TWI429091B - Backsheet structure for solar plate module and its fabrication method - Google Patents
Backsheet structure for solar plate module and its fabrication method Download PDFInfo
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- TWI429091B TWI429091B TW099119059A TW99119059A TWI429091B TW I429091 B TWI429091 B TW I429091B TW 099119059 A TW099119059 A TW 099119059A TW 99119059 A TW99119059 A TW 99119059A TW I429091 B TWI429091 B TW I429091B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Description
本發明係有關於一種太陽能板模組之封裝技術,特別是一種太陽能板模組之背板結構及其製法。The invention relates to a packaging technology of a solar panel module, in particular to a backboard structure of a solar panel module and a manufacturing method thereof.
隨著節能簡碳意識提高與綠色能源需求增加,太陽能發電成為重要的替代性能源之一。一般太陽能板模組通常設置於戶外,戶外環境之水氣、高溫等因素會不利於太陽模組,因此太陽能板模組之構成、材質構造等方面被要求充分的耐久性、耐候性,特別是要求背板具有耐候性且水蒸氣穿透率小。因為當封裝材因水分穿透而剝離或變色造成線路腐蝕時,會對模組之輸出電力本身造成影響。With the increasing awareness of energy saving and carbon and the increasing demand for green energy, solar power has become one of the important alternative energy sources. Generally, solar panel modules are usually installed outdoors, and the outdoor environment such as moisture and high temperature may be detrimental to the solar module. Therefore, the composition and material structure of the solar panel module are required to have sufficient durability and weather resistance, especially The back sheet is required to have weather resistance and a small water vapor transmission rate. Because when the package is peeled or discolored due to moisture penetration, the line is corroded, which will affect the output power of the module itself.
接續上述說明,如圖1所示,於一般太陽能板模組之結構中,封入該封裝中之組件稱為太陽電池模組100,太陽電池模組100之上下層以由熱塑性塑膠110(如乙烯-乙酸乙烯酯共聚合樹脂,EVA)所組成之封裝材來封裝填補太陽電池模組100間隙。太陽電池模組100接受太陽光照射之面一般係經玻璃120覆蓋。另外,太陽電池模組100內面則由具耐熱、耐候性塑膠材料等之薄片所構成之背板130保護。背板之製作多為塗佈貼合製程,且需要多日於熟成室進行熟成,因此背板製品熟成後展開會呈現翹曲狀態。Following the above description, as shown in FIG. 1 , in the structure of a general solar panel module, the component enclosed in the package is called a solar cell module 100, and the upper layer of the solar cell module 100 is made of a thermoplastic plastic 110 (such as ethylene). A package composed of vinyl acetate copolymer resin (EVA) is packaged to fill the gap of the solar cell module 100. The surface of the solar cell module 100 that is exposed to sunlight is generally covered by the glass 120. Further, the inner surface of the solar cell module 100 is protected by a back sheet 130 made of a sheet of heat-resistant and weather-resistant plastic material. The production of the back sheet is mostly a coating and laminating process, and it takes several days to mature in the mature chamber, so that the back sheet product is warped after being cooked.
一般太陽能板模組之封裝多採用疊壓製程(lamination process),溫度約150℃上下,常因各膜材與太陽電池模組層疊時需多道置放工序或膜材間翹曲程度不同,進而影響疊合良率。Generally, the packaging of the solar panel module adopts a lamination process, and the temperature is about 150 ° C. Usually, when the membranes are stacked with the solar cell module, multiple placement processes or warpage between the membranes are different. In turn, it affects the overlap yield.
為了解決上述問題,本發明目的之一係提供一種太陽能板模組之背板結構及其製法,藉由熱融押出(extrusion)方式將密封材料層與電絕緣層整合為一複合式背板,無需額外塗料貼合並省略熟成步驟且製品之翹曲值低。In order to solve the above problems, one of the objects of the present invention is to provide a backplane structure of a solar panel module and a method for manufacturing the same, which integrates a sealing material layer and an electrical insulating layer into a composite backing plate by an extrusion method. No additional paint sticking is required and the ripening step is omitted and the warpage value of the product is low.
