TWI467786B - Photovoltaic module and manufacturing method thereof - Google Patents

Description

Solar photovoltaic module and manufacturing method thereof

This proposal relates to a solar photovoltaic module and a method of fabricating the same, and more particularly to a solar photovoltaic module having an inverter unit and a method of fabricating the same.

With the development of science and technology, human beings have accelerated the quality of life and accelerated the consumption of energy on the earth. Therefore, the demand for alternative energy sources is increasing, among which solar energy has the most potential for development.

The solar photovoltaic system includes a plurality of solar photovoltaic modules and a single inverter, wherein the solar photovoltaic modules are connected in series to the inverter to convert the direct current generated by the solar photovoltaic modules into alternating current to provide a living environment. Electricity. However, in the process of outputting alternating current in the solar photovoltaic system, when the inverter converts direct current into alternating current, a large number of coils and switching devices are liable to cause 15 to 20 percent power loss, thereby increasing the sun. The cost of electricity generation in photovoltaic systems.

In addition, the components of the conventional inverter are numerous and complicated, and the volume is relatively large, so that the solar photovoltaic system has the problem of the installation site cost and the equipment cost of the inverter being too high to increase the power generation cost.

In order to solve the above problem, the size of the inverter can be reduced by introducing a wide-gap silicon carbide power semiconductor component to reduce the installation site cost, but the method has a large energy gap of the tantalum carbide power semiconductor component unit price. Too high to effectively reduce the cost of solar photovoltaic system power generation.

The proposal is to provide a solar photovoltaic module and a manufacturing method thereof, thereby solving the problem. The prior art has the problem of excessive power generation costs.

An embodiment of the present invention includes a light-receiving panel, a solar cell unit, an inverter unit, a dielectric layer, a backlight, and an encapsulation layer. Wherein, the solar cell unit includes a light receiving surface and a backlight surface opposite to each other. The light receiving plate is for receiving light, and the light receiving surface is disposed on the light receiving plate. The inverter unit is electrically connected to the solar battery unit, and the dielectric layer covers the inverter unit and is disposed on the backlight surface. The encapsulation layer covers the dielectric layer and the solar cell unit and is disposed between the light-receiving plate and the backlight.

The method for fabricating a solar photovoltaic module according to an embodiment of the present invention includes the steps of: forming a first dielectric layer on a backlight surface of a solar cell unit. Next, four pads are disposed on the first medium. Soldering a diode of the inverter unit to the second solder pad of the four solder pads and a programmable switch of the soldering inverter unit to the other two solder pads of the four solder pads, and electrically connecting the four soldering wires by wire bonding Pad with solar battery unit. Next, a second dielectric layer is laminated to the first dielectric layer. Forming two first holes on the second dielectric layer, and forming a plating layer on the second dielectric layer and the two first holes by electroplating, so that the plating layer is electrically connected to the diode through the first hole and can be programmed switch. Pressing an encapsulation layer on the second dielectric layer and the solar cell unit to enclose the encapsulation layer with the second dielectric layer and the solar cell unit. Then, a light-receiving plate and a backlight are pressed on a first surface and a second surface of the encapsulation layer, wherein the first surface faces the second surface.

Another embodiment of the present invention discloses a method for fabricating a solar photovoltaic module, the method comprising: forming a first dielectric layer on a backlight surface of a solar cell unit. Then, four second holes are formed on the first dielectric layer, and four conductive layers are screen printed on the four second holes, so that the four conductive layers are electrically connected to the solar energy through the four second holes. Battery unit. Disposing a diode of an inverter unit on the two conductive layers of the four conductive layers and a programmable switch of the inverter unit on the other two conductive layers of the four conductive layers, and electrically connecting the two conductive layers Polar body and programmable switch. Next, a second dielectric layer is laminated to the first dielectric layer. Pressing an encapsulation layer on the second dielectric layer and the solar cell unit to enclose the encapsulation layer with the second dielectric layer and the solar cell unit. Then, a light-receiving plate and a backlight are pressed on a first surface and a second surface of the encapsulation layer, wherein the first surface faces the second surface.

