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TWI361994B - Touch panel - Google Patents

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Publication number
TWI361994B
TWI361994B TW97135241A TW97135241A TWI361994B TW I361994 B TWI361994 B TW I361994B TW 97135241 A TW97135241 A TW 97135241A TW 97135241 A TW97135241 A TW 97135241A TW I361994 B TWI361994 B TW I361994B
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Taiwan
Prior art keywords
holes
touch panel
hole
electrode substrate
circuit board
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TW97135241A
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Chinese (zh)
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TW201011614A (en
Inventor
Chih Yao Fang
Ming Kung Wu
Ping Wen Huang
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Wintek Corp
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Priority to TW97135241A priority Critical patent/TWI361994B/en
Publication of TW201011614A publication Critical patent/TW201011614A/en
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Publication of TWI361994B publication Critical patent/TWI361994B/en

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1361994 WP9705-C207-0813 28557twf.doc/n 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種觸控面板’且特別是有關於一種 具有平坦外表面的觸控面板。 【先前技術】 近年來,各式電子產品都不斷朝向操作簡便、小體積 φ 以及大螢幕尺寸的方向邁進,特別是攜帶式的電子產品對 於體積及螢幕尺寸的要求更為嚴格。因此,許多電子產品 都將觸控面板與液晶顯示面板整合,以省略鍵盤或是操控 按鍵所需的空間,進而使螢幕可配置的面積擴大。 目前,觸控面板大致可區分為電阻式、電容式、紅外 ,式及超音波式等觸控面板,其中以電阻式觸控面板與電 容式觸控面板為最常見的產品。圖1繪示為習知的一種觸 f面板的剖面示意圖。請參照圖卜f知_控面板100 =括第一電極基板110以及第二電極基板12〇,第一電極 土板110與第二電極基板12〇相互疊置且兩者間維持一微 J的間隙。使用者可直接以手或是觸控筆按壓第二電極基 板120以進行觸控操作。 只際上,第一電極基板110外側連接有一可撓性電路 130,且第一電極基板11()以及第二電極基板12〇上分 ^配置有導電薄臈(未繪示)。使用者的按壓動作將使第一 八極基板110以及第二電極基板12 0上的兩導電薄膜(未繪 丁產生電性訊號,並藉由可撓性電路板130傳輸至控制晶 5 1361994 WP9705-C207-0813 28557twf.doc/n 片以解析該電性訊號並判斷觸控點的座標。 台灣專利公開號200632752 —案提出一種顯示面板 100之訊號傳輸線路的連接方式。其主要利用一金屬針腳 140配置於第一電極基板11〇的貫孔112中,以使第二電 極基板120上的訊號得以傳輸至可撓性電路板13〇上。同 時,為了使金屬針腳140與可撓性電路板13〇上的電路電 性連接,金屬針腳140具有一圓板狀頭部14〇a。此圓板狀 頭部140a凸出於電路板130外將使觸控面板1〇〇的外表面 無法平坦化,而使觸控面板100與顯示面板等其他元件貼 附時產生困難。另外,圓板狀頭部140a所佔面積較大而可 能造成觸控面板100之動作區域的面積受限。 值得一提的是,利用金屬針腳的連接方式,可能產生 一些使觸控面板1〇〇良率受影響的問題。舉例而今, 針腳的尺寸過長可能使第二電極基板12G受壓變^,或θ 金屬針腳的尺寸過短而使第二電極基板12 = 板130之間有連接不良的問題。 職電路 【發明内容】 本發明是提供—種觸控面板,以解決習知之觸1361994 WP9705-C207-0813 28557twf.doc/n IX. Description of the Invention: TECHNICAL FIELD The present invention relates to a touch panel and particularly relates to a touch panel having a flat outer surface. [Prior Art] In recent years, various electronic products have been moving toward simple operation, small volume φ, and large screen size. In particular, portable electronic products have stricter requirements on volume and screen size. Therefore, many electronic products integrate the touch panel with the liquid crystal display panel to omit the space required for the keyboard or the control buttons, thereby expanding the configurable area of the screen. Currently, touch panels can be roughly classified into resistive, capacitive, infrared, and ultrasonic touch panels. Among them, resistive touch panels and capacitive touch panels are the most common products. 1 is a schematic cross-sectional view of a conventional touch panel. Referring to FIG. 4, the first electrode substrate 110 and the second electrode substrate 12 are overlapped, and the first electrode earth plate 110 and the second electrode substrate 12 are overlapped with each other and maintain a micro J therebetween. gap. The user can directly press the second electrode substrate 120 with a hand or a stylus to perform a touch operation. In the meantime, a flexible circuit 130 is connected to the outside of the first electrode substrate 110, and a conductive thin layer (not shown) is disposed on the first electrode substrate 11 and the second electrode substrate 12. The pressing action of the user will cause the two conductive films on the first eight-pole substrate 110 and the second electrode substrate 120 (the electrical signal is not drawn, and is transmitted to the control crystal by the flexible circuit board 130 to the control crystal 5 1361994 WP9705 -C207-0813 28557twf.doc/n to analyze the electrical signal and determine the coordinates of the touch point. Taiwan Patent Publication No. 200632752 - A connection method for the signal transmission line of the display panel 100 is proposed. The main use of a metal pin The 140 is disposed in the through hole 112 of the first electrode substrate 11 , so that the signal on the second electrode substrate 120 is transmitted to the flexible circuit board 13 . Meanwhile, in order to make the metal pin 140 and the flexible circuit board The circuit on the 13 电 is electrically connected, and the metal pin 140 has a disc-shaped head portion 14 〇 a. The disc-shaped head portion 140a protrudes from the outside of the circuit board 130, so that the outer surface of the touch panel 1 无法 cannot be flattened. However, it is difficult to attach the touch panel 100 to other components such as the display panel. In addition, the disk-shaped head portion 140a occupies a large area and may cause a limited area of the action area of the touch panel 100. Is With the connection method of the metal pins, there may be some problems that affect the yield of the touch panel 1. For example, if the size of the pins is too long, the second electrode substrate 12G may be pressed, or the size of the metal pins. Too short to cause a problem of poor connection between the second electrode substrate 12 = the board 130. The present invention provides a touch panel to solve the conventional touch

其中上表面與凹槽位於相對的兩側且第 貝孔連通於 以解決習知之觸控面板 平坦的外表面之問題。 ^ 6 1361994 WP9705-C207-0813 28557twf.doc/n 3極被第三貫絲露出來i路板崎於承餘材的凹 槽中,且電路板具衫個第四貫孔以及多鱗電接塾 =貫^暴露出第-貫孔所在區域。導線容置於相 電::及貫:電=:?·貫孔内並電性連 護芦在==實1謝,上述之觸控面板更包括一保 。蔓層其配置於弟-貫孔、第二貫孔、第 二,[,覆導線。第三貫孔的孔徑例如 、貝孔與第一貝孔的孔徑,以使位於第一貫孔、第二. 孔以及第二貫孔中的部份保護層實質上為τ字型 、 保護層實質上可以填平凹槽。具體㈣例 如為一絕緣膠,其包括料細轉。日之材質例 為多實施射,上叙連接電極與導電接墊 在本發明之一實施例中,上述之第一電極基 夕個訊號傳輸電極:其電性連接至連接電極。如此―^, 2面板可歧包括至少—導電膠,其㈣第 基板之間’且導電膠使訊號傳輸電心 7 1361994 WP9705-C207-0813 28557twf.doc/n 在本發明之一實施例中,上述之觸控面板更包括一黏 著劑,其中電路板藉由黏著劑黏著於承載基材的凹槽内。 在本發明之一實施例中,上述之電路板實質上為一可 撓性電路板(Flexible Printed Circuit, FPC)。 在本發明之一實施例中,上述之導線的材質包括銀、 銘、銅或上述之組合。 本發明的觸控面板利用在承載基材上形成一凹槽的 φ 設計使得電路板及導線等線路埋設於凹槽以及連接凹槽的 貝孔中。因此,本發明之觸控面板可以具有平坦的外表面 以便與其他裝置貼附。此外,本發明之觸控面板中,呈上 下交錯配置的連接電極以及導電接墊利用導線之連結而可 於小範圍内達成訊號之連接,以提高觸控面板之動作區的 配置面積。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂,下文待舉較佳實施例,並配合所附圖式,作詳細說 明如下。 【實施方式】 圖2繪示為本發明之一實施例的觸控面板之局部立體 圖,而圖3為沿圖2之X方向所繪示之觸控面板的局部剖 面圖。請同時參照圖2與圖3,觸控面板200包括一承载 基材210A、一第一電極基板21〇B、一間隔層22〇、—第 二電極基板230、一電路板24〇以及多條導線250。承载基 材210A具有一凹槽212、一上表面214以及多個第一貫孔 8 1361994 28557twf.doc/n WP9705-C207-0813 216A,其中上表面214與凹槽212位於相對的兩側且第一 貫孔216A連通上表面214與凹槽212。第一電極基板210B 配置於承載基材210A之上表面214上,且第一電極基板 210B具有多個第二貫孔216]B以暴露出第一貫孔216a所 在區域。第二電極基板230具有多個連接電極232。間隔 層220配置於第一電極基板210B與第二電極基板230之 間,且具有多個第三貫孔222,其中第三貫孔222係分別 暴露出第二貫孔216B所在區域,同時暴露出第二電極基 板230上之連接電極232。電路板240配置於承載基材210A 的凹槽212中,且電路板240具有多個第四貫孔242以及 多個導電接墊244,其中導電接墊244係與連接電極232 呈上下交錯配置。第四貫孔242暴露出第一貫孔216A所 在區域,且導電接墊244係設於電路板240上。導線250 則電性連接於連接電極232以及導電接墊244之間。 在本實施例中,承載基材210A具有凹槽212,且第 一貫孔216A、第二貫孔216B、第三貫孔222以及第四貫 孔242是相互連貫並共同暴露出連接電極232。如此一來, ,於第一貝扎216A、第二貫孔216B、第三貫孔222以及 第四貫孔242中並且電性連接於連接電極232以及導電接 墊244之間的導線250不會凸出於凹槽212之外。同時, 電路板240例如是-可撓性電路板,其也是埋設於凹槽212 之中。只務上,觸控面板2〇〇更包括一黏著劑26〇,其中 電路板240藉由黏著劑260黏著於承载基材21〇A上。 在本實施例中,凹槽212的設計可以將電路板24〇與 9 1361994 WP9705-C207-0813 28557twf.doc/n 導線250埋設於其中。因此,除了電路板24〇的部份區域 會自觸控面板200之—旁延伸出來之外,觸控面板2〇〇的 外表面上不會有裸露的導線或是凸出的元件。觸控面板 200欲貼附於顯示面板等其他裝置上時,平坦的外表面有 助於提升兩裝置的貼附良率。 貫際上’為了保護這些導線250 ’觸控面板2〇〇更包 括一保護層270,其配置於第一貫孔216A、第二貫孔 216B、第三貫孔222、第四貫孔242以及凹槽212中,並 包覆導線250。在本實施例中,保護層27〇的材質例如是 選用一絕緣膠體,例如紫外光固化膠等。另外,為了使觸 控面板200的外表面更佳平坦,保護層27〇實質上是填平 凹槽212而與承載基材21〇A遠離上表面214之一側切齊。 如此,保護層270非旦可以保護導線25〇以避免導線25〇 爻到腐蝕,更可以提供一平坦的表面而有利於觸控面板 2〇0的後續組裝製程。 在本實施例中,連接電極232例如為多個金屬電極。 舉例而& ’連接電極232可以是配置於第二電極基板23〇 上的銀電極。另外,在本實施例中例如是利用超音波震盪 金屬針頭之儀器以使導線250配置於第一貫孔216八、第二 貫孔216B、第三貫孔222以及第四貫孔M2中。同時,導 線250的材質包括銀、鋁、銅或其他的金屬材質。實務上, 連接電極232的表面可以配置有銀膠等導電性膠體以使導 線250與連接電極232的接合性更加提升。當然,以上之 連接電極232的材質以及導線250的製作方法僅為舉例說 10 1361994 WP9705-C207-0813 28557twf.doc/n 明之用,而本發明不限於此。 相較於習知利用金屬針腳的連接方式,本實施例利用 導線250連接於連接電極232與導電接墊244之間不僅可 以維持連接電極232與導電接墊244的電性連接關係並且 不會造成第二電極基板230受到壓迫而變形的情形。 進一步而言,為了強化保護層270的鑲固能力,本實 施例是使第三貫孔222的孔徑大於第一貫孔216A與第二 貫孔216B的孔徑,使位於第一貫孔216A、第二貫孔216B 以及弟二貝孔222中的保護層270實質上為T字型。因此, 一旦電路板240受到外力而向外拉張時,τ字型的設計可 以提供足夠的鑲固強度以避免保護層27〇向外脫離,並防 止導線250的斷裂或損壞。也就是說,本實施例不但藉由 凹槽212搭配第一貫孔216A、第二貫孔216B、第三貫孔 222以及第四貫孔242之設計可使得觸控面板2〇〇具有平 坦的外表面,且更進一步藉由貫孔之大小設計提供近似於 投錨作用,使保護層270具有更良好的信賴性,而提升觸 控面板200之品質。 圖4與圖5為沿圖2之Y方向所繪示之觸控面板的局 部剖面圖’其中圖4係繪示第二電極基板23〇與電路板24〇 之電性連接關係,而圖5係繪示第一電極基板21〇B與電 路板240之電性連接關係。請先參照圖4,第一電極基板 210B與第二電極基板230例如都是由鍍覆有導電氧化層 (未繪示)的一可撓性基板所組成。在本實施例中,凹槽 例如是位於承載基材210A上,而第一電極基板210B配置 11 1361994 28557twf.doc/i WP9705-C207-0813 於承載基材21〇A上。承載基材21〇A例如是由玻璃、聚碳 1醋士等質额硬的㈣製作而成。使用者按絲控面板 200時’承載基材2祖可以提供適當的承載力以避免觸控 面板200整體產生形變。 第電極基板230中的導電氧化層(未繪示)係用以感 、則使用者之觸控動作所產生的訊號。此外,第二電極基板 230 ^多個連接電極232電性連接於第二電極基板23〇之 導電,化層(未繪不)。在圖4所㈣的局部觸控面板細 中、’第二電極基板230之導電氧化層(未繪示)上所產生的 感測訊號可以藉由連接電極232以及導線請傳輸至電路 板 240。 —接著’清參照圖5,要使觸控面板2〇〇可以正蜂的進 行觸控感測,則第-電極基板2之導電氧化層(未繪示) 上的訊號也必需傳遞至電路板·。因此,由圖5的局部 剖面圖來看’第-電極基板2麵更具有多個訊號傳輸電 極218(圖中僅繪示一個為例),其用以使第一電極基板 210B之導電氧化層(未緣示)電性連接至連接電極μ2。實 際上,為了使訊號傳輸電極加電性連接至連接電極况, 觸控面板2G0彳以更包括至少—導轉,,其位於訊號 傳輸電極218與連接電極232之間。如此,第一電極基板 210B之導電氧化層(未繪示)上的訊號便可以藉由訊號傳輸 電極218、導電膠280、連接電極232以及導線25〇傳 電路板240。 整體而言,本實施例的連接電極232有一部分是電性 12 1361994 WP9705-C207-0813 28557twf.doc/n 連接至第一電極基板21〇B’而另一部份則是電性連接至第 二電極基板230。如此一來,無論哪一個電極基板(21〇b 或230)上所產生的訊號都可以藉由連接電極232與導線 250傳輸至電路板240以完成觸控控制訊號的傳輸。同時, 由圖4與圖5之剖面圖來看,觸控面板2〇〇之連接線路設 計可以使觸控面板200具有平坦的外表面,特別是承载基 材210A之外側,因而有助於提升觸控面板2〇〇與其他裝 置貼附時的製程良率。 W' 在本實施例中,第一電極基板21〇B與第二電極基板 230例如是由鍍覆有導電氧化層的可撓性塑膠基材所構 成。由於,觸控面板200往往會與顯示面板貼合以成為觸 控式顯不裝置,導電氧化層的材質較佳是選自透明的導電 性氧化物以提供良好的透光率。舉例來說,透_導電性 氧化物例如是銦錫氧化物、銦鋅氧化物等。 圖6緣不為圖2的觸控面板之上視示意圖。請參 6’觸控面板200例如是具有—動作區AA以及位於動;^區 AA周邊的線路區CA。動作區从主要是觸控面板勘可 ^行觸控㈣動作的區域,而線路區CA中則配置有訊號 傳輪相關翁。-般來說,板· ^了使電子裝置具有更大的螢幕科及更良好的操作^ _ ^凸ίίί11 CA的設計,圖6將連接電極232、 ^線 導電接墊244以及電路板240細會示出來。 線路區CA的設計例如與上述之線路設計方式相同 13 1361994 WP9705-C207-0813 28557twf.doc/n 是說,利用導線 诺虿径—矜守琶赉垫 之間可以為觸控面板200提供平整的外表面。由圖6可知, 本實施例的線路區CA所佔面積僅約一挾長矩形區域因 而動作區AA所佔面積可以適度的增加。如此—來,在相 同尺寸設計的裝置中,應用觸控面板2〇〇的裝置可具有較 大的顯示螢幕’而更符合市場需求。 綜上所述,本發明藉由承載基材之凹槽以及第一貫 孔、第二貫孔 '第三貫孔與第四貫孔將多條導線連接第二 電極基板之連接電極與電路板之導電接墊,使第二電極^ 板與電路板之間的傳輸線路設計不f裸露或是凸出於二 面板外部。也就是說,本發明之财面減有平坦的外^ !助於提升觸控面板貼附於其他元件上時的: 2另外’呈上下交錯配置的連接電㈣及導電接塾利用 ===内達成訊號之連接,高觸控 限定:ΐ二 常=非: :==二範圍内’當可作些許之更動與_, 為準。 複乾圍當視後附之申請專利範圍所界定者 【圖式簡單說明】 圖、、'e示為習知的一種觸控面板的剖面示意圖。 圖2緣示為本發明之一實施例的觸控面板^局部立體 14 1361994 WP9705-C207-0813 28557twf.doc/n 圖。 圖3為沿圖2之X方向所繪示之觸控面板的局部剖面 圖。 圖4與圖5為沿圖2之Y方向所繪示之觸控面板的局 部剖面圖。 圖6繪示為圖2的觸控面板之上視示意圖。 【主要元件符號說明】 100、200 :觸控面板 110、210B ··第一電極基板 112 :貫孔 120、230 :第二電極基板 130 :可撓性電路板 140 :金屬針腳 14〇3·.圓板狀頭部 210Α :承載基材 212 :凹槽 214 :上表面 216Α :第一貫孔 216Β :第二貫孔 218 :訊號傳輸電極 220 :間隔層 222 :第三貫孔 232 :連接電極 15 1361994 WP9705-C207-0813 28557twf.doc/n 240 :電路板 242 :第四貫孔 244 :導電接墊 250 :導線 260 :黏著劑 270 :保護層 280 :導電膠 AA :動作區 CA :線路區The upper surface and the recess are located on opposite sides and the plenum is connected to solve the problem of the flat outer surface of the conventional touch panel. ^ 6 1361994 WP9705-C207-0813 28557twf.doc/n The 3 poles are exposed by the third thread, and the board is in the groove of the remaining material, and the circuit board has a fourth through hole and a multi-scale electrical connection. = Through ^ exposes the area where the first through hole is located. The wire is placed in the phase of electricity:: and through: electricity =:? · through the hole and the electrical connection of the reed in == real 1 thanks, the above touch panel also includes a guarantee. The vine layer is disposed in the ridge-through hole, the second through hole, and the second, [, the covered wire. The aperture of the third through hole, for example, the aperture of the first hole and the first hole, so that a part of the protective layer located in the first through hole, the second hole and the second through hole is substantially a τ-shaped, protective layer The groove can be filled in