本發明目的之一係提供一種太陽能板模組之背板結構及其製法,其結構平整可減少因高低差導致破片之機率,且具有低收縮率亦可減少破片機率與太陽電池模組線路不良之機率。One of the objects of the present invention is to provide a back panel structure of a solar panel module and a method for fabricating the same, which can reduce the probability of fragmentation due to height difference, and has a low shrinkage rate and can reduce the probability of fragmentation and poor solar cell module wiring. The chance.
本發明目的之一係提供一種太陽能板模組之背板結構及其製法,可減少封裝疊合時空氣層的產生,故可具有較快的抽氣排泡速率與較佳的層接著力。One of the objects of the present invention is to provide a back panel structure of a solar panel module and a method of manufacturing the same, which can reduce the generation of an air layer when the package is stacked, and thus can have a faster pumping and discharging rate and a better layer bonding force.
本發明一實施例之一種太陽能板模組之背板結構,係包括:一電絕緣層;以及一密封材料層,係利用一熱融押出(extrusion)方式直接成形於電絕緣層上且密封材料層之上表面係具有一表面壓花結構。A back sheet structure of a solar panel module according to an embodiment of the present invention includes: an electrically insulating layer; and a sealing material layer directly formed on the electrically insulating layer by a hot melt extrusion method and the sealing material The surface above the layer has a surface embossed structure.
本發明一實施例之一種太陽能板模組之背板結構的製法,係包括下列步驟:提供一電絕緣層;以及利用一熱融押出(extrusion)方式將一密封材料層直接成形於電絕緣層上且密封材料層之上表面係具有一表面壓花結構。A method for fabricating a backplane structure of a solar panel module according to an embodiment of the invention includes the steps of: providing an electrically insulating layer; and forming a layer of sealing material directly on the electrically insulating layer by a hot melt extrusion method The upper surface of the upper sealing material layer has a surface embossed structure.
以下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。The purpose, technical contents, features, and effects achieved by the present invention will become more apparent from the detailed description of the appended claims.
其詳細說明如下,所述較佳實施例僅做一說明非用以限定本發明。圖2為本發明一實施例之太陽能板模組之背板結構的示意圖。於本實施例中,太陽能板模組之背板結構包括:一電絕緣層200;以及一密封材料層300。密封材料層300係利用一熱融押出(extrusion)方式直接成形於電絕緣層200上。且密封材料層300之上表面係具有一表面壓花結構。The detailed description is as follows, and the preferred embodiment is not intended to limit the invention. 2 is a schematic view showing the structure of a back plate of a solar panel module according to an embodiment of the present invention. In this embodiment, the backplane structure of the solar panel module includes: an electrically insulating layer 200; and a sealing material layer 300. The sealing material layer 300 is directly formed on the electrically insulating layer 200 by a hot melt extrusion method. And the upper surface of the sealing material layer 300 has a surface embossed structure.
接續上述說明,其中密封材料層300之材質為交聯型封裝材料,例如於一實施例中,可為乙烯-醋酸乙烯酯共聚合物(ethylene-vinyl acetate copolymer,EVA)。另外,密封材料層300之材質亦可為聚乙烯丁醛樹脂(Polyvinyl Butyral,PVB)。Following the above description, the material of the sealing material layer 300 is a cross-linked packaging material. For example, in one embodiment, it may be an ethylene-vinyl acetate copolymer (EVA). In addition, the material of the sealing material layer 300 may also be a polyvinyl butyral resin (PVB).
