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TWI365851B - Magnesium hydroxide particle and fabricating method thereof and resin composition containing the same - Google Patents

Magnesium hydroxide particle and fabricating method thereof and resin composition containing the same

Info

Publication number
TWI365851B
TWI365851B TW095114857A TW95114857A TWI365851B TW I365851 B TWI365851 B TW I365851B TW 095114857 A TW095114857 A TW 095114857A TW 95114857 A TW95114857 A TW 95114857A TW I365851 B TWI365851 B TW I365851B
Authority
TW
Taiwan
Prior art keywords
resin composition
same
composition containing
magnesium hydroxide
fabricating method
Prior art date
Application number
TW095114857A
Other languages
Chinese (zh)
Other versions
TW200637794A (en
Inventor
Atsuya Kawase
Hirofumi Kurisu
Masaaki Kunishige
Original Assignee
Tateho Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tateho Kagaku Kogyo Kk filed Critical Tateho Kagaku Kogyo Kk
Publication of TW200637794A publication Critical patent/TW200637794A/en
Application granted granted Critical
Publication of TWI365851B publication Critical patent/TWI365851B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F5/00—Compounds of magnesium
    • C01F5/14—Magnesium hydroxide
    • C01F5/16—Magnesium hydroxide by treating magnesia, e.g. calcined dolomite, with water or solutions of salts not containing magnesium
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/40—Particle morphology extending in three dimensions prism-like
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition
    • C08L2666/84—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW095114857A 2005-04-28 2006-04-26 Magnesium hydroxide particle and fabricating method thereof and resin composition containing the same TWI365851B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005131149A JP4774236B2 (en) 2005-04-28 2005-04-28 Magnesium hydroxide particles, method for producing the same, and resin composition containing the same

Publications (2)

Publication Number Publication Date
TW200637794A TW200637794A (en) 2006-11-01
TWI365851B true TWI365851B (en) 2012-06-11

Family

ID=37194575

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114857A TWI365851B (en) 2005-04-28 2006-04-26 Magnesium hydroxide particle and fabricating method thereof and resin composition containing the same

Country Status (5)

Country Link
JP (1) JP4774236B2 (en)
KR (1) KR100843874B1 (en)
CN (1) CN100455513C (en)
MY (1) MY142249A (en)
TW (1) TWI365851B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4745713B2 (en) * 2005-04-28 2011-08-10 タテホ化学工業株式会社 Magnesium hydroxide particles, method for producing the same, and resin composition containing the same
JP5181219B2 (en) * 2005-07-13 2013-04-10 日立化成株式会社 Epoxy resin composition for sealing and electronic component device
JP2010030882A (en) * 2008-06-25 2010-02-12 Kyowa Chem Ind Co Ltd Composite magnesium hydroxide particle, flame retardant composition and flame-retardant polyolefin resin composition
JP4778111B1 (en) * 2010-06-29 2011-09-21 貴夫 舩田 Magnesium hydroxide and method for producing the same
JP5877745B2 (en) * 2012-03-27 2016-03-08 タテホ化学工業株式会社 Composite metal hydroxide particles and resin composition containing the same
JP5944714B2 (en) * 2012-03-27 2016-07-05 タテホ化学工業株式会社 Magnesium hydroxide particles and resin composition containing the same
JP6059577B2 (en) * 2012-11-13 2017-01-11 タテホ化学工業株式会社 Magnesium hydroxide particles and resin composition containing the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63277511A (en) * 1987-05-11 1988-11-15 Shin Nippon Kagaku Kogyo Co Ltd Production of magnesium hydroxide and surface-treated magnesium hydroxide
JP2602436B2 (en) * 1987-11-17 1997-04-23 宇部化学工業株式会社 Method for producing highly dispersible magnesium hydroxide
JPH03170325A (en) * 1989-11-27 1991-07-23 Mitsubishi Materials Corp Production of magnesium hydroxide
JPH04362012A (en) * 1991-06-06 1992-12-15 Mitsubishi Materials Corp Production of high-dispersive magnesium hydroxide
JPH0881216A (en) * 1994-09-09 1996-03-26 Daicel Amiboshi Sangyo Kk Water suspension of magnesium hydroxide and its production
JP2944928B2 (en) * 1995-02-13 1999-09-06 ダイセル網干産業株式会社 Method for producing magnesium hydroxide and its aqueous suspension
JPH1059711A (en) * 1996-08-12 1998-03-03 Daicel Amiboshi Sangyo Kk Magnesium hydroxide and production of aqueous liquid suspension thereof
AU1685200A (en) * 1998-12-14 2000-07-03 Kyowa Chemical Industry Co., Ltd. Magnesium hydroxide particles, process for producing the same, and resin composition containing the particles
JP2000233924A (en) * 1998-12-14 2000-08-29 Kyowa Chem Ind Co Ltd Magnesium hydroxide particle and its production
KR100538527B1 (en) * 1999-07-08 2005-12-22 제일모직주식회사 Epoxy Molding Compound for Semiconductor Encapsulement
JP4765150B2 (en) * 2000-05-29 2011-09-07 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
JP4961635B2 (en) * 2001-05-30 2012-06-27 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
KR100523621B1 (en) * 2003-02-11 2005-10-24 주식회사 케이씨씨 Epoxy resin composition for environmental frendly sealing semiconductor element
JP4745713B2 (en) * 2005-04-28 2011-08-10 タテホ化学工業株式会社 Magnesium hydroxide particles, method for producing the same, and resin composition containing the same

Also Published As

Publication number Publication date
TW200637794A (en) 2006-11-01
JP2006306658A (en) 2006-11-09
KR20060113521A (en) 2006-11-02
MY142249A (en) 2010-11-15
CN1854067A (en) 2006-11-01
CN100455513C (en) 2009-01-28
JP4774236B2 (en) 2011-09-14
KR100843874B1 (en) 2008-07-03

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