[go: up one dir, main page]

TWI326026B - Heat radiating device - Google Patents

Heat radiating device Download PDF

Info

Publication number
TWI326026B
TWI326026B TW96106741A TW96106741A TWI326026B TW I326026 B TWI326026 B TW I326026B TW 96106741 A TW96106741 A TW 96106741A TW 96106741 A TW96106741 A TW 96106741A TW I326026 B TWI326026 B TW I326026B
Authority
TW
Taiwan
Prior art keywords
heat
heat sink
gap
air
fan
Prior art date
Application number
TW96106741A
Other languages
Chinese (zh)
Other versions
TW200836047A (en
Inventor
Hideyuki Fujikawa
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to TW96106741A priority Critical patent/TWI326026B/en
Publication of TW200836047A publication Critical patent/TW200836047A/en
Application granted granted Critical
Publication of TWI326026B publication Critical patent/TWI326026B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

1326026 九、發明說明: C發明所屬之技術領域:! 技術領域 本發明係有關一種具有多數片隔著間隙排列之散熱 5片,且從散熱片散熱至於前述散熱片之間隙流動的空氣的 散熱件。 【先前技術3 背景技術 隨著近年電子機器越來越高機能化,電子機器内部亦 10 會搭載具有高運算能力的大規模LSI,而其發熱量隨著演算 能力越來越強而越來越大,因此負責進行前述大規模LSI 之散熱的散熱件也需要越來越高的散熱性能。前述散熱件 通常係採用具有多數片隔著間隙排列之散熱片,且使空氣 於前述散熱片之間隙流動,並將熱從前述散熱片傳送至空 15 氣,再將溫度上昇之空氣排出至機器外部的散熱結構。特 許文獻1、2中揭示有一種散熱片之形狀與排列等業經設 計,以實現更高散熱性能的結構。 【特許文獻1】特開平8-88301號公報 【特許文獻2】特開平11-103183號公報 20 其中,在前述具有排列有多數片散熱片之散熱件中的 一個大問題在於:當長時間使用搭載有前述散熱件之電子 機器時,塵埃會附著於前述散熱片之空氣流入側端緣,使 得空氣流動變差且散熱性能惡化,結果,難以冷卻如大規 模LSI等之散熱對象的發熱件並產生高溫,而引起前述散熱 5 1326026 件之故障與惡化,更可能引起前述發熱件損壞、電子機器 動作停止。 其中,為了降低塵埃附著於散熱片的情況,可考慮擴 大散熱片間的間隔,或降低風量等方法,但前述方法皆會 5 導致散熱性能下降,因此在隨著發熱件之發熱量的增加而 要求提高散熱性能的情況中,前述對策並不適當。 本發明係鑒於前述情況而製成者,其目的在於提供一 種可維持散熱性能並且減少塵埃附著之散熱件。 【發明内容】 10 發明揭示 為了達成前述目的,本發明之散熱件係具有多數片隔 著間隙排列之散熱片,且可將熱從前述散熱片傳送至於前 述散熱片之間隙流動的空氣者,而且前述散熱片之空氣流 入側端緣具有朝前述散熱片之排列方向交替地或循環地切 15 除不同部分之切口形狀。 由於本發明之散熱件之散熱片的空氣流入側端緣具有 前述切口形狀,因此可實質地擴大空氣流入側端緣之空氣 流入開口,且可維持散熱性能並且減少塵埃附著。 其中,在本發明之散熱件中,散熱片的空氣流入側端 20 緣具有前述切口形狀,而且散熱片的空氣流出側端緣亦具 有前述切口形狀。 當散熱片之空氣流出側端緣具有前述切口形狀時,可 因此減低於散熱片之間隙流動之空氣的阻礙,並使空氣順 利流動,而有利於提昇散熱性能。 6 1326026 又,本發明之散熱件中,當從前述散熱片之排列方向 看散熱片之具有前述切口形狀的端緣時,相鄰之散熱片的 突出部分之間形成有間隙。 在該情況下,可更等量地擴大相鄰之散熱片之空氣流 5 入側端緣的間隙,並可更減少塵埃附著。 又,本發明之散熱件中,更具有從作為冷卻對象之發 熱件吸熱的吸熱板,且散熱片直立設置於前述吸熱板上。 藉由採用前述結構,並利用吸熱板從發熱件吸收熱且 傳送至散熱片,並且從散熱片傳熱至空氣,而可進行從前 10 述發熱件的散熱。 其中,在具有前述吸熱板的結構中,更具有連接於前 述吸熱板且貫穿散熱片,並且將吸熱板之熱傳送至散熱片 的傳熱構件。 當具有前述傳熱構件時,可更有效地傳送吸熱板之熱 15 至散熱片。 再者,在本發明之散熱件中,更具有用以於散熱片之 間隙形成氣流的風扇。 由於一體地具有風扇,因此不須另外設計風扇的安裝 結構,也不須另外準備風扇,故很方便。 20 在該情況下,前述風扇可為將空氣送入散熱片之間隙 的風扇,或者,亦可為將空氣從散熱片之間隙送出的風扇。 如前述說明,根據本發明可維持散熱性能並且減少塵 埃附著。 圖式簡單說明 7 1326026 第1圖係作為本發明之第1實施型態之散熱件的透視 圖。 第2圖係第1圖所示之散熱件的俯視圖。 第3圖係第1圖所示之散熱件的正視圖。 5 第4圖係第1圖所示之散熱件的側視圖。 第5圖係第1圖所示之R1部分的放大圖。 第6圖係第3圖所示之R2部分的放大圖。 第7圖係作為本發明之第2實施型態之散熱件的透視 圖。 10 第8圖係第7圖所示之散熱件的側視圖。 第9圖係第8圖所示之R3部分的放大圖。 第10圖係構成第7圖所示之散熱件之吸熱板的概略透 視圖。 第11圖係顯示構成第7圖所示之散熱件之熱管形狀的 15 概要圖。 【實施方式3 實施發明之最佳型態 以下,針對本發明之實施型態進行說明。 第1圖係作為本發明之第1實施型態之散熱件的透視 20 圖,第2圖係第1圖所示之散熱件的俯視圖,第3圖係第1圖 所示之散熱件的正視圖,而第4圖係第1圖所示之散熱件的 側視圖。 又,第5圖係第1圖所示之R1部分的放大圖,第6圖係第 3圖所示之R2部分的放大圖。 8 1326026 前述散熱件10係由吸熱板11與多數片隔著間隙排列之 散熱片12所構成。吸熱板11係由熱傳效率高之金屬,例如, 銅等作成,且其下面配置於發熱件(圖未示),而具有從前述 發熱件吸收熱的作用,又,該吸熱板歛合有多數片散熱片 5 12,而具有固持前述多數片散熱片12並且將熱傳送至該等 散熱片12的作用。散熱片12亦係由熱傳效率高之材料,例 如,鋁或銅等所構成。從發熱件傳送至吸熱板11的熱會再 傳送至散熱片,並傳送至於散熱片12間隙流動的空氣。吸 收熱而成為高溫的空氣會排出至内部安裝有發熱件與散熱 10 件10之電子機器等的外部。 其中,構成前述散熱件10之多數片散熱片12的上端緣 與兩側端緣形成有如第5圖放大所示之切口形狀,即,每1 片散熱片的端緣具有反覆切割成凹凸狀的形狀,且在此所 示之例中,相鄰之散熱片的凸部12a、12b不重疊,並且如 15 第6圖所示,不同的位置交替地形成有凸部12a、12b,而使 凸部之間形成有間隙g、h。 因此,可擴大形成流入散熱片12間隙之空氣流入端緣 及從散熱片12間隙流出之空氣流出端緣的實質開口(第5圖 所示之每1片散熱片的間隔d與相鄰之散熱片之凸部的間隔 20 e),並可減少附著於空氣流入端緣之塵埃,且可減低通過 散熱片間隙之氣流的阻礙,而使氣流更順利流動,故此點 有利於防止塵埃附著,並且可提升散熱性能。 又,在此所示之例中,係以當從散熱片之排列方向看 來時,形成有如第6圖所示之凸部的開口間隙g、h為較佳的 9 1326026 型態,但即使不存有該等間隙g、h,例如,交替地形成凸 部並使凸部之一部份重疊,仍可確保作為散熱片之空氣流 入端緣與空氣流出端緣全體之實質開口的寬度,因此不一 定要形成該等間隙g、h。 5 又,在此所示之例中,係在不區分散熱片之空氣流入 端緣與空氣流出端緣的情況下,於除了斂合於吸熱板11之 側的端緣以外的三側具有切口形狀,但當事先知道空氣流 入端緣與空氣流出端緣時,亦可只於空氣流入端緣形成前 述切口形狀。由於塵埃會附著於空氣流入端緣,因此只要 10 空氣流入端緣形成有前述切口形狀的話,便可減少塵埃附 著。 再者,在此所示之例中,係交替地切除相鄰之散熱片 的不同部分,但亦可以3片或4片為一輪,循環地於不同位 置形成切口,且於每3片或每4片散熱片之相同位置形成切 15 口。 第7圖係作為本發明第2實施型態之散熱件的透視圖, 而第8圖係第7圖所示之散熱件的側視圖。 又,第9圖係第8圖所示之圓圈R3部分的放大圖。 再者,第10圖係構成第7圖所示之散熱件之吸熱板的概 20 略透視圖,而第11圖係顯示構成第7圖所示之散熱件之熱管 形狀的概要圖。 在作為前述第2實施型態之散熱件20中,於其下端具有 吸熱板21。 如第10圖所示,前述吸熱板21係由可從發熱件(圖未示) 10 吸收熱之吸熱部211、及4隻用以固定第7圖所示之散熱件20 的臂部212所構成。 在前述實施型態中,吸熱部211係由銅所形成,以確保 良好的吸熱性,且其4角斂合連接有鋁製之臂部212。又, 吸熱部211形成有2條長槽2iia,且該等長槽21 la内配置有 後述之熱管25(參照第丨丨圖)。又,4隻臂部212設有貫穿上下 之安裝孔212a。如第7圖所示,前述安裝孔212a貫穿有螺絲 件22,藉由使用該等螺絲件22,可以吸熱部211之下面抵接 於發熱件之上面的狀態將前述散熱件2〇固定於電子機器的 框體等。又’彈簧構件23係可以吸熱部211之下面配置於發 熱部之狀態將前述散熱件2〇穩定地安裝於框體等的裝置。 又’在第7圖、第8圖所示之散熱件20中,排列有多數 片斂合固定於吸熱部211之散熱片24。該等散熱片24之由風 扇26所覆蓋之上面及兩側面具有第9圖所示之切口形狀。前 述切口形狀本體與構成前述第丨實施型態之散熱件1〇的散 熱片12之切口形狀相同,因此省略重複說明。 又,前述散熱件20具有形狀如第n圖所示之熱管乃。 月’J述熱b 25之一端側嵌入於形成在吸熱板以之吸熱部幻1 的長槽21la,並從該處延伸且描繪出弧線再折返,並且朝 散熱片24之排列方向延伸且貫穿多數片散熱片以。 由於具有則述熱管25,因此以吸熱部叫從發熱件吸收 之熱會通過前述熱管25並有效率地傳送至散熱片以。 再者,在第7圖、第8圖所示之散熱件中,於覆 片24之上端緣的位置具有風扇%。前述風扇%係從散熱^ 1326026 24之上端緣朝散熱片送風者,由風扇26從散熱片24之上端 緣送入散熱片2 4之間隙的空氣係在通過散熱片2 4之間隙時 由散熱片24°及收熱,再接觸吸熱板21且由吸熱板21直接吸 收熱’接著從散熱片24之兩側端緣排出。 5 前述散熱片24之上端緣亦具有與形成於前述散熱片24 之側端緣的切口形狀相同的切口形狀,因此,可減少附著 於前述散熱片24之上端緣,即,空氣流入側端緣的塵埃。 又’在前述說明中,前述第2實施型態之風扇26為朝散 熱片送風之風扇’但前述風扇26亦可為朝從散熱片24吸出 10空氣之方向送風的風扇。在該情況下,散熱片24之兩側端 緣為空氣机入端緣’且前述散熱片24之前述兩側端緣亦具 有切口形狀’因此,在該情況下,亦可減少附著於前述空 氣流入細緣即,兩侧端緣之塵埃。 【班式簡說明】 15 $1圖係'作為本發明之第1實施型態之散熱件的透視 圖。 第2圖#'第1圖所示之散熱件的俯視圖。 第3圖係第1圖所示之散熱件的正視圖。 第4圖係第1圖所示之散熱件的側視圖。 20第5圖係第1圖所示之幻部分的放大圖。 第6圖係第3圖所示之R2部分的放大圖。 第7圖係作為本發明之第2實施型態之散熱件的透視 圖。 第8圖係第7圖所示之散熱件的側視圖。 12 1326026 第9圖係第8圖所示之R3部分的放大圖。 第10圖係構成第7圖所示之散熱件之吸熱板的概略透 視圖。 第11圖係顯示構成第7圖所示之散熱件之熱管形狀的 5 概要圖。 【主要元件符號說明】 10,20…散熱件 26.. 11,21···吸熱板 211·.·吸熱部 12,24...散熱片 211a···長槽 12〇421)...凸部 212...臂部 22...螺絲件 212a...安裝孔 23...彈簧構件 g,h·.·間隙 25...熱管 d^e. ·.間隔 131326026 IX. Description of invention: The technical field to which C invention belongs:! BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating member having a plurality of heat dissipating fins arranged in a gap between a plurality of sheets and dissipating heat from the fins to a gap of the fins. [Prior Art 3] With the increasing performance of electronic devices in recent years, electronic devices are also equipped with large-scale LSIs with high computing power, and their heat generation is becoming more and more powerful as computing power becomes stronger. Therefore, the heat sink responsible for the heat dissipation of the aforementioned large-scale LSI also requires higher and higher heat dissipation performance. The heat dissipating member usually adopts a fin having a plurality of sheets arranged with a gap interposed therebetween, and allows air to flow in a gap between the fins, and transfers heat from the fin to the air, and then discharges the air having a rising temperature to the machine. External heat dissipation structure. A structure in which the shape and arrangement of the fins are designed to achieve higher heat dissipation performance is disclosed in the prior documents 1 and 2. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. In the case of the electronic device in which the heat sink is mounted, the dust adheres to the air inflow side edge of the heat sink, so that the air flow is deteriorated and the heat dissipation performance is deteriorated. As a result, it is difficult to cool the heat generating element such as a large-scale LSI. The high temperature is generated, which causes the failure and deterioration of the heat dissipation 5 1326026, and is more likely to cause damage to the aforementioned heat generating member and stop the operation of the electronic machine. In order to reduce the adhesion of dust to the heat sink, it is conceivable to increase the interval between the heat sinks or reduce the air volume. However, the above methods all cause a decrease in heat dissipation performance, so that the heat generation amount of the heat generating member increases. In the case where it is required to improve the heat dissipation performance, the aforementioned countermeasures are not appropriate. The present invention has been made in view of the foregoing circumstances, and an object thereof is to provide a heat dissipating member which can maintain heat dissipation performance and reduce dust adhesion. SUMMARY OF THE INVENTION In order to achieve the above object, the heat dissipating member of the present invention has a plurality of fins arranged with a gap interposed therebetween, and heat can be transferred from the fins to the air flowing in the gap of the fins, and The air inflow side end edge of the fin has a slit shape which is alternately or cyclically cut in the direction in which the fins are arranged, except for different portions. Since the air inflow side end edge of the heat sink of the heat sink of the present invention has the aforementioned slit shape, the air inflow opening of the air inflow side edge can be substantially enlarged, and heat dissipation performance can be maintained and dust adhesion can be reduced. In the heat sink of the present invention, the air inflow side end edge 20 of the heat sink has the aforementioned slit shape, and the air outflow side edge of the heat sink also has the aforementioned slit shape. When the air outlet side edge of the heat sink has the shape of the slit described above, the air flowing below the gap of the heat sink can be reduced, and the air can flow smoothly, which is advantageous for improving the heat dissipation performance. Further, in the heat dissipating member of the present invention, when the end edge of the fin having the slit shape is viewed from the direction in which the fins are arranged, a gap is formed between the protruding portions of the adjacent fins. In this case, the gap between the air-inlet side edges of the adjacent fins can be expanded more equally, and the dust adhesion can be further reduced. Further, the heat sink of the present invention further has a heat absorbing plate that absorbs heat from the heat generating member to be cooled, and the heat sink is erected on the heat absorbing plate. By adopting the foregoing structure, and absorbing heat from the heat generating member by the heat absorbing plate and transferring it to the heat sink, and transferring heat from the heat sink to the air, heat dissipation from the heat generating member can be performed. Among them, in the structure having the above-described heat absorbing plate, there is further provided a heat transfer member which is connected to the heat absorbing plate and penetrates the heat sink, and transfers heat of the heat absorbing plate to the heat sink. When the heat transfer member is provided, the heat 15 of the heat absorbing plate can be more efficiently transferred to the heat sink. Further, in the heat sink of the present invention, there is further provided a fan for forming an air flow in the gap of the heat sink. Since the fan is integrally provided, it is not necessary to separately design the mounting structure of the fan, and it is not necessary to separately prepare a fan, which is convenient. In this case, the fan may be a fan that sends air into the gap of the heat sink, or may be a fan that sends air from the gap of the heat sink. As explained above, according to the present invention, heat dissipation performance can be maintained and dust adhesion can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS 7 1326026 Fig. 1 is a perspective view of a heat sink according to a first embodiment of the present invention. Fig. 2 is a plan view of the heat sink shown in Fig. 1. Fig. 3 is a front view of the heat sink shown in Fig. 1. 5 Figure 4 is a side view of the heat sink shown in Figure 1. Fig. 5 is an enlarged view of a portion R1 shown in Fig. 1. Fig. 6 is an enlarged view of the portion R2 shown in Fig. 3. Fig. 7 is a perspective view of a heat sink according to a second embodiment of the present invention. 10 Figure 8 is a side view of the heat sink shown in Figure 7. Fig. 9 is an enlarged view of the R3 portion shown in Fig. 8. Fig. 10 is a schematic perspective view of a heat absorbing plate constituting the heat sink shown in Fig. 7. Fig. 11 is a schematic view showing a shape of a heat pipe constituting the heat sink shown in Fig. 7. [Embodiment 3] BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of the present invention will be described. Fig. 1 is a perspective view of a heat sink according to a first embodiment of the present invention. Fig. 2 is a plan view of the heat sink shown in Fig. 1. Fig. 3 is a front view of the heat sink shown in Fig. 1. Fig. 4, and Fig. 4 is a side view of the heat sink shown in Fig. 1. Further, Fig. 5 is an enlarged view of a portion R1 shown in Fig. 1, and Fig. 6 is an enlarged view of a portion R2 shown in Fig. 3. 8 1326026 The heat sink 10 is composed of a heat sink 11 and a plurality of fins 12 arranged with a gap therebetween. The heat absorbing plate 11 is made of a metal having high heat transfer efficiency, for example, copper or the like, and is disposed on the lower surface of the heat generating member (not shown), and has a function of absorbing heat from the heat generating member, and the heat absorbing plate is condensed. A plurality of fins 5 12 have the function of holding the plurality of fins 12 and transferring heat to the fins 12. The heat sink 12 is also made of a material having high heat transfer efficiency, for example, aluminum or copper. The heat transferred from the heat generating member to the heat absorbing plate 11 is transferred to the heat sink and transferred to the air flowing in the gap of the heat sink 12. The air that has been heated to a high temperature is discharged to the outside of an electronic device or the like in which the heat generating element and the heat sink 10 are mounted. The upper end edge and the both end edges of the plurality of fins 12 constituting the heat dissipating member 10 are formed with a slit shape as shown in FIG. 5, that is, the end edge of each fin has a reversely cut into a concave-convex shape. The shape, and in the example shown here, the convex portions 12a, 12b of the adjacent fins do not overlap, and as shown in Fig. 6, as shown in Fig. 6, the convex portions 12a, 12b are alternately formed at different positions, so that the convex portions are convex. There are gaps g and h formed between the portions. Therefore, it is possible to enlarge the substantial opening of the air inflow end edge which forms the gap into the fin 12 and the air outflow end edge which flows out from the gap of the fin 12 (the interval d of each fin shown in FIG. 5 and the adjacent heat dissipation) The spacing of the convex portions of the sheet is 20 e), and the dust adhering to the air inflow end edge can be reduced, and the obstruction of the airflow passing through the gap of the fin can be reduced, and the airflow can flow more smoothly, so that the point is favorable for preventing dust from adhering, and Improves heat dissipation. Further, in the example shown here, the opening gaps g, h formed as the convex portions shown in Fig. 6 are preferably 9 1326026 when viewed from the direction in which the fins are arranged, but even There is no such gap g, h, for example, alternately forming the convex portion and partially overlapping the convex portion, and still ensuring the width of the substantial opening of the air inflow end edge and the air outflow end edge as the heat sink. Therefore, it is not necessary to form the gaps g, h. Further, in the example shown here, in the case where the air inflow end edge of the heat sink and the air outflow end edge are not distinguished, the slit is provided on three sides except the end edge which is joined to the side of the heat absorbing plate 11. The shape, but when the air inflow end edge and the air outflow end edge are known in advance, the slit shape may be formed only by the air inflow end edge. Since dust adheres to the air inflow end edge, dust adhesion can be reduced as long as the air inflow end edge is formed with the aforementioned slit shape. Furthermore, in the example shown here, the different portions of the adjacent fins are alternately cut, but it is also possible to form 3 or 4 sheets for one round, to form slits at different positions cyclically, and for every 3 sheets or each. The same position of the four fins forms a cut of 15 ports. Fig. 7 is a perspective view of a heat sink according to a second embodiment of the present invention, and Fig. 8 is a side view of the heat sink shown in Fig. 7. Further, Fig. 9 is an enlarged view of a portion of the circle R3 shown in Fig. 8. Further, Fig. 10 is a schematic perspective view showing a heat absorbing plate of the heat sink shown in Fig. 7, and Fig. 11 is a schematic view showing the shape of the heat pipe constituting the heat sink shown in Fig. 7. In the heat sink 20 of the second embodiment described above, the heat absorbing plate 21 is provided at the lower end thereof. As shown in Fig. 10, the heat absorbing plate 21 is composed of a heat absorbing portion 211 which can absorb heat from a heat generating member (not shown) 10, and 4 arm portions 212 for fixing the heat sink member 20 shown in Fig. 7. Composition. In the foregoing embodiment, the heat absorbing portion 211 is formed of copper to ensure good heat absorbing property, and the arm portion 212 made of aluminum is joined to the four corners. Further, the heat absorbing portion 211 is formed with two long grooves 2iia, and a heat pipe 25 (see the second drawing) to be described later is disposed in the long grooves 21 la. Further, the four arm portions 212 are provided with attachment holes 212a penetrating the upper and lower sides. As shown in FIG. 7, the mounting hole 212a is inserted through the screw member 22. By using the screw member 22, the heat sink portion 211 can be fixed to the electronic device in a state where the lower surface of the heat absorbing portion 211 abuts against the heat generating member. The frame of the machine, etc. Further, the spring member 23 is a device in which the heat dissipating member 2 is stably attached to the casing or the like in a state where the lower surface of the heat absorbing portion 211 is disposed in the heat generating portion. Further, in the heat sink 20 shown in Figs. 7 and 8, a plurality of fins 24 that are fixed to the heat absorbing portion 211 are arranged. The upper surface and both side surfaces of the fins 24 covered by the fan 26 have a slit shape as shown in Fig. 9. The slit-shaped body has the same shape as the slit of the heat-dissipating fin 12 constituting the heat sink 1 of the second embodiment, and thus the overlapping description will be omitted. Further, the heat sink 20 has a heat pipe having a shape as shown in Fig. One end side of the month's heat b 25 is embedded in the long groove 21a formed in the heat absorbing plate and the heat absorbing portion is 1 , and extends therefrom and depicts an arc to be folded back, and extends toward the arrangement direction of the heat sink 24 and runs through Most of the heat sinks are. Since the heat pipe 25 is provided, the heat absorbed by the heat-absorbing portion from the heat-generating member passes through the heat pipe 25 and is efficiently transferred to the heat sink. Further, in the heat dissipating members shown in Figs. 7 and 8, there is a fan % at the position of the upper edge of the cover sheet 24. The fan % is supplied from the upper edge of the heat sink 1326026 24 toward the heat sink, and the air that is fed from the upper end edge of the heat sink 24 into the gap of the heat sink 24 is cooled by the heat sink 24 . The sheet is 24° and heat is received, and the heat absorbing plate 21 is contacted and the heat is directly absorbed by the heat absorbing plate 21 and then discharged from both side edges of the heat sink 24. The upper end edge of the heat sink 24 also has the same slit shape as the slit formed on the side edge of the heat sink 24, thereby reducing the adhesion to the upper edge of the heat sink 24, that is, the air inflow side edge. Dust. Further, in the above description, the fan 26 of the second embodiment is a fan that blows air to the heat radiating fins. However, the fan 26 may be a fan that blows air in a direction in which air is sucked from the fins 24. In this case, the both end edges of the fins 24 are the air inlet edge 'and the both end edges of the fins 24 also have a slit shape'. Therefore, in this case, the adhesion to the air can also be reduced. The dust flows into the thin edges, that is, the dust on both sides. [Brief Description] The 15 $1 diagram is a perspective view of the heat sink of the first embodiment of the present invention. Fig. 2 is a top view of the heat sink shown in Fig. 1. Fig. 3 is a front view of the heat sink shown in Fig. 1. Fig. 4 is a side view of the heat sink shown in Fig. 1. Fig. 5 is an enlarged view of the magical part shown in Fig. 1. Fig. 6 is an enlarged view of the portion R2 shown in Fig. 3. Fig. 7 is a perspective view of a heat sink according to a second embodiment of the present invention. Figure 8 is a side view of the heat sink shown in Figure 7. 12 1326026 Figure 9 is an enlarged view of the R3 portion shown in Figure 8. Fig. 10 is a schematic perspective view of a heat absorbing plate constituting the heat sink shown in Fig. 7. Fig. 11 is a schematic view showing a shape of a heat pipe constituting the heat sink shown in Fig. 7. [Description of main component symbols] 10, 20... heat sink 26.. 11, 21···heat absorbing plate 211·.·heat absorbing part 12, 24... heat sink 211a···long slot 12〇421)... Convex portion 212...arm portion 22...screw member 212a...mounting hole 23...spring member g,h·.gap 25...heat pipe d^e. ·.interval 13

Claims (1)

13260261326026 1010 - 20 十、申請專利範圍: 1. 一種散熱件,係具有多數片隔著間隙排列之散熱片,且 可將熱從前述散熱片傳送至於前述散熱片之間隙流動 的空氣者,其特徵在於: 前述散熱片之空氣流入側端緣具有朝前述散熱片 之排列方向交替地或循環地切除不同部分之切口形狀。 2. 如申請專利範圍第1項之散熱件,其中前述散熱片之空 氣流入側端緣具有前述切口形狀,而且前述散熱片之空 氣流出側端緣亦具有前述切口形狀。 3. 如申請專利範圍第1項之散熱件,其中當從前述散熱片 之排列方向看前述散熱片之具有前述切口形狀的端緣 時,相鄰之前述散熱片的突出部分之間形成有間隙。 4. 如申請專利範圍第1項之散熱件,更具有從作為冷卻對 象之發熱件吸熱的吸熱板,且前述散熱片直立設置於前 述吸熱板上。 5. 如申請專利範圍第4項之散熱件,更具有連接於前述吸 熱板且貫穿前述散熱片,並且將前述吸熱板之熱傳送至 前述散熱片的傳熱構件。 6. 如申請專利範圍第1項之散熱件,更具有用以於前述散 熱片之間隙形成氣流的風扇。 7. 如申請專利範圍第6項之散熱件,其中前述風扇係將空 氣送入前述散熱片之間隙的風扇。 8. 如申請專利範圍第6項之散熱件,其中前述風扇係將空 氣從前述散熱片之間隙送出的風扇。 14- 20 X. Patent application scope: 1. A heat dissipating member is a heat dissipating fin which has a plurality of sheets arranged with a gap therebetween, and can transfer heat from the heat dissipating fin to the air flowing in the gap of the fins, and is characterized in that: The air inflow side end edge of the fin has a slit shape in which different portions are alternately or cyclically cut toward the arrangement direction of the fins. 2. The heat sink according to claim 1, wherein the air inflow side end edge of the heat sink has the slit shape, and the air flow side edge of the heat sink has the slit shape. 3. The heat sink according to claim 1, wherein when the edge of the heat sink having the slit shape is viewed from the direction in which the heat sink is arranged, a gap is formed between the protruding portions of the adjacent heat sink. . 4. The heat sink of claim 1, further comprising a heat absorbing plate that absorbs heat from the heat generating member as a cooling object, and the heat sink is erected on the heat absorbing plate. 5. The heat sink of claim 4, further comprising a heat transfer member coupled to the heat absorbing plate and extending through the heat sink and transferring heat of the heat absorbing plate to the heat sink. 6. The heat sink of claim 1 is further provided with a fan for forming an air flow in the gap of the heat sink. 7. The heat sink of claim 6, wherein the fan is a fan that sends air into the gap of the heat sink. 8. The heat sink of claim 6, wherein the fan is a fan that sends air from the gap of the heat sink. 14
TW96106741A 2007-02-27 2007-02-27 Heat radiating device TWI326026B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96106741A TWI326026B (en) 2007-02-27 2007-02-27 Heat radiating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96106741A TWI326026B (en) 2007-02-27 2007-02-27 Heat radiating device

Publications (2)

Publication Number Publication Date
TW200836047A TW200836047A (en) 2008-09-01
TWI326026B true TWI326026B (en) 2010-06-11

Family

ID=44819839

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96106741A TWI326026B (en) 2007-02-27 2007-02-27 Heat radiating device

Country Status (1)

Country Link
TW (1) TWI326026B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613954B (en) * 2016-08-31 2018-02-01 Asia Vital Components Co Ltd Cooling water cooling row structure
US10251306B2 (en) 2016-09-26 2019-04-02 Asia Vital Components Co., Ltd. Water cooling heat dissipation structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613954B (en) * 2016-08-31 2018-02-01 Asia Vital Components Co Ltd Cooling water cooling row structure
US10251306B2 (en) 2016-09-26 2019-04-02 Asia Vital Components Co., Ltd. Water cooling heat dissipation structure
US11399446B2 (en) 2016-09-26 2022-07-26 Asia Vital Components Co., Ltd. Water cooling heat dissipation structure

Also Published As

Publication number Publication date
TW200836047A (en) 2008-09-01

Similar Documents

Publication Publication Date Title
CN102573383B (en) Wind scooper and use the heat abstractor of this wind scooper
TW200903236A (en) Heat dissipation module
TW201144990A (en) Heat dissipation device and centrifugal fan thereof
TWI332143B (en) Heat dissipation module
TWI326026B (en) Heat radiating device
CN100493317C (en) heat sink
TWI588437B (en) Heat dissipator and heat dissipating device
JP4998548B2 (en) Heat dissipation component
CN101739106A (en) Radiator optimally designed along with wind speed of flow field
TW201245942A (en) Heat sink
TWI325754B (en) Heat dissipation module
CN101344808B (en) Cooling module
CN100531539C (en) Heat radiating device
CN201159867Y (en) Extended internal memory protection sheet
TWI284500B (en) Heat sink
TW201318548A (en) Heat dissipation device
TW200908859A (en) Heat dissipation device
TWI296369B (en) Heat dissipation apparatus
JP4875454B2 (en) Heat sink with centrifugal fan for heat dissipation
TWI274540B (en) Heat sink
JP5181879B2 (en) Heat sink and heat dissipation system
CN103135720B (en) Radiating fin, radiator and manufacturing method of radiating fin
TWI354883B (en) Thermal module and heat sink used therein
TWI411385B (en) Heat sink and heat dissipation device using same
JP3140904U (en) Heat dissipation fin

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees