TWI417704B - Heat sink structure and method of improvement thereof - Google Patents

Description

Radiator structure and improved method thereof

A heat sink structure, in particular a stamped heat sink structure and an improved method thereof.

With the advancement of technology, the development trend of all electronic devices is toward a thinner direction. For example, a computer mainframe or a notebook computer is also moving toward a light and thin volume. At the same time, with these thin electronic devices, the user can not only save the space occupied by the electronic device, but also facilitate the carrying and operation of the user.

However, the current electronic devices on the market, such as notebook computers, tend to be thinner, but the heat dissipation problem of their notebook computers is one of the major obstacles to the development of thinning. The reason is that in order to improve and increase the heat dissipation effect of the notebook computer, most notebook computers or other electronic devices will be equipped with a heat sink module to enhance the heat dissipation effect of the electronic device. The thermal module of a typical notebook computer includes a copper block, a spring piece, a heat pipe, a heat sink fin, and a fan that are in contact with the wafer in the electronic device. Therefore, in the assembly process, the heat dissipating components of the wafer, the copper block, the shrapnel, the heat pipe, and the like are stacked too high, and the electronic device must increase its easy space to cover the assembled heat dissipating component. Accordingly, the electronic device as a whole is in a state of increasing volume, which is contrary to the demand for thinning products.

In order to solve the problem of excessive stacking of the heat dissipation module, the stacking height is also reduced by the technique of the eccentric device, and the copper block contacting the heat source is extended from the other end to connect the heat pipes, so that the heat pipes are not stacked with the heat source. Although it can directly reduce the height of the stack, it generates a considerable thermal resistance between the ends of the copper block extension. Therefore, although the eccentric device can reduce the stack height, it also sacrifices the heat dissipation module. The heat transfer performance.

Therefore, how to improve the stacking height of the heat-dissipating module can improve the convenience in the development of thinning, and at the same time maintain good heat-dissipating effect, which is the inventor of the case and the technical field of the related industry. The subject of improvement.

In view of this, the present invention provides a heat sink structure for contacting a heat source, and the heat sink structure includes a heat pipe, wherein the heat pipe includes a heat insulating portion, a heat receiving end, and a heat radiating end. The heated end is formed by stamping one end of the heat insulating section, the thickness of the heated end is smaller than the thickness of the heat insulating section for contacting the heat source; and the heat radiating end is connected to the heat insulating section. Wherein, the heated end is formed by stamping one end of the heat insulating section, and a solid sheet body is formed.

In addition, the embodiment of the invention further includes a fin located at the heat dissipation end. The fins are formed by extending the heat dissipation end. And a fastening portion that fastens the heat receiving end to the heat source.

The invention also provides a method for improving the structure of a heat sink, comprising: providing a heat pipe; forming a heat receiving end at one end of the heat pipe, a heat radiating end at the other end of the heat pipe, and a heat insulating portion between the heat radiating end and the heat receiving end, wherein the thickness of the heat receiving end is smaller than The thickness of the adiabatic section; and the heat source is cooled by contacting the heat source with the heat receiving end. Wherein, in the step of stamping the heat pipe, the heated end is stamped into a solid piece.

In the embodiment of the present invention, after the step of providing the heat pipe, the method further includes: providing a fin disposed on the heat dissipation end. The fins are formed by extending the heat dissipation end. After the step of contacting the heat source with the heat receiving end, the method further comprises: providing a fastening portion for fastening the heat receiving end to the heat source.

The heat sink structure improvement method of the present invention forms a heat receiving end by punching one end of the heat insulating section, and the heated end is stamped to form a solid sheet body, so that the thickness of the heat receiving end is smaller than the thickness of the heat insulating section. Therefore, the height of the heat sink structure in assembly can be reduced. Moreover, by forming a solid sheet body by punching the heated end, not only the strength of the heated end can be increased, but also the function of the copper block in the prior art can be replaced, and a good heat dissipation effect is maintained.

The detailed features and advantages of the present invention are described in detail in the embodiments of the present invention. The objects and advantages associated with the present invention can be readily understood by those skilled in the art.

Please refer to FIG. 1 , which is a schematic view of a heat pipe of the present invention. It is a heat sink structure disclosed in the present invention for contacting a heat source, including a heat pipe 10, wherein the heat pipe 10 includes a heat insulating portion 20, a heat receiving end 30 and a heat radiating end 40.

Please refer to FIG. 1 and FIG. 2 , FIG. 1 is a schematic view of a heat pipe of the present invention, and FIG. 2 is a schematic view of a heat receiving end and a heat insulating section of the present invention. The heat insulating section 20 has a substantially elongated shape. In the present invention, the heat insulating section 20 is slightly flat. However, the present invention is not limited thereto, and the shape of the heat insulating section 20 may be a columnar shape. In addition, the heat insulating section 20 is mainly a vacuum-sealed tubular casing, and the inner wall of the casing is provided with a capillary structure such as a powder sintered body, a groove structure and a wire mesh structure. However, the previously described thermal insulation section 20 is preferably made of metal, such as copper, aluminum or other materials having good thermal conductivity.

The heated end 30 is coupled to one end of the insulating section 20, which is preferably formed by stamping one end of the insulating section 20 such that the thickness of the heated end 30 is less than the thickness of the insulating section 20. In the present invention, the heat insulating end 20 is flat, and then one end of the heat insulating end 20 is flattened by force, and the inside of the tubular shell is compressed to have no space and is solid. The heated end 30 will exhibit a thickness that is less than the adiabatic section 20.

The heat dissipation end 40 is a substantially elongated structure connected to the other end of the heat insulating section 20 such that one end of the heat insulating section 20 is the heat receiving end 30 and the other end is the heat radiating end 40. In the present invention, the heat dissipating end 40 is preferably integrally formed with the heat insulating portion 20, and the heat receiving end 30 is also integrally formed with the heat insulating portion 20, but the invention is not limited thereto. Therefore, the heat dissipation end 40 of the present invention is formed by bending the other end of the heat insulating section 20, and is divided into two sections of the heat dissipation end 40 and the heat insulating section 20 by the bending portion, so that the heat dissipation end 40 and the heat insulating section 20 are substantially L. The shape. Furthermore, the present invention further has fins 50 located on the heat dissipating end 40. The fins 50 can also be made of materials having good thermal conductivity and arranged at intervals. The fins 50 may also be extended by the heat dissipation end 40, but the invention is not limited thereto.

Please refer to FIG. 3 and FIG. 4, FIG. 3 is an exploded view of an embodiment of the present invention, and FIG. 4 is an overall structural view of the present invention. The engaging portion 60 has a structure of a rectangular shape. One of the surface portions of the engaging portion 60 is a concave portion, and the other surface is convex. Therefore, the fastening portion 60 has a substantially U-shaped structure, and the heat receiving end 30 is fastened to the concave portion by the U-shaped concave portion. In addition, the outer side of the fastening portion 60 can extend out of the fastening support member 61. The number of the fastening support members 61 is preferably four, and is disposed at the four end points of the fastening portion 60 to form a cross. The present invention is not limited thereto, and the present invention is not limited thereto, and any of the heat-receiving ends 30 can be used in the scope of the present invention. However, the heat source described above may be a computer chip or other electronic component, but the invention is not limited thereto.

Referring to FIG. 5, FIG. 5 is a flow chart of a method for improving the structure of the heat sink of the present invention, comprising the following steps: Step 501: Providing a heat pipe.

The heat pipe 10 (refer to Fig. 1) has a substantially elongated structure and is slightly flat. However, the present invention is not limited thereto, and the heat pipe 10 may have a cylindrical shape. The heat pipe 10 is mainly a vacuum-sealed tubular casing, and the inner wall of the casing is provided with a capillary structure such as a powder sintered body, a groove structure and a wire mesh structure.

Step 502: One end of the stamping heat pipe forms a heat receiving end, and the other end of the heat pipe is a heat radiating end, and a heat insulating section is between the heat radiating end and the heat receiving end, wherein the thickness of the heat receiving end is smaller than the thickness of the heat insulating section.

The heat pipe 10 is mainly composed of a heat insulating section 20, a heat receiving end 30 and a heat radiating end 40. The heat pipe 30 is formed at one end of the heat pipe 10 and the heat radiating end 40 is disposed at the other end. The ground system is integrally formed, but the invention is not limited thereto. Furthermore, the heated end 30 is flattened by a force stamping method, and the inside of the tubular casing is compressed to have no space to form a solid sheet. Therefore, the thickness of the heated end 30 will be smaller than that of the insulating section 20.

After the step 501 of providing the heat pipe, the method further includes: providing a fin disposed on the heat dissipation end.

The invention further has a fin 50 located on the heat dissipation end 40. The fin 50 can be made of a material with good thermal conductivity and arranged at intervals, or can be extended by the heat dissipation end 40, but the invention is not Limited.

Step 503: Dissipating heat to the heat source by contacting the heat source with the heat receiving end.

The heat source can be a chip or other electronic component of the computer by the heat receiving end 30. However, the present invention is not limited thereto, and simultaneously transfers heat energy to the heat radiating end 40 for heat dissipation when contacting the heat source.

Step 504: Provide a fastening portion, and fasten the heat receiving end to the heat source.

The heat receiving end 30 is fastened to the heat sink 30 by engaging the heat receiving end with the heat receiving end by engaging the heat receiving end with the heat receiving end.

In the present invention, an appropriate amount of liquid such as water, ethanol, acetone or the like is charged inside the adiabatic section. The fluid is vaporized by heat at the heated end. The vapor fluid can absorb a large amount of heat energy due to the latent heat generated by the phase change. The vapor fluid condenses into a liquid at the heat radiating end due to the exothermic effect and the fins enhance the exothermic effect, and is carried by gravity or in the shell. Under the action of capillary force, it is continuously circulated again to complete the heat dissipation effect, and the heated end is formed into a flat solid by pressing, which reduces the thickness and also increases the strength, so that the heated end can replace the function of the copper block in the prior art, and maintains the good function. The heat dissipation effect and the reduction of the copper block during assembly can further reduce the height of the heat sink structure in assembly.

Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention are encompassed by the present invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

10‧‧‧heat pipe

20‧‧‧Adiabatic section

30‧‧‧heated end

40‧‧‧heating end

50‧‧‧Fins

60‧‧‧Deduction Department

61‧‧‧Bucking support

Figure 1 is a schematic view of a heat pipe of the present invention.

Figure 2 is a schematic view of the heated end and the adiabatic section of the present invention.

Figure 3 is an exploded view of an embodiment of the present invention.

Figure 4 is an overall structural view of the present invention.

Fig. 5 is a flow chart showing a method for improving the structure of the heat sink of the present invention.

10. . . Heat pipe

20. . . Adiabatic section

30. . . Heated end

40. . . Heat sink

50. . . Fin

60. . . Buckle

61. . . Buckle support

Claims (11)

A heat sink structure for contacting a heat source comprises: a heat pipe comprising: a heat insulating section; a heat receiving end connected to one end of the heat insulating section, the heat receiving end having a thickness smaller than a thickness of the heat insulating section for contacting the heat sink a heat source, wherein the heated end is a solid piece; and a heat radiating end is connected to the other end of the heat insulating section. The heat sink structure of claim 1 further comprises a fin located at the heat dissipation end. The heat sink structure of claim 2, wherein the fin is extended from the heat dissipation end. The heat sink structure of claim 1, wherein the heat receiving end, the heat insulating portion and the heat dissipating end are integrally formed. The heat sink structure of claim 1, further comprising a fastening portion for fastening the heat receiving end to the heat source. The heat sink structure of claim 1, wherein the heated end is formed by stamping from one end of the heat insulating section. A heat sink structure improvement method includes: providing a heat pipe; stamping one end of the heat pipe to form a heat receiving end; the other end of the heat pipe is a heat radiating end, wherein the heat radiating end and the heat receiving end are an adiabatic section, wherein The thickness of the heated end is less than the thickness of the insulating segment, and the heated end is a solid piece; and the heated end contacts a heat source to dissipate heat from the heat source. The heat sink structure improvement method of claim 7, wherein after the step of providing the heat pipe, the method further comprises: providing a fin disposed on the heat dissipation end. The method of improving the heat sink structure of claim 8, wherein the fin is formed by the heat dissipating end. The method of improving the heat sink structure of claim 7, wherein after the step of contacting the heat source with the heat receiving end, the method further comprises: providing a fastening portion for fastening the heat receiving end to the heat source. The heat sink structure improvement method of claim 7, wherein the heat receiving end, the heat insulating portion, and the heat dissipating end are integrally formed.