A method for fabricating a solar photovoltaic module according to another embodiment of the present invention includes the steps of providing a primary module, wherein the secondary module comprises the solar cell unit, a light receiving plate and a first polymer layer, the first high The molecular layer is disposed between the solar cell unit and the light receiving plate. Forming a first dielectric layer on a backlight surface of a solar cell unit. Then, four second holes are formed on the first dielectric layer, and four or two conductive layers are screen printed on the four second holes, so that the four conductive layers are electrically connected to the solar battery cells through the four second holes. Disposing a diode of an inverter unit on the two conductive layers of the four conductive layers and arranging a switchable switch on the other two conductive layers of the four conductive layers, and electrically connecting the diodes with the wire bonding method Program switch. Next, a second dielectric layer is laminated to the first dielectric layer. Pressing a second polymer layer on the first polymer layer and the solar cell unit, so that the first polymer layer and the second polymer layer cover the second dielectric layer and the solar cell. Next, a backlight is pressed onto a third surface of the second polymer layer.

A method for fabricating a solar photovoltaic module according to a further embodiment of the present invention includes the steps of providing a primary module, wherein the secondary module comprises the solar cell unit, a light receiving plate and a first polymer layer, the first high Molecular layer disposed on solar cell sheet Between the element and the light plate. Forming a first dielectric layer on a backlight surface of a solar cell unit. Next, four pads are disposed on the first medium. Soldering a diode of the inverter unit to the second solder pad of the four solder pads and a programmable switch of the soldering inverter unit to the other two solder pads of the four solder pads, and electrically connecting the four soldering wires by wire bonding Pad with solar battery unit. Next, a second dielectric layer is laminated to the first dielectric layer. Forming two first holes on the second dielectric layer, and forming a plating layer on the second dielectric layer and the two first holes by electroplating, so that the plating layer is electrically connected to the diode through the first hole and can be programmed switch. Next, a second polymer layer is pressed against the first polymer layer and the solar cell unit such that the first polymer layer and the second polymer layer cover the second dielectric layer and the solar cell. Next, a backlight is pressed onto a third surface of the second polymer layer.

According to the solar photovoltaic module disclosed in the above proposal, the inverter unit is disposed between the backlight board and the light-receiving board, and on the one hand, the electrical conduction path between the solar battery unit and the inverter unit can be shortened, and the electric energy is transmitted. The loss caused by the long path, thereby improving the output efficiency of the solar photovoltaic module; on the other hand, the installation space cost of the conventional solar photovoltaic module due to the need to additionally install the inverter device can be omitted; The unit is damaged by moisture in the environment. According to the manufacturing method of the solar photovoltaic module disclosed in the above proposal, the method is applicable to a roll-to-roll process to improve the production of the solar photovoltaic module disclosed in the proposal.

The features, implementation and efficacy of this proposal are described in detail below with reference to the preferred embodiment of the drawings.

Please refer to "1G Figure" and "1H Figure" for the purposes of this proposal. A schematic view of a side view of a solar photovoltaic module according to a first embodiment and a top view of a solar cell, an inverter unit and a dielectric layer according to "1G", wherein "1G" is also used to make the proposal. A schematic side view of the solar photovoltaic module step 314 of the first embodiment.

In this embodiment, the solar photovoltaic module 100 includes a light receiving plate 102, a solar battery unit 104, an inverter unit 106, a dielectric layer 108, a backlight 110, and an encapsulation layer 112. The solar cell unit 104 includes a light receiving surface 60 and a backlight surface 62 opposite to each other. The solar photovoltaic module 100 can be, but is not limited to, a back contact photovoltaic module. The light-receiving plate 102 has translucency to receive the light 90, and the light-receiving surface 60 is disposed on the light-receiving plate 102. The material of the light receiving plate 102 may be, but not limited to, glass.

