TWI508556B - Image sensor assembly and image sensor module - Google Patents

Description

Image sensor package and image sensor module

The invention relates to an image sensor package and an image sensor module using the image sensor package, in particular to a small-sized image sensor package and a small-sized image sensor module. group.

Image sensor coefficient is one of the most important components of the camera. The size of the image sensor package is also a major factor in determining the size and photographic performance of the digital camera.

Previous image sensors include a Charge Coupled Device (CCD) or a Complementary Metal-Oxide-Semiconductor (CMOS). In operation, the image sensor is usually mounted on a circuit board, and the image sensor can be powered or signaled by the circuit board, and the heat generated by the image sensor when working is performed by the circuit. The board is distributed to the outside world. However, previous circuit boards, such as fiberglass (FR4) boards, are often difficult to match the image sensor in terms of thermal conductivity, for example, due to the glass fiber thermal expansion circuit board (the substrate of which is made of glass fiber). The coefficient of thermal expansion (CTE) and the image sensor (the substrate is 矽) have a large difference in thermal expansion coefficient. When the image sensor emits heat, the image sensor is between the sensor and the board. It is easy to generate thermal stress, which causes the two to be pressed and deformed. In the prior art, by increasing the thickness of the circuit board, the strength of the circuit board can be appropriately increased to resist the deformation of the circuit board, but this is easy to cause When the image sensor is mounted on a circuit board, its overall size is too large to accommodate the miniaturization of electronic products.

In view of this, it is necessary to provide a small image sensor package and an image sensor module.

An image sensor package having a smaller size and an image sensor module using the image sensor package will be described below by way of embodiments.

An image sensor package includes a thin substrate and an image sensor. The thin substrate is made of alumina doped with a carbon nanotube as a substrate, and the thin substrate has a plurality of contacts. The image sensor is disposed on the thin substrate and has a sensing area. The sensing area is surrounded by a plurality of pads corresponding to the plurality of contacts, and the plurality of pads are electrically connected to the thin type respectively. A plurality of contacts on the substrate.

An image sensor module includes an image sensor package and a lens module. The image sensor package includes a thin substrate and an image sensor. The thin substrate uses aluminum oxide doped with a carbon nanotube as a substrate, and the thin substrate has an upper surface and a plurality of contacts. The image sensor is disposed on the thin substrate and has a sensing area. The sensing area is surrounded by a plurality of pads corresponding to the plurality of contacts, and the plurality of pads are electrically connected to the thin type respectively. A plurality of contacts on the substrate. The lens module includes a lens barrel, at least one lens housed in the lens barrel, and a lens holder connected to the lens barrel, wherein the lens holder is disposed on an upper surface of the thin substrate.

Compared with the prior art, the image sensor package and the image sensor module respectively use a thin substrate doped with a carbon nanotube in the substrate. The thin substrate is doped with carbon Since the alumina of the nanotube is used as the substrate, even if the thickness is small, it can have a preferable strength and is less likely to be deformed. In addition, the difference between the thermal expansion coefficient and the thermal expansion coefficient of the image sensor is small, which is advantageous for reducing the thermal stress generated by the uneven thermal expansion between the image sensor and the thin substrate. Moreover, the thin substrate has better thermal conductivity, and the heat emitted by the image sensor can be dissipated to the outside through the thin substrate to ensure stable performance of the image sensor.

100, 200‧‧‧ image sensor module

110, 210‧‧‧ Image Sensor Package

111, 211‧‧‧ Thin substrate

112‧‧‧Image Sensor

113, 213‧‧‧ Connection block

116‧‧‧welding line

120, 220‧‧‧Adhesive body

130‧‧‧Lens module

132, 232‧‧‧ lens

133, 233‧‧ ‧ mirror base

134, 234‧‧‧ transparent board

135, 235‧‧ ‧ infrared cut filter

111a, 113a, 211a, 213a‧‧‧ upper surface

111c‧‧‧Electrical contacts

112a‧‧‧ pads

112b‧‧‧Sensing area

113b‧‧‧ lower surface

113c‧‧‧ first joint

113d‧‧‧second junction

132a‧‧‧Mirror tube

132b‧‧‧Lens

132d‧‧‧ spacer ring

133a‧‧‧ top board

133b‧‧‧through hole

133c, 233c‧‧‧ feet

133d‧‧ ‧ room

1200‧‧‧through hole

1 is a cross-sectional view of an image sensor module provided by a first embodiment of the present invention, the image sensor module including an image sensor package.

2 is a cross-sectional view of an image sensor module provided by a second embodiment of the present invention, the image sensor module including an image sensor package.

The invention will now be further described in detail in conjunction with the drawings.

