particularly preferably 1 wt% to 45 wt%.
1.3(3)溶劑1.3 (3) solvent
亦可使用溶劑作為稀釋劑(C)。對噴墨噴頭進行加溫時,若墨水中含有低沸點的溶劑,則存在溶劑揮發,墨水的黏度上升,而導致噴墨噴頭的噴嘴口阻塞的情況。因此,特別好的是沸點為100℃~300℃的溶劑。A solvent can also be used as the diluent (C). When the ink jet head is heated, if the ink contains a solvent having a low boiling point, the solvent volatilizes, and the viscosity of the ink rises, which may cause the nozzle opening of the ink jet head to clog. Therefore, a solvent having a boiling point of from 100 ° C to 300 ° C is particularly preferred.
沸點為100℃~300℃的溶劑的具體例可列舉:水、乙酸丁酯、丙酸丁酯、乳酸乙酯、羥基乙酸甲酯、羥基乙酸乙酯、羥基乙酸丁酯、甲氧基乙酸甲酯、甲氧基乙酸乙酯、甲氧基乙酸丁酯、乙氧基乙酸甲酯、乙氧基乙酸乙酯、3-羥基丙酸甲酯、3-羥基丙酸乙酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、2-羥基丙酸甲酯、2-羥基丙酸乙酯、2-羥基丙酸丙酯、2-甲氧基丙酸甲酯、2-甲氧基丙酸乙酯、2-甲氧基丙酸丙酯、2-乙氧基丙酸甲酯、2-乙氧基丙酸乙酯、2-羥基-2-甲基丙酸甲酯、2-羥基-2-甲基丙酸乙酯、2-甲氧基-2-甲基丙酸甲酯、2-乙氧基-2-甲基丙酸乙酯、丙酮酸甲酯、丙酮酸乙酯、丙酮酸丙酯、乙醯乙酸甲酯、乙醯乙酸乙酯、2-側氧丁酸甲酯、2-側氧丁酸乙酯、二氧陸圜(dioxane)、乙二醇、二乙二醇、三乙二醇、丙二醇、二丙二醇、三丙二醇、1,4-丁二醇、乙二醇單異丙基醚、乙二醇單丁基醚、丙二醇單甲基醚、丙二醇單甲基醚乙酸酯、丙二醇單乙基醚乙酸酯、丙二醇單丙基醚乙酸酯、二丙二醇單乙基醚乙酸酯、二丙二醇單丁基醚乙酸酯、乙二醇單丁基醚乙酸酯、環己酮、環戊酮、二乙二醇單甲基醚、二乙二醇單甲基醚乙酸酯、二乙二醇單乙基醚、二乙二醇單乙基醚乙酸酯、二乙二醇單丁基醚、二乙二醇單丁基醚乙酸酯、二乙二醇二甲基醚、二乙二醇二乙基醚、二乙二醇甲基乙基醚、甲苯、二甲苯、苯甲醚、γ-丁內酯、N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮、或二甲基咪唑啶酮。Specific examples of the solvent having a boiling point of 100 ° C to 300 ° C include water, butyl acetate, butyl propionate, ethyl lactate, methyl hydroxyacetate, ethyl hydroxyacetate, butyl glycolate, and methoxyacetate. Ester, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, 3-methoxy Methyl propyl propionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate Ester, propyl 2-hydroxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, Ethyl 2-ethoxypropionate, methyl 2-hydroxy-2-methylpropanoate, ethyl 2-hydroxy-2-methylpropionate, methyl 2-methoxy-2-methylpropanoate , 2-ethoxy-2-methylpropionic acid ethyl ester, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetate, ethyl acetate, 2-butoxybutyric acid Ester, ethyl 2-oxobutanoate, dioxane, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene Alcohol, tripropylene glycol, 1,4-butanediol, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether Acetate, propylene glycol monopropyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monobutyl ether acetate, ethylene glycol monobutyl ether acetate, cyclohexanone, cyclopentane Ketone, diethylene glycol monomethyl ether, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl Ether, diethylene glycol monobutyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, toluene, xylene, benzene Ether, γ-butyrolactone, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, or dimethylimidazolidone.
這些溶劑可為1種化合物,亦可為大於等於2種不同化合物的混合物。These solvents may be one compound or a mixture of two or more different compounds.
作為稀釋劑(C)的溶劑的含量若為噴墨用墨水總量的0.1 wt%~10 wt%,則噴射性與其他特性的平衡較好,更好的是0.2 wt%~8 wt%,進而好的是0.5 wt%~6 wt%,特別好的是1 wt%~5 wt%。When the content of the solvent of the diluent (C) is from 0.1 wt% to 10 wt% of the total amount of the ink for inkjet, the balance between the jetting property and other characteristics is good, and more preferably 0.2 wt% to 8 wt%. Further preferably, it is 0.5 wt% to 6 wt%, and particularly preferably 1 wt% to 5 wt%.
稀釋劑(C)可為1種化合物,亦可為大於等於2種不同化合物的混合物。例如可為單官能聚合性單體與溶劑的混合物。The diluent (C) may be one compound or a mixture of two or more different compounds. For example, it may be a mixture of a monofunctional polymerizable monomer and a solvent.
1.4光聚合起始劑(D)1.4 Photopolymerization initiator (D)
為了對本發明的噴墨用墨水賦予光硬化性,其可含有光聚合起始劑(D)。光聚合起始劑(D)若為藉由紫外線或可見光線的照射而產生自由基的化合物,則並無特別限定。In order to impart photocurability to the inkjet ink of the present invention, it may contain a photopolymerization initiator (D). The photopolymerization initiator (D) is not particularly limited as long as it is a compound which generates a radical by irradiation with ultraviolet rays or visible light.
