1351900 九、發明說明： 【發明所屬之技術領域】 =明涉及-種電路板及電子產品，尤其涉及一種應 匕、，月軌的金屬殼體的電子產品中的電路板及具有該 電路板的電子產品。 【先前技術】 目前，越來越多的電子產品，在其電路板與該電子產 品的殼體的結合設計上，為利於該電子產品的小型化，採 •用空間緊凑的滑軌（軌道）式結構的結合設計方式，即將該 電路板插入該殼體的滑軌以達到固定的目的。由於該殼體 -般採用金屬製成，因此需要將該殼體接地，以將該殼體 上產生的靜電導走。針對此問題，目前所採用的辦法為： 在與該滑執接觸的電路板的板邊的上下表面鋪設與該電路 板的地過孔電性接觸的裸銅膜，以藉由該電路板的地過孔 與該滑執的電性接觸，將該殼體上的靜電導走。前述結構 還可將該電路板上的零件產生的熱傳遞至該殼體上， 參散熱效果。 惟，上述結構在實際運用中效果並不理想。具體地， 由於該滑軌的寬度以及該電路板的厚度存在製作誤差，因 此，當該安裝有電路板的殼體豎立起來時（滑執與地面垂 直）’該電路板的板邊與該滑軌的接觸變差，對應地，該電 子產品的防電磁干擾性及散熱性能變差。另一方面，為了 避免該裸銅膜被氧化，該板邊的上下表面必須使用化學金 制程’從而使該電路板的成本提高。 6 1351900 【發明内容】 有鑒於此，有必要提供一種與具有滑執的金屬殼體接 觸性好的電路板及具有該電路板的電子產品。 一種電路板，其應用於一個具有滑執的金屬殼體中。 該電路板包括至少-個地過孔及至少―個與該至少一個地 過孔電性連接的導電凸塊。該至少―個㈣凸塊形成於該 電路板與該滑軌接觸的表面上，且當該電路板插設於該滑 軌時，該至少一個導電凸塊抵觸於該滑軌。 一種電子產品，其包括一個具有滑槽的金屬殼體及一 個插設於該滑槽的電路板。該電路板包括至少一個地過孔 及至少一個與該至少一個地過孔電性連接的導電凸塊該 至少一個導電凸塊形成於該電路板與該滑軌接觸的表面 上，且該至少一個導電凸塊抵觸於該滑執。 與先前技術相比，所述電路板及具有該電路板的電子 產°°，藉由在該電路板與該滑軌接觸的表面設置該至少一 個導電凸塊，改善該金屬殼體與該電路板的電及熱接觸 性’既改善該電子產品的電及熱接觸性。 【實施方式】 下面將結合附圖對本發明實施方式作進一步的詳細說 日月。 … 请一併參閱圖1及圖2，為本發明實施方式提供的一 種電路板100,其组裝在一個電子產品3〇〇的金屬殼體2〇〇 中。該金屬殼體200具有一對相對的滑執21〇，該對滑軌 21〇分別為第一滑軌212與第二滑軌214。該第一滑軌212 上開設有第一滑槽212a，該第二滑軌214上開設有第二滑 7 1351900 槽214a。該電路板loo呈矩形，其具有四個首尾相接的板 :邊10、12、14、16。該第一滑槽212a與該第二滑槽214a 供該電路板100的其中兩個相對的板邊10、14(或12、16) 插入’以將該電路板100組裝在該金屬殼體2〇〇中。在本 實施方式中’該第一滑槽212a與該第二滑槽214a供該電 路板100的其中兩個相對的板邊1〇、14插入。 該兩個板邊10、14上分別開設有至少一個地過孔2〇。 該地過孔20為内表面鍍有導電材料的通孔，且該地過孔1351900 IX. Description of the invention: [Technical field to which the invention pertains] = related to a circuit board and an electronic product, and more particularly to a circuit board in an electronic product of a metal casing that is suitable for the moon, and a circuit board having the same electronic product. [Prior Art] At present, more and more electronic products, in combination with the design of the circuit board and the housing of the electronic product, facilitate the miniaturization of the electronic product, and adopt a space-sliding rail (track) The combined design of the structure is to insert the circuit board into the slide rail of the housing to achieve the purpose of fixing. Since the housing is generally made of metal, the housing needs to be grounded to conduct static electricity generated on the housing. To solve this problem, the currently adopted method is: laying a bare copper film electrically contacting the ground via of the circuit board on the upper and lower surfaces of the board edge of the circuit board in contact with the sliding board, by using the circuit board The ground via is in electrical contact with the slider to conduct static electricity from the housing. The foregoing structure can also transfer heat generated by the components on the board to the housing for heat dissipation. However, the above structure is not ideal in practical use. Specifically, since the width of the slide rail and the thickness of the circuit board have manufacturing errors, when the housing on which the circuit board is mounted is erected (sliding is perpendicular to the ground), the board edge of the circuit board and the sliding The contact of the rail is deteriorated, and correspondingly, the electromagnetic interference resistance and heat dissipation performance of the electronic product are deteriorated. On the other hand, in order to prevent the bare copper film from being oxidized, the upper and lower surfaces of the board side must use a chemical gold process to increase the cost of the board. 6 1351900 SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a circuit board having good contact with a metal case having a slippery and an electronic product having the same. A circuit board for use in a metal housing having a slippery handle. The circuit board includes at least one ground via and at least one conductive bump electrically connected to the at least one via. The at least one (four) bump is formed on a surface of the circuit board that contacts the slide rail, and the at least one conductive bump abuts the slide rail when the circuit board is inserted into the slide rail. An electronic product includes a metal housing having a chute and a circuit board interposed in the chute. The circuit board includes at least one ground via and at least one conductive bump electrically connected to the at least one ground via. The at least one conductive bump is formed on a surface of the circuit board contacting the slide rail, and the at least one The conductive bumps resist the slip. Compared with the prior art, the circuit board and the electronic device having the circuit board improve the metal casing and the circuit by providing the at least one conductive bump on a surface of the circuit board contacting the sliding rail The electrical and thermal contact of the board' both improves the electrical and thermal contact of the electronic product. [Embodiment] Hereinafter, embodiments of the present invention will be further described in detail with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2 together, a circuit board 100 according to an embodiment of the present invention is assembled in a metal casing 2 of an electronic product. The metal housing 200 has a pair of opposite slides 21〇, which are a first slide rail 212 and a second slide rail 214, respectively. A first sliding slot 212a is defined in the first sliding rail 212, and a second sliding 7 1351900 slot 214a is defined in the second sliding rail 214. The board loo is rectangular in shape with four end-to-end boards: sides 10, 12, 14, 16. The first sliding slot 212a and the second sliding slot 214a are inserted into the opposite side edges 10, 14 (or 12, 16) of the circuit board 100 to assemble the circuit board 100 in the metal housing 2. In the middle. In the present embodiment, the first chute 212a and the second chute 214a are inserted into the opposite side edges 1 and 14 of the circuit board 100. At least one ground via 2 is respectively formed on the two board sides 10 and 14. The via hole 20 is a through hole whose inner surface is plated with a conductive material, and the via hole is
