1344733 六、 [0001] [0002] [0003]1344733 VI [0001] [0002] [0003]
的9年12月16日桉正眷換頁I 發明說明： 【發明所屬之技術領域】 本創作關於一種用以裝卸晶片模組之治具，特別係一種 可使晶片模組準確地與所應用之電連接器中之導電端子 電性接觸之治具。 【先前技術】 請參閱第-圖及第二圖’係―種先前技術裝卸晶片模組 之治具之結構示意圖。該裝卸晶片模組之治具丨，包括 本體10，、安裝於本體10,上之若干卡持體丨丨，扣合於 本體Γ上之背板13’ 。 本體10包括主體1〇〇及主體100，兩側的板狀體 ，S亥主體1 〇 0包括側邊1 0 0 1，，其中部設有中央通孔 (未標號）。主體1〇〇’自中央通孔一端向下延伸出一漏斗 狀框體105’ ，且該漏斗狀框體105，之最小截面尺寸與 晶片模組（未圖示）之尺寸了一對應。主體100，與板狀體 10Γ結合處設有通槽102，，側邊1001，對稱地設有若 干凸塊103’ ，且兩相鄰凸塊ί〇3，間形成一凹槽丨04， 。卡持體11，按其與本體1〇，之配合關係分爲第一類卡 持體和第二類卡持體，包括縱長之固持部1 1 〇 ’以及自固 持部110’中部沿縱向方向延伸之卡持部丨丨丨，，第一類 卡持體固持於主體100，與板狀體101，連接之通槽1〇2 内，第二類卡持體111’固持於主體100，侧邊1001， 之凹槽104’内；背板13，扣合於本體10，上並依靠臂部 131 ’固持於本體1 〇’的兩側。晶片模組可以沿著該漏斗 狀框體105’準確地置於所應用之電連接器（未圖示）中， 095136515 表單編號Α0101 第3頁/共27頁 0993451055-0 1344733 __ 099年12月16日修正替换頁 並與導電端子電性接觸。 [0004] 惟，上述治具Γ存在下述缺陷：該框體105’係自主體 10’延伸而出，當卸載晶片模組時，治具1’將晶片模組 定位於框體105’之範圍之内以方便真空吸嘴將晶片模組 取出，然卸載之過程中，晶片模組可能會受到意外之外 力作用而偏離正確之位置，故，晶片模組就至少有部分 不能處於框體105’内，顯然，晶片模組可能受到框體 105’之損害。 [0005] 鑒於此，確有必要對上述治具進行改進以解決其存在之 缺陷。 【發明内容】 [0006] 本創作要解決之技術問題之一係提供一種治具，可使同 樣之電連接器能夠接受不同大小之晶片模組。 [0007] 本創作要解決之另一個技術問題係提供一種治具，其定 位晶片模組之裝置爲浮動式，能減小卸載時晶片模組受 損害之幾率。 [0008] 爲解決上述問題，本創作提供了一種治具，用以將晶片 模組準確地與所應用之電連接器中之導電端子電性接觸 _ ，其包括一主體及與主體配合之卡持體、與主體可動配 合之晶片導引裝置。晶片導引裝置收容於本體之中且相 對於與本體可上下移動。 [0009] 相較於先前技術，本創作至少具有以下優點：當卸載晶 片模組時，晶片導引裝置能夠在電連接器之鎖扣裝置釋 放晶片模組之前就將其定位，因此能夠正確卸載晶片模 095136515 表單編號A0101 第4頁/共27頁 0993451055-0 1344733 099年12月16日 組’且晶片導引裝置相對於本體可浮動調整，使晶片模 組即使偏離了正破之位置也不會受到損害。 【實施方式】 [0010] 叫參閱第三圖至第十—圖，本創作揭示一種治具丨，其借 助一真空°及嘴3可使相同之電連接器2接受不同尺寸之晶 片模組4。 [0011] 與本創作治具1相關之電連接器2如第七圖所示，其包括 絕緣本體20、置於絕緣本體20内之承接體21、組裝於承 接體21上之鎖扣裝置22、收容承接體21之框體24以及級 裝在絕緣本體2〇上方並可驅動鎖扣裝置22之驅動體25。 [0012] 絕緣本體20大致呈長形之框體狀，其上設有四處配合孔 200以收容第一彈簧23，側壁上開設有複數凹槽2〇1，所 述凹槽201與絕緣本體20上表面相連處設有突起2〇u。 [0013] 承接體21置於減24所限定之收容空間内，㈣連同樞 體24-起裝至絕緣本體承接鎖設有承栽部1 210以承栽晶片模組4，承載部21〇上容設有複數導電端子 以與晶片模組4上之導電元件電性接觸。承接⑽上對稱 設有-對固定部211，該固定部211之下部與絕緣本體2〇 結合在一起，上部將鎖扣裝置22之鎖扣部221固定，鎖扣 裝置22可繞鎖扣部221旋轉。框體24之一對相對之側壁I 開設有收容部240，以供鎖扣裝置23通過。鎖扣裝置。包 括一對鎖扣元件，其上設有鎖扣部221。 驅動體25大體呈框形，其四周向下垂直延伸有複數突板 250以與絕緣本體20側壁外側之凹槽2〇1相配合，該突板 095136515 表單編號A0101 第5頁/共27頁 0993451055-0 [0014] 1344733 __ 099年12月1β日後正養換頁 250之末端設有凸台2501。驅動體25之四角向下延伸出 四個定位柱251，其相對兩側設有按壓部252。組裝時， 第一彈簧23套在定位柱251上，定位柱251則插入到絕緣 本體20之配合孔200中，藉由凹槽201末端之突起2011擋 止凸台2501，驅動體25與絕緣本體20組裝在一起。 [0015] 組裝時，首先將鎖扣裝置22與承載體21組合在一起，然 後承載體21置於框體24之收容空間内，鎖扣裝置22穿過 收容部240並置於承載部210上，然後將承載體21與框體 24之組合一起置於絕緣本體20内，此時鎖扣裝置22處於 閉合位置。最後，將驅動裝置25安裝在絕緣本體20上， 當按壓驅動體25時，驅動體25向下運動，按壓部252將按 壓在鎖扣裝置22上，使鎖扣裝置22由閉合狀態轉爲開啓 狀態。此時，晶片模組4可與承載部210上之導電端子電 性接觸，當撤去作用在驅動體25上外力後，鎖扣裝置22 恢復到閉合位置並將晶片模組4鎖緊。使晶片模組4準確 地與導電端子電性接觸之功能由本創作治具1完成，詳述 如下。 [0016] 請參考第三圖至第六圖，本創作治具1包括主體10、安裝 於主體10上之複數卡持體11、安裝於主體10上之晶片導 . 引裝置12、收容於主體10和晶片導引裝置12之間之複數 滾珠13、收容於卡持體11内之第二彈簧14，扣合於本體 10上之背板15、組設於主體10上之止動片16以及收容於 晶片導引裝置12中之第三彈簧17。 [0017] 主體10包括安裝部100及自該安裝部100兩侧朝向遠離安. 裝部100之方向延伸而出之兩板狀體101。安裝部100之 095136515 表單編號Α0101 第6頁/共27頁 0993451055-0 1344733 [0018] 099年12月16日修正替換頁 中部設有一開口 1〇〇2，該開口 1〇〇2之大小可使多種規格 之晶片模組通過。 主體10上，安裝部100於開口 1002之兩側、開口 1 002與 板狀體101相交處分別設有兩處通槽1〇2，兩通槽1〇2之 間形成一導引部103，導引部103之下端延伸出一定位塊 104以擋止晶片模組12之定位部123，上述開口 1〇〇2之内 壁在正對著定位塊1〇4之位置還對稱開設了一對缺口（未 標號）以收容晶片導引裝置12之定位部123 ;開口1〇〇2 之另外兩側之内壁上設有凹面105以與晶片導引裝置1 2之 滑動部124配合，外壁上設有有複數凸塊106，且兩相鄰 之凸塊106間形成一-^槽1 Of。請重點參考第三圖、第四 圖及第六圖’開口1002之内壁之四個拐角處以及内壁上 開設有複數貫通安裝部100上下表面之滾珠收容槽1003以 收容滾珠13於其中，當治具1組裝後，滾珠13在上下方向 之位移分別被背板15和止動片16限定；而晶片導引裝置 12收容於開口 10 0 2之中，其上下方向之位移分別被背板 15和定位塊104所限定’电此’本創作之晶片導引裝置a 能實現其浮動式之目之。需要指出，本創作中，滾珠13 以及滚珠收容槽1003之設置並非必要，沒有它們，晶片 導引裝置12裝配後同樣係浮動式之，只是如果缺少了上 述之滾珠13以及滾珠收容槽1〇〇3，晶片導引裝置12要實 現便利之滑動’就要求開口 1002之内壁和晶片導引裝置 12之週邊之表面精度相對要高，無疑會增加成本；此外 晶片導引裝置12與開口 1002之間存在一定之間隙，當使 用一段時間後，灰塵就會侵入它們之間之間隙，即使灰 095136515 表單編號A0101 第7頁/共27頁 0993451055-0 134473312 眷 I I I I I I I I I I I I I I I I I I I I I I I I I I I I 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本A jig for electrically contacting a conductive terminal in an electrical connector. [Prior Art] Please refer to Fig. 2 and Fig. 2 for a schematic view of the structure of the jig of the prior art loading and unloading chip module. The fixture of the loading and unloading chip module comprises a body 10, a plurality of holding bodies 安装 mounted on the body 10, and a backing plate 13' fastened to the body 。. The body 10 includes a main body 1 and a main body 100, and a plate-like body on both sides. The main body 1 〇 0 includes a side edge 1 0 0 1, and a central through hole (not labeled) is disposed in a portion thereof. The main body 1' extends downward from a central through-hole end with a funnel-shaped frame 105', and the funnel-shaped frame 105 has a minimum cross-sectional dimension corresponding to the size of the wafer module (not shown). The main body 100 is provided with a through groove 102 at a joint with the plate-like body 10, and the side edge 1001 is symmetrically provided with a plurality of adjacent protrusions 103', and a groove 丨04 is formed between the two adjacent protrusions. The holding body 11 is divided into a first type of holding body and a second type of holding body according to the cooperation relationship with the main body 1 , and includes a longitudinally extending portion 1 1 〇 ' and a middle portion of the self-holding portion 110 ′ The first type of holding body is fixed to the main body 100, and the second type of holding body 111' is held in the main body 100, and the second type of holding body 111' is fixed to the main body 100. The side edge 1001 is defined in the recess 104'; the back plate 13 is fastened to the body 10 and supported by the arm portion 131' on both sides of the body 1'. The wafer module can be accurately placed in the applied electrical connector (not shown) along the funnel-shaped frame 105', 095136515 Form No. 1010101 Page 3 of 27 0993451055-0 1344733 __ December 099 The replacement page was corrected on the 16th and electrically contacted with the conductive terminals. [0004] However, the above-mentioned jig has the following drawbacks: the frame 105' extends from the main body 10', and when the wafer module is unloaded, the jig 1' positions the wafer module in the frame 105'. Within the scope, the vacuum module can be used to take out the wafer module. However, during the unloading process, the wafer module may be subjected to an unexpected external force and deviate from the correct position. Therefore, at least part of the wafer module cannot be in the frame 105. 'Inside, obviously, the wafer module may be damaged by the frame 105'. In view of this, it is indeed necessary to improve the above jig to solve the drawbacks of its existence. SUMMARY OF THE INVENTION [0006] One of the technical problems to be solved by the present invention is to provide a jig that enables the same electrical connector to accept wafer modules of different sizes. [0007] Another technical problem to be solved by the present invention is to provide a fixture in which the device for positioning the wafer module is floating, which can reduce the probability of damage to the wafer module during unloading. In order to solve the above problems, the present invention provides a jig for accurately contacting a wafer module with a conductive terminal in an applied electrical connector, which includes a body and a card that cooperates with the body. A wafer guiding device that is held and movably mated with the main body. The wafer guiding device is housed in the body and is movable up and down with respect to the body. Compared with the prior art, the present invention has at least the following advantages: when the wafer module is unloaded, the wafer guiding device can position the wafer connector before the latching device of the electrical connector releases the wafer module, so that it can be properly unloaded Wafer module 095136515 Form No. A0101 Page 4 / Total 27 Page 0993451055-0 1344733 December 16th, 2008, the group 'and the wafer guiding device can be floated and adjusted relative to the body, so that the wafer module does not deviate from the position of the broken position. Will suffer. [Embodiment] Referring to the third to tenth drawings, the present invention discloses a jig, which can accept the same size of the wafer module 4 by the same electrical connector 2 by means of a vacuum and the mouth 3. . [0011] The electrical connector 2 associated with the present fixture 1 includes an insulative housing 20, a receiving body 21 disposed in the insulative housing 20, and a latching device 22 assembled to the receiving body 21, as shown in FIG. The frame body 24 for accommodating the receiving body 21 and the driving body 25 mounted on the insulating body 2A and capable of driving the locking device 22 are mounted. [0012] The insulative housing 20 is substantially in the shape of a frame having a long shape, and is provided with four matching holes 200 for receiving the first spring 23, and a plurality of grooves 2〇1 are formed on the side wall, and the groove 201 and the insulating body 20 are formed. A protrusion 2〇u is provided at the junction of the upper surfaces. [0013] The receiving body 21 is placed in the receiving space defined by the minus 24, (4) together with the pivot body 24 - is mounted to the insulating body to receive the bearing 1 210 to support the wafer module 4, the carrying portion 21 A plurality of conductive terminals are disposed to electrically contact the conductive elements on the wafer module 4. The upper portion of the fixing portion 211 is coupled to the insulating body 2〇, and the upper portion fixes the locking portion 221 of the locking device 22, and the locking device 22 can surround the locking portion 221. Rotate. One of the frames 24 is provided with a receiving portion 240 for the opposite side wall I for the locking device 23 to pass. Locking device. A pair of locking elements are included, and a locking portion 221 is disposed thereon. The driving body 25 is substantially in the shape of a frame, and a plurality of protruding plates 250 are vertically extended downwardly to cooperate with the grooves 2〇1 on the outer side of the side wall of the insulative housing 20, the protruding plate 095136515, the form number A0101, the fifth page, the total of 27 pages, 0993451055-0 [0014] 1344733 __ December 1st, 1st, 1st, the rear of the page 250 is provided with a boss 2501. The four corners of the driving body 25 extend downwardly from the four positioning posts 251, and the pressing portions 252 are provided on opposite sides thereof. When assembled, the first spring 23 is sleeved on the positioning post 251, and the positioning post 251 is inserted into the mating hole 200 of the insulative housing 20, and the protrusion 2501 is blocked by the protrusion 2011 at the end of the recess 201, the driving body 25 and the insulating body 20 assembled together. [0015] When assembling, the locking device 22 is first combined with the carrier 21, and then the carrier 21 is placed in the receiving space of the frame 24. The locking device 22 passes through the receiving portion 240 and is placed on the carrying portion 210. The carrier 21 and the combination of the frame 24 are then placed together in the insulative housing 20, with the latching device 22 in the closed position. Finally, the driving device 25 is mounted on the insulative housing 20. When the driving body 25 is pressed, the driving body 25 moves downward, and the pressing portion 252 will be pressed on the locking device 22 to turn the locking device 22 from the closed state to the opening. status. At this time, the wafer module 4 can be electrically contacted with the conductive terminals on the carrying portion 210. When the external force acting on the driving body 25 is removed, the locking device 22 returns to the closed position and the wafer module 4 is locked. The function of electrically contacting the wafer module 4 with the conductive terminals is completed by the present fixture 1, as described in detail below. [0016] Please refer to the third to sixth figures. The present invention includes a main body 10, a plurality of holding bodies 11 mounted on the main body 10, a wafer guiding device 12 mounted on the main body 10, and being housed in the main body. a plurality of balls 13 between the wafer guiding device 12 and a second spring 14 received in the holding body 11, a backing plate 15 fastened to the main body 10, a stopper piece 16 assembled on the main body 10, and The third spring 17 is housed in the wafer guiding device 12. [0017] The main body 10 includes a mounting portion 100 and two plate-like members 101 extending from both sides of the mounting portion 100 in a direction away from the mounting portion 100. 095136515 of the mounting part 100 Form No. 1010101 Page 6 of 27 0993451055-0 1344733 [0018] On December 16, 099, there is an opening 1〇〇2 in the middle of the correction replacement page, and the size of the opening 1〇〇2 can be A variety of wafer modules are passed. On the main body 10, the mounting portion 100 is provided with two through grooves 1〇2 at two sides of the opening 1002 and at the intersection of the opening 1 002 and the plate-like body 101, and a guiding portion 103 is formed between the two through grooves 1〇2. A positioning block 104 extends from the lower end of the guiding portion 103 to block the positioning portion 123 of the wafer module 12. The inner wall of the opening 1〇〇2 is symmetrically opened at a position facing the positioning block 1〇4. (not labeled) to accommodate the positioning portion 123 of the wafer guiding device 12; the inner wall of the other two sides of the opening 1〇〇2 is provided with a concave surface 105 to cooperate with the sliding portion 124 of the wafer guiding device 12, and the outer wall is provided There are a plurality of bumps 106, and a pair of bumps 106 are formed between two adjacent bumps 106. Please refer to the third corner, the fourth figure and the sixth figure, the four corners of the inner wall of the opening 1002 and the ball receiving groove 1003 of the upper and lower surfaces of the plurality of through mounting portions 100 to receive the ball 13 therein. After the assembly of the device 1, the displacement of the balls 13 in the up and down direction is respectively defined by the back plate 15 and the stopper piece 16; and the wafer guiding device 12 is housed in the opening 102, and the displacement in the up and down direction is respectively carried by the back plate 15 and The wafer guiding device a defined by the positioning block 104 can realize its floating purpose. It should be noted that, in the present creation, the arrangement of the balls 13 and the ball receiving grooves 1003 is not necessary. Without them, the wafer guiding device 12 is also floating after being assembled, except that the above-mentioned balls 13 and the ball receiving grooves 1 are missing. 3, the wafer guiding device 12 to achieve a convenient sliding 'requires that the surface accuracy of the inner wall of the opening 1002 and the periphery of the wafer guiding device 12 is relatively high, which will undoubtedly increase the cost; further, between the wafer guiding device 12 and the opening 1002 There is a certain gap, when used for a period of time, dust will invade the gap between them, even if ash 095136515 Form No. A0101 Page 7 / Total 27 Page 0993451055-0 1344733
塵狼少，也有可能佶B H 則會卡持在開口觸;不二:置11 面之原因導致晶片導引襄;而如果由於制程等方 能順利之滑:：又力不均勾造成晶片導引裝置12不 月動。而晶片導引裴罾〗 个 本創作要解决之技術間題來說比較重:方:二浮動’對 面之敍述將進—步介紹。 要，關於這點’下 [0019] 乙不问側邊。母一個卡持部 ⑴以及自固持部11〇之中部沿藍直二包括縱長之固持; 111，豎直方向延伸之卡持部 該卡持部⑴朝向固持部110之一侧之末端 導引斜面112，_丨斜面112可以使祕丨順利地卡持There are few dust wolves, and it is also possible that BH will be stuck in the open touch; not only: the reason for the 11-sided surface causes the wafer to be guided; and if the process can smoothly slide due to the process, etc. The guiding device 12 is not moving. The wafer guide 裴罾 〗 〖 The technical problem to be solved in this creation is relatively heavy: square: two floating ‘the opposite narrative will be introduced step by step. Yes, about this point, [0019] B does not ask the side. The female one holding portion (1) and the middle portion of the self-holding portion 11b include a longitudinal length retention along the blue straight two; 111, a vertically extending holding portion, the holding portion (1) is guided toward the end of one side of the holding portion 110 The bevel 112, _ sloping surface 112 allows the secret to be smoothly held
所應用之電連接器2上，固持部⑽設有收容第二彈簧P 之收容孔113及自固持部11Q之兩端沿水平延伸之 114。 [0020] 晶片導引裝置12包括大致呈矩形之基體12〇以及自基體 120下表面延伸而出之複數引導末端121，所述引導末端 121朝向晶片導引裝置12之中心線方向傾斜延伸。基體 120上設有一貫通之導引通道122，該導弓丨通道122之大 小可使多種規格之晶片通過；基體120之兩相對側邊上對 稱凸設有一對“L”形之定位部123 ;基體ι2〇之另外—對 側邊上對稱之設有一對滑動部124，該滑動部124大致呈 不完全之圆柱體狀，其上還設有一圓孔125以收容第三彈 095136515 表單編號A0101 第8頁/共27頁 0993451055-0 1344733 __ ^199年12月16日修正替換頁 簧17於其中。 [0021]背板15包括一縱長形之平板150、自該平板150之兩側邊 向下垂直延伸之兩臂部151。平板150之另一對側邊上對 稱設有一凹口 152以與板狀體1〇1上之導引部1〇3配合， 該平板150中央還設有與主體1〇之開口 1〇〇2相匹配之中 部開口 153。 [0022] 組合時，首先將卡持體11組裝至主體1〇，第一類卡持體 收容於主體10與板狀體1〇1之間之通槽102内，第二類卡 持體則收容於主體10之卡槽107内，第一類卡持體之延伸 部114置於板狀體1〇1上，卡持部hi延伸出通槽丨〇2，第 二類卡持體之延伸部114置於凸塊1〇6上，卡持部ill同 樣延伸出卡槽107，接著將第二彈簧14置於卡持體11上之 收容孔113中；然後，將滾珠13裝進滾珠收容槽ι 003内 並使晶片模組導引裝置12收容於開口 1 〇 〇 2中，其中滑動 部124與凹面105配合，“L”形之定位部123則與上述之 缺口配合，接下來，把止動片16焊接至安裝部1〇〇之下表 面以擋止滾珠13向下之位移！焉緣:，將背板15扣合於主 體10上，且使凹口 152與主體1〇上之導引部103配合，臂 部1 51固持於主體1 〇之兩側。如此，本創作之治具1組裝 完畢，其中，晶片導引裝置12和卡持體11相對於主體 均爲浮動式，在外力之作用下可朝向背板丨5滑動，撤去 外力後，在彈簧之作用下兩者均能順利回位。 [0023] 下面結合第八圖至第十一圖來詳細說明本創作治具丨如何 作用于所應用之電連接器2上並實現其功能。首先通過使 卡持體11卡持於電連接器2之驅動體25外側而將治具1組 095136515 表單編號A0101 第9頁/共27頁 0993451055-0 1344733 099年12月16日修正替換頁 裝到電連接器2上，由於卡持體11係浮動式，故，當操作 失誤時，卡持體11不易受到損害。當治具1尚未對電連接 器2施加壓力時，電連接器2之鎖扣裝置22處於關閉狀態 ，當按壓治具1之背板15，安裝部100將力傳遞到電連接 器2之驅動體25上，鎖扣裝置22受到驅動體25之按壓部 252作用，由關閉狀態達到開啓狀態；這時，使用真空吸 嘴3吸起晶片模組4並穿過治具1上之開口 1 002以及晶片導 引裝置12上之導引通道122，然後操縱真空吸嘴3使其釋 放晶片模組4，在晶片導引裝置12上之引導末端121之限 制下，晶片模組4順利到達預定之位置，並與承載部210 上之導電端子準確地電性接觸；之後，撤去作用在治具1 上之外力，鎖扣裝置22恢復到閉合位.置並將晶片模組4鎖 緊。 [0024] 當前一個晶片模組測試完畢，需要從電連接器2中取出以 測試下一個晶片模組。同樣，先把治具1、組裝在電連接器 2上，然後施加一外力於治具1上，晶片導引裝置12之引 導末端121在鎖扣裝置22還沒有轉換至開啓狀態之前就已 罩在晶片模組之四周；繼續按壓治具1，鎖扣裝置22轉換 到開啓位置。此時，就可以利用真空吸嘴將晶片模組順 利之取出，即使晶片模組因爲意外之原因偏離了最初之 位置，但不會偏離出引導末端121所限定之範圍；而當晶 片導引裝置12之製造及安裝不是非常精確導致卸載晶片 模組時晶片模組偏離出引導末端121之範圍，此時，晶片 模組被取出時可能會碰到導引末端121，但由於晶片導引 裝置12能夠向上方便之滑動，因此，操作者能及時發現 095136515 表單編號A0101 第10頁/共27頁 0993451055-0 1344733 - 099年12月16日修正替換頁 問題，從而減小、避免晶片模組之損壞。 [0025] 綜上所述，本創作確已符合發明專利之要件，爰依法提 出申請專利。惟，以上所述者僅係本發明之較佳實施方 式，本發明之範圍並不以上述實施方式爲限，舉凡熟習 • 本案技藝之人士援依本發明之精神所作之等效修飾或變 化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0026] 第一圖係先前技術治具之立體分解圖。 [0027] 第一圖係先前技術治具之立體組合圖。 [0028] 第三圖係本創作治具之立體分解圖。 [0029] 第四圖係本創作治具另一視角之立體分解圖。 [0030] 第五圖係本創作治具之立體組合圖。 [0031] 第六圖係本創作治具主體之立體圖。 [0032] 第七圖係本創作治具相關之電連接器之立體分解圖。 [0033] 第八圖係本創作治具作用在所應用的電連接器上之立體 示意圖，其中鎖扣裝置處於關閉狀態。 [0034] 第九圖與第八圖類似，惟鎖扣裝置處於開啓狀態。 [0035] 第十圖係沿第八圖X-X面之剖視圖。 [0036] 第十一圖係沿第九圖XI-XI面之剖視圖。 【主要元件符號說明】 [0037] 治具：1 095136515 表單編號A0101 第11頁/共27頁 0993451055-0 1344733 [0038] 主體：10 [0039] 安裝部：100 [0040] 板狀體：101 [0041] 開口 ： 1002 [0042] 通槽：102 [0043] 滚珠收容槽：1003 [0044] 導引部：103 [0045] 定位塊：104 [0046] 凹面：10 5 [0047] 凸塊：106 [0048] 卡槽：107 [0049] 卡持體：11 [0050] 固持部：110 [0051] 卡持部：111 [0052] 導引斜面：112 [0053] 收容孔：113 [0054] 延伸部：114 [0055] 晶片導引裝置：12 [0056] 基體：120 095136515 表單編號A0101 第12頁/共27頁 099年12月16日修正替換頁 0993451055-0 1344733 099年12月16日梭正替換頁 [0057] 引導末端：121 [0058] 導引通道：122 [0059] 定位部：123 [0060] 滑動部：124 [0061] 圓孔：125 [0062] 滚珠：13 [0063] 第二彈簧：14 [0064] 背板：15 [0065] 平板：1 5 0 [0066] 臂部：151 [0067] 凹口 ： 1 52 [0068] 中部開口 ： 153 [0069] 止動片：16 [0070] 第三彈簧：17 [0071] 電連接器：2 [0072] 絕緣本體：20 [0073] 配合孔：20 0 [0074] 凹槽：201 [0075] 突起：2011 095136515 表單編號A0101 第13頁/共27頁 0993451055-0 1344733 _— 099年12月16日修正替換頁 [0076] 承接體：21 [0077] 承載部：210 [0078] 固定部：211 [0079] 鎖扣裝置：22 [0080] 鎖扣部：221 [0081] 第一彈簧：23 [0082] 框體：24 [0083] 收容部：240 [0084] 驅動體：25 [0085] 突板：250 [0086] 凸台：2501 [0087] 定位柱：251 [0088] 按壓部：252 [0089] 真空吸嘴：3 [0090] 晶片模組：4 095136515 表單編號A0101 第14頁/共27頁 0993451055-0In the electrical connector 2 to be applied, the holding portion (10) is provided with a receiving hole 113 for accommodating the second spring P and 114 extending horizontally from both ends of the holding portion 11Q. The wafer guiding device 12 includes a substantially rectangular base 12 〇 and a plurality of leading ends 121 extending from a lower surface of the base 120, the leading ends 121 extending obliquely toward a center line direction of the wafer guiding device 12. The base body 120 is provided with a through guiding channel 122. The size of the guiding arch channel 122 can pass through a plurality of types of wafers; a pair of "L" shaped positioning portions 123 are symmetrically protruded on opposite sides of the base 120; The base ι2 〇 is further provided with a pair of sliding portions 124 symmetrically on the side, the sliding portion 124 is substantially incompletely cylindrical, and a circular hole 125 is further provided thereon for receiving the third bomb 095136515. Form No. A0101 8 pages / a total of 27 pages 0993451055-0 1344733 __ ^ December 16, 199 revised replacement page spring 17 in it. The back plate 15 includes a vertically elongated flat plate 150, and two arm portions 151 extending vertically downward from both side edges of the flat plate 150. The other side of the flat plate 150 is symmetrically provided with a notch 152 to cooperate with the guiding portion 1〇3 on the plate-shaped body 1〇1, and the opening 1501 of the flat plate 150 is further provided with the opening 1〇〇2 of the main body 1 Match the middle opening 153. [0022] When combining, first, the holding body 11 is assembled to the main body 1 , and the first type of holding body is received in the through groove 102 between the main body 10 and the plate-like body 1〇1, and the second type of holding body is It is received in the card slot 107 of the main body 10. The extension portion 114 of the first type of retaining body is placed on the plate-like body 1〇1, and the latching portion hi extends out of the slotted groove 2, and the extension of the second type of retaining body The portion 114 is placed on the bump 1〇6, and the latching portion ill also extends out of the latching groove 107, and then the second spring 14 is placed in the receiving hole 113 of the retaining body 11; then, the ball 13 is loaded into the ball receiving body. In the slot 003, the wafer module guiding device 12 is received in the opening 1 ,2, wherein the sliding portion 124 cooperates with the concave surface 105, and the positioning portion 123 of the "L" shape cooperates with the above-mentioned notch, and then, The stopper piece 16 is welded to the lower surface of the mounting portion 1 to block the downward displacement of the balls 13! The rim edge: the back plate 15 is fastened to the main body 10, and the notch 152 is engaged with the guiding portion 103 on the main body 1 ,, and the arm portion 151 is held on both sides of the main body 1 。. In this way, the jig 1 of the present invention is assembled, wherein the wafer guiding device 12 and the holding body 11 are all floating with respect to the main body, and can slide toward the back plate 丨 5 under the action of an external force, after the external force is removed, in the spring Both of them can return smoothly. [0023] The following is a detailed description of how the present invention can be applied to the applied electrical connector 2 and realize its function in conjunction with the eighth to eleventh drawings. First, by holding the holding body 11 to the outside of the driving body 25 of the electrical connector 2, the jig 1 group 095136515 Form No. A0101 Page 9 / Total 27 Page 0993451055-0 1344733 December 16th, revised correction page On the electrical connector 2, since the retaining body 11 is of a floating type, the latching body 11 is less likely to be damaged when an operation is mistaken. When the jig 1 has not applied pressure to the electrical connector 2, the locking device 22 of the electrical connector 2 is in a closed state. When the backing plate 15 of the jig 1 is pressed, the mounting portion 100 transmits the force to the driving of the electrical connector 2. In the body 25, the locking device 22 is acted upon by the pressing portion 252 of the driving body 25, and is opened from the closed state; at this time, the vacuum module 3 is used to suck up the wafer module 4 and pass through the opening 1 002 of the jig 1 and The guiding channel 122 on the wafer guiding device 12, and then the vacuum nozzle 3 is operated to release the wafer module 4, and the wafer module 4 smoothly reaches the predetermined position under the restriction of the guiding end 121 on the wafer guiding device 12. And electrically contacting the conductive terminals on the carrying portion 210; afterwards, the external force acting on the jig 1 is removed, and the locking device 22 is restored to the closed position. The wafer module 4 is locked. [0024] Currently, one wafer module is tested and needs to be taken out of the electrical connector 2 to test the next wafer module. Similarly, the jig 1 is first assembled on the electrical connector 2, and then an external force is applied to the jig 1, and the leading end 121 of the wafer guiding device 12 is covered before the locking device 22 has been switched to the open state. Around the wafer module; continue to press the jig 1 and the locking device 22 is switched to the open position. At this time, the wafer module can be taken out smoothly by using the vacuum nozzle, even if the wafer module deviates from the initial position due to an accident, it does not deviate from the range defined by the leading end 121; and when the wafer guiding device The fabrication and installation of 12 is not very precise. The wafer module is offset from the leading end 121 when the wafer module is unloaded. At this time, the leading end 121 may be encountered when the wafer module is removed, but due to the wafer guiding device 12 It is easy to slide up, so the operator can find 095136515 Form No. A0101 Page 10 / Total 27 Page 0993451055-0 1344733 - December 16, 099 to correct the replacement page problem, thus reducing and avoiding damage to the wafer module . [0025] In summary, the creation has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. All should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0026] The first figure is a perspective exploded view of a prior art jig. [0027] The first figure is a three-dimensional combination of prior art fixtures. [0028] The third figure is an exploded view of the creation jig. [0029] The fourth figure is a perspective exploded view of another perspective of the present fixture. [0030] The fifth figure is a three-dimensional combination diagram of the creation jig. [0031] The sixth figure is a perspective view of the main body of the creation jig. [0032] The seventh figure is an exploded perspective view of the electrical connector associated with the present fixture. [0033] The eighth figure is a perspective view of the present fixture acting on the applied electrical connector, wherein the locking device is in a closed state. [0034] The ninth diagram is similar to the eighth diagram except that the latching device is in an open state. [0035] The tenth drawing is a cross-sectional view taken along line X-X of the eighth drawing. [0036] The eleventh drawing is a cross-sectional view taken along the XI-XI plane of the ninth. [Main component symbol description] [0037] Fixture: 1 095136515 Form No. A0101 Page 11/Total 27 Page 0993451055-0 1344733 [0038] Main body: 10 [0039] Mounting part: 100 [0040] Plate-shaped body: 101 [ 0041] Opening: 1002 [0042] Passing groove: 102 [0043] Ball receiving groove: 1003 [0044] Guide: 103 [0045] Positioning block: 104 [0046] Concave: 10 5 [0047] Bump: 106 [ 0048] Card slot: 107 [0049] Holder: 11 [0050] Holder: 110 [0051] Holder: 111 [0052] Guide ramp: 112 [0053] Reception hole: 113 [0054] Extension: 114 [0055] Wafer guiding device: 12 [0056] Base: 120 095136515 Form No. A0101 Page 12/Total 27 Pages December 16, 099 Revision Replacement Page 0993451055-0 1344733 December 16th, 2017 [0057] Guide end: 121 [0058] Guide channel: 122 [0059] Positioning portion: 123 [0060] Slide portion: 124 [0061] Round hole: 125 [0062] Ball: 13 [0063] Second spring: 14 Backplane: 15 [0065] Plate: 1 5 0 [0066] Arm: 151 [0067] Notch: 1 52 [0068] Middle opening: 153 [0069] Stopper: 16 [00 70] Third spring: 17 [0071] Electrical connector: 2 [0072] Insulating body: 20 [0073] Cooperating hole: 20 0 [0074] Groove: 201 [0075] Protrusion: 2011 095136515 Form No. A0101 Page 13 / Total 27 pages 0993451055-0 1344733 _- December 16, revised correction page [0076] receiving body: 21 [0077] bearing part: 210 [0078] fixing part: 211 [0079] locking device: 22 [0080 ] Locking part: 221 [0081] First spring: 23 [0082] Frame: 24 [0083] Housing: 240 [0084] Driver: 25 [0085] Tab: 250 [0086] Boss: 2501 [0087] Positioning post: 251 [0088] Pressing part: 252 [0089] Vacuum nozzle: 3 [0090] Wafer module: 4 095136515 Form number A0101 Page 14 of 27 0993451055-0