川4759 九、發明說明： 【發明所屬之技術領域】 尤其涉及一種製 本發明涉及一種製作電路板之方法 作具有斷差結構之電路板之方法。' 【先前技術】 =電子產品往體積小型化、功能多樣化方向之發 傳二板由於大幅度增加電路板之線路密度及訊號 =里攸而獲得廣泛之應用。並且，隨著電路板各區域不 ^度=同職性之要求，傳統之多層電路板已漸發展 為具有斷差結構之電路板。 立如圖23所示，為-種具有斷差結構之電路板之剖面示 思圖。電路板於不同之區域具有不同之層數，層數少之區 域厚度小、剛性小，層數多之區域具有高線路密度，同時 具有較大之厚度及較大之剛度。由此，該種具有斷差結構 之電路板具有優異之整體性能，既可實現大量資訊之傳 鲁輸’又具有適當之剛撓性。 圖17至圖22為先前技術中積層法製作此種電路板之 方法示意圖。參閱圖17，將第一覆銅層壓板（c〇pper Clad川4759 九的发明说明: [Technical Field of the Invention] In particular, the present invention relates to a method of fabricating a circuit board as a method of a circuit board having a stepped structure. '[Previous technology] = The development of electronic products in the direction of miniaturization and diversification of functions The second board has been widely used due to the greatly increased circuit board density and signal = Lie. Moreover, with the various areas of the circuit board being less than the same level, the conventional multilayer circuit board has gradually developed into a circuit board with a fault structure. As shown in Fig. 23, it is a cross-sectional view of a circuit board having a stepped structure. The circuit board has different layers in different regions, the area with a small number of layers is small, the rigidity is small, the area with a large number of layers has a high line density, and has a large thickness and a large rigidity. Thus, the circuit board having the stepped structure has excellent overall performance, and can realize a large amount of information transmission and appropriate rigidity. 17 to 22 are views showing a method of fabricating such a circuit board by a laminate method in the prior art. Referring to Figure 17, the first copper clad laminate (c〇pper Clad
Laminate，CCL) 100、第一黏合層200、第二覆銅層壓板3〇〇 進行疊層壓合。參閱圖18至圖19,壓合後，於第一覆銅層 壓板100及第二覆銅層壓板300上蝕刻線路。蝕刻線路時， 先於第一覆銅層壓板100及第二覆銅層壓板300上分別貼 一層乾膜101、301，但由於第一覆銅層壓板1〇〇與第二覆 銅層壓板300長度不一致，於第一覆銅層壓板1〇〇與第二 7 1334759 覆銅層壓板300之間存在一斷差結構’於斷差結構附近乾 .膜101彎曲而不能緊密貼合於第一覆銅層壓板1〇〇及第二 復銅層壓板300之表面，其間存在一孔隙1〇2。於蝕刻銅層 寸姓玄];谷液從。亥孔隙1〇2中侵入，使第一覆銅層壓板1〇〇 及第二覆銅層壓板300之絕緣層受到侵蝕而不能有效保護 銅層。 • 除線路製作外，電路板之製作還包括一導通孔之製作 鲁步驟。參閱圖20至圖22’先於電路板上鑽通孔，再於第一 覆銅層壓板100及第二覆銅層壓板3〇〇上貼附乾膜1〇2、3〇2 保濩線路圖案，再藉由曝光、顯影，進行通孔鍍銅。由於 乾膜102、302於斷差結構處存在一孔隙1〇3，從而於進行 L孔鍍銅之4候亦會於此處形成銅屑3 〇 1，既影響線路圖案 之導通路徑，又影響產品之外觀品質，嚴重降低產品之良 〇 有鑑於此，有必要提供一種於製作過程中避免對絕緣 _層與導電層產生損害之製作具有斷差結構之電路板之方 法。 【發明内容】 以下以貫施例5兑明於製作過程中避免對電路板内部導 電層與絕緣層產生損害之製作具有斷差結構之電路板之方 法0 一種製作具有斷差結構之電路板之方法，包括步驟： 提供第一基板、黏合層及第二基板，所述第一基板包括一 基材層及形成於所述基材層上之第一導電層’所述第二基 8 1334759 ^少包括一第二導電層；於所述黏合層上預定區域形成 述黏合層具有一第—開口側面；利用雷射切割第 二基材層之預定區域形成一第-切口，從而於所述 二：二形成一第一切口側面；使所述第一切口側面與所 =一：側面對應，並使第—基板之基材層與黏合層相 =觸:黏合層與第二基板相接觸，將所述第—基板、黏合 層其弟—基板依次疊層璧合得到預製電路板；钱刻所述第 -J板之第一導電層形成—第二切口，該第一導電層具有 :第一切口側面’並使所述第二切口側面、第—切口側面、 弟-開口側面相對應；沿裁切邊界裁切所述預製電路板， 所述裁切邊界對應於黏合層開口，使得所述第二切口、第 切口、開口與裁切邊界於所述預製電路板上定義出一去 除區，去除所述去除區從而形成—具有斷差結構之電路板。 相較於先前技術，本技術方案製作具有斷差結構之電 =/、有如下優點：於電路板上形成線路圖案或者 包路板上並無斷差結構存在，因此可避免銅 層剝離、斷線等不良之產生，提高 :輕中’電路板表面沒有預先形成之刀口，；避免：； 冷液“ 口中侵入’造成電路板不良。再次，雷射之運用 使得切口定位準確、邊緣光滑，生產之產品既具有高良率 又具有優異之外觀品質。 【實施方式] 具有二【之9方對::術方案第-實象 冉戈幂路板之方法作進一步詳細說明。 9 1334759 請參閱圖1，提供第一基板10、黏合層20及第.二基板 30 ° 所述第一基板10包括一基材層11及形成於所述基材 層11上之第一導電層12。所述基材層11具體結構依待製 作之具有斷差結構之電路板之具體結構而定，其可為單層 絕緣層或為導電層與絕緣層之疊加結構。本實施例中，所 • 述基材層11為一絕緣層。 所述第二基板30至少包括一層導電層，其具體結構亦 B可依待製作之具有斷差結構之電路板具體結構而定。本實 施例中，所述第二基板30為一覆銅層壓板（Copper Clad Laminate，CCL)，包括第二絕緣層31及第二導電層32。 所述基材層11、第一導電層12、黏合層20、第二絕緣 層31及第二導電層32之材料可依電路板之具體需求性能 而定。通常來說，第一導電層12及第二導電層32之最常 用材質為銅，但亦可為其他金屬，如銀、金等。黏合層20 | 一般為塗料或樹脂。當所製作之電路板為剛性電路板時， 其絕緣層之材質可為選自酚醛樹脂、環氧樹脂、聚酯樹脂 及樹脂與玻璃布之混合物中之一種。當所製作之電路板為 柔性電路板時，其絕緣層之材質可選自聚醯亞胺（Polyimide， PI)、鐵氟龍（Teflon)、聚硫胺（Poly amide)、聚曱基丙烯酸曱 酷（Polymethylmethacrylate)、聚石炭酸醋（Polycarbonate)、聚 乙稀對苯二酸醋（Polyethylene Terephtalate，PET)或聚酿亞 胺-聚乙烯-對苯二曱酯共聚物（Polyamide Polyethylene-Terephthalate copolymer)或者其組合物。 丄J/ 一併參閱圖2及圖3，t巾同，1 θ 為圖2中之黏含層20 之俯視圖，於所述黏合層2〇上箱〜 ρ« π 01 頂疋區域形成開口 2卜所述 開口 21可利用模具沖出，亦 ,η 、 』利用刮刀刮除或其他方式形 成。幵> 成所述開口 21之預定區只β L域與待製作之具有斷差結構 ^路板之斷差區域相關，g ^ 妙分祕 伋具體產品結構設計而定。當 “、、、依據具體產品之結構’開口 , 可為不同形狀’如圓形、 矩升> 或其他多邊形等。本實 m lL * κ她例中，所述開口 21為矩形。 因此，所述黏合層20具有第一 Μ π九， ^ 负弟開口側面211、第二開口側 、第三開口側面213及第四開口側面214。盆中，第 213與弟四開口側面214相對。 請參關4,㈣雷射切割第—基板iq中基材層以之 其2域形成一第一切口 110。形成第-切口 110後，所述 U具有—第—切口側面111。雷射種類可根據所述 土 a 11之性質進行相應選擇。一般來說，摻鈥釔鋁石榴 YAf田射裔發射之雷射波長較短，屬紫外波段，脈 車乂问，既可應用於導電層之切割，亦可用於絕緣層 之=卜C〇2雷射II發射之雷射波長較長，屬中紅外波段， 通常僅應用於絕緣層之切割。當然，亦可選擇混合雷射系 =Nd.YAG雷射切割導電層，以co2雷射切割絕 = 本κ化例中，基材層11為絕緣層，故以C02雷射進 行切割即可。 優、地，可於第一基板10上形成一工具孔（圖未示）， 用於進行雷射切割時之定位。 11 請參閱圖5,使所述第一切口側面ill與所述第-開口 側面如制，並使第-基板10之基材層^與黏合層20 才接觸黏σ層20與第二基板3〇之第二絕緣層31相接觸， 將所述第—基板1G、黏合層2G、第二基板3q順次壓合， 麼合後得到預製電路板4〇 〇 一第十刀口側Φ 111與第一開口側® 211之間可具有一 定誤差距離，該誤差距離應為2毫米以 /，、Laminate, CCL) 100, the first adhesive layer 200, and the second copper clad laminate 3 are laminated and laminated. Referring to Figures 18 through 19, after pressing, the wiring is etched on the first copper clad laminate 100 and the second clad laminate 300. When the circuit is etched, a dry film 101, 301 is applied to the first copper clad laminate 100 and the second copper clad laminate 300, respectively, but the first copper clad laminate 1 and the second copper clad laminate 300 The lengths are inconsistent, and there is a gap structure between the first copper clad laminate 1〇〇 and the second 7 1334759 copper clad laminate 300. The film 101 is bent near the gap structure and cannot be closely adhered to the first cover. The surface of the copper laminate 1 and the second copper laminate 300 has a void 1 〇 2 therebetween. In the etching of the copper layer, the name is Xuan]; The intrusion in the hole 1 〇 2 causes the insulating layers of the first copper clad laminate 1 〇〇 and the second copper clad laminate 300 to be eroded to effectively protect the copper layer. • In addition to circuit fabrication, the fabrication of the board also includes the fabrication of a via. Referring to FIG. 20 to FIG. 22', a through hole is drilled on the circuit board, and a dry film 1〇2, 3〇2 protection line is attached to the first copper clad laminate 100 and the second copper clad laminate 3〇〇. The pattern is then subjected to through-hole copper plating by exposure and development. Since the dry film 102, 302 has a porosity of 1 〇 3 at the stepped structure, the copper swarf 3 〇 1 is formed here during the L-hole copper plating, which affects both the conduction path of the line pattern and the influence of the line pattern. The appearance quality of the product seriously degrades the product. In view of this, it is necessary to provide a method for fabricating a circuit board having a stepped structure during the manufacturing process to avoid damage to the insulating layer and the conductive layer. SUMMARY OF THE INVENTION The following is a method for fabricating a circuit board having a fault structure by avoiding damage to the conductive layer and the insulating layer inside the board during the manufacturing process. The method includes the steps of: providing a first substrate, an adhesive layer, and a second substrate, wherein the first substrate comprises a substrate layer and a first conductive layer formed on the substrate layer, the second base 8 1334759 ^ Included in the predetermined area on the adhesive layer, the adhesive layer has a first opening side; the predetermined area of the second substrate layer is cut by laser to form a first-cut, thereby forming the second Forming a first slit side surface; making the first slit side surface correspond to the = one side surface, and contacting the base layer of the first substrate with the adhesive layer = contact: the adhesive layer is in contact with the second substrate And the first substrate, the adhesive layer and the substrate are laminated and laminated to obtain a prefabricated circuit board; the first conductive layer of the first-J plate is formed into a second slit, the first conductive layer has: First slit side 'and said a second slit side, a first slit side, and a younger-opening side surface; the prefabricated circuit board is cut along a cutting boundary, the cutting boundary corresponding to the adhesive layer opening, so that the second slit, the first slit, the opening A removal region is defined on the prefabricated circuit board with the trimming boundary, and the removal region is removed to form a circuit board having a stepped structure. Compared with the prior art, the technical solution of the present invention has the advantage of having a fault structure: the circuit pattern is formed on the circuit board or the circuit board has no fault structure, so that the copper layer can be prevented from being peeled off and broken. The occurrence of defects such as lines, improvement: light medium 'the surface of the circuit board does not have a pre-formed knife edge; avoid:; cold liquid "intrusion in the mouth" caused the circuit board is bad. Again, the use of laser makes the incision accurate positioning, smooth edges, production The product has both high yield and excellent appearance quality. [Embodiment] There are two methods for the 9-party pair: the surgical scheme-the real image, the Ge power circuit board is further described. 9 1334759 See Figure 1 The first substrate 10, the adhesive layer 20, and the second substrate 30 are provided. The first substrate 10 includes a substrate layer 11 and a first conductive layer 12 formed on the substrate layer 11. The specific structure of the layer 11 depends on the specific structure of the circuit board having the fault structure to be fabricated, and may be a single insulating layer or a superposed structure of the conductive layer and the insulating layer. In this embodiment, the substrate layer is 11 for one The second substrate 30 includes at least one conductive layer, and the specific structure B can be determined according to the specific structure of the circuit board to be fabricated with the fault structure. In this embodiment, the second substrate 30 is a Copper Clad Laminate (CCL), comprising a second insulating layer 31 and a second conductive layer 32. The substrate layer 11, the first conductive layer 12, the adhesive layer 20, the second insulating layer 31 and the second The material of the conductive layer 32 may depend on the specific performance of the circuit board. Generally, the most common material of the first conductive layer 12 and the second conductive layer 32 is copper, but other metals such as silver, gold, etc. The adhesive layer 20 is generally a coating or a resin. When the circuit board is made of a rigid circuit board, the insulating layer may be made of a material selected from the group consisting of phenolic resin, epoxy resin, polyester resin, and a mixture of resin and glass cloth. When the circuit board is made of a flexible circuit board, the material of the insulating layer may be selected from the group consisting of polyimide (PI), Teflon, poly amide, polyfluorene. Polymethylmethacrylate, poly stone Polycarbonate, Polyethylene Terephtalate (PET) or Polyamide Polyethylene-Terephthalate copolymer or a combination thereof. / Referring to FIG. 2 and FIG. 3 together, t towel is the same, 1 θ is the top view of the adhesive layer 20 in FIG. 2, and the opening layer 2 is formed in the top layer of the adhesive layer 2 〇 upper box ρ ρ « π 01 The opening 21 can be punched out by a mold, and η, 』 can be formed by scraping or otherwise.幵> The predetermined area of the opening 21 only has a β L domain associated with the gap region of the road plate to be fabricated, which is determined by the specific product structure design. When ",, according to the structure of a specific product' opening, it may be a different shape 'such as a circle, a moment rise> or other polygons, etc. In the present example, the opening 21 is rectangular. Therefore, The adhesive layer 20 has a first ππ9, a negative opening side surface 211, a second opening side, a third opening side 213, and a fourth opening side 214. In the basin, the 213 is opposite to the fourth opening side 214. In the fourth step, (4) laser cutting, the substrate layer in the substrate iq forms a first slit 110 in the second region. After forming the first slit 110, the U has a first-cut side 111. According to the nature of the soil a 11 can be selected accordingly. Generally speaking, the yttrium aluminum pomegranate YAf field emission of the laser has a shorter wavelength, which belongs to the ultraviolet band, and is applied to the conductive layer. Cutting, can also be used for the insulation layer = Bu C〇2 Laser II emission of the longer wavelength of the laser, is a mid-infrared band, usually only used for the cutting of the insulation layer. Of course, you can also choose a hybrid laser system = Nd. YAG laser cuts the conductive layer and cuts it with co2 laser. In this case, the substrate layer 11 It is an insulating layer, so it can be cut by C02 laser. Preferably, a tool hole (not shown) can be formed on the first substrate 10 for positioning during laser cutting. 11 See FIG. The first slit side ill and the first opening side are made, and the base layer and the adhesive layer 20 of the first substrate 10 are in contact with the second smear layer 20 and the second substrate 3 The insulating layer 31 is in contact with each other, and the first substrate 1G, the adhesive layer 2G, and the second substrate 3q are sequentially pressed together, and the pre-made circuit board 4, a 10th edge side Φ 111 and the first opening side 211 are obtained. There may be a certain error distance between the two, and the error distance should be 2 mm / /,
切口側面山與第一開口側面211相齊平。A也弟 優1""地，可於第一基板10、黏合層20及第二基板3〇 上形成有至少一個對應之定位孔，如此，於黏合層2〇上挖 1 21於第基板10上形成第一切口 110及將第一基 黏5層20及第二基板30進行疊層壓合時均可定位 孔為參照，進行定位對準。The side of the incision is flush with the first open side 211. A also has a corresponding positioning hole formed on the first substrate 10, the adhesive layer 20 and the second substrate 3, so that the first substrate is etched on the adhesive layer 2 When the first slit 110 is formed on the first base 10 and the first base adhesive 5 layer 20 and the second substrate 30 are laminated and pressed, the positioning holes can be used as a reference for positioning and alignment.
,、凊參閱圖6 ’蝕刻所述第一基板10之第一導電層12 形成一第切ϋ 120。形成第二切σ 120後’該第一導電層 具有一第二切口側面121，並使所述第二切口側面12工、 第切口側® 111及第一開口側面211相對應。 所述第一切口側面U1、第一開口側面211盥第二 侧面m之間可具有2毫米以内之誤差距離。優選地，所 述第一切口側面121、第-切口側面111及第-開口側面 211相齊平。 J ® 所述第二切口 120藉由蝕刻工藝形成，包括塗覆光阻、 曝，、顯影、钱刻等步驟。優選地’所述第二切口 120可 ”第導電層12、第二導電層32之線路圖案同時形成。當 12 導電層12、第二導電層32之線路議 圖案、第二導二：;2弟一:刀口120、第-導電層12之線路 通孔、將、圖案之前或之後，可包括-鑽 逋孔將通孔孔壁電 -導電.又之乂驟，以導通第一導電層12與第 =;二，：第—導電層12與第二導電…間可實 二導；二*通孔孔壁電鍍製裎係第〆導電層12、第 前岸^、^線路圖案形成之後進行，則進行孔壁電鍍之 刖應於第一導電層?芬笙_ 護線路圖案。 第層32表面貼覆乾膜以保 一併參閱圖7及圖^㈣為…沿㈣方向之叫面 不沿裁切邊界術裁切所述預製電路板40，所i裁 1?η宝一/ 口層2〇之開021相對應，使得第二切口 〇、弟-刀口 no、開口 21與裁切邊界4〇 40上定義出一去除區41〇。 、衣电路板 所述裁切邊界401依具體產品結構設計而定，苴可兔 不同形狀’如圓形、矩形或其他多邊形等。本實施例中為 所述裁切邊界為矩形，因此，其包括相對之第— 術與第二邊界4〇3、相對之第三邊界姻與第四邊界^ 具體之，所述第-邊界4G2依待形成之具有斷差 路板結構而定，所述第二邊界術應與第二開口； 相齊平或位於第一開口側面211與第二開口側面h 間，所述第三邊界404應與第三開口側面213相 之 於第三開口側面213與第四開口側面214之 二或位 所述弟四 13 邊界405，與第四開口側面2i3相齊平或位於第三開口側 。第四開口側面214之間。從而，所述裁切邊界4〇1 〜、第一切口 120、第一切口 110、開口 21形成一與開口 21對應之去除區410。 由於開口 21處之黏結材料已事先去除，故所述去除區 I10,未黏附於第二基板3〇,可從所述預製電路板40上脫 洛攸而，形成一如圖9所示之具有斷差結構之電路板42〇。 本具施例中第一基板10僅包括一層導電層，第二基板 3〇亦僅包括一層導電層，因此，形成部分區域為單層，另 邛刀區域為兩層之電路板42〇。當然，僅需改變第一基板 忉 ' 第二基板30之導電層層數，即可形成具有其他斷差結 構之電路板’滿足各種設計需求。 圖10至圖16為第二實施例之製作具有斷差結構之電 路板之方法示意圖。 参閱圖10 ’提供第一基板50、黏合層60及第二基板 70。所述第一基板50包括一基材層51及形成於所述基材 層51上之第一導電層52。本實施例中，所述基材層51包 括第一絕緣層511與弟一導電層512。所述第二基板7〇包 括依次疊加之第三絕緣層71、第三導電層72、第二黏合層 75、第四絕緣層73及第四導電層74。所述第二導電層512、 第三導電層72已預先形成線路圖案。 參閱圖11’於所述黏合層60上預定區域形成開口 61， 從而，於所述黏合層60上形成一第一開口側面611。 參閱圖12 ’本貝加例中’採用混合雷射系統切割基材 14 1334759 層51之第二絕緣層511 '第二導電層512之預定區域以形 成第一切口 510。具體之，先採用摻鈥釔鋁石榴石Ν^γΑ〇 雷射切割基材層51之第二導電層512，再以c〇2雷射切割 第二絕緣層511。雷射切割形成第一切口 51〇後’所述基材 層51具有一第一切口側面511。 當然，雷射切割時可利用工具孔進行定位。 麥閱圖13，使所述第一切口側面511與所述第一開口 側面611對應，並使基材層51之第二導電層512與黏合層 60相接觸、黏合層60與第二基板7〇之第三絕緣層71相接 觸，=述第-基板50、黏合層6〇、第二基板％順次壓 合’壓s後得到預製電路板80。The first conductive layer 12 of the first substrate 10 is etched to form a reticle 120. After the second slit σ 120 is formed, the first conductive layer has a second slit side surface 121, and the second slit side surface 12, the first slit side 111, and the first opening side surface 211 are corresponding. The first slit side surface U1, the first opening side surface 211, and the second side surface m may have an error distance within 2 mm. Preferably, the first slit side surface 121, the first slit side 111, and the first opening side surface 211 are flush. The second slit 120 of the J ® is formed by an etching process, including steps of coating photoresist, exposure, development, engraving, and the like. Preferably, the second slit 120 can be formed simultaneously with the line pattern of the second conductive layer 12 and the second conductive layer 32. When the conductive layer 12 and the second conductive layer 32 are in a line pattern, the second guide 2: 2 Brother 1: The knife hole 120, the line through hole of the first conductive layer 12, before or after the pattern, may include a drill hole to electrically-conduct the through hole wall to further conduct the first conductive layer 12 And the second; the second conductive layer 12 and the second conductive layer 12, the first front hole ^, ^ line pattern is formed after the formation of the second conductive layer 12 Then, the hole wall plating should be performed on the first conductive layer, the 笙 笙 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The prefabricated circuit board 40 is cut along the cutting boundary, and the opening 021 of the ? 一 一 / / / / / / / / / / / / / / / / / / / / / / / / / / A removal area 41〇 is defined on the 4〇40. The cutting boundary 401 of the clothing board is determined according to the specific product structure design, and the rabbit may have different shapes. Shape, rectangle or other polygon, etc. In this embodiment, the cutting boundary is a rectangle, and therefore, the relative edge and the second boundary 4〇3, the third boundary and the fourth boundary are respectively The first boundary 4G2 depends on the structure of the step board to be formed, and the second boundary should be flush with the second opening or between the first opening side 211 and the second opening side h The third boundary 404 should be flush with the third opening side 213 to the second opening side 213 and the fourth opening side 214, or the fourth opening 13 405, and be flush with the fourth opening side 2i3 or Located on the third opening side, between the fourth opening sides 214. Thus, the cutting boundary 4〇1~, the first slit 120, the first slit 110, and the opening 21 form a removal area 410 corresponding to the opening 21. Since the bonding material at the opening 21 has been removed in advance, the removal region I10, which is not adhered to the second substrate 3, can be detached from the prefabricated circuit board 40 to form a cutout as shown in FIG. The circuit board 42 has a stepped structure. The first substrate 10 in the embodiment only includes A conductive layer, the second substrate 3 〇 also includes only one conductive layer, so that the partial region is formed as a single layer, and the boring region is a two-layer circuit board 42 〇. Of course, only the first substrate 忉 ' The number of conductive layers of the substrate 30 can form a circuit board having other fault structures to meet various design requirements. Fig. 10 to Fig. 16 are schematic views showing a method of fabricating a circuit board having a stepped structure according to the second embodiment. 10' provides a first substrate 50, an adhesive layer 60, and a second substrate 70. The first substrate 50 includes a substrate layer 51 and a first conductive layer 52 formed on the substrate layer 51. This embodiment The substrate layer 51 includes a first insulating layer 511 and a first conductive layer 512. The second substrate 7 includes a third insulating layer 71, a third conductive layer 72, a second adhesive layer 75, a fourth insulating layer 73, and a fourth conductive layer 74 which are sequentially stacked. The second conductive layer 512 and the third conductive layer 72 have previously formed a line pattern. Referring to FIG. 11', an opening 61 is formed in a predetermined area on the adhesive layer 60, so that a first opening side surface 611 is formed on the adhesive layer 60. Referring to Fig. 12'''''''''''''' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Specifically, the second conductive layer 512 of the substrate layer 51 is laser-cut with ytterbium-doped aluminum garnet yttrium, and the second insulating layer 511 is laser-cut by c〇2. The laser cutting forms a first slit 51. The substrate layer 51 has a first slit side 511. Of course, the tool hole can be used for laser cutting. Referring to FIG. 13, the first slit side surface 511 is corresponding to the first opening side surface 611, and the second conductive layer 512 of the base material layer 51 is in contact with the adhesive layer 60, and the adhesive layer 60 and the second substrate are bonded. The third insulating layer 71 of the seventh layer is in contact with each other, and the first substrate 50, the adhesive layer 6A, and the second substrate are sequentially pressed together to form a pre-made circuit board 80.
參閱圖 14，於第 一 Mr ^ & CO W導-層52預定區域形成-第二切口 二：而於第一導電層52上形成一第二切口側面521，並 面611與第二切口側面 並於第二。另外，於預製電路板80上製作-導通孔， :體Γ層52、第四導電層74上形成線路圖案， /、體之，可首先於預製電路板8 =其次將所鑽通孔進行孔壁電鍍製程，再次ΓΓί 電層52、第四導電芦 丹人於弟—導 第二切σ 52〇。9 、设乾膜，同時形成線路圖案及 所述沿裁切邊界⑽1裁切所述預製電路板⑼。 =第=口 =與Γσ61相對應，使得所述第二切口 f電路二 1與所述裁切邊界謝於所述預 一板上8。定義出一與開口61對應之去 = 15 1334759 事先已開口 61處絲結材料，故所述去㈣ 於第二基板7〇,可從所述預製電路板80上脫落 一如圖16所示之具有斷差結構之電路板82〇。 ’ :實施例形成部分區域為兩層，另一部分區域為四層 之電路板820。當然，僅需改變第— 曰 ^ ^ Φ s a ^ B 暴扳50、弟二基板70 ¥電層層數，即可形成具有其他斷差結構之電路板。 本技術方案之製作具有斷差結構之電路板方法 =首先，於電路板上形成線路圖案或者通孔導通時: 因此可避免鋼層剝離、斷線“ 表面沒有預先形成之刀口，可中’電路板 』避免生產溶液從刀口中俨 確^成電路板*良。再次，雷射之和使W定位準 觀品質。 ^既具有南良率又具有優異之外 提出發明確已符合發明專利之要件’遂依法 ,明准，以上所述者僅為本發明之較佳實施方 =自不能以此限制本案之申請專利範圍。舉凡孰朵本荦 應=人士援依本發明之精神所作之等效修倚或變化，皆 …啦盍於以下申請專利範圍内。 【圖式簡單說明】 姓構9係本技術方案第一實施例之製作具有斷差 、·-。構之電路板之方法示意圖。 圖10至圖16係本技術方安楚―容#, 差結構之電路板之方法示意圖。案弟一只知例之製作具有斷 16 1334759 圖17至圖22係先前技術製作具有斷差結構之:電路板 之方法示意圖。 圖23係具有斷差結構之電路板之示意圖。Referring to FIG. 14, a second slit 2 is formed in a predetermined region of the first Mr ^ & CO W conductive layer 52. A second slit side surface 521 is formed on the first conductive layer 52, and the surface 611 and the second slit side are formed. And in the second. In addition, a via hole is formed on the prefabricated circuit board 80, and a wiring pattern is formed on the body layer 52 and the fourth conductive layer 74, and the body can be firstly drilled in the prefabricated circuit board 8 = secondly. The wall plating process, again, the electric layer 52, the fourth conductive Ludan people in the younger brother - the second cut σ 52 〇. 9. A dry film is formed while forming a line pattern and the prefabricated circuit board (9) is cut along the cutting boundary (10). = the third port = corresponding to Γ σ 61 such that the second slit f circuit 2 and the cutting boundary are thanked to the pre-board 8. Defining a corresponding to the opening 61 = 15 1334759 The wire material has been opened 61 in advance, so that the fourth substrate 7A can be detached from the prefabricated circuit board 80 as shown in FIG. A circuit board 82 having a stepped structure. The embodiment forms a partial region of two layers, and the other portion is a four-layer circuit board 820. Of course, it is only necessary to change the number of layers of the first 曰 ^ ^ Φ s a ^ B, and the number of layers of the second substrate 70 to form a circuit board having other fault structures. The circuit board method with the difference structure is made by the technical solution. Firstly, when the circuit pattern is formed on the circuit board or the through hole is turned on: Therefore, the steel layer can be prevented from being peeled off and broken. "The surface has no pre-formed edge, and the circuit can be The board avoids the production solution from the edge of the knife to the circuit board * good. Again, the sum of the lasers allows the W to be positioned to the quality. ^There is both a good yield and an excellent invention. '遂 According to the law, Mingzhun, the above is only the preferred implementer of the present invention=There is no way to limit the scope of the patent application in this case. The equivalent of the person who is in the spirit of the invention It is within the scope of the following patent application. [Simplified Schematic Description] The following is a schematic diagram of a method for fabricating a circuit board having a gap, a structure of the first embodiment of the present technical solution. 10 to FIG. 16 are schematic diagrams of a method for a circuit board of a differential structure of the present technology. The production of a known example of the case has a break 16 1334759. FIGS. 17 to 22 are manufactured by a prior art with a fault structure: The method of plates of FIG. FIG. 23 schematic view showing a circuit board having a structural difference of breaking.
【主要元件符號說明】 10 ' 50 第一基板 11、51 基材層 110、510 第一切口 111 、 511 第一切口側面 120、520 第二切口 121 、 521 第二切口側面 12、52 第一導電層 20、60 黏合層 21 ' 61 開口 211、 611 第一開口側面 212 第二開口側面 213 第三開口側面 214 第四開口側面 30 > 70 第二基板 31 、 511 第二絕緣層 32、512 第二導電層 40、80 預製電路板 401、801裁切邊界 402 第一遺界 403 第二邊界 404 第三邊界 405 第四邊界 410、810去除區 420、820具有斷差結構之電路板 71 第三絕緣層 72 第三導電層 75 第二黏合層 73 第四絕緣層 74 第四導電層 17[Description of main component symbols] 10 ' 50 First substrate 11, 51 Base material layers 110, 510 First slits 111, 511 First slit side faces 120, 520 Second slits 121, 521 Second slit side faces 12, 52 a conductive layer 20, 60 adhesive layer 21' 61 opening 211, 611 first opening side 212 second opening side 213 third opening side 214 fourth opening side 30 > 70 second substrate 31, 511 second insulating layer 32, 512 second conductive layer 40, 80 prefabricated circuit board 401, 801 cutting boundary 402 first boundary 403 second boundary 404 third boundary 405 fourth boundary 410, 810 removal area 420, 820 circuit board 71 with a fault structure Third insulating layer 72 third conductive layer 75 second adhesive layer 73 fourth insulating layer 74 fourth conductive layer 17