工 380609 ___ '0 '* 100年.09月27日接正替換頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係關於一種電路板組合。 【先前技術】 [0002] 習知電珞板系統一般包括有母板（也稱母卡、主卡或主 機板）及複數子板。每一母板及每一子板分別包括有電 源層、接地層及信號層。母板一般採用無源設計且結構 固定；子板則係透過可插拔之連接器與母板電性連接》 在母板與子板之間之信號互連方面，如果母板與子板之 位置相互垂直，母板可採用直公（straight male)連 接器，而子板一般採用彎母（right angle female) 連接器。如果母板與子板處於同一平面，母板及子板可 採用彎公（right angle male)和彎母（right angle female)連接器達成電性連接。母板與子板採用 之連接器中分別對應包括有接地端子、電源端子及信號 端子。如中國大陸專利第0213 0034. 8號所揭示之技術内 容。 [0003] 當電腦主頻頻率較低時，一般不會因爲接地不良或電壓 供給不穩而影響電路板信號傳輸之正確性，以及使積體 電路操作不正常。但，當電腦之主頻達到數百MHz(百萬 赫茲）之高頻時，僅靠連接器中數量有限之端子提供電源 或進行接地，這易造成電源與接地迴路之不足，從而使 得傳輸信號不穩’以及使電磁干擾（EMI)無法宣洩。 【發明内容】 [0004] 有黎於此’有必要提供一種增加電流迴路之電路板組合 095114423 表單編號A0101 第3頁/共12頁 1003353102-0 1380609 100年〇9月 2 7Θ [0005] [0006] 一種電路板組合，其包括/母板、—子板及至少一彈片 ，該子板透過連接器與該母板電性連接，該母板包括至 少一焊墊，該子板對應包枯至·少一焊墊’該彈片之兩端 分別與該母板及該子板之焊勢電性連接。 該母板及該子板之間透過金廣彈片增加母板與子板間電 源與接地迴路數量，從而穩定了傳輪信號。該母板及該 子板之間透過金屬彈片亦同時增加了接地面積，可更有 效地防電磁干擾（EMI )。 [0007] [0008] [0009] [0010] 【實施方式】 請參考圖1，本發明電路板組合之較佳實施方式包括一母 板1、一子板2、一第一彈片3及一第二彈片4 » 該母板1設有一電源焊塾10及一接地焊塾14。該電源焊塾 10電性連接於該母板1之電源層；該接地焊塾14電性連接 於該母板1之接地層；該母板1設有一連接器u。 該子板2對應設有一電源焊墊20及一接地焊墊24。該電源 焊塾20電性連接於該子板2之電源層；該接地焊塾24電性 連接於該子板2之接地層。該子板2上設有一可與該母板ι 之連接器11電性連接之連接器21。 該第一彈片3與該第二彈片4係選用導電性能優良及彈性 好之金屑封料彎折製成，該第一彈片3及該第二彈片4分 別包括-大致则之部32、42及—平直之固定部Μ [0011] 095114423 請參考圖2， 表單编號A0101 該連接器21可插置於該連接 第4頁/共12頁 1003353102-0 1380609 I t f 1100年09月巧 片3之固定部31焊接在該母板丨之電源焊墊i〇，其彈性^^ 32彈性抵接在該子板2之電源焊墊20上。該第二彈片4之 固定部41焊接在該母板2之接地焊墊14，其彈性部42彈性 抵接在該子板2之接地焊墊24上。該第一彈片3及第二彈 片4相當於分別增加該母板丨及該子板2之間電源及接地迴 路，以更好地穩定電路。同時亦增加了接地面積可防電 磁干擾。可設置複數該第一彈片3及該第二彈片4，以更 好穩定電源及加強接地。本實施例中，該固定部31、41 亦可焊接於該子板2之焊墊20、24上，而該彈性部32、 4 2抵接在該母板1之焊塾* 1 〇、14上。 [0012]圖3及圖4係本發明電路板組合之其他較佳實施方式。圖3 僅係用於穩定電源，該彈片5—端係焊接在該母板1之電 源焊墊10上，另一端彈性抵接在該子板2之電源焊墊2〇上 。圖4僅係用於增強接地，該彈片6一端係焊接在該子板2 之接地焊墊24上，另一端彈性抵接在該母板丨之接地焊墊 14上。 [0013] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請》惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0014] 圖1係本發明電路板組合之較佳實施方式之示意分解圖。 [0015] 圖2係圖1之組裝圖。 [0016] 圖3及圖4係本發明電路板組合之其他較佳實施方式之示 095114423 表單編號A0101 第5頁/共12頁 1003353102-0 1380609 100:年09月27日按正雜百· 意圖。 【主要元件符號說明】 [0017] 母板：1 [0018] 子板：2 [0019] 第一彈片：3 [0020] 第二彈片：4 [0021] 電源焊墊：10、20 [0022] 連接器：11、21 [0023] 接地焊墊：14、24 [0024] 彈性部：32、42 [0025] 彈片：5、6 [0026] 固定部：31、41 095114423 表單编號A0101 第6頁/共12頁 1003353102-0380609 ___ '0 '* 100 years. September 27th replacement page 6. Description of the invention: [Technical Field of the Invention] [0001] The present invention relates to a circuit board assembly. [Prior Art] [0002] The conventional electric raft system generally includes a mother board (also referred to as a mother card, a main card or a main board) and a plurality of sub-boards. Each of the motherboards and each of the daughter boards includes a power layer, a ground layer, and a signal layer. The motherboard is generally passively designed and fixed in structure; the daughter board is electrically connected to the motherboard through a pluggable connector. In terms of signal interconnection between the motherboard and the daughter board, if the motherboard and the daughter board are The positions are perpendicular to each other, the motherboard can be a straight male connector, and the daughter board generally uses a right angle female connector. If the motherboard and the daughter board are in the same plane, the mother board and the daughter board can be electrically connected by a right angle male and a right angle female connector. The connector used in the motherboard and the sub-board respectively includes a ground terminal, a power terminal, and a signal terminal. For example, the technical content disclosed in Chinese Patent No. 0213 0034. [0003] When the main frequency of the computer is low, it is generally not affected by the poor grounding or the unstable voltage supply, which affects the correctness of the signal transmission of the circuit board and the abnormal operation of the integrated circuit. However, when the main frequency of the computer reaches a high frequency of several hundred MHz (million Hz), only a limited number of terminals in the connector provide power or ground, which may cause a shortage of power and ground loops, thereby transmitting signals. Unstable 'and make electromagnetic interference (EMI) unable to vent. SUMMARY OF THE INVENTION [0004] There is a need to provide a circuit board combination 095114423 to increase the current loop Form No. A0101 Page 3 / Total 12 Page 1003353102-0 1380609 100 years 〇 September 2 7Θ [0005] [0006 a circuit board assembly comprising: a mother board, a daughter board, and at least one elastic piece, the daughter board being electrically connected to the motherboard