請參照圖3A,密封材料層300可為一多層疊置結構,如兩層,係由共押成型所組成。具有表面壓花結構之一第一密封材料層310之材質係選自乙烯-醋酸乙烯酯共聚合物(ethylene-vinyl acetate copolymer,EVA)或聚乙烯丁醛樹脂(Polyvinyl Butyral,PVB)。疊置於第一密封材料層310下的一第二密封材料層320之材質係選自乙烯-醋酸乙烯酯共聚合物(EVA)、聚乙烯丁醛樹脂(PVB)、乙烯基聚合物(Polyolefins)、熱塑性塑膠彈性體(thermoplastic elastomer,TPE),如聚烯烴系彈性體(thermoplastic Olefine,TPO)、熱塑性硫化橡膠(Thermoplastic Vulcanizates,TPV)、氟素橡膠、矽氟橡膠。Referring to FIG. 3A, the sealing material layer 300 may be a multi-layered structure, such as two layers, which is composed of a co-molding. The material of the first sealing material layer 310 having one of the surface embossed structures is selected from the group consisting of ethylene-vinyl acetate copolymer (EVA) or polyvinyl butyral (PVB). The material of a second sealing material layer 320 stacked under the first sealing material layer 310 is selected from the group consisting of ethylene-vinyl acetate copolymer (EVA), polyvinyl butyral resin (PVB), and vinyl polymer (Polyolefins). ), thermoplastic elastomer (TPE), such as thermoplastic elastomer (TPO), thermoplastic vulcanizate (TPV), fluorocarbon rubber, fluorocarbon rubber.
接著,請繼續參照圖3B,於一實施例中,密封材料層300亦可為一三層疊置結構。疊置於第二密封材料層320下的一第三密封材料層330之材質係選自乙烯-醋酸乙烯酯共聚合物(EVA)或聚乙烯丁醛樹脂(PVB)。Next, please refer to FIG. 3B. In an embodiment, the sealing material layer 300 may also be a three-layer laminated structure. The material of a third sealing material layer 330 stacked under the second sealing material layer 320 is selected from the group consisting of ethylene-vinyl acetate copolymer (EVA) or polyvinyl butyral resin (PVB).
於本發明中,背板結構中之電絕緣層200係為一耐候層(weather film),除了電氣絕緣性質外,更必須防止氣體與水份進入太陽能板模組。於一實施例中,電絕緣層200之材質係為氟塑料(fluoroplastics)。於一實施例中,電絕緣層200之材質可選自聚乙烯混合物(Poly-Vinyl Fluoride,PVF)、聚偏氟乙烯(polyvinylidene fluoride,PVDF)、乙烯-四氟乙烯共聚物(Ethylene-tetrafluoroethylene,ETFE)、四氟乙烯和六氟丙烯之共聚物(Perfluoronated ethylene propylene copolymer,EFEP)、聚丙烯(Polypropylene,PP)、聚碳酸酯(polycarbonate,PC)或尼龍摻和乙烯和乙烯醇共聚物(Nylon-EVOH)。其中,於一實施例,氟塑料(fluoroplastics)中可選擇性摻和(blend)乙烯基聚合物(Polyolefins)。於一實施例,電絕緣層200中可選擇性摻和(blend) 奈米黏土(nano-clay)。In the present invention, the electrically insulating layer 200 in the backplane structure is a weather film. In addition to electrical insulation properties, it is necessary to prevent gas and moisture from entering the solar panel module. In one embodiment, the material of the electrically insulating layer 200 is fluoroplastics. In one embodiment, the material of the electrically insulating layer 200 may be selected from the group consisting of Poly-Vinyl Fluoride (PVF), polyvinylidene fluoride (PVDF), and ethylene-tetrafluoroethylene (Ethylene-tetrafluoroethylene). ETFE), Perfluoronated ethylene propylene copolymer (EFEP), Polypropylene (PP), Polycarbonate (PC) or Nylon blended with ethylene and vinyl alcohol copolymer (Nylon) -EVOH). Wherein, in one embodiment, fluoroplastics may be selectively blended with polyolefins. In an embodiment, the electrically insulating layer 200 is selectively blendable. Nano-clay.
又,於另一實施例中,電絕緣層200之材質係為熱塑性橡膠彈性體(thermoplastic elastomer,TPE),可選自聚烯烴系彈性體(thermoplastic Olefine,TPO),如,三元乙丙橡膠(ethylene propylene diene terpolymer rubber,EPDM)、乙烯丙烯橡膠(ethylene propylene rubber,EPR)、熱塑性硫化橡膠(Thermoplastic Vulcanizates,TPV)、氟素橡膠、矽氟橡膠。Moreover, in another embodiment, the material of the electrically insulating layer 200 is a thermoplastic elastomer (TPE), which may be selected from a thermoplastic elastomer (TPO), such as ethylene propylene diene monomer. (ethylene propylene diene terpolymer rubber, EPDM), ethylene propylene rubber (EPR), thermoplastic vulcanizates (TPV), fluorocarbon rubber, fluorocarbon rubber.
