1355832 ·▲ 補充修正日期:100年11月11日 • 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種混合式散熱裝置及其製法及結合其散熱裝 置的電子元件，尤指一種兼具熱管及加大散熱面積之散熱效果， 不僅可有效提升電子元件的散熱效能，而且具有模組化效果而易 於量化生產製造之技術。 【先前技術】 隨著科技進步，電子產品不斷地推陳出新。而大都數的電子 產品’由於強調輕薄短小’以及處理速度，相對地其上的運算或 處理元件，主要都是以半導體製成的電子元件，它們在小體積及 • 快速運轉的環境下’便很容易產生極大的熱量，例如中央處理器， ' 裝置有各式電子晶片的主機板’或是以蠢晶製成的發光二極體， 它們在啟動運轉後，很快就會產生很大的熱量，若不將其熱量有 效散除以降低溫度，在高溫的環境下工作，便會減低其處理或運 算的速度，甚至容易造成損壞，而熱之排除，一般需藉由傳導、 對流及輻射方式將熱排出于周圍環境，降低電子產品的運轉溫 度，以維持系統運轉的穩定度與可靠度。為了將電子元件或半導 體電子元件運作時所產生的熱量散除，以提升或轉其應有的處 理運轉之速度，及避免造壞而無法朗，電子元件中的 機板中央處理器或發光二極體，都會加設有散熱裝置或散熱 模組’藉由散錄置來_雜的效I最傳_散熱裝置是^ 有散熱‘鰭片，散熱鍺片為一種固定於電子元件表面之導熱性材 3 1^558^2 , 補充修正日期:100年11月11日 -料，藉以將電子元件產生之熱料至環境，其構造多為底板 和籍片所組成’底板部份直接與電子元件接觸，主要侧為均熱， 使熱快速傳導及擴散，而韓片部份之作用為散熱，藉由表面積之 增加來傳遞經由底板所擴散之熱，並由空氣職將熱自鰭片表面 散至周圍環境。當鰭片表面積越大’其散熱效果越佳，愈能使電 子70件達到應有之效能，愈具有節能之效果。於電腦散熱片的應 用中’對於散熱元件所會產生之影響因素為以下各項：丨.製程的 影響：包括材料因素、應力集中、接觸面及裂縫等均會影響 熱傳效果；2.環境因素：由於電腦内部阻礙過多，不利於氣流流 • 通，導致散熱不良，使散熱片效果降低。 轉型散熱片為使用最廣泛之散熱片製程，製造方式係將銘 _熱，加溫至約52G〜54(rc，於高壓下讓織__模具，做 出具連續平行溝槽之散熱片初胚，再經由二次加工，將初胚裁剪、 剖溝後製成散熱片。-般常用的轉型材料為_63，其具有良 好熱傳導率（約16H8G W/m.K)與加工性，為最普遍應用之製程。 輯型散熱片由於資本投資與生產成本較低，且具有低技術門 檻模具費低、開發期短之優點，普遍用於較不受空間限制之桌 上㈣腦與値器上。然而，_型散熱片受限於製程方式，其 形狀單純、欠缺變化，難以適應新產品關發，域_⑽㈣ 細長比有其關（約<15)，在有限空町難啸高散細積與熱傳 效率’故散熱效果較差。在桌上型計算機工作頻率已達到3版以 上’崎酿㈣的朗已受_縮，需尋求技術與材料上的進 1355882 補充修正日期:100年11月11日 一步突破。再者’鋁擠型散熱片由於技術門植低與價格低之因素， 獲利空間有限，於獲利不易下，其生產重心已逐漸轉往中國。表 一所示為各種不同散熱片製程之能力限制，表二所示為各種散熱 片製程之優缺點比較》 表一、各種不同散熱片製程之能力限制 傳統製程 百前較創新的製程 參數 擠型 mm 接合 折彎 改良壓鑄 麟 刨製 機械加工 Μιη, ό' ,mm 1.0 1.0 0.75 0.25 0.2 0.4 0.3 0.5 Max.H/S 12:1 10:1 60:1 40:1 >50 50:1 25:1 50:1 Min,S.mm 3.2 2.0 0.8 1.25 0.2 1 2 1 材料 鋁 鋁鈴金 銘，銅，鎂 銘，銅 銘齡金 鋁 鋁 錫，銅，鎂 (註：（5 :鳎片厚度，H:鮪片高度，S:鲔片間隔) 表二、各種散熱片製程之優缺點比較 材料種類 材料製程 優 點 缺 駐 A6063 銘換型(Extrusion) 成本低廉 聞發期短 細長比<15 形狀單纯 1070, ADC12, A356, A6061,Cu 磨錄(Die Casting) 可作複雜形狀 散热面積大 量產性佳 開發成本高 開發時間長 模具费用高 A1 Alloy 改良式壓鑄 (Modified Die Castii32) 可-插入超薄的A1或Cu鰭片 量產性較差 有界面&抗間題 lxxx, 7xxx A1 锻造(Forging) 材料抵密髙 高细長比 可®化形狀 模具費用較高 需二次加工 Al. Cu 接合型(Bonding Fius) 高麵長比 重量輕、散热面積大 不同材科之接合 有界面阻抗 可靠度較差 Al, Cu 折货型(Folded FinsJ 高細長比 重量輕、散熱面積大 可接合不珂材料 界面扭抗大 形狀單纯 鼓租多、量產性較差 Al * Cu 機械加工漤 (Machining) 容易自動化 適合铜散熱片 材料損耗化 量產速率慢 6063, Cu Alloy 到床(Skiving) 散熱片面積大 底座與鳍片一體成型 重量輕 鰭片無法太高 限於單纯之Pin-fm结搆 Cu. Cu-W 金屬粉末射出 —®成形 適用於销合金_ 原料成本比較昂貴 良率較其它敦程低 鋁壓鑄型散熱片是在鋁擠型外，另一個常被用來製造散熱片 的製程方式為鋁壓鑄型散熱片。其製程係將鋁錠熔解成液態後， 充填入金屬模型内，利用壓鑄機直接壓鑄成型，製成散熱片，壓 鑄型散熱片可依需求作成複雜形狀，亦可配合風扇及氣流方向作 5 13558821355832 ·▲ Supplementary Amendment Date: November 11th, 100th, 2016. 6. Description of the Invention: The present invention relates to a hybrid heat sink, a method of manufacturing the same, and an electronic component incorporating the heat sink thereof, especially a type It has the heat pipe and the heat dissipation effect of increasing the heat dissipation area, which not only can effectively improve the heat dissipation performance of electronic components, but also has a modular effect and is easy to quantify the manufacturing technology. [Prior Art] With the advancement of technology, electronic products are constantly being introduced. Most of the electronic products 'because of the emphasis on thin and light' and processing speed, the relative computing or processing components are mainly electronic components made of semiconductors, which are small in size and fast-moving environment. It is easy to generate a lot of heat, such as the central processing unit, 'the motherboard with various electronic chips' or the light-emitting diodes made of stupid crystals, which will generate a lot soon after starting up. Heat, if it is not effectively dissipated to reduce the temperature, working in a high temperature environment will reduce the speed of its processing or calculation, and even cause damage, and the heat is generally excluded by conduction, convection and radiation. The method discharges heat to the surrounding environment and reduces the operating temperature of the electronic product to maintain the stability and reliability of the system operation. In order to dissipate the heat generated by the operation of electronic components or semiconductor electronic components, to increase or transfer the speed of the processing operation, and to avoid damage, the central processing unit or the light-emitting diode in the electronic components In the polar body, there will be a heat sink or a heat sink module. By means of the scatter, the efficiencies are the most common. The heat sink is a heat sink fin. The heat sink is a heat sink fixed to the surface of the electronic component. Material 3 1^558^2, Supplementary revision date: November 11th, 100th, in order to bring the hot material generated by the electronic components to the environment, the structure is mostly composed of the bottom plate and the piece of the substrate. When the components are in contact, the main side is soaked, the heat is quickly conducted and diffused, and the function of the Korean part is heat dissipation. The heat generated by the bottom plate is transmitted by the increase of the surface area, and the air is heated from the surface of the fin. Scattered to the surrounding environment. When the surface area of the fin is larger, the better the heat dissipation effect, the more the 70 pieces of electrons can achieve the desired performance, and the more energy-saving effect. In the application of computer heat sinks, the factors affecting the heat dissipating components are as follows: 丨. The influence of the process: including material factors, stress concentration, contact surfaces and cracks, etc., will affect the heat transfer effect; 2. Environment Factors: Due to excessive internal obstruction of the computer, it is not conducive to airflow and ventilation, resulting in poor heat dissipation and reduced heat sink effect. The heat sink is the most widely used heat sink process. The manufacturing method is to heat the heat to about 52G~54 (rc, let the weave __ mold under high pressure, make the heat sink with continuous parallel grooves After secondary processing, the initial embryo is cut and grooved to form a heat sink. The commonly used transformation material is _63, which has good thermal conductivity (about 16H8G W/mK) and processability, which is the most common application. Due to the low capital investment and low production cost, and the low technical cost and short development period, the heat sink is generally used on the table (4) brain and sputum which is not limited by space. , _ type heat sink is limited by the process method, its shape is simple, lack of change, it is difficult to adapt to the new product shutdown, domain _ (10) (four) slender ratio has its off (about < 15), in the finite air town difficult to scream high dispersion With the heat transfer efficiency, the heat dissipation effect is poor. The working frequency of the desktop computer has reached 3 or more. The Razaki (4) Lang has been subject to shrinkage. It is necessary to seek technical and material advances. 1355882 Supplementary amendment date: 100 years November One step breakthrough on the 11th. In addition, 'aluminum extruded heat dissipation Due to the low technology and low price, the profit margin is limited, and the profit is not easy to be transferred. The production focus has gradually shifted to China. Table 1 shows the capacity limitations of various heat sink processes, as shown in Table 2. Comparison of the advantages and disadvantages of various heat sink processes. Table 1. The ability of various heat sink processes to limit the traditional process. More innovative process parameters. Extrusion mm. Bonding and bending improvement. Die-casting machine processing Μιη, ό' , mm 1.0 1.0 0.75 0.25 0.2 0.4 0.3 0.5 Max.H/S 12:1 10:1 60:1 40:1 >50 50:1 25:1 50:1 Min, S.mm 3.2 2.0 0.8 1.25 0.2 1 2 1 Material Aluminum-aluminum bell gold, copper, magnesium, copper, gold, aluminum, aluminum, tin, copper (Note: (5: thickness of the sheet, H: height of the sheet, S: septum spacing) Table 2, various heat sink processes Advantages and Disadvantages Comparison of Material Types Material Process Advantages Missing A6063 Extrusion Low Cost and Short Sleeve Ratio <15 Shape Simple 1070, ADC12, A356, A6061, Cu Die Casting Complicated Shape heat dissipation area, large yield, good development cost, high development time, long mold High cost A1 Alloy Modified Die Castii32 can be inserted into ultra-thin A1 or Cu fins. Poor mass production interface & anti-interaction lxxx, 7xxx A1 Forging material, high density, slender ratio Highly costable molds require secondary processing. Al. Cu Bonding Fius High surface length is lighter in weight and heat dissipation area is different. The joints of the materials have poor interface resistance reliability. Al, Cu Discounted type (Folded) FinsJ high slender ratio, light weight, large heat dissipation area, can be joined, material interface, torsion resistance, large shape, simple drum rent, poor mass production, Al * Cu machining, Machining, easy to automate, suitable for copper heat sink material loss mass production Slow rate 6063, Cu Alloy to Skiving Heat sink area Large base and fins Integrated lightweight fins can not be too high limited to pure Pin-fm structure Cu. Cu-W Metal powder injection -® forming is suitable for Pin alloy _ raw material cost is relatively expensive. Compared with other Duncheng low aluminum die-casting heat sinks, it is used in aluminum extrusion. Another process commonly used to make heat sinks is aluminum die-casting heat sinks. The process is to melt the aluminum ingot into a liquid state, fill it into a metal mold, directly die-cast molding using a die-casting machine to form a heat sink, and the die-casting heat sink can be made into a complicated shape according to requirements, and can also be matched with the fan and the airflow direction 5 1355882
再者，真空壓鑄技術中-個重要的技術參數是模具内真空壓 力。近年來，國内外研究人員_這—技術開展了大量工作然 而，多數工作並沒有針對模具内的實際真空壓力進行研究。一般 來說，輯生產中的型腔排氣並不充分，型腔壓力—般高於 Pa，這種真空壓鑄的降低鎊件含氣量效果不夠穩定，真空系统 料有導流效果的散刻，且能做㈣且====二 積’故普遍用於受郎限制的筆記型電腦上。—般常用的麟型 齡金為節2，由於壓鑄成型性良好，適用於做薄鱗件作因執 f率較差（約96叫現在多以卿〇崎來做為壓鑄材料，、 ，、熱傳導率尚達200 _左右，具有良好的散熱效果，但是以 AA1070 _來_存在著—些如下所述之問題： 1.表面流紋和氧化渣太多 2. 内部微縮孔偏高，降低實質熱傳導率α<麵/mK) 3. 壓鑄模具易受鋁液侵蝕，模具壽命過短 4. 成型性較差，不適合薄肉件 5. 材質較軟，易發生變形。 主要表現幻丨導合金充填型腔的個，只能稱為“真空輔助壓 鑄”。日本壓鑄界對真空麟進行了長期深入的研究，最先提出 型腔真空壓力<5kPa的高真空壓鑄技術’使壓鑄件性能得到了進一 步的提升。針對真空壓鑄程序中型腔真空壓力的變化也有一定的 研究成果發表。高真空壓鎊技術目前主要有兩種；—是由德國 MuHingarten公司和Vaw公司聯合研發的法，二是 補充修正日期:100年11月11日 德國Alcan-BDW公司推出的MFT法。Vacural法是將熔化爐通過升 液管和壓射室直接鄉連，抽真空時先將金屬鋁液吸入到壓射室 内，接著繼續抽真空至預定真空度後再壓射成形。MFT(Minimum Fill Time)法則是使用普通壓鑄機，其工藝特點是採用多洗道和 大面積内洗口以保證金屬紹液在極短時間内充填型腔。由於 Vacural法需要專用壓鑄機，且技術受專利保護，所以壓鑄機價格 昂貴，成本很高。相對而言，MFT法由於使用的是普通壓鑄機，設 備門檻低，_普及輪高，制前景好。射—種日本雅馬哈 公司開發的Vac_ Golve Box法，其因考慮到頂杆無抽芯處的密 封較困難，採取的結構是將整個模具裝在一個密封罩内並設置 有幾個抽氣瞒來抽取密封罩_具情空氣，趣了模^腔 中的南真空度。 有鏗於現有習知散熱技術產生諸多缺失，本發明乃針對散熱 結構做研發設計，並配合自行曝之真空麟製程技術來製_ 式散熱片，針對上述現有散熱片的缺點加以改進，設計出一種散 熱\用壓鑄合金’兼具材料之熱傳導率與鑄造性。使用該壓鱗合 金之散熱結構，其熱阻抗值均比ADC12或1〇7〇來得佳❶同時，利 用真空辅助壓鑄製程，可以提高鑄_捲氣齡,件機械性質 特性與密度有大幅改it，麟件在祕理録岐 麵製程降低許多。 得統 【發明内容】 本發明之β目的，在於提供—射纽財胁容易發熱 13.55882 補充修正日期:100年11月U日 •-之半導體元件的散熱效能之散熱裝置。