The inverter unit 106 is electrically connected to the solar battery unit 104. The solar cell unit 104 includes a first electrode 93, a first electrode 95, a second electrode 88, a second electrode 89, a P-type semiconductor doping layer 92, and an N-type semiconductor doping layer 94. The first electrodes 93 and 95 are electrically connected to the P-type semiconductor doping layer 92, and the second electrodes 88 and 89 are electrically connected to the N-type semiconductor doping layer 94. The materials of the first electrodes 93, 95 and the second electrodes 88, 89 may be, but not limited to, aluminum glue or silver glue, and the first electrodes 93, 95 and the second electrodes 88, 89 have different electrical properties. The doping material of the N-type semiconductor doping layer 94 may be, but not limited to, phosphorus oxychloride (POCl ₃ ), phosphorus (P), arsenic (As) or antimony (Tb), doping of the P-type semiconductor doping layer 92. The material may be, but not limited to, boron tribromide (BBr ₃ ), boron (B), aluminum (Al), germanium (Ge), or indium (In). The inverter unit 106 can include a diode 96 and a programmable switch 98. The diode 96 can include, but is not limited to, a bypass diode and a maximum power point tracker (MPPT). The switch 98 can include, but is not limited to, a phase tracker and a field effect transistor, and the field effect transistor can be a Metal Oxide Semiconductor Field Effect Transistor (MOSFET) or a metal semiconductor field effect transistor (Metal Semiconductor Field Effect). Transistor, MESFET). In this embodiment, the solar photovoltaic module 100 further includes a plating layer 34. The diode 96 and the programmable switch 98 are electrically connected to each other by the plating layer 34. However, this embodiment is not intended to limit the proposal. For example, the diode 96 and the programmable switch can also be electrically connected to each other by wire bonding.

The dielectric layer 108 covers the inverter unit 106 and is disposed on the backlight surface 62. In this embodiment, the solar photovoltaic module 100 further includes pads 70, 71, 72, 73. The dielectric layer 108 may include a first dielectric layer 80 and a second dielectric layer 82. The second dielectric layer 82 includes A hole 30, 32. The pads 70, 71, 72, 73 are disposed on the first dielectric layer 80 and electrically connected to the solar cell unit 104 by wire bonding (ie, the pads 70, 72 are electrically connected to the first electrodes 93, 95, pads 71, 73). The second electrodes 89, 88) are electrically connected. The diode 96 is soldered to the pads 71 and 72, and the programmable switch 98 is soldered to the pads 70 and 73, so that the diode 96 and the programmable switch 98 are electrically connected to the solar cell unit 104. The plating layer 34 is disposed on the second dielectric layer 82 and the first holes 30 and 32 and electrically connected to the diode 96 and the programmable switch 98 via the first holes 30 and 32. The material of the first dielectric layer 80 may be, but not limited to, polypropylene, polyimide, or ABF (ajinomoto build-up film). The material of the second dielectric layer 82 may be, but not limited to, polypropylene. (polypropylene), polyimide (polyimide) or ABF (ajinomoto build-up film) material. The first dielectric layer 80 and the second dielectric layer 82 may be, but not limited to, the same material, for example, The first dielectric layer 80 and the second dielectric layer 82 can be of different materials.

The encapsulation layer 112 covers the dielectric layer 108 and the solar cell unit 104 and is disposed between the light-receiving plate 102 and the backlight plate 110. The material of the encapsulation layer 112 can be, but not limited to, Ethylene Vinyl Acetate (EVA) or Polyvinyl Chloride (PVC). The material of the backlight board 110 may be, but not limited to, polyester, polyolefin, polyethylene, polypropylene, or polyimide.

Please refer to "1A" to "1G" for the side view of the solar photovoltaic module step 302 to step 314 of the first embodiment of the present proposal. The solar photovoltaic module manufacturing method includes:

Step 302: Form a first dielectric layer on a backlight surface of the solar cell unit.

Step 304: Configure four pads on the first medium.

Step 306: soldering a diode of an inverter unit to the second pad of the four pads and a programmable switch of the welding inverter unit to the other two pads of the four pads, and electrically connecting the four wires by wire bonding. Pad with solar battery unit.

Step 308: Pressing a second dielectric layer on the first dielectric layer.

Step 310: forming two first holes on the second dielectric layer, and forming a plating layer on the second dielectric layer and the first holes by electroplating, so that the plating layer is electrically connected to the diode through the two first holes. Programmable switch.

Step 312: Pressing an encapsulation layer on the second dielectric layer and the solar cell unit to cover the encapsulation layer with the second dielectric layer and the solar cell unit.

Step 314: Pressing a light-receiving plate and a backlight plate on a first surface and a second surface of the encapsulation layer, wherein the first surface faces the second surface.

In step 302, the first dielectric layer 80 can be disposed on the backlight surface 62 by screen printing or attaching. The material of the pads 70, 71, 72, 73 described in step 304 may be, but not limited to, gold or copper. The encapsulation layer 112 described in step 314 includes a first surface 36 and a second surface 35, wherein the first surface 36 faces the second surface 35.

Please refer to "2F" and "2G", which are respectively a schematic view of a side view of a solar photovoltaic module according to a second embodiment of the present proposal and a solar battery unit and an inverter unit according to "2F". A schematic top view of the dielectric layer, wherein "2F" is also a side view of the solar photovoltaic module step 412 of the second embodiment of the present invention. The solar photovoltaic module 200 includes a wire 36. The diode 97 and the programmable switch 99 are electrically connected to each other by a wire 36. However, this embodiment is not intended to limit the proposal.

In this embodiment, the solar photovoltaic module 200 includes a light receiving plate 202, a solar battery unit 204, an inverter unit 206, a dielectric layer 208, a backlight 210, and an encapsulation layer 212. The solar cell unit 204 includes a light receiving surface 61 and a backlight surface 63 opposite to each other. The solar photovoltaic module 200 can be, but is not limited to, a back contact photovoltaic module. The light-receiving plate 202 is translucent to receive the light 90, and the light-receiving surface 61 is disposed on the light-receiving plate 202.

The inverter unit 206 is electrically connected to the solar battery unit 204. The solar cell unit 204 includes a first electrode 53, a first electrode 55, a second electrode 78, a second electrode 79, a P-type semiconductor doping layer 52, and an N-type semiconductor doping layer 54. The first electrodes 53, 55 are electrically connected to the P-type semiconductor doping layer 52, the second electrodes 78, 79 are electrically connected to the N-type semiconductor doping layer 54, and the first electrodes 53, 55 and the second electrodes 78, 79 have Different electrical properties. The inverter unit 206 can include a diode 97 and a programmable The switch 99, wherein the diode 97 can include, but is not limited to, a bypass diode and a maximum power point tracker (MPPT), and the programmable switch 99 can include, but is not limited to, a phase tracker and a field effect transistor. The field effect transistor may be a Metal Oxide Semiconductor Field Effect Transistor (MOSFET) or a Metal Semiconductor Field Effect Transistor (MESFET). In this embodiment, the diode 97 and the programmable switch 99 can be electrically connected to each other by wire bonding.

The dielectric layer 208 covers the inverter unit 206 and is disposed on the backlight surface 63. In this embodiment, the solar photovoltaic module 200 further includes a conductive layer 41, 42, 43, 44. The dielectric layer 208 may include a first dielectric layer 51 and a second dielectric layer 57. The first dielectric layer 51 includes a first dielectric layer 51. The two holes 21, 22, 26, and 28 are disposed on the second holes 28, 21, 26, and 22, respectively, and are electrically connected to the solar cells through the second holes 28, 21, 26, and 22. The unit 204 (ie, the conductive layers 41 and 43 are electrically connected to the second electrodes 78 and 79, the conductive layers 42 and 44 are electrically connected to the first electrodes 53 and 55), and the inverter unit 206 is disposed on the conductive layers 41, 42, 43, and 44. The solar cell unit 204 is electrically connected. In other words, the diode 97 is electrically connected to the first electrode 55 and the second electrode 79 of the solar cell 204 by the conductive layer 44 and the conductive layer 43. The programmable switch 99 is electrically connected to the solar energy by the conductive layers 42 and 41. The first electrode 53 and the second electrode 78 of the battery unit 204.

The encapsulation layer 212 covers the dielectric layer 208 and the solar cell 204 and is disposed between the light-receiving plate 202 and the backlight 210.

Please refer to "2A" to "2F" for the side view of the solar photovoltaic module steps 402 to 412 of the second embodiment of the present proposal. Figure. The solar photovoltaic module manufacturing method includes:

Step 402: Form a first dielectric layer on a backlight surface of the solar cell unit.

Step 404: Form four fourth holes on the first dielectric layer, and screen the four conductive layers on the fourth second holes, so that the four conductive layers are electrically connected to the solar battery cells by the four second holes.

Step 406: Configuring a diode of the inverter unit to connect the two conductive layers of the four conductive layers and the programmable switch of the inverter unit to the other two conductive layers of the four conductive layers, and electrically connect the diodes with the wire bonding method. Programmable switch.

Step 408: Pressing the second dielectric layer on the first dielectric layer.

Step 410: Press-bonding the encapsulation layer to the second dielectric layer and the solar cell unit such that the encapsulation layer encapsulates the second dielectric layer and the solar cell unit.

Step 412: Pressing the light-receiving plate and the backlight plate on a first surface and a second surface of the encapsulation layer, wherein the first surface faces the second surface.

In step 402, the first dielectric layer 51 can be disposed on the backlight surface 63 by screen printing or attaching. The encapsulation layer 212 described in step 412 includes a first surface 24 and a second surface 23, wherein the first surface 24 faces the second surface 23 .

Please refer to "3G" and "3H", which are schematic views of a side view of a solar photovoltaic module according to a third embodiment of the present proposal, and a solar battery unit and an inverter unit according to "3G". A schematic top view of the dielectric layer, wherein the "3G" is also a side view of the solar photovoltaic module step 514 of the third embodiment of the present invention.

In this embodiment, the difference between the solar photovoltaic module 300 and the solar photovoltaic module 200 is that the encapsulation layer 212 includes a first polymer layer 12 and a second polymer. In the layer 10, the first polymer layer 12 is disposed between the light-receiving plate 202 and the solar cell 204, and the second polymer layer 10 covers the second dielectric layer 57 and the solar cell 204.

Please refer to "3A" to "3G", which are schematic cross-sectional structures of steps 502 to 514 of the solar photovoltaic module of the third embodiment of the present invention. The solar photovoltaic module manufacturing method includes:

Step 502: Provide a secondary module.

Step 504: Form a first dielectric layer on a backlight surface of the solar cell unit.

Step 506: Forming four second holes on the first dielectric layer, and printing four conductive layers on the fourth second holes, so that the four conductive layers are electrically connected to the solar battery cells by the four second holes.

Step 508: Configuring the diode of the inverter unit on the two conductive layers of the four conductive layers and the programmable switch of the inverter unit on the other two conductive layers of the four conductive layers, and electrically connecting the two poles by wire bonding Body and programmable switch.

Step 510: Pressing the second dielectric layer on the first dielectric layer.

Step 512: Pressing the second polymer layer on the first polymer layer and the solar cell unit, so that the first polymer layer and the second polymer layer cover the second dielectric layer and the solar cell.

Step 514: Pressing the light-receiving plate and the backlight plate on the first surface and the second surface of the encapsulation layer, wherein the first surface faces the second surface.

In step 502 , the secondary module 203 includes a solar cell 204 , a light-receiving plate 202 and a first polymer layer 12 , and the first polymer layer 12 is disposed between the solar cell 204 and the light-receiving plate 202 .

Solar photovoltaic module of the first embodiment, the second embodiment and the third embodiment Only a single solar cell unit and a single inverter unit are included, but the above embodiments are not intended to limit the proposal. For example, a solar photovoltaic module may include a plurality of solar cells and a single inverter unit (ie, a backlight unit of a single solar cell unit has an inverter unit), wherein the solar cells may be connected in series, in parallel, or partially in series. Parallel; or the solar photovoltaic module may include a plurality of solar cells and a plurality of inverter units, wherein the number of solar cells may be the same or different from the number of inverters (ie, some or all of the backlights of the solar cells have an inverse Variable cells), and these solar cells can be connected in series, in parallel with each other or partially in series.

According to the solar photovoltaic module disclosed in the above proposal, the inverter unit is disposed between the backlight board and the light-receiving board, which can shorten the electrical conduction path between the solar battery unit and the inverter unit, and reduce the electric energy due to the conduction path. The loss caused by the long, and thus the output efficiency of the solar photovoltaic module. In addition, by covering the inverter unit with the encapsulation layer, the inverter unit can be prevented from being damaged by the moisture of the environment. Furthermore, since the volume of the inverter unit disclosed in the present proposal is smaller than that of the inverter device required for the conventional solar photovoltaic module, the installation of the conventional solar photovoltaic module due to the installation of the inverter device can be omitted. Space cost. According to the manufacturing method of the solar photovoltaic module disclosed in the above proposal, the method is applicable to a roll-to-roll process to improve the production of the solar photovoltaic module disclosed in the proposal.

While the present invention has been disclosed in the foregoing preferred embodiments, it is not intended to limit the present invention. Any skilled person skilled in the art can make some changes and refinements without departing from the spirit and scope of the present proposal. The scope of patent protection of the proposal shall be subject to the definition of the scope of the patent application attached to this specification.

10‧‧‧Second polymer layer

12‧‧‧First polymer layer

21, 22, 26, 28‧‧‧ second hole

23, 35‧‧‧ second surface

24, 36‧‧‧ first surface

30, 32‧‧‧ first hole

34‧‧‧Electroplating

36‧‧‧Wire

41, 42, 43, 44‧‧‧ conductive layers

51, 80‧‧‧ first dielectric layer

52, 92‧‧‧P type semiconductor doped layer

53, 55, 93, 95‧‧‧ first electrode

54, 94‧‧‧N type semiconductor doped layer

78, 79, 88, 89‧‧‧ second electrode

57, 82‧‧‧second dielectric layer

60, 61‧‧‧Glossy

62, 63‧‧‧ Backlit surface

70, 71, 72, 73‧‧ ‧ pads

90‧‧‧Light

96, 97‧‧‧ diode

98, 99‧‧‧ Programmable switch

100, 200, 300‧‧‧ solar photovoltaic modules

102, 202‧‧‧ light board

104, 204‧‧‧ solar cells

106, 206‧‧‧Inverter unit

108, 208‧‧‧ dielectric layer

110, 210‧‧‧ Backlight

112, 212‧‧‧Encapsulation layer

203‧‧‧ modules

Fig. 1A is a schematic cross-sectional view showing the step 302 of the solar photovoltaic module of the first embodiment of the present invention.

Fig. 1B is a schematic cross-sectional view showing the step 304 of the solar photovoltaic module of the first embodiment of the present invention.

1C is a schematic cross-sectional view showing the step 306 of the solar photovoltaic module of the first embodiment of the present invention.

1D is a schematic cross-sectional view of a solar photovoltaic module step 308 of the first embodiment of the present invention.

Fig. 1E is a schematic cross-sectional view showing the step 310 of the solar photovoltaic module of the first embodiment of the present invention.

FIG. 1F is a schematic cross-sectional view showing the step 312 of the solar photovoltaic module of the first embodiment of the present invention.

The 1Gth diagram is a schematic cross-sectional view of the solar photovoltaic module step 314 of the first embodiment of the present invention.

The 1Hth diagram is a schematic plan view of the solar cell, the inverter unit, and the dielectric layer according to the 1Gth diagram.

Fig. 2A is a schematic cross-sectional view showing the step 402 of the solar photovoltaic module of the second embodiment of the present invention.

Figure 2B is a schematic cross-sectional view showing the step 404 of the solar photovoltaic module of the second embodiment of the present invention.

2C is a schematic cross-sectional view of the solar photovoltaic module step 406 of the second embodiment of the present invention.

2D is a schematic cross-sectional view of a solar photovoltaic module step 408 of the second embodiment of the present invention.

2E is a schematic cross-sectional view showing the step 410 of the solar photovoltaic module of the second embodiment of the present invention.

2F is a schematic cross-sectional view of the solar photovoltaic module step 412 of the second embodiment of the present invention.

The 2Gth diagram is a schematic plan view of the solar cell, the inverter unit, and the dielectric layer according to the 2Hth diagram.

Fig. 3A is a schematic cross-sectional view showing the step 502 of the solar photovoltaic module of the third embodiment of the present invention.

Fig. 3B is a schematic cross-sectional view showing the step 504 of the solar photovoltaic module of the third embodiment of the present invention.

Figure 3C is a schematic cross-sectional view showing the step 506 of the solar photovoltaic module of the third embodiment of the present invention.

The 3D figure is a schematic cross-sectional view of the solar photovoltaic module step 508 of the third embodiment of the present invention.

Fig. 3E is a schematic cross-sectional view showing the step 510 of the solar photovoltaic module of the third embodiment of the present invention.

Figure 3F is a schematic cross-sectional view showing the step 512 of the solar photovoltaic module of the third embodiment of the present invention.

The 3G figure is a schematic cross-sectional view of the solar photovoltaic module step 514 of the third embodiment of the present invention.

The 3H figure is the solar cell unit, the inverter unit and the medium according to the 3G figure. Schematic diagram of the top view of the electrical layer.

30, 32‧‧‧ first hole

34‧‧‧Electroplating

35‧‧‧ second surface

36‧‧‧ first surface

60‧‧‧Glossy surface

62‧‧‧ Backlit surface

70,72‧‧‧ solder pads

80‧‧‧First dielectric layer

82‧‧‧Second dielectric layer

90‧‧‧Light

92‧‧‧P type semiconductor doped layer

93, 95‧‧‧ first electrode

96‧‧‧ diode

98‧‧‧Programmable switch

100‧‧‧Solar Photoelectric Module

102‧‧‧ light board

104‧‧‧Solar battery unit

106‧‧‧Inverter unit

108‧‧‧ dielectric layer

110‧‧‧Backlight board

112‧‧‧Encapsulation layer

Claims (11)

