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TWI372242B - Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method - Google Patents

Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method

Info

Publication number
TWI372242B
TWI372242B TW097101548A TW97101548A TWI372242B TW I372242 B TWI372242 B TW I372242B TW 097101548 A TW097101548 A TW 097101548A TW 97101548 A TW97101548 A TW 97101548A TW I372242 B TWI372242 B TW I372242B
Authority
TW
Taiwan
Prior art keywords
lithographic
device manufacturing
processing cell
inspection method
lithographic processing
Prior art date
Application number
TW097101548A
Other languages
English (en)
Other versions
TW200839213A (en
Inventor
Hugo Augustinus Joseph Cramer
Antoine Gaston Marie Kiers
Der Ploeg Durk Oeds Van
Goce Naumoski
Weel Roland Mark Van
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200839213A publication Critical patent/TW200839213A/zh
Application granted granted Critical
Publication of TWI372242B publication Critical patent/TWI372242B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G03F7/70655—Non-optical, e.g. atomic force microscope [AFM] or critical dimension scanning electron microscope [CD-SEM]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • G03F7/706847—Production of measurement radiation, e.g. synchrotron, free-electron laser, plasma source or higher harmonic generation [HHG]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW097101548A 2007-01-16 2008-01-15 Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method TWI372242B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/653,441 US7916927B2 (en) 2007-01-16 2007-01-16 Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method

Publications (2)

Publication Number Publication Date
TW200839213A TW200839213A (en) 2008-10-01
TWI372242B true TWI372242B (en) 2012-09-11

Family

ID=39617834

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097101548A TWI372242B (en) 2007-01-16 2008-01-15 Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method

Country Status (6)

Country Link
US (1) US7916927B2 (zh)
JP (2) JP4782802B2 (zh)
KR (1) KR100919663B1 (zh)
CN (1) CN101261452B (zh)
IL (1) IL188768A (zh)
TW (1) TWI372242B (zh)

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WO2016177548A1 (en) 2015-05-07 2016-11-10 Asml Netherlands B.V. Metrology method and apparatus, computer program and lithographic system
NL2017074A (en) 2015-07-17 2017-01-19 Asml Netherlands Bv Methods and apparatus for simulating interaction of radiation with structures, metrology methods and apparatus, device manufacturing method
WO2017055075A1 (en) * 2015-09-28 2017-04-06 Asml Netherlands B.V. Hierarchical representation of two-dimensional or three-dimensional shapes
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US10768533B2 (en) * 2016-10-20 2020-09-08 Kla-Tencor Corporation Method and system for generating programmed defects for use in metrology measurements
JP7438105B2 (ja) * 2017-09-27 2024-02-26 エーエスエムエル ネザーランズ ビー．ブイ． デバイス製造方法の制御パラメータを決定する方法、コンピュータプログラム、および、基板にデバイスを製造するためのシステム
EP3480659A1 (en) * 2017-11-01 2019-05-08 ASML Netherlands B.V. Estimation of data in metrology
JP7129356B2 (ja) * 2019-02-13 2022-09-01 キオクシア株式会社 測定方法

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Also Published As

Publication number Publication date
JP2011040772A (ja) 2011-02-24
KR20080067590A (ko) 2008-07-21
US20080170780A1 (en) 2008-07-17
CN101261452B (zh) 2012-07-18
KR100919663B1 (ko) 2009-09-30
JP5248569B2 (ja) 2013-07-31
IL188768A (en) 2013-12-31
CN101261452A (zh) 2008-09-10
US7916927B2 (en) 2011-03-29
JP2008249686A (ja) 2008-10-16
IL188768A0 (en) 2008-11-03
JP4782802B2 (ja) 2011-09-28
TW200839213A (en) 2008-10-01

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