1289610 玖、發明說明： 【發明所屬之技術領域】 本發明之實施例一般係提供用於基材製造技術 材支撐及其製造方法。 【先前技術】 液晶顯示器或面板顯示器常作為諸如電腦及電 幕之類的主動陣列顯示器來用。大致而言，面板包含 玻璃板，彼此之間夾有一層液晶材料C»其中至少一層 板包括於其上配置著與電源供應器連接的至少一層 膜。由電源供應器供應到導電膜的電力改變了液晶材 方向’而在顯示器上產生肉眼可見的圖案，例如文字 形。其中一種常用來生產面板的製程是電漿增強化學 沉積法（PECVD)。 電漿增強化學氣相沉積法一般係應用於將薄膜 在例如矽或石英晶圓、大面積玻璃製品或聚合物製造 等基材上。電漿增強化學氣相沉積法通常是藉由將氣 質引到内含基材之真空處理室内而達成。氣態先質典 係流經位在靠近真空處理室頂端的分配板。處理室内 態先質因接受與處理室連接的一個或多個（RF)電源 應之RF電力而通電（例如受激發）形成電漿。受激發 體進行反應而在位於有溫度控制的基材支撐上的基材 形成一層材料。當某些應用中基材接受的是低溫多晶 時，基材支撐可加熱到攝氏400度以上。反應中所產 之基 視螢 二層 破璃 導電 料的 或圖 氣相 沉積 製品 態先 型地 之氣 所供 的氣 表面 矽層 生的 1289610 揮發性副產品則經由排氣系統從處理室排出。 一般而言，製造平面顯示器所使用基材支撐屬於大型 的，經常超過5 50亳米x 650毫米。高溫用途的基材支樓 典型地係經鍛造或焊接，將一個或多個發熱元件及熱電偶 封裝在鋁製機體之内。基材支撐典型地係在較高溫（即超過 攝氏3 50度且接近攝氏5〇〇度）下操作。由於係在高溫下操 作，若未能適時將熱引出並分散到基材支撐處，便可能因 在局部形成熱點而極易使基材支撐内封包的發熱元件故 •障。 雖然此種用途之基材支撐已顯示良好的製造效能， 不過此種支撐事實上不易製造且相當昂貴。此外，由於材 料以及製造基材支撐之成本昂貴，基材支撐製造失敗是極 端須避免的。此外，若基材支撐在製造時失敗，其所支撐 之基材便可能受損。由於這些現象可能在進行完數道製程 後發生，因此在製程中造成的基材損失便可能非常龐大。 此外，在替換製造處理室内受損的支撐時亦會產生昂貴基 φ 材生產量損失，因製造處理室在替換或修理基材支擇時必 須停工。尤有甚之’新一代基材支撐須在接近攝氏5〇〇度 下配合2平方公尺以上的基材因而尺寸增加，解決上述問 題變得更為迫切。 因此，有需要尋求改良式基材支樓。 【發明内容】 本發明在此提供加熱的基材支樓實施例。在一實施例 6 1289610 中’該基材支撐包括一機體其具有支稽面以及至少一個溝 槽。溝槽内配置有由展性散熱片包覆的發熱元件。在受包 覆的發熱元件和溝槽之間實質上並無空氣。在溝槽内發熱 疋件之上方有插入件。此插入件實質上覆蓋住並接觸到受 包覆的發熱元件及溝槽壁。在在溝槽内之插入件上方有溝 蓋。此溝蓋覆蓋住並接觸到插入件，且其上表面之位置實 質上與支撑表面齊平。 在另一實施例中，該基材支撐包括一機體其具有支 撐面以及至少一個溝槽。溝槽内配置有由展性散熱片圍繞 的發熱元件。散熱片可由一個或多個部件組成。溝槽内散 熱片上方配置有一溝蓋，且具有一上表面，配置成其方位 實質上與支撐面齊平。 在另一實施例中，其係提供形成基材支撐之方法。 形成基材支撐之方法包括提供機體之步驟，在該機體的上 方支撐表面形成有至少一溝槽；以及插入一發熱元件至該 溝槽内的步驟，該發熱元件係由較該機體更為柔軟材質所 製成的散熱片所圍繞。散熱片可由一個或多個部件組成。 溝蓋係位在溝槽内發熱元件和散熱片的上方。溝蓋之上表 面實質上係與該機體之上支樓表面齊平。 【實施方式】 本發明係關於提供一種加熱的基材支撐以及其製造 方法。本發明以PECVD系統，例如取自 AKT(Applied Materials, Inc.，Santa Clara，California)之 PECVD 系統作 71289610 发明, INSTRUCTION DESCRIPTION: TECHNICAL FIELD OF THE INVENTION Embodiments of the present invention generally provide a substrate support material manufacturing method and a method of manufacturing the same. [Prior Art] A liquid crystal display or a panel display is often used as an active array display such as a computer and a screen. In general, the panel comprises a glass plate with a layer of liquid crystal material C» interposed therebetween, at least one of which comprises at least one film disposed thereon to be connected to a power supply. The power supplied from the power supply to the conductive film changes the direction of the liquid crystal material to produce a visually visible pattern on the display, such as a character shape. One of the processes commonly used to produce panels is plasma enhanced chemical deposition (PECVD). Plasma enhanced chemical vapor deposition is generally applied to substrates such as tantalum or quartz wafers, large area glass articles or polymer substrates. Plasma enhanced chemical vapor deposition is typically accomplished by introducing the gas into a vacuum processing chamber containing the substrate. The gaseous precursors flow through the distribution plate near the top of the vacuum processing chamber. The processing chamber precursor is energized (e.g., excited) by receiving RF power from one or more (RF) power sources connected to the processing chamber to form a plasma. The exciter reacts to form a layer of material on the substrate on the temperature controlled substrate support. When the substrate is subjected to low temperature polycrystalline in some applications, the substrate support can be heated to above 400 degrees Celsius. In the reaction, the fluorinated by-products are discharged from the processing chamber through the exhaust system. The 1289610 volatile by-products are discharged from the processing chamber through the exhaust system. In general, the substrate support used to make flat-panel displays is large, often exceeding 5 50 mm x 650 mm. A substrate support for high temperature