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TWI522868B - Touch panel - Google Patents

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Publication number
TWI522868B
TWI522868B TW103139645A TW103139645A TWI522868B TW I522868 B TWI522868 B TW I522868B TW 103139645 A TW103139645 A TW 103139645A TW 103139645 A TW103139645 A TW 103139645A TW I522868 B TWI522868 B TW I522868B
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Taiwan
Prior art keywords
bonding pad
conductive layer
line
transmission
electrically connected
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TW103139645A
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Chinese (zh)
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TW201617807A (en
Inventor
劉貴文
王朝珍
陳志成
陳昭全
蘇丁茂
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友達光電股份有限公司
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Application filed by 友達光電股份有限公司 filed Critical 友達光電股份有限公司
Priority to TW103139645A priority Critical patent/TWI522868B/en
Priority to CN201510001571.1A priority patent/CN104656978B/en
Application granted granted Critical
Publication of TWI522868B publication Critical patent/TWI522868B/en
Publication of TW201617807A publication Critical patent/TW201617807A/en

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Description

觸控面板 Touch panel

本發明係關於一種觸控面板,特別關於一種具有高感應區域面積比的觸控面板。 The present invention relates to a touch panel, and more particularly to a touch panel having a high sensing area ratio.

觸控面板是觸控螢幕中最重要的元件,而觸控螢幕做為一種便利的輸入/輸出裝置,目前被廣泛的應用於許多可攜式裝置。對於觸控螢幕而言,感應區域的面積相較於整個觸控螢幕的面積的比例越大越好。 The touch panel is the most important component in the touch screen, and the touch screen is a convenient input/output device, and is widely used in many portable devices. For a touch screen, the larger the ratio of the area of the sensing area to the area of the entire touch screen, the better.

此外,觸控面板的製程有分為「單導電層」與「雙導電層」兩種。單導電層觸控面板相較於雙導電層觸控面板而言,由於少了一個導電層,因此成本可以相對較低。然而,由於單導電層觸控面板具有較多的接合墊,導致其感應區域的面積會因此受限。此外,單導電層觸控面板中的多個同類別的傳輸端必需透過軟性電路板來橋接。綜上所述,如何提高觸控面板的感應區域的面積相較於整個觸控面板的面積的比例是一個有待克服的問題。 In addition, the manufacturing process of the touch panel is divided into "single conductive layer" and "double conductive layer". Compared with the double conductive layer touch panel, the single conductive layer touch panel can be relatively low in cost due to the lack of one conductive layer. However, since the single conductive layer touch panel has more bonding pads, the area of the sensing area thereof is thus limited. In addition, multiple transmission terminals of the same type in a single conductive layer touch panel must be bridged through a flexible circuit board. In summary, how to increase the ratio of the area of the sensing area of the touch panel to the area of the entire touch panel is a problem to be overcome.

有鑑於以上的問題,本發明提出一種觸控面板,藉由應用邊框與元件之間的空隙,配置連接線,以減少必須 配置的接合墊的數量,並降低繞線的複雜度,從而減少了邊框的寬度,提高了感應區域的面積相較於整個觸控面板的面積的比例。 In view of the above problems, the present invention provides a touch panel, which is configured to reduce the necessity by applying a gap between a frame and a component. The number of bonding pads is configured, and the complexity of the winding is reduced, thereby reducing the width of the frame and increasing the ratio of the area of the sensing area to the area of the entire touch panel.

依據本發明一個或多個實施例所揭露的一種觸控面板,包括:基板、導電層、多個第一傳輸端、多個第二傳輸端、多個第三傳輸端、至少一個第一接合墊、至少一個第二接合墊、至少一個第三接合墊、一條第一連接線、一條第一導線、至少一條第二導線與至少一條第三導線。其中基板的上表面定義有感應區與環繞感應區的非感應區,非感應區定義有第一側邊、第二側邊、第三側邊與第四側邊,其中第一側邊相對於第三側邊,第二側邊相對於第四側邊。導電層位於基板的上表面。前述多個第一傳輸端位於導電層,對應於感應區且相鄰於第一側邊。前述多個第二傳輸端位於導電層,對應於感應區且相鄰於前述多個第一傳輸端,前述多個第一傳輸端位於第二傳輸端與第一側邊之間。前述多個第三傳輸端位於導電層,對應於感應區且相鄰於第三側邊。第一接合墊、第二接合墊與第三接合墊均位於導電層且對應於第三側邊。第一連接線位於導電層,對應於第一側邊,且與前述多個第一傳輸端電性連接。第一導線位於導電層,電性連接於前述多個第一傳輸端其中之一與前述第一接合墊之間。第二導線位於導電層,電性連接於前述多個第二傳輸端與前述第二接合墊之間。第三導線位於導電層,電性連接於 前述多個第三傳輸端與前述第三接合墊之間。 A touch panel according to one or more embodiments of the present invention includes: a substrate, a conductive layer, a plurality of first transmission ends, a plurality of second transmission ends, a plurality of third transmission ends, and at least one first junction a pad, at least one second bond pad, at least one third bond pad, a first connection line, a first wire, at least one second wire, and at least one third wire. The upper surface of the substrate defines a sensing area and a non-sensing area surrounding the sensing area, and the non-sensing area defines a first side, a second side, a third side and a fourth side, wherein the first side is opposite to the first side The third side is opposite to the fourth side. The conductive layer is on the upper surface of the substrate. The plurality of first transmission ends are located on the conductive layer, corresponding to the sensing area and adjacent to the first side. The plurality of second transmission ends are located on the conductive layer, corresponding to the sensing area and adjacent to the plurality of first transmission ends, and the plurality of first transmission ends are located between the second transmission end and the first side. The plurality of third transmission ends are located on the conductive layer, corresponding to the sensing area and adjacent to the third side. The first bonding pad, the second bonding pad and the third bonding pad are both located on the conductive layer and correspond to the third side. The first connecting line is located on the conductive layer, corresponding to the first side, and is electrically connected to the plurality of first transmitting ends. The first wire is located on the conductive layer and electrically connected between one of the plurality of first transmission ends and the first bonding pad. The second wire is located on the conductive layer and electrically connected between the plurality of second transmission ends and the second bonding pad. The third wire is located on the conductive layer and is electrically connected to The plurality of third transmission ends are between the third bonding pad and the third bonding pad.

綜上所述,本發明所揭露的一種觸控面板,可以以一層導電層實現,並且所述的觸控面板上的部份傳輸端藉由觸控面板的邊框與導線間的間隙來繞線而彼此電性連接。所實現的觸控面板具有較少的接合墊數量,而此一觸控面板要連接至軟性電路板的接合墊數量減少,可以降低接合部的面積來提高感應區域佔整個觸控面板的比例。如此可以提高觸控面板的利用率。 In summary, the touch panel disclosed in the present invention can be implemented by a conductive layer, and a part of the transmission end of the touch panel is wound by a gap between the frame of the touch panel and the wire. They are electrically connected to each other. The touch panel has a smaller number of bonding pads, and the number of bonding pads of the touch panel to be connected to the flexible circuit board is reduced, and the area of the bonding portion can be reduced to increase the ratio of the sensing area to the entire touch panel. This can improve the utilization of the touch panel.

以上之關於本發明內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理,並且提供本發明之專利申請範圍更進一步之解釋。 The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention.

1000、1000’、1000”、1000a‧‧‧觸控面板 1000, 1000', 1000", 1000a‧‧‧ touch panels

1100‧‧‧基板 1100‧‧‧Substrate

1200‧‧‧導電層 1200‧‧‧ Conductive layer

1311、1321、1331、1341、1351‧‧‧傳輸端 1311, 1321, 1331, 1341, 1351‧‧‧ transmission end

1313、1323、1333、1343、1353‧‧‧接合墊 1313, 1323, 1333, 1343, 1353‧‧‧ joint pads

1314、1324‧‧‧連接線 1314, 1324‧‧‧ connection line

1315、1325、1335、1345、1355‧‧‧導線 1315, 1325, 1335, 1345, 1355‧‧‧ wires

13R1~13R3‧‧‧接收線 13R1~13R3‧‧‧ receiving line

13R11~13R13‧‧‧接合墊 13R11~13R13‧‧‧ joint pad

13G1‧‧‧接地線 13G1‧‧‧ grounding wire

13G2‧‧‧接合墊 13G2‧‧‧ joint pad

1400‧‧‧感應區 1400‧‧ ‧ Sensing area

1500‧‧‧非感應區 1500‧‧‧ non-sensing area

1510、1520、1530、1540‧‧‧側邊 1510, 1520, 1530, 1540‧‧‧ side

1610‧‧‧放電保護線 1610‧‧‧Discharge protection line

1620‧‧‧放電接合墊 1620‧‧‧Discharge bonding pads

2000‧‧‧軟性電路板 2000‧‧‧Soft circuit board

2101~2105‧‧‧連接線 2101~2105‧‧‧Connecting line

2106A~2106B‧‧‧連接線 2106A~2106B‧‧‧Connecting line

2107~2108‧‧‧連接線 2107~2108‧‧‧Connection line

3000‧‧‧處理器 3000‧‧‧ processor

第1圖係依據本發明一實施例的觸控面板俯視示意圖。 1 is a top plan view of a touch panel according to an embodiment of the invention.

第2圖係對應於第1圖2-2’線的剖面示意圖。 Fig. 2 is a schematic cross-sectional view corresponding to the line 2-2' of Fig. 1.

第3圖係依據本發明一實施例的觸控面板俯視示意圖。 FIG. 3 is a top plan view of a touch panel according to an embodiment of the invention.

第4圖係依據本發明一實施例中的觸控面板部分放大示意圖。 4 is an enlarged schematic view of a portion of a touch panel in accordance with an embodiment of the present invention.

第5圖係依據本發明再一實施例的觸控面板俯視示意圖。 FIG. 5 is a top plan view of a touch panel according to still another embodiment of the present invention.

第6圖係依據本發明又一實施例的觸控面板俯視示意圖。 FIG. 6 is a top plan view of a touch panel according to still another embodiment of the present invention.

以下在實施方式中詳細敘述本發明之詳細特徵 以及優點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。 The detailed features of the present invention are described in detail below in the embodiments. And the advantages are sufficient to enable anyone skilled in the art to understand the technical contents of the present invention and to implement the present invention, and the skilled artisan can easily understand the present invention based on the contents disclosed in the specification, the patent application scope and the drawings. Related purposes and advantages. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

請參照第1圖與第2圖,其係依據本發明一實施例所揭露的一種觸控面板,其中第1圖係依據本發明一實施例的觸控面板俯視示意圖,第2圖係對應於第1圖2-2’線的剖面示意圖。如第1圖所示,所揭露的觸控面板1000包括基板1100、多個第一傳輸端1311、多個第二傳輸端1321、多個第三傳輸端1331、多個第四傳輸端1341、多個第五傳輸端1351、一個第一接合墊1313、多個第二接合墊1323、多個第三接合墊1333、多個第四接合墊1343、多個第五接合墊1353、一條第一連接線1314、一條第一導線1315、多條第二導線1325、多條第三導線1335、多條第四導線1345與多條第五導線1355。 1 and 2 are a top view of a touch panel according to an embodiment of the invention, and FIG. 2 is a top view of the touch panel according to an embodiment of the invention. Fig. 1 is a schematic cross-sectional view of the line 2-2'. As shown in FIG. 1 , the disclosed touch panel 1000 includes a substrate 1100 , a plurality of first transmission ends 1311 , a plurality of second transmission ends 1321 , a plurality of third transmission ends 1331 , and a plurality of fourth transmission ends 1341 . a plurality of fifth transmission terminals 1351, a first bonding pad 1313, a plurality of second bonding pads 1323, a plurality of third bonding pads 1333, a plurality of fourth bonding pads 1343, a plurality of fifth bonding pads 1353, and a first The connecting line 1314, a first wire 1315, a plurality of second wires 1325, a plurality of third wires 1335, a plurality of fourth wires 1345 and a plurality of fifth wires 1355.

其中基板1100的上表面定義有感應區1400與環繞感應區1400的非感應區1500,非感應區1500定義有第一側邊1510、第二側邊1520、第三側邊1530與第四側邊1540,其中第一側邊1510相對於第三側邊1530,第二側邊1520相對於第四側邊1540。並由第2圖可知,導電層1200位於基板1100的上表面。 The upper surface of the substrate 1100 defines a sensing area 1400 and a non-sensing area 1500 surrounding the sensing area 1400. The non-sensing area 1500 defines a first side 1510, a second side 1520, a third side 1530 and a fourth side. 1540, wherein the first side 1510 is opposite the third side 1530 and the second side 1520 is opposite the fourth side 1540. As can be seen from FIG. 2, the conductive layer 1200 is located on the upper surface of the substrate 1100.

導電層1200中有導電材料以及絕緣材料,絕緣材料是用以分隔導電材料,以使導電材料可以依位置與功用被分隔成前述的多個第一傳輸端1311、第二傳輸端1321、第三傳輸端1331、第一接合墊1313、第二接合墊1323、第三接合墊1333、第四接合墊、第五接合墊、第一連接線1314、第一導線1315、第二導線1325、第三導線1335、第四導線1345與第五導線1355。 The conductive layer 1200 has a conductive material and an insulating material. The insulating material is used to separate the conductive material, so that the conductive material can be separated into the foregoing plurality of first transmitting ends 1311, second transmitting ends 1321, and third according to position and function. The transmitting end 1331, the first bonding pad 1313, the second bonding pad 1323, the third bonding pad 1333, the fourth bonding pad, the fifth bonding pad, the first connection line 1314, the first wire 1315, the second wire 1325, and the third A wire 1335, a fourth wire 1345, and a fifth wire 1355.

每個第一傳輸端1311都對應於感應區1400且相鄰於第一側邊1510。每個第二傳輸端1321。 Each of the first transmission ends 1311 corresponds to the sensing area 1400 and is adjacent to the first side 1510. Each second transmission end 1321.

也都對應於感應區1400且相鄰於一個第一傳輸端1311,每個第一傳輸端1311位於一個第二傳輸端1321與第一側邊1510之間。每個第三傳輸端1331對應於感應區1400且相鄰於第三側邊1530。第一接合墊1313、第二接合墊1323與第三接合墊1333均對應於第三側邊。第一連接線1314對應於第一側邊1510,且與所有的第一傳輸端1311電性連接。於本實施例中,第一導線1315電性連接於最靠近第二側邊1520的第一傳輸端1311與第一接合墊1313之間。 Also corresponding to the sensing area 1400 and adjacent to a first transmitting end 1311, each first transmitting end 1311 is located between a second transmitting end 1321 and the first side 1510. Each of the third transmission ends 1331 corresponds to the sensing area 1400 and is adjacent to the third side 1530. The first bonding pad 1313, the second bonding pad 1323, and the third bonding pad 1333 each correspond to the third side. The first connecting line 1314 corresponds to the first side 1510 and is electrically connected to all the first transmitting ends 1311. In the embodiment, the first wire 1315 is electrically connected between the first transmission end 1311 closest to the second side 1520 and the first bonding pad 1313.

