TWI428971B - Method and apparatus for breaking workpiece, scribing and breaking method, and scribing apparatus with breaking function - Google Patents

Description

Sliver method and device for workpiece, scribing and splitting method and scoring device for function of splitting piece

The present invention relates to a sharding method and apparatus for a workpiece which is subjected to a rupture of a workpiece composed of a brittle material such as a semiconductor wafer or glass, a scribing method, a slashing method, and a scribing method.

A method of cutting (cutting) a workpiece made of a brittle material such as a semiconductor wafer or glass into a predetermined shape, and cutting the workpiece into a rotating blade to break into small cubes. (dicing) method. In the cutting method, the volumetric form in which the workpiece is fed into the rotary blade is removed.

In recent years, there has been a method of replacing the cutting method, which has been used to sculpt a workpiece by slashing the surface of the workpiece with a scribing device, and then using a dicing device to grow the crack along the scribe line (for example, refer to Patent Document 1 Paragraphs [0001]~[0004]).

Figure 29 is a schematic diagram of a conventional splitting method. In the splitting method, the workpiece 2 is placed between the two support points 1a and 1b, and a pressing force is applied between the support points 1a and 1b from the upper side by the breaking head 3 (breaking head). The applied pressure is applied from the back side of the scored side of the score line. By applying a pressing force between the support points 1a and 1b, the workpiece 2 is subjected to a bending moment, and a tensile stress is generated at a portion where the score line is scored by the bending moment. With this tensile stress, the crack of the score line progresses from the surface toward the back side of the item (from bottom to top in Fig. 29). If the crack reaches the back of the workpiece, the workpiece is broken.

However, in the conventional splitting method shown in Fig. 29, when the split is applied, the workpieces which are broken on the back surface of the workpiece are rubbed against each other, causing chipping on the back surface of the workpiece shown in Part A of the figure (slices) Defective condition). In addition, if the pressing force from the split head increases, it will also cause the deformation of the workpiece.

A technique for solving this problem is as shown in FIG. 30. Patent Document 2 discloses that "the glass substrate assembly W joined by a pair of glass substrates S1 and S2 has a fracture line along each cell. The glass substrate S1 forming the notch groove faces upward and is placed on the spherical support head 71, and is covered with a sufficiently flexible push-pull sheet 73, and is passed through the exhaust pipe 71b. The sheet material 73 and the support head surface 71a and the like, the air in the space of the glass substrate assembly W enclosed therein is discharged, so that the glass substrate assembly W is adhered to the spherical support surface 71a, and the glass substrate S1 is placed along the surface. A method of breaking a notch groove" (see Patent Document 2, Patent Application No. 1).

Patent Document 1: Japanese Patent Laid-Open No. Hei 9-202635, Patent Document 2: Japanese Patent Laid-Open No. 2004-354836

However, in the splitting method described in Patent Document 2, since the pressing sheet 73 is covered on the glass substrate assembly W, the elastic force of the pressing sheet 73 is prevented from being cracked in the notch d of the glass substrate S1. Therefore, it is still feared that the chipping state occurs due to the friction of the fracture surface of the glass substrate S1. On the other hand, when the pressed sheet material 73 is removed, the finally broken glass substrate joined body W is scattered, and handling of the glass substrate joined body W is also difficult.

Accordingly, it is an object of the present invention to provide a method and apparatus for splitting a workpiece which can prevent a fracture of a workpiece from being broken by friction when a workpiece having a score line is fractured.

In order to solve the above problems, the invention of claim 1 is a lobing method for a workpiece having a surface scribed with a scored workpiece (5) broken along a scribe line (5c), comprising: the above workpiece ( 5) a step of attaching a workpiece attached to the stretchable sheet (9) on the back side; a sheet stretching step of stretching the sheet (9) to which the workpiece (5) has been attached; and a workpiece breaking step in which the scribe line (5c) reaches the back surface of the workpiece in a state where the sheet (9) is stretched; wherein the workpiece (5) which is broken is a tensile force using the sheet (9) And separated.

According to the present invention, since the workpiece is pulled away at the same time as the fracture, the friction between the fractured workpieces is reduced, and the chipping of the back surface can be prevented. In addition, since the tensile force is assisted by the fracture of the workpiece by applying a tensile force to the workpiece, the split can be performed with a smaller force. In addition, since the workpiece is attached to the sheet, after the workpiece is split, the broken workpiece will not be scattered, and no frictional condition will occur. Therefore, the processing of the workpiece will be easier.

The invention of claim 2, wherein the workpiece breaking step is performed by stretching the sheet (9) in accordance with the workpiece (5) The workpiece (5) is bent such that the surface side becomes curved outward, whereby the scribe line (5c) reaches the back surface of the workpiece (5).

According to the present invention, by the combination of the bending moment and the tensile force, even a workpiece having a thickness can be fractured without causing chipping.

The invention of claim 3, wherein the sheet stretching step is performed after the sheet (9) is stretched, and the workpiece is subjected to the sharding method of the workpiece of claim 1 or 2 (5) A gap is left around and the frame member (12) is attached to the sheet (9), and the tension of the sheet (9) is enclosed in the frame member (12).

According to the present invention, after the workpiece is stretched, even if the tensile force is removed, the tensile force can be continuously imparted to the workpiece.

The invention of claim 4 is a lobing device for scrimming a workpiece (5) having a scribed line (5) along a scribe line (5c), and is provided with: affixing the back surface of the workpiece (5) a sheet stretching means (10, 11, 14a, 14b) for stretching the attached stretchable sheet (9), and a state in which the sheet (9) is stretched to make the workpiece (5) The surface of the workpiece (5) is bent toward the outside of the curved surface, whereby the scribe line (5c) is brought to the workpiece breaking means (16) on the back surface of the workpiece (5); wherein the workpiece (5) is broken They are separated by the tensile force of the above sheet (9).

According to the present invention, since the workpiece is pulled away at the same time as the fracture, the friction between the fractured workpieces is reduced, and the chipping of the back surface can be prevented. In addition, by the combination of the bending moment and the tensile force, even a workpiece having a thickness can be fractured without causing chipping. Moreover, since the workpiece is attached to the sheet, the broken workpiece does not scatter after the workpiece is split, and there is no friction condition. Therefore, the processing of the workpiece is relatively easy.

The invention of claim 5 is a scribing and splitting method of a workpiece in which a workpiece (5) is fractured along a scribe line (5c) while scribing a scribe line (5c) on the surface of the workpiece (5). a step of attaching a workpiece to which a workpiece (5) is attached to a stretchable sheet (9); and a sheet stretching step of stretching the sheet (9) to which the workpiece (5) is attached And in the state in which the sheet (9) is stretched, the scribe line (5c) is scribed on the surface of the workpiece (5) while the scribe line (5c) on the surface of the workpiece (5) is reached. The workpiece breaking step on the back surface of the workpiece (5); wherein the fractured workpiece (5) is separated by the tensile force of the sheet (9).

