TWI514457B - Joint-free board-dividing device and manufature method of substrates using the same - Google Patents

Description

Jointless plate device and method for manufacturing substrate using the same

The present invention relates to a sorting apparatus, and more particularly to a seamless splitting apparatus and a method of manufacturing a substrate using the same.

Printed circuit boards (PCBs) often account for a considerable proportion of the total cost of manufacturing sheet materials. However, in the general PCB production process, a lot of cutting waste is generated, and the PCB factory transfers the scrap cost to the finished product. In turn, the unit price of the PCB is increased.

At present, the manufacturing process of the PCB factory is limited by the equipment capacity of the machine. The typesetting is arranged in the connection mode. When manufacturing the light bar, it is necessary to reserve a gap between the light bars, so that the usable space on the PCB becomes smaller and greatly increased. Cutting waste and increasing the cost of the board.

The invention relates to a seamless splitting device and a method for manufacturing a substrate by using the same. When the light strip is manufactured on the substrate by using the separating device of the present invention, no gap is required between the light bars, and the cutting can be reduced. Waste, greatly improve the utilization of the board and effectively save the process cost.

According to the present invention, a seamless panel assembly is provided that includes a base, a groove forming element, and a cutting element. The pedestal is for carrying a substrate, the groove forming component is oppositely disposed above the pedestal, and the groove forming component has a plurality of V-shaped ribs for forming a plurality of grooves on the substrate, and the cutting element is adjacent to the pedestal And a groove forming member for pressing the substrate along the groove to form a separate strip substrate.

According to the present invention, a method of manufacturing a substrate is provided, including The substrate is carried on a pedestal. The substrate is conveyed horizontally to a groove forming member, and the groove forming member is disposed opposite to the base and has a plurality of V-shaped ribs. A plurality of grooves are formed on the substrate by the V-shaped ribs for forming a plurality of seamless strip-shaped substrates on the substrate. The seamless strip substrate is conveyed horizontally to a cutting element that is adjacent to the base and the groove forming element. The seamless strip substrate is extruded along the grooves to separate the seamless strip substrates from each other.

In order to provide a better understanding of the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings

1‧‧‧Seamless splitter device

10‧‧‧ Pedestal

20‧‧‧ Grooved forming components

30‧‧‧cutting components

40, 40'‧‧‧ substrate

201‧‧‧V-shaped ribs

401‧‧‧ trench

W‧‧‧Width

Θ‧‧‧ angle

Figure 1 is a schematic view of the seamless splitter device of the present invention.

2A-2E are flow charts showing a method of manufacturing a substrate using the seamless splitting device of the present invention.

FIG. 3 is a schematic view showing a seamless substrate according to an embodiment of the present invention.

Fig. 1 is a schematic view showing the seamless splitting device 1 of the present invention. As shown in Fig. 1, the seamless splitter device 1 includes a base 10, a groove forming member 20, and a cutting member 30. The pedestal 10 is configured to carry a substrate, and the groove forming member 20 is disposed opposite to the pedestal 10. The groove forming member 20 has a plurality of V-shaped ribs 201 for forming a plurality of grooves on the substrate. The element 30 is adjacent to the base 10 and the groove forming element 20 for pressing the substrate along the groove to form a separate strip substrate.

In one embodiment, the V-shaped ribs 201 are equidistantly spaced from each other by a distance W, and the pitch corresponds to the width of the individual strip-shaped substrates. The cutting member 30 has a width W which is equal to the distance between the V-shaped ribs 201. The V-shaped rib 201 has an included angle θ which is between 10 and 80 degrees. Further, a plurality of grooves formed by the V-shaped ribs 201 have a depth of 1/5 to 4/5 of the thickness of the substrate.

In this embodiment, the V-shaped rib 201 is disposed on the groove forming element. Item 20, but the invention is not limited thereto. In some embodiments, the susceptor 10 may further include a plurality of V-shaped ribs, and corresponding to the V-shaped ribs 201 on the groove forming member 20, such that a plurality of grooves are formed on the upper and lower sides of the substrate.

In addition, the substrate of the embodiment of the present invention may be a printed circuit board, and the substrate may include a plurality of light-emitting elements, such as a light-emitting diode, and the V-shaped rib 201 may be a blade.