於本實施例中,每一條第二導線1325電性連接於一個第二傳輸端1321與一個第二接合墊1323之間。每一條第三導線1335電性連接於一個第三傳輸端1331與一個第三接合墊1333之間。每一條第四導線1345電性連接於一個第四傳輸端1341與一個第四接合墊1343之間。每一條第五 導線1355電性連接於一個第五傳輸端1351與一個第五接合墊1353之間。 In this embodiment, each of the second wires 1325 is electrically connected between a second transmission end 1321 and a second bonding pad 1323. Each of the third wires 1335 is electrically connected between a third transmission end 1331 and a third bonding pad 1333. Each of the fourth wires 1345 is electrically connected between a fourth transmitting end 1341 and a fourth bonding pad 1343. Each fifth The wire 1355 is electrically connected between a fifth transmission end 1351 and a fifth bonding pad 1353.

並且,於第1圖可以看出觸控面板1000更包括多條接收線13R1~13R3、多條接地線13G1、多個接收接合墊13R11、13R12、13R13與多個接地接合墊13G2,接收線13R1~13R3均位於導電層1200且對應於感應區1400。每一條接地線13G1位於導電層1200且對應於感應區1400。接收接合墊13R11~13R13均位於導電層1200且對應於第三側邊1530。每一條接地接合墊13G2位於導電層1200且對應於第三側邊1530。於本實施例中,接收線13R1~13R3中的每一條均與一條接地線13G1成對,每一條接收線的第一側(左側)有一個第一傳輸端1311、一個第二傳輸端1321、一個第三傳輸端1331、一個第四傳輸端1341與一個第五傳輸端1351,每一條接收線的第二側(右側)係對應的接地線13G1。每一條接地線13G1的第二側(右側)也有一個第一傳輸端1311、一個第二傳輸端1321、一個第三傳輸端1331、一個第四傳輸端1341與一個第五傳輸端1351。接收接合墊13R11~13R13均位於導電層1200,對應於第三側邊1530,並且接收接合墊13R11電性連接至接收線13R1,接收接合墊13R12電性連接至接收線13R2,接收接合墊13R13電性連接至接收線13R3。每個接地接合墊13G2也位於導電層1200,且對應於第三側邊1530並電性連接至對應的一條接地線13G1。 Moreover, it can be seen from FIG. 1 that the touch panel 1000 further includes a plurality of receiving lines 13R1 to 13R3, a plurality of grounding lines 13G1, a plurality of receiving bonding pads 13R11, 13R12, 13R13 and a plurality of ground bonding pads 13G2, and a receiving line 13R1. ~13R3 is located in the conductive layer 1200 and corresponds to the sensing region 1400. Each of the ground lines 13G1 is located on the conductive layer 1200 and corresponds to the sensing region 1400. The receiving bond pads 13R11~13R13 are all located on the conductive layer 1200 and correspond to the third side 1530. Each of the ground bond pads 13G2 is located on the conductive layer 1200 and corresponds to the third side 1530. In this embodiment, each of the receiving lines 13R1 to 13R3 is paired with a grounding line 13G1, and the first side (left side) of each receiving line has a first transmitting end 1311 and a second transmitting end 1321. A third transmitting end 1331, a fourth transmitting end 1341 and a fifth transmitting end 1351, and a second side (right side) of each receiving line is a corresponding grounding line 13G1. The second side (right side) of each of the grounding lines 13G1 also has a first transmitting end 1311, a second transmitting end 1321, a third transmitting end 1331, a fourth transmitting end 1341 and a fifth transmitting end 1351. The receiving bonding pads 13R11~13R13 are all located on the conductive layer 1200, corresponding to the third side 1530, and the receiving bonding pad 13R11 is electrically connected to the receiving line 13R1, the receiving bonding pad 13R12 is electrically connected to the receiving line 13R2, and the receiving bonding pad 13R13 is electrically connected. It is connected to the receiving line 13R3. Each of the ground pads 13G2 is also located on the conductive layer 1200 and corresponds to the third side 1530 and is electrically connected to a corresponding one of the ground lines 13G1.

此外從第1圖也可以知道,本發明一實施例中的觸控面板1000還可以包括一條放電保護線1610與一個放電接合墊1620。其中放電保護線1610位於導電層1200,對應於非感應區1500,且放電保護線1610環繞前述的第一傳輸端1311、第二傳輸端1321、第三傳輸端1331、第一接合墊1313、第二接合墊1323、第三接合墊1333、第一連接線1314、第一導線1315、第二導線1325與第三導線1335。放電接合墊1620位於導電層1200,對應於第三側邊1530。 It is also known from FIG. 1 that the touch panel 1000 in one embodiment of the present invention may further include a discharge protection line 1610 and a discharge bonding pad 1620. The discharge protection line 1610 is located on the conductive layer 1200, corresponding to the non-sensing area 1500, and the discharge protection line 1610 surrounds the foregoing first transmission end 1311, second transmission end 1321, third transmission end 1331, first bonding pad 1313, and The second bonding pad 1323, the third bonding pad 1333, the first connection line 1314, the first wire 1315, the second wire 1325, and the third wire 1335. The discharge bond pad 1620 is located on the conductive layer 1200, corresponding to the third side 1530.

於本發明另一實施例中,觸控面板可以只具有一個第二接合墊1323與一條第二導線1325。請參照第3圖,其係依據本發明一實施例的觸控面板俯視示意圖。如第3圖所示,相較於第1圖的觸控面板1000,觸控面板1000’只有一個第二接合墊1323,然而觸控面板1000’更具有多條第二連接線1324,每一條第二連接線用以連接位於兩條仳鄰之接收線與接地線(例如接收線13R1與仳鄰的接地線13G1)兩側的兩個第二傳輸端1321。 In another embodiment of the present invention, the touch panel may have only one second bonding pad 1323 and one second wire 1325. Please refer to FIG. 3 , which is a top view of a touch panel according to an embodiment of the invention. As shown in FIG. 3, the touch panel 1000' has only one second bonding pad 1323 compared to the touch panel 1000 of FIG. 1, but the touch panel 1000' further has a plurality of second connecting lines 1324, each of which The second connecting line is used to connect two second transmitting ends 1321 on both sides of the two adjacent receiving lines and the grounding line (for example, the receiving line 13R1 and the adjacent grounding line 13G1).

關於第二連接線1324的構造,請同時參照第3圖與第4圖,其係依據本發明一實施例中的觸控面板部分放大示意圖。如第4圖所示,第二連接線1324包括:位於導電層1200的第一走線部241、第二走線部242與第三走線部243。第一走線部241位於接收線13R1~13R3其中之一(例如為接收線13R1)與相鄰於前述接收線13R1的第一傳輸端1311 之間,第一走線部241電性連接至相鄰於前述接收線的第二傳輸端1321。第二走線部242位於一條接地線13G1與相鄰於前述接地線13G1的第一傳輸端1311之間,第二走線部242電性連接至相鄰於前述接地線13G1的第二傳輸端1321。第三走線部243對應於第一側邊1510,第三走線部243電性連接第一走線部241與第二走線部242。於此實施例中,第二導線1325可以電性連接於第二接合墊1323與最靠近第二側邊1520的第二傳輸端1321。然而,於某些實施例中,第二導線1325也可以是電性連接於第二接合墊1323與任意一個第二傳輸端1321之間,本發明並不加以限定。 Regarding the structure of the second connecting line 1324, please refer to FIG. 3 and FIG. 4 simultaneously, which is an enlarged schematic view of a portion of the touch panel according to an embodiment of the invention. As shown in FIG. 4 , the second connection line 1324 includes a first trace portion 241 , a second trace portion 242 , and a third trace portion 243 located on the conductive layer 1200 . The first wiring portion 241 is located at one of the receiving lines 13R1 to 13R3 (for example, the receiving line 13R1) and the first transmitting end 1311 adjacent to the foregoing receiving line 13R1. The first routing portion 241 is electrically connected to the second transmission end 1321 adjacent to the aforementioned receiving line. The second trace portion 242 is located between a ground line 13G1 and a first transmission end 1311 adjacent to the ground line 13G1, and the second trace portion 242 is electrically connected to a second transmission end adjacent to the ground line 13G1. 1321. The third routing portion 243 corresponds to the first side 1510 , and the third routing portion 243 is electrically connected to the first routing portion 241 and the second routing portion 242 . In this embodiment, the second wire 1325 can be electrically connected to the second bonding pad 1323 and the second transmission end 1321 closest to the second side 1520. However, in some embodiments, the second wire 1325 may be electrically connected between the second bonding pad 1323 and any one of the second transmission ends 1321, which is not limited in the present invention.

而於本發明再一實施例中,觸控面板可以只具有一個第三接合墊。則所述的觸控面板可參照第5圖,其係依據本發明再一實施例的觸控面板俯視示意圖。如第5圖所示,觸控面板1000”中只有一個第三接合墊1333,並且第一接合墊1313、第二接合墊1323與第三接合墊1333彼此相鄰。同時,第三接合墊1333藉由多條第三導線1335與多個第三傳輸端1331電性連接。 In still another embodiment of the present invention, the touch panel may have only one third bonding pad. For the touch panel, reference may be made to FIG. 5 , which is a top view of a touch panel according to still another embodiment of the present invention. As shown in FIG. 5, there is only one third bonding pad 1333 in the touch panel 1000", and the first bonding pad 1313, the second bonding pad 1323 and the third bonding pad 1333 are adjacent to each other. Meanwhile, the third bonding pad 1333 The plurality of third wires 1335 are electrically connected to the plurality of third transmission ends 1331.

結合上述的多個實施例,於本發明一實施例中,觸控面板還可以藉由軟性電路板電性連接至處理器。請參照第6圖,其係依據本發明又一實施例的觸控面板俯視示意圖。如第6圖所示,相較於前述的觸控面板1000”,觸控面板1000a可以更包括軟性電路板2000。軟性電路板2000包括可撓性基 板2100與其上設置的多條連接線2101~2105以及連接線2106A、2106B、2106C、連接線2107、連接線2108。連接線2101的第一端電性連接至第一接合墊1313,連接線2102的第一端電性連接至第二接合墊1323,連接線2103的第一端電性連接至第三接合墊1333,連接線2104的第一端電性連接至第四接合墊1343,連接線2105的第一端電性連接至第五接合墊1353,連接線2106A~2106C的第一端電性分別連接至接收接合墊13R11~13R13其中之一,連接線2107的第一端電性連接至接地接合墊13G2,而連接線2108的第一端電性連接至放電接合墊1620。而這些連接線的第二端可以電性連接至處理器3000,而連接線2108的第二端也可以不連接至處理器3000,而是連接至整個系統的靜電保護電路。藉此,處理器3000透過軟性電路板2000可以控制觸控面板1000a上的多個傳輸端與接收線,以偵測觸控手勢。 In conjunction with the above embodiments, in one embodiment of the present invention, the touch panel can be electrically connected to the processor through a flexible circuit board. Please refer to FIG. 6 , which is a top view of a touch panel according to still another embodiment of the present invention. As shown in FIG. 6, the touch panel 1000a may further include a flexible circuit board 2000 compared to the aforementioned touch panel 1000". The flexible circuit board 2000 includes a flexible base. The board 2100 has a plurality of connecting lines 2101 to 2105 and connecting lines 2106A, 2106B, and 2106C, a connecting line 2107, and a connecting line 2108. The first end of the connecting wire 2101 is electrically connected to the first bonding pad 1313. The first end of the connecting wire 2102 is electrically connected to the second bonding pad 1323. The first end of the connecting wire 2103 is electrically connected to the third bonding pad 1333. The first end of the connecting line 2104 is electrically connected to the fourth bonding pad 1343. The first end of the connecting line 2105 is electrically connected to the fifth bonding pad 1353. The first ends of the connecting lines 2106A~2106C are electrically connected to the receiving end respectively. One of the bonding pads 13R11~13R13, the first end of the connecting wire 2107 is electrically connected to the ground bonding pad 13G2, and the first end of the connecting wire 2108 is electrically connected to the discharge bonding pad 1620. The second ends of the connecting lines may be electrically connected to the processor 3000, and the second end of the connecting lines 2108 may not be connected to the processor 3000, but may be connected to the electrostatic protection circuit of the entire system. Therefore, the processor 3000 can control the plurality of transmission ends and the receiving lines on the touch panel 1000a through the flexible circuit board 2000 to detect the touch gesture.

於此實施例中,可以看出由於第一傳輸端、第二傳輸端及/或第三傳輸端都已經於觸控面板1000a上分別電性連接至第一接合墊、第二接合墊及/或第三接合墊,因此軟性電路板2000上無需為第一傳輸端、第二傳輸端與第三傳輸端進行架橋(跳線)。如此一來,既可以簡化軟性電路板的製作程序,也可以利用本發明所揭露的觸控面板來實質的提高對應的軟性電路板乃至整個觸控螢幕的良率。 In this embodiment, it can be seen that the first transmission end, the second transmission end, and/or the third transmission end are respectively electrically connected to the first bonding pad, the second bonding pad, and/or on the touch panel 1000a. Or the third bonding pad, so there is no need to bridge (jump) the first transmission end, the second transmission end and the third transmission end on the flexible circuit board 2000. In this way, the manufacturing process of the flexible circuit board can be simplified, and the touch panel disclosed in the present invention can be used to substantially improve the yield of the corresponding flexible circuit board or the entire touch screen.

綜上所述,本發明所揭露的一種觸控面板,可以 以一層導電層實現,並且所述的觸控面板上的部份傳輸端藉由觸控面板的邊框與導線間的間隙來繞線而彼此電性連接。所實現的觸控面板具有較少的接合墊數量,而此一觸控面板要連接至軟性電路板的接合墊數量減少,可以降低接合部的面積來提高感應區域佔整個觸控面板的比例,也可以降低軟性電路板要架橋的走線的數量。一方面可以提高觸控面板的利用率,另一方面可以提高以此觸控面板連接至軟性電路板所生產的觸控螢幕的良率。 In summary, the touch panel disclosed in the present invention can The surface of the touch panel is electrically connected to each other by a gap between the frame and the wire of the touch panel. The touch panel has a smaller number of bonding pads, and the number of bonding pads of the touch panel to be connected to the flexible circuit board is reduced, and the area of the bonding portion can be reduced to increase the ratio of the sensing area to the entire touch panel. It is also possible to reduce the number of traces that a flexible circuit board has to bridge. On the one hand, the utilization rate of the touch panel can be improved, and on the other hand, the yield of the touch screen produced by connecting the touch panel to the flexible circuit board can be improved.

雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。 Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

1000‧‧‧觸控面板 1000‧‧‧Touch panel

1311、1321、1331、1341、1351‧‧‧傳輸端 1311, 1321, 1331, 1341, 1351‧‧‧ transmission end

1313、1323、1333、1343、1353‧‧‧接合墊 1313, 1323, 1333, 1343, 1353‧‧‧ joint pads

1314‧‧‧連接線 1314‧‧‧Connecting line

1315、1325、1335、1345、1355‧‧‧導線 1315, 1325, 1335, 1345, 1355‧‧‧ wires

13R1~13R3‧‧‧接收線 13R1~13R3‧‧‧ receiving line

13R11~13R13‧‧‧接合墊 13R11~13R13‧‧‧ joint pad

13G1‧‧‧接地線 13G1‧‧‧ grounding wire

13G2‧‧‧接合墊 13G2‧‧‧ joint pad

1400‧‧‧感應區 1400‧‧ ‧ Sensing area

1500‧‧‧非感應區 1500‧‧‧ non-sensing area

1510、1520、1530、1540‧‧‧側邊 1510, 1520, 1530, 1540‧‧‧ side

1610‧‧‧放電線 1610‧‧‧discharge line

1620‧‧‧接合墊 1620‧‧‧Join pad

Claims (8)

一種觸控面板,包括:一基板,於該基板的上表面定義有一感應區與環繞該感應區的一非感應區,該非感應區定義有一第一側邊、一第二側邊、一第三側邊與一第四側邊,其中該第一側邊相對於該第三側邊,該第二側邊相對於該第四側邊;一導電層,位於該基板的上表面;多個第一傳輸端,位於該導電層,對應於該感應區且相鄰於該第一側邊;多個第二傳輸端,位於該導電層,對應於該感應區且相鄰於該些第一傳輸端,該些第一傳輸端位於該些第二傳輸端與該第一側邊之間;多個第三傳輸端,位於該導電層,對應於該感應區且相鄰於該第三側邊;至少一第一接合墊,位於該導電層,對應於該第三側邊;至少一第二接合墊,位於該導電層,對應於該第三側邊;至少一第三接合墊,位於該導電層,對應於該第三側邊;一第一連接線,位於該導電層,對應於該第一側邊,且與該些第一傳輸端電性連接; 一第一導線,位於該導電層,電性連接於該些第一傳輸端其中之一與該第一接合墊之間;至少一第二導線,位於該導電層,電性連接於該些第二傳輸端與該至少一第二接合墊之間;至少一第三導線,位於該導電層,電性連接於該些第三傳輸端與該至少一第三接合墊之間;一接收線,位於該導電層且對應於該感應區;一接地線,位於該導電層且對應於該感應區;以及一第二連接線,用以電性連接於該些第二傳輸端之間,該第二連接線包括:一第一走線部,位於該導電層,且位於該接收線與該些第一傳輸端中相鄰於該接收線的一第一傳輸端之間,電性連接至該些第二傳輸端中相鄰於該接收線的一第二傳輸端;一第二走線部,位於該導電層,且位於該接地線與該些第一傳輸端中相鄰於該接地線的一第一傳輸端之間,電性連接至該些第二傳輸端中相鄰於該接地線的一第二傳輸端;以及一第三走線部,位於該導電層且對應於該第一側邊,電性連接該第一走線部與該第二走線部;其中,該接收線與該接地線成對,且該接收線的一第一側有該些第一傳輸端其中之一、該些第二傳輸端其中之 一與該些第三傳輸端其中之一,該接收線相對於該第一側的一第二側係對應的該接地線,該接地線的該第二側有該些第一傳輸端其中之一、該些第二傳輸端其中之一與該些第三傳輸端其中之一。 A touch panel includes: a substrate defining a sensing area and a non-sensing area surrounding the sensing area on the upper surface of the substrate, the non-sensing area defining a first side, a second side, and a third a side edge and a fourth side, wherein the first side is opposite to the third side, the second side is opposite to the fourth side; a conductive layer is located on the upper surface of the substrate; a transmission end, located in the conductive layer, corresponding to the sensing area and adjacent to the first side; a plurality of second transmission ends located in the conductive layer, corresponding to the sensing area and adjacent to the first transmission The first transmission end is located between the second transmission end and the first side; the plurality of third transmission ends are located on the conductive layer, corresponding to the sensing area and adjacent to the third side At least one first bonding pad is located on the conductive layer corresponding to the third side; at least one second bonding pad is located on the conductive layer corresponding to the third side; at least one third bonding pad is located at the a conductive layer corresponding to the third side; a first connecting line, located in the conductive layer, To the first side, and connected to the plurality of first terminals electrically; a first conductive layer is electrically connected between the one of the first transmitting ends and the first bonding pad; at least one second wire is disposed on the conductive layer and electrically connected to the first conductive layer Between the second transmission end and the at least one second bonding pad; at least one third wire is located in the conductive layer, electrically connected between the third transmission end and the at least one third bonding pad; a receiving line, Located in the conductive layer and corresponding to the sensing area; a grounding line located at the conductive layer and corresponding to the sensing area; and a second connecting line for electrically connecting between the second transmitting ends, the first The second connection line includes: a first trace portion located between the receiving line and a first transmission end of the first transmission end adjacent to the receiving line, electrically connected to the a second transmission end of the second transmission end adjacent to the receiving line; a second routing portion located at the conductive layer and located adjacent to the ground line between the ground line and the first transmission ends Between a first transmission end and an electrical connection to the second transmission end adjacent to the a second transmission end of the ground line; and a third line portion located on the conductive layer and corresponding to the first side, electrically connecting the first wire portion and the second wire portion; wherein The receiving line is paired with the grounding line, and a first side of the receiving line has one of the first transmitting ends, and the second transmitting ends are And one of the third transmission ends, the receiving line is opposite to the ground line corresponding to a second side of the first side, and the second side of the ground line has the first transmitting ends 1. One of the second transmission ends and one of the third transmission terminals. 如申請專利範圍第1項所述的觸控面板,更包括:一接收接合墊,位於該導電層,對應於該第三側邊,電性連接至該接收線;以及一接地接合墊,位於該導電層,對應於該第三側邊,電性連接至該接地線。 The touch panel of claim 1, further comprising: a receiving bonding pad located on the conductive layer, corresponding to the third side, electrically connected to the receiving line; and a ground bonding pad located at The conductive layer is electrically connected to the ground line corresponding to the third side. 如申請專利範圍第1項所述的觸控面板,更包括:一放電保護線,位於該導電層,對應於該非感應區,且環繞該些第一傳輸端、該些第二傳輸端、該些第三傳輸端、該第一接合墊、該至少一第二接合墊、該至少一第三接合墊、該第一連接線、該第一導線、該至少一第二導線與該至少一第三導線;以及一放電接合墊,位於該導電層,對應於該第三側邊。 The touch panel of claim 1, further comprising: a discharge protection line, located in the conductive layer, corresponding to the non-sensing area, and surrounding the first transmission ends, the second transmission ends, the a third transmission end, the first bonding pad, the at least one second bonding pad, the at least one third bonding pad, the first connecting line, the first wire, the at least one second wire and the at least one a three wire; and a discharge bond pad located on the conductive layer corresponding to the third side. 如申請專利範圍第1項所述的觸控面板,其中該至少一第二接合墊係一第二接合墊,該至少一第二導線係一條第二導線,該第二導線電性連接於該第二接合墊與該些第二傳輸端其中之一。 The touch panel of claim 1, wherein the at least one second bonding pad is a second bonding pad, the at least one second wire is a second wire, and the second wire is electrically connected to the The second bonding pad and one of the second transmission ends. 如申請專利範圍第1項所述的觸控面板,其中該至少一第三接合墊係一個第三接合墊,且該至少一第三導線係多條 第三導線,每一該第三導線電性連接於該第三接合墊與該些第三傳輸端其中之一。 The touch panel of claim 1, wherein the at least one third bonding pad is a third bonding pad, and the at least one third wire is a plurality of wires And a third wire, each of the third wires is electrically connected to one of the third bonding pad and the third transmitting ends. 如申請專利範圍第1項至第5項任一項所述的觸控面板,更包括一軟性電路板,至少電性連接至該第一接合墊、該至少一第二接合墊與該至少一第三接合墊。 The touch panel of any one of claims 1 to 5, further comprising a flexible circuit board electrically connected to the first bonding pad, the at least one second bonding pad and the at least one The third bonding pad. 如申請專利範圍第6項所述的觸控面板,其中該軟性電路板包括:一可撓性基板;一第一連接線,位於該可撓性基板,具有一第一端與一第二端,該第一連接線的該第一端與該第一接合墊電性連接;一第二連接線,位於該可撓性基板,具有一第一端與一第二端,該二連接線的該第一端與該第二接合墊電性連接;以及一第三連接線,位於該可撓性基板,具有一第一端與一第二端,該第三連接線的第一端與該第三接合墊電性連接。 The touch panel of claim 6, wherein the flexible circuit board comprises: a flexible substrate; a first connecting line located on the flexible substrate, having a first end and a second end The first end of the first connecting line is electrically connected to the first bonding pad; a second connecting line is located on the flexible substrate, having a first end and a second end, the two connecting lines The first end is electrically connected to the second bonding pad; and a third connecting line is located on the flexible substrate, having a first end and a second end, the first end of the third connecting line The third bonding pad is electrically connected. 如申請專利範圍第6項所述的觸控面板,更包括一處理器,該處理器電性連接至該第一連接線的該第二端、該第二連接線的該第二端與該第三連接線的該第二端。 The touch panel of claim 6, further comprising a processor electrically connected to the second end of the first connecting line, the second end of the second connecting line, and the The second end of the third connection line.
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