TWI534937B - Assembly and method for algining wafers - Google Patents

Description

Alignment wafer assembly and method 【0001】

The invention relates to an assembly and method for a aligning wafer, in particular to a method for quickly calculating an error between a positioning point on a conveying device and a center of a wafer to position the wafer on a carrying platform. One of the standard position assemblies and methods.

【0002】

In the prior art, before the wafer is to be transported to a carrier platform for wafer inspection and classification, it is necessary to use a pair of bit devices to perform a one-bit, positioning process on the wafer. The wafer is transported to the carrier platform for subsequent inspection and classification operations.

[0003]

However, such a aligning device can only perform alignment and positioning operations for a single specific size wafer (eg, 2 吋 wafer), and is used for alignment and positioning operations of other size wafers (eg, 4 吋). Wafer), it is necessary to replace the other corresponding size of the alignment device.

[0004]

On the other hand, as is well known to those skilled in the art, the prior art alignment device is independent of the detection classification machine having the loading platform, so when the alignment device is matched with the detection classification machine, the installation fineness is Will be required. Therefore, after the replacement of the positioning device is completed, it usually takes a lot of time for the subsequent calibration to re-align the wafer and locate the program, which causes inconvenience in use. In particular, when the wafer inspection and classification performed involves various sizes, it is more necessary to frequently replace the aforementioned positioning device, resulting in a lot of work time being costly and increasing the time cost.

[0005]

In view of this, how to improve and improve the above-mentioned defects to provide an assembly and method for quickly aligning wafers is an urgent problem to be solved in the industry.

[0006]

It is an object of the present invention to provide an assembly and method for quickly calculating an error between a positioning point on a conveyor and a center of a wafer to position the wafer on a standard position on a carrier platform.

【0007】

To achieve the above object, a aligning assembly of the present invention comprises a conveying device, a carrying platform and an image capturing device. The transport device is adapted to grasp and place the wafer, and the load bearing platform defines a standard position thereon, so that the load bearing platform can move the wafer by the standard position. The image taking device is disposed between the conveying device and the carrying platform, and performs an image capturing process on the wafer. After the transport device picks up the wafer, the wafer is placed under the image capturing device to perform an image capturing process, and the loading platform then calculates an offset according to the image capturing program to perform an axial fine adjustment of the carrying platform for transport. The device places the wafer in a standard position on the carrying platform.

[0008]

To achieve the above object, the delivery device of the alignment assembly of the present invention has an anchor point, and the offset is the error between the anchor point and one of the centers of the wafer.

【0009】

To achieve the above object, the image pickup device of the alignment assembly of the present invention is an optical camera.

[0010]

To achieve the above object, the axial fine adjustment of the alignment assembly of the present invention is a fine adjustment of an X-Y axis.

[0011]

To achieve the above object, the delivery device of the alignment assembly of the present invention is a take-up bar.

[0012]

To achieve the above object, the alignment method of the present invention comprises the steps of: (a) placing a wafer in a region to be tested; (b) moving the wafer from the region to be tested to a pair of bit regions; (c) utilizing a The image capturing device performs an image capturing process on the wafer; (d) calculating an offset according to the result of the image capturing program; (e) performing an axial fine tuning of the carrier platform according to the offset; and (f) Place the wafer in one of the standard locations defined by the carrier platform.

[0013]

The above objects, technical features, and advantages will be more apparent from the following description.

100‧‧‧ alignment assembly
110‧‧‧Conveyor
112‧‧‧Location points
120‧‧‧Loading platform
122‧‧‧ standard position
130‧‧‧Image capture device
200‧‧‧ wafer

[0014]

Figure 1 is a perspective view of the alignment assembly of the present invention;
2 is a schematic view of the wafer of the alignment assembly of the present invention;
FIG. 3 is a schematic diagram of an image capturing program of the image capturing device of the alignment assembly of the present invention; FIG.
Figure 4 is a schematic view showing the movement of the carrying platform of the alignment assembly of the present invention to the image taking device;
FIG. 5 is a schematic view showing a method for placing a wafer on a carrying platform according to the conveying device of the alignment assembly of the present invention; and FIG. 6 is a schematic diagram showing a method for aligning and positioning the wafer by the alignment assembly of the present invention.

[0015]

As shown in FIG. 1, the present invention is directed to an assembly and method for aligning wafers.

[0016]

As shown, one of the alignment assemblies 100 of the present invention includes a transport device 110, a carrier platform 120, and an image capture device 130. The transport device 110 is adapted to capture and place a wafer 200. The load bearing platform 120 defines a standard position 122 for the carrier platform 120 to movably carry the wafer 200 by the standard position 122. In addition, the image capturing device 130 is disposed between the conveying device 110 and the carrying platform 120 and is used to perform an image capturing process on the wafer 200.

[0017]

Therefore, the wafer 200 is captured by the transport device 110, the image capturing device is used to perform the image capturing process by the image capturing device 130, and finally the wafer 200 is placed on the carrying platform 120 by the transport device 110. At position 122, the alignment and positioning of the wafer 200 is completed, enabling the wafer 200 to perform subsequent inspection yield programs.

[0018]

The operation and cooperation between the components such as the transport device 110, the load bearing platform 120, and the image capturing device 130 will be described below with reference to the contents of FIGS. 2-5.

[0019]

First, as shown in FIG. 2, when the alignment and positioning process of the wafer 200 is to be performed, the transport device 110 first grabs the wafer 200 from a test area or a cassette. Next, as shown in FIG. 3, the transport device 110 places the captured wafer 200 under the image capturing device 130 to perform an image capturing process to enable the loading platform 120 disposed on the opposite side of the area to be tested. An offset can be calculated based on the result of the imaging process. As shown in FIG. 4, based on the calculation of the aforementioned offset, the carrier platform 120 will be able to perform an axial fine adjustment to offset the offset during travel to a predetermined location to carry the wafer 200. Finally, as shown in FIG. 5, after the axial trimming is used to offset the offset, the transport device 110 will be able to accurately place the wafer 200 on the standard position 122 on the carrier platform 120, so that the wafer 200 It is possible to carry out subsequent detection yield and classification operations.

[0020]

In the present embodiment, the transport device 110 is preferably a take-up bar and carries the wafer 200 in a bottom-up manner and then moves the wafer 200. In addition, in the present invention, the surface of the wafer 200 used by the transport device 110 of the alignment assembly 100 has an anchor point, and the anchor point is preferably disposed on one of the surfaces. The central position, and the image capturing process performed by the image capturing device 130 described above is to calculate the error between the positioning point and one of the centers (ie, the center of the wafer) of the wafer 200.

[0021]

Of course, in other implementations, the transport device 110 may be provided with a plurality of positioning points, and the plurality of reference points may be correspondingly disposed on the wafer 200, so that the image capturing device 130 can calculate the complex number when performing the image capturing program. The error value between the anchor point and the complex reference point to increase the accuracy of calculating the offset.

[0022]

In the embodiment, the image capturing device 130 is preferably an optical camera, which can be used to perform an image capturing process, and thereby calculate an error between the positioning point of the conveying device 110 and the center of the wafer 200, so that the carrying platform 120 can be obtained. Depending on the offset, axial fine tuning is performed during the journey to the carrier wafer 200.

[0023]

Therefore, those skilled in the art can easily infer that, in the present embodiment, the process of the loading platform 120 going to the predetermined position only has the XY axial displacement, so the axial fine adjustment of the carrying platform 120 can be only A single X-axis, a single Y-axis or a simultaneous fine-tuning of the XY axis.

[0024]

On the other hand, the aforementioned wafer 200 may be an LED wafer or a double-dip wafer, but is not limited thereto.

[0025]

As shown in Fig. 6, the alignment method of the present invention comprises the following steps:

[0026]

First, as shown in step 601, the wafer 200 is disposed in a region to be tested; as shown in step 602, the wafer 200 is moved from the region to be tested to a pair of regions, wherein the alignment region is taken As shown in step 603, the image capturing device 130 performs an image capturing process on the wafer 200; as shown in step 604, an offset is calculated according to the result of the image capturing program; As shown, the carrier platform 120 is subjected to an axial fine adjustment according to the offset. Finally, as shown in step 606, the wafer 200 is placed in a standard position defined by the carrier platform 120 to complete the wafer 200. Counterpoint.

[0027]

It should be noted that, in the foregoing step 605, the load bearing platform 120 may be first moved to the predetermined position, and then the axial fine adjustment may be performed; or, the axis may be simultaneously performed during the operation of the load bearing platform 120 to the predetermined position. Fine adjustment; or alternatively, the axial adjustment can be performed before the carrier platform 120 is actuated to a predetermined position.

[0028]

However, regardless of the aspect of the foregoing step 605, it is necessary to allow the transport device 110 to place the wafer 200 on the standard position 122 defined by the carrier platform 120 after the carrier platform 120 is actuated to a predetermined position. A collision between the conveying device 110 and the carrying platform 120 is avoided.

[0029]

In summary, with the setting of the alignment assembly 100 of the present invention, the alignment and positioning procedures can be quickly completed before the wafer 200 can be assisted in yield detection, thereby improving detection efficiency and reducing operating costs.

[0030]

The embodiments described above are only intended to illustrate the embodiments of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of protection of the present invention. Any changes or equivalents that can be easily made by those skilled in the art are within the scope of the invention. The scope of the invention should be determined by the scope of the claims.

100‧‧‧ alignment assembly

110‧‧‧Conveyor

112‧‧‧Location points

120‧‧‧Loading platform

122‧‧‧ standard position

130‧‧‧Image capture device

Claims (6)

[Item 1] A aligning assembly for performing a wafer alignment operation, comprising:
a conveying device adapted to grasp and place the wafer;
a load bearing platform having a standard position defined thereon, such that the load bearing platform movably carries the wafer by the standard position; and an image capturing device disposed between the transport device and the transfer bearing platform, and The wafer performs an image capturing process;
After the device picks up the wafer, the wafer is placed under the image capturing device to perform the image capturing process, and the carrier platform then calculates an offset according to the image capturing program to make the carrier platform An axial fine adjustment is performed for the transport device to place the wafer in the standard position of the carrying platform. [Item 2] The alignment assembly of claim 1, wherein the transport device has an anchor point, the offset being an error between the anchor point and a center of the wafer. [Item 3] The alignment assembly of claim 1, wherein the imaging device is an optical camera. [Item 4] The alignment assembly of claim 1, wherein the axial fine tuning is a fine adjustment of an X-Y axis. [Item 5] The alignment assembly of claim 1 wherein the delivery device is a take-up bar. [Item 6] A method of aligning a wafer includes the following steps:
(a) placing the wafer in a region to be tested;
(b) moving the wafer from the area to be tested to a pair of bit areas;
(c) performing an image capturing process on the wafer using an image capturing device;
(d) calculating an offset according to the result of the image capturing program;
(e) subjecting a carrier platform to an axial fine adjustment based on the offset; and (f) placing the wafer in a standard location defined by the carrier platform.