1376185 101年.08月0>日修正替換頁 六、發明說明： 【發明奸屬之技術領域】 [0001] 本發明涉及一種電子裝置殼體及其製造方法。 【先前技術】 [0002] 隨著電子技術之迅速發展，筆記本電腦、移動電話、個 人數位助理（PDA)等電子裝置得到了越來越廣泛地應用 。同時，人們對於電子裝置之外觀要求亦越來越高。電 子裝置殼體一般由金屬或塑膠製成，由於金屬殼體具有 強度高、電磁遮罩效果好等特點而被廣泛應用於電子裝 置中。 [0003] 當採用金屬殼體時，為了防止電磁遮罩影響信號收發， 電子裝置殼體之天線蓋部位通常採用塑膠製造，然後藉 由卡勾卡合或鉚接等方式將塑膠製造之天線蓋固定於金 屬殼體上即可。惟，卡勾卡合及鉚接之方式容易產生間 隙大、易鬆動等缺陷，而影響產品之強度及外觀。隨著 電子產品日趨輕、薄、短、小之發展趨勢，電子裝置殼 體之厚度亦將越來越趨向於薄型化，當電子裝置殼體之 厚度減小到一定程度，採用卡勾卡合及鉚接之方式容易 產生斷裂應力而影響產品之強度。上述結合方式之缺陷 及局限性會伴隨電子產品薄型化之趨勢愈發突出。 【發明内容】 [0004] 鑒於上述狀況，有必要提供一種電子裝置殼體及其製造 方法，尤其係一種強度高、外形美觀且適於薄型化設計 之電子裝置殼體及其製造方法》 [0005] 一種電子裝置殼體，包括金屬本體及塑膠天線蓋，該金 _79#單编號A〇101 第4頁/共21頁 1〇] 1376185 101年08月07日修正_«頁 屬本體與該塑膠天線蓋採用嵌入成型技術一體成型，其 結合處之外表面為一平滑面，且該平滑面上形成有一連 貫之塗層，該金屬本體之一側邊設置有至少一扣合部， 該至少一扣合部與該塑膠天線蓋扣合而於該金屬本體與 該塑膠天線蓋之結合處形成至少一扣合結構；該扣合部 為階梯孔、卡勾、通孔及凸台中之其中一種。 [0006] 一種電子裝置殼體之製造方法，包括以下步驟：提供一 金屬本體，該金屬本體之一側邊設置有至少一扣合部； 將該金屬本體作為嵌件，藉由嵌入成型技術將一塑膠天 線蓋與該金屬本體一體成型，該至少一扣合部與該塑膠 天線蓋扣合而於該金屬本體與該塑膠天線蓋之結合處形 成至少一扣合結構，該扣合部為階梯孔、卡勾、通孔及 凸台中之其中一種，且該金屬本體與該塑膠天線蓋之結 合處之外表面為一平滑面；對該一體成型後之電子裝置 殼體之外表面進行塗裝，而於該平滑面上形成一連貫之 塗層。 [0007] 上述電子裝置殼體之金屬本體與塑膠天線蓋藉由嵌入成 型技術一體成型，具有較高之結合強度。且金屬本體與 塑膠天線蓋之結合處之外表面為一平滑面，並形成有一 連貫之塗層，該塗層對電子|置殼體起到保護及裝飾作 用，使得金屬本體與塑膠天線蓋之結合處看不到接合痕 跡，產品外形美觀。同時，嵌入成型技術可滿足較為多 樣化之產品設計需求，適於製造具有較薄厚度之電子裝 置殼體。 【實施方式】 097U79#單編號 A〇101 第5頁/共21頁 1013298678-0 1376185 101年.08月07日核正替換頁 [0008] 下面將結合附圖及較佳實施例對本發明之電子裝置殼體 及其製造方法作進一步地詳細說明。 [0009] 請參見圖1，所示為本發明較佳實施例之電子裝置殼體10 ，其包括一金屬本體11及一塑膠天線蓋12。 [0010] 金屬本體11大體為一矩形金屬蓋板，其一側邊設置有複 數扣合部110，用以於成型過程中與塑膠天線蓋12緊密扣 合而形成扣合結構。金屬本體11採用合金材料製造，優 選採用錢合金'銘合金或鈦合金製造。 [0011] 塑膠天線蓋12大體為一長條裝蓋板，其可成型於金屬本 體11設置有扣合部110之一側邊處。塑膠天線蓋12之材料 要求與金屬本體11之材料具有較好之融合性，例如具有 較小之縮水率及與金屬本體11之材料近似之線膨脹係數 。故，塑膠天線蓋12優選採用液晶高分子聚合物（LCP) 、聚苯硫醚（PPS)、聚對苯二曱酸丁二醇酯（PBT)等工 程塑料製造。 [0012] 請同時參見圖2與圖3，電子裝置殼體10之金屬本體11與 塑膠天線蓋12之結合處之外表面為一平滑面，且形成有 一連貫之塗層13，使金屬本體11與塑膠天線蓋12之結合 處看不到接合痕跡。同時，金屬本體11與塑膠天線蓋12 之結合面為台階面14，採用台階面14可有效增大金屬本 體11與塑膠天線蓋12之間之結合面積，從而有助於提高 其結合強度。 [0013] 塗層13之厚度為30微米至90微米，其主要成分包括成膜 物質、顏料以及溶劑、助劑等。成膜物質主要為樹脂， 隱·#單编號A_ 第6頁/共21頁 1013298678-0 1376185 101:年.08月0>日按正替g頁 可選自聚乙烯（PE)、聚丙烯（PP)、聚氣乙烯（pvc) 、聚苯乙烯（PS)、聚氨脂（PU)、脲醛樹脂（UF)、 酚醛樹脂（PF)、乙烯橡（ER)、丙烯腈-丁二烯丙烯_ 笨乙烯共聚物（ABS)、聚甲基丙烯酸曱酯（PMMA)、聚 碳酸脂（PC)、聚四氟乙烯（PTFE)、聚醯亞胺（pi) 等。顏料可選自鈦白粉、碳黑及氧化鐵紅等。溶劑可選 自有機溶劑，如乙醇、丙酮、脂類以及笨類等有機溶劑 。助劑可為發泡劑、增塑劑、潤滑剤、穩定劑、阻燃劑 、著色劑、交聯劑等’用以改進塗層之相應特性。例如 ’添加發泡劑可改變塗層之密度、硬度、隔音、吸振、 隔熱與輕量等特性。添加阻燃劑可使塗層產生耐燃特性 〇 [0014] [0015] [0016] 上述電子裝置殼體10之製造方法包括以下步驟： (1) 提供一金屬本體11。提供金屬本體11之方法可為： 利用鑄造、擠出、鍛造、沖壓等各種金屬生產方法製備 該金屬本體11，優選採用壓鑄方法製備金屬本體11。 (2) 將金屬本體11作為嵌件，藉由嵌入成型技術將一塑 膠天線蓋12與該金屬本體11 一體成型，且金屬本體"與 塑膠天線蓋1 2之結合處之外表面為一平滑面。即將金屬 本體11作為嵌件放入射出成型模具之模腔内，然後將熔 融之塑膠注入射出成型模具之模腔内，熔融之塑膠與金 屬本體11接合固化即形成塑膠天線蓋〗2。 [0017] (3)對一體成型後之電子裝置殼體1〇之外表面進行塗裝 ，而於該電子裝置殼體1〇之外表面形成一連貫之塗層13 09711799#早編號 A0101 第7頁/共21頁 1013298678-0 1376185 101年08月07日修正替換頁 。首先對電子裝置殼體10進行清洗、脫脂，並進行化成 處理以形成塗裝前之底層，然後再對電子裝置殼體10之 外表面進行塗裝，塗裝工序可採用烤漆或噴漆等方式， 優選以烤漆之方式於電子裝置殼體10之外表面形成連貫 之塗層13。 [0018] 可以理解，步驟（1)後，可首先對金屬本體U進行打磨去 除毛邊’並對金屬本體11進行化學處理，如微弧氧化、 陽極氧化等，用以於金屬本體11與塑膠天線蓋12之結合 面上形成一層接合膜’從而增強其結合力。步驟（2)後， 可對一體成型後之金屬本體11及塑膠天線蓋12進行打磨 ，去除塑膠天線蓋12之澆口及毛邊》 [0019] 請同時參見圖4至圖6，為了進一步增強金屬本體11與塑 膠天線蓋12之間之結合強度，其結合處還形成有第一扣 合結構15、第二扣合結構16、第三扣合結構17以及第四 扣合結構18。該第一扣合結構1 5藉由以下方式形成：步 驟（1)後’採用數控機床（Computer Number Control ’ CNC)於金屬本體11之一側邊加工形成一階梯孔m， 階梯孔111位於電子裝置殼體1〇内表面一端之孔徑大於位 於電子裝置殼體10外表面一端之孔徑；嵌_入成型時，炫 ' 融之塑膠流入階梯孔111中並將階梯孔111充滿，冷卻後 _ 即於金屬本體11與塑膠天線蓋〗2之結合處形成第一扣合 ‘ 結構15。 [0020] 請同時參見圖5與圖7，該第二扣合结構16藉由以下方式 形成：採用數控機床於金屬本體Π之一側邊處加工形成 至少一卡勾112 ;嵌入成型時，熔融之塑膠包覆該卡勾 1013298678-0 09711799#單编號删1 第8頁/共21頁 1376185 10Ϊ年08月0>日修正無頁 112，冷卻後即於金屬本體11與塑膠天線蓋12之結合處形 成第二扣合結構16。 [0021] 請同時參見圖5與圖8，該第三扣合結構17藉由以下方式 形成：採用數控機床於金屬本體11之一側邊處加工形成 至少一通孔113 ;嵌入成型時，熔融之塑膠流入通孔113 内並將通孔113充滿，冷卻後即於金屬本體11與塑膠天線 蓋12之結合處形成第三扣合結構17。 [0022] 請同時參見圖5與圖9，該第四扣合結構18藉由以下方式 形成：採用數控機床於金屬本體11之一側邊處加工形成 至少一凸台114 ’該ώ台114上形成有二卡勾1141 ;嵌入 成型時，熔融之塑膠包覆該凸台Π4之外表面，並包覆二 卡勾1141，冷卻後即於金屬本體11與塑膠天線蓋12之結 合處形成第四扣合結構18。 [0023] 可以理解’階梯孔111、卡勾2 '通孔113以及凸台114 除採用數控機床加工形成以外，亦可於採用鑄造方式製 備金屬本體11之過程中直接形成。 [0024] 由於電子裝置殼體10之金屬本體11與塑膠天線蓋12藉由 嵌入成型技術一體成型，其結合處貼合緊密，無間隙， 從而具有較高之結合強度。且金屬本體丨丨與塑膠天線蓋 12之結合面為台階面14，結合面積較大，有助於提高其 結合強度。進一步地，金屬本體丨丨與塑膠天線蓋12之結 合處還形成有第一扣合結構15、第二扣合結構16、第三 扣合結構17以及第四扣合結構18，確保電子裝置殼體j 〇 具有更咼之強度。同時，金屬本體丨丨與塑膠天線蓋12之 097U79#單編號A_ 第9頁/共21頁 1013298678-0 1376185 101年08月07日梭正替換頁 結合處之外表面為一平滑面，且形成有一連貫之塗層13 ' ，該塗層13對電子裝置殼體10起到保護及裝飾作用，使 得金屬本體11與塑膠天線蓋12之結合處看不到接合痕跡 ，產品外形美觀。另，嵌入成型技術可滿足較為多樣化 之產品設計需求，適於製造較薄之電子裝置殼體。同時 金屬本體11與塑膠天線蓋12之結合處之台階面14與第一 扣合結構15、第二扣合結構16、第三扣合結構17及第四 扣合結構18可保證較薄之電子裝置殼體具有較高之強度 [0025] 可以理解，扣合部110除階梯孔111、卡勾112、通孔113 以及凸台114以外，還可變更為其他結構，以滿足產品多 樣化之結合方式。根據產品之設計要求，金屬本體11與 塑膠天線蓋12結合處可選用台階面14 '第一扣合結構15 、第二扣合結構16、第三扣合結構17以及第四扣合結構 18中之一種或其組合。 [0026] 綜上所述，本發明確已符合發明專利要件，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施例， 舉凡熟悉本案技藝之人士，於援依本案發明精神所作之 等效修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 [0027] 圖1係本發明電子裝置殼體之立體分解圖。 [0028] 圖2係本發明電子裝置殼體一體成型後之正面示意圖。 [0029] 圖3係圖2所示電子裝置殼體之局‘部立體剖視圖。 [0030] 圖4係本發明電子裝置殼體一體成型後之背面示意圖。 1013298678-0 09711799^單编號A〇101 第10頁/共21頁 1376185 [0031] [0032] [0033] 101年08月0>日修正替換頁 圖5係圖4所示電子裝置殼體另一方向之局部放大圖。 圖6係圖5所示電子裝置殼體沿VI-VI線之局部剖視圖。 圖7係圖5所示電子裝置殼體沿V11-V11線之局部剖視圖 [0034] 圖8係圖5所示電子裝置殼體沿V111 -V111線之局部剖視 圖。 [0035] 圖9係圖5所示電子裝置殼體沿IX-IX線之局部剖視圖。 【主要元件符號說明】 [0036] 電子裝置殼體：10 [0037] 金屬本體：11 [0038] 扣合部：110 [0039] 塑膠天線蓋：12 [0040] 塗層：13 [0041] 台階面：14 [0042] 第一扣合結構：15 [0043] 第二扣合結構：16 [0044] 第三扣合結構：17 [0045] 第四扣合結構：18 [0046] 階梯孔：111 [0047] 卡勾：1 1 2 097U79#單賊 A〇101 第11頁/共21頁 1013298678-0 1376185 [0048] 通孔： 113 [0049] 凸台： 114 [0050] 卡勾： 1141 09711799户單编號 A〇101 第12頁/共21頁 101年08月07日移正替換頁 1013298678-01376185 101.08.08 gt; day correction replacement page 6. Description of the invention: [Technical field of invention of genus] [0001] The present invention relates to an electronic device housing and a method of manufacturing the same. [Prior Art] [0002] With the rapid development of electronic technology, electronic devices such as notebook computers, mobile phones, and PDAs have become more and more widely used. At the same time, people are increasingly demanding the appearance of electronic devices. The housing of the electronic device is generally made of metal or plastic, and is widely used in electronic devices due to its high strength and good electromagnetic shielding effect. [0003] When a metal casing is used, in order to prevent the electromagnetic shielding from affecting signal transmission and reception, the antenna cover portion of the electronic device casing is usually made of plastic, and then the plastic antenna cover is fixed by hooking or riveting. It can be on the metal casing. However, the manner in which the hooks are engaged and riveted is prone to defects such as large gaps and looseness, which affect the strength and appearance of the product. As electronic products become lighter, thinner, shorter, and smaller, the thickness of electronic device housings will become thinner and thinner. When the thickness of the electronic device housing is reduced to a certain extent, the hooks are used. And the way of riveting is prone to break stress and affect the strength of the product. The shortcomings and limitations of the above-mentioned combination methods are accompanied by the trend of thinning electronic products. SUMMARY OF THE INVENTION [0004] In view of the above circumstances, it is necessary to provide an electronic device housing and a method of manufacturing the same, and more particularly to an electronic device housing having high strength, beautiful appearance, and suitable for thin design and manufacturing method thereof [0005] An electronic device housing comprising a metal body and a plastic antenna cover, the gold _79# single number A 〇 101 page 4 / total 21 pages 1 〇 1376185 101 years of August 07 revision _ «page body and The plastic antenna cover is integrally formed by insert molding technology, and the outer surface of the joint is a smooth surface, and the smooth surface is formed with a continuous coating, and one side of the metal body is provided with at least one fastening portion. The at least one fastening portion is engaged with the plastic antenna cover to form at least one fastening structure at the joint of the metal body and the plastic antenna cover; the fastening portion is a stepped hole, a hook, a through hole and a boss One. [0006] A method of manufacturing an electronic device housing, comprising the steps of: providing a metal body, one side of one side of the metal body is provided with at least one fastening portion; the metal body is used as an insert, by insert molding technology a plastic antenna cover is integrally formed with the metal body, and the at least one fastening portion is engaged with the plastic antenna cover to form at least one fastening structure at the joint of the metal body and the plastic antenna cover, and the fastening portion is a ladder One of the hole, the hook, the through hole and the boss, and the outer surface of the joint of the metal body and the plastic antenna cover is a smooth surface; the outer surface of the integrally formed electronic device housing is painted And forming a continuous coating on the smooth surface. [0007] The metal body of the electronic device housing and the plastic antenna cover are integrally formed by the embedded molding technology, and have high bonding strength. And the outer surface of the joint of the metal body and the plastic antenna cover is a smooth surface, and a continuous coating is formed, the coating protects and decorates the electronic housing, and the metal body and