through a connector, the motherboard comprising at least one solder pad, the daughter board corresponding to the package · One less pad' The two ends of the shrapnel are electrically connected to the soldering potential of the motherboard and the sub-board, respectively. The mother and the sub-board pass through the Jinguang shrapnel to increase the number of power and ground loops between the motherboard and the sub-board, thereby stabilizing the transmission signal. The metal shrapnel between the motherboard and the sub-board also increases the ground contact area, which is more effective against electromagnetic interference (EMI). [0009] [0010] [Embodiment] Referring to FIG. 1, a preferred embodiment of a circuit board assembly of the present invention includes a motherboard 1, a daughter board 2, a first spring 3, and a first Two shrapnel 4 » The motherboard 1 is provided with a power pad 10 and a ground pad 14 . The power supply pad 10 is electrically connected to the power layer of the motherboard 1; the ground pad 14 is electrically connected to the ground layer of the motherboard 1; the motherboard 1 is provided with a connector u. The sub-board 2 is provided with a power pad 20 and a ground pad 24 . The power pad 20 is electrically connected to the power layer of the sub-board 2; the ground pad 24 is electrically connected to the ground layer of the sub-board 2. The sub-board 2 is provided with a connector 21 electrically connectable to the connector 11 of the motherboard ι. The first elastic piece 3 and the second elastic piece 4 are formed by bending a gold filing material with excellent electrical conductivity and elasticity. The first elastic piece 3 and the second elastic piece 4 respectively include a substantially portion 32, 42. And - straight fixed part Μ [0011] 095114423 Please refer to Figure 2, form number A0101 This connector 21 can be inserted in the connection page 4 / total 12 pages 1003353102-0 1380609 I tf 1100 September 09 The fixing portion 31 of the 3 is soldered to the power pad i of the motherboard, and the elastic member 32 is elastically abutted on the power pad 20 of the daughter board 2. The fixing portion 41 of the second elastic piece 4 is soldered to the ground pad 14 of the motherboard 2, and the elastic portion 42 elastically abuts against the ground pad 24 of the sub-board 2. The first elastic piece 3 and the second elastic piece 4 are equivalent to respectively increasing the power supply and the grounding circuit between the mother board and the sub-board 2 to better stabilize the circuit. At the same time, the grounding area is also increased to prevent electromagnetic interference. A plurality of the first elastic piece 3 and the second elastic piece 4 may be disposed to better stabilize the power supply and strengthen the grounding. In this embodiment, the fixing portions 31, 41 can also be soldered to the pads 20, 24 of the daughter board 2, and the elastic portions 32, 42 abut the soldering pads * 1 〇, 14 of the motherboard 1. on. [0012] Figures 3 and 4 are other preferred embodiments of the circuit board assembly of the present invention. FIG. 3 is only used for stabilizing the power supply. The spring 5 is soldered to the power pad 10 of the motherboard 1 and the other end is elastically abutted on the power pad 2 of the daughter board 2. 4 is only used to enhance the grounding. The elastic piece 6 is soldered to the ground pad 24 of the sub-board 2 at one end, and the other end is elastically abutted on the ground pad 14 of the motherboard. [0013] In summary, the present invention meets the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and those who are familiar with the skill of the present invention are in accordance with the spirit of the present invention. Equivalent modifications or variations are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0014] FIG. 1 is a schematic exploded view of a preferred embodiment of a circuit board assembly of the present invention. 2 is an assembled view of FIG. 1. 3 and FIG. 4 show another preferred embodiment of the circuit board assembly of the present invention. 095114423 Form No. A0101 Page 5 / Total 12 Page 1003353102-0 1380609 100: September 27th, according to the original . [Main component symbol description] [0017] Motherboard: 1 [0018] Daughter board: 2 [0019] First shrapnel: 3 [0020] Second shrapnel: 4 [0021] Power pad: 10, 20 [0022] Connection Device: 11, 21 [0023] Grounding pad: 14, 24 [0024] Elastic part: 32, 42 [0025] Shrapnel: 5, 6 [0026] Fixed part: 31, 41 095114423 Form No. A0101 Page 6 / Total 12 pages 1003353102-0