TWI433619B - Electronic component mounter - Google Patents

Description

Device for assembling electronic components

The present invention relates to an apparatus for assembling an electronic component, for example, an apparatus for assembling an electronic component for mounting a semiconductor device on a display panel such as a liquid crystal panel.

In the LCD industry, its market is expanding from PC to monitor in recent years. Along with this situation, the size of the liquid crystal panel (substrate) is also increased, and the price is required to be reduced.

A display panel such as a liquid crystal panel is mounted on an edge of a glass substrate for driving electronic components (for example, TAB (Tape Automated Bonding), COG (Chip on Glass), and TCP (Tape Carrier). Package; tape carrier package), or FPC (Flexible Printed Circuit). The device for assembling the electronic component of the display panel is an ACF adhesive portion of an anisotropic conductive film (ACF: Adhesive Conductive Film) adhered to the edge of the glass substrate; and the anisotropic conductive film is interposed An electronic component mounting portion that mounts an electronic component for temporary pressure bonding, and an operating mechanism portion such as an electronic component crimping portion that thermally presses heat and load by applying an electronic component and an anisotropic conductive film in a temporarily bonded state.

An apparatus for assembling electronic components for such display panel assembly generally targets a plurality of types of substrates ranging in size from small to large. There are many general-purpose types, and the arrangement of the above-described working mechanism portion or the movement path of the substrate holding platform is set based on a substrate having a predetermined maximum size.

On the other hand, the electronic component temporary crimping portion in the mounting device of the liquid crystal module is assembled by using a fixed rotary head in which a mounting head such as a TAB or a COG is mounted in equal parts (for example, refer to Japanese Patent Laid-Open No. 2006-202877). Bulletin).

Therefore, as the size of the liquid crystal panel increases, the space size of the temporary crimping portion of the electronic component is also set based on the substrate having the predetermined maximum size, and is gradually increased in size.

Fig. 9 shows a stationary rotary head used for the above-described electronic component temporary crimping portion. The liquid crystal panel (substrate) is required to be transported at a pitch of the substrate 106 to be mounted and transported to a specific position of the stationary rotary head 104 (a position at which the alignment correction movement can be carried).

For this reason, (1) the processing speed of the device depends on the mounting capability of the rotary head.

(2) The necessary area of the device must be more than twice the maximum substrate size of the object to be the device. In other words, when the electronic component is mounted in parallel on the long side of the substrate, since the rotary head is fixed, it is necessary to move the substrate. In the ninth figure, when the length of the long side of the substrate is tentatively set to L, the substrate 106 is required to have a distance of L from the left direction of the ninth drawing to the right direction, and the necessary area of the device must be 2 L or more.

(3) Further, a plurality of fixings are arranged on one side of the substrate 106. In the case of the rotary head 104, there is a problem that the mounting pitch cannot be changed.

Therefore, the object of the present invention is to provide an electronic component mounting device (temporary pressure bonding device) capable of improving the processing capability of the device while maintaining the necessary operation time, and to provide an electronic device capable of processing with a minimum space. Further, an apparatus for assembling an electronic component that can be selected in accordance with the selection of a target head for mounting work is provided.

In order to achieve the above object, the present invention is directed to an apparatus for assembling an electronic component in which an electronic component is mounted at a specific portion of a panel, comprising: an electronic component supply portion that provides a plurality of electronic components mounted on the panel; and the positioning is provided by the electronic component supply portion The electronic component to be mounted is mounted on the electronic component mounting portion of the panel; and the electronic component is taken out from the electronic component supply unit and transferred to the transfer portion of the electronic component mounting portion, and the panel is configured to arrange the electronic component The base of the mounting portion is positioned and fixed, and the electronic component mounting portion has a plurality of mounting heads that are movable in parallel with respect to the processing side on the panel to which the electronic component is to be mounted.

In other words, the unit configuration of the temporary crimping portion is divided into an electronic component supply unit, an electronic component transfer unit, and an electronic component mounting unit. Further, in the mounting portion, by moving a plurality of mounting heads in parallel with the processing of the panel (substrate), it is possible to shorten the processing time and save space.

According to the present invention, it is possible to enhance the processing capability as a device while maintaining the necessary operation time.

It is also possible to process with a minimum space. Furthermore, it is possible to achieve The selection of the head of the work is carried out.

Hereinafter, embodiments of the present invention will be described based on the drawings.

[Example 1]

First, an assembly state of an electronic component (for example, COF (Chip on Film) or the like) of a panel (for example, a liquid crystal display panel) 1 is shown in FIG. In the same figure, each of the long side and the short side of the lower substrate of the panel 1 is pulled out from the upper substrate, and the plurality of electrons are assembled on the long side protrusion 1a and the short side protrusion 1b of the lower substrate. Element 2.

Wherein, the electronic component 2 is any one of COF or TAB, TCP, and FPC, and the electronic component 2 is electrically connected to the protrusion 1a or 1b of the substrate under the panel 1 by using an ACF (anisotropic conductive film). The electrode is assembled to the electrode on the side of the electronic component 2. The ACF (not shown) is formed by uniformly dispersing conductive particles in a binder resin, and forms an electrode on the side of the electronic component 2 and the electrode on the panel 1 side via the conductive particles. Further, the binder resin is composed of a thermosetting adhesive, and the panel 1 is pressurized under the heating electronic component 2 to form a thermocompression bonding. However, in the assembly process, the electronic component 2 is positioned in a state in which the panel 1 of the ACF is preliminarily bonded, and after being temporarily crimped, it is heated to a temperature higher than the hardening temperature of the binder resin. The action is applied to form a fixed crimp.

As shown above, the electronic component 2 is mounted on the panel 1 by an ACF bonding process in which the ACF is first adhered to a specific position of the panel 1; the electronic component 2 is assembled, and a temporary crimping process is performed for temporary crimping; and a fixed crimping process is constructed. . Further, in order to transport the panel 1 in each of these projects, the panel 1 is transported by a panel transport means (not shown).

The apparatus for assembling an electronic component according to the present invention is a person who performs the temporary crimping work.

First, a perspective view of the apparatus 200 for mounting electronic components described in the present embodiment is shown in Fig. 2, and a plan view thereof is shown in Fig. 3.

As shown in FIG. 2, the main configuration of the device 200 for mounting an electronic component includes: taking an electronic component (here, an electronic component mounted on the COF as an example) The electronic component supply unit 4; the electronic component mounting portions 7a and 7b that temporarily press the electronic components on the panel 1; and the electronic component transfer units 6a and 6b that carry the electronic components to the mounting head.

In addition, the details of each component will be described using FIG. Here, the members are arranged in a left-right direction. For example, the COF reels 3a and 3b or the pull-up models 5a and 5b are arranged in a left-right direction, and the apparatus is stopped in order to prevent the COF reel from being exchanged. Therefore, in the following description, the description will be centered on the portion shown on the right side of the drawing (the attached word a of the symbol).

The electronic component supply unit 4 includes a COF reel 3a that winds a COF on which a plurality of electronic components 15 are mounted on a ribbon, and a pull-up model 5a for punching out the electronic components on the ribbon; Electronics The straight-line electronic component extractor 11 that transports the component to the specific position; the electronic component transport mechanism (X direction) 13 that moves the straight-line electronic component extractor in the X direction, and the electronic component transport mechanism that moves in the Y direction (Y Direction) 14.

Moreover, the electronic components to be taken out are sequentially arranged in a specific number (in the case where 16 are displayed here), and the electronic component collecting tray 16 for collecting is provided in the vicinity of the electronic component supply unit 4.

Further, the electronic component collecting tray 16 is fixed by an adsorption function.

The electronic component transfer unit 6a includes an electronic component pickup 17a including a suction head for taking out one of the electronic components 15 arranged in the electronic component collection tray 16 one by one, and an adhesive surface of the electronic component 15 On the other hand, the side surface is reversed, and the electronic component is moved and placed on the transfer unit main body 18a of the electronic component mounting portion 7a.