其-方面係利料列分佈 且一端為自由端的導熱柱，以產生所謂pin-fin的散熱效果，並 在導熱柱内填裝具有更佳導熱效率的導熱材，使半導體元件所生 之熱源，透過基座後立即經由導熱材而快速傳導至導熱柱，並延 伸至其自由端，再由導熱柱散至其周圍的空氣中，而達到快速有 效散熱的效果。另方面則更可以液態導熱材料為導熱材，藉由液 態自然對流的熱管(heat pipe)原理，輔助快速做冷熱交換，進而 以更為經濟的方式，達到提升更佳的散熱效能之目的。 達成上述目的之本發明技術手段，係包括一金屬製基座及複 數個金屬製長條狀的導熱柱，基座具有_第—面及—第二面，每 - 一該複數個導熱柱具有一第一端及一第二端，該複數個導熱柱之 該第一端接設於該基座之該第一面，而該導熱柱的該第二端為自 由端’該基座供裝置至少-半導體電子元件，藉該基座及該複數 個導熱柱而可辅助該半導體電子元件做散熱。其中，基座的該第 二面上設有一具開口之容槽，每一該複數個導熱柱呈管狀而於内 部形成一腔室，且該導熱柱的該第一端具開口，而該第二端則呈 封閉，每一該複數個導熱柱之該腔室與該基座之該容槽相通，於 該容槽及該腔室内同時容置導熱材，並於該容槽之該開口覆設蓋 體，使該導熱材有效留置於該容槽及該腔室内部。 【實施方式】 I·本發明之特點及應用原理 i·本發明的特點 8 1355882 補充修正日期:1〇〇年11月11日 為了有效提升散熱裝置對於容易發熱之半導體元件的散熱效 能，本發明人乃利用在導熱柱内填裝具有更佳導熱效率的導熱 材，使半導體元件所生之熱源，透過基座後立即經由導熱材而快 速傳導至導熱柱，再由導熱柱散至其周圍的空氣中，而達到快速 有效散熱的效果。而且，本發明更可以液態導熱材料為導熱材， 藉由液態自然對流的熱管（heat pipe)原理，辅助快速做冷熱交 換，進而以更為經濟的方式，達到提升更佳的散熱效能之目的。 ii.本發明的應用原理 -般熱管由下列三要素組成：a)封閉容器（CQntainer) ; ^毛 細結構(wick structure);及 c)工作流體(w〇rking fluid)。熱管 可被劃分為三部份：a)蒸發段(evaporat〇r secti〇n) ; b)絕熱段 (adiabatic section);及 c)冷凝段(condenser secti〇n)。 其工作原理’祕以第十三、十四圖，係#發熱元件與蒸發 段接觸後，便將熱量傳給容H管壁、毛細結構和工作流體。工作 流體受熱後吸賊化潛錢絲汽。由於蒸發段的蒸汽壓力高於 冷凝段，因此_形成壓力差，鶴蒸汽絲發段流向冷凝^。、 蒸汽在冷凝段冷凝時放域化潛熱，通過毛細結構、管壁傳到熱 管的散熱[由於紐的賴，在紐段的工作流贿面在毛細 結構内形成不同_率半徑，所因而產生的毛細力將冷凝液由冷 凝段抽酬級段，並完成—個工作魏m毛細結_ 產生的毛細力大於熱管⑽總壓降，熱管即能正常工作。 π·本發明的具體實施 1355882 補充修正日期:100年1丨月11日 i.本發明具體實施例的基本特徵 請參看第一至四圖所示，本發明所設計之半導體電子元件之 混合式散熱裝置，其包括一金屬製基座（10)、蓋體(4〇)及複數個 金屬製長條狀的導熱柱(20)。其中，基座（10)具有相反朝向的一 第一面（11)及一第二面（12)。每一該複數個導熱柱(2〇)具有一第 一、(21)及一第二端(22)，該複數個導熱柱(2〇)之該第一端（21) 接設於該基座（10)之該第一面（11)，且該導熱柱(2〇)的該第二端 (22)為相對基座（1〇)呈遠離的自由端，為了便於製造及提升散熱 效率，一種較佳實施例，該導熱柱(20)的軸線呈直線延伸。如第 七、八圖所示，該基座（10)供裝置於至少一電子元件或半導體電 子元件（50)上，其可配合電子元件的方位而呈直立或橫置或其他 任意方位的安置，只要基座（10)的第二面（12)較第一面（11)臨近 該半導體電子元件，即可藉著該基座（10)及該複數個導熱柱(20) 來輔助該半導體電子元件做有效散熱。其中，本發明所應用裝設 的半導體電子元件可為中央處理器（CPlJ)(如第七圖所示），或其 他各式的電腦用電子元件，亦可為發光二極體(LE：D)(如第八圖所 示）。 本發明的主要特徵，係該基座（10)的該第二面（12)上設有一 具開口（14)之容槽（13)，每一該複數個導熱柱(2〇)呈管狀而於内 部形成一腔室（23)，且該導熱柱（20)的該第一端（21)具開口 (25)，而該第二端（22)則呈封閉，每一該複數個導熱柱(2〇)之該 腔室（23)與該基座（1〇)之該容槽〇3)相通，於該容槽〇3)及該腔 10 1355882 ' 補充修正曰期:1〇〇年丨丨月丨1曰 室（23)内同時容置導熱材，並於該容槽（13)之該開口（14)覆設蓋 體(40)，使該導熱材(30)有效留置於該容槽（13)及該腔室（23)内 部。 i i.本發明的較佳實施例 請參看第一至四圖所示，本發明一種較佳實施例，該複數個 導熱柱(20)呈陣列分佈。其中，更佳的實施例，係該基座（1〇)呈 矩形，而該複數個導熱柱（2〇)呈矩形陣列。藉此，可使熱源之傳 導更為均勻，散熱更佳。再者，一種更佳的實施例，該複數個導 熱柱相互之間呈等距離分佈，如此可使散熱更為均勻。 請參看第一至四圖所示，本發明一種較佳實施例，該導熱柱 (2〇)的周面佈設有複數個長條狀的緒片（24),該鍺片（24)長度係 與3亥導熱柱(20)之軸線平行延伸。藉由鍺片（24)的設計，使得導 熱柱(20)周圍的空氣具有較佳的導流效果，以利空氣對於導熱柱 (20)上的熱量做冷熱交換，更為提升散熱效果。 清參看第五圖所示’本發明的導熱柱(2〇)可以為圓柱體，亦 可以為多邊柱體，如第三騎補四雜，或第六騎示之六邊 柱°其中’無論導熱柱是圓柱體、四邊柱體或是六邊柱體，本發 明-種較佳實施例，其導熱柱(2〇)的每邊面都可各加設有複數個 長條狀_片（24)。藉由緒片均勻地分佈在導熱柱⑽）的周面， 讓導熱柱(2__域具有更佳且更有效的導紐果，使更充 足的空氣可對導熱柱⑽)上的熱量做冷熱交換，更能提升整體的 散熱效能。 13558.82 浦充修正日期:丨00年11月11日 請參看第一圖所示’本發明為了提升散熱效能，其導熱柱(20) 與基座（10)可為一體成型，其製造時，取鋁、銅、鋅或其他高熱 導係數之金屬的其申一種或多種，利用真空壓鑄，即可一體製成。 亦即，導熱柱(20)與基座（10)係以同一金屬材料經由壓鑄加工方 式而一體成型。 請參看第一、四圖所示，本發明為了提升散熱效能，或便於 導熱材之更換，可在基座（1〇)—側邊設有一通孔（15)，該通孔貫 通該容槽（13)，並以一桿塞（16)配合封住通孔（15)，可供一使用 者拆下桿塞（16)，而於該通孔（15)將原來舊的導熱材洩除，再注 入新的導熱材，再以桿塞（16)封住通孔（15；^更可配合加設一與 該容槽（13)相通的出口，於該出口及該通孔（15)分別連接一導管 至一導熱材源，利用一泵浦而可使導熱材不斷循環，以提高散熱 效能。再者，一種更佳實施例，係通孔（15)設有内螺牙，而桿塞 (16)設有相配合的外螺牙，桿塞（16)與通孔（15)以螺合方式結 合，其桿塞（16)可供調整基座（1〇)之容槽（13)及導熱柱(2〇)之腔 室（23)内部的導熱材之壓力，當桿塞（16)更為伸入通孔（15)，可 增加容槽（13)及腔室（23)内部的之壓力，反之，若反向調整則可 降低容槽（13)及腔室（23)内部的壓力。 為了確保散熱效能，除了具有上述的基本結構特徵之外，本 發明也可如同胃知鮮—樣，在導齡⑽)之腔室⑽壁面設置 毛細結構。藉由毛細結構所產生的毛細力大於熱管内的總壓降， 俾使熱管能正常工作。其毛細結構，可以在腔室（23)内壁設溝槽、 12 •燒結銅絲、裝置金屬網或纖維其中之—丨〇〇年1丨月丨丨日 冚.本發明的基本製造方式 1.本發明第一種基本具體製造方式 請配合參看第四、九圖所示，本發明第一種基本具體製造方 式，係包括有以下的流程步驟： (al)準備金屬材料，解備的金屬材料可雜、銅、辞或其 他高熱導係數之金屬的其中一種或多種； ⑽將金屬材料真空壓鑄而形成—基座⑽及複數個導熱柱 ⑽）’並另成型-蓋體⑽’其中，基座⑽與導熱柱⑽)為一 體成型，基座（10)具有相反朝向的一第一面（Η)及一第二面 (⑵’其第二面（⑵上設有-具開口（14)之容槽（13)，每一導熱 柱(20)呈管狀而於内部形成一腔室（23)，且導熱柱(2〇)的第一端 (21)具開口（25) ’第二端(22)呈封閉，每一該複數個導熱柱(2〇) 之腔室（23)與基座（10)之容槽（13)相通； (cl)將基座（10)、蓋體(4〇)及導熱柱(2〇)洗淨； (dl)於導熱柱(20)的腔室（23)内壁設置毛細結構； (el)將蓋體(40)與基座（1〇)蓋合，以蓋體(4〇)封住基座（1〇) 的容槽（13)開口（14);及 (fl)於導熱柱(20)之腔室（23)内填充液態之導熱材(30)，使 導熱材(30)封存在腔室(23)内部，而為成品。 ii.本發明第二種基本具體製造方式 請配合參看第四、十圖所示，本發明第一種基本具體製造方 13 13.55832 補充修正曰期:丨〇〇年11月11曰 ， 式，係包括有以下的流程步驟： (a2)準備金屬材料’所準備的金屬材料可以鋁、銅、鋅或其 他高熱導係數之金屬的其中一種或多種； (b2)將金屬材料真空壓鑄而形成一基座（1〇)、一蓋體(4〇)及 複數個導熱柱(20)，其中，基座（1〇)具有相反朝向的一第一面（11) 及一第二面（12)，其第二面（12)上設有一具開口（14)之容槽 (13)，每一導熱柱(20)呈管狀而於内部形成一腔室⑵），且導熱 柱(20)的第一端（21)具開口（25)，第二端(22)呈封閉； (c2)將基座（10)、蓋體(4〇)及導熱柱(2〇)洗淨； (d2)於導熱柱(20)的腔室（23)内壁設置毛細結構； (e2)將導熱柱(20)的第一端燒焊熔接於基座（10)，使導熱柱 (20)的腔室（23)與基座〇〇)的容槽（13)相通； (f2)將蓋體(40)與基座（1〇)蓋合，以蓋體(4〇)封住基座（1〇) 的容槽（13)的開口（14);及 (g2)於導熱柱(20)之腔室（23)内填充液態之導熱材(30)，使 導熱材(30)封存在腔室（23)内部，而為成品。 iii·本發明的實驗例 本發明的第一實驗例，其製造的步驟為：先做熱流的設計— 基座、導熱柱及蓋體以機械加工成型—以化學溶劑對基座、導熱 柱及蓋體除脂及進行超音波洗淨—利用燒結銅粉粒的技術，而在 導熱柱之腔室内壁形成毛細結構->將導熱柱溶接在基座上，並將 蓋體與基座蓋合θ對導熱柱内部進行真空測漏—並做真空烘烤— 14 1355882 谁/-亩处， 補充修正曰期:100年1丨月11日 订具二除氣’再將導熱材定量充填於導熱柱的腔室内，而完成 成品製造。 晴配合參看第十一至十四圖所示，本發明的第二實驗例，利 用如第十二圖所示之壓鑄機（6〇)及高真空壓鑄真空辅助系統 (61)，其中向真空壓鑄真空辅助系統(61)與壓鑄模具整合如 第十四圖所示，其製造的步驟為：先做熱流的設計—採用銘、銅、 鋅或其他高熱導係數之金屬材料’並_真空麟成型方法加工 成型基座與導熱柱為—體之結構，其巾，真空壓力低於1GT〇rr， 並配合〇型環密封模具，且製成一蓋體—以化學溶劑對基座、導 熱柱及蓋體除脂及進行超音波洗淨4利用燒結銅粉粒的技術，而 在導熱柱之腔室内壁形成毛細結構—將蓋體與基座蓋合—對導熱 柱内部進行真空測漏Θ並做真空烘烤—進行真空除氣，再將導熱 材定量充填於導熱柱的腔室内，而完成成品製造。其中，本發明 製程中以125T熱室壓鑄機(60)為主，模具為一模兩穴，只要數秒 鐘真空度即可達lOTorr以下，生產週期：包括抽真空及成型時間 <12sec。本發明針對模具(62)結構内之頂針、滑塊、分模面及退 座行程四大部份進行密封設計，真空變化小於15%。本發明配合 壓鑄機（60)做製程調整及最佳化，以提高鑄件微小特徵尺寸成形 性，最大等效孔隙直徑<0.15讓，測量面積之孔隙度<2%。 IV ·結論 藉由上述本發明之技術特徵’可歸納本發明具有下列之優點： 1.本發明於基座設容槽，並於導熱柱設腔室，於容槽及腔 15 13.55882 補充修正曰期:丨00年11月11曰 室容置液態導熱材，其導熱材大面積地分佈在基座上，大幅提 升導熱材對基座的攜熱額度，並且藉由熱管作用，進而可有效 提升其對於電子元件或半導體電子元件之散熱效能。 2.本發明基座與導熱柱可真空壓鑄一體成型，形成模組化 的簡潔構造，僅於基座覆蓋蓋體，再填充導熱材，即完成製造， 相當節省工時，因而可降低成本。 3·本發明基座之容槽與導熱柱之腔室連通，於基座一侧設 通孔及桿塞，即可自通孔洩除或填充導熱材，便於本裝置之重 複利用’既經濟，且環保。 4.本發明可在基座之容槽及導熱柱之腔室哺注液態的導熱 材並在腔至内壁5又毛細結構，使其產生有效的熱管散熱效果， 可讓本發明以最經濟的方式_最佳熱效能。 5·本發明應用於半導體電子元件，可應用於中央處理器（⑽ 或發光二極體(LED)的重要散熱。 6.