TWI530971B - Wings coil and its making method - Google Patents

Description

Wing coil and manufacturing method thereof

The invention relates to a wing coil and a manufacturing method thereof, in particular to using a connecting bolt with heat pressable characteristics to tightly bond an upper connecting mat and a lower connecting mat, and utilizing a fold line of the upper soft board to make the upper soft board The side areas are easily bent and provide wing coils with flexible, bendable and coil functions.

In general, any electrical product requires a suitable circuit board to carry and connect various electronic components, typically using a rigid circuit board with good mechanical strength and electrical insulation, such as an epoxy substrate with high electrical insulation. However, the rigid circuit board is flat, so it cannot be bent to match the actual application, or the overall space is saved, and it is difficult to apply to a space-constrained field such as a mobile phone. Therefore, it is necessary to use a flexible circuit board with bendable and flexible, which is generally called a soft board, and the current soft board manufacturing technology is quite mature.

In addition, since coils are often required on electrical circuits to provide inductive functions, such as magnetic induction coils, conventional techniques use metallic copper or copper alloys to form spiral patterns by etching or electroplating, as coils, and by chemical etching and machining. Or laser drilling to form holes. Since the existing coils and flexible boards are made by different manufacturers, and the coils and the flexible boards are already punched at the factory, it is necessary to perform the lamination processing, and the coils and the soft boards are attached to each other to complete the required carrier board, and the production procedure is increased. Moreover, when the coil and the flexible board are attached, it is easy to cause a problem of alignment tolerance between the hole of the coil and the hole of the soft board, that is, the alignment is not accurate, which seriously affects the electrical characteristics of the overall carrier.

Furthermore, a plurality of magnetic induction coils can be conventionally fabricated on the same plane to increase the sensing range of the magnetic induction coil, but occupy a limited area or increase the appearance area, which is highly disadvantageous for practical applications.

Therefore, there is a need for a new type of wing coil and a manufacturing method thereof, which utilize a connecting bolt having heat-pressable pressing characteristics to tightly bond the upper connecting pad and the lower connecting pad, and utilize the upper The fold line of the soft board is such that the two side edges of the upper soft board are easily bent, and the wing coils with flexible, bendable and coil functions are provided, in particular, the upper magnetic induction coil, the lower magnetic induction coil and the bottom magnetic induction The coils are integrated into a multi-layer stack structure, which not only avoids the occurrence of alignment tolerances during the bonding process, but also enhances the magnetic induction effect, thereby solving the problems of the above-mentioned conventional techniques.

The main object of the present invention is to provide a wing coil, comprising an upper soft board, at least one upper magnetic induction coil, at least one upper connection pad, a lower soft board, at least a lower magnetic induction coil, at least a lower connection pad, at least one gold finger, and a medium The electrical layer and the at least one connecting plug provide characteristics that are flexible, bendable, and coil functional. In general, the intermediate portion of the wing coil of the present invention is thicker and convex downward, while the two side edges of the wing coil are thinner and thus have a wing-like appearance, and the intermediate portion of the wing coil has an intermediate hole.

The upper soft board and the lower soft board are flexible substrates, which are made of an electrically insulating material, and the dielectric layer is sandwiched between the upper soft board and the lower soft board, and the horizontal size of the upper soft board is larger than the lower part. The lateral dimensions of the soft board.

The upper magnetic induction coil and the lower magnetic induction coil are respectively embedded in the upper soft board and the lower soft board, and have a spiral shape, wherein the upper magnetic induction coil is close to the upper surface of the upper soft board, and the lower magnetic induction coil is close to the lower soft board. surface. In addition, the upper magnetic induction coil and the lower magnetic induction coil are disposed around the intermediate hole and are separated by a dielectric layer.

The gold fingers are disposed on the two side edges of the upper flexible board and are electrically connected to the corresponding upper magnetic induction coils, and each upper connection pad is electrically connected to the corresponding upper magnetic induction coil, and each lower connection pad is Electrically connected to the corresponding lower magnetic induction coil, especially the upper connection pad and the corresponding lower connection pad are aligned with each other in the vertical direction.

The connecting plug has the characteristics of being heatable and pressed, and can be stuffed between the upper connecting pad and the lower connecting pad, or first forming a connecting bolt on the lower surface of the upper connecting pad, or attaching the connecting plug to the upper connecting pad first. The lower surface is further heated and pressed to form the connecting plug to bond the upper connecting pad and the lower connecting pad.

Therefore, the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad, and the lower magnetic induction coil of the present invention are substantially electrically connected.

Furthermore, the lower surface of the upper flexible board has an individual fold at the intersection with the lower soft board. a line, wherein the fold line has a groove shape that is recessed inward or upward, so that the two side edges of the upper flexible board are easily bent, such as bending upward or downward, and the dielectric layer does not extend to the fold line, that is, Since the groove-shaped fold line does not have a dielectric layer, the wing coil of the present invention has bendability and flexibility.

Another object of the present invention is to provide a method for manufacturing a wing coil, which comprises preparing an upper soft board, preparing a dielectric layer, preparing a lower soft board, and heating and pressing in order to make a bendable and flexible Curved wings coil.

Specifically, when preparing the upper flexible board, at least one upper magnetic induction coil, at least one upper connection pad, at least one gold finger, and at least one connection plug are disposed in the upper soft board, and the upper soft board has an intermediate area Middle hole. The upper magnetic induction coil and the upper connection pad are electrically connected and buried in the intermediate portion of the upper flexible board and adjacent to the upper surface of the upper flexible board. The gold finger is disposed on the upper surface of the two side regions of the upper flexible board. In addition, the connecting bolt is disposed on the lower surface of the middle portion of the upper soft board A, and is attached to the bottom of the corresponding upper connecting mat, and the connecting bolt is spherical, columnar or block-shaped, and is made of copper, tin, or The copper alloy or the tin-containing alloy is formed so that the connecting plug has the characteristics of being heatable and pressed, and is easily deformed and deformed by pressing under heating. In particular, the lower surface of the upper flexible sheet individually has a groove-like fold line that is recessed inward or upward at the intersection of the middle and the two side edges.

In the step of preparing the dielectric layer, the dielectric layer is prepared to have a lateral dimension equal to the intermediate portion of the upper flexible sheet, and the intermediate portion of the dielectric layer has an intermediate hole.

When preparing the lower soft board, the lower soft board is prepared to have an intermediate hole in the middle portion, and the lower magnetic induction coil and the lower connection pad are buried in the lower soft board and are close to the lower surface of the lower soft board.

Finally, in the heating and pressing step, the lower soft board, the dielectric layer and the upper soft board are sequentially stacked from bottom to top into a multi-layer stack structure, and the individual intermediate holes are aligned with each other, and under heating, using appropriate pressure The mold is pressed to laminate the multi-layer stack structure so as to be integrated under heating and pressing, wherein the connecting bolt can tightly connect the upper connecting mat and the lower connecting mat when heating and pressing, thereby forming a good electrical connection.

Since the present invention has an upper magnetic induction coil and a lower magnetic induction coil respectively located near the upper surface and the lower surface of the soft board, the magnetic induction effect can be greatly enhanced under a limited area. Moreover, the fold line of the invention can make the two side edges of the soft board easily bend upward or bend downward without causing damage to the buried upper magnetic induction coil and the lower magnetic induction coil, which can expand the application field and improve the load. The convenience and reliability of the board in subsequent assembly and processing.

10‧‧‧Upper magnetic induction coil

10A‧‧‧ connection pad

11‧‧‧Lower magnetic induction coil

11A‧‧‧Connecting mat

12‧‧‧Bottom magnetic induction coil

12A‧‧‧Bottom connection pad

20A‧‧‧Upper soft board

20B‧‧‧low soft board

20C‧‧‧ bottom soft board

22‧‧‧ Gold Finger

23‧‧‧ fold line

24‧‧‧ dielectric layer

24A‧‧‧External dielectric layer

25‧‧‧coating

26‧‧‧Connecting bolt

30‧‧‧Auxiliary cushioning material

H‧‧‧Intermediate hole

S10~S16‧‧‧Steps

S20~S29‧‧‧Steps

The first figure shows a top view of a wing coil in accordance with a first embodiment of the present invention.

The second figure shows a side cross-sectional view of the wing coil in the first figure.

The third figure shows a side cross-sectional view of a wing coil in accordance with a second embodiment of the present invention.

The fourth figure shows an operational flowchart of a method of fabricating a wing coil in accordance with a third embodiment of the present invention.

The fifth A diagram and the fifth D diagram show schematic diagrams of individual processing steps in the fabrication method of the third embodiment.

Fig. 6 is a flow chart showing the operation of the method of manufacturing the wing coil according to the fourth embodiment of the present invention.

7A and 7E show schematic views of individual processing steps in the fabrication method of the fourth embodiment.

The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

Referring to the first and second figures, the first figure is a top view of the wing coil of the first embodiment of the present invention, and the second figure is a side cross-sectional view of the secant line AA of the first figure. As shown in the first and second figures, the wing coil of the first embodiment of the present invention mainly includes an upper soft board 20A, at least one upper magnetic induction coil 10, at least one upper connection pad 10A, a lower soft board 20B, and at least a lower portion. The magnetic induction coil 11, at least a lower connection pad 11A, at least one gold finger 22, a dielectric layer 24, and at least one connection plug 26.

The upper flexible board 20A and the lower soft board 20B are flexible substrates and are electrically Made of a gas-insulated material, such as a resin or plastic material. The dielectric layer 24 is sandwiched between the upper flexible board 20A and the lower flexible board 20B, and the upper flexible board 20A is located on the upper surface of the dielectric layer 24, and the lower flexible board 20B is located on the lower surface of the dielectric layer 24. In particular, the lateral dimension of the upper flexible panel 20A is greater than the lateral dimension of the lower flexible panel 20B. Therefore, as a whole, the intermediate portion of the wing coil of the first embodiment has a thick thickness and protrudes downward, and the thickness of the two side regions of the wing coil is thinner than the thickness of the intermediate portion, and thus has a wing shape. Exterior.

Furthermore, the upper surface of the wing coil of the present invention is a flat surface, and the lower surface has an intermediate convex shape, and the intermediate portion of the wing coil has an intermediate hole H in which the sandwich between the upper soft board 20A and the lower soft board 20B is sandwiched. The electrical layer 24 is penetrated by the intermediate hole H.

Specifically, the upper magnetic induction coil 10 and the lower magnetic induction coil 11 are respectively embedded in the upper soft board 20A and the lower soft board 20B, and have a spiral shape, wherein the upper magnetic induction coil 10 is close to the upper surface of the upper soft board 20A, and The lower magnetic induction coil 11 is near the lower surface of the lower flexible board 20B, and the upper magnetic induction coil 10 and the lower magnetic induction coil 11 are disposed around the intermediate hole H and are separated by the dielectric layer 24.

The gold fingers 22 are disposed on the two side edges of the upper flexible board 20A and are electrically connected to the corresponding upper magnetic induction coils 10, and each of the upper connection pads 10A is electrically connected to the corresponding upper magnetic induction coil 10, and each The lower connection pads 11A are electrically connected to the corresponding lower magnetic induction coils 11, and in particular, the upper connection pads 10A and the corresponding lower connection pads 11A are aligned with each other in the vertical direction. In addition, the dielectric layer 24 is further designed to have at least one hole, and each hole is aligned with the corresponding upper connection pad 10A and lower connection pad 11A. Therefore, the upper connection pad 10A and the lower connection pad 11A can be connected via the connection pin 26 and electrical connection.

Preferably, the connecting plug 26 is made of a conductive metal material such as copper, tin, a copper-containing alloy or a tin-containing alloy. In particular, the connecting bolt 26 has the characteristics of being heatable and pressed, for example, it can be stuffed between the upper connecting pad 10A and the lower connecting pad 11A by a ball, column or block connecting bolt 26, or the upper connecting pad is first used. The lower surface of the 10A forms the connecting plug 26, or the connecting plug 26 is first attached to the lower surface of the upper connecting pad 10A, and then heated and pressed to make the connecting bolt 26 combine with the upper connecting pad 10A and the lower connecting pad 11A. One.

Therefore, the gold finger 22, the upper magnetic induction coil 10, the upper connection pad 10A, the lower connection pad 11A, the connection pin 26, the lower connection pad 11A, and the lower magnetic induction coil of the present invention 11 is essentially an electrical connection as a whole.

The upper magnetic induction coil 10, the upper connection pad 10A, the lower magnetic induction coil 11, the lower connection pad 11A, and the gold finger 22 may be composed of the same or different conductive materials, such as metallic copper, copper alloy, or gold, and the dielectric layer 24 It is made of a dielectric material.

Referring again to the second figure, the lower surface of the upper flexible board 20A has a fold line 23 at the intersection with the lower soft board 20B, wherein the fold line 23 has a groove shape which is recessed inward or upward, so that the two sides of the upper soft board 20A can be made The edge region is easily bent, such as bent upward or downwardly. In particular, the dielectric layer 24 does not extend to the fold line 23, that is, the groove-shaped fold line 23 does not have the dielectric layer 24. Therefore, the wing coil of the present invention is bendable and can provide electrical functions of the coil, and is well suited for use in fields requiring magnetic induction.

In addition, the bottom surface of the two side regions of the upper flexible board 20A may be attached or coated with an external dielectric layer 24A to enhance the isolation protection, wherein the external dielectric layer 24A may be the same as or different from the dielectric layer 24. Made up of electrical materials.

The wing coil of the present invention may further include a coating layer 25 covering the upper surface of the upper soft board 20A and the lower surface of the lower soft board 20B, and covering the periphery of the gold finger 22, wherein the coating layer 25 may be transparent. It is composed of a light or opaque electrical insulating material.

Referring further to the third figure, a side cross-sectional view of a wing coil of a second embodiment of the present invention, wherein the wing coil of the second embodiment is similar to the first embodiment of the first figure, and has a top view like the first figure, Therefore, the same technical features will not be described again.

As shown in the third figure, the main difference between the second embodiment and the first embodiment is that the wing coil of the second embodiment further includes an underlying substrate 20C, at least one underlying magnetic induction coil 12, and at least one underlying connection pad 12A, wherein the underlying substrate 20C is attached to the lower surface of the lower flexible board 20B, and the underlying magnetic induction coil 12 and the underlying connection pad 12A which are electrically connected are embedded in the underlying substrate 20C and are close to the lower surface of the underlying substrate 20C. In particular, each of the bottom connection pads 12A is attached to the corresponding lower connection pad 11A. Further, the base substrate 20C and the lower flexible board 20B have the same lateral dimension.

Another difference of the second embodiment is that the wing coil of the second embodiment may further include a coating layer 25 which is coated on the upper surface of the upper flexible board 20A and the lower surface of the base substrate 20C instead of the first implementation. In the example, the coating layer 25 is coated on the upper surface and the lower surface of the upper soft board 20A. The lower surface of the soft board 20B.

Therefore, in the wing coil of the second embodiment, the gold finger 22, the upper magnetic induction coil 10, the upper connection pad 10A, the connection plug 26, the lower connection pad 11A, the lower magnetic induction coil 11, the bottom connection pad 12A, and the bottom magnetic induction coil 12 are Essentially, they are electrically connected in sequence.

It is to be noted that the wing coil of the second embodiment in the third embodiment is a three-layer stacked structure including the upper flexible board 20B, the lower flexible board 20B, and the base substrate 20C, which is merely an exemplary embodiment of the second embodiment of the present invention. It is not intended to limit the scope of the present invention, that is, the wing coil of the present invention may substantially include an upper flexible board 20B, a lower soft board 20B, and at least one bottom substrate 20C, that is, the present invention may also include a plurality of bottom substrate 20C. In order to form a stack structure of three or more layers.

Referring to the fourth and fifth A and fifth figures, wherein the fourth figure is an operational flowchart of the method for fabricating the wing coil of the third embodiment of the present invention, and the fifth and fifth figures are the third embodiment. A schematic diagram of individual processing steps in the method of making the example.

As shown in the fourth figure, the method for fabricating the wing coil of the third embodiment of the present invention includes steps S10, S12, S14 and S16 for making a wing coil.

First, the method for fabricating the wing coil of the third embodiment first performs step S10 to prepare the upper flexible board 20A as shown in FIG. 5A, and at least one upper magnetic induction coil 10 and at least one upper portion are disposed in the upper flexible board 20A. The pad 10A, at least one gold finger 22, and at least one connecting pin 26 are connected, and the upper flexible plate 20A has an intermediate hole H in the intermediate portion.

The upper magnetic induction coil 10 and the upper connection pad 10A are electrically connected and buried in the intermediate portion of the upper flexible board 20A and close to the upper surface of the upper flexible board 20A, and the gold fingers 22 are disposed on the two side areas of the upper flexible board 20A. Upper surface. Further, the connecting pin 26 is provided on the lower surface of the intermediate portion of the upper flexible board 20A and attached to the bottom of the corresponding upper connecting pad 10A. Preferably, the connecting pin 26 can be spherical, columnar or block-shaped, and is composed of copper, tin, a copper-containing alloy or a tin-containing alloy, and the connecting plug 26 has the characteristics of being heatable and pressed, so that it is easy It is deformed and shaped by pressing under heating.

Further, the lower surface of the upper flexible board 20A has a fold line 23 at the intersection of the intermediate portion and the two side edges, wherein the fold line 23 has a groove shape which is recessed inward or upward.

Next, in step S12, a dielectric layer 24 as shown in FIG. The lateral dimension of the dielectric layer 24 is the same as the lateral dimension of the intermediate portion of the upper flexible board 20A, and has an intermediate hole H in the intermediate portion of the dielectric layer 24. Then, step S14 is performed to prepare a lower flexible board 20B as shown in FIG. 5C, wherein the middle portion of the lower flexible board 20B has an intermediate hole H, and at least a lower magnetic induction coil 11 and at least a lower connection pad electrically connected to each other 11A is embedded in the lower soft board 20B, especially near the lower surface of the lower soft board 20B.

Finally, proceeding to step S16, the lower flexible board 20B, the dielectric layer 24, and the upper soft board 20A are sequentially stacked from bottom to top into a multi-layer stack structure, wherein the individual intermediate holes H are aligned with each other and heated under appropriate use. The stamper is pressed to laminate the multi-layer stack structure, so that the multi-layer stack structure is integrated under heating and pressing. In particular, the connecting bolt 26 can tightly connect the upper connecting pad 10A and the lower connecting pad 11A, as shown in FIG. 5D. Form a good electrical connection.

In addition, the embodiment may further include forming a coating layer 25 to cover the upper surface of the intermediate portion of the upper flexible board 20A and the lower surface of the bottom flexible board 20C while covering the periphery of the gold finger 22, thereby forming a Required wing coils.

Further referring to the sixth figure, the seventh A picture and the seventh E picture, wherein the sixth figure is an operation flowchart of the method for manufacturing the wing coil according to the fourth embodiment of the present invention, and the seventh picture A and the seventh picture E are fourth A schematic representation of individual processing steps in the fabrication methods of the examples.

As shown in the sixth embodiment, the method for fabricating the wing coil of the fourth embodiment of the present invention includes steps S20, S22, S24, S26, and S28 for fabricating a wing coil, which is a manufacturing method similar to the third embodiment described above, wherein Steps S20, S22, and S24 of the fourth embodiment are the same as S10, S12, and S14 of the third embodiment, respectively preparing the upper flexible board 20A, the dielectric layer 24, and the preparation lower soft board 20B, and as in the seventh A The figure, the seventh B, and the seventh C are shown, and thus will not be described again.

Specifically, in the step S26 of the manufacturing method of the fourth embodiment, the bottom soft board 20C as shown in FIG. C is prepared, and the bottom soft board 20C is attached to the lower surface of the lower soft board 20B to be combined into a stack. The bottom soft board 20C is similar to the lower soft board 20B, has at least one bottom magnetic induction coil 12 and at least one bottom connection pad 12A electrically connected, and has an intermediate hole H in the middle portion of the bottom soft board 20C.

Finally, in step S28, heating and pressing are performed to form a multi-layer stack structure as shown in FIG. 7D, mainly stacking the stack, the dielectric layer 24 and the upper soft board 20A sequentially from bottom to top, in particular Individual intermediate holes H need to be aligned with each other and heated again, using compression molding The adjacent upper soft board 20A, the lower soft board 20B, and the bottom soft board 20C are combined with each other, and the connection pad 26 is electrically connected by tightly bonding the upper connection pad 10A and the lower connection pad 11A by heat pressing.

In addition, the embodiment may further include a step S29, as shown in the seventh E, forming the cladding layer 25 to cover the upper surface of the intermediate portion of the upper flexible board 20A and the lower surface of the bottom flexible board 20C while being covered. The circumference of the gold finger 22 thus forms the desired wing coil.

In addition, if the upper flexible board 20A and the seventh B-shaped dielectric layer 24 of FIG. 7 are larger than the lower flexible board 20B of the seventh C diagram, the upper flexible board 20A and the intermediate soft board 20A and the medium are pressed in step S28. The two side edge portions of the electric layer 24 are suspended by the lower soft board 20B, and are easily bent and deformed, especially the gold finger 22 of the upper soft board 20A, which seriously affects the heating and pressing process. Yield. Therefore, in order to improve the yield of the step S28, the auxiliary cushioning material 30 equal to or larger than the upper soft board 20A may be added to the bottom of the bottom soft board 20C, wherein the auxiliary cushioning material 30 has two convex portions for the cushion body, respectively The gold fingers 22 of the upper flexible board 20A are aligned to support the upper side edges of the upper flexible board 20A and the dielectric layer 24, thereby protecting the gold fingers 22 of the upper flexible board 20A. Next, as shown in FIG. E, the auxiliary cushioning material 30 is removed, and a coating layer 25 is formed on the upper surface of the upper flexible board 20A and the lower surface of the bottom soft board 20C, respectively.

Preferably, the auxiliary cushioning material 30 may be composed of silicone or pulp, and the surface of the auxiliary cushioning material 30 may be further covered with a release film to help facilitate the direct removal of the cushioning material 30.

Therefore, in the wing coil manufactured in the fourth embodiment, the gold finger 22, the upper magnetic induction coil 10, the upper connection pad 10A, the connection plug 26, the lower connection pad 11A, the lower magnetic induction coil 11, the bottom connection pad 12A, and the bottom magnetic induction coil 12 is qualitatively connected in sequence.

In summary, the present invention is characterized in that the upper magnetic induction coil, the lower magnetic induction coil and the bottom magnetic induction coil are disposed in an individual soft board, and are integrated by heating and pressing, so that the density of the coil is greatly increased, thereby enhancing the magnetic induction capability. The problem of the alignment tolerance of the individual holes encountered in the conventional coil carrier when the individually fabricated coil and the flexible board are processed can be avoided.

Another feature of the present invention is that the flexible board has a fold line design, so that the two side edges of the soft board can be easily bent upward or bent downward without the buried upper magnetic induction coil, the lower magnetic induction coil or the bottom. The magnetic induction coil causes damage and can be matched with the actual geometric construction. It is necessary to make appropriate bending, expand the application field, and improve the convenience and reliability of the subsequent assembly and processing of the carrier.

In addition, the connecting bolt of the present invention can be heated and pressed, can be tightly combined with the connecting mat to form a good electrical connection, and thus has the advantages of lower manufacturing cost, can help the price advantage in the market, and can greatly improve Industrial utilization in the existing market.

The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, and any modifications or alterations to the present invention made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention.

10‧‧‧Upper magnetic induction coil

10A‧‧‧ connection pad

11‧‧‧Lower magnetic induction coil

11A‧‧‧Connecting mat

20A‧‧‧Upper soft board

20B‧‧‧low soft board

20C‧‧‧Bottom substrate

22‧‧‧ Gold Finger

23‧‧‧ fold line

24‧‧‧ dielectric layer

24A‧‧‧External dielectric layer

25‧‧‧coating

26‧‧‧Connecting bolt

H‧‧‧Intermediate hole

Claims (20)

A wing coil for providing magnetic induction and having flexibility and bendability, and having a wing-like appearance with a thicker lower portion and a thinner side with a lower side, including: an upper soft board, The flexible substrate is made of an electrically insulating material and has an intermediate portion and two side regions, and the intermediate portion of the upper flexible plate has an intermediate hole; at least one upper magnetic induction coil is embedded in the upper portion a flexible plate having a spiral shape and close to an upper surface of the upper flexible plate; at least one upper connection pad, each of the upper connection pads being electrically connected to the corresponding upper magnetic induction coil; and a lower soft plate The flexible substrate is made of an electrically insulating material and has an intermediate portion and two side regions, and the intermediate portion of the lower flexible plate has an intermediate hole, and the lateral size of the lower flexible plate is smaller than the upper portion. The lateral dimension of the plate; at least the lower magnetic induction coil is embedded in the lower soft plate and has a spiral shape and is close to the lower surface of the lower soft plate; at least a lower connection pad, each lower connection Is electrically connected to the corresponding lower magnetic induction coil, and the upper connection pad and the corresponding lower connection pad are aligned with each other in a vertical direction; at least one gold finger is disposed on two side edges of the upper soft board And electrically connected to the corresponding upper magnetic induction coil; a dielectric layer is sandwiched between the upper soft board and the lower soft board, and the upper soft board is located on an upper surface of the dielectric layer And the lower flexible board is located on a lower surface of the dielectric layer, the dielectric layer has at least one hole, and each hole is aligned with the corresponding upper connection pad and the lower connection pad; and at least one connection plug , is composed of a conductive metal material, each connecting plug is configured to pass through a hole of the dielectric layer and is located between the corresponding upper connecting pad and the lower connecting pad, and the connecting plug The upper magnetic pad and the lower magnetic induction coil are respectively disposed on the upper soft board and are respectively coupled to the upper connection pad and the lower connection pad to form an electrical connection by heating and pressing. The intermediate hole of the lower flexible board is surrounded by the dielectric layer, and the lower surface of the upper flexible board has a fold line at the intersection with the lower soft board, and the fold line has an inward or upward recess The groove shape is such that the two side edges of the upper flexible board are easily bent, including upward bending or downward bending, and the dielectric layer does not extend to the folding line. The wing coil according to claim 1, wherein the upper soft board and the lower soft board are made of a resin or a plastic material, and the connecting plug is made of copper, tin, a copper-containing alloy or a tin-containing alloy, and It is spherical, columnar or blocky. The wing coil of claim 1, wherein the upper magnetic induction coil, the upper connection pad, the lower magnetic induction coil, the lower pad, and the gold finger are made of the same or different conductive materials, and the The conductive material includes metallic copper, copper alloy or gold, and the dielectric layer is composed of a dielectric material. The wing coil according to claim 1, wherein a bottom surface of the two side regions of the upper flexible board is attached or coated with an external dielectric layer, and the external dielectric layer is the same or different from the The dielectric material of the dielectric layer is composed of a dielectric material. The wing coil according to claim 1, further comprising a coating layer, wherein the coating layer is coated on an upper surface of the upper soft board and a lower surface of the lower soft board, and is covered by the Around the gold finger, and the coating layer is made of a light-transmitting or opaque electrical insulating material. Composition. A wing coil for providing magnetic induction and having flexibility and bendability, and having a wing-like appearance with a thicker lower portion and a thinner side with a lower side, including: an upper soft board, The flexible substrate is made of an electrically insulating material and has an intermediate portion and two side regions, and the intermediate portion of the upper flexible plate has an intermediate hole; at least one upper magnetic induction coil is embedded in the upper portion a flexible plate having a spiral shape and close to an upper surface of the upper flexible plate; at least one upper connection pad, each of the upper connection pads being electrically connected to the corresponding upper magnetic induction coil; and a lower soft plate The flexible substrate is made of an electrically insulating material and has an intermediate portion and two side regions, and the intermediate portion of the lower flexible plate has an intermediate hole, and the lateral size of the lower flexible plate is smaller than the upper portion. The lateral dimension of the plate; at least the lower magnetic induction coil is embedded in the lower soft plate and has a spiral shape and is close to the lower surface of the lower soft plate; at least a lower connection pad, each lower connection Is electrically connected to the corresponding lower magnetic induction coil, and the upper connection pad and the corresponding lower connection pad are aligned with each other in a vertical direction; at least one gold finger is disposed on two side edges of the upper soft board And electrically connected to the corresponding upper magnetic induction coil; a dielectric layer is sandwiched between the upper soft board and the lower soft board, and the upper soft board is located on an upper surface of the dielectric layer And the lower flexible board is located on a lower surface of the dielectric layer, the dielectric layer has at least one hole, and each hole is aligned with the corresponding upper connection pad and the lower connection pad; at least one connection plug, Composed of a conductive metal material, each connecting plug is configured to pass through the dielectric a hole of the layer is located between the corresponding upper connection pad and the lower connection pad, and the connection pin has a property of being heatable and pressed, thereby tightly bonding the upper connection pad and the lower connection pad by heat pressing To form an electrical connection, a bottom soft board, which is located under the lower soft board, is a flexible substrate, is made of an electrically insulating material, and has an intermediate portion and two side edges, and the upper soft board The intermediate portion has an intermediate hole, and the lateral flexible plate has a lateral dimension equal to the lateral dimension of the lower flexible plate; at least one bottom magnetic induction coil is embedded in the bottom flexible plate and has a spiral shape and is adjacent to the a bottom surface of the bottom flexible board; and at least one bottom connection pad, each bottom connection pad being electrically connected to the corresponding bottom magnetic induction coil, and the bottom connection pad and the corresponding lower connection pad are mutually perpendicular in a vertical direction Aligning; wherein the upper magnetic induction coil, the lower magnetic induction coil, and the bottom magnetic induction coil are respectively disposed on the upper soft board, the lower soft board, and the bottom soft board The upper magnetic induction coil and the lower magnetic induction coil are separated by the dielectric layer, and the lower surface of the upper flexible board has a fold line at the intersection with the lower soft board, and the fold line has an inward line Or a groove shape that is recessed upward so that the two side edges of the upper flexible board are easily bent, including upward bending or downward bending, and the dielectric layer does not extend to the folding line. The wing coil according to claim 6, wherein the upper soft board, the lower soft board and the bottom soft board are made of a resin or a plastic material, and the connecting plug is made of copper, tin, a copper-containing alloy or It is made of tin alloy and is spherical, columnar or blocky. The wing coil of claim 6, wherein the upper magnetic induction coil, the upper connection pad, the lower magnetic induction coil, the lower pad, the bottom magnetic induction coil, the bottom pad, and the gold finger are the same Or a different conductive material, and the conductive material package Metal copper, copper alloy or gold is included, and the dielectric layer is composed of a dielectric material. The wing coil of claim 6, wherein the bottom surface of the two side regions of the upper flexible board is attached or coated with an external dielectric layer, and the external dielectric layer is the same or different The dielectric material of the dielectric layer is composed of a dielectric material. The wing coil according to claim 6, further comprising a coating layer, wherein the coating layer is coated on the upper surface of the upper soft board and the lower surface of the bottom soft board, and is covered by the The periphery of the gold finger, and the coating layer is composed of a light-transmitting or opaque electrical insulating material. A method for manufacturing a wing coil for manufacturing a wing coil having a magnetic induction function and a bendable and flexible shape, comprising: preparing an upper soft board, wherein the upper soft board is provided with at least one upper magnetic induction coil, At least one upper connection pad, at least one gold finger and at least one connection plug, and the upper flexible board has an intermediate hole in an intermediate portion, and the upper magnetic induction coil and the upper connection pad are electrically connected and embedded in the upper soft a middle portion of the plate adjacent to an upper surface of the upper flexible plate, the gold finger being disposed on an upper surface of the two side edges of the upper flexible plate, the connecting pin being disposed on a lower surface of the intermediate portion of the upper flexible plate And attached to the bottom of the corresponding upper connection pad; preparing a dielectric layer, the lateral dimension of the dielectric layer is the same as the lateral dimension of the intermediate portion of the upper flexible board, and the intermediate portion of the dielectric layer has a middle hole; preparing a lower soft plate, wherein the upper soft plate is provided with at least a lower magnetic induction coil and at least a lower connection pad, and the lower soft plate has an intermediate hole in an intermediate portion, and the lower flexible plate has an intermediate hole The magnetic induction coil portion and a lower portion of the connection pads are electrically connected and embedded in the lower flexible inner plate and the intermediate region near the The lower surface of the lower flexible board; and the heating and pressing, comprising stacking the lower soft board, the dielectric layer and the upper soft board from bottom to top in a multi-layer stack structure, and the lower soft board, the lower soft board The electrical layer and the individual intermediate holes of the upper flexible board are aligned with each other, and under heating, a die is pressed to press the multi-layer stack structure, so that the multi-layer stack structure is integrated under heating and pressing, and the connection is The plug is made of a conductive metal material and has a heating and pressing property, and is disposed through a hole of the dielectric layer between the corresponding upper connecting pad and the lower connecting pad, so that the connecting plug After being heated and pressed, the upper connecting pad and the lower connecting pad are tightly coupled to form an electrical connection, wherein a lower surface of the upper flexible board has a fold line at the intersection of the intermediate portion and the two side edges, and each The fold lines have a groove shape that is recessed inward or upward so that the two side edges of the upper flexible board are easily bent, including upward bending or downward bending, and the dielectric layer does not extend to the fold line. The manufacturing method according to claim 11, wherein the upper soft board and the lower soft board are made of a resin or a plastic material, and the connecting plug is made of copper, tin, a copper-containing alloy or a tin-containing alloy, and is Spherical, columnar or blocky. According to the manufacturing method of claim 11, wherein the upper magnetic induction coil, the upper connection pad, the lower magnetic induction coil, the lower pad and the gold finger are made of the same or different conductive materials, and the conductive material comprises Metallic copper, copper alloy or gold, and the dielectric layer is composed of a dielectric material. According to the manufacturing method of claim 11, wherein the bottom surface of the two side regions of the upper flexible board is attached or coated with an external dielectric layer, and the external dielectric layer is the same as or different from the dielectric layer. The dielectric layer is composed of a dielectric material. According to the manufacturing method of claim 11, further comprising coating or coating a coating layer on the upper surface of the upper flexible board and the lower surface of the lower soft board, wherein the coating layer is coated on the upper soft board The upper surface and the lower surface of the lower soft board are coated around the gold finger, and the coating layer is made of a light-transmitting or opaque electrical insulating material. A method for manufacturing a wing coil for manufacturing a wing coil having a magnetic induction function and a bendable and flexible shape, comprising: preparing an upper soft board, wherein the upper soft board is provided with at least one upper magnetic induction coil, At least one upper connection pad, at least one gold finger and at least one connection plug, and the upper flexible board has an intermediate hole in an intermediate portion, and the upper magnetic induction coil and the upper connection pad are electrically connected and embedded in the upper soft a middle portion of the plate adjacent to an upper surface of the upper flexible plate, the gold finger being disposed on an upper surface of the two side edges of the upper flexible plate, the connecting pin being disposed on a lower surface of the intermediate portion of the upper flexible plate And attached to the bottom of the corresponding upper connection pad; preparing a dielectric layer, the lateral dimension of the dielectric layer is the same as the lateral dimension of the intermediate portion of the upper flexible board, and the intermediate portion of the dielectric layer has a middle hole; preparing a lower soft plate, wherein the upper soft plate is provided with at least a lower magnetic induction coil and at least a lower connection pad, and the lower soft plate has an intermediate hole in an intermediate portion, and the lower flexible plate has an intermediate hole The magnetic induction coil and the lower connection pad are electrically connected and buried in an intermediate portion of the lower flexible board and adjacent to a lower surface of the lower flexible board; a bottom soft board is prepared, and the bottom soft board is attached thereto The bottom surface of the lower flexible board is combined into a stack, the bottom soft board is provided with at least one bottom magnetic induction coil and at least one bottom connection pad, and the bottom soft board has an intermediate hole in an intermediate portion, and the bottom magnetic induction coil as well as The bottom connection pad is electrically connected and buried in an intermediate portion of the bottom flexible board and adjacent to a lower surface of the bottom flexible board; and is heated and pressed to include the stacked body, the dielectric layer, and the upper flexible board Sequentially stacked from bottom to top into a multi-layer stack structure, and the bottom soft board, the lower soft board, the dielectric layer and the individual intermediate holes of the upper soft board are aligned with each other, and under heating, a stamper is used Pressing the multi-layer stack structure such that the multi-layer stack structure is integrated under heating and pressing, and the connecting plug is made of a conductive metal material and has the characteristics of being heatable and pressed, and is configured to pass through the medium. a hole of the electric layer is located between the corresponding upper connection pad and the lower connection pad, so that the connection pin is heat-pressed to tightly bond the upper connection pad and the lower connection pad to form an electrical connection, wherein the upper part The lower surface of the flexible board has a fold line at the intersection of the intermediate portion and the two side edges, and each fold line has a groove shape recessed inward or upward so that the two sides of the upper soft board Easy to bend, bending upward or downward comprising a bent and the dielectric layer does not extend to the fold line. The manufacturing method according to claim 16, wherein the upper soft board, the lower soft board and the bottom soft board are made of a resin or a plastic material, and the connecting plug is made of copper, tin, a copper-containing alloy or tin. It is made of alloy and is spherical, columnar or blocky. The manufacturing method of claim 16, wherein the upper magnetic induction coil, the upper connection pad, the lower magnetic induction coil, the lower pad, the bottom magnetic induction coil, the bottom pad, and the gold finger are the same or different The conductive material comprises a metallic copper, a copper alloy or gold, and the dielectric layer is composed of a dielectric material. According to the manufacturing method of claim 16, wherein the bottom surface of the two side regions of the upper flexible board is attached or coated with an external dielectric layer, and the external dielectric layer is the same as or different from the dielectric layer. The dielectric material of the layer is formed. According to the manufacturing method of claim 16, further comprising coating or coating a coating layer on the upper surface of the upper flexible board and the lower surface of the lower soft board, wherein the coating layer is coated on the upper soft board The upper surface and the lower surface of the bottom soft plate are coated around the gold finger, and the coating layer is made of a light transmissive or opaque electrical insulating material.