the plastic antenna cover The joints do not see the joint marks, and the appearance of the product is beautiful. At the same time, the insert molding technology can meet a variety of product design requirements and is suitable for manufacturing electronic device housings with thinner thicknesses. [Embodiment] 097U79#单号A〇101 Page 5/Total 21 Page 1013298678-0 1376185 101.08.07.07 Nuclear replacement page [0008] The electronic device of the present invention will be described below with reference to the accompanying drawings and preferred embodiments. The device housing and its method of manufacture are described in further detail. Referring to FIG. 1, an electronic device housing 10 according to a preferred embodiment of the present invention includes a metal body 11 and a plastic antenna cover 12. [0010] The metal body 11 is generally a rectangular metal cover plate, and a plurality of fastening portions 110 are disposed at one side thereof for tightly engaging the plastic antenna cover 12 during the molding process to form a fastening structure. The metal body 11 is made of an alloy material, and is preferably made of a carbon alloy alloy or a titanium alloy. [0011] The plastic antenna cover 12 is generally a long-length cover plate which can be formed at a side of the metal body 11 provided with one of the fastening portions 110. The material of the plastic antenna cover 12 is required to have a good fusion with the material of the metal body 11, for example, a small shrinkage ratio and a linear expansion coefficient similar to that of the metal body 11. Therefore, the plastic antenna cover 12 is preferably made of a process plastic such as liquid crystal polymer (LCP), polyphenylene sulfide (PPS), or polybutylene terephthalate (PBT). 2 and FIG. 3, the outer surface of the joint of the metal body 11 and the plastic antenna cover 12 of the electronic device casing 10 is a smooth surface, and a continuous coating 13 is formed to make the metal body 11 No joint marks are visible at the junction with the plastic antenna cover 12. At the same time, the joint surface of the metal body 11 and the plastic antenna cover 12 is a stepped surface 14. The use of the stepped surface 14 can effectively increase the bonding area between the metal body 11 and the plastic antenna cover 12, thereby contributing to the improvement of the bonding strength. The thickness of the coating layer 13 is from 30 micrometers to 90 micrometers, and its main components include film-forming substances, pigments, solvents, auxiliaries, and the like. The film-forming substance is mainly resin, hidden · #单单 A_ Page 6 / Total 21 pages 1013298678-0 1376185 101: Year. August 0 gt; Day by g = page can be selected from polyethylene (PE), polypropylene (PP), polyethylene (pvc), polystyrene (PS), polyurethane (PU), urea resin (UF), phenolic resin (PF), ethylene rubber (ER), acrylonitrile-butadiene propylene _ Stupid ethylene copolymer (ABS), polymethyl methacrylate (PMMA), polycarbonate (PC), polytetrafluoroethylene (PTFE), polyimine (pi), and the like. The pigment may be selected from