本發月可延伸應用於各式新產品，例如平板式熱管、迴路 式熱管及其他電子散熱解決方案。 以上所述，僅為本發明 明之專利範圍，凡皋佑楠τ 之—可行實施例，並非用以限定本發Furthermore, an important technical parameter in vacuum die casting technology is the vacuum pressure in the mold. In recent years, researchers at home and abroad have done a lot of work, and most of them have not studied the actual vacuum pressure in the mold. In general, the cavity exhaust in the production is not sufficient, and the cavity pressure is generally higher than Pa. The effect of the vacuum die casting on reducing the gas content of the pound is not stable enough, and the vacuum system has the effect of diversion. And can do (four) and ==== two products' is commonly used on notebook computers subject to lang restrictions. The commonly used lining age gold is section 2, because of the good die-casting property, it is suitable for making thin scales. The implementation rate is poor (about 96 is now more than the use of Qingsaki as a die-casting material, ,, heat conduction The rate is up to 200 _, with good heat dissipation effect, but there are some problems as follows: AA1070 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Rate α < face / mK) 3. Die casting mold is easily corroded by aluminum liquid, mold life is too short 4. Formability is poor, not suitable for thin meat parts 5. The material is soft and prone to deformation. The main performance of the phantom guide alloy filling cavity can only be called "vacuum assisted die casting". Japan's die-casting industry has conducted long-term and in-depth research on vacuum lining, and first proposed the high-vacuum die-casting technology of cavity vacuum pressure < 5 kPa, which has further improved the performance of die-casting parts. A certain amount of research results have been published for the change of cavity vacuum pressure in the vacuum die casting process. There are two main types of high-vacuum pressure-pound technology; - a method jointly developed by MuHingarten and Vaw in Germany, and a supplementary amendment date: November 11, 100, the MFT method introduced by Alcan-BDW, Germany. The Vacural method is to directly connect the melting furnace through the riser tube and the injection chamber. When vacuuming, the metal aluminum liquid is first sucked into the injection chamber, and then the vacuum is continued to a predetermined degree of vacuum before being injection molded. The MFT (Minimum Fill Time) rule uses an ordinary die-casting machine. The process features a multi-washing and a large-area internal rinsing to ensure that the molten metal fills the cavity in a very short time. Since the Vacural method requires a dedicated die casting machine and the technology is patented, the die casting machine is expensive and costly. Relatively speaking, the MFT method uses a common die-casting machine, and the threshold of the equipment is low, and the wheel height is high, and the system has a good prospect. Shooting - the Vac_ Golve Box method developed by Yamaha Corporation of Japan, which is difficult to consider because it is considered that the ejector is not sealed at the core, the structure is to install the whole mold in a sealed hood and set several suction rafts to extract Sealing cover _ with air, interesting to the south vacuum in the cavity. In view of the many shortcomings of the existing conventional heat dissipation technology, the present invention is designed and developed for the heat dissipation structure, and is combined with the vacuum exposure process technology of self-exposure to manufacture the heat sink, and the shortcomings of the above-mentioned existing heat sink are improved and designed. A heat-dissipating / die-casting alloy 'has the thermal conductivity and castability of the material. Using the heat-dissipating structure of the scale-scale alloy, the thermal resistance value is better than that of the ADC12 or 1〇7〇. At the same time, the vacuum-assisted die-casting process can improve the casting age, and the mechanical properties and density of the parts are greatly changed. , Lin's process in the secret management process is much lower. [Description of the Invention] The purpose of the present invention is to provide a heat-emitting device for heat dissipation of semiconductor components in the U.S. It is a heat-conducting column with a distributed distribution and a free end at one end to generate a so-called pin-fin heat-dissipating effect, and a heat-conducting material having a better thermal conductivity is filled in the heat-conducting column to make a heat source generated by the semiconductor element, Immediately after passing through the susceptor, it is quickly conducted to the heat-conducting column via the heat-conducting material, and extends to its free end, and then is dispersed by the heat-conducting column to the air around it to achieve rapid and effective heat dissipation. On the other hand, the liquid heat conductive material can be used as a heat conductive material, and the heat pipe principle of the liquid natural convection assists in rapid hot and cold exchange, thereby achieving a better heat dissipation performance in a more economical manner. The technical means of the present invention for achieving the above object comprises a metal base and a plurality of metal strip-shaped heat conducting columns, the base having a first surface and a second surface, each of the plurality of heat conducting columns having a first end and a second end, the first end of the plurality of