接著,請參照圖4,於一實施例中,電絕緣層200係為一多層疊置結構,如兩層。此多層疊置結構包括:一第一電絕緣層210係與密封材料層300(如圖2所示)接觸,用作一抗濕層;以及一第二電絕緣層220疊置於第一電絕緣層210下。Next, referring to FIG. 4, in an embodiment, the electrically insulating layer 200 is a multi-layered structure, such as two layers. The multi-layered structure includes a first electrically insulating layer 210 in contact with the sealing material layer 300 (shown in FIG. 2) for use as a moisture resistant layer; and a second electrically insulating layer 220 stacked on the first electrical layer. The insulating layer 210 is under.
接續上述說明,於一實施例中,第一電絕緣層210之材質可為乙烯基聚合物(Polyolefins)。於一實施例中,第一電絕緣層210之材質亦可為熱塑性橡膠彈性體(thermoplastic elastomer,TPE)、聚烯烴系彈性體(thermoplastic Olefinic,TPO)或熱塑性硫化橡膠(Thermoplastic Vulcanizates,TPV)。於一實施例中,第一電絕緣層210之材質可為聚對苯二甲酸乙二醇酯(polyethylene terephthalate,PET)或聚碳酸酯(polycarbonate,PC)。。第二電絕緣層220之材質係為氟塑料(fluoroplastics)並選自聚乙烯混合物(Poly-Vinyl Fluoride,PVF)、聚偏氟乙烯(polyvinylidene fluoride,PVDF)、乙烯-四氟乙烯共聚物(Ethylene-tetrafluoroethylene,ETFE)或四氟乙烯和六氟丙烯之共聚物(Perfluoronated ethylene propylene copolymer,EFEP)。其中,於一實施例,氟塑料(fluoroplastics)中可選擇性摻和(blend)乙烯基聚合物(Polyolefins)。Following the above description, in an embodiment, the material of the first electrical insulating layer 210 may be a polyolefin. In one embodiment, the material of the first electrically insulating layer 210 may also be a thermoplastic elastomer (TPE), a thermoplastic elastomer (TPO), or a thermoplastic vulcanizate (TPV). In one embodiment, the material of the first electrically insulating layer 210 may be polyethylene terephthalate (PET) or polycarbonate (PC). . The second electrical insulating layer 220 is made of fluoroplastics and is selected from the group consisting of Poly-Vinyl Fluoride (PVF), polyvinylidene fluoride (PVDF), and ethylene-tetrafluoroethylene copolymer (Ethylene). -tetrafluoroethylene, ETFE) or a copolymer of tetrafluoroethylene and hexafluoropropylene (EFEP). Wherein, in one embodiment, fluoroplastics may be selectively blended with polyolefins.