光聚合起始劑(D)的具體例可列舉:二苯甲酮、米其勒酮(Michler's ketone)、4,4'-雙(二乙基胺基)二苯甲酮、氧雜蒽酮(xanthone)、硫雜蒽酮(thioxanthone)、異丙基氧雜蒽酮、2,4-二乙基硫雜蒽酮、2-乙基蒽醌、苯乙酮、2-羥基-2-甲基苯丙酮、2-羥基-2-甲基-4'-異丙基苯丙酮、1-羥基環己基苯基酮、異丙基安息香醚、異丁基安息香醚、2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、樟腦醌(camphoroquinone)、苯幷蒽酮(benzanthrone)、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮-1、4-二甲基胺基苯甲酸乙酯、4-二甲基胺基苯甲酸異戊酯、4,4'-二(第三丁基過氧基羰基)二苯甲酮、3,4,4'-三(第三丁基過氧基羰基)二苯甲酮、3,3',4,4'-四(第三丁基過氧基羰基)二苯甲酮、3,3',4,4'-四(第三己基過氧基羰基)二苯甲酮、3,3'-二(甲氧基羰基)-4,4'-二(第三丁基過氧基羰基)二苯甲酮、3,4'-二(甲氧基羰基)-4,3'-二(第三丁基過氧基羰基)二苯甲酮、4,4'-二(甲氧基羰基)-3,3'-二(第三丁基過氧基羰基)二苯甲酮、1,2-辛二酮,1-[4-(苯硫基)苯基]-,2-(鄰苯甲醯基肟)、2-(4'-甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(3',4'-二甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(2',4'-二甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(2'-甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(4'-戊氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、4-[對N,N-二(乙氧基羰基甲基)]-2,6-二(三氯甲基)-均三嗪、1,3-雙(三氯甲基)-5-(2'-氯苯基)-均三嗪、1,3-雙(三氯甲基)-5-(4'-甲氧基苯基)-均三嗪、2-(對二甲基胺基苯乙烯基)苯幷噁唑、2-(對二甲基胺基苯乙烯基)苯幷噻唑、2-巰基苯幷噻唑、3,3'-羰基雙(7-二乙基胺基香豆素)、2-(鄰氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四(4-乙氧基羰基苯基)-1,2'-聯咪唑、2,2'-雙(2,4-二氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2,4-二溴苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2,4,6-三氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、3-(2-甲基-2-二甲基胺基丙醯基)咔唑、3,6-雙(2-甲基-2-嗎啉基丙醯基)-9-正十二烷基咔唑、1-羥基環己基苯基酮、雙(η5-2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1H-吡咯-1-基)-苯基)鈦、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦、或2,4,6-三甲基苯甲醯基二苯基氧化膦。Specific examples of the photopolymerization initiator (D) include benzophenone, Michler's ketone, 4,4'-bis(diethylamino)benzophenone, xanthone (xanthone), thioxanthone, isopropyl oxazinone, 2,4-diethylthiaxanone, 2-ethyl hydrazine, acetophenone, 2-hydroxy-2-methyl Phenylpropiophenone, 2-hydroxy-2-methyl-4'-isopropylpropiophenone, 1-hydroxycyclohexyl phenyl ketone, isopropyl benzoin ether, isobutyl benzoin ether, 2,2-diethoxy Acetophenone, 2,2-dimethoxy-2-phenylacetophenone, camphoroquinone, benzantrone, 2-methyl-1-[4-(methylthio) Phenyl]-2-morpholinylpropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butanone-1, 4-dimethyl Ethyl benzyl benzoate, isoamyl 4-dimethylaminobenzoate, 4,4'-di(t-butylperoxycarbonyl)benzophenone, 3,4,4'-three (t-butylperoxycarbonyl)benzophenone, 3,3',4,4'-tetrakis(t-butylperoxycarbonyl)benzophenone, 3,3',4,4' -tetrakis(t-hexylperoxycarbonyl)benzophenone, 3,3'-bis(methoxycarbonyl)-4,4'-di(t-butyl Oxycarbonyl)benzophenone, 3,4'-bis(methoxycarbonyl)-4,3'-bis(t-butylperoxycarbonyl)benzophenone, 4,4'-di Methoxycarbonyl)-3,3'-bis(t-butylperoxycarbonyl)benzophenone, 1,2-octanedione, 1-[4-(phenylthio)phenyl]-, 2-(o-benzylidene hydrazide), 2-(4'-methoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'- Dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(2',4'-dimethoxystyryl)-4,6-bis (three Chloromethyl)-s-triazine, 2-(2'-methoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-pentyloxystyrene -4,6-bis(trichloromethyl)-s-triazine, 4-[p-N,N-bis(ethoxycarbonylmethyl)]-2,6-di(trichloromethyl)- Triazine, 1,3-bis(trichloromethyl)-5-(2'-chlorophenyl)-s-triazine, 1,3-bis(trichloromethyl)-5-(4'-A Oxyphenyl)-s-triazine, 2-(p-dimethylaminostyryl)benzoxazole, 2-(p-dimethylaminostyryl)benzothiazole, 2-mercaptobenzoquinone Thiazole, 3,3'-carbonylbis(7-diethylaminocoumarin), 2-(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'- Biimidazole, 2,2'-bis(2-chlorophenyl)-4, 4',5,5'-tetrakis(4-ethoxycarbonylphenyl)-1,2'-biimidazole, 2,2'-bis(2,4-dichlorophenyl)-4,4', 5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4-dibromophenyl)-4,4',5,5'-tetraphenyl-1, 2'-biimidazole, 2,2'-bis(2,4,6-trichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 3-( 2-methyl-2-dimethylaminopropionyl)carbazole, 3,6-bis(2-methyl-2-morpholinylpropanyl)-9-n-dodecylcarbazole, 1-hydroxycyclohexyl phenyl ketone, bis(η 5 -2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-benzene Titanium, bis(2,4,6-trimethylbenzylidene)phenylphosphine oxide, or 2,4,6-trimethylbenzimidyldiphenylphosphine oxide.
光聚合起始劑(D)可為1種化合物,亦可為大於等於2種化合物的混合物。The photopolymerization initiator (D) may be one compound or a mixture of two or more compounds.
光聚合起始劑(D)的含量若為噴墨用墨水總量的0.5 wt%~20 wt%,則製成噴墨用墨水時,對紫外線為高感度,故較好,更好的是1 wt%~20 wt%,進而好的是2 wt%~20 wt%。When the content of the photopolymerization initiator (D) is from 0.5% by weight to 20% by weight based on the total amount of the ink for inkjet, it is preferable because it is highly sensitive to ultraviolet rays when it is used as an ink for inkjet. 1 wt% to 20 wt%, and further preferably 2 wt% to 20 wt%.
1.5其他成分1.5 other ingredients
為了進一步提高本發明的噴墨用墨水的各種特性,其可含有環氧樹脂、環氧硬化劑、界面活性劑、著色劑、聚合抑制劑等。In order to further improve various characteristics of the inkjet ink of the present invention, it may contain an epoxy resin, an epoxy hardener, a surfactant, a colorant, a polymerization inhibitor, and the like.
1.5(1)環氧樹脂1.5 (1) epoxy resin
本發明的噴墨用墨水例如為了提高耐蝕刻性或耐鍍敷性而可含有環氧樹脂。The inkjet ink of the present invention may contain an epoxy resin, for example, in order to improve etching resistance or plating resistance.
環氧樹脂的具體例可列舉:雙酚A型環氧樹脂、雙酚F型環氧樹脂、縮水甘油酯型環氧樹脂、或脂環式環氧樹脂。Specific examples of the epoxy resin include a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a glycidyl ester type epoxy resin, or an alicyclic epoxy resin.
環氧樹脂的市售品可列舉:Epikote 807、Epikote 815、Epikote 825、Epikote 827、Epikote 828、Epikote 190P、Epikote 191P(商品名;Yuka Shell Epoxy股份有限公司製造);Epikote 1004、Epikote 1256(商品名;Japan Epoxy Resin股份有限公司製造);Araldite CY177、Araldite CY184(商品名;Japan Ciba Geigy股份有限公司製造);Celloxide 2021P、EHPE-3150(商品名;Daicel Chemical Industries股份有限公司製造);或Techmore VG3101L(商品名;三井化學股份有限公司製造)。Commercial products of the epoxy resin include Epikote 807, Epikote 815, Epikote 825, Epikote 827, Epikote 828, Epikote 190P, Epikote 191P (trade name; manufactured by Yuka Shell Epoxy Co., Ltd.); Epikote 1004, Epikote 1256 (product) Name; manufactured by Japan Epoxy Resin Co., Ltd.; Araldite CY177, Araldite CY184 (trade name; manufactured by Japan Ciba Geigy Co., Ltd.); Celloxide 2021P, EHPE-3150 (trade name; manufactured by Daicel Chemical Industries, Inc.); or Techmore VG3101L (trade name; manufactured by Mitsui Chemicals, Inc.).
噴墨用墨水中所使用的環氧樹脂可為1種化合物,亦可為大於等於2種化合物的混合物。The epoxy resin used in the inkjet ink may be one type of compound or a mixture of two or more compounds.
環氧樹脂的含量若為噴墨用墨水固體成分的1 wt%~20 wt%,則耐蝕刻性或耐鍍敷性提高,故較好,更好的是1 wt%~10 wt%,進而好的是1 wt%~7 wt%。When the content of the epoxy resin is from 1 wt% to 20 wt% of the solid content of the ink for inkjet, the etching resistance or the plating resistance is improved, so that it is preferably 1 wt% to 10 wt%, and further Good is 1 wt% to 7 wt%.
1.5(2)界面活性劑1.5(2) surfactant
本發明的噴墨用墨水例如為了提高對基底基板的潤濕性、及硬化膜的膜面均勻性,而可含有界面活性劑。界面活性劑可列舉:矽系界面活性劑、丙烯酸系界面活性劑、及氟系界面活性劑等。The inkjet ink of the present invention may contain a surfactant, for example, in order to improve the wettability to the base substrate and the film surface uniformity of the cured film. Examples of the surfactant include a ruthenium-based surfactant, an acrylic surfactant, and a fluorine-based surfactant.
界面活性劑的市售品可列舉:Byk-300、Byk-306、Byk-335、Byk-310、Byk-341、Byk-344、及Byk-370(商品名;Byk-Chemie股份有限公司製造)等矽系界面活性劑;Byk-354、Byk-358、及Byk-361(商品名;Byk-Chemie股份有限公司製造)等丙烯酸系界面活性劑;DFX-18、Ftergent 250、或Ftergent 251(商品名;NEOS股份有限公司製造),Megafac F-479(商品名;DIC股份有限公司製造)等氟系界面活性劑。Commercial products of the surfactants include Byk-300, Byk-306, Byk-335, Byk-310, Byk-341, Byk-344, and Byk-370 (trade name; manufactured by Byk-Chemie Co., Ltd.). Isocyanic surfactant; Acrylic surfactant such as Byk-354, Byk-358, and Byk-361 (trade name; manufactured by Byk-Chemie Co., Ltd.); DFX-18, Ftergent 250, or Ftergent 251 (commodity A fluorine-based surfactant such as a product manufactured by NEOS Co., Ltd., Megafac F-479 (trade name; manufactured by DIC Corporation).
噴墨用墨水中所使用的界面活性劑可為1種化合物,亦可為大於等於2種化合物的混合物。The surfactant used in the ink for inkjet may be one compound or a mixture of two or more compounds.
界面活性劑的含量若為噴墨用墨水固體成分的0.001 wt%~1 wt%,則硬化膜的膜面均勻性提高,故較好,若考慮到與其他特性的平衡,則更好的是0.001 wt%~0.1 wt%,進而好的是0.001 wt%~0.05 wt%。When the content of the surfactant is 0.001 wt% to 1 wt% of the solid content of the ink for inkjet, the film surface uniformity of the cured film is improved, so that it is preferable to consider the balance with other characteristics. 0.001 wt% to 0.1 wt%, and further preferably 0.001 wt% to 0.05 wt%.
1.5(3)著色劑1.5(3) colorant
本發明的噴墨用墨水例如為了於檢查硬化膜的狀態時容易與基板識別而可含有著色劑。著色劑較好的是染料、顏料。The inkjet ink of the present invention may contain a coloring agent, for example, in order to easily recognize the substrate when the cured film is inspected. The colorant is preferably a dye or a pigment.
噴墨用墨水中所使用的著色劑可為1種化合物,亦可為大於等於2種化合物的混合物。The coloring agent used in the inkjet ink may be one type of compound or a mixture of two or more compounds.
著色劑的含量若為噴墨用墨水固體成分的0.1 wt%~5 wt%,則容易進行硬化膜的檢查,故較好,若考慮到與其他特性的平衡,則更好的是0.1 wt%~1 wt%,進而好的是0.1 wt%~0.5 wt%。When the content of the colorant is from 0.1 wt% to 5 wt% of the solid content of the ink for inkjet, it is easy to inspect the cured film, and therefore it is preferably 0.1 wt% in consideration of balance with other characteristics. ~1 wt%, and further preferably 0.1 wt% to 0.5 wt%.
1.5(4)聚合抑制劑1.5 (4) polymerization inhibitor
本發明的噴墨用墨水例如為了提高保存穩定性,而可含有聚合抑制劑。聚合抑制劑的具體例可列舉:4-甲氧基苯酚、對苯二酚、或酚噻嗪。於這些聚合抑制劑中,酚噻嗪即便進行長期保存黏度的變化亦較小,故較好。The inkjet ink of the present invention may contain a polymerization inhibitor, for example, in order to improve storage stability. Specific examples of the polymerization inhibitor include 4-methoxyphenol, hydroquinone, or phenothiazine. Among these polymerization inhibitors, phenothiazine is preferred even if the change in viscosity for long-term storage is small.
噴墨用墨水中所使用的聚合抑制劑可為1種化合物,亦可為大於等於2種化合物的混合物。The polymerization inhibitor used in the inkjet ink may be one type of compound or a mixture of two or more compounds.
聚合抑制劑的含量若為噴墨用墨水固體成分的0.01 wt%~1 wt%,則即便進行長期保存黏度的變化亦較小,故較好,若考慮到與其他特性的平衡,則更好的是0.01 wt%~0.5 wt%,進而好的是0.01 wt%~0.1 wt%。When the content of the polymerization inhibitor is 0.01 wt% to 1 wt% of the solid content of the ink for inkjet, the change in viscosity for long-term storage is small, so it is preferable, and it is better to consider the balance with other characteristics. It is 0.01 wt% to 0.5 wt%, and further preferably 0.01 wt% to 0.1 wt%.
1.6噴墨用墨水的黏度1.6 Viscosity of inkjet ink
若本發明的噴墨用墨水利用E型黏度計所測定的於25℃下的黏度為2 mPa.s~200 mPa.s,則利用噴墨印刷的塗佈特性(噴射精度等)變得良好,故較好。25℃下的噴墨用墨水的黏度更好的是10 mPa.s~180 mPa.s,進而好的是20 mPa.s~150 mPa.s。The inkjet ink of the present invention has a viscosity of 2 mPa at 25 ° C as measured by an E-type viscometer. s~200 mPa. In s, the coating characteristics (ejection accuracy, etc.) by inkjet printing are good, which is preferable. The inkjet ink at 25 ° C has a viscosity of 10 mPa. s~180 mPa. s, and thus better is 20 mPa. s~150 mPa. s.
在使用於25℃下的黏度大於等於50 mPa.s的墨水時,若對噴墨噴頭進行加溫而降低噴出時的黏度,則可實現更加穩定的噴出。於加熱噴墨噴頭進行噴射時,加熱溫度(較好的是40℃~120℃)下的噴墨用墨水的黏度較好的是1 mPa.s~30 mPa.s,更好的是2 mPa.s~25 mPa.s,特別好的是3 mPa.s~20 mPa.s。The viscosity at 25 ° C is greater than or equal to 50 mPa. In the case of s ink, if the ink jet head is heated to lower the viscosity at the time of ejection, a more stable discharge can be achieved. When the inkjet head is sprayed, the viscosity of the ink for inkjet at a heating temperature (preferably 40 ° C to 120 ° C) is preferably 1 mPa. s~30 mPa. s, better is 2 mPa. s~25 mPa. s, especially good is 3 mPa. s~20 mPa. s.
於對噴墨噴頭進行加溫時,較好的是使用不含溶劑的墨水。於該情況下,墨水的黏度較好的是藉由適當選擇稀釋劑(C)的種類與含量來進行調整。於不對噴墨噴頭進行加溫時,墨水的黏度可添加小於等於墨水總量的10 wt%的溶劑來進行調整。When the ink jet head is heated, it is preferred to use a solvent-free ink. In this case, the viscosity of the ink is preferably adjusted by appropriately selecting the type and content of the diluent (C). When the ink jet head is not warmed, the viscosity of the ink can be adjusted by adding a solvent of 10 wt% or less equal to or less than the total amount of the ink.
1.7噴墨用墨水的保存1.7 Preservation of ink for inkjet
本發明的噴墨用墨水若於-20℃~20℃下保存,則保存中的黏度變化較小,且保存穩定性良好。When the ink for inkjet of the present invention is stored at -20 ° C to 20 ° C, the change in viscosity during storage is small, and the storage stability is good.
2.藉由噴墨方法的噴墨用墨水的塗佈2. Coating of ink for inkjet by an inkjet method
本發明的噴墨用墨水可使用公知的噴墨塗佈方法進行塗佈。噴墨塗佈方法例如有:將機械能(mechanical energy)作用於墨水,而使墨水自噴墨噴頭噴出(塗佈)的方法(所謂壓電(piezo)方式);以及將熱能作用於墨水,而塗佈墨水的塗佈方法(所謂氣泡噴射(bubble-jet)(註冊商標)方式)等。The inkjet ink of the present invention can be applied by a known inkjet coating method. The inkjet coating method includes, for example, a method of applying mechanical energy to the ink to eject (coat) the ink from the inkjet head (so-called piezo method); and applying thermal energy to the ink, The coating method of the applied ink (so-called bubble-jet (registered trademark) method).
藉由使用噴墨塗佈方法,可將噴墨用墨水塗佈成預先設定的圖案狀。藉此,可僅於需要的部位塗佈墨水,與光微影法相比較,可降低成本。By using an inkjet coating method, the ink for inkjet can be applied in a predetermined pattern. Thereby, the ink can be applied only to a desired portion, and the cost can be reduced as compared with the photolithography method.
至於使用本發明的噴墨用墨水進行塗佈時較好的塗佈單元(unit),例如可列舉:包含收納這些墨水的墨水收納部與噴墨噴頭的噴墨單元。噴墨單元例如可列舉:使與塗佈信號相對應的熱能作用於墨水,並藉由上述能量而產生墨水液滴的噴墨單元。As a coating unit which is preferably used for coating with the inkjet ink of the present invention, for example, an inkjet unit including an ink containing portion for storing the ink and an inkjet head can be cited. The ink jet unit may, for example, be an ink jet unit that applies thermal energy corresponding to a coating signal to the ink and generates ink droplets by the energy.
噴墨噴頭例如為:具有含有金屬及/或金屬氧化物的發熱部接液面的噴墨噴頭。至於上述金屬及/或金屬氧化物的具體例,例如可列舉鉭(Ta)、鋯(Zr)、鈦(Ti)、鎳(Ni)、鋁(Al)等金屬、及這些金屬的氧化物等。The ink jet head is, for example, an ink jet head having a liquid contact surface of a heat generating portion containing a metal and/or a metal oxide. Specific examples of the metal and/or metal oxide include metals such as lanthanum (Ta), zirconium (Zr), titanium (Ti), nickel (Ni), and aluminum (Al), and oxides of these metals. .
使用本發明的噴墨用墨水進行塗佈時較好的塗佈裝置例如可列舉:對具有收納墨水的墨水收納部的噴墨噴頭的室內的墨水提供與塗佈信號相對應的能量,並藉由上述能量而產生墨水液滴的裝置。In the coating apparatus which is preferably used for the application of the inkjet ink of the present invention, for example, energy corresponding to the coating signal is supplied to the ink in the ink jet head having the ink containing portion for storing the ink, and A device that produces ink droplets from the above energy.
噴墨塗佈裝置並不限於噴墨噴頭與墨水收納部相分離的裝置,亦可使用這些不可分離而成為一體的裝置。另外,墨水收納部除了對噴墨噴頭可分離、或者不可分離而成為一體並搭載於托架(carriage)的形態以外,亦可為設置於裝置的固定部位,經由墨水供給構件例如管體(tube)而向噴墨噴頭供給墨水的形態。The inkjet coating device is not limited to a device in which the inkjet head is separated from the ink containing portion, and these devices that are inseparable and integrated may be used. Further, the ink accommodating portion may be provided in a fixed portion of the device in addition to the form in which the ink jet head is detachable or inseparable and integrated in a carriage, and may be provided via an ink supply member such as a tube (tube). The form of supplying ink to the inkjet head.
另外,噴墨的噴出(塗佈)溫度較好的是10℃~120℃,塗佈溫度下的噴墨用墨水的黏度較好的是1 mPa.s~200 mPa.s。In addition, the inkjet ejection (coating) temperature is preferably from 10 ° C to 120 ° C, and the viscosity of the inkjet ink at the coating temperature is preferably 1 mPa. s~200 mPa. s.
3.硬化膜的形成3. Formation of hardened film
本發明的硬化膜可於藉由噴墨法將上述噴墨用墨水塗佈於基板表面後,視需要對墨水照射紫外線或可見光線等光而獲得。The cured film of the present invention can be obtained by applying the ink for inkjet onto the surface of the substrate by an inkjet method, and then irradiating the ink with light such as ultraviolet rays or visible rays, as needed.
於照射紫外線時,所照射的紫外線的量依存於噴墨用墨水的組成,使用Ushio Denki股份有限公司製造的安裝有受光器UVD-365PD的累計光量計UIT-201進行測定,較好的是10 mJ/cm2~1,000 mJ/cm2左右,更好的是20 mJ/cm2~800 mJ/cm2左右,進而好的是40 mJ/cm2~500 mJ/cm2左右。另外,所照射的紫外線的波長較好的是200 nm~450 nm,更好的是220 nm~430 nm,進而好的是250 nm~400 nm。When the ultraviolet ray is irradiated, the amount of the ultraviolet ray to be irradiated is determined by the composition of the inkjet ink, and is measured using an integrated photometer UIT-201 equipped with a light receiver UVD-365PD manufactured by Ushio Denki Co., Ltd., preferably 10 mJ/cm 2 to 1,000 mJ/cm 2 or so, more preferably 20 mJ/cm 2 to 800 mJ/cm 2 or more, preferably 40 mJ/cm 2 to 500 mJ/cm 2 or so. Further, the wavelength of the ultraviolet ray to be irradiated is preferably from 200 nm to 450 nm, more preferably from 220 nm to 430 nm, and further preferably from 250 nm to 400 nm.
另外,可視需要進一步對藉由光的照射而硬化的上述硬化膜進行加熱、煅燒,特別好的是於100℃~250℃下加熱10分鐘~60分鐘,更好的是於120℃~230℃下加熱10分鐘~60分鐘,進而好的是於150℃~200℃下加熱10分鐘~60分鐘。Further, the cured film which is hardened by irradiation with light may be further heated and calcined as needed, and it is particularly preferably heated at 100 ° C to 250 ° C for 10 minutes to 60 minutes, more preferably at 120 ° C to 230 ° C. The heating is carried out for 10 minutes to 60 minutes, and it is preferably heated at 150 ° C to 200 ° C for 10 minutes to 60 minutes.
本發明中可使用的「基板」若為可成為塗佈噴墨用墨水的對象的基板,則並無特別限定,其形狀並不限於平板狀,亦可為曲面狀。The "substrate" which can be used in the present invention is not particularly limited as long as it can be a target for applying ink for inkjet printing, and the shape thereof is not limited to a flat plate shape, and may be a curved shape.
另外,基板的材質並無特別限定,例如可列舉:聚對苯二甲酸乙二酯(PET,polyethylene terephthalate)、聚對苯二甲酸丁二酯(PBT,polybutylene terephthalate)等聚酯系樹脂,聚乙烯、聚丙烯等聚烯烴樹脂,聚氯乙烯、氟樹脂、丙烯酸系樹脂、聚醯胺、聚碳酸酯、聚醯亞胺等塑膠膜,賽珞玢(cellophane)、乙酸酯、金屬箔、聚醯亞胺與金屬箔的積層膜、具有填充效果的玻璃紙(glassine paper)、羊皮紙(parchment paper)、或者利用聚乙烯、黏土黏合劑、聚乙烯醇、澱粉、羧基甲基纖維素(CMC,carboxymethyl cellulose)等進行填充處理的紙,玻璃(glass)。In addition, the material of the substrate is not particularly limited, and examples thereof include polyester resins such as polyethylene terephthalate (PET) and polybutylene terephthalate (PBT). Polyolefin resins such as ethylene and polypropylene, plastic films such as polyvinyl chloride, fluororesin, acrylic resin, polyamide, polycarbonate, and polyimide, cellophane, acetate, metal foil, a laminate film of polyimide and metal foil, a glasse paper with a filling effect, a parchment paper, or a polyethylene, a clay binder, polyvinyl alcohol, starch, carboxymethyl cellulose (CMC, Carboxymethyl cellulose), etc., which is filled with paper, glass.
於這些構成基板的物質中,於不對本發明的效果產生不良影響的範圍內,可進一步含有顏料、染料、抗氧化劑、抗劣化劑、填充劑、紫外線吸收劑、抗靜電劑及/或抗電磁波劑等添加劑。另外,亦可於基板表面的一部分形成與基板不同的材質。Among the substances constituting the substrate, pigments, dyes, antioxidants, anti-deterioration agents, fillers, ultraviolet absorbers, antistatic agents, and/or anti-electromagnetic waves may be further contained within a range that does not adversely affect the effects of the present invention. Additives such as agents. Further, a material different from the substrate may be formed on a part of the surface of the substrate.
基板的用途亦並無特別限定,由本發明的噴墨用墨水所得的硬化膜由於耐蝕刻液性、耐鍍敷性、對鹼性水溶液的剝離性優異,因此較好的是用於製造在基板表面具有金屬製電路的電子電路基板等。形成電路的金屬並無特別限定,較好的是金、銀、銅、鋁或氧化銦錫(ITO,Indium Tin Oxide)。The use of the substrate is not particularly limited, and the cured film obtained by the inkjet ink of the present invention is excellent in etching liquid resistance, plating resistance, and peeling property to an alkaline aqueous solution, and therefore is preferably used for manufacturing on a substrate. An electronic circuit board or the like having a metal circuit on its surface. The metal forming the circuit is not particularly limited, and is preferably gold, silver, copper, aluminum or indium tin oxide (ITO).
基板的厚度並無特別限定,通常為10 μm~2 mm左右,根據所使用的目的而進行適當調整,較好的是15 μm~500 μm,更好的是20 μm~200 μm。The thickness of the substrate is not particularly limited, but is usually about 10 μm to 2 mm, and is appropriately adjusted depending on the purpose of use, and is preferably 15 μm to 500 μm, more preferably 20 μm to 200 μm.
亦可視需要於基板的形成硬化膜的面上實施斥水處理、電暈(corona)處理、電漿(plasma)處理、或噴擊(blast)處理等易黏接處理,或者於表面設置易黏接層或彩色濾光片(color filter)用保護膜。It is also possible to perform an easy adhesion treatment such as water repellent treatment, corona treatment, plasma treatment, or blast treatment on the surface on which the cured film is formed on the substrate, or it is easy to adhere to the surface. A protective film for the layer or color filter.
[實施例][Examples]
以下,藉由實施例進一步對本發明進行說明,但本發明並不受這些實施例限定。Hereinafter, the present invention will be further illustrated by the examples, but the present invention is not limited by these examples.
<噴墨用墨水及形成硬化膜圖案的基板的製作><Production of Inkjet Ink and Substrate Forming Cured Film Pattern>
首先,對實施例1~2及比較例1~3的噴墨用墨水及由其所得的形成硬化膜圖案的基板進行說明。First, the inkjet inks of Examples 1 to 2 and Comparative Examples 1 to 3 and the substrate on which the cured film pattern is formed will be described.
[實施例1][Example 1]
按下述組成比例混合並溶解:用作樹脂(A)的Maruka LyncurM S-1G(商品名;丸善石油化學股份有限公司製造、重量平均分子量:1,600-2,400),用作具有大於等於1個羧基的單體或低聚物(B)的雙酚F型酸改質環氧丙烯酸酯即NEOPOL 8476(商品名;Japan U-pica股份有限公司製造、重量平均分子量:5000),用作稀釋劑(C)的甲基丙烯酸-2-羥基乙酯、甲基丙烯酸丁酯,作為光聚合起始劑(D)的2,4,6-三甲基苯甲醯基二苯基氧化膦即DAROCUR TPO(商品名;Ciba Specialty Chemicals股份有限公司製造)、及作為聚合抑制劑的酚噻嗪,然後利用聚四氟乙烯(PTFE,polytetra-fluoroethylene)製薄膜過濾器(membrane filter)(1 μm)進行過濾,而製備噴墨用墨水1。Mixed and dissolved in the following composition ratio: Maruka Lyncur M S-1G (trade name; manufactured by Maruzen Petrochemical Co., Ltd., weight average molecular weight: 1,600-2,400) used as the resin (A), used as having 1 or more carboxyl groups Monomer or oligomer (B) bisphenol F type acid-modified epoxy acrylate, NEOPOL 8476 (trade name; manufactured by Japan U-pica Co., Ltd., weight average molecular weight: 5000), used as a diluent ( C) 2-hydroxyethyl methacrylate, butyl methacrylate, 2,4,6-trimethylbenzhydryldiphenylphosphine oxide as photopolymerization initiator (D), DAROCUR TPO (trade name; manufactured by Ciba Specialty Chemicals Co., Ltd.), and phenothiazine as a polymerization inhibitor, and then filtered using a membrane filter (1 μm) made of polytetrafluoroethylene (PTFE). Inkjet ink 1 was prepared.
使用E型黏度計(東機產業股份有限公司製造的TV-22、以下相同),測定25℃下的噴墨用墨水1的黏度,結果為40 mPa.s。The viscosity of the inkjet ink 1 at 25 ° C was measured using an E-type viscometer (TV-22 manufactured by Toki Sangyo Co., Ltd., the same applies hereinafter), and the result was 40 mPa. s.
將噴墨用墨水1注入至噴墨盒(ink jet cartridge)中,並將其裝著於噴墨裝置(FUJIFILM Dimatix公司製造的DMP-2811)中,使用10 pl用的噴頭,於噴出電壓(壓電電壓)為16 V、噴頭溫度為70℃、驅動頻率為5 kHz、塗佈次數為1次的噴出條件下,於在聚醯亞胺上積層銅箔而成的厚度為35 μm的銅箔積層板即Vyloflex(商品名;東洋紡績股份有限公司製造)的銅表面上形成特定的圖案。The inkjet ink 1 was injected into an ink jet cartridge, and it was mounted in an inkjet apparatus (DMP-2811 manufactured by FUJIFILM Dimatix Co., Ltd.), and a discharge nozzle was used at a discharge voltage of 10 pl ( Copper with a thickness of 35 μm formed by laminating copper foil on polyimide by a piezoelectric voltage of 16 V, a nozzle temperature of 70 ° C, a driving frequency of 5 kHz, and a coating number of one shot. A specific pattern is formed on the copper surface of a foil laminate, that is, Vyloflex (trade name; manufactured by Toyobo Co., Ltd.).
以250 mJ/cm2的UV曝光量,對將噴墨用墨水1形成圖案的基板照射波長為365 nm的紫外線,使噴墨用墨水1硬化,藉此獲得形成有厚度為10 μm的硬化膜圖案的基板1。The substrate on which the inkjet ink 1 is patterned is irradiated with ultraviolet rays having a wavelength of 365 nm at a UV exposure amount of 250 mJ/cm 2 to cure the inkjet ink 1 to thereby obtain a cured film having a thickness of 10 μm. Patterned substrate 1.
[實施例2][Embodiment 2]
使用Maruka LyncurM S-2G(商品名;丸善石油化學股份有限公司製造、重量平均分子量:4,000-6,000)作為聚乙烯苯酚,並設為下述組成比例,除此以外,以與實施例1相同的方式製備噴墨用墨水2。The same procedure as in Example 1 was carried out except that Maruka Lyncur M S-2G (trade name; manufactured by Maruzen Petrochemical Co., Ltd., weight average molecular weight: 4,000-6,000) was used as the polyvinyl phenol, and the following composition ratio was used. The inkjet ink 2 was prepared in a manner.
使用E型黏度計(東機產業股份有限公司製造的TV-22、以下相同),測定25℃下的噴墨用墨水2的黏度,結果為45 mPa.s。The viscosity of the inkjet ink 2 at 25 ° C was measured using an E-type viscometer (TV-22 manufactured by Toki Sangyo Co., Ltd., the same applies hereinafter), and the result was 45 mPa. s.
使用噴墨用墨水2,以與實施例1相同的方法獲得形成有厚度為10 μm的硬化膜圖案的基板2。Using the inkjet ink 2, a substrate 2 on which a cured film pattern having a thickness of 10 μm was formed was obtained in the same manner as in Example 1.
[比較例1][Comparative Example 1]
除去包含使用乙烯苯酚的聚合物的樹脂,以與實施例1相同的組成,並以與實施例1相同的方式,製備噴墨用墨水3。The resin containing the polymer using vinyl phenol was removed, and the inkjet ink 3 was prepared in the same manner as in Example 1 in the same manner as in Example 1.
使用E型黏度計(東機產業股份有限公司製造的TV-22、以下相同),測定25℃下的噴墨用墨水3的黏度,結果為66 mPa.s。The viscosity of the inkjet ink 3 at 25 ° C was measured using an E-type viscometer (TV-22 manufactured by Toki Sangyo Co., Ltd., the same applies hereinafter), and the result was 66 mPa. s.
使用噴墨用墨水3,以與實施例1相同的方法獲得形成有厚度為10 μm的硬化膜圖案的基板3。Using the inkjet ink 3, a substrate 3 on which a cured film pattern having a thickness of 10 μm was formed was obtained in the same manner as in Example 1.
[比較例2][Comparative Example 2]
使用酚醛清漆系酚樹脂即BRG-555(昭和高分子股份有限公司製造、重量平均分子量:600),來替代包含使用乙烯苯酚的聚合物的樹脂,並設為下述組成比例,除此以外,以與實施例1相同的方式製備噴墨用墨水4。A resin comprising a polymer of vinyl phenol, which is a phenolic resin-based phenol resin, which is a phenolic resin, is used as a resin, and is a composition ratio of the following composition ratio. An inkjet ink 4 was prepared in the same manner as in Example 1.
使用E型黏度計(東機產業股份有限公司製造的TV-22、以下相同),測定25℃下的噴墨用墨水4的黏度,結果為92 mPa.s。The viscosity of the inkjet ink 4 at 25 ° C was measured using an E-type viscometer (TV-22 manufactured by Toki Sangyo Co., Ltd., the same applies hereinafter), and the result was 92 mPa. s.
使用噴墨用墨水4,以與實施例1相同的方法獲得形成有厚度為10 μm的硬化膜圖案的基板4。Using the inkjet ink 4, a substrate 4 on which a cured film pattern having a thickness of 10 μm was formed was obtained in the same manner as in Example 1.
[比較例3][Comparative Example 3]
使用Maruka LyncurM S-4G(商品名;丸善石油化學股份有限公司製造、重量平均分子量:9,000-11,000)作為聚乙烯苯酚,並設為下述組成比例,除此以外,以與實施例1相同的方式製備噴墨用墨水5。The same procedure as in Example 1 was carried out, except that Maruka Lyncur M S-4G (trade name; manufactured by Maruzen Petrochemical Co., Ltd., weight average molecular weight: 9,000-11,000) was used as the polyvinyl phenol, and the following composition ratio was used. The inkjet ink 5 was prepared in a manner.
使用E型黏度計(東機產業股份有限公司製造的TV-22、以下相同),測定25℃下的噴墨用墨水5的黏度,結果為47 mPa.s。The viscosity of the inkjet ink 5 at 25 ° C was measured using an E-type viscometer (TV-22 manufactured by Toki Sangyo Co., Ltd., the same applies hereinafter), and the result was 47 mPa. s.
使用噴墨用墨水5,以與實施例1相同的方法獲得形成有厚度為10 μm的硬化膜圖案的基板5。Using the inkjet ink 5, a substrate 5 on which a cured film pattern having a thickness of 10 μm was formed was obtained in the same manner as in Example 1.
<噴墨用墨水及圖案狀硬化膜的評價><Evaluation of inkjet ink and patterned cured film>
接著,對噴墨用墨水的噴出性、硬化膜的硬化性、耐蝕刻性、耐鍍敷性、及鹼性剝離性進行評價。各試驗方法如下所述,將評價結果示於表1中。Next, the discharge property of the inkjet ink, the curability of the cured film, the etching resistance, the plating resistance, and the alkali peelability were evaluated. Each test method is as follows, and the evaluation results are shown in Table 1.
墨水的噴出性試驗Ink ejection test
對所得的基板1~5上的圖案的混亂、印刷的擦痕進行觀察,評價墨水的噴出性。評價基準如下所述。The disorder of the pattern on the obtained substrates 1 to 5 and the scratches of the printing were observed, and the discharge property of the ink was evaluated. The evaluation criteria are as follows.
◎:完全無圖案的混亂、印刷的擦痕。◎: completely without pattern confusion, printed scratches.
○:幾乎無圖案的混亂、印刷的擦痕。○: There is almost no pattern of confusion and printed scratches.
△:稍有產生圖案的混亂、印刷的擦痕。△: There is a slight confusion in the pattern and a scratch on the print.
×:圖案的混亂、印刷的擦痕較多。×: The pattern is confusing, and the printed scratches are many.
膜的硬化性試驗Membrane hardening test
手指接觸基板表面,並利用顯微鏡觀察硬化膜的表面狀態。評價基準如下所述。The surface of the substrate was touched by a finger, and the surface state of the cured film was observed with a microscope. The evaluation criteria are as follows.
○:於硬化膜表面完全無手指接觸的痕跡。○: There is no trace of finger contact on the surface of the cured film.
△:於硬化膜表面殘留較少手指接觸的痕跡。△: There are few traces of finger contact remaining on the surface of the cured film.