According to the present invention, since the workpiece is pulled away at the same time as the fracture, the friction between the fractured workpieces is reduced, and the chipping of the back surface can be prevented. Further, since the tensile force is assisted by the fracture of the workpiece by applying a tensile force to the workpiece, the split can be performed while the workpiece is being scored. Moreover, since the workpiece is attached to the sheet, the broken workpiece does not scatter and has no frictional condition after the workpiece is split. Therefore, the processing of the workpiece is relatively easy.

The invention of claim 6 is a scribing device having a function of a splitting piece for cutting a workpiece (5) along a scribe line while scribing a scribe line (5c) on the surface of the workpiece (5). a sheet stretching means (22) for stretching the stretchable sheet (9) to which the workpiece (5) is attached; and in the state where the sheet (9) is stretched, the workpiece (5) The surface is scribed with a score line (5c) while the above-mentioned scribe line (5c) on the surface of the workpiece (5) reaches the back surface of the workpiece (5), and the workpiece is broken by the workpiece (5) (20); wherein the fractured workpiece (5) is separated by the tensile force of the sheet (9).

According to the present invention, since the workpiece is pulled away at the same time as the fracture, the friction between the fractured workpieces is reduced, and the chipping of the back surface can be prevented. Further, by applying a tensile force to the workpiece, the tensile force is assisted by the fracture of the workpiece, so that the split can be performed while the workpiece is being scored. Moreover, since the workpiece is attached to the sheet, the broken workpiece does not scatter and has no frictional condition after the workpiece is split. Therefore, the processing of the workpiece will be easier.

The invention of claim 7 is a sharding method in which a workpiece (51) having a scribed line (52) is scribed on the surface, and a workpiece (51) which is ruptured along the scribe line (52) is included, including: a step of attaching the workpiece (51) to the workpiece on the back side of the sheet (53); attaching the sheet (53) to the splitting table (55, 65), and aligning the surface of the workpiece (51) toward the outside of the curved surface The workpiece (51) is bent, whereby the scribe line (52) on the surface of the workpiece (51) reaches the back surface of the workpiece (51), and the workpiece (51) is broken.

According to the present invention, since the sheet is located on the back side of the workpiece, the sheet does not hinder the action of breaking the workpiece by the scribe line on the surface side of the workpiece. Therefore, it is possible to prevent the fracture surface of the workpiece from being rubbed and broken. Moreover, by attaching the workpiece to the sheet, the fractured workpiece is not scattered.

The invention of claim 8 is the lobing method of the workpiece of claim 7, wherein the step of splicing the workpiece comprises: arranging the workpiece (51) with a plurality of scribe lines (52). a step of breaking the above-mentioned workpiece (51) into a plurality of elongated strips by bending along a semi-cylindrical shape splitting table (55); then, said sheet (53) being retracted from said splitting table (55) a relative rotation step of rotating relative to 90 degrees in a plane including the above-mentioned sheet (53) with respect to the above-mentioned split sheet stage (55); and extending the above-mentioned workpiece (51) which is broken into elongated strips The stage (55) is again bent, and the above-mentioned workpiece (51) is broken into a wafer breaking step of a plurality of chips.

According to the present invention, a workpiece which is scored in the longitudinal and transverse directions can be divided into wafers without being broken. Then, since the workpiece is broken in two steps by using the semi-cylindrical shape splitting table, the force along the score line is compared when the workpiece is broken along the split table, as compared with the case where the workpiece is broken in a single step using the spherical shape splitter table. Difficult to occur, so the fracture surface of the workpiece does not cause friction.

The invention of claim 9 is the splitting method of the workpiece of claim 7 or 8, wherein the workpiece breaking step uses the suction hole (56, 66) for sucking air to apply the workpiece (51) The attached sheet (53) is attached to the splitting table (55, 65) to bend the workpiece (51) along the splitting table (55, 65).

According to the present invention, the workpiece can be bent along the splitting table by sucking air from the adsorption holes.

The invention of claim 10, wherein the workpiece breaking step is performed on a plane including the sheet (53), in a vertical direction, in the method of splitting a workpiece according to claim 7 or 8. The splitting table (55, 65) is relatively moved relative to the sheet (53), and the splitting table (55, 65) is pushed against the sheet (53) to which the workpiece (51) is attached. The workpiece (51) is bent along the splitting table (55, 65).

According to the present invention, the workpiece can be bent along the splitting table by pushing the sheet to which the workpiece is attached against the splitting table. Moreover, since the tensile force is applied to the workpiece before the workpiece is broken, when the workpiece is broken, the fractured workpieces are separated from each other. Therefore, the situation in which the fracture surfaces of the workpieces rub against each other does not occur.

The invention of claim 11 is a splitting device for scribing a workpiece (51) having a score line (52) and a workpiece broken along the score line (52), comprising: causing the workpiece (51) a curved splitting table (55, 65); and a sheet (53) attached to the back surface of the workpiece (51) is in close contact with the splitting table (55, 65), and faces the curved outer side according to the surface of the workpiece (51) a sheet adhesion means (56, 66, 64) for bending the workpiece (51); wherein the scribe line (52) on the surface of the workpiece (51) is brought to the back surface of the workpiece (51), and the above The workpiece (51) is broken.

According to the present invention, since the sheet is located on the back side of the workpiece, the sheet does not hinder the action of breaking the workpiece by the scribe line on the surface side of the workpiece. Therefore, it is possible to prevent a situation in which the fracture surface of the workpiece rubs against each other and breaks. Moreover, by attaching the workpiece to the sheet, the workpiece after the fracture can be prevented from being scattered.

The invention of claim 12, wherein in the splitting device of the workpiece of claim 11, the close-contact means (56, 66) is oriented from a higher position of the splitting table (55, 65) The position has a height difference arrangement and has a plurality of adsorption holes (56, 66) for sucking air, and the sheet (53) is adsorbed by the adsorption holes (56, 66), so that the workpiece (51) is in close contact with The above split table (55, 65).

According to the present invention, the workpiece can be closely attached to the splitting stage in order from the upper position of the splitting table to the lower position. Since the workpiece is sequentially broken from a higher position toward a lower position, it is possible to prevent the fracture surface of the workpiece from rubbing against each other and causing chipping.

The invention of claim 13 is the split device of the workpiece of claim 12, wherein the close-contact means further comprises a plurality of solenoid valves (63) which are sequentially arranged from a higher position toward a lower position The above adsorption holes (56, 66) draw air.

According to the present invention, the workpiece can be securely attached to the splitting table from a higher position of the workpiece to a lower position.

The invention of claim 14 is the split device of the workpiece of claim 11, wherein the close-contact means includes: a state in which the split table (55, 65) is placed, and the sheet is held (53) an end sheet fixing table (64); and on the plane including the sheet (53), the split table (55, 65) is vertically opposed to the sheet fixing table (64) a relatively moving pushing mechanism; wherein the workpiece (51) is along the split by pushing the sheet (53) attached to the workpiece (51) against the splitting table (55, 65) The table (55, 65) is bent.

According to the present invention, the workpiece can be bent along the splitting table by pushing the sheet to which the workpiece is attached against the splitting table. Moreover, since the tensile force is applied to the workpiece before the workpiece is broken, when the workpiece is broken, the inter-worked phase exits. Therefore, there is no situation in which the fracture surfaces of the workpieces rub against each other.

The invention of claim 15 is the apparatus for splitting a workpiece according to any one of claims 11 to 14, wherein the splitting device is configured to scribe the workpiece (51) with a plurality of score lines in the longitudinal and transverse directions. And bending the semi-cylindrical splitting table (55) to break the workpiece (51) into a plurality of elongated strips, and then retracting the sheet (53) from the splitting table (55) relative to the splitting table (55) Rotating at a relative angle of 90 degrees in a plane including the above-mentioned sheet (53), and then re-bending the above-mentioned workpiece (51) which has been broken into elongated strips along the splitting table (55), and the above-mentioned workpiece (51) Breaking into a plurality of wafers.

According to the present invention, it is possible to divide a workpiece which is scribed in the longitudinal and transverse directions into a wafer without causing chipping. Moreover, since the workpiece is broken in two steps using a semi-cylindrical splitting table, the force along the scribe line is difficult when bending along the splitting table as compared with the case where the workpiece is broken in a single step using the spherical shaped splitting table. The action occurs, and there is no situation in which the fracture surfaces of the workpiece rub against each other.

According to the invention of the first to fifteenth aspects of the above patent application, when the workpiece having the scored line is fractured, it is possible to prevent the workpiece from being broken by the frictional surface of the workpiece.

Fig. 1 is a schematic view showing a method of splitting a workpiece according to a first embodiment of the present invention. On the surface of a plate-like workpiece such as a semiconductor wafer or glass, a scribe line is scribed in advance using a scribing device. The scoring device adopts a pointed tip or a freely rotating thin plate disc (wheel) as a scribing knife, and pushes against the surface of the workpiece, and moves the scoring blade along the surface of the workpiece to be chiseled on the surface of the workpiece. Dash.

After the score line is scored on the surface of the workpiece, the workpiece 5 is mounted on the split device. The lobing device applies a bending moment to the workpiece 5 such that one side 5a of the scribe line is curved outward. Specifically, the workpiece 5 is placed between the two support points 6a and 6b (machine table), and the workpiece 5 between the support points 6a and 6b is applied with pressure from the upper side by the split head 7. The pressing force is applied from the back side of the side 5a on which the score line is scored. By applying a pressing force between the support points 6a, 6b, the workpiece 5 is subjected to a bending moment by which the tensile stress in the bending stress occurs at the portion where the score line is scored. By the tensile stress, the crack progresses from the surface toward the back (in the direction from bottom to top in Fig. 1).

While the bending moment is applied to the workpiece 5, the workpiece 5 is also subjected to a tensile force P in the orthogonal direction of the scribe line. By applying the tensile force P to the workpiece 5, since the workpiece 5 is also pulled away while being broken, the friction between the fractured workpieces 5 is reduced, and the back surface (the back side of the scribing side) is suppressed from being broken. situation. Further, by applying the tensile force P to the workpiece 5, since the tensile force P serves as an aid to the fracture of the workpiece, the workpiece 5 can be split by applying pressure with the smaller split head 7.

Further, when the tensile force is applied only to the workpiece 5, the workpiece 5 can be lobed, and the bending moment can not be applied to the workpiece 5. When a bending moment is applied to the workpiece 5, the splitting head 7 may be replaced by a splitting roller, or a linearly extending projection may be formed on the machine table, and the workpiece may be drawn on the machine on the two sides of the projection. The suction device is sucked, and the workpiece is bent with the protruding portion as a vertex.

Figure 2 shows the bending stress caused by the bending moment. When the bending moment M is applied to the workpiece 5, the bending stress M is used to cause the workpiece to have a bending stress σ. The distribution of the bending stress σ is as shown in the drawing, and tensile stress occurs at the lower side of the neutral shaft 5e, and compressive stress occurs at the upper side. The compressive stress σ occurring on the upper side of the workpiece 5 is a cause of friction between the workpieces 5. Even if the tensile force P applied to the workpiece is smaller than the compressive stress σ, the workpiece 5 can be pulled away while being broken, so that the situation in which the workpieces 5 rub against each other can be reduced. On the other hand, if the tensile force P of the workpiece 5 is larger than the compressive stress σ generated by the bending moment M on the upper side of the workpiece 5, since the compressive stress of the workpiece 5 can be prevented, the cause of the friction between the workpieces 5 can be eliminated.

Fig. 3 is a schematic view showing a method of splitting a workpiece according to a second embodiment of the present invention. In the present embodiment, the workpiece 5 is split by applying a tensile force P to the workpiece 5 in the orthogonal direction of the score line while scribing the surface of the workpiece 5. In other words, in the present embodiment, the scribing step of scribing the workpiece 5 and the splitting step of breaking the workpiece are simultaneously performed.

The tensile force P is applied to the workpiece 5 while scribing the workpiece 5, and the crack 5d is advanced in the thickness direction of the workpiece (the direction from the top to the bottom in Fig. 3). When the crack 5d reaches the back surface 5b, the workpiece 5 is split. Further, by applying a tensile force to the workpiece 5, since the workpiece 5 is pulled away while being broken, the mutual friction between the fractured workpieces 5 is reduced, and the occurrence of chipping on the back surface 5b of the workpiece 5 can be suppressed.

When the thickness of the workpiece 5 is thick, there may be a case where only the tensile force is applied to the workpiece 5, but the crack cannot be reached to the back surface 5b. In this case, a bending moment is applied to the workpiece 5 such that the one side of the score line 5a is curved outside while the tensile force is applied.

Figure 4 is a schematic diagram showing the method of applying a tensile force to the workpiece 5 using the sheet 9. First, as shown in FIG. 4(A), the workpiece 5 is attached to the stretchable sheet 9. Adhesion is imparted to the sheet 9 in advance. The two ends of the sheet 9 are clamped in a sheet stretching means (for example, an extension jig formed by the fixed side 10 and the movable side 11 which is movable to the fixed side 10). In a state where the workpiece 5 is attached to the sheet 9, the movable side 11 of the extension jig is moved, and the sheet 9 is stretched in a predetermined direction, and a tensile force (tension) is applied to the sheet 9. In this example, the example in which the workpiece 5 is stretched only in the X direction is exemplified, but it is not limited to the X direction, and may be stretched in two directions such as the X direction and the Y direction orthogonal to the X direction.

Next, as shown in FIG. 4(B), the ring 12 as a frame member is attached around the workpiece 5 while the tension is maintained, and the sheet outside the ring 12 is cut. The state in which the sheet outside the ring 12 is cut is as shown in Fig. 4(C). A gap is provided between the workpiece 5 and the ring 12 around the workpiece 5, and tension is applied to the sheet 9 between the workpiece 5 and the ring 12. On the other hand, since the workpiece 5 is attached to the sheet 9 before the tension is applied, tension is not applied to the sheet 9 to which the workpiece 5 is attached.

Next, the workpiece 5 to which the tension is applied is conveyed to the slitting device or the scoring device having the function of the splitting piece, and as shown in Fig. 4(D), the workpiece 5 is split by the slitting device or the scoring device with the splitting function. Since the tension is applied to the workpiece 5, the workpieces 5 are pulled apart while being broken, and a gap is left between the workpieces 5. Finally, the adhesion of the sheet 9 is removed by UV irradiation or the like, and the workpiece 5 is peeled off from the sheet 9.

The tensioning method applied to the workpiece 5 by the sheet 9 as described above is quite suitable for a semiconductor wafer having a small workpiece size 5.

Description of the splitting method and the splitting device of the workpiece 5 for realizing the above-described splitting principle. Fig. 5 shows a splitting device according to a first embodiment of the present invention. On the machine table 23 of the splitting device, the workpiece 5 is mounted with the surface of the workpiece 5 having the score line 5c drawn downward. Immediately above the score line 5c, a rod-shaped split head 16 extending in the direction of the score line 5c as a workpiece breaking means is disposed. The splitting device presses the split head 16 from above the workpiece 5, and the workpiece 5 is bent in such a manner that one side of the score line is scored to the outside.

(workpiece sticking step. sheet stretching step)

The workpiece 5 having the score line 5c is scribed on the surface, and the back surface thereof is attached to the stretchable sheet 9. Then, the sheet 9 to which the workpiece 5 is attached is stretched in such a manner that the tensile force P is applied to the workpiece 5. Fig. 6 shows a tensioning mechanism for a sheet stretching means for imparting a tensile force to the workpiece 5. The workpiece 5 is attached to the sheet 9, and the sheet 9 is fixed to the pair of stages 14a, 14b by a vacuum or the like. Then, the platforms 14a, 14b are moved in opposite directions and the stretched sheet 9 is stretched. In addition, the two platforms 14a, 14b can also be moved in opposite directions, and one of the platforms 14a can be fixed, and only the other platform 14b can be moved. Further, as shown in Fig. 9, the workpiece 5 may be attached to the sheet 9, and then the sheet 9 may be stretched by a clamp jig 22 that clamps both ends of the sheet 9. Further, although only the tensile force in the X direction is given to the workpiece, two sets of the tensioning mechanism may be provided, and the tensile force may be applied to the X direction and the Y direction orthogonal to each other. Of course, the ring 12 shown in Fig. 4 can also be used.

(workpiece breaking step)

As shown in Fig. 5, in a state where the sheet 9 is stretched, the workpiece 5 is bent by the split head 16 of the workpiece breaking means so that the surface side of the workpiece 5 becomes curved outside. Then, by bending the workpiece 5, the score line 5c on the surface of the workpiece 5 reaches the back surface of the workpiece 5. Fig. 7(A) shows the crack 5d which occurs in the workpiece 5. Since the crack 5d is made to progress by applying the tensile force P to the workpiece 5, the workpiece 5 can be split by the small pressing force of the split head 16. Further, after the fracture, since the workpieces 5 are separated from each other, it is possible to suppress the occurrence of chipping at the edge of the workpiece, and the split can be performed without applying unnecessary load (damage) to the fracture surface. Fig. 7(B) shows a comparative example in the case where no tensile force is applied to the workpiece 5. When the tensile force is not applied to the workpiece 5, since there is no escape in the horizontal direction, if the split head 16 is pressed against the workpiece 5, the A portion of the back surface is broken, and the fracture surface of the workpiece 5 is also Rubbed against each other and suffered damage. Further, when the workpiece is in a thin condition, even if the bending moment M is not applied, the fracture can be performed only by the tensile force P. In this case, the split head 16 that imparts the bending moment M is not required.

Fig. 8 and Fig. 9 show a scribing device functioning device according to a second embodiment of the present invention. Fig. 8 is a perspective view showing a scribing device with a splitting function, Fig. 9(A) is a plan view of a scoring device with a splitting function, and Fig. 9(B) is a scoring device for attaching a splitting function. Side view. The scoring device with the splitting function simultaneously performs the scribing step and the splitting step, and includes: a machine table 18 supporting the workpiece 5; and a scribing head 20 having a scoring blade 19 abutting on the workpiece 5 (workpiece breaking means) And a moving mechanism 21 that moves the scribing head 20 linearly. A vibrating element such as a magnetostrictive vibrating element or a piezoelectric element is provided in the scribing head 20. The magnetostrictive vibrating element is vibrated by the current sent from the transmitter, and the scribing blade 19 is vibrated by the vibrating element. When the scribe blade 19 is vibrated, since the collision force is applied to the workpiece 5 from the scribe blade 19, the crack progresses toward the thickness direction of the workpiece 5. The moving mechanism 21 that moves the scribing head 20 is a well-known moving mechanism such as a ball screw mechanism. When the scribing blade 19 abutting on the workpiece is moved, the score line 5c is scored on the surface of the workpiece 5.

(workpiece sticking step. sheet stretching step)

The workpiece 5 having the score line 5c is scored on the surface, and the back surface thereof is attached to the stretchable sheet 9. Then, the sheet 9 to which the workpiece 5 is attached is stretched so as to impart a tensile force P to the workpiece 5. In other words, as shown in Fig. 9, the workpiece 5 is attached to the sheet 9, and then the sheet 9 is stretched by the clamp jig 22 which clamps the both ends of the sheet 9. Of course, instead of the clamp jig 22, the tensioning mechanism shown in Fig. 6 can be used to stretch the sheet.

(workpiece breaking step)

As shown in Fig. 8, in a state where the sheet 9 is stretched, the scribing head 20 using the workpiece breaking means scores the score line 5c on the surface of the workpiece 5 while the score line 5c on the surface of the workpiece 5 is reached. The back of the workpiece 5. Fig. 10(A) shows the crack 5d which occurred. By applying the tensile force P to the workpiece 5, the vertical crack 5d generated by the scribe blade 19 by the scribe head 20 can be further grown, and finally reaches the full-cut state. By applying the tensile force P to the workpiece 5, even if the load of the scoring blade 19 is a low load, a large vertical crack 5d can be formed. Further, since the escape of the vertical crack 5d is formed, no excessive load (damage) is applied to the fracture surface. Fig. 10(B) shows a comparative example in the case where the tensile force P is not applied to the workpiece 5. When the tensile force P is not applied to the workpiece 5, since the vertical crack 5d is less likely to grow, and the vertical crack 5d does not escape, an excessive load (damage) is applied to the fracture surface of the workpiece 5. If the load of the scoring blade 19 is increased to form the long vertical crack 5d, an excessive load may be applied to the fracture surface, resulting in a decrease in the quality and the fracture strength of the fractured product.

Fig. 11 shows a scribing device having a splitting function according to a third embodiment of the present invention. The present embodiment is characterized in that the bending moment M is applied to the workpiece in the scribing device having the split blade function according to the second embodiment. The bending moment M is applied so that one side of the scored score line 5c is curved outward. If the thickness of the workpiece 5 is thick, the application of the tensile force P alone cannot break the workpiece. Therefore, by applying a bending moment M to the workpiece 5, the workpiece can be easily broken. The manner in which the bending moment is applied to the workpiece may be, for example, a method of applying a bending moment by using a 3-point bending, or a pair of machines holding the workpiece with the scribe line as a boundary, and one of them is performed on the other. A manner in which a predetermined angle is inclined; or a manner in which a pair of clamping devices that hold a workpiece with a scribe line as a boundary, such that one of them is tilted at a predetermined angle to the other. Since the scribing head 20 and the moving mechanism 21 are the same as the scribing device of the second embodiment, the same reference numerals are given to the same components, and the description thereof is omitted.

Fig. 12(A) shows a crack which occurs when the scribing device having the splitting function of the third embodiment is used. By applying the tensile force P and the bending moment M to the workpiece 5, the vertical crack 5d generated by the scoring device can be further grown, and finally the full-cut state can be achieved. Figure 12 (B) shows that the tensile force is not applied to the workpiece 5. A comparative example in the case of the bending moment M. When the tensile force and the bending moment are not applied to the workpiece 5, since the vertical crack 5d is less likely to grow, and the vertical crack 5d does not escape, an excessive load (damage) is applied to the fracture surface of the workpiece 5. If the load of the scoring blade 19 is increased to form a long vertical crack, an excessive load may be applied to the fracture surface, resulting in a decrease in the quality and fracture strength of the fractured product.

(Example)

(1) Device outline In order to investigate the effect of extension, a test fixture having only an extension mechanism was produced (Fig. 13). The external dimensions are 410mm x 450mm. The test jig can apply a tension to the sheet in a composite direction only in the X direction and the X-Y direction. The clamping of the sheet is combined with a grooved plate and secured with screws. The grooved plate can be used to clamp the overall width of the sheet. The adjustment of the tension is performed by using the screw of the "stretching portion" in the drawing while viewing the scale.

(2) The outline of the sheet to be used for stretching is a D-650 and an extension tape D-675 (Lintec (Adwill), which is generally used for the enamel wafer, and has a width of 300 mm. Thickness 80 μ m]. It is scribed as an appropriate length for use.

(3) Extension effect at the time of wafer splicing The 矽 wafer was attached to the scribe tape (D-675) and stretched by 15 mm in the X and Y directions, respectively. When the workpiece is stretched only in the sheet stretching direction (X direction), wrinkles will occur in the orthogonal direction (Y direction) of the sheet stretching direction (X direction) [Fig. 14 (a) ], but if the same direction is extended in the orthogonal direction, the wrinkling phenomenon will disappear [Fig. 14(b)].

When the workpiece is broken (broken by hand), a gap occurs at the break (Figure 15). The gap is approximately 340 μm. The fractured and opened gap tends to gradually expand over time, and after a few hours, new fractures are found in other locations, and the gap is confirmed to be narrower than the width previously started.

(4) The case where the workpiece is subjected to cross scoring is used to investigate the extension effect by the workpiece subjected to cross scribing. The extension distance is set to 15 mm. The result of breaking the X direction (breaking by hand) (Fig. 16) deviates from the scribe line, but a gap occurs at the break. In addition, a gap also appears in the cross direction, and the width is wider than the first break. It can be judged that it is affected by the order of extension. If the sheet is removed from the loop and placed for a few hours, the gap will shrink but will not become zero.

(5) In the case of the dicing tape D-675, the dicing tape material was changed to use the extension D-675, and an elongation fracture test was performed. The extension distance is set to 20 mm in both the X and Y directions. As a result of the fracture, the tension is released and a gap occurs in the place where both directions are broken. The width of the gap occurring in the stretching direction is expanded toward the X direction like the previous D-650 tape, and is slightly narrowed toward the Y direction. Because the vertical cracks generated by the scoring are shallow, the effect of breaking by hand is greater, and thus the deviation from the position of the score line is less. When the position of the score line can be broken, it can be broken in a straight line, no large fragmentation phenomenon is found at the edge portion, and no particle adhesion phenomenon is observed on the surface of the fractured workpiece (Fig. 17). Although it is difficult to say that the state of the split surface is broken by hand, it can be said that the straight angle is substantially good.

(6) Conclusion The results obtained in this test were organized as follows: It was confirmed that even the conventionally used dicing tape can be sufficiently extended.

A gap occurs at the break where the workpiece is broken.

When extending in a cross, although the tension is changed in the stretching order (X, Y), the effect of stretching can be found regardless of which direction.

After the cleavage and the transfer, since the workpieces did not rub against each other, no chipping occurred, and no adhesion of particles to the surface of the crucible was observed.

Since it is considered that a sufficient extension effect can be obtained in the scratch test, it is judged that a good quality split can be performed.

Hereinafter, a splitting device according to a fourth embodiment of the present invention will be described. Fig. 18 to Fig. 21 show a splitting device according to a fourth embodiment of the present invention. As shown in FIG. 18, a grid-shaped scribe line 52 is drawn in the vertical and horizontal directions by using a scriber in advance on the thin-plate-shaped semiconductor wafer as the workpiece 51. For example, a sharp-pointed corner tool (knife tip) or a freely rotating thin plate disk (wheel) is pushed against the surface of the workpiece, and the tools are moved along the surface of the workpiece 51, and the surface of the workpiece 51 is chiseled and scored. Line 52. It is also possible to cause the tool to vibrate while the tool is being extended by the workpiece 51.

(workpiece sticking step)

After the scribe line 52 is scored on the surface of the workpiece 51, as shown in Fig. 19(A), one side of the workpiece 51 on which the scribe line 52 has been scribed is set as the surface side, and the back surface of the workpiece 51 is attached. On the sheet 53. The sheet 53 is made of an adhesive resin product. For example, it is possible to use the same sheet for transporting the wafer-shaped semiconductor wafer as it is during transportation. The splitting device of the fourth embodiment is different from the splitting device of the first embodiment in that the sheet 53 has a tensile force applied thereto, and may not be applied.

As shown in Fig. 18, the workpiece 51 attached to the sheet 53 is placed on the middle-high splitting stage 55 with the sheet 53 as the back side. The splitting table 55 is formed in a semi-cylindrical shape, and a plurality of adsorption holes 56 as a means for adhering the sheets are formed on the surface. The suction hole 56 is connected to the suction path 57, and the suction path 57 is connected to the last suction port 58. Although the adsorption holes 56 in the central portion of the splitting table 55 are not shown in Fig. 18, a plurality of them are actually provided in the circumferential direction of the splitting table 55. The suction port 58 is connected to a vacuum pump (not shown), and sucks air from the suction port 58.

Fig. 20 is a plan view showing a semi-cylindrical split piece stage 55, and Fig. 21 is a rear view. The plurality of adsorption holes 56 are arranged at the highest portion of the splitter table 55 (on the line h1), and are arranged on the uppermost portion of not only the highest portion of the splitter stage 55 but also from the highest portion to the lower position (line h2) with a height difference. Figure 20 shows a row of adsorption holes 56 of the same height in the lateral direction. In the figure, W1 and W2 are plane shapes of circular workpieces having different sizes. The suction holes 56 are arranged around the suction workpiece 51 or away from the workpiece 51 only by sucking the sheet 53. Then, the adsorption holes 56 of the lower position column are arranged more than the higher position column. The adsorption holes 56 are connected to the suction grooves 59 formed on the back surface of the splitting table 55. As shown in Fig. 21, the suction groove 59 extends in the longitudinal direction and the lateral direction, and is connected to the last suction port 58. The splitting table 55 is placed on a base having a flat surface (not shown), and the surface between the abutment and the splitting table suction groove 59 serves as a path for sucking air.

(workpiece breaking step)

After the sheet 53 to which the workpiece 51 has been attached is placed on the splitting table 55, air is sucked from the suction port 58, and the suction hole 56 connected to the suction port 58 sucks air to make the sheet 53 adhere to each other. Splitting table 55. Because the narrower the distance between the sheet 53 and the splitting table 55, the pressure is more likely to decrease, so that it naturally proceeds from the higher position of the splitting table 55 toward the lower position, in other words, from the central portion of the workpiece 51 toward the two ends. The sheet 53 is sequentially adhered to the splitting stage 55. When the sheet 53 is in close contact with the splitting table 55, the workpiece 51 attached to the sheet 53 is bent along the splitting table 55 so that the score line 52 becomes curved outward as shown in Fig. 19(B). Accordingly, the workpiece 51 is subjected to a bending moment, and tensile stress is generated on one side of the workpiece 51 having the chiseled score line 52. By the tensile stress, the crack 54 progresses from the surface of the workpiece 51 toward the back surface to break the workpiece 51. Here, the workpiece 51 is broken during the stage in which the workpiece 51 is bent along the splitting table 55. Therefore, the workpiece 51 gradually breaks from the center portion toward the both end sides (if, in Fig. 18, from the highest portion of the semi-cylindrical split table 55, the right and left scribe lines 52 occur/propel fracture).

The reason why the sheet 53 is set to the back side of the workpiece 51 is as shown in Fig. 19, because the crack 54 is easier to advance the workpiece 51. It is assumed that if the sheet 53 is attached to the surface side of the workpiece 51, the sheet 53 will hinder the opening of the scribe line 52 due to its elastic force, thus causing the sipe to become difficult. Further, by setting the splitting table 55 to a semi-cylindrical shape and arranging the score line 52 of the workpiece 51 parallel to the splitting table center line 55a, stress acts on the normal direction of the bent workpiece 51. Therefore, it is possible to prevent the chipping of the fracture surface of the workpiece 51 from colliding with each other.

In the above-described breaking step, in the longitudinal and lateral scribe lines 52, the workpiece 51 is broken only in the longitudinal direction (in other words, the scribe line 52 parallel to the center line 55a of the lobing table 55). At the final stage of the fracture in one of the longitudinal and transverse directions, the workpiece 51 is broken into an elongated strip on the sheet 53 (strip strip breaking step). Next, the adsorption of the adsorption holes 56 is released, and the sheet 53 is retracted from the split table 55. Then, either the sheet 53 or the splitting table 55 is rotated 90 degrees (relatively rotating step) on a plane (for example, in a horizontal plane) including the sheet 53. Accordingly, the score line 52 of the other of the vertical and horizontal directions is parallel to the center line 55a of the split stage 55. Then, air is again sucked from the adsorption holes 56, and the workpiece 51 which has been broken into the elongated strips is again bent along the splitting table 55, and the workpiece 51 is broken into a plurality of wafers (wafer breaking step). By separating the workpiece breaking step into the elongated strip breaking step and the wafer breaking step, the workpiece 51 which has been scored with the longitudinal and transverse score lines can be broken into wafers without causing chipping.

FIG. 22 shows an example in which the stretchable sheet 53 is stretched in a state where the workpiece 51 is attached to the sheet 53. When the workpiece 51 is broken, if a tensile force is applied to the workpiece 51, the workpiece 51 will be pulled away while the workpiece 51 is broken, because gaps are left between the workpieces 51, so that the occurrence of fracture between the workpieces 51 can be further prevented. Contact situation. Therefore, as shown in FIG. 22, a tensile force may be applied to the stretchable sheet 53 in a state where the workpiece 51 is attached to the sheet 53 before the workpiece 51 is broken. Specifically, the periphery of the sheet 53 is stretched in the X direction and the Y direction, and a tensile force (tension t) is applied to the sheet 53 in the X direction and the Y direction. The frame member 60 is attached around the workpiece 51 while the tension t is maintained. A space is formed between the periphery of the workpiece 51 and the frame member 60, and tension is applied to the sheet 53 exposed around the workpiece 51. Further, when a tensile force is applied to the workpiece 51, the adsorption hole 56 is preferably disposed at a position where only the sheet 53 is adsorbed while avoiding the lower surface of the workpiece 51. The reason is that if the adsorption hole 56 is disposed under the workpiece 51, the tensile force of the sheet 53 is originally used to pull the fractured workpiece apart, but the adsorption of the adsorption hole 56 causes the workpiece 51 to be difficult to separate.

However, it is not known that there is a splitting device that can break a semiconductor wafer having a longitudinal and vertical score line 52 into a wafer. The reason is that at the stage of processing the workpiece 51 into a sliver, the remaining score lines 52 are not arranged in a straight line. When the cutting is performed by the blade, the misalignment is not possible. The positional relationship between the score line 52 and the blade and the blade holder must require high precision. When the workpiece 51 is rotated by 90 degrees, the blade cannot fall on the score line, resulting in Wafer. However, in the present embodiment, the step of breaking the elongated strip which can easily break the workpiece 51 into a slender strip, and the step of breaking the wafer by 90 degrees and the split is a wafer do not require the score line 52 to be in a straight line. Therefore, the lobes become wafers.

Another example of the adsorption hole 56 formed in the cleavage table 55 is shown in FIG. In this example, a groove 61 extending in the parallel direction of the center line 55a of the splitting table 55 is formed on the surface of the splitting table 55. The adsorption holes 56 are connected to the grooves 61, and the adsorption holes 56 in one row are grouped by the grooves 61. When the adsorption holes 56 are grouped by the grooves 61, the workpiece 51 can be uniformly adsorbed in the center line direction of the splitting table 55. Further, as shown in Fig. 24, in order to make the suction of the sheet 53 to the splitting table 55 stronger, it is also an effective method to surround the splitting table 55 with the casing 62.

Fig. 25 shows an example in which the suction holes 56 are sucked toward the lower position from the upper position, and the plurality of solenoid valves 63 are provided on the suction path 57. The plurality of adsorption holes 56 are arranged from the highest position in the center to the lower left and right positions. Therefore, the suction path 57 is provided in plurality with the height of the adsorption hole 56, and the plurality of adsorption holes 56 of the same height in the respective suction paths 57 are connected. A solenoid valve 63 is provided in each of the suction paths 57. The solenoid valve 63 is opened from the suction path 57 to which the adsorption hole 56 of the higher position is connected, and the suction path connected to the adsorption hole 56 at the lower position is sequentially opened. For example, as shown in Fig. 25, the solenoid valve 63 will be opened in the order of 1, 2, 3, ..., 7, and the like. When the electromagnetic valve 63 is provided, the workpiece 51 can be closely adhered to the splitting table 55 in order from the center portion of the workpiece 51 to the outside, and surely visually recognized.

Fig. 26 shows a splitting device according to a fifth embodiment of the present invention. In the present embodiment, the sheet material adhering means for adhering the sheet member 53 to the split sheet stage 55 is constituted by the sheet fixing table 14 and the sheet pushing mechanism. In other words, as shown in Fig. 26(A), the pair of sheet fixing stages 14 are placed to sandwich the splitting table 55, and the both ends of the sheet 53 are clamped by the sheet fixing table 14. Then, as shown in FIG. 26(B), the splitting table 55 is pushed up from the lower side toward the sheet 53 by the pushing mechanism, and the sheet 53 is brought into close contact with the splitting table 55. The pushing mechanism uses a well-known single-axis moving mechanism such as a ball screw. Further, since the movement of the sheet 53 against the sheet 53 is opposed, instead of pushing the splitting table 55 upward, the sheet fixing table 14 can be pushed down.

The sheet 53 is pushed against the splitting table 55 by the rise of the splitting table 55, and is bent along the surface of the splitting table 55. If the sheet 53 is in close contact with the splitting table 55, the workpiece 51 attached to the sheet 53 will also be bent along the splitting table 55. When the workpiece 51 is bent along the cleavage table 55, the workpiece 51 is broken. Therefore, the workpiece 51 gradually breaks from the center portion toward the both end sides, and the fractured workpiece 51 is in close contact with the cleavage table 55 in order. According to the above, the workpiece 51 is divided into elongated strips. After the workpiece 51 is divided into elongated strips, the splitting table 55 is retracted downward from the sheet 53, and the both ends of the sheet 53 are removed from the sheet fixing table 14. then. After the sheet 53 is rotated 90 degrees in the horizontal plane, the sheet 53 is again held on the sheet fixing table 14. Of course, instead of placing the sheet 53 on the sheet fixing table 14, a rotating mechanism for rotating the splitting table 55 at 90 degrees in the horizontal plane may be provided instead. Finally, the splitting table 55 is again pushed up to divide the workpiece 51 that has been divided into elongated strips into wafers.

According to the splitting device of the fifth embodiment, even if the adsorption hole 56 is not provided in the splitting table 55, the sheet 53 can be adhered to the splitting table 55. Further, when the sheet 53 is pushed up by the splitting table 55, since the tensile force acts on the sheet 53 naturally, it is possible to prevent the fracture surfaces between the broken workpieces 51 from rubbing against each other.

Another example of the splitting stage 65 shown in Figs. 27 and 28 is shown. Fig. 27 is a side view of the cleavage table 65, and Fig. 28 is a side view of the cleavage table 65. When the workpiece 51 is collectively divided into wafers at a time, the splitting table 65 may be formed as a part of the spherical surface as in the present example. In this case, in the plan view of the splitting stage shown in Fig. 28, the adsorption holes 66 are arranged concentrically around the highest portion C of the splitting stage 65. Then, the adsorption hole 66 is connected to the suction path 67, and the suction path 67 is communicated to one of the suction ports 68. When air is sucked from the suction hole 66, the workpiece 51 can be closely adhered to the splitting stage 65 from the center portion of the workpiece 51 toward the outer peripheral side.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention. For example, a workpiece can also replace a semiconductor wafer and use a thin glass substrate instead. In addition, in the step of attaching the workpiece, the workpiece may be attached to the sheet after the scribe line is scored in the workpiece, or the workpiece may be scribed on the workpiece after being attached to the sheet. Lined out. In addition, the semi-cylindrical split table can also be semi-cylindrical.

The present specification is Japanese Patent Application No. 2005-000554 filed on Jan. 5, 2005, Japanese Patent Application No. 2005-146551, filed on May 19, 2005, and Japanese Patent Application No. 2005-. Based on 373460. The content of these are all covered by the present invention.

1a, 1b. . . Support point

2, 5. . . Workpiece

3. . . Fragment head

5a. . . One side with a score line

5b. . . back

5c. . . Scribing

5d. . . crack

5e. . . Neutral axis

6a, 6b. . . Support point

9. . . Sheet

10, 11. . . Extension jig composed of fixed side and moving side (sheet stretching method)

14a, 14b. . . Tensioning mechanism composed of a platform (sheet stretching means)

12. . . Ring (frame member)

16. . . Split head (workpiece breaking means)

18. . . Machine

19. . . Knife

20. . . Scribing head (workpiece breaking means)

twenty one. . . Mobile agency

twenty two. . . Clamping clamp (sheet stretching method)

51. . . Workpiece

52. . . Scribing

53. . . Sheet

55, 65. . . Splitting table

55a. . . Splitting table centerline

56, 66. . . Adsorption hole (sheet adhesion means)

57, 67. . . Suction path

58, 68. . . Suction port

61. . . Trench

62. . . Box

63. . . The electromagnetic valve

64. . . Sheet fixing table (sheet bonding means)

71. . . Spherical support head

71a. . . Support head surface

71b. . . exhaust pipe

73. . . Press sheet

d. . . Notch groove

P. . . Tensile force

M. . . Bending moment

S1, S2. . . glass substrate

W. . . Glass substrate assembly

W1, W2. . . Circular workpiece

Fig. 1 is a schematic view showing a method of splitting a workpiece according to a first embodiment of the present invention.

Figure 2 is a graph of the bending stress occurring by the bending moment.

Fig. 3 is a schematic view showing a method of splitting a workpiece according to a second embodiment of the present invention.

4(A) to (D) are schematic views showing a method of applying a tensile force to a workpiece using a sheet.

Fig. 5 is a perspective view showing a splitting device according to a first embodiment of the present invention.

Figure 6 is a perspective view of a tensioning mechanism for applying a tensile force to a workpiece.

Fig. 7 is a view showing a crack generated by a splitting device (Fig. (A) shows a case where the splitting device of the present embodiment is used, and Fig. (B) shows a case where a conventional splitting device is used in a comparative example).

Fig. 8 is a perspective view showing a scribing device having a splitting function according to a second embodiment of the present invention.

Fig. 9 is a view showing the scribing device of the above-mentioned Fig. 8 (Fig. (A) is a plan view, and Fig. (B) is a side view).

Fig. 10 is a view showing a crack generated by the scribing device having the splitting function shown in Fig. 8 (Fig. (A) shows the use of the scribing device of the present embodiment, and Fig. (B) shows the conventional scribing for the comparative example. The situation of the device).

Fig. 11 is a perspective view showing a scribing device having a splitting function according to a third embodiment of the present invention.

Fig. 12 is a view showing a crack generated by the scribing device having the splitting function shown in Fig. 11 (Fig. (A) shows the use of the scribing device of the present embodiment, and Fig. (B) is used in the comparative example. The case of a conventional scoring device).

Figure 13 is an external view of the extension jig.

Fig. 14 (a) and (b) are photographs showing the state of sheet stretching by a trial jig.

Fig. 15 (a) and (b) are photographs of the ruthenium wafer fracture in an extended state.

Figure 16 is a broken (D-650) diagram of a cross score.

Fig. 17 (a) to (c) are photographs of the surface state (D-675) of the workpiece after the fracture.

Figure 18 is a perspective view showing a splitting device according to a fourth embodiment of the present invention.

Fig. 19 is a cross-sectional view showing a state in which a workpiece is attached to a sheet (Fig. (A) shows a state before the workpiece is bent, and Fig. (B) shows a state where the workpiece is bent).

Figure 20 is a top plan view of a semi-cylindrical split table.

Figure 21 is a bottom plan view of the splitting stage shown in Figure 20.

Fig. 22 is a schematic perspective view showing an example in which a stretchable sheet is stretched in a state in which a workpiece is attached to a sheet.

Fig. 23 is a plan view showing another example of the adsorption holes formed in the split stage.

Fig. 24 is a schematic perspective view showing an example in which a splitting table is surrounded by a casing.

Fig. 25 is a schematic perspective view showing an example in which a solenoid valve is provided on a suction path.

Fig. 26 is a perspective view showing a splitting device according to a fifth embodiment of the present invention (Fig. (A) is a stage in which the sheet is pushed up, and Fig. (B) is a step in which the sheet is pushed up).

Figure 27 is a side elevational view of a spherical shaped splitter table.

Figure 28 is a plan view of a spherical shaped splitting table.

Figure 29 is a schematic diagram of a conventional splitting method.

Figure 30 is a cross-sectional view of a conventional splitting device (Fig. (A) is before the workpiece is adsorbed, and Figure (B) is after the workpiece is adsorbed).

5. . . Workpiece

5c. . . Scribing

16. . . Split head

twenty three. . . Machine

M. . . Bending moment

P. . . Tensile force

Claims (10)

A method for splitting a workpiece, which is a method for splitting a workpiece having a surface with a scored workpiece broken along a score line, characterized in that: a workpiece pasting step is performed, and the back surface of the workpiece is attached to the stretchable sheet a sheet stretching step of stretching the sheet to which the workpiece is attached by a sheet stretching means; and a frame member attaching step of the sheet by the sheet stretching means a state in which the material is stretched, a gap is left around the workpiece, and the frame member is attached to the sheet, and the tension of the sheet is restricted to the frame member; and a workpiece breaking step is performed on the sheet When the tension of the material is limited to the inside of the frame member, the scribe line reaches the back surface of the workpiece; wherein the broken workpiece is separated by the tensile force of the sheet. The splitting method of the workpiece according to the first aspect of the invention, wherein the workpiece breaking step is: bending the workpiece so that the surface side of the workpiece becomes the outer side of the bending in a state in which the sheet is stretched. This causes the above-mentioned score line to reach the back surface of the above workpiece. A splitting device for a workpiece, which is a splitting device for a workpiece whose surface is scored with a scored workpiece along a score line, characterized in that: a frame member is provided for the workpiece by means of sheet stretching Attached on the back a state in which the stretchable sheet is stretched, a gap is left around the workpiece to be attached to the sheet, and a workpiece breaking means is used to restrict the tension of the sheet to the frame member. Next, the scribe line is brought to the back surface of the workpiece; wherein the fractured workpiece is separated by the tensile force of the sheet. A method for scribing and splitting a workpiece, which is a method for scribing and splitting a workpiece by performing a scribe line on the surface of the workpiece while scribing the workpiece along the scribe line, characterized in that: a workpiece pasting step is provided, Attaching a workpiece to a stretchable sheet; a sheet stretching step of stretching the sheet to which the workpiece is attached; and a step of breaking the sheet, in a state in which the sheet is stretched, The surface of the workpiece is scored with a scribe line, and at the same time, the scribe line on the surface of the workpiece reaches the back surface of the workpiece; wherein the fractured workpiece is separated by the tensile force of the sheet. A scribing device with a splitting function, which is a scribing device for severing a workpiece with a scribe line on the surface of the workpiece, and is characterized by a sheet stretching method. And stretching the stretchable sheet to which the workpiece is attached; and a workpiece breaking means for scribing the surface of the workpiece in a state where the sheet is stretched, and simultaneously making the above The above engraving of the surface of the workpiece The scribe line reaches the back surface of the workpiece to break the workpiece; wherein the fractured workpiece is separated by the tensile force of the sheet. A method for splitting a workpiece, which is a method for dicing a workpiece with a scribed line on a surface, and a rupture of the workpiece along the scribe line, characterized in that: a workpiece pasting step is performed, and the back surface of the workpiece is attached to the sheet And a workpiece breaking step of adhering the sheet to the splitting table and bending the workpiece so that the surface of the workpiece becomes a curved outer side, thereby causing the scribe line on the surface of the workpiece to reach the back surface of the workpiece And rupturing the workpiece; and the plurality of adsorption holes for sucking air are arranged at a height difference from a higher position of the cleavage table toward a lower position, and the sheet is adsorbed by the adsorption hole. In this way, the workpiece is adhered to the splitting table, and the plurality of adsorption holes are arranged so as to avoid only the back surface of the workpiece and adsorb only the sheet. The splitting method of the workpiece according to the sixth aspect of the invention, wherein the workpiece breaking step is provided with: a slender strip breaking step, wherein the workpiece is longitudinally and horizontally scored with a plurality of lines, and is bent along the splitting table to make the above Breaking the workpiece into a plurality of elongated strips; wherein the sheet is retracted from the splitting table, and the sheet is rotated relative to the splitting table by a relative rotation of 90 degrees in a plane containing the sheet; A chip breaking step of re-bending the workpiece that has been broken into elongated strips along the splitting table to break the workpiece into a plurality of wafers. A splitting device for a workpiece, which is a splitting device for scribing a workpiece with a score on a surface, and a workpiece that is broken along the score line, characterized in that: a splittable table for bending the workpiece; and a sheet a bonding means for adhering a sheet to which the back surface of the workpiece is attached to the splitting stage, and bending the workpiece so that the surface of the workpiece becomes a curved outer side; wherein the scribe line of the surface of the workpiece reaches the above Forming the back surface of the workpiece to break the workpiece, and the adhesion means are arranged with a height difference from a higher position of the splitting stage toward a lower position, and have a plurality of adsorption holes for sucking air, and the sheet is used by the adsorption hole The material is adsorbed, whereby the workpiece is adhered to the splitting table, and the plurality of adsorption holes are arranged so as to avoid only the back surface of the workpiece and adsorb only the sheet. A splitting device for a workpiece, which is a splitting device for scribing a workpiece with a score on a surface, and a workpiece that is broken along the score line, characterized in that: a splittable table for bending the workpiece; and a sheet a bonding means for adhering a sheet to which the back surface of the workpiece is attached to the splitting table so that the surface of the workpiece becomes a curved outer side The workpiece is bent; wherein the scribe line on the surface of the workpiece reaches the back surface of the workpiece to break the workpiece, and the adhesion means are arranged at a height difference from a higher position of the cleavage table toward a lower position. And a plurality of adsorption holes for sucking air, wherein the sheet is adsorbed by the adsorption holes, whereby the workpiece is adhered to the splitting table, and the adhesion means further includes: a plurality of electromagnetic valves, which are from a higher position The suction holes are sequentially sucked into the air toward the lower position. The splitting device of the workpiece of claim 8 or 9, wherein the splitting device causes the workpiece to be scribed with a plurality of scribe lines in a longitudinal and transverse direction, and is bent along the splitting table to break the workpiece into a plurality of elongated strips. And the sheet retracted from the splitting table is rotated relative to the splitting table in a plane containing the sheet by 90 degrees, and then the workpiece broken into a sliver is bent again along the splitting table. The workpiece is broken into a plurality of wafers.