丄⑽〇25 九、發明說明： Γ發明所屬之技術領域】 本發明涉及-種散熱裝置，特 熱裝置及其製造方法。 梗電子兀件政 【先前技術】 高功率電子元件（例如，電腦cpu)在運行時會釋放 出大量之熱，而這些熱量若不能被有效散發之話，會使電 子凡件溫度迅速上升，容易導致電子元件之運行出現故障。 爲此，業界通常在電子元件上安裝一散埶 仏 元件進行散熱。常見之散熱器是採用銘播成型，其 f面與電子元件接觸之吸熱基座及複數從該吸熱基座頂面 ，延伸出來之散熱鰭片’吸熱基座吸收電子元件產生之 熱:，並將熱量傳遞給散熱籍片，以藉散熱韓片與空氣之 大量接觸面積來實現散熱。然而，隨著電子技術之發展， 電子元件之運行速度越來越快，相應地，其產生之熱量也 •，來越夕。上述散熱器之導熱基座由於單純採用銘製成， V…、率相對較低’使熱量無法快速之向遠離電子元件之位 置傳遞，而積聚在電子元件附近，而無法滿足電子元件之 散熱需求。 【發明内容】 馨於此有必要提供一種散熱效率較高之散熱裝置。 種政熱裝置’包括一柱狀導熱本體及複數從該導熱 tn周圍延伸出之散熱鰭片，所述導熱本體中嵌置有一熱 1326025 管，該熱管從所料熱本體之一端面朝另一端面彎曲延伸。 ' 種散熱裝置的製造方法，包括如下步驟： (A) 提供一散熱體，在該散熱體中形成一柱形孔； (B) 提供一導熱柱，在該導熱柱之側壁面形成一螺 旋形溝槽； μ (C) 提供一螺旋形熱管； (D )將所述螺旋形熱管旋入所述導熱柱的螺旋形溝 槽中； (Ε)將帶有所述螺旋形熱管的導熱柱嵌入所述散熱 體的柱形孔中。 上述散熱裝置與現有技術相比，由於在導熱本體中嵌 置有一彎曲延伸之熱管，使熱量能從導熱本體一端面快速 地傳遞到其他部位，從而減少熱量在電子元件附近聚積， 有利於提高散熱效率。 【實施方式】 圖1及圖2不出了本發明散熱裝置之一個實施例，該 散熱裝置可用於散發電腦CPU等高功率電子元件（未圖示） 産生之熱量，其包括一散熱體1〇、一嵌置在該散熱體1〇 中之導熱柱20以及一嵌置於該導熱柱2〇中之熱管3〇。導 熱柱20用於吸收電子元件產生之熱量，並將熱量傳遞給散 熱體10，由散熱體1〇將熱量散發到環境空氣中去。 政熱體10可採用導熱性能良好之材料（例如，銘）一 體成型，其包括一圓筒狀導熱筒.u及複數從該導熱筒n 1326025 之外側壁面呈放射狀延伸出來之散熱鰭片13，導熱筒U 之側壁圍成一圓柱形孔15,該圓柱形孔15之孔徑與導熱柱 20之直徑相適應，以供導熱柱2〇緊密地穿置其中。… 一同參照圖3可知，導熱柱2〇呈圓柱狀，其也採用導 熱性良好之材料製成，優選地，基於成本及重量之考慮而 採用鋁製成。當然，其也不排除採用鋁以外之材料（例如， 銅）製成。熱柱20底端形成有一用於與電子元件貼合之 吸熱面21，導熱柱20之侧壁面形成有一從底端螺旋延伸至 ►頂端之螺旋形溝槽23，以供嵌置熱管3〇，螺旋形溝槽幻 之斷面形狀根據熱管30之斷面形狀之不同而不同。當然， 導熱柱20並不局限於圓柱狀，其也可以呈其他形狀，例如， 圓錐狀、圓臺狀、橢圓柱狀等。 導熱柱20穿置於散熱體1〇之導熱筒11之圓柱形孔15 中’其侧壁面與導熱筒u之内壁面之間緊密配合（例如， 過盈配&)，而與導熱筒U結合成一圓柱狀導熱本體。導 熱柱20上之螺旋形溝槽23與導熱筒u之内侧壁面配合， 开> 成一用於容納熱管3〇之螺旋形通道。 需要說明的是，在一些實施例中，導熱柱20也可以與 導熱筒11 一體成型成一整體之導熱本體。在另一些實施例 中，也可以在導熱筒11之内側壁面形成螺旋形溝槽，而導 熱柱20上不形成螺旋形溝槽，或者兩者均形成有螺旋形溝 槽，來實現在導熱本體中形成螺旋形通道之目的。 熱官30可被預製成螺旋形構造（類似圓柱形彈菩之構 1326025 k )例如採用細長形熱管卷制而成。熱管3〇之斷面形 狀可以是圓形、橢圓形或矩形等，熱管30之尺寸與導熱柱 • 20上之螺旋形溝槽23之尺寸相適應，以便熱管3〇嵌置於 螺旋形溝槽23中時’與導熱柱2()緊密接觸，從而可以將 電子，件産生之熱量傳遞至導熱柱2G之中部及頂部，以加 速熱量在導熱柱2G上之均句分佈，從而提高散熱效率。優 選熱官30還與導熱筒u之内側壁面緊密接觸，以便 ，管30可同時將熱量傳遞給導熱筒u。另外，爲了增加熱 離s 30與電子％件之接觸面積’還將其底端進行扁平化處 理，而形成一吸熱面31，該吸熱面31與導熱柱20之吸埶 面21齊平。 … i述散熱裝置在組裝過程中，可以首先將螺旋形構 .之熱管30旋入導熱柱2〇之螺旋形溝槽23中並使熱管邛 之吸熱面31與導熱柱u之吸熱面齊平，再將帶有熱管％ 之導熱柱20插入導熱筒11之圓柱形孔15中。 _、可以理解的是’上述熱管3G並不局限於圓柱形螺旋構 造，根據導熱柱2G之形狀不同，其構造也可以發生變化， 例如，對應圓錐形導熱柱，其也可以預製成圓錐形螺旋構 造。另外，上述熱管30還可以是其他f曲之構造， 於上述導熱本體從底端面朝頂端面彎曲延伸，以實現埶旦 於導熱本體快速並均勻地分佈。 …、里 綜上所述，本發明符合發明專利要件 利申請。惟，以上所述者僅為太路^ 托出專 孰朵太空姑蔽 厅这者僅為本發明之較佳實施例，舉凡 …。本案技"之人士’在爰依本發明精神所作之等效修飾 下之申凊專利範圍内 或變化’皆應涵蓋於以 f圖式簡單說明】 圖1係本發明散熱裝置底部朝上時之組合圖。 圖2係圖1所示散熱裝置之分解圖。 圖3係圖2導熱柱之分解圖。 【主要元件符號說明】 散熱體 10 導熱筒 11 散熱鰭片 13 圓柱形孔 15 導熱柱 20 吸熱面 21 螺旋形溝槽 23 熱管 30丄(10)〇25 IX. Description of the Invention: TECHNICAL FIELD The present invention relates to a heat dissipating device, a special heat device and a method of manufacturing the same.梗电子兀件@前技术 High-power electronic components (such as computer cpu) will release a lot of heat during operation, and if this heat can not be effectively dissipated, the temperature of electronic parts will rise rapidly and easily This causes the operation of the electronic components to malfunction. To this end, the industry usually installs a heat sink on the electronic components to dissipate heat. The common heat sink is formed by in-situ molding, the heat-absorbing base of the f-plane contacting the electronic component and the plurality of heat-dissipating fins extending from the top surface of the heat-absorbing base absorb the heat generated by the electronic component: The heat is transferred to the heat sink to dissipate heat by the large contact area between the heat sink and the air. However, with the development of electronic technology, electronic components are running faster and faster, and accordingly, the heat generated by them is also coming to New Year's Eve. The heat-conducting base of the above-mentioned heat sink is made of purely inscription, V..., and the rate is relatively low, so that heat cannot be quickly transmitted to the position away from the electronic component, and accumulates in the vicinity of the electronic component, and cannot meet the heat-dissipation requirement of the electronic component. . SUMMARY OF THE INVENTION It is necessary to provide a heat dissipating device with high heat dissipation efficiency. The heat-generating device comprises a columnar heat-conducting body and a plurality of heat-dissipating fins extending from the heat-conducting tn, wherein the heat-conducting body is embedded with a heat 1326025 tube, the heat pipe is from one end face of the heat body to the other The end face is curved and extended. The manufacturing method of the heat dissipating device comprises the following steps: (A) providing a heat dissipating body, forming a cylindrical hole in the heat dissipating body; (B) providing a heat conducting column, forming a spiral shape on the side wall surface of the heat conducting column a groove; μ (C) providing a spiral heat pipe; (D) screwing the spiral heat pipe into the spiral groove of the heat conducting column; (Ε) embedding the heat conducting column with the spiral heat pipe The heat sink is in the cylindrical hole. Compared with the prior art, the heat dissipating device has a heat pipe bent and extended in the heat conducting body, so that heat can be quickly transferred from one end surface of the heat conducting body to other parts, thereby reducing heat accumulation in the vicinity of the electronic component, thereby improving heat dissipation. effectiveness. [Embodiment] Figs. 1 and 2 show an embodiment of a heat sink according to the present invention. The heat sink can be used to dissipate heat generated by a high-power electronic component (not shown) such as a computer CPU, and includes a heat sink. a heat conducting column 20 embedded in the heat sink body 1 and a heat pipe 3 嵌 embedded in the heat conducting column 2〇. The heat guiding column 20 is for absorbing heat generated by the electronic component and transferring the heat to the heat radiating body 10, and the heat radiating body 1 散 radiates heat to the ambient air. The thermal body 10 can be integrally formed by using a material having good thermal conductivity (for example, Ming), and includes a cylindrical heat-conducting cylinder, and a plurality of heat-dissipating fins 13 extending radially from the outer wall surface of the heat-conducting cylinder n 1326025. The side wall of the heat-conducting cylinder U is surrounded by a cylindrical hole 15 whose aperture is adapted to the diameter of the heat-conducting column 20 for the heat-conducting column 2 to be closely penetrated therein. Referring to Fig. 3 together, the heat conducting column 2 is cylindrical, and it is also made of a material having good heat conductivity, preferably made of aluminum based on cost and weight. Of course, it is not excluded to use a material other than aluminum (for example, copper). A heat absorbing surface 21 is formed on the bottom end of the heat column 20 for bonding with the electronic component. The side wall surface of the heat conducting column 20 is formed with a spiral groove 23 extending from the bottom end to the top end of the ► for arranging the heat pipe 3〇. The shape of the spiral groove phantom is different depending on the sectional shape of the heat pipe 30. Of course, the heat transfer column 20 is not limited to a cylindrical shape, and may have other shapes, for example, a conical shape, a truncated cone shape, an elliptical column shape, or the like. The heat conducting column 20 is disposed in the cylindrical hole 15 of the heat conducting tube 11 of the heat dissipating body 1 'the side wall surface thereof is closely matched with the inner wall surface of the heat conducting tube u (for example, interference fit &), and the heat conducting tube U Combined into a cylindrical heat-conducting body. The spiral groove 23 on the heat guiding column 20 is engaged with the inner wall surface of the heat conducting cylinder u, and is opened to form a spiral passage for accommodating the heat pipe 3〇. It should be noted that, in some embodiments, the heat conducting column 20 may also be integrally formed with the heat conducting tube 11 as an integral heat conducting body. In other embodiments, a spiral groove may be formed on the inner side wall surface of the heat conduction tube 11, and no spiral groove is formed on the heat conduction column 20, or both of them are formed with a spiral groove to realize the heat conduction body. The purpose of forming a spiral channel in the middle. The heat officer 30 can be prefabricated into a spiral structure (similar to a cylindrical structure 1326025 k), for example, rolled by an elongated heat pipe. The cross-sectional shape of the heat pipe 3〇 may be circular, elliptical or rectangular, and the size of the heat pipe 30 is adapted to the size of the spiral groove 23 on the heat conducting column 20 so that the heat pipe 3 is embedded in the spiral groove. At 23 o'clock, it is in close contact with the heat conducting column 2 (), so that the heat generated by the electrons and the parts can be transferred to the middle and the top of the heat conducting column 2G to accelerate the uniform distribution of heat on the heat conducting column 2G, thereby improving the heat dissipation efficiency. Preferably, the heat officer 30 is also in intimate contact with the inner side wall surface of the heat pipe u so that the tube 30 can simultaneously transfer heat to the heat pipe u. Further, in order to increase the contact area of the heat s 30 with the electron % member, the bottom end is flattened to form a heat absorbing surface 31 which is flush with the suction surface 21 of the heat transfer column 20. In the assembly process, the heat pipe 30 of the spiral structure can be first screwed into the spiral groove 23 of the heat conducting column 2, and the heat absorbing surface 31 of the heat pipe is flush with the heat absorbing surface of the heat conducting column u. Then, the heat conducting post 20 with the heat pipe % is inserted into the cylindrical hole 15 of the heat conducting cylinder 11. _, it can be understood that the above heat pipe 3G is not limited to the cylindrical spiral structure, and the structure may also vary according to the shape of the heat conducting column 2G. For example, corresponding to the conical heat conducting column, it may also be preformed into a conical shape. Spiral construction. In addition, the heat pipe 30 may be of another structure, and the heat conducting body is bent and extended from the bottom end surface toward the top end surface to realize rapid and uniform distribution of the heat conducting body. In summary, the present invention is in accordance with the application for the invention patent. However, the above-mentioned one is only a special way for the present invention, which is only a preferred embodiment of the present invention. In the scope of the claims of the present invention, the changes in the scope of the claims of the present invention should be included in the description of the f diagram. FIG. 1 is the bottom of the heat sink of the present invention. Combination diagram. Figure 2 is an exploded view of the heat sink shown in Figure 1. Figure 3 is an exploded view of the thermally conductive column of Figure 2. [Main component symbol description] Heat sink 10 Heat pipe 11 Heat sink fin 13 Cylindrical hole 15 Heat transfer column 20 Heat absorbing surface 21 Spiral groove 23 Heat pipe 30