×:手指接觸的痕跡完全殘留於硬化膜表面。×: The trace of the finger contact completely remains on the surface of the cured film.
耐蝕刻性試驗Etch resistance test
於50℃下,將基板於13%FeCl3水溶液中浸漬2分鐘,利用顯微鏡觀察硬化膜的表面狀態。評價基準如下所述。The substrate was immersed in a 13% FeCl 3 aqueous solution at 50 ° C for 2 minutes, and the surface state of the cured film was observed with a microscope. The evaluation criteria are as follows.
◎:於硬化膜上完全無變化。◎: There was no change at all on the cured film.
○:於硬化膜上見到較少變色,但完全未見到剝落。○: Less discoloration was observed on the cured film, but no peeling was observed at all.
△:硬化膜完全變色,亦見到較少剝落。△: The cured film was completely discolored, and less peeling was also observed.
×:硬化膜完全剝落。×: The cured film was completely peeled off.
耐鍍敷性試驗Plating resistance test
於60℃下,將基板於市售的非電解鍍鎳液(商品名:Nimden NPR-4、Ni濃度為4.5 g/L、上村工業股份有限公司製造)中浸漬15分鐘,利用顯微鏡觀察硬化膜的表面狀態。另外,於90℃下,於非電解鍍金液(商品名:Goblite TAM-55、Au濃度為1 g/L、上村工業股份有限公司製造)中浸漬20分鐘,進行相同的觀察。評價基準如下所述。The substrate was immersed in a commercially available electroless nickel plating solution (trade name: Nimden NPR-4, Ni concentration: 4.5 g/L, manufactured by Uemura Kogyo Co., Ltd.) at 60 ° C for 15 minutes, and the cured film was observed by a microscope. Surface state. Further, the same observation was carried out by immersing in an electroless gold plating solution (trade name: Goblite TAM-55, Au concentration: 1 g/L, manufactured by Uemura Industrial Co., Ltd.) at 90 ° C for 20 minutes. The evaluation criteria are as follows.
◎:於硬化膜上完全無變化。◎: There was no change at all on the cured film.
○:於硬化膜上見到較少變色,但完全未見到剝落。○: Less discoloration was observed on the cured film, but no peeling was observed at all.
△:硬化膜完全變色,亦見到較少剝落。△: The cured film was completely discolored, and less peeling was also observed.
×:硬化膜完全剝落。×: The cured film was completely peeled off.
鹼性剝離性試驗Alkaline stripping test
於50℃下,將評價了耐蝕刻性後的基板於濃度為5%的NaOH水溶液中浸漬1分鐘,利用顯微鏡觀察硬化膜的剝離性。另外,於50℃下,將首先評價耐鍍鎳性,接著評價耐鍍金性後的基板於濃度為5%的NaOH水溶液中浸漬1分鐘,利用顯微鏡觀察硬化膜的剝離性。評價基準如下所述。The substrate after the evaluation of the etching resistance was immersed in an aqueous NaOH solution having a concentration of 5% at 50 ° C for 1 minute, and the peeling property of the cured film was observed by a microscope. Further, at 50 ° C, the nickel plating resistance was first evaluated, and then the substrate after the gold plating resistance was evaluated was immersed in an aqueous NaOH solution having a concentration of 5% for 1 minute, and the peeling property of the cured film was observed by a microscope. The evaluation criteria are as follows.
◎:完全剝離。◎: Completely peeled off.
○:一部分剝離。○: Partial peeling.
×:完全未剝離。×: Not peeled at all.
如由表1所示的結果可明確般,於本發明的基板1~2中幾乎未見到圖案的混亂、印刷的擦痕,墨水的噴出性良好。另外,對基板1~4上的手指接觸的膜的硬化性進行評價,結果於硬化膜表面完全未殘留手指接觸的痕跡,膜的硬化性良好。As is clear from the results shown in Table 1, in the substrates 1 to 2 of the present invention, almost no pattern turbulence or printing scratches were observed, and the ink ejection property was good. Moreover, the hardenability of the film which contacted the finger on the board|substrate 1 - 4 was evaluated, and the trace of the finger contact was not left in the surface of the cured film, and the hardenability of the film was favorable.
另外,基板1~2的耐蝕刻性、耐鍍鎳性、耐鍍金性、及鹼性剝離性良好,其中特別是基板2的耐蝕刻性及耐鍍鎳性、耐鍍金性優異,另外基板1、2的鹼性剝離性優異。Further, the substrates 1 to 2 are excellent in etching resistance, nickel plating resistance, gold plating resistance, and alkali peeling resistance, and in particular, the substrate 2 is excellent in etching resistance, nickel plating resistance, and gold plating resistance, and the substrate 1 is additionally provided. 2 is excellent in alkaline peelability.
另一方面,不含樹脂(A)的比較例1的耐鍍鎳性及耐鍍金性不良,於耐鍍鎳性評價後及耐鍍金性評價後的基板表面見到變色。進而,鹼性剝離性極為不良,且完全未剝離。On the other hand, in Comparative Example 1 containing no resin (A), nickel plating resistance and gold plating resistance were poor, and discoloration was observed on the surface of the substrate after evaluation of nickel plating resistance and evaluation of gold plating resistance. Further, the alkali peelability was extremely poor, and it was not peeled at all.
關於使用酚醛清漆系酚樹脂替代樹脂(A)的比較例2,鹼性剝離性極為不良,且完全未剝離。In Comparative Example 2 in which a novolak-based phenol resin was used in place of the resin (A), the basic peeling property was extremely poor, and it was not peeled at all.
另外,關於使用分子量為9,000~11,000的聚乙烯苯酚作為樹脂(A)的比較例3,墨水的噴出性較差,基板5上的印刷圖案的混亂、擦痕較多,無法獲得均勻的膜。因此,中斷除墨水的噴出性以外的評價。Further, in Comparative Example 3 in which polyvinylphenol having a molecular weight of 9,000 to 11,000 was used as the resin (A), the discharge property of the ink was inferior, and the printed pattern on the substrate 5 was disordered and scratched, and a uniform film could not be obtained. Therefore, the evaluation other than the discharge property of the ink is interrupted.
如以上所說明般,根據本發明,可獲得一種墨水的噴出性、膜的硬化性、耐蝕刻性、及耐鍍敷性優異的可進行鹼性剝離的噴墨用墨水。As described above, according to the present invention, it is possible to obtain an inkjet ink which can be subjected to alkaline peeling, which is excellent in ink discharge property, film curability, etching resistance, and plating resistance.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
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