TWI511656B - Server module - Google Patents
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- TWI511656B TWI511656B TW102146629A TW102146629A TWI511656B TW I511656 B TWI511656 B TW I511656B TW 102146629 A TW102146629 A TW 102146629A TW 102146629 A TW102146629 A TW 102146629A TW I511656 B TWI511656 B TW I511656B
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Description
本發明系關於一種伺服模組,特別是關於一種具有導風板的伺服模組。The invention relates to a servo module, in particular to a servo module with a wind deflector.
伺服器機箱係為目前市面上常見的產品之一,伺服器機箱係為多層之機櫃結構,可依使用者的需求於各層中放置各種不同之電子裝置及多個運算單元。機櫃中的多個運算單元係插設於機箱內且並排設置。The server chassis is one of the common products on the market. The server chassis is a multi-layer cabinet structure. Various electronic devices and multiple computing units can be placed in each layer according to the needs of users. Multiple computing units in the cabinet are inserted into the chassis and arranged side by side.
在目前伺服器機箱的內部結構設計中,通常會將多個運算單元插設於底板的插槽上,而這些運算單元會以分隔板隔開。由於運算單元運作時會產生大量的熱能,故必須對伺服器機箱內部進行散熱。目前伺服器機箱及運算單元的散熱方式係藉由伺服器機箱一側之外部吹入冷風對伺服器機箱內部進行散熱。然而,這種方法會造成離入風口較遠之運算單元的散熱效果較差。也就是說,目前伺服器機箱之散熱系統無法達到均勻散熱的功效。因此,業界正積極研究如何解決伺服器機箱內部散熱不均的問題。In the current internal structure design of the server chassis, a plurality of arithmetic units are usually inserted into the slots of the bottom plate, and the arithmetic units are separated by a partition plate. Since the computing unit operates with a large amount of thermal energy, the internals of the server chassis must be dissipated. At present, the heat dissipation method of the server chassis and the computing unit is to dissipate heat from the inside of the server chassis by blowing cold air to the outside of the server chassis side. However, this method causes the heat dissipation effect of the arithmetic unit far from the air inlet to be poor. That is to say, the current heat dissipation system of the server chassis cannot achieve uniform heat dissipation. Therefore, the industry is actively studying how to solve the problem of uneven heat dissipation inside the server chassis.
鑒於以上的問題,本發明是關於一種伺服模組, 藉以改善伺服器機箱內部散熱不均的問題。In view of the above problems, the present invention relates to a servo module, In order to improve the problem of uneven heat dissipation inside the server chassis.
本發明一實施例之伺服模組,包含一殼體、一第一分隔板、一第二分隔板、複數個第一插槽、複數個第一伺服單元、複數個第二插槽、複數個第二伺服單元、複數個第三插槽、複數個第三伺服單元、一第一散熱流道、複數個導風板以及一第二散熱流道。殼體包含一側板及一底板,側板豎立於底板之一側緣,側板具有複數個入風口。第一分隔板設置於底板上且位於側板之一側。第二分隔板設置於底板上且位於第一分隔板遠離側板之一側。複數個第一插槽設置於底板上且位於側板及第一分隔板之間。複數個第一伺服單元分別插設於這些第一插槽上。複數個第二插槽設置於底板上且位於第一分隔板及第二分隔板之間。複數個第二伺服單元分別插設於這些第二插槽上。複數個第三插槽設置於底板上且位於第二分隔板遠離第一分隔板之一側。複數個第三伺服單元分別插設於這些第三插槽上。第一散熱流道依次經過側板之這些入風口、這些第一伺服單元、第一分隔板、這些第二伺服單元、第二分隔板以及這些第三伺服單元,這些第一分隔板上對應第一散熱流道設有複數個第一散熱孔,這些第二分隔板上對應第一散熱流道設有複數個第二散熱孔。每一這些導風板設置於底板且位於每相鄰的二第二插槽之間,其中這些導風板遠離底板之一側為一斜面,斜面鄰近第一分隔板之一端至底板的距離小於斜面鄰近第二分隔板之一端至底 板的距離。這些第一分隔板上靠近底板一側還開設有複數個第三散熱孔,一第二散熱流道流經這些第一伺服單元與底板間的空隙、這些第三散熱孔、這些導風板與第二伺服單元間的空隙、這些第二散熱孔鄰近底板之部分至這些第三伺服單元。A servo module according to an embodiment of the invention includes a casing, a first dividing plate, a second dividing plate, a plurality of first slots, a plurality of first servo units, and a plurality of second slots, a plurality of second servo units, a plurality of third slots, a plurality of third servo units, a first heat dissipation channel, a plurality of air deflectors, and a second heat dissipation channel. The housing comprises a side plate and a bottom plate, the side plate is erected on one side edge of the bottom plate, and the side plate has a plurality of air inlets. The first partitioning plate is disposed on the bottom plate and located on one side of the side plate. The second partitioning plate is disposed on the bottom plate and located on a side of the first partitioning plate away from the side plate. A plurality of first slots are disposed on the bottom plate and between the side plates and the first partition plates. A plurality of first servo units are respectively inserted in the first slots. A plurality of second slots are disposed on the bottom plate and located between the first partition plate and the second partition plate. A plurality of second servo units are respectively inserted in the second slots. A plurality of third slots are disposed on the bottom plate and located on a side of the second partitioning plate away from the first partitioning plate. A plurality of third servo units are respectively inserted in the third slots. The first heat dissipation flow passage sequentially passes through the air inlets of the side plates, the first servo unit, the first partition plate, the second servo units, the second partition plate, and the third servo units, and the first partition plates A plurality of first heat dissipation holes are disposed corresponding to the first heat dissipation channel, and the plurality of second heat dissipation holes are disposed on the second partition plate corresponding to the first heat dissipation channel. Each of the air deflectors is disposed on the bottom plate and located between each adjacent two second slots, wherein the air deflectors are away from a side of the bottom plate as a slope, and the slope is adjacent to a distance from one end of the first partition plate to the bottom plate Less than the slope adjacent to one end of the second partition plate to the bottom The distance of the board. A plurality of third heat dissipation holes are further disposed on a side of the first partition plate adjacent to the bottom plate, and a second heat dissipation flow path flows through the gap between the first servo unit and the bottom plate, the third heat dissipation holes, and the air guide plates. And a gap between the second servo unit and the second heat dissipation hole adjacent to the bottom plate to the third servo unit.
其中,這些第一插槽之間不設有這些導風板。Wherein, the air deflectors are not disposed between the first slots.
本發明之伺服模組,由於導風板具有斜面,且斜面的第一端至底板的距離小於斜面的第二端至底板的距離,使部分低溫散熱氣流經導風板之斜面導引而流入第二插槽上之第二伺服單元及第三插槽上之第三伺服單元,因而提升了伺服模組整體的散熱效果,且解決了散熱不均的問題。In the servo module of the present invention, since the air deflector has a sloped surface, and the distance from the first end of the inclined surface to the bottom plate is smaller than the distance from the second end of the inclined surface to the bottom plate, part of the low-temperature heat dissipation airflow is guided by the inclined surface of the air deflector The second servo unit on the second slot and the third servo unit on the third slot improve the heat dissipation effect of the entire servo module and solve the problem of uneven heat dissipation.
又,第一插槽之間不設有導風板,故相鄰之二第一插槽之間可自然形成通道供散熱氣流通過。Moreover, the air deflector is not disposed between the first slots, so that a channel can be naturally formed between the adjacent first slots for the airflow to pass through.
以上之關於本發明內容之說明及以下之實施方式之說明係用以示範與解釋本發明之原理,並且提供本發明之專利申請範圍更進一步之解釋。The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.
10‧‧‧伺服模組10‧‧‧Servo Module
100‧‧‧殼體100‧‧‧shell
110‧‧‧側板110‧‧‧ side panels
111‧‧‧入風口111‧‧‧Air inlet
115‧‧‧通風孔115‧‧‧ventilation holes
120‧‧‧底板120‧‧‧floor
121‧‧‧側緣121‧‧‧ side edge
200‧‧‧蓋體200‧‧‧ cover
201‧‧‧內表面201‧‧‧ inner surface
210‧‧‧第三散熱流道210‧‧‧ Third cooling channel
250‧‧‧導風斜面250‧‧‧ wind deflector
251‧‧‧第一側251‧‧‧ first side
252‧‧‧第二側252‧‧‧ second side
300‧‧‧第一分隔板300‧‧‧ first partition
301‧‧‧第一散熱孔301‧‧‧First vent
400‧‧‧第二分隔板400‧‧‧Second divider
401‧‧‧第二散熱孔401‧‧‧second vent
500‧‧‧第一插槽500‧‧‧first slot
600‧‧‧第二插槽600‧‧‧second slot
700‧‧‧第三插槽700‧‧‧ third slot
800‧‧‧導風板800‧‧‧Air deflector
810‧‧‧斜面810‧‧‧Slope
811‧‧‧第一端811‧‧‧ first end
812‧‧‧第二端812‧‧‧ second end
910‧‧‧第一伺服單元910‧‧‧First SERVOPACK
920‧‧‧第二伺服單元920‧‧‧Second servo unit
930‧‧‧第三伺服單元930‧‧‧third servo unit
950‧‧‧第一散熱流道950‧‧‧First cooling channel
960‧‧‧第二散熱流道960‧‧‧Second cooling channel
第1圖係為根據本發明一實施例之伺服模組剖視圖。1 is a cross-sectional view of a servo module in accordance with an embodiment of the present invention.
第2圖係為根據本發明一實施例之伺服模組上視圖。2 is a top view of a servo module in accordance with an embodiment of the present invention.
第3圖係為根據本發明一實施例之伺服模組剖視圖。Figure 3 is a cross-sectional view of a servo module in accordance with an embodiment of the present invention.
請參照第1圖、第2圖及第3圖。第1圖係為根據本發明一實施例之伺服模組剖視圖。第2圖係為根據本發明一實施例之伺服模組上視圖。第3圖係為根據本發明一實施例之伺服模組剖視圖。Please refer to Figure 1, Figure 2 and Figure 3. 1 is a cross-sectional view of a servo module in accordance with an embodiment of the present invention. 2 is a top view of a servo module in accordance with an embodiment of the present invention. Figure 3 is a cross-sectional view of a servo module in accordance with an embodiment of the present invention.
一種伺服模組10,包含一殼體100、一蓋體200、一第一分隔板300、一第二分隔板400、複數個第一插槽500、複數個第二插槽600、複數個第三插槽700、複數個導風板800、複數個第一伺服單元910、複數個第二伺服單元920、複數個第三伺服單元930、一第一散熱流道950及一第二散熱流道960。A servo module 10 includes a housing 100, a cover 200, a first partition 300, a second partition 400, a plurality of first slots 500, a plurality of second slots 600, and a plurality a third slot 700, a plurality of air deflectors 800, a plurality of first servo units 910, a plurality of second servo units 920, a plurality of third servo units 930, a first heat dissipation channel 950 and a second heat sink Runner 960.
殼體100包含一側板110及一底板120,側板110豎立於底板120之一側緣121,且側板110具有複數個入風口111。本實施例之入風口111為長條狀開口,但並不以此為限。The housing 100 includes a side plate 110 and a bottom plate 120. The side plate 110 is erected on one side edge 121 of the bottom plate 120, and the side plate 110 has a plurality of air inlets 111. The air inlet 111 of the embodiment is an elongated opening, but is not limited thereto.
第一分隔板300設置於底板120上且位於側板110之一側。第一分隔板具有複數個第一散熱孔301。本實施例之第一散熱孔301為長條狀開口,但並不以此為限。此外,在本實施例中,第一分隔板300上靠近底板120之一側還開設有複數個第三散熱孔302。本實施例之第三散熱孔302位於第二伺服單元920的下表面與底板120之間。The first partitioning plate 300 is disposed on the bottom plate 120 and located on one side of the side plate 110. The first partitioning plate has a plurality of first heat dissipation holes 301. The first heat dissipation hole 301 of the embodiment is an elongated opening, but is not limited thereto. In addition, in the embodiment, a plurality of third heat dissipation holes 302 are further opened on one side of the first partition plate 300 near the bottom plate 120. The third heat dissipation hole 302 of this embodiment is located between the lower surface of the second servo unit 920 and the bottom plate 120.
第二分隔板400設置於底板120上且位於第一分隔板400遠離側板110之一側。第二分隔板400具有複數個第二散熱孔401。本實施例之第二散熱孔401為長條狀開口,但 並不以此為限。在本實施例中,第一分隔板300、第二分隔板400及側板110實質上平行排列。The second partitioning plate 400 is disposed on the bottom plate 120 and located on a side of the first partitioning plate 400 away from the side plate 110. The second partition plate 400 has a plurality of second heat dissipation holes 401. The second heat dissipation hole 401 of this embodiment is an elongated opening, but Not limited to this. In the present embodiment, the first partitioning plate 300, the second dividing plate 400, and the side plates 110 are substantially parallel arranged.
複數個第一插槽500設置於底板120上且位於側板110及第一分隔板300之間。在本實施例中,側板110的入風口111位於相鄰的二第一插槽500之間。The plurality of first slots 500 are disposed on the bottom plate 120 and located between the side plates 110 and the first partition plate 300. In this embodiment, the air inlet 111 of the side panel 110 is located between the adjacent two first slots 500.
複數個第二插槽600設置於底板上且位於第一分隔板300及第二分隔板400之間。The plurality of second slots 600 are disposed on the bottom plate and located between the first partition plate 300 and the second partition plate 400.
複數個第三插槽700設置於底板120上且位於第二分隔板400遠離第一分隔板300之一側。The plurality of third slots 700 are disposed on the bottom plate 120 and located on a side of the second partitioning plate 400 away from the first partitioning plate 300.
在本實施例中,入風口111位於相鄰的二第一插槽500之間,第二散熱孔301位於相鄰的二第三插槽600之間,第二散熱孔401位於相鄰的二第三插槽之間。In this embodiment, the air inlet 111 is located between the adjacent two first slots 500, the second heat dissipation hole 301 is located between the adjacent two third slots 600, and the second heat dissipation hole 401 is located adjacent to the second slot. Between the third slots.
每一導風板800設置於底板120上且位於每相鄰的二第二插槽之600間。這些導風板800遠離底板120之一側為一斜面810。斜面810具有鄰近第一分隔板300之第一端811及鄰近第二分隔板400之第二端812。第一端811至底板120的距離小於第二端812至底板120的距離。又,第一插槽500之間不設有導風板800,故相鄰之二第一插槽500之間可自然形成通道供散熱氣流通過。Each air deflector 800 is disposed on the bottom plate 120 and located between 600 adjacent each second second slot. One side of the air deflector 800 away from the bottom plate 120 is a slope 810. The ramp 810 has a first end 811 adjacent the first divider 300 and a second end 812 adjacent the second divider 400. The distance from the first end 811 to the bottom plate 120 is less than the distance from the second end 812 to the bottom plate 120. Moreover, the air deflector 800 is not disposed between the first slots 500, so that a channel can be naturally formed between the adjacent first slots 500 for the airflow to pass through.
複數個第一伺服單元910,分別插設於這些第一插槽500上。複數個第二伺服單元920,分別插設於這些第二插槽600上。複數個第三伺服單元930,分別插設於這些第三 插槽700上。在本實施例中,第一伺服單元910、第二伺服單元920及第三伺服單元930本身係為相同的元件。在本實施例中,第二散熱孔401鄰近底板120之部分位於這些導風板800鄰近第二分隔板400之一端與這些第三伺服單元930的下表面之間。A plurality of first servo units 910 are respectively inserted in the first slots 500. A plurality of second servo units 920 are respectively inserted in the second slots 600. a plurality of third servo units 930 are respectively inserted in the third On slot 700. In this embodiment, the first servo unit 910, the second servo unit 920, and the third servo unit 930 are themselves the same component. In the present embodiment, the portion of the second heat dissipation hole 401 adjacent to the bottom plate 120 is located between one end of the air guide plate 800 adjacent to the second partition plate 400 and the lower surface of the third servo unit 930.
第一散熱流道950依次經過側板110之這些入風口111、這些第一伺服單元910、第一分隔板300之複數個第一散熱孔301、這些第二伺服單元920、第二分隔板400之複數個第二散熱孔401以及這些第三伺服單元930。The first heat dissipation channel 950 passes through the air inlets 111 of the side plates 110, the first plurality of first heat dissipation holes 301 of the first servo unit 910 and the first partition plate 300, the second servo unit 920, and the second partition plate. a plurality of second heat dissipation holes 401 of 400 and the third servo unit 930.
第二散熱流道960流經這些第一伺服單元910與底板120間的空隙、這些第三散熱孔302、這些導風板800與第二伺服單元920間的空隙、這些第二散熱孔401接近底板120之部分至這些第三伺服單元930。The second heat dissipation channel 960 flows through the gap between the first servo unit 910 and the bottom plate 120, the third heat dissipation holes 302, the gap between the air deflector 800 and the second servo unit 920, and the second heat dissipation holes 401 are close to each other. Portions of the bottom plate 120 to these third servo units 930.
蓋體200設置於殼體100上,蓋體200與這些伺服單元900間隔一距離而形成一第三散熱流道210。在本實施例中,側板110鄰近蓋體200處具有複數個通風孔115連接於第三散熱流道210的一端。蓋體20具有一內表面201,內表面201面對底板120。內表面201突出有一導風斜面250。導風斜面250具有鄰近側板110之第一側251及遠離側板110之第二側252,第一側251至底板120的距離大於第二側252至底板120的距離。需注意的是,在其他實施例中,通風孔115的數量可以為一。此外,在其他實施例中,伺服模組10可不 包含蓋體200,且側板110可不具有通風孔115。The cover 200 is disposed on the housing 100. The cover 200 is spaced apart from the servo units 900 to form a third heat dissipation channel 210. In the embodiment, the side plate 110 has a plurality of ventilation holes 115 adjacent to the cover 200 and is connected to one end of the third heat dissipation channel 210. The cover 20 has an inner surface 201 that faces the bottom plate 120. The inner surface 201 protrudes from a wind deflecting surface 250. The wind deflector 250 has a first side 251 adjacent to the side panel 110 and a second side 252 away from the side panel 110. The distance from the first side 251 to the bottom panel 120 is greater than the distance from the second side 252 to the bottom panel 120. It should be noted that in other embodiments, the number of the vent holes 115 may be one. In addition, in other embodiments, the servo module 10 may not The cover 200 is included, and the side plate 110 may not have the ventilation hole 115.
接下來將對伺服模組10的散熱過程進行說明。當一散熱氣流從入風口111吹入後,大部分之散熱氣流會直接流向第一散熱流道950,因而流過第一插槽500上之伺服單元910而降低其溫度,而少部分散熱氣流會流向第二散熱流道960。也就是說,此少部分散熱氣流由相鄰之第一插槽500之間的空隙流過。由於通過相鄰之第一插槽500之間的散熱氣流並未流經第一伺服單元910,故其溫度仍維持低溫。此低溫的散熱氣流穿過第一散熱孔301後流向導風板800之斜面810。藉由斜面810之第一端811至底板120的距離小於斜面810之第二端812至底板120的距離,此低溫的散熱氣流可被導引至第三插槽700上之第三伺服單元930,而流向第三插槽700上之第三伺服單元930之過程中也有部分低溫散熱氣流流入第二插槽600上之第二伺服單元920。如此一來,第二插槽600上之第二伺服單元920及第三插槽700上之第三伺服單元930均會被低溫之散熱氣流所吹送,因而提升了伺服模組10整體的散熱效果,且離入風口111較遠之伺服單元也能得到良好的散熱,解決了先前技術中伺服模組散熱不均的問題。Next, the heat dissipation process of the servo module 10 will be described. When a heat-dissipating airflow is blown in from the air inlet 111, most of the heat-dissipating airflow directly flows to the first heat-dissipating flow path 950, thereby flowing through the servo unit 910 on the first slot 500 to lower the temperature thereof, and a small portion of the heat-dissipating airflow. It will flow to the second heat dissipation channel 960. That is to say, this small portion of the heat dissipation airflow flows through the gap between the adjacent first slots 500. Since the heat radiating airflow between the adjacent first slots 500 does not flow through the first servo unit 910, the temperature thereof is maintained at a low temperature. The low-temperature heat dissipation airflow passes through the first heat dissipation hole 301 and flows to the slope 810 of the guide air plate 800. By the distance from the first end 811 of the slope 810 to the bottom plate 120 being less than the distance from the second end 812 of the slope 810 to the bottom plate 120, the low temperature heat dissipation airflow can be directed to the third servo unit 930 on the third slot 700. During the process of flowing to the third servo unit 930 on the third slot 700, a portion of the low temperature heat dissipation airflow also flows into the second servo unit 920 on the second slot 600. In this way, the second servo unit 920 on the second slot 600 and the third servo unit 930 on the third slot 700 are all blown by the low-temperature heat dissipation airflow, thereby improving the overall heat dissipation effect of the servo module 10. The servo unit which is far away from the air inlet 111 can also obtain good heat dissipation, and solves the problem of uneven heat dissipation of the servo module in the prior art.
此外,由於側板110鄰近蓋體200處具有複數個通風孔115,外部氣流可從通風孔115流入第三散熱流道210。接著,氣流經由導風斜面250的導引而流入第二插槽600上之第二伺服單元920及第三插槽700上之第三伺服單元930,以 對這些伺服單元進行散熱。由於從通風孔115流入第三散熱流道210的氣流位於這些伺服單元上方,故其溫度在流入第二插槽600上之第二伺服單元920及第三插槽700上之第三伺服單元930之前仍保持低溫,因此提升了伺服模組10整體的散熱效果,且能達到均勻散熱之功效。In addition, since the side plate 110 has a plurality of ventilation holes 115 adjacent to the cover 200, the external airflow can flow from the ventilation holes 115 into the third heat dissipation flow path 210. Then, the airflow flows into the second servo unit 920 on the second slot 600 and the third servo unit 930 on the third slot 700 via the guiding of the air guiding ramp 250, to Heat these servo units. Since the airflow flowing from the vent hole 115 into the third heat dissipation channel 210 is located above the servo units, the temperature is in the second servo unit 920 flowing into the second slot 600 and the third servo unit 930 on the third slot 700. The temperature is kept low before, so the heat dissipation effect of the servo module 10 as a whole is improved, and the effect of uniform heat dissipation can be achieved.
根據上述實施例之伺服模組,由於導風板具有斜面,且斜面的第一端至底板的距離小於斜面的第二端至底板的距離,使部分低溫散熱氣流經導風板之斜面導引而流入第二插槽上之第二伺服單元及第三插槽上之第三伺服單元,因而提升了伺服模組整體的散熱效果,且解決了散熱不均的問題。According to the servo module of the above embodiment, since the air deflector has a slope, and the distance from the first end of the slope to the bottom plate is smaller than the distance from the second end of the slope to the bottom plate, part of the low-temperature heat dissipation airflow is guided by the inclined surface of the wind deflector. The second servo unit on the second slot and the third servo unit on the third slot improve the heat dissipation effect of the entire servo module and solve the problem of uneven heat dissipation.
又,第一插槽之間不設有導風板,故相鄰之二第一插槽之間可自然形成通道供散熱氣流通過。Moreover, the air deflector is not disposed between the first slots, so that a channel can be naturally formed between the adjacent first slots for the airflow to pass through.
此外,由於側板鄰近蓋體處具有複數個通風孔,且蓋體之內表面突出有導風斜面,外部氣流可從通風孔流入流道,接著經由導風斜面的導引而流入第二插槽上之第二伺服單元及第三插槽上之第三伺服單元,藉此提升伺服模組整體的散熱效果。In addition, since the side plate has a plurality of ventilation holes adjacent to the cover body, and the inner surface of the cover body protrudes from the air guiding slope, the external airflow can flow into the flow channel from the ventilation hole, and then flows into the second slot through the guiding of the wind guiding slope. The second servo unit and the third servo unit on the third slot are used to improve the heat dissipation effect of the entire servo module.
雖然本發明以前述之較佳實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.
10‧‧‧伺服模組10‧‧‧Servo Module
100‧‧‧殼體100‧‧‧shell
110‧‧‧側板110‧‧‧ side panels
111‧‧‧入風口111‧‧‧Air inlet
115‧‧‧通風孔115‧‧‧ventilation holes
120‧‧‧底板120‧‧‧floor
121‧‧‧側緣121‧‧‧ side edge
200‧‧‧蓋體200‧‧‧ cover
201‧‧‧內表面201‧‧‧ inner surface
210‧‧‧第三散熱流道210‧‧‧ Third cooling channel
250‧‧‧導風斜面250‧‧‧ wind deflector
251‧‧‧第一側251‧‧‧ first side
252‧‧‧第二側252‧‧‧ second side
300‧‧‧第一分隔板300‧‧‧ first partition
301‧‧‧第一散熱孔301‧‧‧First vent
302‧‧‧第三散熱孔302‧‧‧3rd vent
400‧‧‧第二分隔板400‧‧‧Second divider
401‧‧‧第二散熱孔401‧‧‧second vent
500‧‧‧第一插槽500‧‧‧first slot
600‧‧‧第二插槽600‧‧‧second slot
700‧‧‧第三插槽700‧‧‧ third slot
800‧‧‧導風板800‧‧‧Air deflector
810‧‧‧斜面810‧‧‧Slope
811‧‧‧第一端811‧‧‧ first end
812‧‧‧第二端812‧‧‧ second end
910‧‧‧第一伺服單元910‧‧‧First SERVOPACK
920‧‧‧第二伺服單元920‧‧‧Second servo unit
930‧‧‧第三伺服單元930‧‧‧third servo unit
950‧‧‧第一散熱流道950‧‧‧First cooling channel
960‧‧‧第二散熱流道960‧‧‧Second cooling channel
Claims (7)
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101807100B (en) * | 2010-03-18 | 2012-01-11 | 北京航空航天大学 | High-density rack server radiating system |
CN202145719U (en) * | 2011-07-26 | 2012-02-15 | 北京绿创环保集团有限公司 | Totally-enclosed server equipment cabinet with cooling system |
CN202941081U (en) * | 2012-11-26 | 2013-05-15 | 北京德能恒信科技有限公司 | Data center cooling solution |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101807100B (en) * | 2010-03-18 | 2012-01-11 | 北京航空航天大学 | High-density rack server radiating system |
CN202145719U (en) * | 2011-07-26 | 2012-02-15 | 北京绿创环保集团有限公司 | Totally-enclosed server equipment cabinet with cooling system |
CN202941081U (en) * | 2012-11-26 | 2013-05-15 | 北京德能恒信科技有限公司 | Data center cooling solution |
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