heat conducting columns is connected to the first side of the base, and the second end of the heat conducting column is a free end At least - a semiconductor electronic component, the susceptor and the plurality of thermally conductive columns can assist the semiconductor electronic component in dissipating heat. Wherein the second surface of the base is provided with an opening slot, each of the plurality of heat conducting columns is tubular and internally forms a cavity, and the first end of the heat conducting column has an opening, and the first The two ends are closed, and the chamber of each of the plurality of heat conducting columns is in communication with the receiving groove of the base, and the heat conducting material is simultaneously accommodated in the receiving groove and the cavity, and the opening is covered in the receiving groove The cover body is disposed such that the heat conductive material is effectively left in the pocket and inside the chamber. [Embodiment] I·Features and Application Principles of the Invention i·Features of the Invention 8 1355882 Supplementary Amendment Date: November 11th, 1st, in order to effectively improve the heat dissipation performance of the heat sink for semiconductor elements that are prone to heat, the present invention The person uses a heat-conducting material with better thermal conductivity in the heat-conducting column, so that the heat source generated by the semiconductor element is quickly transmitted to the heat-conducting column through the heat-conducting material through the susceptor, and then dispersed by the heat-conducting column to the periphery thereof. In the air, it achieves the effect of fast and effective heat dissipation. Moreover, the present invention can further improve the heat dissipation performance of the liquid heat conductive material by using the heat pipe principle of the liquid natural convection to assist in rapid hot and cold exchange, thereby achieving a better heat dissipation performance in a more economical manner. Ii. Application Principle of the Invention The general heat pipe is composed of the following three elements: a) a closed container (CQntainer); a wick structure; and c) a working fluid (w〇rking fluid). The heat pipe can be divided into three parts: a) an evaporation section (evaporat〇r secti〇n); b) an adiabatic section; and c) a condensation section (condenser secti〇n). The working principle of the secret is the thirteenth and fourteenth figures. After the heating element is in contact with the evaporation section, heat is transferred to the H-wall, capillary structure and working fluid. After the working fluid is heated, it sucks the thief to make money. Since the vapor pressure of the evaporation section is higher than that of the condensation section, the pressure difference is formed, and the flow section of the crane steam flows toward the condensation. When the steam condenses in the condensation section, the latent heat is released, and the heat is transferred to the heat pipe through the capillary structure and the pipe wall. [Because of the New Zealand's Lai, the working brittle surface in the new section forms different y-rate radii in the capillary structure, thus resulting in The capillary force will condense the condensate from the condensing section and complete the work--------------------------------------------------------------------------------------------------------------------------------------------- π·Specification of the Invention 1354882 Supplementary Amendment Date: 100 years 1 month 11th i. Basic features of a specific embodiment of the present invention, as shown in Figures 1 to 4, the hybrid of the semiconductor electronic components designed by the present invention The heat dissipating device comprises a metal base (10), a cover body (4 turns) and a plurality of metal strip-shaped heat transfer columns (20). The base (10) has a first face (11) and a second face (12) facing in opposite directions. Each of the plurality of thermally conductive columns (2) has a first (21) and a second end (22), and the first end (21) of the plurality of thermally conductive columns (2) is connected to the base The first side (11) of the seat (10), and the second end (22) of the heat conducting column (2) is a free end away from the base (1〇), for ease of manufacture and improved heat dissipation efficiency In a preferred embodiment, the axis of the thermally conductive column (20) extends in a straight line. As shown in the seventh and eighth figures, the pedestal (10) is provided on at least one electronic component or semiconductor electronic component (50), which can be placed in an upright or transverse position or in any other orientation in accordance with the orientation of the electronic component. As long as the second side (12) of the pedestal (10) is adjacent to the semiconductor electronic component than the first surface (11), the susceptor (10) and the plurality of thermally conductive columns (20) can be used to assist the semiconductor. Electronic components are used for effective heat dissipation. The semiconductor electronic component to which the present invention is applied may be a central processing unit (CP1J) (as shown in FIG. 7), or other various types of computer electronic components, or may be a light emitting diode (LE: D). ) (as shown in Figure 8). The main feature of the present invention is that the second surface (12) of the base (10) is provided with a slot (13) having an opening (14), and each of the plurality of heat conducting columns (2 turns) is tubular. Forming a chamber (23) therein, and the first end (21) of the heat conducting column (20) has an opening (25), and the second end (22) is closed, and each of the plurality of heat conducting columns The chamber (23) of the (2〇) is in communication with the pocket 〇3) of the susceptor (1〇), and the chamber 103) and the chamber 10 1355882 'Supplementary correction period: 1 year A heat-conducting material is simultaneously accommodated in the chamber (23) of the moon, and the cover (40) is covered in the opening (14) of the container (13) to effectively retain the heat-conducting material (30). The tank (13) and the interior of the chamber (23). Preferred Embodiments of the Invention Referring to Figures 1 to 4, in a preferred embodiment of the invention, the plurality of thermally conductive columns (20) are arranged in an array. In a preferred embodiment, the pedestal (1 〇) has a rectangular shape, and the plurality of thermally conductive columns (2 〇) have a rectangular array. Thereby, the heat source can be more uniformly guided and the heat dissipation can be better. Moreover, in a more preferred embodiment, the plurality of thermally conductive columns are equidistantly spaced from one another such that heat dissipation is more uniform. Referring to the first to fourth embodiments, in a preferred embodiment of the present invention, the circumferential surface of the heat conducting column (2〇) is provided with a plurality of strip-shaped pieces (24), and the length of the piece (24) is It extends parallel to the axis of the 3H heat conducting column (20). By the design of the cymbal piece (24), the air around the heat guiding column (20) has a better guiding effect, so that the air exchanges heat with the heat on the heat conducting column (20), thereby improving the heat dissipation effect. Referring to the fifth figure, the heat conducting column (2〇) of the present invention may be a cylinder or a polygonal cylinder, such as a third riding complement, or a sixth riding pole. The heat conducting column is a cylinder, a four-sided cylinder or a six-sided cylinder. In the preferred embodiment of the present invention, each of the heat conducting columns (2〇) may be provided with a plurality of strips each of the strips (2) twenty four). By evenly distributing the circumferential surface of the heat conducting column (10), the heat conducting column (the 2__ domain has a better and more effective guiding effect, so that more air can be exchanged for heat on the heat conducting column (10)). It can improve the overall heat dissipation performance. 13558.82 Pu-charge correction date: November 11, 00, please refer to the first figure. 'In order to improve the heat dissipation performance, the heat-conducting column (20) and the base (10) can be integrally formed. One or more of aluminum, copper, zinc or other metals having a high thermal conductivity can be integrally formed by vacuum die casting. That is, the heat transfer column (20) and the base (10) are integrally molded by die casting processing using the same metal material. Please refer to the first and fourth figures. In order to improve the heat dissipation performance or facilitate the replacement of the heat conductive material, a through hole (15) may be disposed on the side of the base (1 〇), and the through hole penetrates the cavity (13), and sealing the through hole (15) with a rod plug (16), for a user to remove the rod plug (16), and the original heat conduction material is discharged from the through hole (15) , injecting a new heat conductive material, and sealing the through hole with a rod plug (16) (15; ^ can also be coupled with an outlet that communicates with the receiving groove (13), at the outlet and the through hole (15) A conduit is connected to a heat conductive material source, and a heat pump is continuously circulated by a pump to improve heat dissipation performance. Further, in a further embodiment, the through hole (15) is provided with an internal thread, and the rod The plug (16) is provided with a matching outer thread, the rod plug (16) and the through hole (15) are screwed together, and the rod plug (16) is adapted to adjust the socket of the base (1〇) (13) And the pressure of the heat conductive material inside the chamber (23) of the heat conducting column (2), when the rod plug (16) protrudes into the through hole (15), the receiving groove (13) and the chamber (23) can be added. Internal pressure, and vice versa Adjustment can reduce the pressure inside the tank (13) and the chamber (23). In order to ensure the heat dissipation performance, in addition to the basic structural features described above, the present invention can also be used as the stomach, in the lead age (10) The wall of the chamber (10) is provided with a capillary structure. The capillary force generated by the capillary structure is greater than the total pressure drop in the heat pipe, so that the heat pipe can work normally. The capillary structure can be provided with a groove in the inner wall of the chamber (23), 12 • sintered copper wire, device metal mesh or fiber, which is one of the basic manufacturing methods of the present invention. The first basic specific manufacturing method of the present invention, please refer to the fourth and ninth drawings. The first basic specific manufacturing method of the present invention includes the following process steps: (al) preparing a metal material and preparing the metal material One or more of metals which may be miscellaneous, copper, rhodium or other high thermal conductivity; (10) vacuum casting of the metal material to form a susceptor (10) and a plurality of thermally conductive columns (10)) and further forming a cover (10) The seat (10) is integrally formed with the heat conducting column (10), and the base (10) has a first surface (Η) and a second surface ((2)' of the second side ((2) is provided with an opening (14)) a cavity (13), each of the heat conducting columns (20) is tubular and internally forms a chamber (23), and the first end (21) of the heat conducting column (2) has an opening (25) 'the second end (22) being closed, each of the plurality of thermally conductive columns (2) of the chamber (23) communicating with the receptacle (13) of the base (10); (cl) washing the base (10), the cover (4〇) and the heat transfer column (2〇); (dl) providing a capillary structure on the inner wall of the chamber (23) of the heat transfer column (20); The cover body (40) is covered with the base (1〇), and the cover (13) opening (14) of the base (1〇) is sealed by the cover body (4〇); and (fl) is applied to the heat transfer column (20) The chamber (23) is filled with a liquid heat-conducting material (30), so that the heat-conducting material (30) is sealed inside the chamber (23), and is a finished product. ii. The second basic specific manufacturing method of the present invention is referred to As shown in the fourth and tenth figures, the first basic concrete manufacturer of the present invention 13 13.55832 Supplementary amendment period: November 11th, the following, includes the following process steps: (a2) Preparation of metal materials' The prepared metal material may be one or more of aluminum, copper, zinc or other metals having high thermal conductivity; (b2) vacuum casting the metal material to form a pedestal (1 〇), a cover (4 〇) and a plurality of heat conducting columns (20), wherein the base (1) has a first face (11) and a second face (12) opposite to each other, and the second face (12) is provided with an opening (14) ) the slot (13), each heat conducting column (20) is Forming a chamber (2) inside, and the first end (21) of the heat conducting column (20) has an opening (25), the second end (22) is closed; (c2) the base (10), the cover (4〇) and the heat-conducting column (2〇) are cleaned; (d2) a capillary structure is disposed on the inner wall of the chamber (23) of the heat-conducting column (20); (e2) the first end of the heat-conducting column (20) is welded The base (10) is welded to the cavity (23) of the heat conducting column (20) to communicate with the cavity (13) of the base ;); (f2) the cover body (40) and the base (1〇) Covering, closing the opening (14) of the receiving groove (13) of the base (1〇) with a cover body (4〇); and (g2) filling the liquid chamber with the chamber (23) of the heat conducting column (20) The heat conductive material (30) is such that the heat conductive material (30) is sealed inside the chamber (23) and is a finished product. Iii· Experimental Example of the Invention The first experimental example of the present invention is manufactured by first designing a heat flow—a susceptor, a heat-conducting column, and a cover body are mechanically formed—with a chemical solvent to the susceptor, a heat-conducting column, and Degreasing of the cover and ultrasonic cleaning - using the technique of sintering copper particles, forming a capillary structure on the inner wall of the chamber of the heat transfer column - > melting the heat conducting column on the base, and covering the cover with the base θ θ vacuum leak detection inside the heat-conducting column - and vacuum baking - 14 1355882 Who / - acre, supplementary correction period: 100 years 1 month 11th set with two degassing 're-quantitative filling of thermal materials Finish the finished product manufacturing in the chamber of the heat-conducting column. Referring to Figures 11 to 14, the second experimental example of the present invention utilizes a die casting machine (6〇) as shown in Fig. 12 and a high vacuum die casting vacuum assisting system (61), wherein the vacuum is applied The die-casting vacuum assisting system (61) is integrated with the die-casting mold as shown in Figure 14. The manufacturing steps are: first designing the heat flow—using metal materials such as Ming, copper, zinc or other high thermal conductivity coefficients. The forming method processes the forming base and the heat conducting column into a body structure, and the towel has a vacuum pressure lower than 1GT〇rr, and is matched with the 〇-ring sealing mold, and is formed into a cover body - a chemical solvent to the base and a heat conducting column And the cover body is degreased and ultrasonic cleaning is performed. 