A solar photovoltaic module for receiving a light, comprising: a light receiving plate for receiving the light; a solar battery unit comprising a light receiving surface and a backlight surface opposite to each other, the light receiving surface being disposed on the light receiving plate An inverter unit electrically connected to the solar cell unit; a dielectric layer covering the inverter unit and disposed on the backlight surface; a backlight board; and an encapsulation layer covering the dielectric layer and the The solar cell unit is disposed between the light receiving plate and the backlight plate. The solar photovoltaic module of claim 1, wherein the dielectric layer comprises a first dielectric layer and a second dielectric layer, the first dielectric layer is disposed on the backlight surface, and the second dielectric layer covers the Inverter unit. The solar photovoltaic module of claim 1, wherein the inverter unit comprises a diode and a programmable switch, and the diode is electrically connected to the programmable switch. The solar photovoltaic module of claim 3, wherein the solar photovoltaic module further comprises a four-pad, the four pads are disposed on a first dielectric layer and electrically connected to the solar cell by wire bonding, respectively The diode is soldered to the second pad of the four pads, and the programmable switch is soldered to the other two pads of the four pads. The solar photovoltaic module of claim 4, wherein the solar photovoltaic module further comprises a plating layer and a second dielectric layer disposed on the backlight surface, wherein the second dielectric layer comprises two first holes, the plating The layer is disposed on the second dielectric layer and the first holes and electrically connected to the diode and the programmable switch by the first holes. The solar photovoltaic module of claim 3, wherein the solar photovoltaic module further comprises a fourth conductive layer, the first dielectric layer comprising four second holes, wherein the conductive layers are disposed in the second holes and by the The second holes are electrically connected to the solar cell, the diodes are disposed on the two conductive layers of the four conductive layers to electrically connect the solar cells, and the programmable switch is disposed on the other of the four conductive layers. The solar cell unit is electrically connected to the layer. The solar photovoltaic module of claim 6, wherein the diode is electrically connected to the programmable switch in a wire bonding manner. The solar photovoltaic module of claim 1, wherein the encapsulation layer comprises a first polymer layer and a second polymer layer, wherein the first polymer layer is disposed between the light-receiving plate and the solar cell unit. The second polymer layer coats the second dielectric layer and the solar cell. A solar photovoltaic module manufacturing method includes: forming a first dielectric layer on a backlight surface of a solar cell; arranging four pads on the first medium; soldering a diode of the inverter unit to the a solder pad of the four pads and a programmable switch for soldering the inverter unit are electrically connected to the other pads of the four pads, and electrically connected to the solar cells by wire bonding; a dielectric layer is formed on the first dielectric layer; a second hole is formed on the second dielectric layer, and a plating layer is formed on the second dielectric layer and the first holes by electroplating, so that the plating layer is The first holes are electrically connected to the diode and the programmable switch; pressing an encapsulation layer on the second dielectric layer and the solar cell unit, so that The encapsulation layer covers the second dielectric layer and the solar cell unit; and presses a light-receiving plate and a backlight plate on a first surface and a second surface of the encapsulation layer, wherein the first surface faces the second surface surface. A solar photovoltaic module manufacturing method includes: forming a first dielectric layer on a backlight surface of a solar cell; forming four second holes on the first dielectric layer, and printing four conductive layers on the fourth The two holes are electrically connected to the solar cell by the four second holes; a diode of an inverter unit is disposed on the two conductive layers of the four conductive layers and the inverter unit is disposed a programmable switch is connected to the other two conductive layers of the four conductive layers, and electrically connected to the diode and the programmable switch by wire bonding; pressing a second dielectric layer on the first dielectric layer; pressing one Encapsulating the second dielectric layer and the solar cell unit such that the encapsulation layer encapsulates the second dielectric layer and the solar cell unit; and pressing a light-receiving plate and a backlight plate to the first of the encapsulation layer The surface and a second surface, wherein the first surface faces the second surface. A method for manufacturing a solar photovoltaic module, comprising: providing a primary module, wherein the secondary module comprises a solar battery unit, a light receiving plate and a first polymer layer, wherein the first polymer layer is disposed in the solar battery unit Forming a first dielectric layer on a backlight surface of the solar cell unit; forming four second holes on the first dielectric layer, and screen printing four conductive layers on the second holes, so that The four conductive layers are electrically connected to the second holes respectively. a solar cell unit; a diode of the inverting unit is disposed on the two conductive layers of the four conductive layers and a programmable switch of the inverter unit is disposed on the other two conductive layers of the four conductive layers, and is wired The method is electrically connected to the diode and the programmable switch; press-bonding a second dielectric layer to the first dielectric layer; and pressing a second polymer layer on the first polymer layer and the solar cell to The first polymer layer and the second polymer layer are coated with the second dielectric layer and the solar cell; and a backlight is pressed against a third surface of the second polymer layer.