The transfer unit main body 18a moves on the electronic component transfer portion shaft 19 in the X direction parallel to the processing side of the panel 1 on which the electronic component is mounted, in response to the position of the electronic component mounting portion 7a.

The electronic component mounting portion 7a is a mounting head 9 for temporarily pressing the electronic component 15 and mounting it on the processing side of the panel 1 (for example, 1a shown in FIG. 1); and the mounting head 9 is provided for The mounting slider 8a is moved in a specific direction.

The mounting slider 8a is provided with a mechanism that can move in the X direction on the mounting shaft 20 for the slider.

Further, the electronic component mounting portion 7a is provided to detect that each is disposed at The electronic component 15 and the electronic component of the alignment mark for detecting the position of the panel 1 and the panel alignment camera 10a.

Next, the operation of each component will be described.

First, in order to take out a plurality of electronic components formed on the COF reel, the pull-up type mold 5a is raised, and on the other hand, the straight-line type component extractor 11 is lowered. The straight-line component extractor 11 receives the pulled-out electronic component and starts to rise. Thereafter, the electronic component transport mechanism (X direction) 13 and the electronic component transport mechanism (Y direction) 14 are moved to a specific position, the electronic component 15 is transported to the electronic component collecting tray 16, and the electronic component 15 is sequentially arranged at a specific position.

In Fig. 3, 16 electronic components are arranged in the electronic component collecting tray 16. In addition, the number of the electronic components shown in the peripheral portion of the panel which is the object of the present device is usually 16 in the maximum.

Next, the electronic component pick-up unit 17a picks up one of the electronic components arranged in the electronic component collecting tray 16 and picks up it. The arm portion supporting the electronic component pickup is rotated 180, the surface of the electronic component 15 is reversed, and the electronic component 15 is transferred to the electronic component mounting portion 7a. Further, by rotating the arm portion by 180 degrees, the electrode of the electronic component 15 is opposed to the electrode on the panel side, and the electronic component 15 is turned over so as to be press-contactable with each other.

The electronic component transfer unit 6a including the electronic component pickup is moved to an appropriate position on the electronic component transfer portion shaft 19 so that the electronic component 15 is transmitted to the electronic component mounting portion 7a.

Further, the control of the positional relationship between the electronic component transfer unit 6a and the electronic component mounting portion 7a is performed by a control device (not shown).

The electronic component mounting portion 7a that receives the electronic component 15 moves the electronic component 15 to a predetermined region in which the peripheral portion (processing side) of the panel 1 of the electronic component 15 is temporarily crimped. This movement is performed by moving the mounting slider 8a on the electronic component mounting portion shaft 20. The electronic component mounting portion 7a moves in parallel with respect to the processing of the panel 1.

The assembly of the electronic component 15 to the panel 1 must be carried out in a properly positioned state. In other words, it is necessary to perform temporary pressure bonding in such a manner that the electrodes provided on the electronic component 15 and the electrodes on the panel 1 side are correctly aligned. For this purpose, alignment marks (not shown) for position detection are provided in each of the electronic component 15 and the panel 1, so that the alignment marks are aligned with each other. In order to make the alignment marks coincide, an electronic component ‧ panel alignment camera is provided as a registration mark detecting means. The mutual positional deviation is detected based on the image obtained by the registration camera. Furthermore, when there is a positional shift between the electronic component and the panel, the position is corrected. In the present embodiment, two cameras on the left and right are provided.

In this way, when the alignment of the electronic component 15 and the panel 1 is completed, a specific pressing force is applied to the electronic component, whereby the temporary bonding of the electronic component 15 to the panel 1 is performed.

At this time, in the present embodiment, the mounting head 9 is set to a predetermined temperature in the range of about 60 to 100 degrees, and the pressurized pressure is set to a desired pressure in the range of 20 to 98 N (Newton).

The above-mentioned mounting head 9 is an electronic component or a panel ruler to be mounted. In the case of the inch or the like, the type of the mounting head that is mounted on the slider 8a can be selected. Further, the mounting pitch can be performed by adjusting the amount of movement of the mounting slider 8a.

Further, as described above, in the convenience of description, the left and right pairs of the constituent parts are mainly described as one side (the right side of the drawing), but the left side of the constituent parts (the added word of the symbol b) The action is also the same as the right side.

The operational relationship of the mutual components is controlled by a control device (not shown). For example, two electronic component mounting sections 7a and 7b are provided. For each of the mounting heads, the electronic component ‧ panel alignment camera is set to be placed on the left and right sides of the mounting head in two sets. The mutual operational relationship between the electronic component mounting portions 7a and 7b is controlled by the above-described control device.

Further, although the components such as the first-class head are used in a plurality of cases, they may be used alone.

The above operations are sequentially performed in reverse, and a specific number of electronic components are mounted on the peripheral portion of the panel 1. Thereafter, the panel 1 is transported to the next project, and the electronic component 15 is fixed to the panel 1 by pressurization under heating, that is, by fixed crimping.

Further, in the present embodiment, in the panel 1, although the electronic components of the same pattern are mounted on the long side 1a and the short side 1b shown in Fig. 1, the electronic components of different patterns are also mounted. can.

As described above, according to the present embodiment, the following effects can be expected.

1) First, the position of the panel 1 is fixed. On the other hand, the electronic component mounting portion 7a of the mounting head for temporarily crimping the electronic component 15 is provided, 7b is a parallel movement for the processing side of the panel 1. Therefore, since the panel 1 does not have to be moved, the panel is not moved by about twice the distance of the perimeter as shown in FIG. 9, and at least the lateral direction (X direction) of the device can be made to be about the peripheral length of the panel. The device is miniaturized.

2) Since the temporary crimping operation of the electronic component mounting portions 7a and 7b is not limited to the supply operation of the electronic component 15, the working time of the temporary pressing of the electronic component mounting portions 7a and 7b can be performed by the electronic component mounting portions 7a and 7b. The processing speed is determined to achieve high-speed processing of the device.

3) In addition, when the temporary crimping is completed for one panel, the panel is transferred to the fixed crimping project of the next project. On the other hand, the panel that is newly temporarily crimped will be transferred from the project on the upstream side. During the transfer, the operation of arranging the electronic component 15 on the electronic component collecting tray 16 from the electronic component supply unit 4 can be performed. Thereby, since the work can be performed independently of the dead time of the transfer panel 1, when the panel is transferred, it is not necessary to stop the supply operation of the electronic component, and standby is caused, and the speed of the apparatus can be increased.

4) The target head can be selected in response to the work carried.

[Example 2]

In the present embodiment, the respective components and their actions will be described centering on portions different from the first embodiment.

Fig. 4 is a perspective view showing the apparatus 201 for mounting an electronic component explained in the present embodiment, and Fig. 5 is a plan view thereof.

As shown in Fig. 4, the main part of the device 201 for assembling electronic components In other words, the electronic component supply unit 4 is provided to hold the electronic component (here, the electronic component mounted on the COF is taken as an example); and the electronic component is temporarily crimped to the panel 1 The electronic component mounting portions 7a and 7b and the electronic component collective transfer portion 33 for collectively transporting the electronic components to the mounting head.

In addition, the detail of each component is demonstrated using FIG.

First, the take-out mechanism of the electronic component of the electronic component supply unit 4 will be described. The taken-out portion of the electronic component is configured by a three-part rotating electronic component take-out portion 31. The electronic component 15 pulled up by the pull-up model 5a is sucked and taken out by the three-part rotating electronic component take-out section 31. The three-part rotating electronic component take-out unit 31 has three electronic component extractors 30, and sequentially picks up and takes out the electronic components 15 and arranges them in the electronic component collecting tray 16. At this time, the electronic component collecting tray 16 is movable in the X direction and the Y direction, and according to the movement, the electronic component 15 can be sequentially arranged in an appropriate position on the electronic component collecting tray 16. Further, the number of electronic components arranged in the electronic component collecting tray 16 is 16. This number is the same as that described in the first embodiment.

Next, the electronic component transfer unit 6 picks up and picks up the electronic component 15 arranged in the electronic component collecting tray 16 by the adsorption head provided in the electronic component collective transfer unit 33. In the present embodiment, since eight adsorption heads 32 are provided, eight electronic components 15 are collectively adsorbed from the electronic component collection tray 16.

The electronic component collective transfer portion 33 is moved in the Y direction, and the electronic component 15 adsorbed on the adsorption head 32 can be moved to the electronic component mounting portion. 7a.

In the mounting slider 8a, the electronic component temporary stage 35 is provided, and the eight electronic components 15 adsorbed by the adsorption head 32 are collectively conveyed, and are transferred from the adsorption head 32 to the electronic component temporary stage 35.

The mounting slider 8a further includes an electronic component pickup 38, whereby the eight electronic components 15 arranged in the electronic component mounting table 35 are sequentially picked up. The picked-up electronic component 15 is moved in the Y direction, and is turned over during the movement to obtain the desired position of the mounting head 9.

The mounting slider 8a moves on the electronic component transfer shaft 37 in the X direction parallel to the peripheral portion of the panel on which the electronic component is mounted.

Further, in the present embodiment, the head 9 is provided in a rotary type, and two heads are provided. The electronic component picked up by the electronic component pickup 38 is first transferred to the rotated head 9x. The electronic component 15 is moved to a position where the electronic component is temporarily crimped to the peripheral portion of the panel by rotating the head 9x at 180 degrees to the position of the head 9y at the position before the rotation.

In the same manner as in the first embodiment, the mounting head 9 can be selected from the type of the mounting head provided on the mounting slider 8a in accordance with the size of the electronic component or the panel to be mounted.

Regarding the above-described subsequent steps, the alignment of the electronic component and the panel, or the temporary crimping operation, and the movement of the fixed pressure contact to the subsequent one are the same as in the first embodiment.

Further, the mutual operational relationship between the respective components is controlled by the control device in the same manner as in the first embodiment.

From the above, according to the present embodiment, the next effect can be expected.

1) By having the three-division rotary electronic component take-out portion 31, the operation time for arranging the electronic component 15 on the electronic component collecting tray 16 can be shortened.

2) By using the eight adsorption heads 32 provided in the electronic component collective transfer unit 33, since it is possible to collectively move a plurality of electronic components, the movement time per electronic component toward the electronic component mounting portion 7a can be shortened.

3) Since a plurality of (here, eight) electronic components can be temporarily placed in the electronic component temporary stage 35, the neutral time for waiting for the supply of the electronic components can be prevented, and the temporary pressure bonding operation can be speeded up.

4) Since the panel does not need to be moved in this embodiment, the miniaturization of the apparatus is the same as that of the first embodiment.

5) The choice of the target head for the loading operation can be achieved.

[Example 3]

In the present embodiment, the respective components and their actions will be described centering on portions different from the first embodiment.

Fig. 6 is a perspective view showing the apparatus 202 for mounting an electronic component explained in the present embodiment, and Fig. 7 is a plan view thereof.

As shown in Fig. 6, the main configuration of the device 202 for mounting an electronic component includes: taking an electronic component (here, an electronic component mounted on the COF as an example) The electronic component supply unit 4; the electronic component mounting portion for temporarily pressing the electronic component to the panel 1; and the electronic component transfer units (1) 43 and (2) 44 for transporting the electronic component to the mounting head.

Further, the details of each component will be described using FIG.

The electronic component supply unit 4 shown in this embodiment is characterized in that it has two pull-up modes 42a and four adsorption heads 40.

First, the take-out mechanism of the electronic component of the electronic component supply unit 4 will be described. Two electronic components 15 are pulled out from the COF at one time by the two pull-up models 42a. The model 42a and the electronic component take-out operation at the time of extraction are the same as those in the first embodiment. The two extracted electronic components are adsorbed by the four adsorption heads 40. Further, by the second model 42a and the electronic component take-out operation, two electronic components are extracted and adsorbed by the four adsorption heads 40. At this time, in the first adsorption operation, the four adsorption heads 40 are attached to the two up-and-down models 42a (the models arranged on the right side of the drawing), and the inside (front side) and the front side (lower side of the drawing) are adsorbed. In the next adsorption operation, the four adsorption heads 40 are for the two pull-up models 42b (the models arranged on the left side of the drawing), and adsorb the inner side (the upper side) and the front side (the front side). Two of the lower sides, and the total number of adsorptions is four.

Next, in the electronic component transfer unit (1) 43, the electronic component pickup 45b attached to the shuttle 46b transfers the electronic component that is adsorbed and held by the first operation and the electronic component that is adsorbed by the next operation. Go to shuttle 46b. On the other hand, in the electronic component transfer unit (2) 44, the electronic component mounted on the front side of the shuttle 46a is used to move the electronic component on the front side by the initial operation and the electronic component on the front side by the second operation. Loaded to the shuttle 46a. A temporary stage 47 is provided in the electronic component mounting portion 7a, and the previous two electronic components 15 are arranged here.

The two electronic components 15 held by the electronic component pickup 45a are moved in the Y direction by the shuttle 46a, and are transferred to the electronic component mounting portion 7a. At this time, the shuttle 46a can be moved in the X direction on the electronic component transfer shaft 48. Therefore, the shuttle 46a can be moved to this position in response to the position of the electronic component mounting portion 7a.

Moreover, the electronic component mounting portion 7a can be moved in the X direction on the electronic component mounting portion shaft 49.

Regarding the above-described subsequent steps, the alignment of the electronic component and the panel, or the temporary crimping operation, and the movement of the fixed pressure contact to the subsequent one are the same as in the first embodiment.

In the same manner as in the first embodiment, the mounting head 9 can be selected from the type of the mounting head provided on the mounting slider 8a in accordance with the size of the electronic component or the panel to be mounted.

Further, the mutual operational relationship between the respective components is controlled by the control device in the same manner as in the first embodiment.

From the above, according to the present embodiment, the next effect can be expected.

1) By having two pull-up models 42a and four adsorption heads 40, it is possible to collectively take out a plurality of electronic components 15 and transfer them again, thereby shortening the work time.

2) Since the shuttle and the mounting slider can be independently moved in the X direction, the working time of the electronic components transmitted between each other can be shortened.

3) Since the panel does not need to be moved in this embodiment, the miniaturization of the apparatus is the same as that of the first embodiment.

4) The choice of the target head for the loading operation can be achieved.

[Example 4]

In the present embodiment, the respective components and their actions will be described centering on portions different from the first embodiment.

Fig. 8 is a plan view showing the apparatus 203 for mounting an electronic component explained in the present embodiment.

In the electronic component supply unit 4 shown in this embodiment, a pull-up type mold 42a and two adsorption heads 50 are provided.

First, the take-out mechanism of the electronic component of the electronic component supply unit 4 will be described. One electronic component 15 is extracted from the COF by the pull-up model 42a. The model 42a and the electronic component take-out operation at the time of extraction are the same as those in the first embodiment. One of the extracted electronic components is adsorbed by the two adsorption heads 50, and further, one electronic component is extracted by the second model 42a and the electronic component extraction operation, and is adsorbed by the two adsorption heads 50.

Further, in the present embodiment, the pull-up type model 42a is exemplified by one pull-up, but one or more corresponding devices may be provided.

In the present embodiment, the means for transferring the electronic component 15 adsorbed by the two adsorption heads 50 to the electronic component transfer portion 6a is different from that of the third embodiment. In other words, in the present embodiment, the two adsorption heads 50 can be moved on the electronic component transfer portions (Y direction) 52a, b, and the electronic component transfer portions 52a, b can be in the electronic component transfer portion (X direction). ) 51 on the move.

With this mechanism, the electronic component adsorbed and held by the two adsorption heads 50 can be transferred to the electronic component pickup 53a, and the electrons held by the electronic component pickup 53a can be held by the shuttle 54a. The element 15 is transferred to the electronic component mounting portion 7a. The electronic component pickup 53b or the shuttle 54b is also the same as the electronic component pickup 53a or the shuttle 54a.

Further, the electronic component transfer unit (Y direction) 52a and the electronic component transfer unit (Y direction) b start to operate without interfering with each other, and both of them perform the take-out operation interactively.

Regarding the above-described subsequent steps, the alignment of the electronic component and the panel, or the temporary crimping operation, and the movement of the fixed pressure contact to the subsequent one are the same as in the first embodiment.

In the same manner as in the first embodiment, the mounting head 9 can be selected from the type of the mounting head provided on the mounting slider 8a in accordance with the size of the electronic component or the panel to be mounted.

Further, the mutual operational relationship between the respective components is controlled by the control device in the same manner as in the first embodiment.

From the above, according to the present embodiment, the next effect can be expected.

1) Since the electronic component transfer portion (Y direction) 52a and the electronic component transfer portion (Y direction) 52b can also be moved in the direction of the electronic component transfer portion (X direction) 51, since the electronic component can be moved The X-direction movement of the carrier portions 6a and 6b is moved, and the electronic component transfer operation time between the electronic component transfer portion (Y direction) 52a and the electronic component transfer portion (Y direction) 52b and the electronic component mounting portion can be shortened.

2) Since the electronic component transfer portion (Y direction) 52a and the electronic component transfer portion (Y direction) 52b interact with each other, the electronic component can be taken out, and the operation time of each of the electronic components can be shortened.

3) Since the panel does not need to be moved in this embodiment, the miniaturization of the apparatus is the same as that of the first embodiment.

4) The choice of the target head for the loading operation can be achieved.

1‧‧‧ panel

1a‧‧‧Long side

1b‧‧‧Short side

2‧‧‧Electronic components

3a, 3b‧‧‧COF reels

4‧‧‧Electronic Component Supply Department

5a, 5b‧‧‧ pull-up model

6a, 6b‧‧‧ Electronic Component Transfer Department

7a, 7b‧‧‧Electronic component mounting department

8a, 8b‧‧‧ equipped with sliding parts

9, 9x, 9y‧‧‧ head

10a, 10b‧‧‧Electronic components ‧ Panel alignment camera

11‧‧‧Linear electronic component extractor

12‧‧‧Band-type electronic component extractor

13‧‧‧Electronic component transport mechanism (X direction)

14‧‧‧Electronic component transfer mechanism (Y direction)

15‧‧‧Electronic components

16‧‧‧Electronic component collection tray

17a, 17b‧‧‧Electronic component picker

18a, 18b‧‧‧Transportation body

19‧‧‧Axis for electronic component transfer

20‧‧‧Axis for sliding parts

30‧‧‧Electronic component extractor

31‧‧‧3 equally divided rotary electronic component extraction unit

32‧‧‧Adsorption head

33‧‧‧Electronic components

34‧‧‧Transportation body

35‧‧‧Electronic component temporary table

36‧‧‧Rotating table

37‧‧‧Axis for electronic component transfer

38‧‧‧Electronic component picker

40‧‧‧4 adsorption heads

41‧‧‧Direct electronic component extraction unit

42a, b‧‧‧2 pull-up models

43‧‧‧Electronic component transfer unit (1)

44‧‧‧Electronic component transfer unit (2)

45a, b‧‧‧Electronic component picker

46a, b‧‧‧ shuttle

47‧‧‧The temporary station

48‧‧‧Axis for electronic component transfer

49‧‧‧Axis for sliding parts

50‧‧‧2 adsorption heads

51‧‧‧Electronic component transfer unit (X direction)

52‧‧‧Electronic component transfer unit (Y direction)

53a, b‧‧‧Electronic component picker

54a, b‧‧‧ shuttle

55a, b‧‧‧ electronic components temporary table

100‧‧‧Transient unit of temporary crimping unit

101‧‧‧ temporary crimping unit

102‧‧‧ Temporary crimping of single lower flow units

104‧‧‧Fixed rotating head

105‧‧‧Heading head

106‧‧‧ Panel in the initial position

107‧‧‧Mobile panel

108‧‧‧ Panel support

200‧‧‧Equipment for assembly of electronic components

201‧‧‧Devices for assembling electronic components

202‧‧‧Equipment for assembly of electronic components

Fig. 1 is a plan view showing a panel on which electronic components are mounted.

Fig. 2 is a perspective view showing the apparatus for assembling an electronic component shown in the first embodiment.

Fig. 3 is a plan view showing the apparatus for assembling an electronic component shown in the first embodiment.

Fig. 4 is a perspective view showing the apparatus for assembling an electronic component shown in the second embodiment.

Fig. 5 is a plan view showing the apparatus for assembling an electronic component shown in the second embodiment.

Fig. 6 is a perspective view showing the apparatus for assembling an electronic component shown in the third embodiment.

Fig. 7 is a plan view showing the apparatus for assembling an electronic component shown in the third embodiment.

Fig. 8 is a plan view showing the apparatus for assembling an electronic component shown in the fourth embodiment.

Figure 9 is a plan view of a conventional fixed rotary head.

1‧‧‧ panel

3a, 3b‧‧‧COF reels

4‧‧‧Electronic Component Supply Department

6a, 6b‧‧‧ Electronic Component Transfer Department

7a, 7b‧‧‧Electronic component mounting department

8a, 8b‧‧‧ equipped with sliding parts

9‧‧‧Heading head

10a, 10b‧‧‧Electronic components ‧ Panel alignment camera

15‧‧‧Electronic components

41‧‧‧Direct electronic component extraction unit

42a, 42b‧‧‧2 pull-up models

50‧‧‧2 adsorption heads

51‧‧‧Electronic component transfer unit (X direction)

52a, 52b‧‧‧Electronic component transfer unit (Y direction)

53a, 53b‧‧‧Electronic component picker

54a, 54b‧‧‧ shuttle

55a, 55b‧‧‧ Electronic components temporary table

Claims (7)

A device for assembling electronic components, which is a device for assembling electronic components for mounting electronic components at a specific portion of a panel, characterized in that: an electronic component supply portion for providing a plurality of electronic components mounted on the panel; An electronic component provided in the electronic component supply unit is mounted on the electronic component mounting portion of the panel; and the electronic component removed from the electronic component supply unit is transferred to the electronic component transfer portion of the electronic component mounting portion, and the panel is The base unit on which the electronic component mounting portion is disposed is positioned and fixed, and the electronic component mounting portion has a mounting head that can move in parallel with respect to processing of the panel on which the electronic component is to be mounted; at least two or more of the mountings are provided. The head has a plurality of electronic component collecting means for temporarily collecting the electronic components taken out by the electronic component supply unit before being transferred to the electronic component transfer portion. The apparatus for assembling an electronic component according to claim 1, wherein the electronic component transfer unit has a moving means that can move parallel to the processing of the panel. The apparatus for assembling an electronic component according to claim 1 or 2, wherein the electronic component transfer unit has means for collectively transferring a plurality of electronic components. The apparatus for assembling an electronic component according to claim 1 or 2, wherein the electronic component supply unit has means for collectively taking out a plurality of electronic components. The apparatus for assembling an electronic component according to claim 1 or 2, wherein the electronic component mounting portion has means for temporarily arranging a plurality of electronic components. The apparatus for assembling an electronic component according to the first or second aspect of the invention, wherein the mounting head is capable of selecting a type of the mounting head according to an mounting specification of the electronic component of the panel. The apparatus for assembling an electronic component according to the first or second aspect of the invention, wherein the electronic component is transferred from the electronic component supply unit to the electronic component transfer unit, and the electronic component mounting unit The operation of the electronic component mounted on the processing side of the panel can be controlled as a control device that is independently performed in time.