TWI332695B - - Google Patents

Description

1332695 IX. Description of the Invention: [Technical Field] The present invention relates to a flexible bump for mounting on a substrate such as a die and a glass substrate, and a manufacturing method thereof, and particularly to a method An elastic bump having a low-order rough surface is formed above the solder pad and a manufacturing method thereof. [Prior Art] The metal cube formed on the soldering pad of the integrated circuit chip is convenient for subsequent Tape Carrier Package (Tcp), wafer and glass substrate packaging (Chip on Glass, c〇 G), wafer and film substrate (Chip on Film, C0F) and other packaging methods, the wafer line force, b, '' inside the pad, bump, package substrate wire to a flat display, etc. Matching equipment. As far as the types of bumps are concerned, in addition to the gold bumps which are typically formed by gold (Au), there are also kinds of gold alloys such as No. 5491 and No. 5 of the Chinese patents, and 9 (Elastic bumps disclosed in H3i469) Referring to FIG. 1, the general elastic bumps 9 are formed by a polymer film as a core 91' peripherally coated with a metal film 92 electrically connected to the material 90. The conductive cube; because the core 91 of the elastic bump 9 can select a polymer material with better working properties and mechanical properties, it has better mechanical properties and reliability than the conventional gold bumps in the process of manufacture and use. Therefore, it has gradually been widely accepted by the flat _ I> ^ 』 十 显 面板 面板 面板 面板 面板 面板 面板 面板 面板 面板 面板 面板 面板 面板 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。

Integrated circuit, IC) electrical function test, the test is carried out by a probe (needle card needle) 8 touch pressure (t〇uch d〇wn) the top surface 921 of the elastic bump 9 for electrical measurement; The core 91 generally has good workability and fluidity during the manufacturing process, so that it has an extremely smooth top after forming, and the metal film 92 is mostly formed by sputtering, so the top surface 921 is The roughness (r〇ughness) is extremely low and does not provide sufficient friction; therefore, when the probe 8 is ensured to be in good contact with the elastic bump 9, excessively pressing (〇ver drive), the probe 8 is caused. The needle tip 81 slides relative to the top surface 921, and a so-called slip phenomenon occurs. The above-mentioned slip needle phenomenon enables repeated measurement of multiple unnecessary pressures between the same probe 8 and the same elastic bump 9 to perform electrical measurement, thereby increasing the time course of the 5 type operation; Whether the needle tip 81 correctly touches the top end 921 of the elastic bump 9, thereby making the test process and the result full of more uncertainty; moreover, since the needle tip 81 is sliding against the top surface 921, it will rise. A part of the metal film 92 is adhered to the needle 81, so that the probe 8 must perform needle cleaning every 5 to 1 times of contact pressure, which not only causes delay in the test time. 'More will result in wrong test results. In order to solve the problem of the slip needle mentioned in the prior art, the invention of the Republic of China Invention Patent No. 帛1248145 and the Republic of China Invention Patent No. 1248133 have been previously proposed, and the contents of the specification are all included in the reference range of the present case. Due to the diversification of today's electronic products, in addition to the tendency of the elastic bumps 9 to have a small size of 6 1332695, in many elastic convex & amp 9 manufacturing processes, the 're-matching line is also used to elastically adjust the elastic convex & 9 s position. However, such a small number of different bump reconfiguration layouts will force the test machine to perform multiple probe test positions and program settings. Such multiple complicated settings will also cause additional burdens on the bumps (4). In addition, the development of the elastic bumps 9 has also become a trend of miniaturization. Therefore, how to avoid the damage of the completed elastic bumps 9, reduce the complicated setting of the test machine, and avoid the above-mentioned slip needles (4) improve the test efficiency and become the industry. Anxious to solve the problem.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide an elastic bump having a low-order coarse wheel surface and a method of fabricating the same. Another object of the present invention is to provide an elastic bump having a rough seam of A and a method of fabricating the same. It is still another object of the present invention to provide an elastic bump which can prevent the occurrence of a slip phenomenon and a method of fabricating the same.

It is still another object of the present invention to provide an elastic bump which can be tested at the position of the pad and a method of fabricating the same. The elastic bump having the low-order rough surface is disposed on a substrate having a pad and a protective layer; the elastic bump has an elastic seat on the substrate, and a cover is disposed on the elastic body The top surface and adjacent to the surface metal film of the surface of the pad, the surface metal film has a contact surface adjacent to the surface of the pad and a low-order surface opposite to the contact surface. The main feature of the elastic bump of the present invention is that the surface metal film is formed with a plurality of grooves extending from the lower-order surface toward the contact surface. 7 1332695 One of the features of the elastic bump of the present invention is that each of the grooves may be a perforation extending to the contact surface and extending through the surface metal film, or a blind extending from the lower-order surface toward the contact surface. A hole, or a channel extending in a horizontal direction parallel to the surface of the soldering surface. One of the features of the resilient bump of the present invention is that the resilient seat is located on the pad and does not completely shield the pad. Of course, this includes forming the elastic seat body on the soldering pad, and the elastic seat body is adjacent to the bottom surface of the soldering pad to be smaller than the surface area of the soldering pad; and only the part of the elastic seat body is formed In this knowledge, the elastic seat body is formed on a region other than the soldering iron. One of the other features of the resilient bump of the present invention is that the resilient seat is located on the protective layer such that the pad will not be shielded. One of the characteristics of the elastic bump of the present invention is that the material of the elastic seat can be a photosensitive or non-photosensitive material, such as polyimide, benez〇cyd〇butene, poly Polyacrylates, rubber, and siiicone. One of the features of the elastic bump of the present invention is that the material of the surface metal film may be gold, silver, chromium, titanium, tungsten, bismuth or copper in a non-limiting manner, in a combination thereof. One of the features of the elastic bump of the present invention is that the surface metal film can be laminated in one or more layers. In a structure of more than two layers, the surface metal film may have an inner film layer adjacent to the pad and an outer film layer adjacent to the inner film layer. The material of the inner film layer may be, without limitation, a combination of road, titanium, crane, aluminum, copper, and the like. The material of the outer film layer may be, without limitation, 8 1332695 being a combination of gold, steel, silver, and the like. The method for manufacturing the elastic bump having the low-order rough surface includes the following steps: a) forming the elastic seat on the substrate having the pad; b) on the elastic body and the top Forming the surface metal layer; and c) removing a portion of the surface metal layer adjacent to the pad to form the plurality of grooves. The method of the present invention is characterized in that the step a) is to form the elastic body on the pad and not completely shield the pad. The method includes: forming the elastic seat body on the soldering pad' and the elastic seat body is adjacent to a bottom surface of the soldering iron to be smaller than a surface area of the soldering iron; and forming only a portion of the elastic seat body on the soldering pad Or the elastic seat is formed on a region other than the weld. The method of (4) may be completed by a lithography technique or a printing technology process; specifically, the step includes the following steps: a-Ι) preparing a photomask having the two-dimensional projection pattern of the elastic seat; A-2) coating a photosensitive material layer on the substrate; a-3) transferring the two-dimensional projection pattern of the elastic seat on the photomask to the photosensitive material layer by exposure; and a-4) The developing method forms the above elastic seat. The method of fabrication of the present invention is characterized in that the step b) is carried out by a process of physical vapor deposition techniques; it includes, without limitation, 贱 mirror technology, or by evaporation techniques. When the surface metal layer is a structure of two or more layers, the step b) of the step 1) may include the following steps:

B-Ι) forming an inner film layer on the elastic body and the soldering iron; and b-2) forming an outer film layer on the inner film layer. H. One of the features of the manufacturing method of the present invention is that if only a specific method of removing a portion of the surface metal layer adjacent to the solder bump portion is formed, the step may include the following steps: -1) defining, by lithography, the grooves in the surface metal layer, and

C - 2) The metal layer of the surface located in the range of the grooves is removed by the technique of (4). The manufacturing method of the present invention is characterized in that the step 〇 further removes a portion of the surface metal layer to extend the surface metal film extending from the elastic body to the pad. In the specific method of removing a portion of the surface metal layer to simultaneously define the surface metal film extending from the elastic body to the pad, and the plurality of grooves, the step c) may include the following steps:

C-1) defining, by the lithography technique, the range of the elastic seat, the range of the pad, the range between the elastic body and the pad, and the range of the grooves; and -2) removing, by etching technique, the surface metal layer not located in the range of the solder pad, not in the range of the solder pad, not located between the elastic body and the solder pad, and at the groove A portion of the surface of the surface metal layer. One of the features of the manufacturing method of the present invention is that the surface metal m defined by extending from the elastic body to the soldering iron is not simultaneously completed in the same process 10 1332695, and the plurality of grooves are limited; the surface metal is defined The contour range of the film and the plurality of grooves defined on the surface metal film may also be performed in different process steps, such as performing the following steps between the step b) and the step c): d) removing part of the surface metal The layer defines a surface metal film extending from the elastic body to the bonding pad. Specifically, the step d) comprises the following steps: d-Ι) defining, by the lithography technique, the range of the elastic seat, the range of the bonding pad, and the elastic seat to the bonding pad The range; and d-2) removing, by the etching technique, the surface metal layer not located in the range of the elastic body, not in the range of the pad, and not in the portion between the elastic body and the pad. The effect of the invention is that an artificial rough surface can be formed on the surface of the elastic bump on the section adjacent to the solder pad, thereby avoiding the occurrence of the slip phenomenon and testing at the position of the solder pad. The above and other technical contents, features and effects of the present invention will become apparent from the following detailed description of the preferred embodiments of the preferred embodiments. Before the detailed description is made, it is noted that in the following description, similar elements are denoted by the same reference numerals. As shown in FIG. 2 and FIG. 3, the first preferred embodiment of the present invention has a low-order rough surface elastic bump 2 and a method for fabricating the same, which is a wafer (wafer 11 is a substrate 1 and a plurality of the present invention will be used. An elastic bump 1 having a surface pattern recess is formed on the substrate i. The substrate i has a circuit layer u, a plurality of pads 12 formed on the X circuit layer 11, and a protection formed on the remaining portion of the circuit layer Layer 13. The circuit layer U includes a plurality of metal interconnects (not shown) and a dielectric material (not shown) surrounding the interconnects. Since the specific configuration of the circuit layer 11 is not the main feature of the present invention, As shown in FIG. 3, the elastic bump 2 has a spring I and a living body 21 disposed on the substrate i, and a surface layer covering the elastic body 21 and the bonding pad 12. The metal film 22. In the embodiment, the elastic body 21 is offset from the solder pad 12 and partially on the protective layer with respect to the solder pad 12, and the pad is not completely shielded. 12, and has a top surface 211 away from the substrate, in the embodiment, the elastic body 21 is photosensitive Made of ph〇t〇-sensitive polyimide material, but not limited thereto; except for the photo-sensitive material which is suitable for making the core of the elastic bump 2 Other non-photosensitive polyimide, benezocycline butene, polyacrylates, rubber, and silicone (siHc〇ne) are also suitable for use in In the present invention, the surface metal film 22 covers the top surface 211 of the elastic seat body 21 and covers the elastic seat body 21, and also extends to the soldering iron 12, covering and adjacent to the elastic seat body. The surface of the pad 12 is electrically connected to the pad 12. The surface metal film 22 has a contact surface 221 adjacent to the surface 121 of the pad 12 and a low-order surface 222 opposite to the contact surface 221. 1332695, and a plurality of grooves 220 extending from the lower-order surface 222 toward the contact surface 221; in the embodiment, each of the grooves 22 extends from the lower-order surface 222 to the contact surface 221, and is a Through the perforation of the surface metal film 22, the surface metal film 22 is An inner layer 223 is formed of an outer film layer 224 adjacent to and directly covering the elastic seat body 21 and the area of the mattress 12 which is not covered by the elastic body 21; the outer film The layer 224 is plated adjacent to the inner film layer 223. The inner film layer 223 is also generally referred to as an adhesion and diffusion barrier layer. In the embodiment, the inner film layer 223 is made of titanium-tungsten mixed metal. (TiW), but not limited thereto, and the inner film layer 223 has a thickness of 1500 Å; the outer film layer 224 is made of gold and has a thickness of 3000 Å. Of course, the material and thickness of the inner film layer 223 and the outer film layer 224 are not limited to the above examples. In addition, the inner film layer 223 may also be made of a material of chromium (CO, titanium (Ti), tungsten (w), ing (1), copper (Cu), or the like, which is preferred. In practice, the thickness is generally in the range of about 500 to 5000 A. The outer film layer 224 may be made of a material of gold (Au), copper (Cu), silver*)', and the like. Further, the surface metal film 22 is not limited to the above two metal layers, and may be composed of a single metal layer or a metal layer of two or more layers. It should be particularly noted that although in the present embodiment, the surface metal film 22 completely covers the elastic body 2, but this is not a necessary technical means of the present invention, the surface metal film 22 only needs to be in the elastic body. The top surface of the 21 surface is formed into a surface 225 for the subsequent assembly operation, and the electrical connection 13 is completed with the solder pad 12, so that the surface metal film 22 is completely covered. (4) The elastic base 21 can be selected according to design requirements. . The technique of the above-mentioned construction operation generally refers to the flip chip technology using bumps, which is not limited; U also includes anisotropic conductive film (ACF) technology, anisotropic conductive t (Acp) technology, and materials. Electron (4) (Qing) technology and non-conductive particles "(NCP) technology, etc., because this is not a technical feature of the present invention, it will not be repeated.

As shown in FIG. 3 and FIG. 4, in the embodiment, each of the grooves 220 is a through hole penetrating through the surface metallization 22, but is not limited thereto. The concave=20 is used to increase the low order. The roughness of the surface 222 is thus the clock space: the size and the size of the product and the arrangement can be adjusted according to the actual needs::: juice change as shown in Fig. 5, each of the grooves 22〇& A groove I extending in the horizontal direction of the flat surface and the pad surface 121. Further, it is known from the manufacturing process of the present invention which will be described later that the step of forming the concave surface is incomplete (deficient) or only (four) In addition to the portion of the outer film layer 224

As shown in Fig. 6, each of the grooves 22Q becomes a blind hole, but the effect of reducing the degree of surface milk generation of the present invention can still be attained. "X" is a detailed description of the above-described elastic bump 2 having a low-order rough surface. The method includes the following steps: Step 500' is as shown in FIG. The pad η and the substrate 1 of the protective layer 13. Step 502 ' As shown in FIG. 9, a photomask 31 having a two-dimensional projection pattern 31 of the above-mentioned elastic body n FIG. 3) is prepared. Step 5〇4, The base 1 is coated with a photosensitive material layer 20, and in the present embodiment, the positive photosensitive polyaracine is disposed in the pad 12 and the protective layer 13 in a spin coating manner. Step 506, the two-dimensional shadow pattern 310 of the reticle 31 is transferred to the photosensitive material layer 2 以 in an exposure manner, and in the 匕 step, the two-dimensional projection pattern 〇 The surface of each of the pads 12 exposed outside the protective layer 13 is not completely covered. Step 508, as shown in FIG. 1A, a part of the photosensitive material layer 20 (see FIG. 9) is removed by a developing method. In the present embodiment, the elastic seat 21 is an organic solvent to remove the unexposed portion of the polyamidamine; of course, For example, an aqueous solution of an organic alkali or the like can also be used in the step of the present invention. Since the two-dimensional projection pattern 31〇 (see FIG. 9) in step 506 does not entirely cover the surface exposed by each of the pads 12, it is apparent that The formed elastic seat 21 will not completely shield the pad 12. The above steps to step 508 are one of the many ways of forming the above-mentioned elastic seat 21 on the mysterious substrate 1, especially when The material of the elastic seat body 21 is a photosensitive material, but it is not limited thereto. Especially when the material of the elastic seat body 21 is non-photosensitive material, the elastic seat body 21 can also adopt other materials. Conventional lithography (etching) or printing (printing) process is completed, step 510, as shown in Figure π, with the splashing technique on the elastic body 21 and not The inner film layer 223 having a uniform thickness is formed on the region of the solder pad 12 covered by the elastic body 21; since the inner film layer 223 is directly adjacent to the solder bump 12, the inner film layer 223 and the solder pad 12 are also disposed. Electrical connection 15 1332695 Step 512, with sputtering The outer film layer 224 is formed on the inner film layer 223. The foregoing step 510 and step 512 are formed on the elastic seat body 21 and the solder pad 12 to form an inner film layer 223 and the outer layer comprising the above two different materials. a film 224, and a method of surface metal layer 229 electrically connected to the pad 12, therefore, if the surface metal layer 229 is composed of a single film layer (not shown), only one is needed here. The surface metal layer 229 can be formed in a single step. Therefore, it is conceivable for those skilled in the art that if the number of layers constituting the surface gold layer 229 is large, the corresponding steps will be increased. Similarly, although in the embodiment, the inner film layer 223 and the outer film layer 224 are formed by sputtering, it is not limited thereto; regardless of the surface metal layer 229 formed, the single film layer structure is Or a multi-layer film structure, which can be formed according to the characteristics of the selected metal material, and adopts other kinds of physical vapor deposition technology (pvD) processes such as evaporation. Can also be applied to this Invention to form the surface of the metal layer 229. Step 514, as shown in FIG. 12, a photoresist 4 is applied over the surface metal layer 229. Step 516, as shown in FIG. 4 and FIG. 12, using a mask 32 covering the elastic body 21 and the pad 12, and the two-dimensional projection pattern 320 having the groove (4), the two-dimensional image is exposed by exposure. The projection image is transferred to the photoresist 4_±^. The two-dimensional pattern of the mask 32 with respect to the groove 22 is projected onto the corresponding portion of the photoresist 4, and the surface metal layer 229 is adjacent to the 16 1332695. Section of 12. The two-dimensional projection pattern 320 referred to herein, which covers the two-dimensional projection of the elastic seat body 21 and the solder pad 12, refers to a range in which the surface metal layer 229 is to be retained, that is, at least the top surface of the elastic seat body 21 is included. 211, a region of the cymbal pad 12 not covered by the elastic seat body 21, and a connection range between the top surface 211 and the region of the pad 12 not covered by the elastic seat body 〇, step 518, moving in a developing manner Except for a portion of the photoresist 4, the elastic body 21, the region where the pad 12 is not shielded by the elastic body 21, and the region between the top surface 211 and the pad 12 not covered by the elastic body 21 The wiring range, and the two-dimensional projection pattern 32 of the above groove 22 is defined on the surface metal layer 229, as shown in FIG. The steps 514 to 518 are defined by the lithography technique on the surface metal layer 229, the range of the elastic seat 21, the range of the solder pad 12, the range between the elastic body 21 and the bonding pad 12, and the above. The range of the groove 220 is. Step 520, as shown in FIG. 13, removing the surface not located in the range of the elastic body 21, not in the range of the pad 12, not located between the elastic body 21 and the pad 12 by etching. a metal layer 229, and a portion of the surface metal layer 229 adjacent to the portion of the pad 12 at the location of the recess 220 (see 胄3); to define the extension from the elastic body 21 to the pad 12 The surface metal film 22 is formed and the above-described groove 220 is formed (see Fig. 3). In this embodiment, the surface metal layer 229 has the inner film layer 223 made of the titanium-tungsten blend 17 1332695 cast metal and the outer layer of the gold, so in this step, the photoresist is used first. 4 (See Figure 13) is the silver engraved barrier, using Cheng (5) and moth repellent (KI) solution for the engraved liquid to engrave the outer film layer 224 • Then to protect the outer layer 224 as a (four) barrier, select The hydrogen peroxide (Η2〇2) solution is engraved with the inscription layer 223. ▲Step 522, removing the remaining photoresist 4 (see FIG. (1), completing the elastic bump 2 having a low-order rough surface. From the above, steps 514 to 522 are synchronously formed as shown in FIG. The concave metal film 22 of the above-mentioned elastic bump 2 is formed by the concave surface of the above-mentioned elastic bump 2, so that the present invention has a low-lying rough surface and has no need to add any Steps: When the photomask 32 having the two-dimensional projection pattern 32 of the elastic convex & 2 is produced, the two-dimensional projection of the groove 22〇 is simultaneously formed in the two-dimensional projection pattern 32〇, When the elastic seat 21 is extended to the surface metal film 22 of the pad ,, the grooves 22 are formed in synchronization. Since the depth of each of the grooves 220 is equal to the thickness of the surface metal film 22, it is equivalent to 疋The surface metal film 22 having a roughness equal to its own thickness is formed on a region of the bonding pad 12 that is not shielded by the elastic body 21. Thus, the position of the spacer 12 is not blocked by the elastic body 21. Test on it' and avoid slipping As shown in FIG. 14, the second preferred embodiment of the elastic bump 2 having the low-order rough surface of the present invention and the manufacturing method thereof is substantially the same as the first preferred embodiment described above, and the difference lies in the present embodiment. The elastic seat body 21 is completely formed in a range in which the solder pad 12 is exposed outside the protective layer 13 and each of the 18 1332695 recesses 220 has a shape extending from the low-order surface 222 to the contact surface 22 In addition, another difference from the first preferred embodiment is that, in the embodiment, the elastic bump 2 is formed by defining the surface metal film 22 first. The groove 220 is formed on the surface metal film 22. Another method for fabricating the elastic bump 2 of the present invention is described in detail below. Referring to FIG. 15, the steps include: Step 600, as shown in FIG. The solder pad 12 and the substrate 1 of the protective layer 13. Λ Step 602, the elastic body 21 is formed on the solder pad 12; in the embodiment, the elastic body 21 is completely located on the solder pad 12 The surface of the protective layer 13 is outside the surface 121, and the elastic seat The area of the bottom portion adjacent to the pad 12 is smaller than the area of the surface 121 of the pad 12; since the pad 12 is not completely shielded by the elastic body 21, a portion of the surface 121 of the pad 12 is exposed. Step 604, such as As shown in FIG. 17, a surface metal layer 229 electrically connected to the pad 12 is formed on the elastic body 21. In the embodiment, the surface metal layer 229 similarly includes an inner film layer 223 and an outer layer. The film layer 224. Step 606, as shown in FIG. 18, defines a range of the solder pads 12 including the elastic body 21 on the surface metal layer 229 by using a photoresist 4 on the surface metal layer 229 by using a lithography technique. Step 608, removing the portion of the surface metal layer 229 that is not located in the range of the pad 2 as shown in FIG. 19 by an etching technique to define the surface layer 22 of the above-mentioned 19 1332695. The range defined herein is relatively simple with respect to the first preferred embodiment described above, because the elastic seat 21 is completely located within the range of the pad 12, thereby defining the surface metal film 22 in the range of the pad 12, The top surface 211 including the elastic seat body 21, the area where the solder pad 12 is not shielded by the elastic seat body 21, and the top surface 2 ι to the solder pad 12 can be defined by the elastic seat body 21. The surface metal film 22 described above is connected to the range. Step 610, as shown in FIG. 20, using a lithography technique to define a range 2240 of the recess 22 (see FIG. 14) on the outer film layer 224 of the surface metal film 22 by a photoresist 4; The range 2240 of the recess 22 is a corresponding portion of the surface metal film 22 adjoining the pad 12, and as shown in FIG. 14, the surface layer located in the range of the groove 220 is removed by etching. The metal film 22 is formed to form the above-described groove 220. According to the above description, the manufacturing method disclosed in the embodiment can form the grooves 220 on the section of the surface metal film 22 adjacent to the bonding pad 12, and the depth of each of the grooves 22 is equal to the above. The thickness of the outer film layer 224 is such that the surface metal film 22 of the elastic bump 2 is formed to have the same thickness as the outer film layer 224 in a region where the solder pad 12 is not shielded by the elastic body 21. The roughness can be tested at a position where the pad 12 is not shielded by the elastic seat 21, and the slip phenomenon is avoided. As shown in FIG. 21, the third preferred embodiment of the present invention is substantially the same as the above two preferred embodiments, except that in the present embodiment, the elastic body 21 is completely formed on the protective layer 13. The shape of each of the pads 220 is the same as that of the above-described first embodiment, and is a through hole penetrating the surface metal film 22. In the present embodiment, the substrate 1 also has a circuit layer 11, a plurality of solder pads 12 which are raised/formed on the circuit layer 11, and a protective layer 13 formed on the remaining portion of the circuit layer 11. The elastic projection 2 has an elastic seat body 21 disposed on the protective layer 13, and a surface metal film 22 covering the elastic seat body 2 and the mattress 12. The elastic seat η is away from the pad η and does not cover the pad 12 at all, and has a distance from the substrate (the top surface 2 ι the surface metal film 22 covers the top surface 211 of the elastic body 21 and The elastic seat body 21 is covered, and also extends to the solder pad 12 to cover and adjacent to the solder bump 12 exposed on the outer surface of the protective layer 13, and is electrically connected to the solder bump 12. The surface metal The film 22 has a contact surface 221 adjacent to the surface 121 of the solder pad 12, a low-order surface 222 opposite to the contact surface 22, and a plurality of grooves 220 extending from the low-order surface 222 toward the contact surface 221; In this embodiment, each of the grooves 220 extends from the lower-order surface 222 to the contact surface 221 and is a through hole penetrating the surface metal film u. As can be seen from the above embodiments, each of the grooves 22 can also be Forming a blind hole or a channel. The surface metal film 22 is composed of an inner film layer 223 and an outer film layer 224, and the inner film layer 223 is adjacent to and directly covers the elastic body 21 and the solder The outer film layer 224 is plated adjacent to the inner film layer 223 21 1332695. Similarly, The surface metal film 22 is not limited to the above two metal layers, and may be composed of a single metal layer or two or more metal layers. Although in the present embodiment, the surface metal film 22 is completely covered. The elastic seat body 21, but this is not a necessary technical means of the present invention, the surface layer metal film 22 only needs to be formed on the top surface 211 of the elastic body 21 for the subsequent assembly work, and is completed with the pad 12 Electrical connection is sufficient, so whether the surface metal film 22 completely covers the elastic seat 21 can be selected according to design requirements. According to the above, the form disclosed in this embodiment can also be formed by The surface metal film 22 is adjacent to the recess 220 of the solder pad 12, so that the surface metal film 22 of the elastic bump 2 has a roughness equal to the thickness of the surface metal film 22 on the solder pad 12, thereby The test is performed at the position of the pad 12, and the slippery phenomenon is avoided. However, the above description is only the third preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. Patent application The simple equivalent changes and modifications made in the contents of the specification of the invention are still within the scope of the patent of the present invention. [Simplified illustration of the drawing] FIG. 1 is a schematic cross-sectional view of a general elastic bump, illustrating a probe touch Figure 2 is a top plan view of a first preferred embodiment of the present invention having a low-order rough surface and an elastic projection of the first embodiment, illustrating that a plurality of elastic projections are disposed on a substrate; 3 is a partial cross-sectional view of the first preferred embodiment of the present invention, illustrating the composition of the elastic bump of the present invention; FIG. 4 is a partial plan view of the first preferred embodiment, illustrating the low-order roughness of the elastic bump. FIG. 5 is a partial plan view of a first preferred embodiment of the present invention, showing another aspect of the lower-order rough surface of another embodiment of the elastic bump; FIG. 6 is the first preferred embodiment described above. Another partial cross-sectional view showing another type of groove formed on the elastic bump of the present invention;

Figure 7 is a flow chart of the first preferred embodiment, illustrating the steps of fabricating the above-mentioned elastic bumps;

Figure 8 is a cross-sectional view of the first preferred embodiment of the example, illustrating the composition of the substrate; Figure 9 is a partial cross-sectional view of the first preferred embodiment of the substrate coated with a layer of photosensitive material; FIG. 11 is a partial cross-sectional view showing a surface metal layer formed on the elastic seat body in a partial cross-sectional view of the first preferred embodiment; FIG. A partial cross-sectional view of a preferred embodiment is coated with a photoresist on the surface metal layer; and the second is a partial cross-sectional view of the first preferred embodiment, illustrating that the L agent is a flexible bump. And the range of the groove; the second method of the invention comprises the elastic bump of the low-order rough surface and the composition of a partial J block of the preferred embodiment A; _ illustrating the elastic convex description of the present invention twenty three

Figure 15 is a step of describing the elastic bumps in one of the above second preferred embodiments; a rank diagram illustrating a partial cross-sectional view of the second preferred embodiment of the above-described second preferred embodiment; The surface of the elastic body of the second preferred embodiment is formed on the surface of the elastic body. The surface of the second embodiment is a partial cross-sectional view of the second preferred embodiment. 2 19 is a partial cross-sectional view of the second preferred embodiment, wherein the surface metal layer defines a surface metal film; FIG. 20 is a partial cross-sectional view of the second preferred embodiment of the photoresist defining a plurality of grooves. And FIG. 21 is a partial cross-sectional view showing a third preferred embodiment of the elastic bump of the present invention having a low-order rough light surface, illustrating the composition of the elastic bump of the present invention. Descriptions are explained in the description. Illustrated in the description 24 1332695 [Description of main component symbols] 1...... .... Substrate 223 ·· ••...Inner film layer 11 ····. ...·Circuit layer 224 ··. Outer film layer 12····.•...pad 2240· ••...range 121 ··· —surface 225 ·· ••...upper surface surface 13·······protective layer 229 ·· .. ...surface metal layer 2... •...elastic bump 31...·......mask 20······...photosensitive material layer 310 ·. ••...two-dimensional projection pattern 21 •...elastic body 32... ·••... reticle 211... •... top surface 320... 2D projection pattern 22·····-surface metal film 4... ••... photoresist 220... •...grooves 500~ 522 Step 221 ··· •... Contact surface 600~ 612 Step 222... •...Low order surface

25

Claims (1)

X. Patent application scope: h An elastic bump having a low-order rough surface is disposed on a substrate having a solder bump, the elastic bump having an elastic seat on the substrate, and a cover a top surface of the elastic body adjacent to the surface metal film of the surface of the pad, the surface metal film having a contact surface adjacent to the surface of the pad and a low-order surface opposite to the contact surface; wherein: the surface metal film A plurality of grooves extending from the lower-order surface toward the contact surface are formed. 2. The elastic bump having a low-order thick surface according to the scope of the patent application, wherein each of the grooves is a blind hole. 3: The elastic bump having a low-order rough surface according to the scope of the patent application, wherein each of the grooves extends to the contact surface and is a through hole penetrating the metal film of the surface layer. 4. The elastic bump having a low-order rough surface according to claim i, wherein each of the grooves is a channel extending in a horizontal direction parallel to the surface of the pad. 5. The elastic bump having a low-order coarse sugar surface according to the invention of claim 5, wherein the elastic seat is located on the soldering iron and does not completely shield the solder pad. 6. The elastic bump having a low-order rough surface as described in the scope of the patent application, wherein the elastic seat is formed on the welding pad, and the elastic seat is adjacent to the bottom # of the bonding pad, The bottom of the raft is less than the surface area of the pad. 7. According to the scope of claim 1, the elastic bump having a low-order rough surface is described. The substrate has a protective layer formed on the protective layer of 26 1332695. 8. The elastic bump having a low-order rough surface as described in claim 1 of the invention, wherein the material of the elastic seat is a photosensitive material. 9. The material of the elastic seat in the elastic bump having a low-order (four) face according to the item i of the patent application is poly-liminamide, benzocyclobutene, polyacrylate, rubber, and silicone. H). The elastic bump having a low-order rough surface according to the first aspect of the patent scope, wherein the material of the surface metal film is selected from the group consisting of: The group includes a combination of gold, silver 'chromium, chin, crane, Ming, copper' and the like. 11_According to the towel, the elastic bump having a low-order secret surface as described in the patent specification, the surface layer, wherein the surface layer The metal film has an inner film layer adjacent to the solder pad and a film layer adjacent to the inner film layer. U., according to the fourth item, the elastic bump having a low-order (10) surface, as described in item (i) The material of the inner film layer is selected from the group consisting of chromium, titanium, tungsten, aluminum, copper, and the like. 13. According to the scope of claim U The elastic bump having a low-order rough surface, wherein the material of the outer film layer is selected from the following a group comprising gold, copper, silver, and the like. 14. A method for fabricating a resilient bump having a low-order rough surface, comprising the steps of: a) having a pad Forming an elastic seat on the substrate; b) forming a surface metal layer on the elastic body and the pad; and 27 1332695 c) removing a portion of the surface metal layer adjacent to the pad to form a plurality of grooves 15' The method for fabricating an elastic bump having a low-order thick chain surface according to the fourth aspect of the invention, wherein the step a) is to form the elastic seat on the silicon pad and not completely shield the The manufacturing method of the elastic bump having the low-order thick chain surface described in the fourth paragraph of the patent, wherein the step a) is to form the elastic seat on the solder pad and the elastic seat The bottom surface of the body adjacent to the solder fillet is smaller than the surface area of the solder pad. 17. The method for fabricating an elastic bump having a low-order secret surface as described in claim 14 of the patent scope is 't' One of the film technology and printing technology is completed According to claim 14, the method for manufacturing an elastic ghost having a low-order rough surface according to claim 14, wherein the step a) comprises the following steps: a-l) preparing a reticle having the two-dimensional projection pattern of the elastic seat described above A_2) coating a photosensitive material layer on the substrate; a3) transferring the two-dimensional projection pattern of the elastic seat on the photomask to the photosensitive material layer by exposure; and a_4) forming the elasticity by developing Seat. 19. The manufacturing process is completed according to the manufacturing method of the bumps in the patent application scope. 2 0. According to the elasticity of the low-order rough surface described in Item 14 of the patent application, the step b) is the elasticity 28 1332695 having the low-order rough surface described in the physical vapor deposition technique 19 item. The method of manufacturing the bumps, wherein the step b) is completed by one of a sputtering technique and an evaporation technique. 21. The method according to claim 4, wherein the step b) comprises the following steps: b-Ι) forming on the elastic body and the bonding pad. An inner film layer; and b-2) forming an outer film layer on the inner film layer. 22. The method for fabricating an elastic bump having a low-order rough surface according to the scope of claim j4, wherein the step comprises the following steps: c-1) defining the surface metal layer by lithography The range of the grooves; and c-2) removing the surface metal layer in a portion of the range of the grooves by etching. 23. The method of fabricating an elastic bump having a low-order coarse sugar surface according to the scope of the patent application, wherein the step c) removes a portion of the surface metal layer more synchronously to define an extension from the elastic body. To the surface metal film of the pad. 24. The method of fabricating an elastic bump having a low-order rough surface according to claim 23, wherein the step 勹 comprises the steps of: cl) defining the elastic seat on the surface metal layer by lithography; The range of the body, the range of the pad, the range between the elastic body and the pad, and the range of the grooves; and c-2) are removed by etching techniques not in the range of the elastic body, The surface metal layer is located in the range of the solder pad, not in the portion between the elastic body and the solder pad, and the surface metal layer is located in a portion of the range of the recesses 29 1332695. 25. The method for fabricating an elastic bump having a low-order rough surface according to claim 14 of the claim is further included in the following steps between the step b) and the step c): d) removing part of the surface metal The layer defines a surface metal film extending from the elastic body to the bonding pad. 26. In the method for fabricating an elastic bump having a low-order rough surface according to claim 25, the step d) comprises the following steps: d_l) defining the elastic seat on the surface metal layer by lithography The range of the body, the range of the pad and the range between the elastic body and the pad; and d-2) the removal of the surname (4) is not located in the range of the symmetrical body, not located in the welding (four) The range 'and the surface metal layer not located between the resilient body and the pad. 30