TWI485054B - Double - sided cutting positioning system and its method - Google Patents
Double - sided cutting positioning system and its method Download PDFInfo
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- TWI485054B TWI485054B TW101132723A TW101132723A TWI485054B TW I485054 B TWI485054 B TW I485054B TW 101132723 A TW101132723 A TW 101132723A TW 101132723 A TW101132723 A TW 101132723A TW I485054 B TWI485054 B TW I485054B
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Description
本發明為提供一種雙面切割之定位系統及其方法,特別是指一種可雙面精確對應定位加工的雙面切割之定位系統及其方法。The invention provides a double-sided cutting positioning system and a method thereof, in particular to a double-sided cutting positioning system capable of double-sided accurate corresponding positioning processing and a method thereof.
按,一般而言,若欲對一物件進行較準確的加工,係必需先對物件進行定位來設定定位點,才以定位點為基準對物件進行加工,而目前最為廣泛運用的定位方式係為邊角定位系統,其係由物件之某一邊線或某一角當作加工原點,且計算加工原點與欲加工之位置間的距離,但此種方法係僅能用於形狀簡單之物件,若物件形狀較為複雜時係難以定位。In general, if you want to process an object more accurately, you must first position the object to set the positioning point, and then use the positioning point as the reference to process the object. The most widely used positioning method is The corner positioning system uses a certain edge or a corner of the object as the machining origin, and calculates the distance between the machining origin and the position to be processed, but this method can only be used for objects with simple shapes. If the shape of the object is more complicated, it is difficult to locate.
因此研發了習用印刷定位系統,而習用印刷定位系統係於物件表面上,加以印刷複數相距一定距離之定位點以供定位,且將具定位點之物件放置於一工作平台上,並以一影像擷取裝置感測該些定位點,而影像擷取裝置係傳遞感測訊號至一加工模組,藉此對物件進行定位加工,但此種方法係僅能用於單面加工,若物件需要雙面加工,此種方法係不符使用,且如果對物件進行雙面印刷,雙面之定位點係無法重合,導致雙面加工失敗。Therefore, a conventional printing positioning system has been developed, and the conventional printing positioning system is attached to the surface of the object to print a plurality of positioning points at a certain distance for positioning, and the object with the positioning point is placed on a working platform, and an image is used. The capturing device senses the positioning points, and the image capturing device transmits the sensing signal to a processing module, thereby positioning the object, but the method can only be used for single-sided processing, if the object needs Double-sided processing, this method is not suitable for use, and if the object is double-sided printed, the positioning points on both sides cannot overlap, resulting in double-sided processing failure.
是以,要如何解決上述習用之問題與缺失,即為本發明之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。Therefore, how to solve the above problems and deficiencies in the above-mentioned applications, that is, the inventors of the present invention and those involved in the industry are eager to study the direction of improvement.
故,本發明之發明人有鑑於上述缺失,乃搜集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種可雙面精確對應定位加工的雙面切割之定位系統及其方法發明專利者。Therefore, the inventors of the present invention have collected the relevant materials in view of the above-mentioned deficiencies, and through multi-party evaluation and consideration, and through years of experience accumulated in the industry, through continuous trial and modification, this double-sided accurate correspondence is designed. Positioning processing double-sided cutting positioning system and method of its invention patent.
本發明之主要目的在於確保正反兩面的定位於同一點上,使兩面的加工得以相對應不偏移,為達上述目的,本發明主結構係包括有一定位感測模組及一加工元件,其中定位感測模組係資訊連結有一切割模組,而加工元件係界定有複數藉由該切割模組加工成形之翻轉部,且該些翻轉部一側處係分別設有一供該定位感測模組感測定位之定位單元,並該些定位單元係藉由一印刷模組對該加工元件進行披覆加工而成;而本發明作動時,係由定位感測模組感測該些定位單元,藉此定位加工元件,而後定位感測模組傳遞定位資訊給切割模組,且切割模組係對加工元件進行加工以初步構成所需之成品,除加工外,切割模組係於該些定位單元四周分別環繞切出一翻轉部,並把該些翻轉部取出且翻轉180度插回位於加工元件之原始位置,再將加工元件翻至背面,故隨該些翻轉部翻轉180度之定位單元係得以呈現,而定位感測模組係再次感測該些定位單元,且加以定位並傳遞至切割模組,而切割模組係對加工元件背面進行切割加工,藉由上述技術,可針對習用印刷定位系統所存在之僅能用於單面加工的問 題點加以突破,達到可雙面精確對應定位加工之實用進步性。The main purpose of the present invention is to ensure that the front and back sides are positioned at the same point, so that the processing of the two sides can be correspondingly not offset. To achieve the above object, the main structure of the present invention comprises a positioning sensing module and a processing component. The positioning sensing module is connected with a cutting module, and the processing component defines a plurality of reversing portions formed by the cutting module, and the reversing portions are respectively provided with one for the positioning sensing. The positioning unit of the module sensing position, and the positioning unit is formed by covering the processing component by a printing module; and when the invention is activated, the positioning sensing module senses the positioning The unit is configured to position the processing component, and the positioning sensor module transmits positioning information to the cutting module, and the cutting module processes the processing component to initially form a desired finished product, and the cutting module is in addition to the processing Each of the positioning units is surrounded by a reversing portion, and the reversing portions are taken out and rotated 180 degrees to be inserted back into the original position of the processing component, and then the processing component is turned to the back, so The positioning unit that flips the flipping portion by 180 degrees is presented, and the positioning sensing module senses the positioning units again, and positions and transmits the positioning unit to the cutting module, and the cutting module performs cutting processing on the back surface of the processing component. With the above technology, it can be applied to the conventional printing positioning system which can only be used for single-sided processing. The problem is broken and the practical progress of the two-dimensional accurate corresponding positioning processing can be achieved.