substantially. Specifically, the fourth (4) is an insulating rubber, which includes a fine rotation of the material. In the embodiment of the invention, the first electrode is a signal transmitting electrode: it is electrically connected to the connecting electrode. Thus, the panel may comprise at least a conductive paste, and (4) between the substrates, and the conductive paste causes the signal transmission core 7 1361994 WP9705-C207-0813 28557twf.doc/n in an embodiment of the invention, The touch panel described above further includes an adhesive, wherein the circuit board is adhered to the recess of the carrier substrate by an adhesive. In an embodiment of the invention, the circuit board is substantially a Flexible Printed Circuit (FPC). In an embodiment of the invention, the material of the wire comprises silver, inscription, copper or a combination thereof. The touch panel of the present invention utilizes a φ design to form a recess in the carrier substrate such that wiring such as circuit boards and wires are buried in the recess and the via hole of the connecting recess. Therefore, the touch panel of the present invention can have a flat outer surface for attachment to other devices. In addition, in the touch panel of the present invention, the connection electrodes and the conductive pads which are arranged in the upper and lower staggered manners can be connected in a small range by using the connection of the wires to improve the arrangement area of the action area of the touch panel. The above and other objects, features, and advantages of the invention will be apparent from 2 is a partial perspective view of a touch panel according to an embodiment of the present invention, and FIG. 3 is a partial cross-sectional view of the touch panel taken along the X direction of FIG. Referring to FIG. 2 and FIG. 3 simultaneously, the touch panel 200 includes a carrier substrate 210A, a first electrode substrate 21B, a spacer layer 22, a second electrode substrate 230, a circuit board 24〇, and a plurality of strips. Wire 250. The carrier substrate 210A has a recess 212, an upper surface 214 and a plurality of first through holes 8 1361994 28557twf.doc/n WP9705-C207-0813 216A, wherein the upper surface 214 and the recess 212 are located on opposite sides and The consistent aperture 216A communicates with the upper surface 214 and the recess 212. The first electrode substrate 210B is disposed on the upper surface 214 of the carrier substrate 210A, and the first electrode substrate 210B has a plurality of second through holes 216]B to expose a region where the first through holes 216a are located. The second electrode substrate 230 has a plurality of connection electrodes 232. The spacer layer 220 is disposed between the first electrode substrate 210B and the second electrode substrate 230, and has a plurality of third through holes 222, wherein the third through holes 222 respectively expose the area where the second through holes 216B are located, and are exposed at the same time. The connection electrode 232 on the second electrode substrate 230. The circuit board 240 is disposed in the recess 212 of the carrier substrate 210A, and the circuit board 240 has a plurality of fourth through holes 242 and a plurality of conductive pads 244, wherein the conductive pads 244 are arranged in a staggered manner with the connection electrodes 232. The fourth through hole 242 exposes the area where the first through hole 216A is located, and the conductive pad 244 is disposed on the circuit board 240. The wire 250 is electrically connected between the connection electrode 232 and the conductive pad 244. In this embodiment, the carrier substrate 210A has a recess 212, and the first through hole 216A, the second through hole 216B, the third through hole 222, and the fourth through hole 242 are coherent and collectively expose the connection electrode 232. As a result, the wires 250 in the first Beza 216A, the second through holes 216B, the third through holes 222, and the fourth through holes 242 and electrically connected between the connection electrodes 232 and the conductive pads 244 are not It protrudes beyond the groove 212. At the same time, the circuit board 240 is, for example, a flexible circuit board that is also embedded in the recess 212. As a matter of course, the touch panel 2 includes an adhesive 26, wherein the circuit board 240 is adhered to the carrier substrate 21A by the adhesive 260. In the present embodiment, the recess 212 is designed to embed the circuit board 24 and the 9 1361994 WP9705-C207-0813 28557 twf.doc/n wire 250 therein. Therefore, except for a portion of the board 24 that extends from the side of the touch panel 200, the exposed surface of the touch panel 2 does not have exposed wires or protruding components. When the touch panel 200 is to be attached to other devices such as a display panel, the flat outer surface helps to improve the adhesion yield of the two devices. The touch panel 2 includes a protective layer 270 disposed on the first through hole 216A, the second through hole 216B, the third through hole 222, and the fourth through hole 242. The groove 212 is covered with a wire 250. In the present embodiment, the material of the protective layer 27 is, for example, an insulating colloid such as an ultraviolet curing adhesive or the like. In addition, in order to make the outer surface of the touch panel 200 more flat, the protective layer 27 is substantially filled in the groove 212 to be aligned with one side of the carrier substrate 21A away from the upper surface 214. Thus, the protective layer 270 can protect the wires 25 from the wires 25 to avoid corrosion, and can provide a flat surface to facilitate the subsequent assembly process of the touch panel 200. In the present embodiment, the connection electrode 232 is, for example, a plurality of metal electrodes. For example, the &' connection electrode 232 may be a silver electrode disposed on the second electrode substrate 23A. Further, in the present embodiment, for example, an instrument for oscillating a metal needle by ultrasonic waves is used to dispose the wire 250 in the first through hole 216, the second through hole 216B, the third through hole 222, and the fourth through hole M2. At the same time, the material of the wire 250 includes silver, aluminum, copper or other metal materials. In practice, the surface of the connection electrode 232 may be provided with a conductive paste such as silver paste to further improve the bonding property between the wire 250 and the connection electrode 232. Of course, the material of the above connecting electrode 232 and the manufacturing method of the wire 250 are only for the purpose of, for example, 10 1361994 WP9705-C207-0813 28557 twf.doc/n, and the present invention is not limited thereto. Compared with the conventional connection manner of the metal pins, the connection between the connection electrode 232 and the conductive pads 244 by using the wires 250 in this embodiment can not only maintain the electrical connection relationship between the connection electrodes 232 and the conductive pads 244, but also does not cause The second electrode substrate 230 is deformed by being pressed. Further, in order to strengthen the inlaying capability of the protective layer 270, in this embodiment, the aperture of the third through hole 222 is larger than the aperture of the first through hole 216A and the second through hole 216B, so that the first through hole 216A, the first through hole 216A The protective layer 270 in the through hole 216B and the second hole 222 is substantially T-shaped. Therefore, once the circuit board 240 is pulled outward by an external force, the τ-shaped design can provide sufficient inlay strength to prevent the protective layer 27 from being detached outward and prevent the wire 250 from being broken or damaged. In other words, the design of the first through hole 216A, the second through hole 216B, the third through hole 222, and the fourth through hole 242 through the groove 212 can make the touch panel 2 平坦 flat. The outer surface, and further by the size of the through hole, provides a similar anchoring effect, so that the protective layer 270 has better reliability and improves the quality of the touch panel 200. 