the group consisting of titanium dioxide, carbon black, and iron oxide red. The solvent can be selected from organic solvents such as ethanol, acetone, lipids and organic solvents such as stupid. The auxiliaries may be foaming agents, plasticizers, lubricating hydrazines, stabilizers, flame retardants, colorants, crosslinkers, etc. to improve the corresponding properties of the coating. For example, 'adding a blowing agent can change the density, hardness, sound insulation, vibration absorption, heat insulation and light weight of the coating. Adding a Flame Retardant to Produce Flame Resistance Characteristics of the Coating 〇 [0016] The manufacturing method of the electronic device housing 10 described above includes the following steps: (1) A metal body 11 is provided. The method of providing the metal body 11 may be: preparing the metal body 11 by various metal production methods such as casting, extrusion, forging, stamping, etc., preferably by using a die casting method. (2) Using the metal body 11 as an insert, a plastic antenna cover 12 is integrally formed with the metal body 11 by insert molding technology, and the outer surface of the joint of the metal body " and the plastic antenna cover 12 is smoothed. surface. That is, the metal body 11 is placed as an insert into the cavity of the molding die, and then the molten plastic is injected into the cavity of the injection molding die, and the molten plastic is bonded to the metal body 11 to form a plastic antenna cover. [0017] (3) coating the outer surface of the integrally formed electronic device housing 1 while forming a continuous coating on the outer surface of the electronic device housing 1 09711799# early number A0101 7 Page / Total 21 pages 1013298678-0 1376185 Correction replacement page on August 07, 101. First, the electronic device casing 10 is cleaned, degreased, and chemicalized to form a bottom layer before painting, and then the outer surface of the electronic device casing 10 is coated. The painting process may be by baking paint or painting. Preferably, a continuous coating 13 is formed on the outer surface of the electronic device housing 10 in a lacquer manner. [0018] It can be understood that, after the step (1), the metal body U can be first polished to remove the burrs and chemically treat the metal body 11, such as micro-arc oxidation, anodization, etc., for the metal body 11 and the plastic antenna. A bonding film ' is formed on the bonding surface of the cover 12 to enhance the bonding force. After the step (2), the integrally formed metal body 11 and the plastic antenna cover 12 can be polished to remove the gate and the burr of the plastic antenna cover 12 [0019] Please also refer to FIG. 4 to FIG. 6 for further reinforcement of the metal. The bonding strength between the body 11 and the plastic antenna cover 12 is further formed with a first fastening structure 15, a second fastening structure 16, a third fastening structure 17, and a fourth fastening structure 18. The first fastening structure 15 is formed by the following steps: after step (1), a stepped hole m is formed on one side of the metal body 11 by using a computer numerical control machine (Computer Number Control 'CNC), and the stepped hole 111 is located at the electronic The aperture of one end of the inner surface of the device housing 1 is larger than the aperture of one end of the outer surface of the electronic device housing 10; when embedded, the plastic melts into the stepped hole 111 and fills the stepped hole 111, after cooling A first fastening structure 15 is formed at the junction of the metal body 11 and the plastic antenna cover 〖2. [0020] Referring to FIG. 5 and FIG. 7 simultaneously, the second fastening structure 16 is formed by processing at least one hook 112 on one side of the metal body 采用 by using a numerical control machine tool; The plastic wraps the hook 1013298678-0 09711799# single number delete 1 page 8 / 21 pages 1376185 10 years old August 0> day correction no page 112, after cooling, the metal body 11 and the plastic antenna cover 12 The joint portion forms a second fastening structure 16. [0021] Referring to FIG. 5 and FIG. 8 simultaneously, the third fastening structure 17 is formed by processing at least one through hole 113 at one side of the metal body 11 by using a numerical control machine tool; The plastic flows into the through hole 113 and fills the through hole 113. After cooling, the third fastening structure 17 is formed at the junction of the metal body 11 and the plastic antenna cover 12. [0022] Referring to FIG. 5 and FIG. 9 simultaneously, the fourth fastening structure 18 is formed by processing at least one boss 114 on one side of the metal body 11 by using a numerical control machine tool. Formed with two hooks 1141; when insert molding, the molten plastic covers the outer surface of the boss 4 and covers the two hooks 1141, and after cooling, forms a fourth joint between the metal body 11 and the plastic antenna cover 12 Fastening structure 18. [0023] It can be understood that the stepped hole 111, the hook 2', the through hole 113, and the boss 114 are formed directly in the process of preparing the metal body 11 by casting, in addition to being formed by a numerically controlled machine tool. [0024] Since the metal body 11 of the electronic device housing 10 and the plastic antenna cover 12 are integrally formed by insert molding technology, the joints thereof are closely fitted and have no gap, thereby having a high bonding strength. Moreover, the joint surface of the metal body 丨丨 and the plastic antenna cover 12 is a step surface 14, and the joint area is large, which helps to improve the bonding strength. Further, a first fastening structure 15 , a second fastening structure 16 , a third fastening structure 17 and a fourth fastening structure 18 are further formed at the junction of the metal body 丨丨 and the plastic antenna cover 12 to ensure the electronic device shell Body j 〇 has a stronger strength. At the same time, the metal body 丨丨 and the plastic antenna cover 12 of the 097U79# single number A_ page 9 / a total of 21 pages 1013298678-0 1376185 on the 7th of August, 101, the replacement surface of the shuttle is a smooth surface, and formed There is a continuous coating 13 ', the coating 13 protects and decorates the electronic device casing 10, so that the joint between the metal body 11 and the plastic antenna cover 12 is not visible, and the appearance of the product is beautiful. In addition, the embedded molding technology can meet a variety of product design requirements and is suitable for manufacturing thin electronic device housings. At the same time, the stepped surface 14 of the joint of the metal body 11 and the plastic antenna cover 12 and the first fastening structure 15, the second fastening structure 16, the third fastening structure 17, and the fourth fastening structure 18 can ensure a thin electronic The device housing has a high strength [0025] It can be understood that the fastening portion 110 can be changed to other structures in addition to the stepped hole 111, the hook 112, the through hole 113, and the boss 114 to meet the diversified product combination. the way. According to the design requirements of the product, the joint portion 14 of the metal body 11 and the plastic antenna cover 12 may be selected from the first fastening structure 15 , the second fastening structure 16 , the third fastening structure 17 and the fourth fastening structure 18 . One or a combination thereof. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0027] FIG. 1 is an exploded perspective view of a housing of an electronic device of the present invention. 2 is a front elevational view showing the electronic device housing of the present invention integrally formed. 3 is a perspective view of a portion of the electronic device housing shown in FIG. 2. 4 is a schematic rear view of the electronic device housing of the present invention after being integrally formed. 1013298678-0 09711799^单单A〇101 Page 10/Total 21 page 1376185 [0032] [0033] 101 years August 0> day correction replacement page FIG. 5 is the electronic device housing shown in FIG. A partial enlargement of one direction. 6 is a partial cross-sectional view of the electronic device housing of FIG. 5 taken along line VI-VI. Figure 7 is a partial cross-sectional view of the electronic device housing of Figure 5 taken along line V11-V11. Figure 8 is a partial cross-sectional view of the electronic device housing of Figure 5 taken along line V111-V111. 9 is a partial cross-sectional view of the electronic device housing of FIG. 5 taken along line IX-IX. [Main component symbol description] [0036] Electronic device housing: 10 [0037] Metal body: 11 [0038] Fastening portion: 110 [0039] Plastic antenna cover: 12 [0040] Coating: 13 [0041] Step surface : 14 [0042] First fastening structure: 15 [0043] Second fastening structure: 16 [0044] Third fastening structure: 17 [0045] Fourth fastening structure: 18 [0046] Stepped hole: 111 [ 0047] Card hook: 1 1 2 097U79#单贼A〇101 Page 11 of 21 page 1013298678-0 1376185 [0048] Through hole: 113 [0049] Boss: 114 [0050] Card hook: 1141 09711799 No. A〇101 Page 12 of 21 Page 101 August 07 Moved to Replace Page 1013298678-0