為達成上述目的及功效,本發明所採用之技術手段及構造,茲繪圖就本發明較佳實施例詳加說明其特徵與功能如下,俾利完全了解。In order to achieve the above objects and effects, the technical means and the structure of the present invention will be described in detail with reference to the preferred embodiments of the present invention.
請參閱第一圖至第八圖所示,係為本發明較佳實施例之結構方塊示意圖、定位單元示意圖、正面加工示意圖、取出翻轉部示意圖、翻轉翻轉部示意圖、插回翻轉部示意圖、加工元件翻面示意圖及背面加工示意圖,由圖中可清楚看出本發明雙面切割之定位系統及其方法係包括有一定位感測模組3、一切割模組4及一加工元件1,其中切割模組4係與定位感測模組3資訊連結,而加工元件1係呈對稱態樣或不對稱態樣其中之一者,且加工元件1係界定有複數藉由該切割模組4加工成形之翻轉部11,並該些翻轉部11係藉由切割模組4切割成形,而該些翻轉部11係呈圓形態樣或多邊形態樣其中之一者,且該些翻轉部11係可經翻轉後插設於加工元件1上,並該些翻轉部11一側處係分別設有一供該定位感測模組3感測定位之定位單元12,而該些定位單元12係藉由一印刷模組2對加工元件1進行披覆加工而成,且定位感測模組3係供感測加工元件1與該些定位單元12間之顏色對比,藉此定位加工元件1,又,上述係僅為本發明其中之一實施態樣,其態樣不設限於此。Please refer to the first to eighth embodiments, which are schematic structural diagrams of the preferred embodiment of the present invention, a schematic diagram of the positioning unit, a schematic diagram of the front processing, a schematic diagram of the removal and reversal section, a schematic diagram of the flipping and turning section, a schematic diagram of the insertion and reversal section, and processing. A schematic diagram of the flipping of the components and a schematic diagram of the backside processing, it can be clearly seen from the figure that the positioning system and the method of the double-sided cutting of the present invention comprise a positioning sensing module 3, a cutting module 4 and a processing component 1 in which cutting The module 4 is connected to the positioning sensing module 3, and the processing component 1 is one of a symmetrical or asymmetrical state, and the processing component 1 defines a plurality of processing modules formed by the cutting module 4 The inverting portion 11 is cut and formed by the cutting module 4, and the inverting portions 11 are one of a circular shape or a polygonal shape, and the inverting portions 11 are After being turned over, the positioning unit 12 is disposed on the processing element 1 , and the positioning unit 12 is disposed on the side of the inversion portion 11 , and the positioning units 12 are printed by a printing unit 12 . Module 2 pair processing The component 1 is subjected to a coating process, and the positioning sensing module 3 is used for color comparison between the sensing processing component 1 and the positioning components 12, thereby positioning the processing component 1. Further, the above-mentioned system is only the present invention. In one embodiment, the aspect is not limited thereto.
請參閱第一圖至第九圖所示,係為本發明較佳實施例之結構方塊示意圖、定位單元示意圖、正面加工示意圖、取出翻轉部示意圖、翻轉翻轉部示意圖、插回翻轉部示意圖、加工元件翻面示意圖、背面加工示意圖及方塊流程圖,由圖中可清楚看出(a)以印刷模組2對一加工元件1之一側進行披覆加工形成複數定位單元12,且(b)以一定位感測模組3感測加工元件1與該些定位單元12間之對比,藉此定位加工元件1,並(c)定位感測模組3係提供定位資訊給一切割模組4,使切割模組4得以對加工元件1準確的切割加工,且對加工元件1鄰近該些定位單元12處進行環繞切割,以形成複數翻轉部11,並(d)將該些翻轉部11取出且翻轉後,插設回原位於加工元件1之位置,才將加工元件1翻至背面,並以隨該些翻轉部11翻轉之該些定位單元12供定位感測模組3感測定位,再由切割模組4對加工元件1背面進行與前述正面加工相對應之切割加工。Please refer to the first to ninth drawings, which are schematic structural diagrams of the preferred embodiment of the present invention, a schematic diagram of the positioning unit, a schematic diagram of the front processing, a schematic diagram of the removal and reversal section, a schematic diagram of the flipping and turning section, a schematic diagram of the insertion and reversal section, and processing. The flip-up diagram of the component, the schematic diagram of the back surface processing and the block diagram of the block are clearly visible in the figure. (a) The printing module 2 is coated on one side of a processing component 1 to form a plurality of positioning units 12, and (b) A positioning sensing module 3 senses the contrast between the processing component 1 and the positioning units 12, thereby positioning the processing component 1 and (c) positioning the sensing module 3 to provide positioning information to a cutting module 4 , the cutting module 4 can be accurately cut and processed to the processing element 1 , and the processing element 1 is circumferentially cut adjacent to the positioning units 12 to form a plurality of inverting portions 11 , and (d) the inverting portions 11 are taken out. After the flipping, the positioning of the processing component 1 is reversed to the position of the processing component 1 to turn the processing component 1 to the back surface, and the positioning unit 12 that is flipped over with the inverting portion 11 is used for the positioning sensing module 3 to sense the position. Then by the cutting module 4 The back surface of the workpiece 1 is subjected to a cutting process corresponding to the front surface processing described above.
綜上所述,藉由將該些翻轉部11翻轉180度且插設回原位置,使位於加工元件1正面之該些定位單元12變更至加工元件1背面,但該些定位單元12之相對位置係不會有所變更,進而達到雙面精確對應定位加工之目的。In summary, the inverting portions 11 are turned 180 degrees and inserted back to the original position, so that the positioning units 12 located on the front surface of the processing element 1 are changed to the back surface of the processing element 1, but the relative positioning of the positioning units 12 The position system will not be changed, so as to achieve the purpose of precise positioning processing on both sides.
請參閱第十圖所示,係為本發明另一較佳實施例之輔助元件示意圖,由圖中可清楚看出本發明雙面切割之定位系統及其方法係包括有一加工元件1a,且加工元件1a於一側處係設有複數定位單元12a,並加工元件1a係進一步設置有至少一與該些定位單元12a相對應設置之輔助元件5a,而輔助元件5a係於中間處形成一孔洞以供展示該些定位單元12a,且輔助元件5a係可重複黏貼於加工元件1a並好撕除,藉此使輔助元件5a與該些定位單元12a產生顏色對比,以避免加工元件1a具有花紋、文字、反光部位等,或加工元件1a顏色與定位單元12a過於相近,導致妨礙感測定位單元12a,進而影響對加工元件1a之定位。Please refer to the tenth figure, which is a schematic diagram of an auxiliary component according to another preferred embodiment of the present invention. It can be clearly seen from the figure that the positioning system and method of the double-sided cutting of the present invention include a processing component 1a and processing. The component 1a is provided with a plurality of positioning units 12a at one side, and the processing component 1a is further provided with at least one auxiliary component 5a disposed corresponding to the positioning units 12a, and the auxiliary component 5a forms a hole in the middle to form a hole. The positioning unit 12a is displayed, and the auxiliary component 5a is repeatedly adhered to the processing component 1a and is torn off, thereby causing the auxiliary component 5a to produce a color contrast with the positioning units 12a to prevent the processing component 1a from having a pattern and a character. The reflective portion or the like, or the color of the processing element 1a is too close to the positioning unit 12a, resulting in an interference with the sensing position unit 12a, which in turn affects the positioning of the processing element 1a.