4 The technique of sintering copper powder particles is used, and a capillary structure is formed on the inner wall of the heat-conducting column chamber—covering the cover body and the base—vacuum leak detection inside the heat-conducting columnΘ And vacuum baking - vacuum degassing, and then the thermal conductive material is quantitatively filled in the chamber of the heat conducting column to complete the finished product manufacturing. Among them, the 125T hot chamber die casting machine (60) is mainly used in the process of the invention, and the mold is a mold and two holes. The vacuum can be less than 10 Torr in a few seconds, and the production cycle includes vacuuming and molding time < 12 sec. The invention designs a sealing design for the thimble, the slider, the parting surface and the retracting stroke in the structure of the mold (62), and the vacuum variation is less than 15%. The invention is combined with a die casting machine (60) for process adjustment and optimization to improve the formability of the minute feature size of the casting, and the maximum equivalent pore diameter < 0.15 allows the porosity of the measured area to be < 2%. IV. Conclusions The present invention has the following advantages by the above-mentioned technical features of the present invention: 1. The present invention is provided in a susceptor tank, and is provided with a chamber in the heat conducting column, and is provided in the cavity and cavity 15 13.55882. Period: November 11th, 11th, the chamber accommodates liquid heat-conducting materials, and the heat-conducting material is distributed on the pedestal in a large area, which greatly enhances the heat-receiving amount of the heat-conducting material to the pedestal, and can be effectively improved by the action of the heat pipe. Its heat dissipation performance for electronic components or semiconductor electronic components. 2. The susceptor and the heat-conducting column of the invention can be integrally formed by vacuum die-casting to form a modular and simple structure, and only the pedestal covers the cover body, and then the heat-conducting material is filled, that is, the manufacturing is completed, which saves man-hours and can reduce the cost. 3. The cavity of the pedestal of the invention communicates with the chamber of the heat conducting column, and the through hole and the rod plug are arranged on one side of the base, so that the heat dissipation material can be discharged or filled from the through hole, so that the device can be reused. And environmentally friendly. 4. The invention can feed the liquid heat-conducting material in the cavity of the base and the cavity of the heat-conducting column and has a capillary structure in the cavity to the inner wall 5, so as to generate an effective heat pipe heat-dissipating effect, which can make the invention most economical. Way _ best thermal performance. 5. The invention is applied to semiconductor electronic components and can be applied to an important heat dissipation of a central processing unit ((10) or a light-emitting diode (LED). 6. This month can be extended to various new products, such as flat heat pipes and circuits. Heat pipe and other electronic heat dissipation solutions. The above is only the patent scope of the present invention, and the feasible embodiment is not limited to the present invention.
以維護本申請人合法 、，性，已符合發明專利要件，爰依法 釣局依法核予專利，以維譜太Φ . 1355882 補充修正日期:1〇〇年11月11日 之權益。 【圖式簡單說明】 第一圖為本發明之分解示意圖； 第二圖為本發明之組合立體外觀圖； 第二圖為本發明之組合俯視平面示意圖； 第四圖為第三圖之A~A斷面示意圖； 第五圖為本發明導熱柱之第二實施例示意圖； 第六圖為本發明導熱柱之第三實施例示意圖； 第七圖為本發明散熱裝置與電子元件(CPU)組合示意圖； 第八圖為本發明散熱裝置與電子元件(LED)組合示意圖； 第九圖為本發明第—種製造流程圖； 第十圖為本發明第二種製造流程圖； 第十-圖為本發明更具體的完整設計流程圖； 第十二圖製造設備之系統架構示意圖； 第十二圖為本發明真空壓轉量產型製造設備示意圖； 第十四圖為本發明精密模具真空輔助系統示意圖；及 第十五圖為-般熱管的工作原理示意圖。 【主要元件符號說明】 (10)基座 (11)第一面 (12)第二面 (13)容槽 (14)開口 (15)通孔 (16)塞桿 17 1355882 - (20)導熱柱 補充修正日期:1〇〇年丨1月11日 (21)第一端 (22)第二端 (23)腔室 (24)鍺片 (25)開口 (30)導熱材 (40)蓋體 (50)電子元件 (60)壓鑄機 (61)真空輔助系統（62)模具 18In order to maintain the legality and sexuality of the applicant, it has met the requirements of the invention patent. In accordance with the law, the fishing bureau has approved the patent according to law, and the spectrum is too Φ. 1355882 Supplementary amendment date: November 11, 2010. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is an exploded perspective view of the present invention; the second drawing is a combined perspective view of the present invention; the second drawing is a schematic plan view of the combination of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a schematic view showing a second embodiment of the heat conducting column of the present invention; FIG. 6 is a schematic view showing a third embodiment of the heat conducting column of the present invention; and FIG. 7 is a combination of the heat sink device and the electronic component (CPU) of the present invention; Figure 8 is a schematic view showing the combination of the heat sink and the electronic component (LED) of the present invention; the ninth drawing is the first manufacturing flow chart of the present invention; the tenth is the second manufacturing flow chart of the present invention; More detailed complete design flow chart of the present invention; FIG. 12 is a schematic diagram of a system architecture of a manufacturing apparatus; FIG. 12 is a schematic view of a vacuum pressure-transfer mass production type manufacturing apparatus of the present invention; The schematic diagram; and the fifteenth diagram are schematic diagrams of the working principle of the general heat pipe. [Main component symbol description] (10) Base (11) First side (12) Second side (13) Clot (14) Opening (15) Through hole (16) Plug rod 17 1355882 - (20) Thermal column Supplementary amendment date: 1〇〇年丨11月11日(21) First end (22) Second end (23) Chamber (24) Sepal (25) Opening (30) Thermal material (40) Cover ( 50) Electronic component (60) die casting machine (61) vacuum assist system (62) mold 18