20連接了該電路板1〇〇的内部的接地層與外部的接地層。 該電路板100的内部的接地層係指該電路板1〇〇的各層上 的接地線路，該電路板1〇〇的外部的接地層係指該電路板 100的表面層上的接地線路。—般該地過孔内表面鍵的 導電材料為錫’因為錫在空氣中不易被氧化。該地過孔20 在該板邊10、14上的設置係越多越好，這樣可增大該電路 的接地面’改善外界雜訊（在該金屬殼體獅滋生的 電何）導入接地層的效率。 該兩個板邊10 讲 的工卜衣面（該電路板100與該第 - 該第二滑軌214接觸的表面）分別設置有至少 接。今導雷1Γ。該導電凸塊30與該地過孔20電性連 :接該地過孔20的電性連接可以藉由相 因每個祕、ft該導電凸塊3G設置在該地過孔2G上。惟， 因每個地過孔20的體穑在古τ η丄 m 電凸换^ 積存在同’在機械化統-設置該導 電凸塊30的過程中，會導致 4 銅線實現，如此該導電凸塊3 的电性連接可以藉由 足 了遇離該地過孔20設置。 8 1351900 在本實施方式中，該導電凸塊30與該板邊ι〇、14之間設 -置有一層裸銅膜4〇,該裸銅膜40與該地過孔2〇内表面鍍 •有的導電材料接觸從而達成電性連接，因此，該導電凸塊 30可遠離該地過孔2〇設置。 該導電凸塊30為可塑性的導電固體，其高度的設定與 該第一滑槽212a的寬度、該第二滑槽214a的寬度以及該 電路板100的厚度有關。在本實施方式中，該導電凸塊3〇 的厚度小於該第一滑槽212a的寬度以及該第二滑槽214a _的寬度’該第一滑槽212a的寬度以及該第二滑槽214a的 寬度略小於該電路板100的厚度；且該第一滑槽212a及該 弟一滑槽214a的寬度存在+0.25毫米（mm)/-〇. 05 mm的製作 誤差範圍，該電路板100存在+/-〇. 1mm的製作誤差範圍。 因此’經過多次實驗，將該導電凸塊3〇的高度定為 0.1 mm。由於該導電凸塊30的可塑性，可以使該電路板 100藉由該第一滑槽212a及該第二滑槽214a組裝至該金 屬殼體200内，不會產生因為該導電凸塊3〇的設置而無法 φ安裝該電路板100的情況。當該電路板1〇〇藉由該第一滑 槽212a及該第二滑槽214a組裝至該金屬殼體200内時， 該導電凸塊30抵觸於對應的該第一滑軌212及該第二滑軌 214。這樣，該第一滑軌212及該第二滑軌214藉由該導電 凸塊30與該地過孔20電性連接，從而使該金屬殼體2〇〇 電性接地。該導電凸塊30由軟金屬製成，如焊錫（鉛與錫 的合金），可以理解，在焊錫中還可以滲入松香等，以減緩 焊錫在空氣中的氧化速度。 該導電凸塊30的形狀不受限制，只要當該電路板ι〇〇 9 1351900 藉由該第一滑槽212a及該第二滑槽214a組裝至該金屬殼 Γ體200時，該導電凸塊30抵觸於對應的該第一滑軌212 ，及該第二滑軌214即可。在本實施方式中，該導電凸塊30 為錫球。該導電凸塊30在板邊10、14上的數量設置不受 限制，盡可能的多，這樣能夠增加該金屬殼體200與該電 路板100的接觸面積，以使該金屬殼體200與該電路板100 良好接觸。 進一步說明，該導電凸塊30還可以分別設置在該兩個 •板邊1〇、14的上表面上’而下表面上採用先前技術設置一 層裸銅膜。當該電路板1〇〇藉由該第一滑槽212a及該第二 滑槽214a組裝至該金屬殼體200時，該導電凸塊30及該 裸銅膜抵觸於對應的該第一滑軌212及該第二滑軌214， 以使該金屬殼體200與該電路板100良好接觸。可以理解， 該兩個板邊10、14的下表面上可設置該導電凸塊30，而 上表面上採用先前技術設置一層裸銅膜。 本實施方式的電子產品300為投影機，請參閱圖3及 籲表 1，為該電子產品300的電磁干擾（electromagnetic interference，EMI)測試及靜電（Electrostatic Discharge，ESD) 測試結果。 由圖3可知：電磁干擾信號頻率在450Mhz〜600Mhz 範圍内，該電子產品300的雜訊頻率明顯低於〇分貝（dB)。 由表1可知：使用靜電槍進行ESD測試，當採用空氣放電 模式時（即靜電搶與該電子產品300之間保持一定距離）， 在靜電檜的四個電壓水準下該電子產品300均無發生重起 (Reboot)現象；當採用接觸放電模式時（即靜電槍與該電子 1351900 產品300接觸），在靜電搶的四個電壓水準下該電子產品 300亦均無發生重起現象。 表1 空氣放雷 電壓水準 2千伏 (KV) 4KV 8KV 15KV 結果 通過 通過 通過 通過 模式 _ 接觸放電 電壓水準 2KV 4KV 6KV 8KV 結果 通過 通過 通過 通過 綜上，該金屬殼體200與該電路板1〇〇的接觸性得到 提尚，從而擁有該金屬殼體2〇〇及該電路板1〇〇的電子產 品300能夠順利通過EMI測試及ESD測試。同時，該金 屬设體200與該電路板1〇〇的高接觸性使該電路板上 的零件（圖未示）發出的熱量能夠及時地傳遞至該金屬殼體 2〇〇上，使該電子產品300具有較高的散熱性，也提高了 該電路板100上的零件的使用壽命。另外，當該電子產品 300處於運動中時，該導電凸塊3〇的設置可以避免該電路 板100在該金屬殼體200内晃動，從而確保該電路板工〇〇 上的零件的正常運行。 綜上所述’本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技藝 之人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 11 IJ51900 f圖式簡單說明】 種電路板的結構示意 圖1為本發明實施方式提供的一 圖0 圖2為採用圖1中的電路板的電子產品的結構示意圖。 圖3為圖2中的電子產品的電磁干擾測試資料圖。 【主要元件符號說明】 電路板 100 電子產品 300 金屬殼體 200 滑軌 210 第一滑執 212 第二滑軌 214 第一滑槽 212a 第二滑槽 214a 板邊 10、12 、14 、 16 地過孔 20 導電凸塊 3020 is connected to the internal ground layer of the circuit board 1 与 and the external ground layer. The ground layer inside the board 100 refers to the ground line on each layer of the board 1. The outer ground layer of the board 1 refers to the ground line on the surface layer of the board 100. Generally, the conductive material of the surface key of the via hole is tin' because tin is not easily oxidized in the air. The more the hole 20 is disposed on the edge 10, 14, the better, so that the grounding surface of the circuit can be increased to improve the external noise (in the metal shell lion's electricity) into the ground layer. s efficiency. The two sides of the board edge 10 (the surface of the board 100 in contact with the second - the second rail 214) are respectively provided with at least a connection. Today's guide is 1 雷. The conductive bumps 30 are electrically connected to the ground vias 20: the electrical connections of the vias 20 can be disposed on the vias 2G by the conductive bumps 3G. However, since the body of each of the via holes 20 is electrically distributed in the ancient τ η 丄 电 存在 存在 存在 在 在 在 在 在 机械 机械 机械 机械 机械 在 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置The electrical connection of the bumps 3 can be provided by the vias 20 that are encountered. 8 1351900 In this embodiment, the conductive bump 30 is disposed between the board edges ι, 14 and has a bare copper film 4 〇, and the bare copper film 40 is plated on the inner surface of the via hole 2 • Some conductive materials are in contact to achieve an electrical connection, and therefore, the conductive bumps 30 can be disposed away from the ground vias 2 . The conductive bump 30 is a plastic conductive solid, and its height is set in relation to the width of the first sliding slot 212a, the width of the second sliding slot 214a, and the thickness of the circuit board 100. In this embodiment, the thickness of the conductive bump 3〇 is smaller than the width of the first sliding slot 212a and the width of the second sliding slot 214a_the width of the first sliding slot 212a and the second sliding slot 214a. The width of the circuit board 100 is slightly smaller than the thickness of the circuit board 100; and the width of the first sliding slot 212a and the second slot 214a is +0.25 mm (mm) / - 〇. 05 mm. /-〇. 1mm production error range. Therefore, the height of the conductive bump 3〇 was set to 0.1 mm after many experiments. Due to the plasticity of the conductive bumps 30, the circuit board 100 can be assembled into the metal housing 200 by the first sliding slot 212a and the second sliding slot 214a, and the conductive bumps 3 are not generated. The case where the circuit board 100 cannot be mounted φ is set. When the circuit board 1 is assembled into the metal housing 200 by the first sliding slot 212a and the second sliding slot 214a, the conductive bump 30 is in contact with the corresponding first sliding rail 212 and the first Two slide rails 214. Thus, the first sliding rail 212 and the second sliding rail 214 are electrically connected to the ground via hole 20 by the conductive bump 30, so that the metal shell 2 is electrically grounded. The conductive bumps 30 are made of a soft metal such as solder (an alloy of lead and tin). It is understood that rosin or the like may be infiltrated into the solder to slow the oxidation rate of the solder in the air. The shape of the conductive bump 30 is not limited, as long as the circuit board ι 9 1351900 is assembled to the metal shell body 200 by the first sliding slot 212a and the second sliding slot 214a, the conductive bump 30 is in contact with the corresponding first slide rail 212 and the second slide rail 214. In the embodiment, the conductive bump 30 is a solder ball. The number of the conductive bumps 30 on the board edges 10, 14 is not limited, as much as possible, so that the contact area of the metal shell 200 with the circuit board 100 can be increased, so that the metal shell 200 and the The board 100 is in good contact. Further, the conductive bumps 30 may also be disposed on the upper surfaces of the two side edges 1 and 14 respectively, and a bare copper film is disposed on the lower surface by the prior art. When the circuit board 1 is assembled to the metal housing 200 by the first sliding slot 212a and the second sliding slot 214a, the conductive bump 30 and the bare copper film are in contact with the corresponding first sliding rail. 212 and the second sliding rail 214 are configured to make the metal casing 200 in good contact with the circuit board 100. It can be understood that the conductive bumps 30 can be disposed on the lower surfaces of the two board sides 10, 14, and a bare copper film is disposed on the upper surface by the prior art. The electronic product 300 of the present embodiment is a projector. Please refer to FIG. 3 and FIG. 1 for the electromagnetic interference (EMI) test and the electrostatic (Electrostatic Discharge (ESD) test result of the electronic product 300. It can be seen from FIG. 3 that the frequency of the electromagnetic interference signal is in the range of 450 Mhz to 600 Mhz, and the noise frequency of the electronic product 300 is significantly lower than 〇 decibel (dB). It can be seen from Table 1 that the ESD test is performed using an electrostatic gun. When the air discharge mode is adopted (that is, the electrostatic charge is kept at a certain distance from the electronic product 300), the electronic product 300 does not occur under the four voltage levels of the electrostatic enthalpy. The Reboot phenomenon; when the contact discharge mode is used (ie, the electrostatic gun is in contact with the electronic 1351900 product 300), the electronic product 300 does not re-emerge at the four voltage levels of the static electricity. Table 1 Air Demining Voltage Level 2 kV (KV) 4KV 8KV 15KV Result by Passing Through Mode _ Contact Discharge Voltage Level 2KV 4KV 6KV 8KV Result Passing Through Pass Through, the Metal Housing 200 and the Board 1〇 The contact property of the crucible is improved, so that the electronic product 300 having the metal casing 2 and the circuit board 1 can pass the EMI test and the ESD test smoothly. At the same time, the high contact between the metal body 200 and the circuit board 1 使 enables the heat generated by the components (not shown) on the circuit board to be timely transmitted to the metal casing 2 to make the electron The product 300 has a high heat dissipation and also increases the service life of the components on the circuit board 100. In addition, when the electronic product 300 is in motion, the arrangement of the conductive bumps 3〇 can prevent the circuit board 100 from shaking in the metal casing 200, thereby ensuring normal operation of the components on the circuit board. In summary, the invention conforms to the patent requirements of the invention, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application. 11 IJ51900 f Brief description of the structure of the circuit board FIG. 1 is a schematic diagram of an embodiment of the present invention. FIG. 2 is a schematic structural view of an electronic product using the circuit board of FIG. FIG. 3 is a data diagram of electromagnetic interference test of the electronic product of FIG. 2. FIG. [Main component symbol description] Circuit board 100 Electronic product 300 Metal housing 200 Slide rail 210 First slide 212 Second slide rail 214 First chute 212a Second chute 214a Edge 10, 12, 14, 16 Hole 20 conductive bump 30
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