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TWI346395B - Packaging structure of laser diode surface mount device and fabricating method thereof - Google Patents

Packaging structure of laser diode surface mount device and fabricating method thereof

Info

Publication number
TWI346395B
TWI346395B TW096107109A TW96107109A TWI346395B TW I346395 B TWI346395 B TW I346395B TW 096107109 A TW096107109 A TW 096107109A TW 96107109 A TW96107109 A TW 96107109A TW I346395 B TWI346395 B TW I346395B
Authority
TW
Taiwan
Prior art keywords
laser diode
surface mount
packaging structure
mount device
fabricating method
Prior art date
Application number
TW096107109A
Other languages
Chinese (zh)
Other versions
TW200837976A (en
Inventor
Wen Liang Tseng
Lung Hsin Chen
Original Assignee
Advanced Optoelectronic Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Optoelectronic Tech filed Critical Advanced Optoelectronic Tech
Priority to TW096107109A priority Critical patent/TWI346395B/en
Publication of TW200837976A publication Critical patent/TW200837976A/en
Application granted granted Critical
Publication of TWI346395B publication Critical patent/TWI346395B/en

Links

TW096107109A 2007-03-02 2007-03-02 Packaging structure of laser diode surface mount device and fabricating method thereof TWI346395B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096107109A TWI346395B (en) 2007-03-02 2007-03-02 Packaging structure of laser diode surface mount device and fabricating method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096107109A TWI346395B (en) 2007-03-02 2007-03-02 Packaging structure of laser diode surface mount device and fabricating method thereof

Publications (2)

Publication Number Publication Date
TW200837976A TW200837976A (en) 2008-09-16
TWI346395B true TWI346395B (en) 2011-08-01

Family

ID=44820384

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107109A TWI346395B (en) 2007-03-02 2007-03-02 Packaging structure of laser diode surface mount device and fabricating method thereof

Country Status (1)

Country Link
TW (1) TWI346395B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI743060B (en) * 2015-11-05 2021-10-21 日商新光電氣工業股份有限公司 Optical element package and optical element device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201114003A (en) * 2008-12-11 2011-04-16 Xintec Inc Chip package structure and method for fabricating the same
DE102009058796A1 (en) 2009-12-18 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Optoelectronic component and method for producing an optoelectronic component
CN103311378A (en) * 2012-03-06 2013-09-18 展晶科技(深圳)有限公司 Manufacturing method for LED package structure
CN103682066B (en) * 2012-09-21 2016-08-03 展晶科技(深圳)有限公司 Light emitting diode module and manufacture method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI743060B (en) * 2015-11-05 2021-10-21 日商新光電氣工業股份有限公司 Optical element package and optical element device

Also Published As

Publication number Publication date
TW200837976A (en) 2008-09-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees