九、發明說明 【發明所屬之技術領域】 本發明關於-種治具，特別關於_種用以 裝置的治具。 电千 【先前技術】 由於利用球閘陣列封I ( Ball Grid Array, BGA )可使 :片底部的空間較為寬大’可以在保證引腳間距較大的前 提下容納更多的引腳以滿足更密集的信號1/〇需要。除此 之外’球閘陣列封裝還具有晶片安裝容易、電氣性能更 好、信號傳輸延遲低、允許高頻運作、散熱性卓越等許 =點’因此球閘陣列封裝已#遍應用在許多電子元件的封 、中。以筆記型電腦上的主機板為例，其上也有電子元 是利用球閘陣列封裝而設置於主機板上。 如圖1A及圖1B所示，其為—種習知具有球閘陣列封 二-的電子裝置7的組裝示意圖，圖认為組裝前，圖 為組裝後1子裝置7具有—殼體78…電路板72、一 轨及散熱片74。其中，封裝_設置於電路板 政…片74设置亚接觸封裝體71以將封裝體η產 生之熱能散逸。 封裝體7i是藉由多數銲點73而與電路板u連結。 要組裝電子裝置7時，需先將電路板72的孔洞72ι對準 咸體78上的螺孔％】接，a jc.,1 m夕j 片74及雷社7 螺絲S來穿過散熱 4及電路板72以鎖附至殼體78。由於鎖附螺絲^所施 1322235 加的力量，會部分轉移至散熱片74及電路板72，進而增 加散熱片74與電路板72單側的應力。如此一來，電路板 72上的部分銲點73，尤其是遠離鎖附處的銲點73 (如圖 1B中圓形虛線處所示）會因為應力不平均的影響而損壞， 進而使得封裝體71的電氣訊號無法傳送至電路板72而變 成不良品。上述問題在表面黏著技術（Surface Mount Technology, SMT)大幅採用無鉛製程後，更顯得嚴重。 【發明内容】 本發明為提供一種能夠維持封裝體與電路板的銲點 可靠度，進而提升產品良率的治具。 本發明提供一種用於組裝一電子裝置的治具，電子裝 置具有一封裝體及一電路板，封裝體與電路板以至少一銲 點連接。治具包含一本體、至少一加壓部以及一操作部。 加壓部設置於本體的一側，操作部設置於本體的另一側， 其中加壓部施予電子裝置的一第一壓力大於操作部施予 電子裝置的一第二壓力。 承上所述，在本發明之治具中，治具上的加壓部施予 電子裝置的第一壓力大於操作部施予電子裝置的第二壓 力。當利用治具組裝電子裝置時，所施加於操作部的第三 壓力與第二壓力的和，則與第一壓力相當。如此一來，在 組裝電子裝置時，施加至電路板及封裝體上的壓力可呈現 對稱分布的狀態，故可保持封裝體與電路板之銲點的可靠 度，並確保封裝體的電氣訊號能傳送至電路板，進而提升 1322235 產品良率 【實施方式】 =將參照相關圖式，說明依本發魏佳實施例之_ 用治具的組裝方法，其令相同的元件將以相同 的參妝付唬加以說明。 及治^時參照圖2至圖5以說明使用治具1的組裝方法 1圖2人為-俯視圖’顯示本發明第一實施例的一種治具 ^ s -本體η、—加壓部12以及一操作部13。盆 :體=”2設置於本體u的一侧，操作部13設置： :=另一側。需說明的是，本發明並不限定本體11、 =部12及操作部13的形狀，本體_佳者可為一正 =形’加壓部12與操作部13可對稱設置或對角設置。 另：，加壓部12與操作部13的數量並 中是以治具1具有-個加㈣丨2與-個操作部13 ; 例，且加壓部12與操作部13為對稱設置。 治具！用於組裝-電子裝置5，圖3為電子裝置5电 裝刖的示意圖’圖4為使用治具工組裝電子裝置$的示章 圖’且為沿圖2中治具1的剖面線A-A，的剖面圖。1中“ 電子裝置5具有-封裝體51、一電路板52及一咳體58 且封褒體51與電路板52以至少—銲點（s〇ider p。⑻μ 連接。本發明並不限錢裝ϋ 51的種類，只要 53與電路板52連接，封裝體51例如可為球間陣列封裳 1322235 (Ball Grid Array，BGA)或四方扁平封裝體（Quaci Flat Package, QFP)。另外’本發明不限定殼體58的形狀及種 類，如可為筆記型電腦、個人數位助理、手機或計算機的 機殼。圖5為藉由治具1組裝電子裝置5之組裝方法的流 程圖，組裝方法主要包含步驟SOI及步驟s〇2。 步驟S01為對應設置治具1與電路板52,以將電路板 52裝設於殼體58。本發明並不限定電路板52與殼體58 裝設的方式，例如可為螺鎖或卡設，於此以利用螺絲s而 將電路板52鎖附於殼體58為例作說明。另外，電路板52 •具有多個固定部521用以螺鎖，固定部521可具有一孔 洞’殼體58可具有多個螺孔581。對應設置時，可利用人 工或其他機械結構的協助，將電路板52上的固定部521 與殼體5 8上的螺孔5 81對準，以利後續該些螺絲s可進 行鎖附。 當治具1放置於電路板52後，治具1本身的重量即 φ 使得加壓部12施予電路板52 —第一壓力P1 ’且操作部 I3施予電路板52 —第二壓力p2，其中第一壓力pi大於 第二壓力P2。在治具1與電路板52對位後’治具1的本 體11的一開口 111可與封|體5丨對應設置，且加壓部i 2 及操作部13則分別對應讀些固定部521的其中之二設 置，並且抵接電路板52，其中加壓部12及操作部13是位 於—共平面（in-plane)上。 在本實施例中’有多種方式可使第一壓力P1大於第 一壓力P2。由於壓力的計算是由力量除以接觸面積，若加 1322235 壓部12與操作部13料路板52的接觸面積相同，則使 加壓部12的重量大於操作部13的重量，即可使得第一壓 力P1大於第二壓力P2。例如加壓部12與操作部可具 T不同的材質（相同體積下，金屬較重；塑膠較輕），或 是具有不同的材料量皆可達到此結果。另外，若加壓部12 與操作部13的重量相同，則可使加壓部12與電路板 的接觸面積小於操作部13與電路板52的接觸面積，即可 使得第-壓力P1大於第二壓力P2。當然，上^式亦可 >昆合使用。 步驟S02為經由操作部13施加一第三壓力而組妒 電子裝置5 ’即將電路板52固定於殼體％。本實施例以 利用螺絲s進行鎖附為例，而操作部13且有一 以利螺絲s穿賴作部13而將電祕52_二 當操作者或機械裝置經由操作部13將電 體58時，會施力（第二 、 2螺鎖於设 〜壓力P3)給治具1或電” 然而，原本螺鎖前，γ & * €路板52。 ㈣$作部13施予電路板52 p2小於加壓部12施+ 的第一壓力 時所造成的第三壓力Ρ3加上第二壓力 近似於第一壓力Pl。^ + 〜曰大約等於或 如此一來，即可避免電路 又部521與另-固定部 板52上口 形變而造成㈣力/$力不均所產生的 進而可確保封_51與電路板”的電性連結衷= :產品良率。另外’利用操作部13鎖附其中一 後，只要將治具1旋轉—角度，使得操作部13料另一 1322235 固定部521 ’即可進行另一固定部521，的鎖附。 圖6顯示使用治具】組裝另一態樣的電子裝置5a。其 中’電子裝置5a之封裝體51a的載板511延伸至螺孔581 及固定部521、52Γ之上的範圍，加壓部12及操作部13 抵接封裝體51a，更明確來說是抵接在封裝體51a的載板 511上，以將封裝體51a及電路板52鎖附於殼體58<j在本 實施例中，治具1、載板511、電路板52及殼體58皆對 應又置。組裝時，操作部13所施予的第二壓力p2及第三 壓力P3落在封裝體5la的载板Η〗上，而加虔部所施 予的第一壓力pi也落在封裝體51a的載板511上且第 三壓力P3加上第二壓力P2大約等於第一壓力ρι。藉由如 前實施例所述的壓力配置方式㈣免電路板52及封裝體 51a因受力不均而造成銲點53破壞的問題，進而可確保封 裝體51a與電路板52的電性連結，並提高產品良率。 圖7顯示使用治具i組裝再一態樣的電子裝置％。其 中’電子裝置％更具有-散熱單元54，其例如為一散埶 片，設置於封裝體51並與封裝體51接觸以協助封裝體51 所產生的熱進行散逸。散熱單元54延伸設置於螺孔训 及固定部521、521,之上的範圍，加壓部Π及操作部13 =散熱單，將散熱單元54及電路板52鎖附於殼 體在本只施例中，治具卜散熱單元54、電路板52 及殼體58皆對應設置。喊時，操作部13戶斤 扳 壓力P2及第三壓力P3 ^在散熱單元54上而散: 54又與封裝體51接觸，而加虔部12所施予的第二= 1322235 P1也落在散熱單元54上，且第三壓力P3加上第二壓力 P2大約等於第一壓力P1。藉由如前實施例所述的壓力配 置方式可避免電路板52及封裝體51因受力不均而造成銲 點53破壞的問題，進而可確保封裝體51與電路板52的 電性連結，並提高產品良率。 圖8顯示使用治具1組裝電子裝置5，其中電子裝置 5更包含另一殼體59,殼體59可與封裝體51接觸。加壓 部12及操作部13抵接殼體59，以將殼體59及電路板52 鎖附於殼體58。在本實施例中，治具1、殼體59、電路板 52及殼體58皆對應設置。組裝時，操作部13所施予的第 二壓力P2及第三壓力P3落在殼體59上，而殼體59又與 封裝體51接觸，而加壓部12所施予的第一壓力P1也落 在殼體59上，且第三壓力P3加上第二壓力P2大約等於 第一壓力P1。藉由如前實施例所述的壓力配置方式可避免 電路板52及封裝體51因受力不均而造成銲點53破壞的 問題，進而可確保封裝體51與電路板52的電性連結，並 提高產品良率。 .圖9為一俯視圖，顯示本發明第二實施例之一種治具 2，其包含一本體21、多個加壓部22及一操作部23。其 中，該些加壓部22及操作部23位於本體21的周圍。利 用治具2亦可組裝電子裝置5。由於裝設的方式與第一實 施例的組裝方法大致相同，故於此僅簡單說明。 請同時參照圖3及圖9所示，當治具2設置於電路板 52時，該些加壓部22可分別施予電路板52第一壓力P1， 11 1322235 操作部23可施予電路板52第二壓力P2。由於使第一壓力 P1與第二壓力P2不同的方法已於第一實施例詳敘，故此 不再贅述。當電路板52鎖附於殼體58時，鎖附造成的第 三壓力P3加上第二壓力P2會均等或近似第一壓力P1，如 此一來，即可避免電路板52因受力不均而造成銲點53破 壞的問題，進而可確保封裝體51與電路板52的電性連 結，並提高產品良率。須注意者，若操作人員或機械裝置 可同時鎖附電路板52上的二個固定部521、521'時，以正 方形治具2為例，則治具2也可同時具有二個操作部23 設置於對角，而另二個對角則設置加壓部22。 圖10為一俯視圖，顯示本發明第三實施例的一種治 具3，其包含一本體31、多個加壓部32及一操作部33， 加壓部32及操作部33位於本體31之周圍。請同時參照 圖3及圖10所示，與上述第二實施例不同之處在於：治 具3的本體31為一實心的正方形，而且治具3更包含一 站碼3 4，例如為·—弧狀站碼或多個缺碼塊’其設置於本體 31並接近該些加壓部32。也就是說，藉由砝碼34置放於 不同的位置，而決定加壓部32的位置。另外，本體31更 可具有一容置區35以容置砝碼34,容置區35可例如為一 環狀溝槽或多凹坑，砝碼34可視加壓部32所需的重量而 設置於環狀溝槽或凹坑内的任何位置。其中，砝碼34只 要為具有重量的物體即可，不限制砝碼34的形狀或材料。 當要進行下一個固定部52Γ的鎖附時，可移動砝碼34 (例 如容置區35為一環狀軌道，砝碼34可滑設於執道上或直 12 1322235 接以人工或機器移動砝碼34)，以改變治具3對應於固定 部521加壓的位置。如此一來，不用旋轉治具3即可進行 下一固定部52Γ的鎖附。 圖11為一俯視圖，顯示本發明第四實施例的一種治 具4，其包含一本體41、多個加壓部42及一操作部43， 加壓部42及操作部43位於本體41之周圍。請同時參照 圖3及圖11所示，與上述第二實施例不同之處在於：治 具4的本體41為一實心的正方形，而且治具4更具有一 缺碼44、多個容置區45及一轉動件46，轉動件46的一 端與砝碼44連結，另一端則樞設於本體41。藉由移動轉 動件46的一端，即可將砝碼44置放於不同的位置，進而 改變治具4對應於固定部521加壓的位置，而形成加壓部 42。當然，本實施例可依需求同時具有多個轉動件46及 多個砝碼44,圖11中是以治具4只具有一轉動件46及一 站碼為例。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1A為一種習知的電路板螺鎖於一殼體之前的示意 圖； 圖1B為圖1A的電路板螺鎖於殼體之後的示意圖； 圖2為依據本發明第一實施例之一種治具的示意圖； 13 1322235 圖3為一電子裝置的示意圖； 圖4為藉由@2的治具組裝圖3 圖5為蕻由岡9从、/|：1 卞展置的不意圖； 马稭由圖2的治具組裝圖3 法的流程圖； 电卞裒置的組裝方 意圖； 意圖； 圖6為藉由圖2的治具組裝另—態樣的電子裝置的示 Θ為藉由圖2的治具組裝再一態樣的電子裝置的示 意圖； 圖8為藉由圖2的治具組裝又一 態樣的電子裝置的示 圖9為依據本發明第二實施例之一種治具的示意圖； 圖10為依據本發明第三實施例之一種治具的示意 圖；以及 1 1 ^ 回 為依據本發明第四實施例之一種治具的示意圖。 【主要元件符號說明】 I ' 2 ' 3、4 :治具 41 :本體 II '21 >31. 32、 42 :加壓部 33、 43 :操作部 111 :開 口 12、22、 13 、 23 、 131 :穿孔 45 :容置區 34 ' 44 :砝碼 35、 1322235 46 :轉動件 5、5a、5b、7 :電子裝置 51、 51a、71 :封裝體 511 :載板 52、 72 :電路板 521、521’ ：固定部 53、 73 :銲點 54 :散熱單元 58、59、78 :殼體 581、781 :螺孔 721 :孔洞 74 :散熱片 A-A':剖面線 P1 :第一壓力 P2 :第二壓力 P3 :第三壓力 S :螺絲 SOI〜S02:組裝方法的步驟IX. INSTRUCTIONS OF THE INVENTION [Technical Field to Which the Invention Is Applicable] The present invention relates to a jig, and more particularly to a jig for use in a device. Electric Thousand [Prior Art] Due to the use of Ball Grid Array (BGA), the space at the bottom of the chip is relatively large, which can accommodate more pins to ensure more pin spacing. Intensive signal 1/〇 is needed. In addition, the 'ball gate array package also has the advantages of easy wafer mounting, better electrical performance, low signal transmission delay, high frequency operation, and excellent heat dissipation. Therefore, the ball grid array package has been applied to many electronic applications. The sealing and middle of the component. Take the motherboard on the notebook as an example. There are also electronic components on the motherboard that are packaged in a ballast array. As shown in FIG. 1A and FIG. 1B , it is a schematic assembly diagram of a conventional electronic device 7 having a ball gate array package. The figure shows that before assembly, the assembled sub-device 7 has a housing 78... Circuit board 72, a rail and heat sink 74. Wherein, the package_disposed on the circuit board 74 sets the sub-contact package 71 to dissipate the heat energy generated by the package η. The package 7i is connected to the circuit board u by a plurality of solder joints 73. To assemble the electronic device 7, the holes 72 of the circuit board 72 must be aligned with the screw holes on the salty body 78, a jc., 1 m y j piece 74 and Leishe 7 screw S to pass through the heat dissipation 4 And the circuit board 72 is attached to the housing 78. Due to the force applied by the locking screw ^1322235, it is partially transferred to the heat sink 74 and the circuit board 72, thereby increasing the stress on one side of the heat sink 74 and the circuit board 72. As a result, part of the solder joints 73 on the circuit board 72, especially the solder joints 73 away from the lock (as shown by the circular dashed line in FIG. 1B), may be damaged due to the influence of stress unevenness, thereby making the package body The electrical signal of 71 cannot be transmitted to the circuit board 72 and becomes a defective product. The above problems are even more serious after the surface mount technology (SMT) has adopted a lead-free process. SUMMARY OF THE INVENTION The present invention is to provide a jig capable of maintaining solder joint reliability of a package and a circuit board, thereby improving product yield. The present invention provides a jig for assembling an electronic device. The electronic device has a package and a circuit board. The package is connected to the circuit board by at least one solder joint. The jig includes a body, at least one pressing portion, and an operating portion. The pressing portion is disposed on one side of the body, and the operating portion is disposed on the other side of the body, wherein a first pressure applied to the electronic device by the pressing portion is greater than a second pressure applied to the electronic device by the operating portion. As described above, in the jig of the present invention, the first pressure applied to the electronic device by the pressurizing portion on the jig is greater than the second pressure applied to the electronic device by the operating portion. When the electronic device is assembled by the jig, the sum of the third pressure applied to the operating portion and the second pressure is equivalent to the first pressure. In this way, when the electronic device is assembled, the pressure applied to the circuit board and the package body can be symmetrically distributed, so that the reliability of the solder joint between the package and the circuit board can be maintained, and the electrical signal of the package can be ensured. Transfer to the board to increase the yield of the 1322235 product. [Embodiment] = The assembly method of the fixture according to the embodiment of the present invention will be described with reference to the related drawings, so that the same components will have the same makeup. Explain it. Referring to FIG. 2 to FIG. 5, an assembly method 1 using the jig 1 is illustrated. FIG. 2 is a top view showing a jig of the first embodiment of the present invention, a body η, a pressurizing portion 12, and a Operation unit 13. The basin: body 2" is disposed on one side of the body u, and the operation portion 13 is provided with: := the other side. It should be noted that the present invention does not limit the shape of the body 11, the portion 12, and the operation portion 13, the body _ Preferably, the positive pressure-pressing portion 12 and the operating portion 13 can be symmetrically disposed or diagonally disposed. Further, the number of the pressing portion 12 and the operating portion 13 is equal to that of the jig 1 (four)丨2 and the operation unit 13; for example, the pressurizing unit 12 and the operation unit 13 are symmetrically disposed. The jig! is used for assembling the electronic device 5, and FIG. 3 is a schematic view of the electronic device 5. A stamp diagram of the electronic device $ is assembled using a jig and is a cross-sectional view along the section line AA of the jig 1 in Fig. 2. In the "electronic device 5 has a package 51, a circuit board 52, and a cough The body 58 and the sealing body 51 and the circuit board 52 are connected by at least a solder joint (s〇ider p. (8) μ. The invention is not limited to the type of the mounting 51, as long as 53 is connected to the circuit board 52, the package 51 can be, for example The ball array is 1322235 (Ball Grid Array, BGA) or quaternary flat package (QFP). In addition, the present invention does not limit the shape of the casing 58 and For example, it can be a notebook computer, a personal digital assistant, a mobile phone or a computer case. FIG. 5 is a flow chart of an assembly method for assembling the electronic device 5 by the jig 1 , and the assembly method mainly includes the step SOI and the step s 〇 2 Step S01 is to set the jig 1 and the circuit board 52 correspondingly to install the circuit board 52 on the housing 58. The invention does not limit the manner in which the circuit board 52 and the housing 58 are mounted, such as a screw lock or a card. For example, the circuit board 52 is locked to the housing 58 by using a screw s. In addition, the circuit board 52 has a plurality of fixing portions 521 for screwing, and the fixing portion 521 can have a hole 'shell The body 58 can have a plurality of screw holes 581. Correspondingly, the fixing portion 521 on the circuit board 52 can be aligned with the screw holes 5 81 on the housing 58 by the assistance of a manual or other mechanical structure, so as to facilitate subsequent The screws s can be locked. When the jig 1 is placed on the circuit board 52, the weight of the jig 1 itself, that is, φ, causes the pressurizing portion 12 to be applied to the circuit board 52 - the first pressure P1 ' and the operating portion I3 is given The circuit board 52 is a second pressure p2, wherein the first pressure pi is greater than the second pressure P2. After the alignment with the circuit board 52, an opening 111 of the body 11 of the jig 1 can be disposed corresponding to the sealing body 5, and the pressing portion i 2 and the operating portion 13 respectively read the fixing portions 521 Secondly, and abutting the circuit board 52, wherein the pressing portion 12 and the operating portion 13 are located on an in-plane. In the present embodiment, there are various ways to make the first pressure P1 larger than the first pressure. P2. Since the pressure is calculated by dividing the force by the contact area, if the contact area of the 1322235 pressure portion 12 and the operation portion 13 of the material path plate 52 is the same, the weight of the pressurizing portion 12 is made larger than the weight of the operation portion 13, The first pressure P1 is made larger than the second pressure P2. For example, the pressurizing portion 12 and the operating portion may have different materials (the same volume, the metal is heavier; the plastic is lighter), or have different amounts of materials to achieve this result. Further, if the weight of the pressurizing portion 12 and the operating portion 13 are the same, the contact area between the pressurizing portion 12 and the circuit board can be made smaller than the contact area between the operating portion 13 and the circuit board 52, so that the first pressure P1 is greater than the second Pressure P2. Of course, the upper formula can also be used by > Kun. Step S02 is to apply a third pressure via the operation unit 13 to assemble the electronic device 5' to fix the circuit board 52 to the casing %. In this embodiment, the locking is performed by using the screw s as an example, and the operating portion 13 has an rivet screw s passing through the portion 13 to connect the electric motor 52 to the operator 58 or the mechanical device via the operating portion 13. , will force (second, 2 screw lock in the set ~ pressure P3) to the fixture 1 or electricity" However, before the original screw lock, γ & * € road board 52. (d) $ part 13 is applied to the circuit board 52 The third pressure Ρ3 caused by the p2 being less than the first pressure applied by the pressurizing portion 12 plus the second pressure is approximately equal to the first pressure P1. ^ + ~ 曰 is approximately equal to or so as to avoid the circuit 521 And the shape of the upper-fixed portion plate 52 is changed to cause (four) force/$ unevenness, which in turn ensures the electrical connection between the seal_51 and the circuit board": product yield. Further, after the one of the operating portions 13 is locked, the jig 1 is rotated by an angle so that the operating portion 13 feeds another 1322235 fixing portion 521' to perform the locking of the other fixing portion 521. Fig. 6 shows an electronic device 5a in which another aspect is assembled using a jig. The carrier 511 of the package 51a of the electronic device 5a extends over the range of the screw holes 581 and the fixing portions 521 and 52, and the pressing portion 12 and the operation portion 13 abut against the package 51a, more specifically, abutting. In the carrier 511 of the package body 51a, the package body 51a and the circuit board 52 are locked to the housing 58<j. In the present embodiment, the jig 1, the carrier board 511, the circuit board 52, and the housing 58 correspond to each other. Set again. During assembly, the second pressure p2 and the third pressure P3 applied by the operating portion 13 fall on the carrier of the package body 51a, and the first pressure pi applied by the twisting portion also falls on the package body 51a. The third pressure P3 plus the second pressure P2 on the carrier plate 511 is approximately equal to the first pressure ρι. According to the pressure arrangement method (4) as described in the previous embodiment, the problem that the soldering point 53 is broken due to the uneven force due to the uneven force of the circuit board 52 and the package body 51a can be ensured, and the electrical connection between the package body 51a and the circuit board 52 can be ensured. And improve product yield. Fig. 7 shows the electronic device % assembled using the jig i. The electronic device % has a heat dissipating unit 54, which is, for example, a heat sink, disposed on the package body 51 and in contact with the package body 51 to assist the heat generated by the package body 51 from being dissipated. The heat dissipating unit 54 extends over the range of the screw hole training and fixing portions 521 and 521, and the pressing portion Π and the operating portion 13 = heat dissipation sheet, and the heat dissipating unit 54 and the circuit board 52 are locked to the housing. In the example, the fixture heat dissipation unit 54, the circuit board 52, and the housing 58 are correspondingly disposed. When shouting, the operation unit 13 pulls the pressure P2 and the third pressure P3 ^ on the heat dissipating unit 54: 54 is in contact with the package 51, and the second = 1322235 P1 applied by the twisting portion 12 also falls on On the heat radiating unit 54, the third pressure P3 plus the second pressure P2 is approximately equal to the first pressure P1. The pressure arrangement according to the previous embodiment can avoid the problem that the circuit board 52 and the package 51 are damaged due to uneven force, thereby ensuring electrical connection between the package 51 and the circuit board 52. And improve product yield. Figure 8 shows the assembly of the electronic device 5 using the jig 1 wherein the electronic device 5 further comprises a further housing 59 which is in contact with the package 51. The pressurizing portion 12 and the operating portion 13 abut against the casing 59 to lock the casing 59 and the circuit board 52 to the casing 58. In the present embodiment, the jig 1, the housing 59, the circuit board 52, and the housing 58 are disposed correspondingly. During assembly, the second pressure P2 and the third pressure P3 applied by the operating portion 13 fall on the housing 59, and the housing 59 is in contact with the package 51, and the first pressure P1 applied by the pressing portion 12 is applied. It also falls on the housing 59, and the third pressure P3 plus the second pressure P2 is approximately equal to the first pressure P1. The pressure arrangement according to the previous embodiment can avoid the problem that the circuit board 52 and the package 51 are damaged due to uneven force, thereby ensuring electrical connection between the package 51 and the circuit board 52. And improve product yield. Fig. 9 is a top plan view showing a jig 2 according to a second embodiment of the present invention, comprising a body 21, a plurality of pressing portions 22, and an operating portion 23. The pressurizing portion 22 and the operating portion 23 are located around the body 21. The electronic device 5 can also be assembled by using the jig 2. Since the mounting method is substantially the same as that of the first embodiment, it will be simply described. Referring to FIG. 3 and FIG. 9 simultaneously, when the jig 2 is disposed on the circuit board 52, the pressing portions 22 can respectively apply the first pressure P1 of the circuit board 52, and the operation portion 23 can be applied to the circuit board. 52 second pressure P2. Since the method of making the first pressure P1 different from the second pressure P2 has been described in detail in the first embodiment, it will not be described again. When the circuit board 52 is locked to the housing 58, the third pressure P3 and the second pressure P2 caused by the locking will be equal or approximate to the first pressure P1, so that the unevenness of the circuit board 52 due to the force can be avoided. The problem of damage to the solder joints 53 further ensures electrical connection between the package body 51 and the circuit board 52, and improves product yield. It should be noted that if the operator or the mechanical device can simultaneously lock the two fixing portions 521, 521' on the circuit board 52, the square fixture 2 is taken as an example, and the jig 2 can also have two operating portions 23 at the same time. The pressing portion 22 is provided at the opposite corners. 10 is a plan view showing a jig 3 according to a third embodiment of the present invention, which includes a body 31, a plurality of pressing portions 32, and an operating portion 33. The pressing portion 32 and the operating portion 33 are located around the body 31. . Referring to FIG. 3 and FIG. 10 simultaneously, the difference from the second embodiment is that the body 31 of the jig 3 is a solid square, and the jig 3 further includes a station code 34, for example, The arc station code or the plurality of missing blocks 'is disposed on the body 31 and adjacent to the pressing portions 32. That is, the position of the pressurizing portion 32 is determined by placing the weight 34 at a different position. In addition, the body 31 further has a receiving area 35 for receiving the weight 34. The receiving area 35 can be, for example, an annular groove or a plurality of dimples, and the weight 34 can be set according to the weight required by the pressing portion 32. Any position within the annular groove or pit. Among them, the weight 34 only needs to be an object having a weight, and does not limit the shape or material of the weight 34. When the next fixing portion 52 is to be locked, the weight 34 can be moved (for example, the receiving area 35 is an annular track, the weight 34 can be slid on the road or the straight 12 1322235 can be moved manually or by machine. Code 34) to change the position at which the jig 3 is pressed corresponding to the fixed portion 521. In this way, the locking of the next fixing portion 52 can be performed without rotating the jig 3. Figure 11 is a top plan view showing a fixture 4 according to a fourth embodiment of the present invention, comprising a body 41, a plurality of pressing portions 42 and an operating portion 43. The pressing portion 42 and the operating portion 43 are located around the body 41. . Referring to FIG. 3 and FIG. 11 simultaneously, the difference from the second embodiment is that the body 41 of the jig 4 is a solid square, and the jig 4 has a missing code 44 and a plurality of accommodating areas. 45 and a rotating member 46, one end of the rotating member 46 is coupled to the weight 44, and the other end is pivotally disposed on the body 41. By moving one end of the rotating member 46, the weight 44 can be placed at a different position, and the position of the jig 4 corresponding to the pressing portion of the fixing portion 521 can be changed to form the pressing portion 42. Of course, the embodiment can have a plurality of rotating members 46 and a plurality of weights 44 as needed. In FIG. 11, the fixture 4 has only one rotating member 46 and a station code as an example. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic view of a conventional circuit board screwed to a housing; FIG. 1B is a schematic view of the circuit board of FIG. 1A screwed behind the housing; FIG. 2 is a first embodiment of the present invention; A schematic diagram of a fixture of the embodiment; 13 1322235 FIG. 3 is a schematic diagram of an electronic device; FIG. 4 is assembled by a fixture of @2, FIG. 3 is a schematic diagram of the 蕻 冈 冈 从, /|:1 卞Not intended; the straw is assembled from the jig of Fig. 2; the flow chart of Fig. 3; the assembly intention of the electric device; the intention; Fig. 6 is an illustration of the electronic device assembled by the jig of Fig. 2 2 is a schematic view of an electronic device assembled by the jig of FIG. 2; FIG. 8 is a view showing an electronic device assembled by the jig of FIG. 2; FIG. 9 is a second embodiment of the present invention. FIG. 10 is a schematic view of a jig according to a third embodiment of the present invention; and 1 1 ^ is a schematic view of a jig according to a fourth embodiment of the present invention. [Description of main component symbols] I ' 2 ' 3, 4: Fixture 41: Main body II '21 > 31. 32, 42: Pressurizing portions 33, 43: Operating portion 111: Openings 12, 22, 13, 23, 131: perforation 45: accommodating area 34' 44: weight 35, 1322235 46: rotating member 5, 5a, 5b, 7: electronic device 51, 51a, 71: package 511: carrier board 52, 72: circuit board 521 521': fixing portion 53, 73: solder joint 54: heat radiating unit 58, 59, 78: housing 581, 781: screw hole 721: hole 74: heat sink A-A': section line P1: first pressure P2 : second pressure P3 : third pressure S : screw SOI ~ S02: steps of the assembly method