2A to 2E are flow charts showing a method of manufacturing a substrate using the seamless sub-board device 1 of the present invention. As shown in FIG. 2A, a substrate 40 is carried on the susceptor 10. Next, as shown in FIG. 2B, the substrate 40 is horizontally transported to the groove forming member 20, and the groove forming member 20 is disposed opposite to the base 10, and has a plurality of V-shaped ribs 201, which are formed by the V-shaped rib 201. A trench 401 (see FIG. 2C) is formed on the substrate for forming a plurality of seamless strip-shaped substrates 40' (see FIGS. 2D and 2E) on the substrate 40, such as a light bar.

As shown in Fig. 2C, the strip substrate 40' is horizontally transported to the cutting element 30, and the cutting element 30 is adjacent to the base 10 and the groove forming member 20. Next, as shown in Figs. 2D and 2E, the substrate 40' is pressed along the groove 401 to form a plurality of strip-shaped substrates 40' which are separated from each other.

FIG. 3 is a schematic view showing the seamless substrate 40 of the embodiment of the present invention. As shown in Fig. 3, the strip substrates 40' are not seamed with each other, and the strip substrate 40' may include a plurality of light emitting elements 402, for example, light emitting diodes.

According to the above embodiment, the seamless sub-board device and the method for manufacturing the substrate using the same according to the present invention, when the strip substrate (light bar) is fabricated on the substrate by the separating device of the present invention, between the strip substrates No need to reserve gaps, which can reduce cutting waste, greatly improve the utilization rate of the board and effectively save the process cost.

In addition, the present invention will automate the seamless seaming device, in addition to improving the substrate utilization rate, the automation can also improve the production efficiency, reduce the manual wear and tear, and meet the mass production requirements.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

1‧‧‧Seamless splitter device

10‧‧‧ Pedestal

20‧‧‧ Grooved forming components

30‧‧‧cutting components

201‧‧‧V-shaped ribs

W‧‧‧Width

Θ‧‧‧ angle

Claims (20)

A seamless splitting device includes: a base for carrying a substrate; a groove forming member disposed opposite the base, the groove forming member having a plurality of V-shaped ribs for Forming a plurality of grooves on the substrate; and a cutting element adjacent to the base and the groove forming member for pressing the substrate along the grooves to form a plurality of independent strip substrates. The splitter device of claim 1, wherein the V-shaped ribs are equidistantly spaced from each other by a pitch corresponding to the width of the strip substrates. The panel device of claim 2, wherein the cutting element has a width that is equal to the spacing. The panel device of claim 1, wherein the V-shaped ribs have an angle of 10 to 80 degrees. The panel device of claim 1, wherein the grooves have a depth of from 1/5 to 4/5 of the thickness of the substrate. The slab device of claim 1, wherein the pedestal further comprises a plurality of V-shaped ribs corresponding to the V-shaped ribs on the groove forming member, so that the substrate is upper and lower A plurality of grooves are formed on the sides. The splitter device of claim 1, wherein the substrate is a printed circuit board. The board device of claim 7, wherein the substrate further comprises a plurality of light-emitting elements. The panel device of claim 8, wherein the light-emitting elements are light-emitting diodes. The splitter device of claim 1, wherein the V-shaped ribs are blades. A method of manufacturing a substrate, comprising: carrying a substrate on a pedestal; horizontally transporting the substrate to a groove forming component, the groove forming component being oppositely disposed Positioned above the pedestal and having a plurality of V-shaped ribs; forming a plurality of grooves on the substrate by using the V-shaped ribs for forming a plurality of seamless strip-shaped substrates on the substrate Horizontally transporting the seamless strip-shaped substrate to a cutting element, the cutting element abutting the base and the groove forming element; and pressing the seamless strips along the grooves The substrate separates the seamless strip substrates from each other. The manufacturing method of claim 11, wherein the V-shaped ribs are equidistantly spaced from each other by a pitch corresponding to the width of the strip-shaped substrates. The manufacturing method of claim 12, wherein the cutting element has a width equal to the spacing. The manufacturing method according to claim 11, wherein the V-shaped ribs have an angle of 10 to 80 degrees. The manufacturing method of claim 11, wherein the grooves have a depth of from 1/5 to 4/5 of the thickness of the substrate. The manufacturing method of claim 11, wherein the base further comprises a plurality of V-shaped ribs corresponding to the V-shaped ribs on the groove forming member, so that the upper and lower sides of the substrate A plurality of grooves are formed. The manufacturing method of claim 11, wherein the substrate is a printed circuit board. The manufacturing method of claim 17, wherein the substrate further comprises a plurality of light-emitting elements. The manufacturing method of claim 18, wherein the light emitting elements are light emitting diodes. The manufacturing method of claim 11, wherein the V-shaped ribs are cutting edges.