Referring to FIG. 1 , a first embodiment of the present invention provides an image sensor module 100 including an image sensor package 110 and a lens module 130 , wherein the lens module 130 includes a lens 132 and A lens holder 133 is disposed on the lens holder 133. The lens holder 133 is fixed to the image sensor package 110 by the adhesive body 120.

The image sensor package 110 includes a thin substrate 111 , an image sensor 112 , a connection block 113 , and a plurality of bonding wires 116 .

The thin substrate 111 is made of alumina (Al 2 O 3 ) doped with carbon nanotubes (CNTs), wherein the weight of the carbon nanotubes is 0.5% to 10% of the total weight of the substrate, preferably 1% to 5%. Specifically, after the carbon nanotube powder and the alumina fine particles are doped, by stirring, sintering (sintering) The substrate is formed by a step of grinding, hot isostatic pressing (HIP) or the like. The thin substrate 111 is plate-shaped and may have a thickness of less than 0.2 mm, preferably less than 0.15 mm. Since the substrate of the thin substrate 111 is doped with a carbon nanotube, even if the thickness is small, the strength can be better, that is, the Young's modulus is large, so the thin substrate 111 can support The image sensor 112 and the lens module 130 are less prone to deformation. In addition, since the substrate of the thin substrate 111 is doped with a carbon nanotube, the substrate has a high thermal conductivity, and the thermal expansion coefficient of the substrate and the image sensor 112 (the substrate is 矽) The difference between the thermal expansion coefficients is small. When the image sensor 112 emits heat, the thermal stress and the thermal strain between the image sensor 112 and the thin substrate 111 are small. . Therefore, when the image sensor 112 is assembled on the thin substrate 111, the thin substrate 111 is less likely to be deformed. The substrate has a dielectric constant of 8 to 11 and a thermal conductivity of 10 W/moC to 40 W/moC.

The thin substrate 111 has an upper surface 111a on which a plurality of electrical contacts 111c are formed. The image sensor 112 is adhered to the upper surface 111a of the thin substrate 111. The image sensor 112 includes a sensing area 112b, and a plurality of pads 112a are disposed around the sensing area 112b.

The connecting block 113 may be in the form of a square plate or a circular plate having an upper surface 113a and a lower surface 113b opposite to the upper surface 113a. The connecting block 113 has a through hole 1200 extending through the upper and lower surfaces thereof. The through hole 1200 is larger in size than the image sensor 112 to accommodate the image sensor 112. In addition, a plurality of first contacts 113c are disposed on the upper surface 113a of the connecting block 113, and a plurality of second contacts 113d are disposed on the lower surface 113b adjacent to the outer edge thereof, and the plurality of second contacts 113d are The plurality of first contacts 113c are in one-to-one correspondence, and each of the second contacts 113d and the corresponding first contact 113c thereof Electrical connection. The electrical connection method may be any one of Surface Mount Technology (SMT), Hot Bar Technology, and Anisotropic Conductive Film (ACF).

The connecting block 113 is disposed on the upper surface 111a of the thin substrate 111, and the plurality of second contacts 113d are electrically connected to the plurality of contacts 111c on the thin substrate 111, respectively. In addition, one end of each bonding wire 116 is electrically connected to one of the pads 112a of the image sensor 112, and the other end thereof is electrically connected to a corresponding first contact 113c of the connecting block 113. Thereby, the image sensor 112 is electrically connected to the thin substrate 111. The thin substrate 111 can be specifically a circuit board. Therefore, the image sensor 112 can input an operating current through a line formed on the circuit board, or further output a sensing signal.

The lens 132 includes a lens barrel 132a and at least one lens 132b housed in the lens barrel 132a. In this embodiment, the number of at least one lens 132b is specifically three, and a spacer ring 132d is disposed between adjacent two lenses 132b to isolate them from each other.

The lens holder 133 includes a top plate 133a, a through hole 133b provided at the center of the top plate 133a, and a foot 133c extending downward along the top plate 132a. The inner wall of the foot 133c defines a cavity 133d. The cavity 133d has an open end, and the inner dimension thereof is slightly larger than the peripheral dimension of the connecting block 113 of the image sensor package 110, so as to be able to accommodate the connecting block. 113 is suitable.

The lens barrel 132b of the lens 132 is disposed in the through hole 133b of the lens holder 133. The base 133c of the lens holder 133 is integrally bonded to the image sensor package 110 by the adhesive body 120. The lens 132a of the lens 132 is relatively positive with the sensing area 112a of the image sensor 112.

In addition, the lens module 130 further includes a transparent plate 134 received in the chamber 133d of the lens holder 133, and is located between the lens 132 and the image sensor 112 to the image sensor 112. It protects, for example, from dust on the outside of the image sensor 112. A transparent cut filter film 135 is formed on the surface of the transparent plate 134 near the lens 132 to filter out infrared light that is unrecognizable by the human eye.

The image sensor package 110 adopts a thin substrate 111, which can reduce the total height of the structure, thereby achieving the purpose of reducing the size of the structure. Moreover, the thin substrate 111 has better thermal conductivity, and the heat emitted by the image sensor 112 can be dissipated to the outside through the thin substrate 111 to ensure stable performance of the image sensor 112. Further, the thin substrate 111 also has a better strength, that is, a Young's modulus is large, so that the image sensor 112 and the lens module 130 can be supported without deformation, and lasting. durable.

Referring to FIG. 3 , a second embodiment of the present invention provides an image sensor module 200 similar to the image sensor module 100 provided in the first embodiment. The difference is that the adhesive body 220 is coated on the connection. The periphery of the upper surface 211a of the block 213; the lens holder 233 has a foot 233c having a peripheral dimension corresponding to the peripheral dimension of the connecting block 213 and the thin substrate 211, which is bonded to the connecting block by the adhesive body 220. 213 is on the upper surface 213a. In addition, the infrared cut filter film 235 of the image sensor module 200 is not formed on the transparent plate 234 but is disposed in the lens 232.

It can be understood that other changes can be made by those skilled in the art within the spirit of the present invention. For example, in the first embodiment, the connecting block 113 is omitted, and one end of each bonding wire 116 and one of the image sensors 112 are soldered. 112a is electrically connected, and the other end thereof is directly electrically connected to one of the contacts 111c on the thin substrate 111. As long as it does not deviate from the technical effects of the present invention. All changes made in accordance with the spirit of the invention are intended to be included within the scope of the invention.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. please. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Image Sensor Module

110‧‧‧Image sensor package

111‧‧‧Thin substrate

112‧‧‧Image Sensor

113‧‧‧Connecting block

116‧‧‧welding line

120‧‧‧Adhesive body

130‧‧‧Lens module

132‧‧‧ lens

133‧‧ ‧ mirror base

134‧‧‧Transparent board

135‧‧‧Infrared cut filter

111a, 113a‧‧‧ upper surface

111c‧‧‧Electrical contacts

112a‧‧‧ pads

112b‧‧‧Sensing area

113b‧‧‧ lower surface

113c‧‧‧ first joint

113d‧‧‧second junction

132a‧‧‧Mirror tube

132b‧‧‧Lens

132d‧‧‧ spacer ring

133a‧‧‧ top board

133b‧‧‧through hole

133c‧‧‧ feet

133d‧‧ ‧ room

1200‧‧‧through hole

Claims (10)

An image sensor package comprising: a thin substrate using aluminum oxide doped with a carbon nanotube as a substrate, the carbon nanotube having a weight of 0.5% to 10% of the total weight of the substrate And the thin substrate has a plurality of contacts; an image sensor is disposed on the thin substrate and has a sensing area, and the periphery of the sensing area is provided with a plurality of soldering corresponding to the plurality of contacts The pad, the plurality of pads are electrically connected to the plurality of contacts of the thin substrate, respectively. The image sensor package of claim 1, wherein the thin substrate has an upper surface, and the plurality of contacts and the image sensor are respectively disposed on the upper surface. The image sensor package of claim 1, wherein the carbon nanotubes comprise from 1% to 5% by weight of the total weight of the substrate. The image sensor package of claim 1, wherein the thin substrate has a thickness of less than 0.2 mm. The image sensor package of claim 1, wherein the thin substrate has a thickness of less than 0.15 mm. An image sensor module includes: an image sensor package comprising: a thin substrate using aluminum oxide doped with a carbon nanotube as a substrate, the weight of the carbon nanotube The thin substrate has an upper surface and a plurality of contacts, and an image sensor is disposed on the thin substrate and has a sensing area around the sensing area. a plurality of pads corresponding to the plurality of contacts, the plurality of pads being electrically connected to the plurality of contacts of the thin substrate; A lens module includes: a lens barrel, at least one lens housed in the lens barrel, and a lens holder connected to the lens barrel, the lens holder being disposed on an upper surface of the thin substrate. The image sensor module of claim 6, wherein the plurality of contacts and the image sensor are respectively disposed on the upper surface. The image sensor module of claim 6, wherein the carbon nanotubes comprise from 1% to 5% by weight of the total weight of the substrate. The image sensor module of claim 6, wherein the thin substrate has a thickness of less than 0.2 mm. The image sensor module of claim 6, wherein the thin substrate has a thickness of less than 0.15 mm.