TWI438162B - 強化玻璃切割方法及強化玻璃切割預置結構 - Google Patents
強化玻璃切割方法及強化玻璃切割預置結構 Download PDFInfo
- Publication number
- TWI438162B TWI438162B TW099132711A TW99132711A TWI438162B TW I438162 B TWI438162 B TW I438162B TW 099132711 A TW099132711 A TW 099132711A TW 99132711 A TW99132711 A TW 99132711A TW I438162 B TWI438162 B TW I438162B
- Authority
- TW
- Taiwan
- Prior art keywords
- glass substrate
- stress layer
- compressive stress
- tempered glass
- cutting
- Prior art date
Links
- 239000011521 glass Substances 0.000 title claims description 52
- 238000000034 method Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 claims description 50
- 239000005341 toughened glass Substances 0.000 claims description 39
- 238000005728 strengthening Methods 0.000 claims description 21
- 238000005342 ion exchange Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 4
- 238000005496 tempering Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 37
- 239000000126 substance Substances 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 2
- 229910001414 potassium ion Inorganic materials 0.000 description 2
- 229910001415 sodium ion Inorganic materials 0.000 description 2
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/241—Methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
- C03C21/001—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions
- C03C21/002—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions to perform ion-exchange between alkali ions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/2457—Parallel ribs and/or grooves
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Surface Treatment Of Glass (AREA)
Description
本發明關於一種強化玻璃切割方法及強化玻璃切割預置結構。
習知的玻璃強化方式主要有兩種,一種是熱強化方式,另一種是化學離子強化方式。舉例而言,於一化學離子強化過程中,待強化的玻璃基材例如可置入熔融的鉀鹽中,使鉀離子與玻璃表層的鈉離子進行離子交換,而使玻璃基材表層形成一層很薄的壓應力層。如圖1A及圖1B所示,對應壓應力層DOL,強化玻璃100內部會衍生出適當的張應力TS使整體達到力平衡。比較圖1A及圖1B可知,當壓應力層DOL越厚(圖1B的壓力層厚度大於圖1A的壓力層厚度),強化玻璃100的強度就越強,但其內部的張應力TS就越大。因此,當張應力TS過大時,會使強化玻璃100在切割時容易不規則地裂開,導致一極低的切割良率。
本發明提供一種可大幅提高切割良率的強化玻璃切割方法及強化玻璃切割預置結構。
依本發明一實施例之設計,一種強化玻璃切割方法包含如下步驟:將一玻璃基材進行強化處理,使玻璃基材由其表面往內部依序形成對應的至少一壓應力層及一張應力層;移除一預定切割路徑會行經的部分壓應力層;及沿該預定切割路徑切割玻璃基材。
依本發明另一實施例之設計,一種強化玻璃切割方法包含如下步驟:將一玻璃基材進行離子交換強化處理,使玻璃基材由其表面往內部依序形成對應的至少一壓應力層及一張應力層;依據一預定切割路徑於玻璃基材的壓應力層形成至少一溝槽;及沿溝槽切割玻璃基材。
依本發明另一實施例之設計,一種強化玻璃切割預置結構包含一經強化處理之玻璃基材及至少一溝槽。玻璃基材由其表面往內部依序形成對應的至少一壓應力層及一張應力層,且溝槽形成於玻璃基材的壓應力層且重合一預定切割路徑。
藉由上述各個實施例之設計,將預定切割路徑行經的部分壓應力層去除後,對應移除部分的內部張應力將會降低,如此切割時即可形成切口平整且符合所需尺寸的強化玻璃區塊,大幅提高切割良率。另一方面,因切割路徑外的壓應力層並未被移除,故玻璃基材整體仍保有原先的強化效果。
本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉實施例並配合所附圖式,作詳細說明如下。
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本發明。
如圖2所示,依發明一實施例的強化玻璃10係先經由強化處理強化一玻璃基材12。舉例而言,該強化處理例如可為一化學離子強化處理。於化學離子強化處理過程中,可將待強化的玻璃基材12置入熔融的鉀鹽中,使鉀離子與玻璃基材12表層的鈉離子進行離子交換,如此可使玻璃基材12表層形成一層壓應力層DOL,並使玻璃基材12內部衍生出適當的張應力TS以使整體達到力平衡。換言之,經由上述的強化處理過程,玻璃基材12可由其表面往內部依序形成對應的一壓應力層DOL及一張應力層TOL。當壓應力層DOL越厚,強化玻璃10表現出來的強度越強,但其內部的張應力TS就越大,該些應力與厚度關係可符合如下關係式:TS=CS*Dc/(D-2*Dc),其中TS為張應力且CS為壓應力,Dc為壓應力層厚度且D為強化玻璃10整體厚度。
當對強化玻璃10進行切割時,適當的切割深度一定會超過壓應力層DOL,亦即切割裂痕的尖端將深入到玻璃基材12內部的張應力層TOL。當張應力TS過大時,會使切割裂痕的尖端處如圖2所示因張應力TS的拉扯直接裂開,該裂開方式通常不規則,導致無法切割出所需的尺寸。因此,若能降低切割處玻璃基材12內部的張應力TS,就可避免此一問題。由於強化玻璃10內部之張應力TS,是因壓應力層DOL所衍生,所以如圖3及圖4所示,先以化學蝕刻或研磨等方式將預定切割路徑行經的部分壓應力層DOL去除,則對應移除部分的內部張應力將會降低,如此切割時即可形成切口平整且符合所需尺寸的強化玻璃區塊,大幅提高切割良率。另一方面,因切割路徑外的壓應力層DOL並未被移除,故玻璃基材12整體仍保有原先的強化效果。當然,上述蝕刻或研磨的基材移除方式僅為例示而完全不限定。
再者,玻璃基材12進行強化處理的區域並不限定。舉例而言,如圖3所示,因為玻璃基材12的底面12a及頂面12b都進行強化處理,所以底面12a及頂面12b都進行移除切割路徑行經的部分壓應力層DOL。當然,壓應力層DOL移除區域的範圍、深度並不限定,僅須為對應切割路徑所需的一適當範圍及深度,達到避免切割時不規則碎裂的效果即可。另外,玻璃基材12的材質並不限定,例如鈉鈣矽酸鹽玻璃、鋁矽酸鹽玻璃等材質均可。再者,雖然上述以化學離子交換處理為例說明強化處理過程,但其並不限定,任何可於玻璃基材12上產生壓應力與張應力的強化處理過程,均適用於本發明的各個實施例。
圖5A為顯示一強化玻璃切割預置結構的示意圖,圖5B顯示切割後的多個強化玻璃區塊。如圖5A所示,經離子交換強化處理或其它強化處理的玻璃基材12,其表面往內部依序形成對應的一壓應力層及一張應力層,且至少一溝槽V(圖5A例示為多道)以蝕刻或研磨等方式對應形成於玻璃基材12的底面12a及頂面12b。溝槽V與一預定切割路徑重合,且溝槽V的深度可略大於壓應力層的厚度較佳。如圖5B所示,當沿溝槽V切割強化玻璃時,可形成切口平整且符合所需尺寸的強化玻璃區塊14。
再者,上述各個實施例之強化玻璃的用途完全不限定,舉例而言,可將該強化玻璃作為一觸控面板(touch panel)的蓋板(cover glass)或玻璃基板,或者作為液晶顯示器、有機發光二極體顯示器、電濕潤顯示器、雙穩態顯示器等顯示裝置的玻璃基板。
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。另外本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本發明之權利範圍。
10、100...強化玻璃
12...玻璃基材
14...強化玻璃區塊
12a...玻璃基材底面
12b...玻璃基材頂面
CS...壓應力
TS...張應力
DOL...壓應力層
TOL...張應力層
D...強化玻璃厚度
Dc...壓應力層厚度
V...溝槽
圖1A及圖1B為一習知化學離子強化玻璃的示意圖。
圖2至圖4為說明依本發明一實施例的強化玻璃切割方法的示意圖。
圖5A為顯示一強化玻璃切割預置結構的示意圖,圖5B顯示切割後的多個強化玻璃區塊。
10...強化玻璃
12...玻璃基材
12a...玻璃基材底面
12b...玻璃基材頂面
CS...壓應力
TS...張應力
DOL...壓應力層
TOL...張應力層
Claims (9)
- 一種強化玻璃切割方法,包含如下步驟:將一玻璃基材進行強化處理,其中該玻璃基材具有相對的一底面及一頂面,使該玻璃基材由該頂面及該底面往內部形成對應的一第一、一第二壓應力層及一張應力層;移除一預定切割路徑會行經的該頂面的部分該第一壓應力層以及該底面的部分該第二壓應力層;及沿該預定切割路徑並經由該玻璃基材其對應被移除的該部分壓應力層的位置處切割該玻璃基材。
- 如請求項1所述之強化玻璃切割方法,其中該強化處理係為離子交換強化處理。
- 如請求項1所述之強化玻璃切割方法,其中部分該壓應力層係以蝕刻或研磨方式移除。
- 一種強化玻璃切割方法,包含如下步驟:將一玻璃基材進行離子交換強化處理,其中該玻璃基材具有相對的一底面及一頂面,使該玻璃基材由該頂面及該底面往內部形成對應的一第一、一第二壓應力層及一張應力層;依據一預定切割路徑於該玻璃基材的該頂面的部分該第一壓應力層形成一第一溝槽及該底面的部分該第二壓應力層形成一第二溝槽;及 沿該第一溝槽或該第二溝槽切割該玻璃基材。
- 如請求項4所述之強化玻璃切割方法,其中該第一及該第二溝槽的深度實質上大於該壓應力層的厚度。
- 一種強化玻璃切割預置結構,包含:一經強化處理之玻璃基材,該玻璃基材具有相對的一底面及一頂面,且該玻璃基材由該頂面及該底面往內部形成對應的一第一、一第二壓應力層及一張應力層;一第一溝槽,形成於該玻璃基材的該頂面的部分該第一壓應力層且重合一預定切割路徑;及一第二溝槽,形成於該玻璃基材的該底面的部分該第二壓應力層且重合該預定切割路徑。
- 如請求項6所述之強化玻璃切割預置結構,其中該溝槽的深度實質上大於該壓應力層的厚度。
- 如請求項6所述之強化玻璃切割預置結構,其中該強化處理係為離子交換強化處理。
- 如請求項6所述之強化玻璃切割預置結構,其中該溝槽係以蝕刻或研磨方式形成。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099132711A TWI438162B (zh) | 2010-01-27 | 2010-09-28 | 強化玻璃切割方法及強化玻璃切割預置結構 |
US13/013,415 US8852721B2 (en) | 2010-01-27 | 2011-01-25 | Method for cutting tempered glass and preparatory tempered glass structure |
US14/476,100 US20140366580A1 (en) | 2010-01-27 | 2014-09-03 | Method for cutting tempered glass |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99102208 | 2010-01-27 | ||
TW099132711A TWI438162B (zh) | 2010-01-27 | 2010-09-28 | 強化玻璃切割方法及強化玻璃切割預置結構 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201127763A TW201127763A (en) | 2011-08-16 |
TWI438162B true TWI438162B (zh) | 2014-05-21 |
Family
ID=44309169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099132711A TWI438162B (zh) | 2010-01-27 | 2010-09-28 | 強化玻璃切割方法及強化玻璃切割預置結構 |
Country Status (2)
Country | Link |
---|---|
US (2) | US8852721B2 (zh) |
TW (1) | TWI438162B (zh) |
Families Citing this family (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101040789B1 (ko) * | 2009-01-16 | 2011-06-13 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 및 그 제조방법 |
TWI494284B (zh) | 2010-03-19 | 2015-08-01 | Corning Inc | 強化玻璃之機械劃割及分離 |
US8864005B2 (en) | 2010-07-16 | 2014-10-21 | Corning Incorporated | Methods for scribing and separating strengthened glass substrates |
WO2012070819A2 (ko) * | 2010-11-25 | 2012-05-31 | 주식회사 옵솔 | 터치 패널용 강화 유리판 및 이를 이용한 터치 패널용 강화 유리판 제조 방법 |
TWI474981B (zh) * | 2011-10-06 | 2015-03-01 | Taiwan Mitsuboshi Diamond Ind Co Ltd | 伴隨表面壓縮應力控制,切割一強化玻璃基板之方法 |
JP4932059B1 (ja) * | 2011-12-16 | 2012-05-16 | 株式会社ミクロ技術研究所 | 強化ガラス、タッチパネル、及び強化ガラスの製造方法 |
KR20140138134A (ko) | 2012-02-28 | 2014-12-03 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 강화 유리를 분리하는 방법과 장치 및 이에 의해 제조된 물품 |
US10357850B2 (en) | 2012-09-24 | 2019-07-23 | Electro Scientific Industries, Inc. | Method and apparatus for machining a workpiece |
US9828278B2 (en) * | 2012-02-28 | 2017-11-28 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
TWI474982B (zh) * | 2012-04-27 | 2015-03-01 | Taiwan Mitsuboshi Diamond Ind Co Ltd | 用於一強化玻璃基板之加工方法及切割設備 |
US10351460B2 (en) * | 2012-05-22 | 2019-07-16 | Corning Incorporated | Methods of separating strengthened glass sheets by mechanical scribing |
KR101681931B1 (ko) * | 2012-06-12 | 2016-12-02 | 코닝정밀소재 주식회사 | 강화유리 커팅 방법 및 커팅 장치 |
JP2014084266A (ja) * | 2012-10-26 | 2014-05-12 | Dainippon Printing Co Ltd | パターン付きガラス基板の製造方法およびパターン付きマザーガラス基板の切断方法。 |
WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US9154138B2 (en) | 2013-10-11 | 2015-10-06 | Palo Alto Research Center Incorporated | Stressed substrates for transient electronic systems |
US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
EP3166895B1 (en) | 2014-07-08 | 2021-11-24 | Corning Incorporated | Methods and apparatuses for laser processing materials |
EP3536440A1 (en) | 2014-07-14 | 2019-09-11 | Corning Incorporated | Glass article with a defect pattern |
WO2016010991A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
EP3169477B1 (en) * | 2014-07-14 | 2020-01-29 | Corning Incorporated | System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter |
US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
FR3024137B1 (fr) * | 2014-07-24 | 2016-07-29 | Saint Gobain | Procede de fabrication de feuilles de verre de forme complexe |
CN107001103B (zh) * | 2014-11-25 | 2019-09-27 | 三星钻石工业股份有限公司 | 脆性衬底的分断方法 |
US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
EP3245166B1 (en) | 2015-01-12 | 2020-05-27 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
CN107922237B (zh) | 2015-03-24 | 2022-04-01 | 康宁股份有限公司 | 显示器玻璃组合物的激光切割和加工 |
CN107666983B (zh) | 2015-03-27 | 2020-10-02 | 康宁股份有限公司 | 可透气窗及其制造方法 |
US9780044B2 (en) | 2015-04-23 | 2017-10-03 | Palo Alto Research Center Incorporated | Transient electronic device with ion-exchanged glass treated interposer |
KR102499697B1 (ko) | 2015-07-10 | 2023-02-14 | 코닝 인코포레이티드 | 유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품 |
KR102368462B1 (ko) | 2015-08-07 | 2022-03-02 | 삼성디스플레이 주식회사 | 강화 유리의 제조 방법 및 표시 장치의 제조 방법 |
US10043903B2 (en) | 2015-12-21 | 2018-08-07 | Samsung Electronics Co., Ltd. | Semiconductor devices with source/drain stress liner |
US10012250B2 (en) | 2016-04-06 | 2018-07-03 | Palo Alto Research Center Incorporated | Stress-engineered frangible structures |
EP3452418B1 (en) | 2016-05-06 | 2022-03-02 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
US10224297B2 (en) | 2016-07-26 | 2019-03-05 | Palo Alto Research Center Incorporated | Sensor and heater for stimulus-initiated fracture of a substrate |
US10026579B2 (en) | 2016-07-26 | 2018-07-17 | Palo Alto Research Center Incorporated | Self-limiting electrical triggering for initiating fracture of frangible glass |
JP7090594B2 (ja) | 2016-07-29 | 2022-06-24 | コーニング インコーポレイテッド | レーザ加工するための装置および方法 |
KR102423775B1 (ko) | 2016-08-30 | 2022-07-22 | 코닝 인코포레이티드 | 투명 재료의 레이저 가공 |
CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
US10903173B2 (en) | 2016-10-20 | 2021-01-26 | Palo Alto Research Center Incorporated | Pre-conditioned substrate |
JP7066701B2 (ja) | 2016-10-24 | 2022-05-13 | コーニング インコーポレイテッド | シート状ガラス基体のレーザに基づく加工のための基体処理ステーション |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
US10026651B1 (en) * | 2017-06-21 | 2018-07-17 | Palo Alto Research Center Incorporated | Singulation of ion-exchanged substrates |
US10626048B2 (en) | 2017-12-18 | 2020-04-21 | Palo Alto Research Center Incorporated | Dissolvable sealant for masking glass in high temperature ion exchange baths |
US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
US10717669B2 (en) | 2018-05-16 | 2020-07-21 | Palo Alto Research Center Incorporated | Apparatus and method for creating crack initiation sites in a self-fracturing frangible member |
US11107645B2 (en) | 2018-11-29 | 2021-08-31 | Palo Alto Research Center Incorporated | Functionality change based on stress-engineered components |
US10947150B2 (en) | 2018-12-03 | 2021-03-16 | Palo Alto Research Center Incorporated | Decoy security based on stress-engineered substrates |
US10969205B2 (en) | 2019-05-03 | 2021-04-06 | Palo Alto Research Center Incorporated | Electrically-activated pressure vessels for fracturing frangible structures |
US12013043B2 (en) | 2020-12-21 | 2024-06-18 | Xerox Corporation | Triggerable mechanisms and fragment containment arrangements for self-destructing frangible structures and sealed vessels |
US11904986B2 (en) | 2020-12-21 | 2024-02-20 | Xerox Corporation | Mechanical triggers and triggering methods for self-destructing frangible structures and sealed vessels |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4702042A (en) * | 1984-09-27 | 1987-10-27 | Libbey-Owens-Ford Co. | Cutting strengthened glass |
AU2001261402A1 (en) * | 2000-05-11 | 2001-11-20 | Ptg Precision Technology Center Limited Llc | System for cutting brittle materials |
JP3965902B2 (ja) * | 2000-05-23 | 2007-08-29 | 株式会社日立製作所 | 液晶表示装置の製造方法 |
FR2839508B1 (fr) * | 2002-05-07 | 2005-03-04 | Saint Gobain | Vitrage decoupe sans rompage |
JP2004168584A (ja) | 2002-11-19 | 2004-06-17 | Thk Co Ltd | ガラス基板材の切断方法 |
JP2005019667A (ja) * | 2003-06-26 | 2005-01-20 | Disco Abrasive Syst Ltd | レーザ光線を利用した半導体ウエーハの分割方法 |
DE102004014277A1 (de) * | 2004-03-22 | 2005-10-20 | Fraunhofer Ges Forschung | Verfahren zum laserthermischen Trennen von Flachgläsern |
US7618895B2 (en) | 2004-12-06 | 2009-11-17 | Asahi Glass Company, Limited | Method for etching doughnut-type glass substrates |
TWI487682B (zh) | 2007-03-02 | 2015-06-11 | Nippon Electric Glass Co | 強化板玻璃及其製造方法 |
KR101040789B1 (ko) | 2009-01-16 | 2011-06-13 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 및 그 제조방법 |
-
2010
- 2010-09-28 TW TW099132711A patent/TWI438162B/zh not_active IP Right Cessation
-
2011
- 2011-01-25 US US13/013,415 patent/US8852721B2/en not_active Expired - Fee Related
-
2014
- 2014-09-03 US US14/476,100 patent/US20140366580A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20140366580A1 (en) | 2014-12-18 |
US20110183116A1 (en) | 2011-07-28 |
US8852721B2 (en) | 2014-10-07 |
TW201127763A (en) | 2011-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI438162B (zh) | 強化玻璃切割方法及強化玻璃切割預置結構 | |
TWI402228B (zh) | 強化玻璃切割方法、強化玻璃薄膜製程、強化玻璃切割預置結構及強化玻璃切割件 | |
TWI515174B (zh) | 強化玻璃之切割方法及切割平台 | |
TWI466835B (zh) | 劃線及分離強化玻璃基板之方法 | |
US20130288010A1 (en) | Strengthened glass article having shaped edge and method of making | |
US10669194B2 (en) | Glass strengthening by ion exchange and lamination | |
US20130122260A1 (en) | Glass substrate having a patterned layer of compressive stress on a surface thereof | |
JP2006509701A (ja) | 破断する必要がないガラス切断方法 | |
TW201040118A (en) | Method of separating strengthened glass | |
US8110279B2 (en) | Method for improving the edge strength of tempered glass sheet articles | |
TW201132607A (en) | Glass sheet article with double-tapered asymmetric edge | |
JP6025156B2 (ja) | 電子機器用カバーガラスのガラス基板及び電子機器用カバーガラス、並びに電子機器用カバーガラスのガラス基板の製造方法 | |
CN102442764A (zh) | 强化玻璃切割方法及强化玻璃切割预置结构 | |
CN104843977A (zh) | 触控面板强化玻璃改料再加工的方法 | |
WO2014167910A1 (ja) | 化学強化ガラス板 | |
CN102452789A (zh) | 强化玻璃切割方法、薄膜制程、切割预置结构及切割件 | |
JP2006182644A5 (ja) | ガラス板 | |
JP2015093822A (ja) | 強化ガラスと強化ガラスの面取り面の形成方法。 | |
JP5971474B2 (ja) | 化学強化ガラスの割断方法 | |
CN201654384U (zh) | 显示面板 | |
KR102056360B1 (ko) | 강화 유리 및 그 제조 방법 | |
KR20130037014A (ko) | 터치 스크린 및 터치 스크린 제작 방법 | |
JP2015013780A (ja) | 強化ガラスの製造方法及び該方法によって製造された強化ガラス | |
JP2015174777A (ja) | 強化ガラス基板 | |
TW201425243A (zh) | 大面積強化玻璃基材的切割方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |