TWI323247B - - Google Patents

Description

1323247 发明Invention Description: [Technical Field] The present invention relates to a method and a method for firing a ceramic plate, and more particularly to a laminated piezoelectric substrate for a piezoelectric actuator or a piezoelectric sensor. A method and a method for firing a piezoelectric ceramic plate such as a plate. [Prior Art] The first month ίι, as a ceramic with errors, is known as a piezoelectric ceramic with a titanic acid error and a titanic acid recording error. Moreover, the piezoelectric ceramic is applied to various products such as a ceramic vibrator, a Tauman wave, a piezoelectric buzzer, a piezoelectric sensor, and a piezoelectric actuator. In the piezoelectric ceramics used for such products, there are a substrate made of a piezoelectric material (piezoelectric ceramic plate) or a laminate in which a large amount of the substrate and the internal electrode layer are alternately laminated in recent years. Here, the general procedure for fabricating a piezoelectric ceramic will be briefly described. First, as a starting material, a pressed terracottine powder synthesized from a compound such as an oxide or a carbonate is purified. Then, a binder or the like is added to the dust powder to form a ceramic plate. The formed ceramic plate is subjected to a degreasing (degumming) treatment. π is further caused by firing the degreased ceramic plate to obtain a sintered body. By grinding and cutting the obtained sintered body into a specific size, the piezoelectric ceramic board is obtained. The laminated system of the piezoelectric ceramics is formed by firing on the surface, and the internal electrode layer is formed. The plurality of Tauman sheets of the electrode paste are overlapped and fired to obtain 0 rounds. The electric ceramics contain errors as described above, so that the lead evaporates when fired. Especially when firing at a high temperature of 900 c or more, the evaporation of lead is remarkable. In order to suppress the dispersal of lead, the degreased ceramic plate is usually loaded on 91939.doc5: benefit, and the clamp is placed in the sister basin of (4) for firing, and as another method for suppressing evapotranspiration of the wrong, Also the public ah 'emulsified new powder body 盥 positioning cry _ /, Yitong into the pot to burn. In recent years, the miniaturization of products using piezoelectric ceramics requires J-type and (four) chemical ceramics. The miniaturization of M electric ceramics can be achieved by (4) simple by cutting the sintering in a specific (four) block (four) row. In addition, the thinning of the surface piezoelectric ceramics has the following problems. #, By grinding the sintered body can achieve a certain degree of sound ^ ', the degree of privateness, but when grinding a thick sintered body: it takes a lot of effort to grind a thin sintered body, as long as a little pressure is applied during grinding, cracking occurs. . Therefore, in view of the use of a thin ceramic plate, it is desirable to obtain a sintered body which does not require grinding, but when it is fired into a thin ceramic plate, it is twisted due to sintering shrinkage to cause bending. This curved section of the square of the ceramic board is obvious. Therefore, when the piezoelectric ceramic is directly used without grinding, it is necessary to remove the large curved periphery 4, which results in a low yield and an increase in cost. For example, Japanese Patent Publication No. Sho 62-128973 (hereinafter referred to as "Triving Document"), Japanese Patent Laid-Open No. 1-282157 (hereinafter referred to as "Patent Document 2"), and Japanese Patent Laid-Open No. Hei 8-91944 (hereinafter referred to as A technique for suppressing bending of a sintered body is disclosed in Japanese Laid-Open Patent Publication No. Hei 10-324574 (hereinafter referred to as "Patent Document 4"). The technique disclosed in Patent Document 1 is a method in which the ceramic plate is pressed by a retainer on the molded body during sintering to suppress bending during firing. Patent Documents 2, 3 and 4 disclose a method of controlling the bending of a sintered body by a method of suppressing uneven heating, 91939.doc5 1323247. That is, the method disclosed in Patent Document 2 is to form an unprocessed ceramic plate by adding an organic binder or the like to the ceramic material, and then place the unprocessed ceramic plate on the positioner to make the unprocessed ceramic plate as a whole. It is surrounded by a ceramic frame containing the same material as the locator, namely, oxidized crystal system, mullite system, etc., and placed in a suitable heating furnace to perform degumming and firing of the unprocessed ceramic plate. In order to reduce the bending of the ceramic plate. Patent Document 3 discloses that the gap between the ceramic plate and the positioner on the ceramic plate is reduced by dense magnesium oxide or densely oxidized ceramic Pffij sheet to control unevenness of the size of the ceramic plate due to firing. And the technique of bending amount 0. In the firing method disclosed in Patent Document 4, the locator is placed on the lower side of the locator in a direction opposite to the locator, and the struts having the same contraction characteristics as the slab The upper positioner on the side locator on the side locator forms a gap between the Tao slab and the upper locator at a certain interval. When the firing is performed in this state, the pillars are also shrunk together with the ceramic plate, so that a specific space between the ceramic plate and the upper positioner can be maintained. Problems to be Solved by the Invention However, the aforementioned prior art ceramic board firing method has the following problems. That is, in the technique disclosed in Patent Document 1, since the locator is forced to slap the board, the rupture of the slab is caused by the weight of the slab, and when the sintering speed of the struts is uneven, a sintered body having a poor shape is produced. . In the prior art method disclosed in Patent Document 2, since the following problems occur due to the material of the (four) plate, it is sometimes impossible to eliminate the bending or deformation of the substrate 91939.doc5 1323247. That is, after the degumming treatment of the unprocessed ceramic plate, it is desired that all of the binder or solvent in the unprocessed ceramic plate is removed. However, a part of the binder is actually left as a carbon component in the unprocessed ceramic plate. This residual carbon gasification occurs in the subsequent step, i.e., firing of the unprocessed ceramic plate, at which time the oxide in the unprocessed ceramic plate is reduced. At this time, depending on the element, evaporation occurs during the reduction, so that the unprocessed ceramic plate is detached, and as a result, a part of the substrate composition is different from the desired one. Such a problem is particularly remarkable when, for example, ZnO is contained in an unprocessed ceramic plate, which is a cause of bending or the like of the substrate. Also, in the gas generated at the time of the win, the gas escaping property generated on the back surface of the unprocessed ceramic plate (the surface on the locator side) is deteriorated, so when the unprocessed ceramic plate is thin and small, the unprocessed ceramic plate is more than The positioner is more bulged and deflected, so that the unprocessed ceramic plate is detached from the locator or the back of the unprocessed ceramic plate is scratched or deformed. Further, in the firing method disclosed in Patent Documents 2 and 3, since the wrong environment around the inside of the Tauman plate and the surrounding of the Tauman plate cannot be maintained, the sintered body φ is bent. In the firing method disclosed in Japanese Patent Publication No. 4, since the peripheral portion of the ceramic plate between the orientation and the positioner is open, the ceramic plate and the upper positioner are not maintained during the firing process. The gas concentration is uniform, the shrinkage of the ceramic plate is uneven due to different positions, and the ceramic plate after firing may be bent or deformed. The thinner the thickness of the ceramic plate, the more significant this problem is. With the firing of the ceramic plate, a plurality of support members of the support positioner 91939.doc5 column components produce sintering shrinkage. However, it is difficult to properly control the shrinkage of the column members. When the loading is as follows, the support member of the support clamp is more difficult to control due to its support of a plurality of positioners. In this way, a positioner supported by a plurality of strut members is caused to cause tilting, and the positioner is brought into contact with the Tauman plate. When the locator disk 2! plate is fired in the contact state, the sintered body obtained by firing the terracotta plate will be attached to the positioning + 达#, and the sintered body self-locating device When peeling, it will cause damage and poor shape. Therefore, it is not suitable for use as a sintered body for use in piezoelectric ceramic products. [Summary of the Invention] Therefore, in such a situation, the purpose of the moon is to provide a ceramic plate firing method that produces a sturdy, raw test or deformation on a ceramic plate after the firing, 2 control bending, etc. At the same time, when the anti-party is in contact with the ceramic plate, the position of the ceramic plate is in contact with the ceramic plate, and the bending of the ceramic plate is reduced... and 3 does reduce the production of ceramics, and prevents the ceramic plate from being generated relative to the positioner during processing. A method of manufacturing an offset ceramic plate. In order to achieve the above object 7, the method for firing a ceramic plate according to the present invention is a method for firing a ceramic plate in which a ceramic plate is placed between a first holding member and a second holding member, and is characterized in that By 盥^, . . / /, the surrounding member formed of a ceramic material having substantially the same composition, „ surrounding the surrounding portion of the ceramic plate between the first holding member and the second holding member, firing the pottery Seesaw. In the method for firing a ceramic plate, the peripheral portion of the ceramic plate between the first holding member and the second holding member is surrounded by a surrounding member formed of a material of ceramic material 39093.doc5 1323247 which is substantially the same as the composition of the ceramic plate. The ambient concentration of the ceramic plate can be kept uniform during the firing process. Therefore, the shrinkage of the ceramic plate produced by the firing can be made uniform, and the ceramic plate after firing can be prevented from being bent or deformed. Further, the ceramic board may of course be a single board of an unprocessed ceramic board, and also means a sheet-like laminated body formed by laminating a plurality of unprocessed ceramic sheets, and also including an unprocessed ceramic board as a substrate to form an electrode. In the case of a turtle, the method of firing a ceramic plate of the present invention is particularly effective when a ceramic material for forming a ceramic plate contains a compound containing a wrong compound. The lead in the lead metal titanate or the titanate wrong compound is easy to evaporate due to firing, but the surrounding member is formed by the ceramic material which is substantially the same as the composition of the ceramic board, so that it is equipped with Tao Jingban. In the environment, the error in the wrong compound is released from the surrounding member. Borrow == The ship with the wrong compound evaporates from the pottery plate, and can maintain the wrong concentration in the environment of the match, and keep the sentence during the firing process. Therefore, it is possible to determine from the i(4) of the ceramic plate produced by the firing, and to prevent the plate from being bent or deformed after the firing. Further, it is preferable that the ceramic plate is placed between the second member and the second holding member to have a gap equal to or less than the thickness of the second holding member and the second holding member. Promote the gap below the thickness of the pottery board, and this can be step-in-step to suppress the stiffness evenly, because the surrounding part is better to have the two; 4: or (4). Degree. So strong 1 ^ ^ thickness of the porcelain plate The same high-environment of the pottery board is thicker than the above-mentioned phase @, which can promote the configuration...the uniformity of the Chen's further step-by-step inhibition of the ceramic board 9i939.doc5 a, speech or deformation. Further, when the second holding member is brought close to the ceramic plate, the surrounding is not hindered. Therefore, it is particularly effective when the gap between the ceramic plate and the second holding portion is set to be less than or equal to the thickness of the ceramic plate. Set to the distance between the board and the surrounding parts of the Taobao board, the adjustable plate can be adjusted to suppress the occurrence of the test or deformation of the pottery according to the thickness or composition of the pottery board. 2You 1' pottery Preferably, the surrounding portion of the competition plate is provided with a gap for holding the first holding member disk retaining member A plurality of spacers are arranged between the adjacent spacers: the size of the components can be kept small and space is saved by the arrangement of the surrounding members between adjacent spacers. The material is taken out, and the surrounding part is better formed by the remaining part of the ceramic material after the ceramic board. The original material of the pottery material = the board of the ceramic board or the layer of the unprocessed pottery board, etc. When the method of measuring holes and other methods is taken out, if the original plate group is used, it is possible to efficiently form the ceramics that contain the materials that are often used as waste materials: and the remaining cost of the material due to the use of the waiving plate. In part, the method of firing the ceramics can be reduced to have the purpose 2, and the plurality of ceramics and plates of the present invention are fired in a plurality of branches: the ceramic plate is placed on the first heart, and the firing process is lower than the firing process. The height height before the firing process of the ceramic board is higher than the height of the piece and after the firing process, the step of the spacer of the height of the Tauman plate; 91939.doc5 1323247 on the plurality of pillar members Step of loading the second positioner covering the ceramic plate and the spacer a step of firing a ceramic plate between the first and second positioners. In the ceramic plate firing method, a ceramic plate is placed on the spacer in the i-th device and the second clamp. The state between the two is fired. Further, the height of the spacer after the firing process is higher than the height of the ceramic plate subjected to the firing process. Therefore, for example, a plurality of pillar members are shrunk during the firing process. τ I7, when the pillar members are contracted and the second positioner is tilted, because of the interval - at least part of the tablet holder, it is possible to effectively suppress the contact between the third and the ceramic plates. In addition, the ceramic plate includes not only a ceramic plate, but also a ceramic plate in which a plurality of ceramic plates are laminated with electrodes, etc. A plurality of spacers are preferably placed on the surface locator. At this time, the contact between the 2 positioner and the ceramic plate can be more reliably suppressed. Further, it is preferably a plurality of times of the firing process. In the sintering process, even if the pillar members are: = degree (four). The ancient 谇, - λ / thousand all the return is lower than the ceramic plate: = can effectively inhibit the second locator 2: the spacer is better placed in the position of the ceramic slab, when the Tao is deflated Directional extension 'The two spacers are preferably arranged in the longitudinal direction of the pottery board in the manner of sandwiching the ceramic plates. Tao finished board is better for the height of the wrong 91939.doc5. At this time, it can be burned: =: The high-13-position of the second positioner in the firing process is as close as possible to the gap between the pottery and the pottery: the position can make the second positioning, thus achieving The ambient temperature of the ceramic plate and the environment are both in the process of firing. Circumference: When the board is examined, it is preferable to "burn the ceramic board" by surrounding it with the surrounding member. At this time, the temperature and the environment around the potting board during the firing process can be uniformized. = It is further included in the second positioner on the ceramic board =: the pillar member and the spacer, and the step of refilling the stone on the pillar member is repeated. After repeating this step, the plurality of firings are performed. Since a plurality of ceramic plates are fired once, the heavy-duty = segment positioner has a large load on the pillar members located below, so that it is easy to produce more shrinkage than the amount of the wire on such pillar members. The above conditions are mentioned between the two devices, but due to the _ piece between the two positioners, it is possible to effectively suppress the shrinkage characteristics of the ceramic plate and the L-pillar member from the firing process and the ceramic plate 2 The same material is formed. At this time, the contraction of the strut member follows the contraction behavior of m in the 21st degree of privacy, so that the distance between the pottery board and the stolen thief can be kept to a certain extent, and the state is performed in this state. Tao: bit::cheng: therefore, by virtue Before the firing process, the ceramic plate is close to the second circumference and the spear king degree, which can effectively make the surrounding area/dishness and environment of the pottery board in the firing process uniform. The material of the same material of the board constitutes % 'the contraction behavior of the pillar part and the L of the board is about a 91939.doc5 •14· 1323247

夂 l ra lL 匕' can effectively achieve the uniform temperature and environment of the ceramic plate during the firing process. Further, in order to achieve the above object, the method for producing a ceramic plate according to the present invention is a method for producing a ceramic plate by firing a raw ceramic plate, and is characterized by the following steps: preparing a surface having a concave-convex portion for material escape In the step of the surface, the concave and convex portions for the material escape are used to escape from the unprocessed ceramic plate when the unprocessed ceramic plate is heated under the condition that the unprocessed ceramic plate is placed, and the binder is contained. The step of forming the unprocessed ceramic plate; placing the unprocessed ceramic plate on the mounting surface of the positioner to perform the step of degumming the unprocessed ceramic plate; and placing the unprocessed ceramic plate on the positioner after degumming the unprocessed ceramic plate The step of firing the unprocessed ceramic plate is carried out as it is on the mounting surface. In this way, the degumming and burning of the unreinforced ceramic plate is performed by using the positioner ' having the uneven portion for material escape formed on the mounting surface, and the unprocessed ceramic plate is placed on the mounting surface of the position@@ In the upper state, the contact area between the positioner and the unprocessed ceramic board becomes smaller. Therefore, in the untwisting step of the unguarded ceramic board, the burning ash of the adhesive is easily escaped from the back surface of the unprocessed ceramic board (the side of the side of the positioner), that is, the degumming property is good. Therefore, the carbon content remaining in the unprocessed ceramic plate after the knee is removed is reduced. Thereby, in the firing step of the unprocessed ceramic plate, the evaporation of the element due to the reduction of the oxide in the unreinforced ceramic plate can be suppressed during the vaporization of the residual carbon. Thereby, the composition uniformity of the material obtained by the firing is improved, so that the bending of the (four) plate or the like can be surely alleviated. In addition, in the degumming step of the unprocessed ceramic plate, the escape property of the gas generated on the back surface of the unprocessed ceramic plate is improved by the uneven portion for material escape, thereby suppressing the unprocessed ceramic plate from the locator The situation. Furthermore, 91939.doc5 'When the unprocessed pottery plate is loaded with the unprocessed pottery plate, the unprocessed pottery board is fired in the closed furnace. 'The embossing part for the material escape makes the positioner and the non-worker The difference in heating speed is reduced, so that the gas existing in the furnace can be prevented from being caught on the back surface of the unprocessed ceramic plate to cause the unprocessed ceramic plate to bulge from the positioner 4, and the unheated m can be prevented from being degummed and burned. At the time of the formation, the unmachined ceramic plate is offset with respect to the positioner. As the positioner, it is preferable to use a concavo-convex portion for escaping the object f which has a center line average roughness Ra of the mounting surface of 1 to 2 G. By forming the uneven portion for the material escape due to the mounting surface of the positioner, the burning ash or gas generated by the adhesive of the unprocessed ceramic plate can be effectively escaped from the positioner side. X ′ prevents the shape of the uneven portion of the material from being escaping when the unprocessed ceramic plate is fired, and is transferred to the back of the unprocessed ceramic plate. Therefore, when the ceramic board obtained by firing is commercialized, it is not necessary to perform mechanical processing on the ceramic board. At this time, it is also possible to carry out the step of including no mechanical processing for the ceramic plate obtained by firing the unprocessed Tauman plate, and forming an external electrode on the ceramic plate, such as itb forming an outer electrode on the Tauman plate. At the time, & it is necessary to grind the ceramic board, so that the manufacturing process of the ceramic board can be simplified. Further, as the positioner, it is preferable to use a positioner made of a mold having a concavo-convex shape for forming a concave-convex portion for material escape. Thereby, it is easier and cheaper to manufacture the positioner having the uneven portion by comparison with the case where the locating surface of the locator is honed by, for example, blasting or grinding. Further, it is not necessary to mechanically process the positioner as in the case of blast processing, so that the positioning benefit can be maintained to the strength, and no machining chips or the like remains on the mounting surface of the positioner 91939.doc5 -16 - 1323247. Further, the unprocessed ceramic plate is preferably formed of a lead-containing material, and the locator carrying the unprocessed ceramic plate is placed in a sealed furnace, and the unprocessed ceramic plate is fired. Thereby, the piezoelectric ceramic board with errors can be easily obtained. Further, by burning a raw ceramic plate in a closed furnace, evaporation of lead can be suppressed. [Embodiment] As described above, according to the method for firing a ceramic plate of the present invention, it is possible to prevent bending or deformation of the ceramic plate after firing, and to prevent the positioner from coming into contact with the ceramic plate during firing. . Further, according to the method for producing a ceramic plate of the present invention, the dicing device having the mounting surface on which the uneven portion for material escape is formed is used for degumming and firing the unprocessed ceramic plate, and the uneven portion for escaping the substance is used for The material generated when the unprocessed ceramic plate is heated in the state where the unprocessed ceramic plate is placed is escaping from no m, so that the bending or deformation of the Tauman plate can be reduced, and the ceramic board can be prevented during the treatment (not The machining of the Tauman plate) produces an offset relative to the positioner. Hereinafter, a suitable embodiment of the method for firing the ceramic board of the present invention and the method for producing the manuscript plate will be described in detail with reference to the drawings. First Embodiment First, the first embodiment of the present invention will be described with reference to Figs. 1 to 3, as shown in Figs. 1 and 2, and a] is 〇〇mmx 1〇. A gasification umbrella positioner (first holding member}1 is placed on the square of the compactness of the square of 〇min (the porosity is 3% or less, more preferably, the porosity is 1% or less), and the ceramic plate 2 is placed. The hammer positioner is more stable than the female 91939.doc5 -17- 1323247, which is 8 mol%~12 mol% of oxidized (Υ2〇3) and is completely stabilized because of its low reactivity with the ceramic plate 2 during the firing process. And the durability is good. In addition, the ceramic board 2 is a piezoelectric Taoman containing titanic acid recording acid (more details is 巧丁丨〇3 _ PbZr〇3-Pb(Mg丨η NbWO3-Pb(Zn"3 A veneer formed of Nb2/3) 43, which is a piezoelectric ceramic) is produced in the following manner. That is, the material in the form of oxide or carbonate is wet-mixed by a ball mill, and mixed to 95 (TC). The pseudo-baking is performed. The material after the pseudo-baking is wet-pulverized using a ball mill to prepare a piezoelectric ceramic powder. Then, a binder is added to the piezoelectric ceramic powder. Or a solvent or the like to be slurried, and formed into an unreinforced ceramic plate (Taojing raw material) having a thickness of 0.15 mm by extrusion molding. The unprocessed ceramic plate is extruded and cut to obtain "8〇mmx8〇". a claw-shaped, thin-plate-shaped ceramic plate 2 having a thickness of 0.15 mm". The ceramic plate 2 thus produced is placed in the center of the lead oxide locator, and the four corners of the blank portion of the oxidized misaligner 1JL formed thereby are carried. A spacer 3 having a height of 〇.3 〇 mm is placed. Further, a rod-shaped surrounding member 4 is placed between the adjacent spacers 3 and 3 on the oxidized misalignment device. At this time, the *root surrounding member 4 is respectively The four sides 2a of the ceramic board 2 are separated by a fixed distance. Thus, by arranging the package member 4 between the adjacent spacers 3 and 3, the size of the oxygen: misplacement thief 1 can be reduced. The spacer 3 is preferably made of the same material as the oxidized misalignment device 1 but may be made of a material such as an oxide or an oxidized lock. The shape of the spacer 2 is not limited to a prismatic shape, and may be, for example, a cylindrical shape. Each of the surrounding members 4 is made of the unprocessed ceramic board in the production of the above-mentioned ceramic board 2 The remainder is formed by the knife, and the oxidization error locator (2,91939, doc5 -18-1323247) holding the same shape as the oxidation fault locator 1 is placed on the oxidant leveler. On the opposite side of the spacer 3, the dream of 'the top of the 2nd board of the ceramic board 2 and the lower side of the oxidization error ^ ^ between the gaps of the gap of 0.1 5 mm S. Second two: Chengzhi burned The unit is stored in the closed bowl 7 as shown in Fig. 3. In addition, the pottery (10) is reacted to obtain a _ fired body. The firing temperature is 1 war and the stabilization time is 2 hours. Window: Before the firing of the ceramic board 2, the Tao Jing board 1 and each of the surrounding components 4 are placed in the state of the above-mentioned specific position on the (1) device 1 of the force oxygen, and the second: 〇... Debonding of the plate 1 and each of the surrounding members 4. In the method of firing a ceramic board according to the first embodiment, the surrounding portion (surrounding space) of the pottery board 2 between the oxidation misalignment holders 5 is composed of the same ceramic board 2 The surrounding member 4 of the pottery (10) material is surrounded, and therefore, the gap S between the potting member 2 and the oxidized misaligner 5 is released from each of the surrounding members 4 to make a mistake. Thereby, the wrong evaporation of the wrong state of the material sheet 2 can be suppressed, and the concentration of the intermediate (four) can be kept constant during the firing. Therefore, the shrinkage of the ceramic plate 2 due to the firing can be made uniform, and the ceramic plate 2 after the firing can be prevented from being bent or deformed. Then, when the interval of the gap S is set to be less than or equal to the thickness of the Tao Jing board 2, it can be found from the next experimental result that the degree of curvature of the ceramic board 2 after firing is extremely small. The main reason for this is that the interval between the gaps s is set to be equal to or less than the thickness of the ceramic plate 2, and when the firing is performed, the error concentration in the gap s can be promoted. f first' is set as the interval of the gap s as described above as the thickness of the 〇15_b ceramic plate ^7, and the f curve 1 is 15.7 _, and further, the interval of the gap $ is set to 〇·10 faces ( <When the thickness of the board 2), the amount of bending is 15.5 (four). In contrast to this 91939.doc5 1323247, when the interval of the gap S is set to 0.30 mm (> the thickness of the ceramic plate 2), the amount of bending is 95.5 μm. Thus, setting the interval of the gap S to be less than the thickness of the ceramic plate 2 can control the amount of bending to about one-sixth. Here, the amount of the test piece is the maximum height difference of the ceramic plate 2 measured by the laser type non-contact three-dimensional shape measuring device, and is an average value of 100 ceramic plates 2. When the interval of the gap S is set to be less than 0.1 〇 mm, it is found that the square shape of the ceramic plate 2 is skewed into a trapezoidal shape or a parallelogram, or the ceramic plate 2 tends to be cracked or defective. Therefore, it is preferable to set the interval of the gap s to be larger than 〇.1〇 mm. Further, when a dense zirconia retainer was replaced and a porous zirconia retainer having a porosity of about 15% was used, it was found that the amount of bending tends to increase. Further, in the method for firing a ceramic plate according to the first embodiment, the height of the surrounding member 4 is substantially the same as the thickness of the ceramic plate 2. Therefore, when the height of the spacer 3 is adjusted so that the cerium oxide locator 5 approaches the ceramic plate 2, The surrounding member 4 does not become an obstacle. Since the respective surrounding members 4 are spaced apart from the side faces 2a of the ceramic sheets 2, the lead concentration in the gap S on the ceramic sheets 2 can be made uniform. And by adjusting the distance between the side 2a of the ceramic plate 2 and the surrounding member 4, the bending or the good shape in the ceramic plate 2 can be suppressed according to the thickness or composition of the ceramic plate 2, thereby adjusting the gap. The concentration of lead in S. Further, since the surrounding member 4 is the remaining portion of the unprocessed ceramic plate after the ceramic plate 2 is cut out, it can be efficiently formed to contain 4° of the component (4) and (4) which are composed of the ceramic plate 2 and 'because the material often becomes waste The remaining part of the slabs of the slabs, so that the cost of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs is reduced. Second Embodiment Next, a second embodiment of the present invention will be described with reference to Figs. 2 to 5 '. In the firing method of the ceramic plate of the first known method, the layered body of the ceramic plate which forms the electrode is used as the Taoshen plate 2 system. This ceramic board is formed into a rectangular thin plate shape which is formed by laminating a body (ceramic material) of a raw ceramic plate which has been subjected to a stamping process, and is formed into a "33 mm x 12, thickness 〇 still surface". Further, the ceramic sheet 2 is fired in the following manner, and then subjected to a polarization treatment or the like to form a laminated piezoelectric element. As shown in Fig. 4 and Fig. 5, 10 ceramic plates 2 cut out from the laminated body of the unprocessed ceramic plate are placed on the yttrium oxide locator ,, and the central portion of the yttrium oxide locator i is arranged in 2 columns. A matrix of 5 rows. Further, the four rod-shaped surrounding members 4 are placed on the oxidation misalignment positioner ljL so as to surround the peripheral portion of the collection of the ceramic plates 2. Further, a spacer 3.75 mmi spacer 3 was placed on the four corners of the blank portion of the yttrium oxide locator. Further, each of the surrounding members 4 is formed by cutting out the remaining portion of the laminated body of the unprocessed ceramic plate of the ceramics. Then, the ruthenium oxide locator 5 having the same shape as the yttrium oxide locator 1 is placed on the spacer 3 so as to face the yttrium oxide locator. Thereby, a gap S of 0.375 mm is formed between the upper surface 2b of each ceramic plate 2 and the lower surface 5a of the yttrium oxide positioner 5. The firing unit 100 having the above-described structure is degreased at a temperature of 35 〇t, and then stored in the sealed bowl 7 in the same manner as in the above-described first embodiment, and the ceramic plate 2 is subjected to a sintering reaction to obtain a firing of the ceramic plate 2. body. In addition, the firing temperature was 11 〇〇. Oh, the stabilization time is 2 hours. 91939.doc5 1323247 In the method of firing a ceramic plate according to the second embodiment, as in the first embodiment, the peripheral portion of each of the ceramic plates 2 between the yttrium oxide locators 1, 5 and the ceramic plate 2 is included. Since the surrounding members 4 of the ceramic material having substantially the same composition are surrounded by each other, the shrinkage of each of the ceramic sheets 2 due to the firing can be made uniform, and the ceramic sheets 2 after the firing are prevented from being bent or deformed. Next, the experimental results of the experiment similar to the first embodiment are as follows. First, when the interval of the gap S is set to 〇·375 mm (=the thickness of the ceramic plate 2) as described above, the amount of bending is 13.5 (four), and the interval of the gap 8 is set to 〇1 〇 mm ( When the thickness of the ceramic plate 2 is used, the amount of bending is. On the other hand, when the interval of the gap S is set to 〇.825 mm (> the thickness of the ceramic board 2), the amount of bending is 92.6 (four). In this way, when the interval between the (4) is set to (4) the thickness of the panel 2 is less than or equal to the thickness of the panel 2, the amount of warpage can be controlled to about one-seventh or less. For example, in the i-th π...丄, it is necessary to form a material that is substantially the same as the composition of the ceramic plate. (4) The ceramic raw material behind the porcelain plate Tao Jing board:: Ran reach = the ceramic material is composed to form the surrounding part and the case of the same or better = the same composition of the ceramic material, with a plurality of surrounding parts :Γ可可: The surrounding part of the ring surrounds the surrounding area of the ceramic board: Department: (4) 'But also the south of the ceramic plate and the thickness of the ceramic plate. Moreover, the height of the surrounding parts is less than that of the ceramic plate. (For example, the surrounding portion is bent or deformed. It is possible to prevent the ceramic plate after firing from being produced, and as shown in Fig. 6, the first embodiment or the second embodiment may be 9l939.doc5 22 Ϊ5252ΑΊ firing a single 70 A plurality of layers (for example, one-stage) are stacked in a closed bowl, and a plurality of ceramic sheets are fired at the same time. Further, as a positioner (i and the second holding member), it is not only the first The material used in the first embodiment and the second embodiment may be one which is excellent in enamel quality, low in reactivity with a ceramic plate during firing, and excellent in durability. The third embodiment is described below with reference to FIG. Figure U is a view showing a third embodiment of the present invention. As shown in Fig. 7 (4), the sound is placed at a substantially central position of the square flat-shaped positioner. The positioner 1 is a fully stabilized oxidized hammer with —1% yttrium oxide (γ2〇3) added thereto. The locator has a porosity of about 3% or less, but the porosity is more preferably 1% or less. The ceramic plate 12 is made of a piezoelectric film containing lead titanate citrate PbTl°3 'PbZr〇3 ' The composition of Pb(M^-Nb2/3)03a^Pb(Zni/3Nb2;;)〇3 is a rectangular thin plate-shaped veneer formed by piezoelectric phantom, and the method disclosed in the first solid mode The same method is used. Then, as shown in Fig. 7(b), the pillar member 14 is placed at the four corners of the positioner 10. The pillar member is made of the same material as the above m12 and is the same as the ceramic sheet 12. The uncut (four) plate is cut out. The support member 14 has a square column shape and extends to the positioner: the direction is extended. Thus, when the pillar member 14 is tied with the Tao Jing board When it is composed of the same material, the ceramics as described later are: (4) fired. Main, the shrinkage behavior of the pillar member 14 and the shrinkage behavior of the plate 12 The material of the other 'pillar member 14 is not necessarily the same as that of the ceramic board 12, and 91939.doc5 • 23· U23247 can be selected, for example, from other materials having the same or the same shrinkage characteristics as the H-sheet 12. As shown in Fig. 7(c), four spacers 16 are placed around the ceramic plate on the positioner 1 更. More specifically, the position is close to each side of the ceramic plate 12, and the sides are The spacers 16 are respectively placed at corresponding positions in the central portion. The heights of the four spacers 16 are the same, the height of the spacers 16 is lower than the height of the pillars, and the height of the spacers 16 is higher than that of the spacers as described later. (4) The height of the ceramic board 12 . Further, the spacer 16 is made of the same material as the above-described positioner 10, and has a square column shape having a square cross section. Then, the ceramic plate 12, the strut members 14, and the spacers 16 are placed on the positioner 10, and then heated to the front and rear of the crests, and the detachment of the ceramic plates 12 and the pillar members 14 is performed. The above is a step of placing the ceramic plate, the pillar member, and the spacer in the order of the spacer, and the order of the placement may be appropriately changed. After the degreasing treatment, as shown in Fig. 7 (d), the locator 10 in which the ceramic board 12, the strut member 14, and the spacer 准备 are prepared in the same manner as described above is placed on the strut member 14. The ceramic board 12 and the spacer 16 disposed on the lower positioner 1 are covered by the positioner 1G. Further, the positioner 1 in which the ceramic plate 12, the strut member 14, and the spacer 16 are disposed is repeatedly loaded a plurality of times by the post member 14, and the multi-stage laminated positioner 20 as shown in Fig. 7 (4) is obtained. Further, the multi-layered buildup locator 2 is placed in a crucible bowl as shown in Fig. 8 to carry out a baking treatment. Fig. 8 is a view showing a state in which the multi-stage laminated positioner 2 is fired. The bowl 22 is formed by the housing portion 22a and the lid portion 22b which are open at the top, 91939.doc5 • 24· 1323247. Then, the multi-layered buildup locator 20 is placed in the M body portion, and the portion (10) is covered and sealed, and the multi-stage laminated locator 2 is heated and fired from the outside of the bowl. The firing conditions at this time can be appropriately selected from the well-known conditions for firing the shim. ~ Gas Next, the state of the positioner 1〇, the pottery plate 12 column member Μ, and the spacer 16 in the firing process will be described with reference to Fig. 9 . Fig. 9 is a view showing the state of each element in the firing process. In addition, as shown in FIG. 3, in order to simplify the description, the entirety of the multi-segment layer locator 20 is not shown, but only two pieces of positioning _, ι 〇, and the positioner 1(), 1G between them are shown. For convenience of description, between the two positioners 10, 10, the upper positioner is referred to as the upper positioner 10A, and the lower side positioner 10 is referred to as the lower positioner 1B. First, in the state before the firing process (see Fig. 9 (a)), the height of the four pillar members 14 supporting the upper locator 10A is the highest. Further, the height of the spacer 16 is lower than the height of the ceramic board 12, and the ceramic board 12 is close to the upper positioner 10A. Thus, when the ceramic plate 12 is close to the upper positioner 10A, and the distance d between the ceramic plate 12 and the upper positioner i〇a is set to be small, the ambient temperature of the ceramic plate i2 during the firing process and the self-ceramic plate can be made. The environment of 12 evaporated lead is effectively homogenized', so that the bending of the ceramic plate 2 which is easily generated during the firing process can be suppressed. Then, when the firing of the ceramic plate 12 is started, the ceramic plate 12 and the pillar member 14 start to shrink with sintering. Further, since the spacer 16 is identical to the material of the locator 10 as described above, no substantial shrinkage occurs. Therefore, when the contraction of the column member 14 proceeds to a certain extent, the height of the column member 丨4 and the spacer 16 becomes the same, and is higher than the height of the ceramic plate 12 (refer to Fig. 9(b)). Further, as described above, the strut members 14 and the ceramic sheets 12 are cut out from the same unprocessed pottery plate 91939.doc5 - 25 - 1323247, so that the contraction behavior of the strut members 14 is consistent with the contraction behavior of the ceramic sheets 12. Therefore, a slight distance d can be maintained between the ceramic plate 12 and the upper positioner 1A, and the ambient temperature of the ceramic plate 12 and the environment of the lead evaporated from the ceramic plate 12 can be effectively uniformized. Further, when the pillar member 14 is contracted, the spacer 16 is replaced with the pillar member 14 and referred to Fig. 9 (4). Thereafter, the sintering shrinkage of the ceramic plate 12 and the strut member 丨4 is still performed, but the height of the upper positioner i〇a does not change until the end of the sintering process. As described in detail above, in the method of firing the fourth plate 12 of the present embodiment, the spacer 16 is placed on the positioner H. This spacer is used to replace the contracted pillar member I4 branch locator 10 during the firing of the panel 12. Therefore, even if the contraction behavior of the four pillar members 14 is uneven, when the spacer 16 is used to support the positioner 10 in place of the pillar member 14, it does maintain the upper positioner 10A and the lower positioner 1〇B. Therefore, in the firing process, it is possible to effectively suppress the upper positioner 1〇A downward positioner_the tilt position device is in contact with the ceramic board 12. This makes it possible to increase the yield of the piezoelectric ceramic obtained by the ceramics. In particular, the multi-segment positioning test 2 "the upper load is larger. Therefore, it is easy to = the T side... the component produces the contract member 14 which shrinks more than the pre-phase. At this time, the effect of the above-mentioned W is more "more" In the embodiment, the four spacers 16 are disposed around the pottery 12, and the slabs of the ceramic sheet are evenly increased or decreased. At least part of the thief, so when 91939.doc5 -26- can effectively inhibit the upper locator and the ceramic plate contact. In addition, in the upper embodiment, the plurality of spacers 16 are the same height In the same way, even if the plurality of spacers are different, because they are in the middle of the firing process, the sheet can support at least part of the upper positioner, thereby effectively preventing the upper clamp from contacting the ceramic plate. Further, the height of the spacer that has passed through the firing process is not necessarily higher than the height of the pillar member 14 after firing, and may be the same as or lower than the pillar member 14 after firing. At the end, the spacer is not supported. The positioner, however, can be prevented by disposing such a spacer on the lower positioner even if it causes the upper positioner to come into contact with the ceramic plate. In the embodiment as described above, , which is a spacer which does not cause substantial shrinkage, but can also be used for the spacer which produces shrinkage during the firing process, and the height before the firing process is lower than the south of the pillar member before the firing process. 'And if the height after the firing process is higher than the height of the ceramic plate after the firing process>>: and, as shown in FIG. 10, it is also possible to place a plurality of ceramic plates 12 on the i-plate state 10 The pattern of the plurality of ceramic plates 12 can be fired in a plurality of times. Fig. 10 is a view showing a positioner which is different from the above embodiment. In the aspect shown in Fig. 1A, the 1 positioner 1 ( On the other hand, the Tao competition board 12 is arranged at intervals of 5 lines every 2 sheets, and each line is provided with 3 spacer sheets _ to hold 2 pieces of Tao competition board, that is, '3 spacer sheets 16 along the longitudinal direction of the Tauman board 12 Direction (X direction in the figure) and arranged in the middle position of the two pieces of the ceramic board 12, one between the sheets 16 and Each of the ceramic plates 12 is disposed at a relative position, and 91939.doc5 -27- and 'the three spacers 16 are arranged in five groups along the parallel direction of the ceramic plates 12 (the γ direction in the figure). As shown in the figure, even when a plurality of ceramic boards 12 are disposed on the positioner 1', the spacers 16 can be disposed around the plurality of sheets m12, thereby effectively suppressing the positioner and the pottery loaded on the column member 14. Contact of the plate 12. As shown in Fig. 11, on the positioner 1A shown in Fig. 1A, the surrounding member 22 cut out from the same unprocessed ceramic plate as the ceramic plate η can also be arranged to surround the ceramic plate. 12. Here, Fig. u is a view showing a clamp different from the above embodiment, that is, in this aspect, four corner-shaped surrounding members are placed between two adjacent strut members 14 The 24, 1 ceramic plate 12 is surrounded by the pillar member 4 and the surrounding member 24 cut out from the same raw ceramic plate. In the firing of the ceramic plate 12 as described above, lead in the lead titanate is released from the pillar member 14 and the surrounding member 24. Thereby, evaporation of lead of the ceramic plate 12 surrounded by the pillar member 14 and the surrounding member 24 can be suppressed, and the temperature around the ceramic plate 12 and the lead environment can be kept uniform, so that the shrinkage of the ceramic plate 12 due to firing can be caused. It is uniformized in each region, and as a result, it is possible to effectively suppress the occurrence of bending or deformation on the ceramic plate 12 after firing. Further, since the surrounding member 24 is the remaining portion of the unprocessed ceramic board after the ceramic board 12 is cut out, the surrounding member 4 including the ceramic material substantially the same as the ceramic sheet 2 can be efficiently formed. Further, since the remaining portion of the unprocessed ceramic plate which is usually made of waste material is used, the cost required for firing the ceramic plate 12 can be reduced and the amount of waste material generated can be reduced. Hereinafter, an embodiment of the third embodiment of the present invention will be described. Embodiment 1 91939.doc5 -28- 1323247 A ceramic plate, a strut member, and a spacer are disposed in the same configuration as that shown in Fig. 10 on the same oxidation positioner (100 mm x 100 mm) as the above positioner 10. Then, 10 sets of the same items as those of the article which were subjected to the degreasing treatment at 350 ° C were prepared, and a 10-stage laminated positioner was produced. Here, the ceramic plate used in the present embodiment is mainly composed of piezoelectric materials of PbTi03, PbZr03, Pb (Mgi/3Nb2/3) 〇3, and Pb (Zni/3Nb2/3) 〇3. The 15 mm x 35 mm veneer is from a raw ceramic plate cutter with a thickness of 0.35 mm. Further, this ceramic plate has a thickness of 0.29 mm after the firing process described later. Further, the spacer used in the present embodiment is of the same material as the zirconia locator, and has a size of 4 mm x 4 mm (height of 0.3 2 mm). Further, the pillar member is the same material as the above-mentioned ceramic plate, and has a size of 4 mm x 5 mm and three heights (0.4 mm, 0.45 mm, 0.55 mm). In addition, when the height of the pillar members is 0.4 mm, 0.45 mm, and 0.55 mm, the distance between the pottery board and the upper positioner is 50 jtim, 100 μm, and 200 /xm, respectively. The three laminated positioners having different thicknesses of the pillar members prepared as described above were respectively placed in a bowl and fired at 1,100 °C. Then, a laser-type non-contact three-dimensional shape measuring device was used to measure the bending of each ceramic plate after firing. More specifically, the maximum height difference on the same substrate was measured as the amount of bending. As a result, the maximum value of the bending amount when the height of the strut member is 0.4 mm is 25 pm, the maximum value of the bending amount when the height of the strut member is 0.45 mm is 30 μm, and the bending amount when the height of the strut member is 0.55 mm The maximum value is 130 /mi. And the fired ceramic plates were not damaged or in a bad shape. 91939.doc5 -29- 1323247 The stacker is removed only under the same conditions as described above except that the above-mentioned spacer is removed and the 'pointer is different from the above-mentioned position. One fruit is broken or poorly shaped by 35% of the pottery board. Such a bad is more common in the underlying Locator. Further, when the same surrounding member as the surrounding member 22 is used, the average value of the amount of bending is lowered by 1 〇 to 2 〇% in either case. Example 2 Adding a binder to a piezoelectric ceramic powder in which (4) Ti〇3, PbZr〇3, pb (Mgi is /3)〇3, and the other four components of the external (four) sense ο〇3 are piezoelectric ceramics. It is made into a silicone-like shape using a scraper method to form a specific thickness of the pottery body. Then, in a specific region of the surface of the ceramic body, an internal electrode paste having a mixing ratio of ? and Pb of 7:3 was screen-printed. Further, 8 pieces of the volume layer of the electrode paste which is thus printed with the electrode paste are extruded from the lamination direction, and are cut into 15 T 〆 and the knife is mmx35 mm to prepare a plurality of ceramics. Laminated body ((4) board). Further, the thickness of each of the laminated bodies after extrusion was 0.35 mm, and the thickness of each laminated body after the firing process described later was 0.295 mm. Then, on the same oxidation locator (1 mm "(8) mm) as in Example i, the laminated body, the pillar member, and the spacer were placed as shown in Fig. 10. Then, the locator was prepared. On the other hand, 35 (the article 1 of the same article after degreasing treatment of rc is used to fabricate a stack of locators of 丨0 segment. Here, the spacer used in this embodiment is the same material as the oxidized locator, and its size is 4 mm x 4 mm. (The height is 〇.32mm.) In addition, the pillar members are the same as the above ceramic material, and the size is 4 mmx5 mm, and the height is 1 91939.doc5 -30- 1JZJZ4/ There are 3 types (0.4_, 0.45_, 〇. 55.) In addition, when the height of the strut members is 0.4 mm, 0.45 _, and 〇55, respectively, the distance between the laminated body and the upper positioner is 50_, 1〇〇(4), and 2〇〇(4), respectively. The three types of laminated positioners having different thicknesses of the pillar members to be prepared are respectively stored in the bowl and fired at 110 Torr. Then, similar to the method (4), the laser-type non-contact three-dimensional shape measuring device is used to measure the calcination. The bending of each laminate. The result is the height of the strut members. The maximum value of the bending amount when the shape is 4 为 is 2 〇, the maximum value of the bending amount when the height of the pillar member is 45 mm is 25 (four), and the maximum value of the bending amount when the height of the pillar member is the G55 surface is 12 G (four). In the case where the laminated body was not damaged or in a shape, the K yellow was fired only under the same conditions as described above except that the one of the spacers was removed from the layered positioner of the i 〇 section. As a result, 40% of the laminated body is damaged or has a poor shape. Such a defect is more common in the underlying slab of the laminated locator. Further, when the surrounding member is the same as the surrounding member 22 as shown in the figure " The average value is reduced by 1 〇 2 〇〇 / Q in either case. 弟 4 embodiment Hereinafter, a fourth embodiment of the present invention will be described with reference to Figs. 12 to 17. This embodiment is manufactured by using titanic acid or chin. Piezoelectric terracotta plate with the main component of the acid wrong acid. This piezoelectric terracotta plate is used for the ceramics, the ceramics, the piezoelectric buzzer, the piezoelectric sensor, and the piezoelectric actuator. And other products. When such a beautiful electric ceramic board is used, first as shown in Fig. 12 and Fig. 13, the quasi-91939.doc5 31 1323247 丫: an oxidized misalignment device 32 on which a plate-shaped unprocessed slab 31 is placed. 32 has a porosity of 3% or less, preferably a density of (4) or less. As a material of the oxidation misalignment device 32, it is preferable to increase the durability of the material, for example, it is possible to add an oxidative printing 2 to an oxidation error. 3) and make it stable. As a stabilizer, in addition to Υ2〇3, calcium oxide ((5)), magnesium oxide (MgO), and cerium oxide (Ce〇2) can be used. As shown in FIG. 14, the mounting surface of the positioner 32 is formed with a concavo-convex portion 33 for material escape, and the concavo-convex portion for escape of the substance is used to place the unprocessed ceramic in a state in which the unprocessed ceramic plate 31 is placed. When the plate 31 is heated, the substance generated by the unprocessed ceramic plate 31 escapes from the side of the yttrium oxide positioner 32. The substance to be referred to herein is a burning ash of a binder which is produced when the unprocessed slab 31 as described later is degummed, or a gas generated when the unprocessed slab is fired later. The concavity and convexity portion 33 for the substance escape constitutes the center line of the placement surface of the oxidation error locator 32, and the average thickness Ra is preferably 1 to 2 μm η η and more preferably 2 to 6 from the claw. Further, the center line average roughness is a surface roughness determined by JIS B〇6〇1, and the thickness curve is folded back from the center line, and the area obtained by the thickness curve and the center line is divided by the length value. The zirconia positioner W having such a fine substance escape concave-convex portion 33 is produced by using a mold (not shown) as follows. That is, first, the surface of the mold to be used is subjected to uneven processing to have the above-described ten-line average roughness Ra. Then, the zirconia powder which is completely stabilized by the additive of Ah or the like is subjected to extrusion processing by the mold to form minute irregularities on the surface of the powder molded body. Then, by firing the powder molded body, it is obtained that the concave and convex portion 33 having the escape property of 91939.doc5 - 32 - 1323247 is obtained. <Zirconium locator 32 of the surface. The outer layer may be formed by adding a binder to the oxidized parasol and the 1G chain of the miscellaneous milk as needed to perform degumming of the powder molded body before firing. By using the mold to form the oxidizing leveler 32, it is easier and cheaper to manufacture a material with a smaller substance than the case where the locating surface is thickened by, for example, blasting with a projection material. The oxidization error locator 32 of the uneven portion 33. In addition, since the powder molded body is not required to be mechanically cured by polishing or blowing after the powder molded body is fired, it is possible to prevent the processing chips 1 or zirconia from adhering to the mounting surface of the oxidation error locator 32. The positioner 32 produces a skew. Further, the unprocessed ceramic plate 31 is formed by, for example, a piezoelectric ceramic having a composition of three components of PbTi03-PbZr03-Pb (Zn1/3Nb2/3)〇3. In the case of containing the materials, an organic advisory agent and an organic solvent are added to the polymer or the organic solvent to be aggregated or gelatinized, and (4) sheet forming is performed by using a doctor blade method or the like to obtain an unprocessed ceramic plate 31. . The unprotected Tauman plate 31 is a laminate obtained by laminating a plurality of ceramic plates having, for example, an internal electrode pattern. Then, the plurality of sheets (here, one sheet) of the unprocessed ceramic plate 31 are placed on the mounting surface of the oxidation misalignment holder 32 as shown in Figs. 12 and 13, and the unprocessed ceramic plate 31 is contained. The binder is subjected to so-called degumming (degreasing). When the binder used for the molding is vaporized at the time of firing as described later, the unprocessed ceramic plate 31 is vaporized, the firing environment is destroyed, and the unprocessed ceramic plate 31 is not burned. Therefore, the baking is performed before the firing. The degumming treatment of the processed ceramic plate 31. As the degumming treatment, the unprocessed ceramic plate 3 is heated at a temperature of, e.g., 4 〇〇 ec, and is stabilized, for example, for 1 hr. 91939.doc5 -33- U23247

Then, the unprocessed ceramic plate 31 is placed on the mounting surface of the zirconia retainer 32, and the unprocessed ceramic plate 31 is fired. Specifically, as shown in Figs. 15 and 16, a plurality of oxidized oxime devices 32 loaded with the unprocessed ceramic plate 31 subjected to the degumming treatment are stacked via the columnar oxidized spacer sheets 34. The oxidative error interval ^4 is placed at the four corners of the zirconia positioner 32. Then, it will be oxidized. The oxidation junction locator 32A, which is not loaded with the unguarded ceramic plate 3 i at the top of the clamp 732, is overlapped by the oxidized error spacer 34. Further, the zirconia retainer 32A is preferably constructed in the same manner as the oxidized misaligner 32 on which the unprocessed terracotta plate 31 is placed. At this time, the interval between the respective oxidation error locators 32 can be adjusted by changing the length of the oxidation retardation sheet 34. Further, the oxidized spacer spacer 34 is preferably formed of the same material as the zirconia locators 32, 32A. Then, the oxidation fault locators 32 and 32a stacked in a plurality of stages are housed in a closed firing furnace 35, and each of the unprocessed ceramic plates 31 is fired. At this time, the unprocessed ceramic plate 31 is heated at, for example, the temperature of the coffee 1 and stabilized, for example, for 3 hours, nb, and the m3ix is not added to the firing furnace for firing. The lead contained in it evaporates. Further, in order to surely suppress the evaporation of lead, a lead oxide powder may be added to the firing furnace 35, and the piezoelectric ceramic plate is obtained by performing such firing. Thereafter, as shown in Fig. 17, an external electrode 37 is formed on the upper surface of the house electric ceramic panel 36 after firing. Here, since the concave &amplifier portion 33 for material escape formed on the mounting surface of the oxidation error locator is a small unevenness, the shape of the uneven portion 33 for material escape is hardly transferred to the lower surface. situation.闵屮-,..., the piezoelectric ceramic plate 36 is subjected to polishing or the like, and the external electrode 37 can be formed on the piezoelectric ceramic plate. Of course, after 9\939.doc5 • 34-1323247 forms an external electrode on the piezoelectric ceramic plate 36, the piezoelectric ceramic plate 36 needs to be ground, etc. At this time, it is coated on the piezoelectric ceramic plate 36. In the case of the Ag paste, the external electric electrode is formed by firing, for example, 7(10).c, and as the material of the external electrode 37, in addition to Ag, Au or the like may be used. In the method of forming the electrode 37, in addition to firing, a sputtering method, an electroless plating method, or the like may be used. /# In the degumming step of the unprocessed pottery plate 31, if the adhesive f is partially removed, the The residual carbon remains in the unprocessed ceramic board. The oxide (ZnO) in the reduction is reduced, and at this time, since the Zn evaporates from the unprocessed ceramic plate, the composition of the unprocessed ceramic plate differs from the surface side and the back side of the unprocessed ceramic plate 31. Thereby, the shrinkage ratio of the unprocessed terracotta plate 31 is changed on the surface side and the back side of the unprocessed slab, and as a result, the piezoelectric ceramic plate 36 is bent or deformed. In order to improve the degumming property of the unprocessed ceramic board 31, it is considered to use the position of the porous material. However, when the unprocessed ceramic plate is placed on the same porous crucible after degumming and fired, the lead (4) in the unprocessed ceramic plate 31 is absorbed by the porous element locator, thereby making it difficult to maintain the unprocessed ceramics. The soaking plaque of the unprocessed ceramic plate 3 1 is generated by the soaking property of the back side (the 疋 position side) of the plate 31 and the environmental uniformity. As a result, even if a phenomenon such as bending of the piezoelectric ceramic plate did not occur, the obtained substrate could not obtain desired characteristics. Further, after the degumming is performed using the porous locator, it is considered that the unfilled ceramic plate 31 can be changed to be placed on the dense locator, but the unprocessed ceramic plate from which the adhesive is removed is 丨The shape retention property is low, so that the unprocessed ceramic plate 31 is easily damaged when the unprocessed ceramic plate is transferred. On the other hand, in the present embodiment, as the yttrium oxide locator 32, a mounting surface having the uneven portion 33 for forming a small substance escape is used. Therefore, the unprocessed ceramic plate 31 is placed in the yttrium oxide locator 32. When the surface is placed, the contact area between the oxidation misalignment 32 and the unprocessed ceramic plate 31 becomes small. Therefore, when the degumming treatment of the unprocessed ceramic plate 3 is performed, the combustion gas (carbon) of the binder easily escapes from the back surface of the unprocessed ceramic plate 31 (the surface on the side of the zirconia positioner 32), so the degumming property is improved. . Therefore, when the unprocessed ceramic board 31 is subjected to the baking treatment, the carbon (the burning ash of the binder) remaining on the unreinforced ceramic sheet 31 is transferred to J. Further, at the time of the firing treatment, when a small amount of residual carbon is vaporized, the gas easily escapes from the back surface of the unprocessed pottery plate 31. As a result, since the residual carbon reduces the oxide in the unprocessed ceramic plate 31, the evaporation is reduced, so that the composition of the surface side and the back side of the processed ceramic plate 31 can be suppressed. Further, since the hard ceramic yttrium locator 32 which is difficult to react with lead is used, the unprocessed ceramic plate 31 is subjected to the firing treatment, and the unprocessed ceramic plate is substantially unaffected by the oxidizing error locator 32 to absorb β χ. In the state where the unprocessed ceramic plate 31 is placed on the mounting surface of the zirconia retainer 32, the contact area between the yttrium oxide locator 32 and the unprocessed ceramic plate 31 as described above becomes small. By such a method, the surface side of the unprocessed ceramic plate 31 and the environmental uniformity are well obtained, so that the burnt plaque of the (4) can be reduced. 9l939.doc5 • 36- U23247 By the above method, the shrinkage ratio of the unprocessed ceramic plate 31 is substantially equal, it is possible to surely reduce the bending or deformation of the piezoelectric ceramic plate 36, and the piezoelectric ceramic plate 36 having the desired characteristics. . μ and further 'by the formation of a small object-escaped concavo-convex portion 33 on the mounting surface of the oxidizing leveler 32, the escape of gas generated on the back side of the unprocessed ceramic plate 3 i during the degumming treatment without m3i The property is improved, so that the unprocessed ceramic board 31 can be prevented from floating up from the yttrium oxide locator.: When processing the ceramic board 31, the unprocessed slab 31 and the oxidized sputum bit 32 The difference in heating speed between the two becomes small, so that the gas originally present in the firing furnace 35 can be controlled to be wound into the back surface of the unprocessed ceramic plate 31. Therefore, the intrusion of the gas can prevent the unprocessed ceramics. The plate 31 floats from the yttrium oxide locator 32. Therefore, when the unprocessed ceramic plate 31 is degummed and fired, the unprocessed ceramic plate 31 can be prevented from shifting with respect to the zirconia retainer 32. Thereby, the unprocessed ceramic can be prevented. The plate 31 is detached from the yttrium oxide locator 32, or a scratch is formed on the back surface of the unprocessed ceramic plate 31 or the unprocessed ceramic plate 3 i is deformed. Further, a zirconia locator 32 having a concave and convex portion 33 for material escape is produced. When, as mentioned above, due to the powder After the body is fired, it is not necessary to mechanically process the powder molded body. Therefore, when the unprocessed ceramic plate is fired, foreign matter such as machining chips does not adhere to the unprocessed ceramic plate 31, or the oxidized misaligner is used. The skew of 32 causes the zirconia positioner 32 to rupture. The fourth embodiment of the present invention relates to a method for manufacturing a lead-containing piezoelectric ceramic plate, but the present invention is of course applicable to other terrariums other than this. In this case, as the positioner, a 91939.doc5 -37· 1323247 positioner formed of alumina or oxidized town may be used. Further, the above embodiment is an unprocessed pottery made of a laminate. The degumming and firing of the present invention can be performed on the ceramic plate. The embodiment of the fourth embodiment and the comparative example are not described below. Embodiment (1) The positioner is used as a positioner for oxidation error. Add 8 mol%~12 coffee yttria (Y2〇3) and make it completely stabilized by dense oxidization. The porosity of the yttrium oxide locator is 3% or less. The size of the yttrium oxide locator For CHOOmmxHK)·, oxidation error locator The thickness is 15 emulsified. The emulsified misalignment||the surface is formed with the concave and convex parts for the material escape of (4) coarser 仏, preferably 2~6 /xm. (2) Ceramics as the material of the unprocessed Taojing board, Use the composition pbTi〇3

The three components of PbZr〇3-Pb(Zni/3 _/3)〇3 are piezoelectric ceramics. The piezoelectric ceramic system formed by this material wet-mixes the oxide or carbonate form of the material in a ball mill and mixes it with 9 (8). c is subjected to pseudo-firing, and then wet-pulverized by a ball mill to form a micronized person. The m-free system was produced by the following method. Namely, a binder and an organic solvent are added to the prepared piezoelectric ceramic body to be gelatinized, and formed into a plate having a thickness of 5 Å by a plate method. Thereafter, an internal electrode paste composed of a metal of Ag/pd = 7:3 was used, and an internal electrode pattern was formed on the plate by screen printing. Thereafter, the sheets were overlapped to form a laminate, and the internal electrodes were subjected to 8 sheets of extrusion processing to form a raw ceramic sheet. The unprocessed 91939.doc5 • 38· (4) plate is then severed so that the size of the unfilled m is 15_35. (3) Degumming The prepared 10 pieces of unprocessed ceramic plates were placed on the yttrium oxide locator (see Figs. 12 and 13). The temperature of C was allowed to stabilize for 10 hours, thereby performing degumming of the unprocessed ceramic plate. (4) After firing and degumming, 'the yttrium oxide locator with the unprocessed ceramic plate is placed on the slab' and the oxidized hammer locator that is not loaded with the unprocessed ceramic plate is laminated as the shape of the sinter (see figure) 15 and Figure 16). At this time, the gap between the respective oxidation misaligners is adjusted by the oxidation spacer. Further, the 1G sheet oxidation misalignment device thus loaded is placed in a closed firing furnace to fire each of the unprocessed ceramic sheets. At this time, the firing was carried out under the conditions of a firing temperature of 1 and a stabilization time of 3 hours. (5) Evaluation > Evaluation of bending of 100 pieces of piezoelectric ceramic sheets obtained by firing was performed using a non-contact laser type 3 dimensional shape measuring apparatus. As a result, the bending of the piezoelectric ceramic plate is also at most 2 m from m. Further, regarding the occurrence of the f-curve, no local bending of the piezoelectric ceramic plate was observed. Further, the residual carbon amount of the unprocessed ceramic sheets after degumming of the one sheet was analyzed by the combustion-infrared absorption method in the oxygen stream, and it was found to be less, and it was 5 〇 15 15 Å PPM. Further, no depression was found on the back surface of the piezoelectric ceramic plate. Moreover, the unprocessed ceramic plate was not caused to fall off from the oxidizer hammer positioner. (Comparative Example) The positioner used in the comparative example is a dense oxygen 91939.doc5 -39-1323247 hydrating locator 1 which is polished after firing, and the zirconia locator is not formed on the mounting surface as described above. Implement the concave and convex part of the material escape. Using such a ruthenium oxide locator, a piezoelectric ceramic plate was produced in the same manner as described above. The evaluation of the bending of the (10) piece of piezoelectric ceramic board thus obtained was carried out in the same manner as described above, and it was found that the maximum (10)_ bending was produced. Further, the occurrence of bending is caused by local bending particularly at the four corners of the substrate. Further, the residual carbon amount of the untreated ceramic plate after degumming was analyzed by the same method as described above, and it was found that _ ppm of carbon remained. Further, there is an unprocessed ceramic plate which is formed on the surface of the substrate and which is concave due to the grinding debris of the zirconia locator. There is also an unprocessed ceramic in which the unprocessed pottery plate is detached from the oxidizing clamp. board. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial cross-sectional front view of a firing unit according to a first embodiment. Fig. 2 is a plan view showing a part of the firing unit shown in Fig. 1 cut away. The Δ diagram is a partial cross-sectional front view showing a state in which the firing unit shown in Fig. 1 is not stored in the sealed sister. Fig. 4 is a partial cross-sectional front view showing the firing unit of the second embodiment. Fig. 5 is a plan view showing a portion of the firing unit shown in Fig. 4 cut away. Fig. 6 is a partial cross-sectional front view showing a state in which a plurality of firing units of the first or second embodiment are stacked and stored in a pocket. Figs. 7(4) to 7(4) are views showing the firing of the ceramic board of the third embodiment. - Figure 8 is a diagram showing the state of the multi-layered layer locator. Fig. 8 is a view showing the state of the third embodiment. 91939.doc5 Figs. 9(a) to 9(c) are diagrams showing the state of each element in the firing process in the third embodiment. Fig. 1 is a view showing a locator of a different aspect in the third embodiment. Fig. 11 is a view showing a different position locator in the third embodiment. Fig. 12 is a plan view showing a state in which the unprocessed ceramic plate is degummed according to the fourth embodiment. Fig. 13 is a plan view showing a state in which degumming of the unprocessed ceramic plate is performed according to the fourth embodiment. Fig. 14 is an enlarged view showing the surface of the ruthenium oxide locator shown in Figs. 12 and 13; Fig. 15 is a vertical cross-sectional view showing a state in which a raw ceramic plate is fired according to the fourth embodiment. Fig. 16 is a horizontal cross-sectional view showing a part of a state in which a raw ceramic plate is fired according to the fourth embodiment. Figure 17 is a perspective view showing the ceramic plate finally obtained according to the fourth embodiment. [Description of Symbols] 1 Positioner 2 Ceramic Plate 2a Side of Ceramic Plate 2b Upper Surface of Ceramic Plate 3 Spacer 4 Enclosing Member 5 Oxidation Error Locator 9!939.doc5 -41 - 1323247 5a Below the yttrium oxide locator 7 Basin 10 Locator 10A Upper locator 10B Lower locator 12 Ceramic plate 14 Pillar part 16 Spacer 20 Multi-layer Locator 22 Basin 22a Basin Upper opening body portion 22b spider cover portion 24 surrounding member 31 plate-shaped raw ceramic plate 32 yttrium oxide locator 32A zirconia locator 33 material escape concave and convex portion 34 zirconia spacer 35 firing furnace 36 piezoelectric Ceramic plate 37 External electrode 100 Burning unit s Clearance 91939.doc5 -42-

Claims (1)

Picking up, applying for a patent: h - a method of firing ceramic plates, arranging pots between the components of the lanthanum; forming: holding the parts and retaining the second part by means of the above-mentioned slabs Surrounded by a... The composition of the Tao Jing material of the Xiangmen is the same as the above-mentioned ceramic board between the holding parts and the Yu... The second and the second holding parts of the two parts are not included. Into the aforementioned ceramics; fe. Such as the scope of patent application! The fired slab of the slab of the slab is placed on the first holding member, and the ceramic is a gap between the ceramic plate and the thickness of the second protective plate. Between the pieces - there is less than the above-mentioned pottery 3. If the Taoman board of the scope of the application of the patent item is off the center, the method is described in the package 4. The degree is roughly the same as the thickness of the board. For example, the firing of the ceramic plate of the third section of the Shenqing patent scope is 罟i T. The package is 5. The ceramic plate has a certain distance between them. For example, the method of applying for a patent is to add a method of adding a gap between the first holding member and the second holding member. The surrounding member is disposed between the spacers. ^ The method for firing a ceramic board according to Item 1, wherein the ceramic board is obtained from a ceramic material, and the surrounding member is formed by taking out the remaining portion of the precursor. The phase is the rear of the board of the Taoman raw material. 7. The method of firing (4) of the board of any of the first to sixth aspects of the patent range is as follows: The ceramic material forming the ceramic sheet contains a lead-containing compound. 9I939.doc6 8. One: two firing method, which is characterized by the following steps: · The smashing of the slab of the slab, the steps of cutting the slab, the plurality of struts, and the interval of the steps. , w, ...w The degree of homogeneity before the firing process of the ceramic tile is lower than the height of the (four) piece before the firing process and passes through the height of the front plate; The step of arranging the second locator of the spacer on the plurality of pillar members in the above-described firing process, carrying out the above-mentioned first and second positioning The above-mentioned ceramics * plate sintering step 9. The "battery burning method _ ° placed a plurality of the aforementioned spacers" lomr range ninth item of the ceramic board firing method, which passes the first two The plurality of the above-mentioned spacers have the same height. The method for firing the terracotta board of the ninth or ninth item, wherein the front fixing spacer is disposed at a position sandwiching the ceramic board. The method of firing the board, wherein the above-mentioned direction is delayed, the two spacer sheets are arranged in the longitudinal direction of the ceramic plate by sandwiching the ceramic pattern. 13. If the patent application is finished...: The method wherein the height of the spacer and the height of the foregoing burning moon is lower than the height of the ceramic plate before the firing process. 1J Shen: A method for firing a ceramic plate of the eighth item, wherein When firing the front v ceramic plate, it is surrounded by surrounding parts The 91039.doc6 1323247 ceramic plate is fired in the surrounding state. 15. The eighth aspect of the patent application is included in the firing method of the ceramic described above, which causes the second positioning of the A, the P plate, Γ The step of arranging the slab, the struts, and the second locating member to mount the new locator, and the sheet is repeated after the step is repeated for a plurality of times. The ceramic plate of the eighth section. The column part is passed by the firing method of the 1' plate, wherein the above-mentioned branch material is composed of the same material as the village material, and the board is the same as that of the board. The method of firing the column member is constructed by the same material as the material of the above-mentioned ceramic board. 18. The method for firing the ceramic board according to item 8 of the patent application. The porcelain sheet contains lead. The method for manufacturing a ceramic board is a method for manufacturing a ceramic board by firing an unprocessed ceramic board, and the method comprises the following steps: a step of positioning the positioner of all the mounting surfaces There is a bump for the object to be used for loading a substance generated when the unprocessed ceramic plate is heated in the state of the unprocessed ceramic plate, which escapes from the unprocessed ceramic plate; 7 a step of forming the aforementioned unprocessed ceramic plate containing a binder; loading the aforementioned unprocessed ceramic plate a step of performing degumming of the unprocessed ceramic plate on the mounting surface of the positioner; and after the unprocessed ceramic plate is degummed, the unprocessed ceramic plate is loaded on the mounting surface of the positioner, The method of manufacturing a ceramic plate according to claim 19, wherein the positioner is used to escape the aforementioned substance. The uneven portion 21. 22. The center line average roughness Ra of the mounting surface is 1 to 2 pm. The method for producing a ceramic plate according to claim 20, further comprising the step of forming an external electrode on the ceramic plate without mechanically processing the ceramic plate obtained by firing the unprocessed ceramic plate. The method for producing a ceramic board according to claim 19, wherein the method of producing a ceramic sheet having a concave-convex portion for forming the escape of the substance is used as a mold. 23. The manufacturer of the slab of any of the items 19 to 22 of the patent application, wherein the unprocessed terracotta board is formed of a material containing the wrong material, and the state of the unprocessed ceramic slab is loaded. In the above, do not:: two: burning ^ 91939.doc6