TWI406615B - - Google Patents
Info
- Publication number
- TWI406615B TWI406615B TW99124099A TW99124099A TWI406615B TW I406615 B TWI406615 B TW I406615B TW 99124099 A TW99124099 A TW 99124099A TW 99124099 A TW99124099 A TW 99124099A TW I406615 B TWI406615 B TW I406615B
- Authority
- TW
- Taiwan
- Prior art keywords
- burrs
- aluminum substrate
- solder mask
- aluminum
- etchant
- Prior art date
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 5
- 229910052782 aluminium Inorganic materials 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 230000002378 acidificating effect Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000011241 protective layer Substances 0.000 abstract 1
Landscapes
- ing And Chemical Polishing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Disclosed is a burrs removing method for an aluminum printed circuit board, which includes a carrying unit having an aluminum substrate, a circuit layout layer and a solder mask in which the aluminum substrate has not gone through burrs removal since its first formation; a protective layer for protection disposed on one side of the aluminum substrate and one side of the solder mask respectively; and an etchant selected among acidic etchants or alkaline etchants, wherein said etchant can remove the burrs around the aluminum substrate. Hereby, the effects of removing the burrs easily, increasing the process yield rate and reducing the manufacture costs can be realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99124099A TW201206278A (en) | 2010-07-22 | 2010-07-22 | Burrs removing method for aluminum printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99124099A TW201206278A (en) | 2010-07-22 | 2010-07-22 | Burrs removing method for aluminum printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201206278A TW201206278A (en) | 2012-02-01 |
| TWI406615B true TWI406615B (en) | 2013-08-21 |
Family
ID=46761895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99124099A TW201206278A (en) | 2010-07-22 | 2010-07-22 | Burrs removing method for aluminum printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201206278A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI859904B (en) * | 2023-06-02 | 2024-10-21 | 京湛機械有限公司 | Hemming device capable of instantly responding to workpiece size and combination having the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200541430A (en) * | 2004-06-07 | 2005-12-16 | Advanced Semiconductor Eng | Method for making a circuit board |
| TW201021346A (en) * | 2008-11-28 | 2010-06-01 | Cyntec Co Ltd | Over-voltage protecting device and method for making thereof |
-
2010
- 2010-07-22 TW TW99124099A patent/TW201206278A/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200541430A (en) * | 2004-06-07 | 2005-12-16 | Advanced Semiconductor Eng | Method for making a circuit board |
| TW201021346A (en) * | 2008-11-28 | 2010-06-01 | Cyntec Co Ltd | Over-voltage protecting device and method for making thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201206278A (en) | 2012-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |