TWI343850B - - Google Patents

Description

1343850. 6. Description of the Invention: [Technical Field] The present invention relates to a laser processing apparatus which is mainly used for opening and processing a workpiece such as a printed substrate, and more particularly relates to an improved productivity A multi-point illumination type laser processing apparatus for the purpose. [Prior Art] In the prior art, a laser processing apparatus capable of simultaneously processing two holes by splitting one laser beam from a laser light source into two beams in order to improve productivity is proposed (refer to, for example, Patent Document 1). In the laser processing apparatus, a laser beam is split by a first polarizing means into two beams of laser light, and is guided to a second polarizing means for substantially matching the optical paths of the two beams of laser light. At this time, one of the laser beams split by the first polarizing means (hereinafter referred to as a main beam) is guided to the second polarizing means via a set of lenses (bend mirrors). In addition, the other laser light (hereinafter referred to as a sub-beam) is scanned in a non-parallel two-axis direction by a pair of first galvano scanner groups. The second polarizing device is mixed. The two laser beams that have passed through the second polarizing device are scanned in a two-axis direction that is not parallel to each other by a pair of second electron microscope scanner groups, and are incident on the ίθ lens to be irradiated onto the workpiece on the table. . Here, since the sub beam is scanned by the first electron microscope scanner group, there is a slight deviation in the angle of the sub beam compared to the main beam passing through a group of lenses, so the main beam after passing through the ίθ lens The sub-beams are respectively illuminated at different positions on the table. In this way, it is possible to simultaneously process two holes with one ί 6> lens to improve productivity. 4 320239 [s] In addition, another laser processing polarizer has been proposed to split a beam of laser light into two beams of light, and the ^1 mirror scanner makes each beam of laser light toward 2 In the direction of the axis, the sweeping/missing is guided to the second polarizing device by the electro-optic light, and then the two holes of the two beams are used to improve the productivity (refer to, for example, the special document, the mirror is added simultaneously). In addition, there is a technique in which the lasers disclosed in Patent Document 1 are generated in the cymbal of each of the electron microscope scanners for performing hole processing at the target position (see, for example, Patent Document 3). Angle command value Patent Document 1: International Japanese Patent Publication No. 2005-230872 (Patent Document 3): International Publication No. 3/〇8〇283 (Convention) The sub-beam side of the slanting laser processing 褒 Γ 经由 经由 经由 经由 经由 合 合 合 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副夕°°; SEM scanner-^ with the feeling of passing through the fixed lens Compared with the unstable dioxin: the sub-beam of the SEM scanner must have a beam of processed product points: a lens positioned at a distance from the first electron microscope that is placed in front of the (7) lens. The front focus position is scanned to the 7th beam. Therefore, if the distance from the ίθ lens is greater than the distance from the SEM scanner group, it is processed by V f.

The Lua quality (the roundness of the machined hole and the focus of the embers 320239 5 1343850 ^ degrees) tend to deteriorate, and as a result, the quality of the machined hole for processing the workpiece is also deteriorated. Further, in the laser processing apparatus described in Patent Document 2, the laser light split by the first partial light-receiving device is configured to be scanned by the mirror scanner instead of the fixed-lens light, because it is f 6 »The space between the lens and the SEM scanner needs to be set between the second polarizer, so that any kind of laser light is scanned at a distance from the front focus position of the f0 lens. As a result, there is a problem that the quality of the processed holes of any laser light deteriorates. Further, in the configuration of the laser processing apparatus described in Patent Document 1, since the optical system is complicated, the angle command value of each of the electron microscope scanners necessary for controlling the position of the light beam described in Patent Document 3 is adjusted. In the calibration work, there are also problems in that it takes a lot of points during trial processing and takes time. The present invention has been made in view of the above, and an object of the present invention is to obtain a laser which can improve processing quality by reducing the difference in processing quality caused by two laser beams in a multi-point illumination type laser processing apparatus. Processing device. Further, another object of the present invention is to obtain a laser processing apparatus capable of easily performing a calibration operation required for controlling a processing position for irradiating laser light. (Means for Solving the Problem) - In order to achieve the above object, the laser processing apparatus of the present invention is a laser processing apparatus that simultaneously irradiates laser light at two or more points on a workpiece placed on a table to perform processing. The laser processing apparatus includes: a first offset 6 320239 m 1343850 optical device that splits the laser beam into the first and second lasers with different optical paths, and the first electron microscope scanner is disposed in the first The first laser light is scanned on the optical path of the laser light in the ith direction on the stage; the second electron microscope scanner is disposed on the optical path of the second laser light and the second laser light is emitted Scanning in a second direction different from the i-th side of the workbench; the second polarizing means mixing the first and second laser beams; and the main electron microscope sweeper is a pair of third and third The fourth electron microscope scanner is configured to scan the mixed first and second laser light toward the different third and fourth directions on the table; and the f Θ lens for scanning from the main electron microscope The aforementioned first and second laser beams of the device are respectively concentrated Is a predetermined position on the workpiece. * (Effects of the Invention) According to the present invention, it is designed to be the first! Since the light splitting of the polarizing means is constituted by three electron mirror sweeps (four), it has the effect of improving the processing quality while maintaining the productivity of simultaneous multi-point irradiation. [Embodiment] Hereinafter, a preferred embodiment of a laser processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings. Further, the present invention is not limited by the following embodiments. (Embodiment 1) An outline of the configuration of the first-needle laser processing apparatus will be described before (4) of the present invention. Fig. 4 is a structural diagram of a conventional multi-point illumination type laser processing. Laser processing 2: ΧΥ table 2η ′ is placed on the printed substrate and other objects (10), Ί 320239 7 1343850 • can move in the horizontal plane (χγ plane); and optical system, used to

The laser beam L emitted from the laser oscillator (not shown) is irradiated onto the workpiece 212 on the χγ operation A 211. In the 14th order, the surface of the XYJ1 on which the force port/worker f12 is placed is the horizontal plane, and the two wheels orthogonal to each other in the horizontal plane are the x-axis and the Y-axis, and the X The axis perpendicular to both the axis and the gamma axis is the Z axis.

The optical system includes: a first eccentric wire 222, which is composed of a polarization beam splitting mirror ^) eam, splltter), etc., and a light emitted from a laser oscillator (not shown) into two laser beams 'Lb; The second polarizing means 223 is composed of polarized light (cut or the like), and the two laser beams La and Lb which are split by the first polarizing means 222 and travel on different optical paths are mixed (mi}〇 and guided to substantially the same optical path. And the W lens 228 condenses the mixed laser light La, Lb from the second polarizing means 223 on the workpiece 212, so that the two beams of laser light La, Lb that are split are in the first polarizing means 222. The optical path length between the second polarizing means and the second polarizing means is the same. The second polarizing means 223 divides the two laser beams b into two apertures. In order to simultaneously process the S solution using a f 0 lens 228 'Describes that the optical paths of the laser light L, La, and Lb are arranged to the lenses 22la to 221 (1 and the phantom 226b, so that the laser (four) devices 224a, 224b, 226a, the y-axis, the gamma axis, the heart-first path become the above It is set to bend at an angle of 90 degrees (and private and parallel). In this case, the skill is 4 C reflection. The upper lenses 224 to 221 (the first system of the 1 series are disposed in the light I, for example, the laser light u reflected by the device 222 forming a 45 degree with respect to any axis of the 239 320239 coordinate system shown in the figure. Scanning the first polarized light Lb in the two-axis direction and connecting the pair of rotating shafts of the laser photoelectric scanners 224a and 224b and the electric ## polarizing device 223 to the X-axis direction The mirror month 225a causes the rotation axis of the lens 225b to be arranged. The EM scanner 224b is arranged by the mirror scanner 224a. By b-spring the X-axis direction of the electric 211, the multiplexed light Lb is directed toward the boring table. Scanning, the laser can be scanned by the electron microscope scanner. U is directed to the Y-axis direction of the lamp stage and 'in the second polarizing device is set to have the second polarized lens f from the second lens 228. The mixed laser light La, Lb of the second setting 223 is pushed in the axial direction and guided to the jade 21 226a, 226b. The electric recording is „„ooe, and the food is immersed in the electron microscope. ,, .7 τ θ 226a is arranged so that the rotation of the lens 227a is '', °, electron microscope The scanner 226b is disposed such that the lens = the rotation axis is in the Y-axis direction. By scanning the electron beam scanning 226a, the laser light La, Lb can be scanned in the X-axis direction on the χγ table 11. By scanning the electron beam selection S 226b, the laser light 11 (four) stage can be scanned in the x-axis direction. The following describes the operation of the laser processing apparatus having the above configuration. The polarization direction of the laser light 1 emitted from the laser oscillator (not shown) is adjusted to 5 degrees in the direction of 5 degrees, and the laser beam L is reflected by the two lenses 221a and 221b and enters the first polarizing means 222. The i-th polarizing device (10) splits the field light into a p-wave laser light whose polarization direction is perpendicular to the incident surface, and a s-wave laser light whose polarization direction is parallel to the incident surface.

The laser light (hereinafter referred to as main beam) La penetrating the first polarizing split 222 is guided to the second polarizing means 223 via the two lenses 221c and 222ld. On the other hand, the laser beam (hereinafter referred to as sub-beam) Lb reflected by the i-th polarizing means 222 is scanned by the electron microscope scanner 224a in the two-axis direction and then guided to the second polarized skirt 223. Here, the main beam enthalpy is constantly bowed to the second polarizing means at the same position, and the sub beam Lb is adjusted to be incident on the second by controlling the electron microscope to scan the slant angle of 22 224 & 22 sen. The position and angle of the polarizing device 223.

Thereafter, the main beam La is reflected by the second polarizing means 223, and the sub beam 1^ penetrates the second polarizing means 223, whereby the two beams of laser light are guided into the substantially identical optical path and guided to the electron microscope. Sweeper 2 coffee, 226b. Then, after scanning in the two-axis direction by the electron microscope scanners 226 & 22, the guide lens is guided to the ίθ lens 228, and is respectively placed at a predetermined position on the workpiece 2! 2 to perform processing. At this time, by scanning the electric ray processors 224a, 224b, 226a, and 226b, the main beam U and the sub beam Lb can be irradiated to the two points different from each other on the object 212. After the processing of the holes in the area to be scanned is completed, the next scanning area (4) can be implemented by moving the χγ' operation (2) in the direction of the 中 in the figure. Here, the first group of the electron microscope scanner 224a is used. When 224b is at a certain angle, the split laser light Lb will draw the same trajectory after the second shift of money, and the same position will be called. Now suppose there are two 320239 丄3

The position of the holes A and β to be processed near St, first, the main beam is processed by scanning the second axis-sharp 226a, 226b in the two-axis direction to process the hole position of the one (for example, A). In this position

• Hole machining. The girl from the ^ J ' 者 者 ' as long as the first group of electron microscope scanners 224a, 224b and then * ' /, 2 cypress direction and from the hole position A to the other hole position B in the direction of sweeping 'the sub-beam Lb The other hole position B is processed. As described above, in the laser processing apparatus having the configuration of Fig. 14, the functions of the ^ 2 group of electron microscope scanners 226a, 226b can be regarded as the main scanning, and the functions of the one group of the electron microscope scanners 224a, 224b can be It is regarded as a differential scan from the 2 position A to the hole position B as described above, and it is easy to intuitively understand the structure. Further, in practice, as with its function, the swing angles scanned by the first group of electron microscope scanners 224a, 224b are smaller than the swing angles scanned by the core 22 ribs of the second group of electron microscope scanners 226. However, in the laser processing apparatus described above, the sub-beams Lb which are one of the split beams pass through a total of two groups (i.e., four units) and a large number of electron microscope scanners 224a, 224b, 226a, and 226b. However, since the electron microscope scanner uses the lens portion to rotate and is unstable compared with the case of fixing the lens, the processing performed by the field 1L beam Lb necessarily has processing quality (the processing quality referred to herein means the scanning area). The problem of the deterioration of the hole quality and the machining position accuracy such as the hole roundness and the focus margin of the hole is likely to deteriorate. Further, the long distance from the front focus position of the f0 lens 228 to the farthest electron microscope scanner 224a for scanning the light beam is also one of the causes of deterioration in processing quality (especially, the quality of the processing hole). Therefore, the present invention provides a laser processing apparatus, which is designed to design 320239 11 1343850, and the laser light La, Ly5 of each optical path is scanned at χγ; the second polarized light is used for the first partial bias in the opposite direction. The wire is set to 21 and travels to a polarizing beam splitter or the like to form two laser beams 26a, 26b that mix and combine the light La to the same material (hereinafter, the same: phase_optical path; electron microscope scanning mirror) The scanner, _, is made; the device 26 & 2, the laser light, which is called the main power, is mixed in the XY table polarizing device 25; and the lens 28 is now different. The direction is scanned on the workpiece 12. Here, the first and the second f 23a, 23_ corresponding to the electron beam scanners 26a and 26b described in the sub-laser light and the L 々 concentrating application range correspond to the third mirror scanning state. Similarly, the Lord, in addition, for the sake of simplicity, (the system is down: the electron microscope scanner. The lenses 22a to 22f on the optical path and the February of the Thunderbolt are described as follows: configuration 2 讣 system to laser light l, La Lb is configured to be, for example, angled with respect to _^ in the figure, with == 撝 state 2, 23b, 26a, purpose (for example) The light is formed at an angle of 45 degrees for one axis, so that the laser path of the XYZ coordinate system is the same as that of the Χϋ, γ axis, and ζ axis, and the optical path of the '_La, LyS is as follows: penetrating the first polarizing device In addition, the optical path is set to reflect 25, and the second polarizing means 21 and the second polarizing means 2 are attached to the second polarizing means 25, and the laser light is transmitted through the W. The second polarizing device 2 is the same as the second polarized light. The length of the optical path between the electrodes 25 is arranged on the optical path passing through the second laser beams La and L/5 in the first embodiment. The number of lenses 22a to 2f and the number of 320239 13 1343850 electron microscope scanners 23a and 23b are arranged to be equal in the two optical paths. In addition, 'in order to make two beams of laser light, L/9 There is no difference in characteristics, and the countermeasures for the configuration of the SEM scanner are also developed. That is, the optical path lengths from the Μ lens to the TEM scanning 23a, 23b are designed to be equal in the two optical paths. 'The laser light penetrating the first polarizing device 21 (hereinafter referred to as α beam) U to the second polarized light The optical path of the device 25 is provided with lenses (22a to 22c) of η (n is a natural number) and an electron microscope scanner 23a. Further, the laser light reflected by the first polarizing means 21 (hereinafter referred to as $beam Μ) The optical path of the second device 25 is provided with a lens (22d and an electron microscope scanner) of n (n is a natural number). In the case of the first figure, the configuration of n=3 is due to The same number of mirrors are arranged on the two optical paths to be the same one, so the quality of the laser light passing through the two optical paths is plotted. In the first embodiment, for example, FIG. 1 and the second == main The electron microscope scanner 26a is such that the rotation axis of the lens 27a is -::::::rrr26b#-w^^27b 2", 27b is more than:::=:::Nove', the front focus position of the brother at η F. However, it is possible to configure a plurality of lenses in the same position, so consider the case of the film. That is, the lens 27b of the electron microscope scanner 26b, which is necessary for the electron microscope scanner, is as close as possible to the position of the focus point F of the squint. <Position Configuration Main Electron Microscope Scanners 26a, 26b, 320239 14 1343850 The center position of the lens 27a connecting the electron microscope scanner 26a and the lens of the electron microscope scanning 26b? The center point of the straight line at 7h 66, dt* Αώ 丄 , and 27b is the focus position F of the ίθ j mirror 28. However, at this time, in consideration of the rotation of the respective lenses 27a, 27b of the main scanning electron microscope scanner, 26b, it is necessary to select the two lenses a' 27b in such a manner that the interference does not occur between the two 22 2 27b (electron microscopy) The distance between the scanners 26a, 26b) is 2Y. In the example shown in the figure, when the lens of the electron microscope scanner 26a is turned on and fixed, and the electron microscope scanner is rotated, the incident position of the laser main lens 28 is changed. Conversely, considering the fixing of W of the electron microscope scanner 26b and the rotation of the electron microscope scanner, the incident position 26b of the (four) mirror (5) is changed by the lightning, the light L. In this way, the incident position (incident angle) of the laser light La, ... " (four) mirror 28 can be changed by making the electron microscope::'. As shown in Fig. 1, the optical system of the 光束 匕 , , α α α α α α α α α α α α α α α α α α α α α α α α α α 电 电 电 电 电 电 电 电 电 电 电 α 电 α α α α Align the direction of the electron mirror to make the rotation axis of the lens 2 become the 2-axis sweeping benefit 23 &, and the electron beam of the alpha beam La is used as the & the field direction is followed by the X direction. On the XY:L 1 lower stage 11, the X-ray & L al ^ is the Μ direction of the Λ , 以 , 以 以 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电'The direction of the sweeping is followed by the Z direction and 320239 15 850, and the m stage is the y direction. Also printed, by scanning the SEM 23a for scanning, it is possible to make the laser light Scanning in the X-axis direction on the table ^, by scanning the SEM sweeper, the laser light can be scanned toward the χ gamma table u_^y (4) to scan the 0 control unit 30, and the main SEM scan is performed. Interpolator, Na and sub-electricity = Tracing, 23 (four) adjustment of the relationship between the angle of the lens and the position of the processing hole: industry, with control to use the mine Light La is irradiated to the machining position of the main hole and the sub electron microscope scan electron microscope scanner ㈣26 coffee, calibration and operation control processing jobs based on the angle of Na lens control unit 3G performed in embodiment 4 will be described.

The ancient child Ming-^ performed the action of the laser plus U having the above-described configuration in February. Heart-shooting vibrator 2. The oscillating laser light 1 is split by the 21 to be the laser light L 々 on the penetrating side. The laser light on the penetrating side (ie, the "beam" L: = _ laser light L 仏 to 22c and the electro-optical lens for the alpha beam are second polarized. Similarly, the reflective side is guided to $ is also guided to the laser light La, L of the electric device 25 for the second polarizing device beam via the other fixed lenses (10) to 22 " the beam mirror scanner 23d: scanning by the second polarized light And the lens _ lens 28, thereby taking the day ^ mirror;; the tracer 1, the two points of tearing. Then 'processing the workpiece 12. At this time 2 and the main electron microscope scanner service, all rely on the sweeper 23a, The setting of the guard information is used to control the lens angle. Section 3Q Pre-320239 16 1343850 Here, the reason why the processing quality can be improved by the laser processing apparatus according to the first embodiment will be described. The first polarizing means 21 and the second polarized light are used. The quality of the two laser beams La and L, which are split between the devices 25, is equal by the same number of lenses and electron microscope scanners. Therefore, the processing points are improved, and the accuracy deviation and the quality of the machined holes are improved. The deviation of the accuracy of the machining point position is the positional deviation of the machining point, which is relative to The error deviation of the position is determined. The angle error at the time of scanning by the electron microscope scanner is the main cause of the variation in the accuracy of the position of the machining point. With the first embodiment, the α beam La and the /5 beam W are respectively passed through three sets of electricity. The mirror scanner is smaller than the deviation of the machining position accuracy by the four sub-beams Lb of the conventional example. The other machining hole quality means that the electron microscope scanner is in the scanning area while changing the Z-axis height. The degree of roundness of the machined hole when the machining is performed by scanning. Generally, if the true circle ratio of the hole is a predetermined value, the quality of the hole is judged to be good, and the quality of the machined hole is judged as The larger the Z-axis range of Jiayu, the wider the focus margin and the better the quality of the machined hole. Here, the Z-axis refers to the sub-electron scanner 23a, 23b, the second electron microscope sweeper 23 and the main The electron microscope scanners 26a and 26b and the f 6» lens 28 are formed as a component group having a mechanism that moves in a direction parallel to the upper surface of the lamp stage u and parallel to the direction (Z-axis direction). Generally speaking, the light before the processing point The more the number of lenses inserted, the worse the quality of the transmitted laser light (the true roundness) will be, and the quality of the beam at the processing point will be reduced. The result is that the quality of the processed hole is also deteriorated. If the plane is strictly speaking, the concave and convex shape is different in the longitudinal and lateral directions, and most of the 320239 1343850 is different, and the diffusion angle of the light beam of the laser light propagating in the plurality of lenses or the Z position of the light collecting point is in the longitudinal and lateral directions. There will be great differences. In terms of the ear, the lens of the SEM scanner is designed as a specially shaped lens, and the flatness is also poor. Therefore, when there are multiple electron microscopes on the optical path, the beam at the processing point Quality deterioration can become very noticeable. ^ Figure 3-1 is a schematic diagram of the state in which the quality of the processed hole is good. Fig. 3-2 is a schematic view showing a state in which the quality of the processing hole is poor. As shown in FIG. W, when the number of lenses and electron microscopes for propagating the laser light L is small, the XZ plane based on the coordinate axis of the reference and the shape system when the laser beam L is cut plane is used. - So that 'the focus is equal, the beam is often straight, not cut at the Z axis near the focus, the laser light L is round. Autumn:::3-2 shows that when the number of lenses and electron microscopes that propagate laser light is eve, the χζ plane and γζ m-cut laser shape based on the coordinate axis shown in the figure are not— To. That is, the focus height (ζ glaze) is different. As a result, in the case where the 隹 * 罟 ( 四 四 τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷In Fig. 3-2, the == angle and the condensing position are different in the longitudinal and lateral directions: a case where the first 攸杈 ellipse changes to the vertical ellipse. The :4 figure shows an example of an evaluation method for the quality of the machined hole. Machining: The quality evaluation method is based on the z._ axis range. When the Z-axis height is changed and the "Wheeling value" is reported, the shape of the machined hole is predetermined. Above the percentage, that is, the Z-axis range of the force hole σσ is considered to be a good range. In addition, the processing is easier. The shaft dry circumference is wider than 320,239 bundles. 1= The main light of the laser processing device of the figure: _2 The figure shows an example of a range in which the processing hole 0 of the laser beam processing apparatus (1) beam L 本 of the first embodiment is judged to be preferable. First, as shown in Fig. 1, the laser light is propagated 'in the main beam La'. The number of electron microscopes 226: 226b is as few as two, and in the sub beam = electron beam scanning m 224b, 226a of the light, ^ = one. Therefore 'only spreads to 2 electron microscope scanner 2, 2 coffee = The quality of the processed hole of the laser light is high', but the machining hole of the sub-laser light Lb that is transmitted to the four electron microscope scanners ^224b, 226a, 226b

Low ground. In contrast to this, as shown in the second figure, the propagation of the laser light P == three of the alpha beam L ... light (10). The quality of the wells is better than that of the wells of the 4th hole. In addition, the amount of light that is applied to the light beam is determined to be approximately the same as that of the first shot, and the range in which the two are overlapped (that is, the quality of the processed hole is a good Z-axis range) It is wider than the case of the first plus laser processing device. That is, by improving the beam quality of the laser light on one side of the beam product, the force of the thunder is set. Further, as the arrangement distance of the front focus position F of the sub-shooting lens 28 shown in the second figure is improved, the hole quality is improved. That is, as shown in Fig. 1, by the configuration of the present 4_'open field 1, the sub-electron microscopy scanners 23a and 23b are individually arranged in the = path of the α-beam La ◎ beam ^, and the first position can be approached. The front focus is only set to F, so it is possible to improve the quality of the machined hole 320239 19 1343850. Since the distances of the sub-electron scanners 2% and 2 in the separation focus position F are equal, the machining is performed by the light-emitting La and Ly9. The quality of the holes will be the same. ' _ According to this implementation (4) 1, the split-lens S-La, L/5 are only passed through 3 electron microscope scanners, and also shorten the front-focus position y from the lens to the farthest sub-electron microscope of the beam scanning By the distance between the scanners 23 & 2 and the north, it is possible to solve the problem of deterioration in the processing quality of the conventional sub-beam while maintaining the same productivity as the conventional multi-point illumination type. In addition, since the processing quality of the two Rays (four) La is equal, the Moonlight expands the range of the z-axis height that can be processed with good quality, and can be carried out under a wider range of conditions than the conventional laser processing apparatus. The effect of processing. Embodiment 2 FIG. 6 is a configuration diagram of a second embodiment of a laser processing apparatus according to the present invention, and FIG. 7-1 is a sub-electron microscopy scanner and a _main electron microscope scanner of the laser processing apparatus of FIG. The arrangement diagram when viewed in the X-axis direction, and the second diagram is the arrangement diagram of the electron microscope scanner in the vicinity of the front focus position of the lens of the laser processing apparatus of Fig. 6. The laser processing apparatus is characterized in that In the first embodiment of the embodiment, the rotation axis of the lens of the electron microscope scanner is tilted by an angle 相对 with respect to the Z axis. Further, the sub + electron microscope selectors 23a and 23b are also opposed to the embodiment! The position is followed by the tilting angle < 9. The scanning axes of the electron microscope scanners 2, 23b' = lenses 24a, 24b, 27a respectively form the same right angle coordinate system. Two lenses 22g to 22j are disposed between the lens 22b and the pair 320239 20 1343850 u 23a in the optical path, and between the lens 22d and the pair: the XYZ coordinate system shown in 23b becomes a straight line in the figure. π^ # I line dumping ^ 用 user. The ratio lens 22g, 2 ϋ W0 _ optical path system is configured to be in the xyz rectangular coordinate system: the reference is based on any one of the $$ spindles. This is necessary for the Weijia X point height relative to χγ. In the case of the second embodiment, the feature is that the 26a is arranged obliquely under the oblique angle of the electron microscope scanner by the oblique curved energy mirror scanner, as shown in Fig. 7_1. to Fig. 7-2, Fig. 2 Compared with the arrangement position of =1, the EM scanner 26a is only tilted at an angle Θ in the second=positive direction. By the month = the movable range of the lenses 27a and 27b, the two are not considered to be away from each other. Then, the distance between the two lenses 27a, 27b can be made smaller than that of the implementation. As a result, the front focus position of the f Θ lens 28 (five) the ideal position of the front scan of the lens 2) and the two lenses 27a, 27b. In addition, the quality of the processed hole of the laser beam can be improved by shortening the situation of the second figure of the embodiment! Further, the electron microscope scanner 26a is tilted by an angle Θ, and the electron microscope scanners 23a and 23b are also used. 2 is shown in the positive direction of the z-axis in the yz plane as compared with the configuration position of the second embodiment shown in the figure. The reading is performed by reading the reading g. In the case where the electron microscope scanners 23a, 23b, and 26a are tilted as described above, the respective electron microscope scanners 23a, 23b, 26a, and 26b are swept by the gamma gamma table 11 at the time of sweeping. The scanning directions of the light rays La and L/3 become parallel to the x-axis and the axis of γ 320239 21 1343850.

According to the second embodiment, in addition to the effects of the first embodiment, since the main electron microscope scanners 26a and 26b are arranged close to the front focus position F of the ίθ lens 28, the processing can be further improved as compared with the first embodiment. The effect of hole quality. (Embodiment 3) In the second embodiment, in order to change the position of the light beam by the vertical adjustment mechanism of the boring shaft (the structure for adjusting the focus position by operating the machining head portion), it is necessary to provide the light path in the middle of the optical path. There is a problem that the number of lenses after the first splitting (first polarizing means 21) is larger than that of the first embodiment in the optical axis "parallel to the x-axis". Therefore, in the present embodiment, the case where the number of lenses after the first splitting is designed to be the same as that of the first embodiment will be described. Fig. 8 is a view showing the configuration of a third embodiment of the laser processing apparatus of the present invention. In the first embodiment of the first embodiment, the laser processing apparatus is configured such that only the electron microscope scanning $26a is tilted obliquely on the oblique side of the electron microscope scanner. The arrangement position of the electron microscope scanner is the same as that shown in Figs. 7 and 2 of the second embodiment, and therefore the description of 1 is omitted. Further, in the third embodiment, only the electron microscope scanning _ 26a is inclined up to the angle 仃 仃 arrangement, and the other sub electroscope scanner 23 and the lenses 22g to 22j are the same as the embodiment 丨

^ ^ „ It is configured so that the optical path is parallel to the χ#, γ-axis, and 2_ 任-axis of the χγζ coordinate system based on XY operation. Therefore, the beam position can be prevented from being caused by the up-and-down adjustment mechanism of the ζ axis. 320239 22 1343850 In the case of the real ~3, when scanning each ECG scanner, 2 North, 26a, 26b, χγ七二n

The laser light La, L === on the XY ui i XY table 11 is parallel to the X-axis and the Y-axis, but is parallel to the two axes intersecting at a predetermined angle other than straight (four). According to the third embodiment, the scanning of the second polarizing means 25 of the scanners 26a, 26b is performed by χ γ ☆ two: quasi: ί = the SEM scanner is fine, and the scanning coordinates are no longer at right angles but have At a certain angle of 0, the number of lenses after the polarizing device 21) is a configuration having a smaller number of sheets than the shape energy/conformity: Therefore, it is possible to suppress the deterioration of the quality of the machined hole as compared with the second embodiment. . The ambiguous embodiment 4 The arrangement of the ρ clock and the mirror in the first to third embodiments has been described. Such as: = work f: centered electron microscope scan: 1 in the optical system as shown in Figure 1, 1 such as 'in the embodiment of the scanner 23a and the beam L / 3 for electricity: two " U The electron microscopic broom 叩 叩 扫描 扫描 叩 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' In Example 28, the electron beam of the α-beam La is scanned so that the desired Μ lens is in the X-axis direction, so that the scanning direction of χγ a is in the immediate operation 11 and the X-axis direction of the SEM beam is used. , the direction of the Ζ, so the scanning direction of the ^ u u u 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上 实际上However, for the reason of the limit, etc., the scanning direction of the TEM scanner is not straight on the XY machine 320239 1343850. In addition, since the processing hole position can be controlled by the drawing method (control method), the sweep of the brother sweeper 3 can also be used for the alpha beam u as in the embodiment 2, and the electron microscope scanner for the beam W is moved. Scanning 2A and Wanguang, in either case, must be composed of =. Because of the angle of 26^, the hole to the target == force, therefore, in the fourth embodiment of this embodiment, the hole is processed by ^. The electric processing method of the hole processing is described. Second, the controller of the laser processing apparatus is the first diagram, the sixth diagram, and the control unit 30. The control unit 3 has the following functions: The adjustment function 3丨 is to obtain the relationship between the slice of the electron microscope scanner and the position of the machining hole opened on the boring table 11; 3L model) storage function 32 Is a storage model for obtaining the lens angle of the electron microscope scanners 23a, 23b ' 26a, 26b for performing hole processing on the target position determined by the adjustment; ^gong &.31; The information storage function 33 is a processing information for storing the position of the machined hole for the workpiece 丨2, and the processing control function, which is the processing information stored in the processing information and the model of the model storage function. The SEM scans $23a, 23b, 26a, 26b and the control of the laser oscillator 20 are performed. Hereinafter, the outline of the control method of the laser processing apparatus will be described first, and then the adjustment method for performing the control will be described. The laser processing apparatus requires the following functions: the hole coordinates (target hole coordinates) on the XY working port 11 to be processed, and the 24 320239 !343850 electron microscope scanners 23a, 23b, 26a, 26b required for processing thereof are obtained. Angle (angle command value). Fig. 9 is a block diagram showing the relationship between the lens angle of each electron microscope scanner of the conventional multi-point illumination type laser processing apparatus shown in Fig. 14 and the coordinates of the machined hole. As shown in FIG. 9, in the conventional simultaneous multi-point radiation type laser processing apparatus, a squatting method is adopted, which is obtained by taking the processed hole coordinates (ax, ay) of the light beam La by A machined hole coordinate (bx'by) of the sub-beam Lb is obtained from the difference of the processed hole coordinates (ax, ay) of the main beam. That is, the lens of the rib of the second group of electron microscope scanners 226a, 22 The angle of the machined hole coordinates (ax, ay) of the main beam La is determined. The other side of the beam allows the machined hole coordinates (bx, by) to be scanned by the second group of electron mirrors: 226a, 226_lens angle In addition, by the electron beam scanning of the 】 group, the lens angle of 224a 224b is determined, if the main light and the sub-beam Lb are collected, the relationship between the output of 4 inputs and 4 outputs can be obtained, that is, 4 electron microscopes are set. Scanner plus, 224 2 2, 2 coffee lenses ^ degree when 2 processing hole coordinates (4 coordinate components) will be determined. According to this, it is a reflection of the details) please light, Γ 2 Γ = laser In the processing apparatus, as described above, both of the laser light before the π-knife are propagated to the same number of eight-eyes of the main beam of the main beam of the scanning electron beam. There is no such thing as a laser plus a device or the like. That is, as shown in FIG. 9 for the present invention, the above-described four mapping relationships using the conventional 7 and the ninth figure are not applicable. The mirror of the electron microscope scanner: the two-degree square of the hole-to-hole coordinate h, so a new control method for determining the coordinates of the hole is required for 320239 25 1^43850. Figure 10 shows the laser processing device of the present invention. A block diagram of the relationship between the lens angle of each electron microscope scanner and the coordinates of the machined hole. As shown in Fig. 10', in the laser processing apparatus of the present invention, regarding the alpha beam, the position coordinates of the machining hole (α) χ, α y) is determined by the lens angle of the sub-electron scanner 23a disposed on the optical path of the light beam, in addition to the lens angles of the main electron microscope scanners 26a and 26b. Further, regarding the _ /5 beam La, the machined hole position coordinates (/Sx, y?y) are also arranged by the light beam of the main beam mirrors 26a, 26b by the lens beam The lens angle of the sub-electron scanner 23b on the road is determined. Further, when the observation is performed, it is known that the following mapping relationship is obtained, that is, when the lens angles of the four electron microscope scanners 23a, 23b, 26a, and 26b are determined, the four processed hole coordinates αχ, ay, and 10,000 (The two holes each have a χ coordinate and a γ coordinate, so there are 4 variables). Accordingly, the fourth embodiment is characterized in that in order to obtain two machining_hole coordinates (components of four machining hole coordinates), the mapping inverse mapping model represented by the block diagram of the first drawing is used. In addition, there are still 4 input and 4 output characteristics, that is, it is known from Fig. 10 that the four coordinates of the target position coordinates αχ, α y, and stone y with respect to the two machining holes, in order to achieve the coordinates ax in the hole, The processing of ay and I outputs four variables of the estimated angles gae, gbe, gCe, and gde of the lens angles of the four electron microscope scanners 23a, 23b, 26a, and 26b. Further, in the inverse mapping model used in the fourth embodiment, a polynomial model including a polynomial of four inputs and four outputs is used, and four processing holes are obtained from the lens angles of the four electron microscope scanners 23a, 23b, 26a, and 26b. 320239 26 1343850 Functions of coordinates αχ, ay, px, & Here, the polynomial refers to a formula that is calculated only by the arithmetic operations of constants and variables, and many types can be considered. The reflection = type used in the present embodiment is expressed by the following equation (1). Here, a matrix representing the estimated values of the lens angles of the four electron microscope scanning benefits 23a, 23b, 26a, 26b, a target hole seat bar matrix represented by a polynomial model of the Α system (η is a natural number), and an X system representing a matrix Α Coefficient matrix (or not

Be=AX...(1) Ping ' :] as in the case of the 1st polynomial model, in the case of the item $15 partial t-type model, the type J=::n is the following formula (3) Form, *3rd degree polynomial mode, additional explanation, except for the polynomial of 1 point, etc., using equation (4), etc.

[g?T e e e Sb > Sc > Sd

Py,β*,a ct, X k2 k3 ^1-2 ^1-3 k2-2 ^2-3 ^2-4 ^3-2 ^3-3 ^3-4 ^4-2 k4- kS- 2 ^5-4 . -(2) ____B* _

••••(3) 320239 27 _x^43850 i6a > Sb > Sc J Sd ] l1:: ~~P*Py βχβ,2 ·· axJay a,3 .kjs-i k3M k3s.3 (4) In the formula, the components of the coefficient matrix x are kl-1, kl2, ·.

The coefficient of the equation is determined by the adjustment method described later in accordance with the characteristics of the optical system. As shown in the equations (2) to (4), the matrix x is a matrix composed only of coefficients of a polynomial. For example, in the case of the first-order polynomial model, the coefficient matrix X is a matrix of 5x4, and in the case of the second-order polynomial model, the 'coefficient matrix X is 15><4_array, in the case of the third-order polynomial model, the coefficient The matrix X is a moment drop of 35x4. If the number of polynomials is increased and the number of terms is increased, the position of the guard hole (4), which is more southerly, can be performed, but it becomes a polynomial mode.

Kw kU3 kM - k 2-1 k 2-2 ...... • The coefficient moment p is for the car and requires more information. Although it is possible to use an arbitrary number of minor terms, it is known from the experimental results that in the case of a laser processing apparatus for opening a substrate or the like, 'when using a polynomial model composed of all times of three times or less = When the number of items (the number of items = 35), it is possible to generate an inverse mapping model that satisfies the accuracy of the required specifications. w ' To find the coefficient of the above polynomial model (unknown parameter), need two. The processing is performed by the adjustment function 31 of the control unit 30. In the 2fih processing, the angle values of the lens angles of the respective electron microscope scans 11 23a, 23b, and 26a 265 are set to be trial-processed, and α 320239 28 The imaging means 29 such as a camera measures the actual hole coordinates to be processed. From the angle data center, gb, gc, gd of each of the electron microscope sweepers 23a, 23b, 26a, and 26b, and the hole coordinate data, ay at the time, using the minimum/flat method or the weighted least squares method, etc. The coefficient of the polynomial model (unknown parameter). The inverse mapping mode (polynomial model) of the mapping of the two hole coordinates processed by the adjustment function 31 in accordance with the lens angle of each of the electron microscope bailers calculated by the above method is stored in the model storage function 32. In the adjustment processing, the laser processing apparatus of the present invention exhibits a remarkable effect of shortening the working time compared to the conventional multi-point irradiation type laser processing apparatus, and the comparison is made by using the following simple example. effect. In the present invention and the conventional calibration process, the first group of electron microscope scanners 23a, 23b (or 224a, 224b) are respectively set to four lens angles for trial processing, and the second group of electron microscope scanners are compared. 26a, 26b (or 226a, 226b) respectively set the three lens angles for trial processing. Fig. 11 is a view showing the position of the g-machined hole when a conventional multi-point irradiation type laser processing apparatus is used. Fig. 12 is a view showing the position of the processed hole when the laser processing apparatus of the present invention is used. Further 'for the sake of simplicity, the ideal ίθ lens 28, 228 is assumed here, and is on the χγ table η, 211. Scan on a straight line. In the figures, the horizontal axis represents the X-axis on the χγ table 11, 211, and the vertical axis represents the Υ axis on the ΧΥ table 11'221. In addition, the "〇" symbol indicates the addition of the main beam La or 〇: Guangdong La. The position of the hole "X" indicates the position of the machining hole formed by the cooling of the sub beam Lb or the β beam L. . Figure 13 is a diagram showing the number of machining holes required for adjustment. In the case of the trial machining of the laser processing apparatus (Fig. 14) of the conventional 29 320239 [s] 1343850, the combination of the lens angles of the electron microscope sweeper is 3x3x4x4 = 144 kinds and the laser light La, Lb is Two bundles, so there are 288 kinds to be confirmed. However, due to the characteristics of the optical system, there are portions that are repeatedly processed at the same position. For example, as can be seen from the block diagram of FIG. 9, in the conventional multi-point illumination type laser processing apparatus, the optical system of the main beam La does not depend on the lens position of the electron microscope scanners 224a, 224b. Confirm 3x3 == 9 kinds. In other words, the number of holes to be confirmed is less than 288, and 153 types are required. On the other hand, in the laser processing apparatus of the present invention, the combination of the lens angles of the pilot/middle mirrors is 3x3x4 = 36, and the laser light l〇: and l stone are two bundles, so it is necessary to confirm There are 72 kinds. Even in this simple example, the laser processing apparatus of the present invention can reduce the number of holes for trial processing when 81 adjustments are made than the conventional technique. In the adjustment process, it is necessary to oscillate the lens of the electron microscope scanner more finely, and thus the difference in the number of holes between the conventional technique and the prior art is more conspicuous. In the adjustment process, the camera device 29 measures the coordinates of the hole to be tested, and the larger the number of holes, the more time the measurement operation takes. The coefficient matrix is obtained by the calibration process as explained above, and the polynomial model: coefficient is determined. Then, in the actual machining, the machining control force 龅 34 of the control unit 30 acquires the XY table 11 and the seat (〇: X, α y), (no, y) from the machining information storage function 33 as The desired position on the workpiece 12 is obtained by the coordinate wheel of the desired opening position, and the lens angle stored in the model storage, and the lens angle of the electron microscope scanner 23a, 23b, 26a, 320239 m 30 1343850 26b Control the lens angle of the SEM scanner obtained after the calculation, handsome, 1 as. By the above process, it is possible to open a hole at a position on the workpiece 12 as a target. Further, in the above description, the case where the laser force of the embodiment is used is an example of the work device, but in the case of the second and third embodiments, the electron microscope scanners 23a and 23b can be controlled by using the polynomial mode (4). The position of the lens of 26a, 26b controls the position of the machined hole. According to the fourth embodiment, since the same number of electron microscope scanners are disposed on the optical path split by the second polarizing means 21, the number of holes to be added required for the adjustment processing can be reduced, and the adjustment processing time can be greatly increased. Significantly shortened ground. Correction, for an X device having such an optical system, has an inverse mapping model that can be mapped by two aperture coordinates of a mirror of two electron microscope scanners. In the above-described embodiments 丨 to 4, two light beams are arranged on each of the optical paths of the two beams, and a plurality of sub-examples are arranged. However, as long as the number of the optical paths is the same, any two of them may be arranged. Mirror scanner. In addition, it is also possible to use the concept of ' splitting the light into p power and then splitting it into two beams, or preparing a plurality of laser gates. Addition and Addition [Industrial Applicability] As described above, the laser processing apparatus of the present invention is a case of a plurality of high-precision hole machining. ' Simultaneously, the following is a brief description of the drawings. 320239 1343850 FIG. 1 is a view showing the configuration of the first embodiment of the laser processing apparatus of the present invention, and the vicinity of the front focus position of the (7) laser processing apparatus of the first embodiment. The configuration diagram of the electron microscope scanner. Fig. 3-1 is a schematic view showing a state in which the quality of the processed hole is good. Fig. 3-2 is a schematic view showing a state in which the quality of the processed hole is poor. Fig. 4 is a view showing an example of the method of evaluating the quality of the guard hole. Fig. 5-1 is a view showing an example in which the main beam and the sub beam of the conventional laser processing apparatus are added, and the hole quality is judged to be a good range. Fig. 5-2 is a view showing the "quality of the processed hole of the beam and the stone beam" in the laser processing apparatus of the embodiment j. Fig. 6 is a laser-assisted device of the present invention. The configuration of the second embodiment is a configuration diagram when the sub-electron scanner scanner of the laser processing apparatus of Fig. 6 is viewed from the y-axis direction. ', ^ Η图图雷的图雷The front focus of the lens of the illuminating device is placed, and the configuration diagram of the nearby electron microscope scanner is placed.

Fig. 8 is a block diagram showing the relationship between the respective electron microscope scans of the square line radiation processing apparatus in the relationship of the laser processing apparatus of the present invention. 320239 32 1343850 Fig. 11 is a view showing the position of a machined hole when a conventional multi-point illumination type laser processing apparatus is used. Fig. 12 is a view showing the position of the processing hole when the laser processing apparatus of the present invention is used. Figure 13 is a diagram showing the number of machining holes required for adjustment. Fig. 14 is a structural view showing a conventional multi-point irradiation type laser processing apparatus of a conventional example. [Description of main component symbols] • 1 211 XY table 12, 212 workpiece 20 laser oscillator 21, 222 1st polarizing means 22a to 22j, 24a, 24b, 27a, 27b, 221a to 221d, 225a, 225b 227a, 227b Lens 23a, 23b, 26, 26a, 26b, 224a, 224b, 226a, 226b Electron microscopy scanner 25, 223 Second polarizing means 28, 228 ίθ lens 29 Imaging device 30 Control unit 31 Tuning function 32 Model storage Function 33 Machining information storage function 34 Machining control functions ga, gb, gc, gd Lens angle L, La, L.y5. Laser light 33 320239

Claims (1)

1343850 • VII. Patent application scope: 1. The seeding processing device is configured to simultaneously irradiate laser light at two or more points on a workpiece placed on a workbench, and the laser processing device is provided with: The device splits a beam of laser light into different optical paths: first and second laser light; the first electron microscope scanner is disposed on the optical path of the first laser, and is described as the first The laser beam is scanned in the first direction on the processing table; the second electron microscope scanner is disposed on the optical path of the second laser beam, and the second laser beam is directed to the table Scanning in the second direction in which the upper direction is different; The second polarizing means mixes the second and second laser light; and the main electron microscope scanner is composed of - the third and fourth electron microscope scanners - the mixed first and second laser light are directed toward Scanning in the third and fourth directions in the different stages on the table; and the lens for concentrating the first and second laser light from the main electron microscope scanner on the added object Pre-determined location. The laser-assisted device of claim i, wherein the first and second electron microscope scanners are respectively disposed on a length of a front focus position of the pupil lens on each optical path that propagates the first laser light For equal positions. The first to fourth electron microscope scanners are arranged such that the directions of the rotation axes of the lenses of the second to fourth electron microscope scanners are the first, second, and fifth. Any direction in the direction becomes the same direction. 4. The laser processing apparatus according to the ninth aspect of the invention, wherein the direction of the first direction and the second direction is the fifth square direction, the second and the second The scanning electron microscope scanner is arranged such that the direction of the rotation axis of the lens of the second and fourth electron microscope scanners is the same direction as any of the second and fifth directions of the first and second directions; The device is disposed closer to the second polarizer than the fourth electron microscope scan, and is disposed such that the direction of the rotation axis of the lens of the third electron microscope scanner is relative to the first, second, and fifth directions. Tilt a predetermined angle in one direction. 5. The laser processing apparatus according to claim 1, wherein the number of the electron microscope scanners disposed in the first and second partial recording paths and the first and second laser light guides The number of mirror φ sheets leading to the predetermined direction is the same. 6. If you apply for a patent range! The laser processing apparatus of the present invention, wherein the control means is based on the mirror illuminance indicating the first to fourth electron microscope scanners and the aforementioned irradiation on the table when the mirror # is a slight angle The coordinate calculation model of the coordinates of the holes processed by the first and second laser beams is used to calculate the lens angles of the first to fourth electron microscope scanners corresponding to the target processing position on the workpiece to control the first pass to the first The lens angle of the 4th electron microscope scanner. 7. The laser-assisted device of claim 6, wherein the aforementioned 320239 [s] 35 lens angles of the first to fourth electron microscope scanners are up to 2 丨 and W laser light on the aforementioned workbench The inverse mapping model of the illuminated coordinates. 8. The laser processing apparatus according to claim 4, wherein the inverse mapping karyotype is a U polynomial model table*, wherein the polynomial model includes four components constituting the illumination coordinates as input, and the The lens angle of the fourth electron microscope scan 11 is the output of the 4 input 4 output polynomial 0. 9. The laser processing of the eighth aspect of the patent application scope, wherein the polynomial model system is provided with 4 of the aforementioned illumination coordinates. A polynomial representation of the component below 3 times. 10. The laser processing apparatus according to claim 6, wherein the control device further comprises a calculation function for measuring the aforementioned ninth angle when arbitrarily swinging the respective lens angles of the first to fourth electron microscope scanners. And the four components of the illumination coordinates of the second laser light on the stage to calculate a calculation model indicating the relationship between the lens angles of the first to fourth electron microscope scanners and the four components of the illumination coordinates. 320239 36