惟,以上所述僅為本發明之較佳實施例而已,非因此即侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。故,請參閱全部附圖所示,本發明使用時,與習用技術相較,著實存在下列優點:However, the above description is only the preferred embodiment of the present invention, and thus it is not intended to limit the scope of the present invention. Therefore, the simple modification and equivalent structural changes of the present specification and the drawings should be treated similarly. It is included in the scope of the patent of the present invention and is combined with Chen Ming. Therefore, referring to all the drawings, when using the present invention, compared with the conventional technology, the following advantages exist:
一、藉由定位感測模組3、切割模組4、複數翻轉部11及複數定位單元12相配合,令本發明達到可雙面精確對應定位加工之實用進步性。1. The positioning sensing module 3, the cutting module 4, the plurality of reversing portions 11 and the plurality of positioning units 12 cooperate to achieve the practical progress of the double-sided accurate corresponding positioning processing.
二、藉由輔助元件5a與定位單元12a相配合,令本發明達到可應用於具各種反光、花紋、文字或顏色的加工元件1a之實用進步性。Second, by the cooperation of the auxiliary component 5a and the positioning unit 12a, the present invention achieves practical advancement applicable to the processing component 1a having various reflections, patterns, characters or colors.
綜上所述,本發明之雙面切割之定位系統及其方法於使用時,為確實能達到其功效及目的,故本發明誠為一實用性優異之發明,為符合發明專利之申請要件,爰依法提出申請,盼審委早日賜准本發明,以保障發明人之辛苦發明,倘若 鈞局審委有任何稽疑,請不吝來函指示,發明人定當竭力配合,實感德便。In summary, the double-sided cutting positioning system and the method thereof of the present invention can achieve its efficacy and purpose when used, and therefore the invention is an invention with excellent practicability, and is an application requirement conforming to the invention patent.提出 Submit an application in accordance with the law, and hope that the trial committee will grant the invention as soon as possible to protect the inventor's hard work. If there is any doubt in the trial committee, please do not hesitate to give instructions, the inventor will try his best to cooperate, and feel really good.
1、1a‧‧‧加工元件1, 1a‧‧‧Processing components
11‧‧‧翻轉部11‧‧‧Flip section
12、12a‧‧‧定位單元12, 12a‧‧‧ Positioning unit
2‧‧‧印刷模組2‧‧‧Printing module
3‧‧‧定位感測模組3‧‧‧ Positioning Sensing Module
4‧‧‧切割模組4‧‧‧ cutting module
5a‧‧‧輔助元件5a‧‧‧Auxiliary components
第一圖 係為本發明較佳實施例之結構方塊示意圖。The first figure is a block diagram showing the structure of a preferred embodiment of the present invention.
第二圖 係為本發明較佳實施例之定位單元示意圖。The second figure is a schematic diagram of a positioning unit in accordance with a preferred embodiment of the present invention.
第三圖 係為本發明較佳實施例之正面加工示意圖。The third drawing is a schematic view of the front side processing of the preferred embodiment of the present invention.
第四圖 係為本發明較佳實施例之取出翻轉部示意圖。The fourth figure is a schematic view of the take-out turning portion of the preferred embodiment of the present invention.
第五圖 係為本發明較佳實施例之翻轉翻轉部示意圖。Figure 5 is a schematic view of a flip-over portion of a preferred embodiment of the present invention.
第六圖 係為本發明較佳實施例之插回翻轉部示意圖。Figure 6 is a schematic view of the insertion and reversal portion of the preferred embodiment of the present invention.
第七圖 係為本發明較佳實施例之加工元件翻面示意圖。Figure 7 is a schematic plan view of a processing component in accordance with a preferred embodiment of the present invention.
第八圖 係為本發明較佳實施例之背面加工示意圖。The eighth figure is a schematic view of the back side processing of the preferred embodiment of the present invention.
第九圖 係為本發明較佳實施例之方塊流程圖。Figure 9 is a block flow diagram of a preferred embodiment of the present invention.
第十圖 係為本發明另一較佳實施例之輔助元件示意圖。Figure 10 is a schematic view of an auxiliary component of another preferred embodiment of the present invention.
1‧‧‧加工元件1‧‧‧Processing components
11‧‧‧翻轉部11‧‧‧Flip section
12‧‧‧定位單元12‧‧‧ Positioning unit
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Citations (2)
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TWI246382B (en) * | 2000-11-08 | 2005-12-21 | Orbotech Ltd | Multi-layer printed circuit board fabrication system and method |
TWM447833U (en) * | 2012-09-07 | 2013-03-01 | Da Yeh Paper Co Ltd | Positioning system for double-sided cutting |
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TWI246382B (en) * | 2000-11-08 | 2005-12-21 | Orbotech Ltd | Multi-layer printed circuit board fabrication system and method |
TWM447833U (en) * | 2012-09-07 | 2013-03-01 | Da Yeh Paper Co Ltd | Positioning system for double-sided cutting |
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