接續上述說明,於一實施例中(圖上未示),於第一電絕緣層210內可選擇性添加有機或無機染料,如硫酸鋇(BaSO4 )、碳酸鈣(CaCO3 )、二氧化鈦(TiO2 )或碳黑(carbon black)。於另一實施例中,於第一電絕緣層210上表面或下表面可選擇性設置含有機或無機染料之表面層(skin layer),圖上未示。於一實施例中,亦可於表面層中添加氟塑料(fluoroplastics)。於一實施例中,圖上未示,有機或無機染料亦可添加至第一電絕緣層210之內夾層中。於一實施例中,於第一電絕緣層210之表面層(skin layer)亦可添加阻水材料,如聚丙烯(Polypropylene,PP)、聚乙烯(polyethlene,PE)、尼龍(polyamide,PA)、乙烯-醋酸乙烯酯共聚合物(ethylene-vinyl acetate copolymer,EVA)、三元乙丙橡膠(ethylene propylene diene terpolymer rubber,EPDM)、乙烯丙烯橡膠(ethylene propylene rubber,EPR)或乙烯和乙烯醇共聚物(ethylene vinyl alcohol,EVOH)。Following the above description, in an embodiment (not shown), an organic or inorganic dye such as barium sulfate (BaSO 4 ), calcium carbonate (CaCO 3 ), or titanium dioxide may be selectively added to the first electrically insulating layer 210 ( TiO 2 ) or carbon black. In another embodiment, a skin layer containing an organic or inorganic dye may be selectively disposed on the upper surface or the lower surface of the first electrically insulating layer 210, not shown. In one embodiment, fluoroplastics may also be added to the surface layer. In one embodiment, an organic or inorganic dye may also be added to the inner interlayer of the first electrically insulating layer 210, not shown. In an embodiment, a water blocking material such as polypropylene (PP), polyethylene (polyethlene, PE), and nylon (PA) may be added to the skin layer of the first electrically insulating layer 210. , ethylene-vinyl acetate copolymer (EVA), ethylene propylene diene terpolymer rubber (EPDM), ethylene propylene rubber (EPR) or copolymerization of ethylene and vinyl alcohol (ethylene vinyl alcohol, EVOH).
於一實施例中,第一電絕緣層210之材質可為聚碳酸酯-聚酯合金(PC-Polyester Alloy),可選擇性添加有機或無機染料於第一電絕緣層210或是於第一電絕緣層210上表面或下表面可選擇性設置含有有機或無機染料之表面層(skin layer)。其中,聚碳酸酯-聚酯合金(PC-Polyester Alloy)可為聚碳酸酯-聚對苯二甲酸乙二醇酯合金(PC-PET Alloy)、聚碳酸酯-二醇類改性對苯二甲酸乙二醇酯合金(PC-PETG Alloy)、聚碳酸酯-聚對苯二酸丁二酯合金(PC-PBT Alloy)。於一實施例中,亦可於表面層中添加氟塑料(fluoroplastics),或是於第一電絕緣層210之內夾層選擇性添加有機或無機染料,如硫酸鋇(BaSO4 )、碳酸鈣(CaCO3 )、二氧化鈦(TiO2)或碳黑(carbon black),或氟塑料(fluoroplastics)。In one embodiment, the material of the first electrically insulating layer 210 may be a polycarbonate-polyester alloy, and an organic or inorganic dye may be selectively added to the first electrically insulating layer 210 or the first A surface layer containing an organic or inorganic dye may be selectively disposed on the upper surface or the lower surface of the electrically insulating layer 210. Among them, polycarbonate-polyester alloy (PC-Polyester Alloy) can be polycarbonate-polyethylene terephthalate alloy (PC-PET Alloy), polycarbonate-diol modified terephthalic acid PC-PETG Alloy, polycarbonate-polybutylene terephthalate alloy (PC-PBT Alloy). In one embodiment, fluoroplastics may be added to the surface layer, or an organic or inorganic dye such as barium sulfate (BaSO 4 ) or calcium carbonate may be selectively added to the interlayer of the first electrically insulating layer 210. CaCO 3 ), titanium dioxide (TiO 2 ) or carbon black, or fluoroplastics.
另外,請參照圖5A,可選擇性的於第一電絕緣層210之上表面設置一抗濕材質層212,其材質可為乙烯和乙烯醇共聚物(ethylene vinyl alcohol,EVOH)、聚醯胺(polyamide,PA)或聚二氯乙烯(polyvinyl dichloride,PVDC)。In addition, referring to FIG. 5A, a moisture-resistant material layer 212 may be selectively disposed on the upper surface of the first electrical insulating layer 210, and the material thereof may be ethylene vinyl alcohol (EVOH) or polyamine. (polyamide, PA) or polyvinyl dichloride (PVDC).
於本發明中,可選擇性的於第一電絕緣層210之至少一表面設置一抗濕材質層212,且其材質為乙烯和乙烯醇共聚物(ethylene vinyl alcohol,EVOH)、聚醯胺(polyamide,PA)或聚二氯乙烯(polyvinyl dichloride,PVDC)。如圖5A所示,抗濕材質層212係設置於第一電絕緣層210之上表面。如圖5B所示,抗濕材質層212係設置於第一電絕緣層210之下表面。又,如圖5C所示,抗濕材質層212可同時設置於第一電絕緣層210之上下表面。In the present invention, a moisture-resistant material layer 212 may be selectively disposed on at least one surface of the first electrical insulating layer 210, and the material thereof is ethylene and vinyl alcohol (EVOH), polyamine ( Polyamide, PA) or polyvinyl dichloride (PVDC). As shown in FIG. 5A, the moisture resistant material layer 212 is disposed on the upper surface of the first electrical insulating layer 210. As shown in FIG. 5B, the moisture resistant material layer 212 is disposed on the lower surface of the first electrical insulating layer 210. Moreover, as shown in FIG. 5C, the moisture resistant material layer 212 can be simultaneously disposed on the upper surface of the first electrically insulating layer 210.
請參照圖6,於一實施例中,電絕緣層200亦為一三層疊置結構。其結構包括:一第一電絕緣層210係與密封材料層300(如圖2所示)接觸;一第二電絕緣層220疊置於第一電絕緣層210下;以及一第三電絕緣層230疊置於第二電絕緣層220下。其中,第一電絕緣層210之材質係選自聚對苯二甲酸乙二醇酯(polyethylene terephthalate,PET)、聚碳酸酯(polycarbonate,PC)或聚碳酸酯-聚酯合金(PC-Polyester Alloy)。其中,聚碳酸酯-聚酯合金(PC-Polyester Alloy)可為聚碳酸酯-聚對苯二甲酸乙二醇酯合金(PC-PET Alloy)、聚碳酸酯-二醇類改性對苯二甲酸乙二醇酯合金(PC-PETG Alloy)、聚碳酸酯-聚對苯二酸丁二酯合金(PC-PBT Alloy)。第二電絕緣層220用以作為一抗濕層且其材質係選自鋁箔板(aluminum foil)。第三電絕緣層230之材質係為氟塑料(fluoroplastics)。於一實施例中,亦可選擇性添加奈米黏土於第一電絕緣層210或第三電絕緣層230內。Referring to FIG. 6, in an embodiment, the electrically insulating layer 200 is also a three-layer stacked structure. The structure includes: a first electrically insulating layer 210 is in contact with the sealing material layer 300 (shown in FIG. 2); a second electrically insulating layer 220 is stacked under the first electrically insulating layer 210; and a third electrical insulation Layer 230 is stacked under second electrically insulating layer 220. The material of the first electrical insulating layer 210 is selected from the group consisting of polyethylene terephthalate (PET), polycarbonate (PC) or polycarbonate-polyester alloy (PC-Polyester Alloy). ). Among them, polycarbonate-polyester alloy (PC-Polyester Alloy) can be polycarbonate-polyethylene terephthalate alloy (PC-PET Alloy), polycarbonate-diol modified terephthalic acid PC-PETG Alloy, polycarbonate-polybutylene terephthalate alloy (PC-PBT Alloy). The second electrically insulating layer 220 serves as a moisture resistant layer and is made of a material selected from the group consisting of aluminum foils. The material of the third electrical insulating layer 230 is fluoroplastics. In an embodiment, nano-clay may also be selectively added to the first electrically insulating layer 210 or the third electrically insulating layer 230.
請參照圖5D與圖5E,於本發明中,電絕緣層200之組合變化並不僅限於上述說明,可依照設計者需求加以變化,例如可設置兩層第一電絕緣層210並搭配一抗濕材質層212與兩層間並與第二電絕緣層220組合成電絕緣層200,如圖5D所示。又,依序設置第一電絕緣層210、一抗濕材質層212、一第一電絕緣210與一抗濕材質層212等組合重複N次並選擇性搭配第二電絕緣層220,如圖5E所示。Referring to FIG. 5D and FIG. 5E , in the present invention, the combination of the electrical insulating layer 200 is not limited to the above description, and may be changed according to the designer's requirements. For example, two layers of the first electrically insulating layer 210 may be disposed and matched with a wet resistance. The material layer 212 is combined with the two layers and with the second electrically insulating layer 220 to form an electrically insulating layer 200, as shown in FIG. 5D. In addition, the first electrical insulating layer 210, a moisture resistant material layer 212, a first electrical insulating layer 210 and a moisture resistant material layer 212 are sequentially arranged N times and selectively combined with the second electrically insulating layer 220, as shown in the figure. 5E is shown.
請參照圖7,為本發明一實施例太陽能板模組之背板結構的製法之示意圖。於本實施例中,此製法包括下列步驟:提供一電絕緣層200;以及利用一熱融押出(extrusion)方式將一密封材料層300由模頭500擠出直接成型於電絕緣層200上且密封材料層300之上表面係具有一表面壓花結構。於不同實施例中,電絕緣層200可為單層或多層結構,若為多層結構可利用黏著組合或共同押出成型。又,密封材料層300亦可為單層或多層結構,若為多層結構可利用共押出成型。Please refer to FIG. 7 , which is a schematic diagram of a method for fabricating a back plate structure of a solar panel module according to an embodiment of the present invention. In the present embodiment, the method includes the steps of: providing an electrically insulating layer 200; and extruding a sealing material layer 300 directly from the die 500 onto the electrically insulating layer 200 by a hot melt extrusion method. The upper surface of the sealing material layer 300 has a surface embossed structure. In various embodiments, the electrically insulating layer 200 can be a single layer or a multi-layer structure, and if it is a multi-layer structure, it can be formed by adhesive bonding or co-extrusion molding. Further, the sealing material layer 300 may have a single layer or a multilayer structure, and if it is a multilayer structure, it may be formed by co-extrusion.
本發明之密封材料層與電絕緣層雖為共押出之產品,然而,因兩種材料之融熔溫度並不相同,因此無法使用同模具共押出。故,利用不同模頭成型方式,先共押出電絕緣層,再共押出密封材料層直接成型於電絕緣層上,故可獲得低收縮複合材料之背板結構。另外,若電絕緣層係利用黏著組合成之多層材料時,雖於前述說明並未提及或圖示,但可理解的是,其層與層間可利用額外之接合劑或黏著劑加以組合。Although the sealing material layer and the electrical insulating layer of the present invention are co-extruded products, since the melting temperatures of the two materials are not the same, it is impossible to co-extend with the same mold. Therefore, by using different die forming methods, the electrical insulating layer is first pressed together, and then the sealing material layer is directly formed on the electrical insulating layer, so that the back plate structure of the low shrinkage composite material can be obtained. Further, when the electrically insulating layer is formed by a combination of adhesives, although not mentioned or illustrated in the foregoing description, it is understood that the layers and layers may be combined with an additional bonding agent or adhesive.
於本發明中,密封材料層係直接成型於電絕緣層上。密封材料層中可添加交聯劑,故背板進行太陽能板模組封裝之壓合程序時,因壓合溫度產生交聯,可直接封裝保護太陽電池模組。當密封材料層為多層組合時,可讓不同層具有不同交聯程度,故可控制壓合交聯速率並消除快速交聯之應力殘留。又,可於單層或不同層內添加有機或無機材料用以形成光線反射層或光線遮蔽層。若密封材料層使用EVA,其醋酸乙烯(vinyl acetate)高含量可提供優異的透明性。本發明之密封材料層表面具有特殊壓花形狀設計,於壓合製程時,密封材料層因融熔而流動包覆太陽電池模組,配合抽氣負壓環境下,氣泡會因材料流動而排出。密封材料層之材質內亦可添加可化學鍵結接著材料,故於壓合製程時,可產生接著反應。密封材料層亦可加入耐黃變添加劑,防止長時間溫度反應之裂化或黃化。又,亦可加入紫外線吸收劑,防止太陽光曝曬後強烈紫外光破壞分解背板之材料。In the present invention, the sealing material layer is directly formed on the electrically insulating layer. A cross-linking agent can be added to the sealing material layer. Therefore, when the backing plate is subjected to the pressing process of the solar panel module package, the cross-linking is generated due to the pressing temperature, and the solar cell module can be directly packaged and protected. When the sealing material layer is a multi-layer combination, different layers can be made to have different degrees of crosslinking, so that the press-crossing rate can be controlled and the stress residue of rapid cross-linking can be eliminated. Further, an organic or inorganic material may be added in a single layer or in different layers to form a light reflecting layer or a light shielding layer. If the sealing material layer uses EVA, its high content of vinyl acetate provides excellent transparency. The surface of the sealing material layer of the invention has a special embossing shape design. When the pressing process is performed, the sealing material layer flows and covers the solar cell module by melting, and the air bubbles are discharged due to the material flow under the suction negative pressure environment. . A chemical bond can be added to the material of the sealing material layer, so that a subsequent reaction can be produced during the pressing process. The sealing material layer may also be added with a yellowing resistant additive to prevent cracking or yellowing of the long-term temperature reaction. In addition, an ultraviolet absorber may be added to prevent the strong ultraviolet light from damaging the material of the decomposition back sheet after exposure to sunlight.
綜合上述,本發明藉由熱融押出(extrusion)方式將密封材料層與電絕緣層整合為一複合式背板,無需額外塗料貼合並省略塗佈膠層所需之數日熟成步驟且製品之翹曲值低;其背板結構平整可減少因高低差導致破片之機率,且具有低收縮率亦可減少破片機率與太陽電池模組線路不良之機率;以及可減少封裝疊合時空氣層的產生,具有較快的抽氣排泡速率與較佳的層接著力。In summary, the present invention integrates the sealing material layer and the electrically insulating layer into a composite backing plate by a hot melt extrusion method, without the need for additional paint sticking and omitting the several-day ripening step required for coating the adhesive layer and the product. The warpage value is low; the flat structure of the back plate can reduce the probability of fragmentation due to the difference in height, and the low shrinkage rate can also reduce the probability of chipping and the badness of the solar cell module circuit; and can reduce the air layer when the package is superposed. Produced with a faster pumping rate and a better layer adhesion.
以上所述之實施例僅係為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。The embodiments described above are merely illustrative of the technical spirit and the features of the present invention, and the objects of the present invention can be understood by those skilled in the art, and the scope of the present invention cannot be limited thereto. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention.
100‧‧‧太陽電池模組100‧‧‧Solar battery module
110‧‧‧熱塑性塑膠層110‧‧‧ thermoplastic layer
120‧‧‧玻璃120‧‧‧glass
130‧‧‧背板130‧‧‧ Backplane
200‧‧‧電絕緣層200‧‧‧Electrical insulation
210‧‧‧第一電絕緣層210‧‧‧First electrical insulation
212‧‧‧抗濕材質層212‧‧‧Dampproof material layer
220‧‧‧第二電絕緣層220‧‧‧Second electrical insulation
230‧‧‧第三電絕緣層230‧‧‧ Third electrical insulation
300‧‧‧密封材料層300‧‧‧Sealing material layer
310‧‧‧第一密封材料層310‧‧‧First sealing material layer
320...第二密封材料層320. . . Second sealing material layer
330...第三密封材料層330. . . Third sealing material layer
圖1習知太陽能板模組之示意圖。Figure 1 is a schematic view of a conventional solar panel module.
圖2為本發明一實施例之示意圖。2 is a schematic diagram of an embodiment of the present invention.
圖3A與圖3B為本發明不同實施例之示意圖。3A and 3B are schematic views of different embodiments of the present invention.
圖4為本發明一實施例之示意圖。Figure 4 is a schematic illustration of an embodiment of the invention.
圖5A、圖5B、圖5C、圖5D與圖5E為本發明不同實施例之示意圖。5A, 5B, 5C, 5D and 5E are schematic views of different embodiments of the present invention.
圖6為本發明一實施例之示意圖。Figure 6 is a schematic illustration of an embodiment of the invention.
圖7為本發明一實施例之示意圖。Figure 7 is a schematic illustration of an embodiment of the invention.
200...電絕緣層200. . . Electrical insulation
300...密封材料層300. . . Sealing material layer
Claims (22)
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