4 and FIG. 5 are partial cross-sectional views of the touch panel taken along the Y direction of FIG. 2, wherein FIG. 4 is a diagram showing the electrical connection relationship between the second electrode substrate 23 and the circuit board 24, and FIG. The electrical connection relationship between the first electrode substrate 21〇B and the circuit board 240 is shown. Referring first to FIG. 4, the first electrode substrate 210B and the second electrode substrate 230 are each composed of a flexible substrate plated with a conductive oxide layer (not shown). In the present embodiment, the recess is, for example, located on the carrier substrate 210A, and the first electrode substrate 210B is disposed on the carrier substrate 21A by 11 1361994 28557 twf.doc/i WP9705-C207-0813. The carrier substrate 21A is made, for example, of a hard (4) material such as glass or polycarbonate. When the user presses the panel 200, the carrier substrate 2 can provide an appropriate bearing capacity to prevent the touch panel 200 from being deformed as a whole. The conductive oxide layer (not shown) in the first electrode substrate 230 is used to sense the signal generated by the user's touch action. In addition, the second electrode substrate 230 is connected to the conductive layer (not shown) of the second electrode substrate 23 . The sensing signal generated on the conductive oxide layer (not shown) of the second electrode substrate 230 in the partial touch panel of FIG. 4(4) can be transmitted to the circuit board 240 through the connection electrode 232 and the wires. - Then, referring to FIG. 5, in order for the touch panel 2 to perform touch sensing, the signal on the conductive oxide layer (not shown) of the first electrode substrate 2 must also be transmitted to the circuit board. ·. Therefore, from the partial cross-sectional view of FIG. 5, the first electrode substrate 2 has a plurality of signal transmission electrodes 218 (only one is shown as an example) for making the conductive oxide layer of the first electrode substrate 210B. (not shown) is electrically connected to the connection electrode μ2. In actuality, in order to electrically connect the signal transmission electrode to the connection electrode, the touch panel 2G0 further includes at least a conduction, which is located between the signal transmission electrode 218 and the connection electrode 232. Thus, the signal on the conductive oxide layer (not shown) of the first electrode substrate 210B can be transmitted to the circuit board 240 by the signal transmission electrode 218, the conductive paste 280, the connection electrode 232, and the wire 25. In general, a part of the connection electrode 232 of the embodiment is electrically 12 1361994 WP9705-C207-0813 28557twf.doc/n is connected to the first electrode substrate 21〇B′ and the other part is electrically connected to the first Two electrode substrate 230. In this way, any signal generated on the electrode substrate (21〇b or 230) can be transmitted to the circuit board 240 through the connection electrode 232 and the wire 250 to complete the transmission of the touch control signal. Meanwhile, as seen from the cross-sectional views of FIG. 4 and FIG. 5, the connection line design of the touch panel 2 can make the touch panel 200 have a flat outer surface, particularly the outer side of the carrier substrate 210A, thereby contributing to the lifting. The process yield of the touch panel 2〇〇 when attached to other devices. W' In the present embodiment, the first electrode substrate 21A and the second electrode substrate 230 are made of, for example, a flexible plastic substrate plated with a conductive oxide layer. Since the touch panel 200 is often attached to the display panel to form a touch-sensitive display device, the conductive oxide layer is preferably made of a transparent conductive oxide to provide good light transmittance. For example, the permeable conductive oxide is, for example, indium tin oxide, indium zinc oxide or the like. FIG. 6 is not a top view of the touch panel of FIG. 2 . Please refer to the 6' touch panel 200 as, for example, a line area CA having an action area AA and a periphery of the area AA. The action area is mainly from the touch panel to detect the area where the touch (4) action is performed, and the line area CA is configured with the signal transmission wheel related Weng. In general, the board has made the electronic device have a larger screen and better operation. ^ _ ^ ί ί ί ί CA design, Figure 6 will connect the electrode 232, ^ wire conductive pad 244 and circuit board 240 thin Will show it. The design of the line area CA is, for example, the same as that of the above-mentioned circuit design. 13 1361994 WP9705-C207-0813 28557twf.doc/n It is said that the touch panel 200 can be provided with a flat surface by using the wire diameter. The outer surface. As can be seen from Fig. 6, the area occupied by the line area CA of this embodiment is only about one long rectangular area, and the area occupied by the action area AA can be moderately increased. As such, in devices of the same size design, the device using the touch panel 2 can have a larger display screen and is more in line with market demand. In summary, the present invention connects the plurality of wires to the connection electrode of the second electrode substrate and the circuit board by the recess of the substrate and the first through hole, the second through hole, the third through hole and the fourth through hole. The conductive pads are such that the transmission line between the second electrode board and the circuit board is not exposed or protrudes from the outside of the two panels. That is to say, the financial aspect of the present invention is reduced by a flat outer surface to help improve the touch panel when attached to other components: 2 additionally 'connecting electricity (four) and conductive connection using up and down staggered configuration === The connection between the signals is reached, and the high touch limit is: ΐ二常=非: :==二范围内' When a few changes can be made and _, whichever is the case. Re-drying is defined by the scope of the patent application attached to the following [Simplified description of the drawings], and 'e shows a schematic cross-sectional view of a conventional touch panel. 2 is a perspective view of a touch panel according to an embodiment of the present invention. 14 1361994 WP9705-C207-0813 28557twf.doc/n. 3 is a partial cross-sectional view of the touch panel taken along the X direction of FIG. 2. 4 and 5 are partial cross-sectional views of the touch panel taken along the Y direction of Fig. 2. FIG. 6 is a top view of the touch panel of FIG. 2 . [Description of main component symbols] 100, 200: touch panel 110, 210B · · First electrode substrate 112 : through holes 120 , 230 : second electrode substrate 130 : flexible circuit board 140 : metal pins 14 〇 3 ·. The disk-shaped head portion 210Α: the carrier substrate 212: the groove 214: the upper surface 216Α: the first through hole 216Β: the second through hole 218: the signal transmission electrode 220: the spacer layer 222: the third through hole 232: the connection electrode 15 1361994 WP9705-C207-0813 28557twf.doc/n 240: circuit board 242: fourth through hole 244: conductive pad 250: wire 260: adhesive 270: protective layer 280: conductive adhesive AA: action area CA: line area

Claims (1)

1361994 WP9705-C207-0813 28557twf.d〇c/n 十、申請專利範圍: 1- 一種觸控面板,包括: 一承載基材,具有一凹槽、一上表面以及多個第一貫 孔,該上表面與該凹槽位於相對的兩側且該些第—貫孔連 通於該上表面與該凹槽; 一第一電極基板’配置於該承載基材之該上表面上,1361994 WP9705-C207-0813 28557twf.d〇c/n X. Patent Application Range: 1- A touch panel comprising: a carrier substrate having a groove, an upper surface and a plurality of first through holes, The upper surface and the groove are located on opposite sides, and the first through holes are connected to the upper surface and the groove; a first electrode substrate 'is disposed on the upper surface of the carrier substrate, 該第一電極基板具有多個第二貫孔以暴露出該些第一貫孔 所在區域; ' 間隔層,配置於該第一電極基板上,該間隔層具有 多個第三貫孔,該些第三貫孔暴露出該些第二貫孔所ς區 域; ^ 一第二電極基板,配置於該間隔層上,具有多個連接 電極’其中該些連接電極被該些第三貫孔暴露出來; 電路板’配置承載基材的該凹彳f巾,且該電路The first electrode substrate has a plurality of second through holes to expose the regions where the first through holes are located; a spacer layer disposed on the first electrode substrate, the spacer layer having a plurality of third through holes, the plurality of through holes The third through hole exposes the region of the second through hole; ^ a second electrode substrate disposed on the spacer layer and having a plurality of connecting electrodes 'the connecting electrodes are exposed by the third through holes The circuit board 'configures the recessed f towel carrying the substrate, and the circuit 貫孔以及多個導電接墊,該些第四貫孔暴 路出该些弟一貝孔所在區域;以及 孔、ί條,容置於該些社連通m、第二貫 第四貫孔内,且電性連接於該些連接電 極以及該些導電接墊。 -伴:專利範圍第1項所述之觸控面板,更包括 三3二;:::第―貫孔、該些第二貫孔、該些第 3·如該凹槽中,並包覆該些導線。 此第-勺,Γ 圍第2項所述之觸控面板,其中該 二第二貝孔的孔徑大於該些第—貫孔與該些第二貫孔的孔 17 1361994 28557twf.doc/n WP9705-C207-0813 徑,以使位於該些第—貫孔、該些第二貫孔以及該些第三 貝孔中的部份保護層實質上為τ字型。 ^ 如申凊專利範圍第2項所述之觸控面板,其中該 保護層實質上填平該凹槽。 、X ^ 如申凊專利範圍第2項所述之觸控面板,其中該 保濩層之材質例如為一絕緣膠。 6’如申凊專利範圍第5項所述之觸控面板,1中兮 絕緣膠包括紫外光固化膠。 、 7.如申請專利範圍第1項所述之觸控面板,i中 些連接電極與該些導電接墊為多個金屬電極。' 外一 8.如申請專利範圍第1項所述之觸控面板,其中該 第電極基板更具有多個訊號傳輸電極,電性連接至今此 連接電極。 〃二 I、9.如申請專利範圍第8項所述之觸控面板,更包括 導電膠,位於各該訊號傳輸電極以及各該連接電極 一 =·如申請專利範圍第1項所述之觸控面板,更包括 一黏著劑’該電路板藉由絲著讎著於該承載基材之該 凹槽内。 Λ U·如申請專利範圍第1項所述之觸控面板,其中該 電路板為一可撓性電路板。 12.如申請專利範圍第i項所述之觸控面板,其中該 -導線的材質包括銀、鋁、銅或上述之組合。 18a through hole and a plurality of conductive pads, the fourth through holes violently exiting the area where the brothers and the first holes are located; and the holes and the strips are accommodated in the social communication m and the second through fourth through holes And electrically connected to the connecting electrodes and the conductive pads. - accompanying: the touch panel of the first aspect of the patent, further comprising three 3 2;::: the first through hole, the second through hole, the third portion, such as the groove, and covered The wires. The touch panel of the second aspect, wherein the apertures of the second second holes are larger than the holes of the first through holes and the second through holes 17 1361994 28557twf.doc/n WP9705 a diameter of -C207-0813 such that a portion of the protective layer located in the first through holes, the second through holes, and the third plurality of holes is substantially t-shaped. The touch panel of claim 2, wherein the protective layer substantially fills the recess. The touch panel of claim 2, wherein the material of the protective layer is, for example, an insulating glue. 6' The touch panel of claim 5, wherein the insulating adhesive comprises a UV curable adhesive. 7. The touch panel of claim 1, wherein the connecting electrodes and the conductive pads are a plurality of metal electrodes. The touch panel of claim 1, wherein the first electrode substrate further has a plurality of signal transmission electrodes electrically connected to the connection electrodes. The touch panel of claim 8, further comprising a conductive adhesive, located at each of the signal transmitting electrodes and each of the connecting electrodes = a touch as described in claim 1 The control panel further includes an adhesive 'the circuit board is held in the groove of the carrier substrate by wire. The touch panel of claim 1, wherein the circuit board is a flexible circuit board. 12. The touch panel of claim i, wherein the material of the wire comprises silver, aluminum, copper or a combination thereof. 18
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