applications is typically forged or welded to encapsulate one or more heating elements and thermocouples within an aluminum body. Substrate support is typically operated at higher temperatures (i.e., above 50 degrees Celsius and near 5 degrees Celsius). Since the system is operated at a high temperature, if the heat is not taken out and dispersed to the support of the substrate in a timely manner, the heat-generating element which is easily supported by the substrate can be easily formed by forming a hot spot locally. While substrate support for such applications has shown good manufacturing performance, such support is in fact not easy to manufacture and relatively expensive. In addition, due to the high cost of materials and substrate support, manufacturing failure of the substrate support is extremely extreme. In addition, if the substrate support fails during manufacture, the substrate it supports may be damaged. Since these phenomena may occur after several passes, the substrate loss during the process can be very large. In addition, the loss of expensive base material production is also incurred in replacing the damaged support in the manufacturing process chamber, as the manufacturing process chamber must be shut down when replacing or repairing the substrate. In particular, the new generation of substrate support has to be added to a substrate of more than 2 square meters at a temperature close to 5 degrees Celsius, which increases the size. Therefore, there is a need to find an improved substrate support. SUMMARY OF THE INVENTION The present invention provides an embodiment of a heated substrate support. In an embodiment 6 1289610 the substrate support comprises a body having a support surface and at least one groove. A heat generating component covered with a stretchable heat sink is disposed in the groove. There is substantially no air between the coated heating element and the trench. There is an insert above the heat generating element in the groove. The insert substantially covers and contacts the coated heating element and the trench walls. There is a groove above the insert in the groove. The groove cover covers and contacts the insert and its upper surface is substantially flush with the support surface. In another embodiment, the substrate support includes a body having a support surface and at least one groove. A heat generating element surrounded by a stretchable fin is disposed in the groove. The heat sink can be composed of one or more components. A groove cover is disposed above the heat sink in the groove, and has an upper surface configured to be substantially flush with the support surface. In another embodiment, it provides a method of forming a substrate support. The method for forming a substrate support includes the steps of providing a body, wherein at least one groove is formed on an upper support surface of the body; and a step of inserting a heating element into the groove, the heating element being softer than the body The heat sink is made of material. The heat sink can be composed of one or more components. The trench cover is positioned above the heat generating component and the heat sink in the trench. The surface above the trench cover is substantially flush with the surface of the upper deck of the body. [Embodiment] The present invention relates to providing a heated substrate support and a method of manufacturing the same. The present invention is based on a PECVD system, such as a PECVD system from AKT (Applied Materials, Inc., Santa Clara, Calif.).
1289610 例示性說明。不過，應瞭解本發明亦可使用其他種系 構，例如物理氣相沉積系統、離子植入系統、蝕刻系 其他化學氣相沉積系統以及其他使用加熱型基材支撐 統0 第1圖是電漿輔助化學氣相沉積系統1 〇〇實施例 面圖。系統1 00包括連接到氣體供應源1 04之處理室 處理室102由多個壁1〇6、一底部108、及一蓋組件 界定出操作室112。操作室112典型地係透過多個壁瘦 上之出入端（未顯示）供基材140進出處理室102。該 壁106和底部108典型地為單一鋁塊或其它可供作製 途之材料。該蓋組件110包含一幫浦充氣機114，其 操作室112與排氣端（可包括各種幫浦，未顯示）相通 該蓋組件110是由多個壁106支撐且可予以拆除 使用處理室102。蓋組件110 —般而言包含鋁。分配相 是輕合至蓋組件110内部側邊120。分配板118典型 鋁製。中央部份包括一通孔區，經此區可將製造物以 氣體供應源104供應的其他氣體運送到操作室112。 板118之通孔區的構造是用來將氣體經過分配板U8 地配送到處理室102内。 加熱型基材支樓組件138係配置在處理室1〇2 中央位置。基材支撐組件138在製造過程中支樓著 1 40。在一實施例中，基材支撐組件1 3 8包含一銘機體 封進其内部的有至少一包埋的發熱元件132以及一熱 190。機體124可視需要加上塗層或經過電鑛。此外， 統架 統、 的系 之剖 102° 110 ；106 多個 程用 可使 > 以便 L 118 地為 及由 分配 平均 内之 基材 124， 電偶 機體 8 1289610 124可為陶瓷材質或其他與製程環境相容的材料。 發熱元件132,例如配置在支撐組件138内之電極， 係耦合至電源130並可調控式地將位在其上之支撐組件 138及基材140加熱至預定的溫度。典型地，發熱元件132 可使基材140之溫度維持在介於約攝& 15〇到至少約㈣ 度之均溫下。 通常，支撐組件138具有下側邊126以及可支撐基 材的上表面134β在在一實施例中，支撐之上表面134的 結構是用於支撐面積大於或等於約550乘約650毫米之基 材。在-實施例中，支樓之上表面134之平面面Ζ於或 等於約0.35平方公尺以便支撐尺寸大於或等於約55Q乘 650毫米之基材。在一實施例中，支撐之上表面134之平 面面積大於或等於約2.7平方公尺(以便支樓尺寸大於或等 於約1500乘1 800毫米之基材）。該支撐之上表面134通常 可為任何形狀或構造。在一實施例中，支樓之上表面134 可為實質的多邊形。在—實施例巾，支撐之上表面是四邊 形。 下側邊126係連接到柄蓋144。柄蓋144 一般而言是 銘環，其係連接在支撑組件138上以便作為供柄轴142附 者的固定面。-般而言，柄轴142自柄iM4延㈣出並 使支撐組件138連接到昇降系統（未顯示），該系統可使支 撐組件138在一較高的位置（如圖示）和一降低位置之間移 動。在移動支樓組件138時伸縮囊146可在腔室112與處 理室102外之大氣之間提供真空密封。柄軸142更提供一 1289610 條使支撐組件1 3 8和系統1 〇 〇其他元件之電力及熱電偶相 連結的管道。1289610 An illustrative description. However, it should be understood that the present invention may also use other types of structures, such as physical vapor deposition systems, ion implantation systems, etching systems, other chemical vapor deposition systems, and other uses of heated substrate support systems. Auxiliary Chemical Vapor Deposition System 1 面 Example of the embodiment. System 100 includes a processing chamber coupled to gas supply 104. Processing chamber 102 defines an operating chamber 112 from a plurality of walls 1-6, a bottom portion 108, and a lid assembly. The operating chamber 112 is typically permeable to the substrate 140 into and out of the processing chamber 102 through a plurality of walled inlets and outlets (not shown). The wall 106 and bottom 108 are typically a single piece of aluminum or other material that can be used in the manufacture. The lid assembly 110 includes a pump inflator 114 having an operating chamber 112 in communication with an exhaust end (which may include various pumps, not shown). The lid assembly 110 is supported by a plurality of walls 106 and is removable for use with the processing chamber 102. . Cover assembly 110 generally comprises aluminum. The dispensing phase is lightly coupled to the inner side 120 of the lid assembly 110. Distribution plate 118 is typically aluminum. The central portion includes a through-hole region through which other gases supplied by the gas supply source 104 can be transported to the operating chamber 112. The through-hole region of the plate 118 is configured to dispense gas into the processing chamber 102 through the distribution plate U8. The heating type substrate branch assembly 138 is disposed at a central position of the processing chamber 1〇2. The substrate support assembly 138 is swelled during the manufacturing process. In one embodiment, the substrate support assembly 138 includes at least one embedded heat generating component 132 and a heat 190 sealed into the interior of the body. The body 124 can be coated or passed through an electric mine as needed. In addition, the system of the system is 102° 110; 106 multiple processes can be used to make the L 118 ground and the substrate 124 distributed in the average, the galvanic body 8 1289610 124 can be ceramic or other Materials compatible with the process environment. A heating element 132, such as an electrode disposed within the support assembly 138, is coupled to the power source 130 and can modulate the support assembly 138 and substrate 140 positioned thereon to a predetermined temperature. Typically, the heating element 132 maintains the temperature of the substrate 140 at an average temperature between about & 15 Torr to at least about (four) degrees. Typically, the support assembly 138 has a lower side 126 and an upper surface 134 that can support the substrate. In one embodiment, the support upper surface 134 is configured to support a substrate having an area greater than or equal to about 550 by about 650 mm. . In an embodiment, the planar surface of the upper surface 134 of the support is at or equal to about 0.35 square meters to support a substrate having a size greater than or equal to about 55Q by 650 millimeters. In one embodiment, the planar surface area of the support upper surface 134 is greater than or equal to about 2.7 square meters (so that the size of the support is greater than or equal to about 1500 by 1 800 mm). The support upper surface 134 can generally be of any shape or configuration. In an embodiment, the upper surface 134 of the branch may be a substantial polygon. In the embodiment, the upper surface of the support is quadrangular. The lower side 126 is coupled to the handle cover 144. The handle cover 144 is generally an inscribed ring that is attached to the support assembly 138 to serve as a mounting surface for the attachment of the stem shaft 142. In general, the arbor 142 extends (4) from the shank iM4 and connects the support assembly 138 to a lifting system (not shown) that allows the support assembly 138 to be in a higher position (as shown) and a lowered position. Move between. The bellows 146 can provide a vacuum seal between the chamber 112 and the atmosphere outside of the processing chamber 102 as the branch assembly 138 is moved. The arbor 142 further provides a 1289610 conduit for connecting the support assembly 138 to the power and thermocouples of the system 1 and other components.
支標組件138具有數個孔128，其配置方位可接受 數個昇降銷15〇。昇降銷150典型地包含陶瓷材質或電鍍 銘。一般而言，當昇降銷150位在正常的位置（即，自支樓 組件138縮回）時，昇降銷15〇有第一末端160，其實質上 與支撐組件138之上表面134齊平或略微下陷。第一末端 160通常為喇π八形以免昇降銷15〇經由孔128掉落。昇降 銷150之第二末端164延伸到支撐組件138之下側邊ι26 之後。昇降銷1 5 0可由昇降板1 54自支撐組件1 3 8上移位 而突出支撐表面134，藉以將基材移離支撐組件138有一 段空間距離。 支偉組件1 3 8通常予以接地以便電源丨22供應到分 配板118(或其他位在或接近處理室蓋組件之電極）的電 源可激發配置在操作室112内介於支撐組件138及分配板 118之間的氣體。電；原122供應❾RF電源一般而言是依基 材大小配合選用以驅動化學氣相沉積製程。 支撐組件138並另外支撐週圍的遮蔽架148。一般而 言，遮蔽架148能防止在基材14〇及支撐組 沈積以免基材黏附在支樓…3… 之“ 第圖係顯不在基材支撐組件138内形成之溝槽2〇4 中配置的發熱元件132之部份剖面圖。發熱元# 132 一般 b括數個裳填在電偶極222内的導電性元件224並以保護 鞘220覆蓋。發熱元件132並包括包圍著保護鞘22〇的包 10 128961ο 覆屉 2l〇 Μ。包覆層210與保護鞘220形成一體，其包覆層 件 鞘220之間實質上沒有氣室在一實施例中，發熱元 覆。/可用適當的包覆層片21〇緊裹在鞘220四周加以包 再經或者&覆層210亦可由直徑大於鞘220之管線形成， 預^由鑄模抽拉並繞著發熱元件i 32之鞘彎曲。此外， 發熱το件132亦可包含由包覆層21〇環繞四周的管道 肩示）以供熱傳遞流體於其間流動。 一般而言，包覆層21〇具有良好熱傳導性，且直 足以在黑‘為、* + ' 也间加熱速率下作為散熱片以便實質上能於操作期間 人發熱疋件132產生熱點。如此’I覆層210 -般可包 含任何具有高熱傳導性的材料以便包覆層21〇能於操作期 :作為導電性元件224所產生之熱的散熱片。各種用途所 ^ I覆層210的厚度可根據發熱元件132所需的熱負載 罝计算出。包覆層210之材質一般亦比基材支撐组件138 之機體124柔軟，或更具展性，以免在插入發熱元件 時使/冓槽2G4變形。在_實施例中，&覆層21。可由高純 度的特級塑鋁材料製成，例如鋁1100至約鋁300010ο系 列。在另-實施例巾，包覆層21〇可由任何能承受埶 之1 XXX系列材料製成，其中χ是整數。包覆層21〇可 分地退火。在一實施例中，包覆層210係以鋁1100_0形成。 另實施例中，包覆層210係以鋁3004形成。 發”、、元件132係配置於基材支撐組件138之上表 形成之溝’ 2〇4内，或多溝槽内。此外，用以容納發 熱元件132之涛槽2〇4可在基材支撐的下側邊126形成。 11 1289610 溝槽204有多個壁206及底部230，其在裝配時一般並非 緊密接觸。溝槽204在基材支撐組件138之機體124上可 依實際需要以任何數目、大小、或圖案形成，以產生所使 t發熱元件132所要求的熱分佈型態。溝槽2〇4的深度 一般足以在搞入溝槽204後能使發熱元件132位在所要求 的位置上且其深度視用途而不同。在一實施例中，其溝槽 204之深度計算係使發熱元件132實質上位在基材支撐組 件138之機體124的正中央。 在一實施例中，溝槽204的直徑比發熱元件1 32之鞘 220大但比插入之前包覆層21〇的直徑小，如第*圖所示。 發熱το件132是往溝槽204按壓嵌入，以使展性的包覆層 210在往溝槽2〇4内插入時變形並破壞本身的氧化層，藉 以使發熱元件132和溝槽204之間有整體性的接觸。由於 籌槽〇4之直徑比勒220大’在往溝槽204内插入發熱元 件132時並不會損害導電性元件224和電偶極222。 溝槽204之多個壁206實質上可為直而平行的。視需 要，溝槽204之多個壁206可略以角度或錐狀形成，而使 溝槽204之底部230比溝槽2〇4之上方部份略微狹窄。多 個壁2 0 6之間的錐形角度一般小於3度，雖然亦可使用較 大的錐形角度。錐形的多個壁2〇6使發熱元件132易於插 入，而變窄的溝槽204底部23〇仍足以使包覆層21〇與機 體124緊密貼附而形成整體性接觸。 溝槽204底部230可為放射狀以配合發熱元件132之 形狀。另外，或同時，溝槽204底部23〇可加以粗化，或 12 1289610 呈紋理狀，以有助於在發熱元件132包覆層210和基材支 撐組件138機體124之間形成更緊密的密封或鎖緊。表面 紋理並能防止在發熱元件132與基材支撐組件138機趙 124之間產生位移。 在溝槽204底部230内亦可提供通道228。通道228 在插入發熱元件132時可使空氣向外泡而使發熱元件I?】 及溝槽204更加鎖緊。將發熱元件132插入溝槽2〇4内時， 0 包覆層210之一部份232會變形填滿通道228而與基材支 樓組件138機體124整體更全面性地接觸。實質上並無氡 泡停留在包覆層2 1 0和溝槽204之間，使得從發熱元件t 3 8 往基材支撐組件138機體124的熱傳遞效應更為提高。視 需要’在插入發熱元件132之前，可先清洗溝槽2〇4以去 除任何存在於表面溝槽204接觸面上的既有氧化物。例 如’氧化層可用腐蝕性材料磨掉、蝕刻，或在插入發熱元 件132之前先於表面溝槽2〇4之接觸面塗上次微米厚度的 抑止劑層以去除氧化層。 Φ 插入件214係配置在溝槽204内的、發熱元件132 之上方，其係與包覆層210及基材支撐組件138機體124 緊密接觸。插入件214 —般是由與包覆層210相同之材料 製成’可更加改善從發熱元件132送出的熱傳遞。插入件 214之底部部份234可為彎曲狀或呈能與發熱元件η]之 包覆層210的上表面更均勻配合之形狀。在插入件214内 可形成數個排氣孔226，以便裝配時插入件2丨4底部部份 2 3 4和發熱元件丨3 2之間的空氣能排出，以確保插入件2 η 13 !28961〇 和發熱元件132之包覆層210之間有更整體性的接觸。在 一實施例中，如第6圖所描述，插入件214的下方部位 係與溝槽204之多個壁206接觸而上層部位6〇4則略突出2 而未接觸到多個壁206。例如，上層部位6〇4可突出數千 分之一英吋。在插入件214與溝槽2〇4之多個壁2〇6之間 減少的表面接觸促使插入件214易於插入溝槽204内。脸 将 插入件214敲錘、捲動、按壓或鍛造進入溝槽2〇4時，便 φ 可消除此突出。插入件214材質的柔軟性使此過程易於進 行而不致於造成機體124之材料實質上變形。在插入溝槽 2 04之後，可修整插入件214以提供一真正的表面以便讓 溝蓋218覆蓋在插入件214上。 溝盍218係覆蓋在插入件214上且其配置方位實質 上與基材支樓組件138之表面134齊平。溝蓋218可包含 與機體124相同之材料且一般係貼附在溝槽204之多個壁 2 06上以便固定在位置上。在一實施例中，溝蓋218可焊 接在機體124上。或者，溝蓋218可以鍛造在位置上。亦 φ 可考慮利用其他將溝蓋2 1 8貼附在基材支撐組件1 3 8機體 124之方法，只要溝蓋2丨8和機體丨24之間的結合力能承 受在基材支撐組件138製造過程的條件。視需要，溝蓋218 及/或機體124可修整成在同一平面以提供能支撐基材的 平滑表面134。基材支撐組件138亦可在下側邊126修整 以平衡來自包埋的發熱元件132的熱分佈。 第3圖是上述基材支撐組件之製造方法3〇〇的實施例 之流程圖。第3圖描述之方法則以參照第4·7圖進一步說 14 1289610The sub-assembly 138 has a plurality of apertures 128 that are configured to receive a plurality of lift pins 15A. The lift pins 150 typically comprise a ceramic or electroplated name. In general, when the lift pin 150 is in the normal position (ie, retracted from the sub-building assembly 138), the lift pin 15 has a first end 160 that is substantially flush with the upper surface 134 of the support assembly 138 or Slightly subsided. The first end 160 is generally in the shape of a bar à eight to prevent the lift pins 15 from falling through the holes 128. The second end 164 of the lift pin 150 extends beyond the lower side ι26 of the support assembly 138. The lift pin 150 can be displaced from the support assembly 138 by the lift plate 1 54 to project the support surface 134, thereby moving the substrate away from the support assembly 138 for a spatial distance. The support assembly 1 3 8 is typically grounded so that the power supply 22 is supplied to the distribution plate 118 (or other electrode located at or near the process chamber cover assembly) to energize the configuration within the operation chamber 112 between the support assembly 138 and the distribution plate. Gas between 118. Electricity; the original 122 supply ❾RF power supply is generally selected according to the size of the substrate to drive the chemical vapor deposition process. The support assembly 138 and additionally supports the surrounding shield 148. In general, the mask 148 prevents the substrate 14 and the support set from depositing in the trenches 2〇4 formed in the substrate support assembly 138. A partial cross-sectional view of the heating element 132. The heating element #132 generally includes a plurality of electrically conductive elements 224 that are filled in the electric dipole 222 and are covered by a protective sheath 220. The heating element 132 includes a protective sheath 22 The package 10 128961 is covered with a cover 210. The cover layer 210 is integrally formed with the protective sheath 220, and there is substantially no air chamber between the cover layer sheaths 220 in one embodiment, and the heat is covered. The cover sheet 21 is tightly wrapped around the sheath 220 for wrapping or & the coating 210 may also be formed by a line having a diameter larger than the sheath 220, which is drawn by the mold and bent around the sheath of the heating element i 32. The heat generating member 132 may also include a pipe shoulder surrounded by the cladding layer 21 ) for the heat transfer fluid to flow therebetween. Generally, the cladding layer 21 has good thermal conductivity and is sufficiently straightforward to be black , * + ' also as a heat sink for the heat rate The heat generating member 132 can generate a hot spot during operation. Thus, the 'I cladding layer 210 can generally comprise any material having high thermal conductivity so that the cladding layer 21 can be used during operation: heat generated as the conductive member 224 The thickness of the cladding layer 210 can be calculated according to the thermal load required for the heating element 132. The material of the cladding layer 210 is also generally softer than the body 124 of the substrate support assembly 138, or more Extensibility, so as not to deform the groove 2G4 when inserting the heat generating component. In the embodiment, the & cladding layer 21 can be made of a high-purity special-grade plastic aluminum material, such as aluminum 1100 to about aluminum 300010ο series. - The embodiment of the cover, the cover 21 can be made of any material capable of withstanding the XXX series, wherein χ is an integer. The cover 21 can be annealed separately. In an embodiment, the cover 210 is The aluminum layer 1100_0 is formed. In another embodiment, the cladding layer 210 is formed of aluminum 3004. The element 132 is disposed in the trench formed in the surface of the substrate supporting component 138, or within the plurality of trenches. . Additionally, a trough 2, 4 for receiving the heat generating element 132 can be formed on the lower side 126 of the substrate support. 11 1289610 The groove 204 has a plurality of walls 206 and a bottom 230 that are generally not in intimate contact when assembled. The grooves 204 can be formed in any number, size, or pattern on the body 124 of the substrate support assembly 138 to provide the desired thermal profile for the t-heat generating component 132. The depth of the trenches 2〇4 is generally sufficient to enable the heat generating component 132 to be in the desired position after the trench 204 is formed and its depth varies depending on the application. In one embodiment, the depth of the trench 204 is calculated such that the heat generating component 132 is substantially centered in the body 124 of the substrate support assembly 138. In one embodiment, the diameter of the trench 204 is larger than the sheath 220 of the heat generating component 1 32 but smaller than the diameter of the cladding 21 之前 prior to insertion, as shown in FIG. The heat generating member 132 is press-embedded into the groove 204 to deform and break the oxide layer of the spreading coating layer 210 when inserted into the groove 2〇4, thereby causing the heat generating element 132 and the groove 204 to be interposed therebetween. There is a holistic contact. Since the diameter of the groove 4 is larger than 220, the conductive element 224 and the electric dipole 222 are not damaged when the heat generating element 132 is inserted into the groove 204. The plurality of walls 206 of the trenches 204 can be substantially straight and parallel. If desired, the plurality of walls 206 of the trenches 204 may be formed slightly angled or tapered such that the bottom 230 of the trenches 204 is slightly narrower than the upper portion of the trenches 2〇4. The taper angle between the plurality of walls 206 is generally less than 3 degrees, although larger taper angles can also be used. The plurality of tapered walls 2〇6 facilitate the insertion of the heat generating element 132, while the bottom 23〇 of the narrowed groove 204 is still sufficient for the cover layer 21 to be in close contact with the body 124 to form a unitary contact. The bottom 230 of the trench 204 can be radially shaped to match the shape of the heat generating component 132. Additionally, or at the same time, the bottom 23 of the trench 204 may be roughened or 12 1289610 textured to help form a tighter seal between the heat-generating component 132 cladding 210 and the substrate support assembly 138 body 124. Or lock. The surface texture prevents displacement between the heat generating component 132 and the substrate support assembly 138. A channel 228 can also be provided in the bottom 230 of the trench 204. The passage 228 allows the air to bubble outwardly when the heating element 132 is inserted, so that the heating element I and the groove 204 are more locked. When the heating element 132 is inserted into the trench 2〇4, a portion 232 of the cladding layer 210 deforms to fill the channel 228 for more overall contact with the substrate assembly 124 of the substrate assembly 138. Substantially no bubbles remain between the cladding 210 and the trenches 204, so that the heat transfer effect from the heat generating component t38 to the substrate 124 of the substrate support assembly 138 is further enhanced. The trenches 2〇4 may be cleaned prior to insertion of the heat generating component 132 to remove any existing oxide present on the contact surface of the surface trench 204, as desired. For example, the oxide layer may be abraded, etched with a corrosive material, or the last micron-thickness inhibitor layer may be applied to the contact surface of the surface trench 2〇4 to remove the oxide layer prior to insertion of the heat-generating element 132. The Φ insert 214 is disposed over the heat generating component 132 within the trench 204 and is in intimate contact with the cladding 210 and the substrate support assembly 138 body 124. The insert 214 is generally made of the same material as the cladding layer 210 to further improve heat transfer from the heat generating component 132. The bottom portion 234 of the insert 214 can be curved or in a shape that more uniformly fits the upper surface of the cladding 210 of the heat generating component η]. A plurality of venting holes 226 may be formed in the insert member 214 so that air between the bottom portion 234 of the insert member 2丨4 and the heat generating member 丨3 2 can be discharged during assembly to ensure the insert 2 η 13 !28961 There is a more integral contact between the crucible and the cladding 210 of the heating element 132. In one embodiment, as depicted in Fig. 6, the lower portion of the insert 214 is in contact with the plurality of walls 206 of the groove 204 and the upper portion 6〇4 is slightly projecting 2 without contacting the plurality of walls 206. For example, the upper portion 6〇4 can protrude by a few thousandths of an inch. The reduced surface contact between the insert 214 and the plurality of walls 2〇6 of the groove 2〇4 facilitates insertion of the insert 214 into the groove 204. When the face is hammered, rolled, pressed or forged into the groove 2〇4, the protrusion φ can eliminate this protrusion. The softness of the material of the insert 214 allows the process to be easily performed without causing substantial deformation of the material of the body 124. After insertion of the groove 404, the insert 214 can be trimmed to provide a true surface for the groove cover 218 to overlie the insert 214. The gully 218 is overlaid on the insert 214 and is disposed substantially flush with the surface 134 of the substrate subassembly 138. The trench cover 218 can comprise the same material as the body 124 and is typically attached to the plurality of walls 206 of the trench 204 for attachment in position. In an embodiment, the trench cover 218 can be welded to the body 124. Alternatively, the trench cover 218 can be forged in position. Also φ may be considered to utilize other methods of attaching the trench cover 2 1 8 to the substrate support assembly 138 body 124 as long as the bonding force between the trench cover 2 丨 8 and the body 丨 24 can withstand the substrate support assembly 138. The conditions of the manufacturing process. The trench cover 218 and/or the body 124 can be trimmed in the same plane to provide a smooth surface 134 that can support the substrate, as desired. The substrate support assembly 138 can also be trimmed at the lower side 126 to balance the heat distribution from the embedded heating element 132. Fig. 3 is a flow chart showing an embodiment of the above-described method of manufacturing the substrate supporting member. The method described in Figure 3 is further described with reference to Figure 4. 7 14 1289610
明。方法300包括步驟3 02,其中發熱元# 132是裝填在 包覆層210内。在步驟3 04中，該發熱元件132是插入在 基材支撐組件138内形成的溝槽2〇4中。發熱元件132可 經施力，例如，機械壓力或水壓機，強制進入溝槽204中。 亦可利用其他方法將受包覆的發熱元件132插入溝槽2〇4 内。如第4圖展示，由於包覆層210之厚度，溝槽204通 常比發熱元件132之直徑略狹窄。展性的包覆層210在受 力強制插入溝槽204時會變形。此優點町造成包覆層210 以及溝槽204之間實質上完全接觸，如第5圖所描述。亦 參考第5圖，在在一實施例中，將以施力強制包覆層2 i 〇 之部份232進入在溝槽2〇4内形成的通道228。 接下來’在步驟306中，插入件214是插入溝槽204 以掩蓋發熱元件132，如第6圖描述。插入件214實質上 填滿了溝槽20 4中未被發熱元件丨3 2佔據的空間。插入件 214 —般可用步驟3 〇4中插入發熱元件132的方法按壓嵌 入溝槽204中。一旦安裝了插入件214,發熱元件132上Bright. The method 300 includes a step 302 in which the heat element #132 is loaded within the cladding layer 210. In step 304, the heat generating component 132 is inserted into the trench 2〇4 formed in the substrate support assembly 138. The heat generating component 132 can be forced into the trench 204 by applying a force, such as a mechanical pressure or hydraulic press. The coated heating element 132 can also be inserted into the trench 2〇4 by other methods. As shown in Fig. 4, the trench 204 is generally slightly narrower than the diameter of the heat generating component 132 due to the thickness of the cladding layer 210. The malleable cladding layer 210 deforms when forced to be inserted into the trench 204. This advantage causes substantially complete contact between the cladding 210 and the trenches 204, as depicted in Figure 5. Referring also to Fig. 5, in an embodiment, the portion 232 of the cladding layer 2 i 以 is forced to enter the channel 228 formed in the trench 2〇4. Next, in step 306, the insert 214 is inserted into the trench 204 to mask the heat generating component 132, as depicted in FIG. The insert 214 substantially fills the space in the trench 204 that is not occupied by the heat generating component 丨32. The insert 214 can generally be pressed into the groove 204 by the method of inserting the heat generating component 132 in step 3 〇4. Once the insert 214 is installed, the heating element 132 is placed
便有一淨正向力。如第6圖展示之實施例所述，在步驟306 後插入件214之上表面 138之上表面134。 61 〇維持在略高於基材支撐組件 取傻 2〇4, |牧步驟3〇8, 一溝蓋218(如第7圖）是播入溝枰 蓋218可以使用與步驟304及308相同的方々 插入溝槽内。溝签 麽# s 冓蓋218壓緊插入件214而對發熱元件 1加淨t向力。按壓插入件214 _，插人件214突出的部 ” _膨脹而與溝槽2G4之多個壁2()6接觸。插入件川 15 1289610 上層部位604提供之突出量與插入件214上表 基材支樓組件138之上表面134的程度可根據 在完全將溝蓋218插入溝槽204内與基材支揮 上表面134齊平時會產生的形變計算。應計算 的擴張程度使能填滿溝槽204，以確保插入件 204之多個壁206有整體性接觸而非強制使溝 打開、變寬、或變形。 溝蓋218插入溝槽204的步驟3〇8在將溝 基材支撐組件138機體124之上後即告完成。 修整基材支撐組件之上表面134及溝蓋218以 撐基材的上表面134。 第8A-E圖係顯示另一實施例中基材支撐 製造階段内之部份剖面圖。材支撐組件8〇〇 一 830,在其支撐表面134上至少有一溝槽8〇2形 件804係配置在溝槽8〇2内以管控基材支撐組 度。機體830 —般是由與上述機體124相同之 而加熱器804 —般則是以與上述發熱元件132 製造。 溝槽802 一般包括多個側壁806以及一 多個側壁806可從底部814向外呈喇叭形，或 於支撐表面134而形成，如第8A-E圖顯示。 在多個側壁806形成，將側壁上部份812與側卷 分開。側壁下部份81〇 一般界定出溝槽8〇2的孝 第一展性散熱片816係配置在溝槽8〇2 面6 1 0伸出 按壓強度和 組件1 3 8之 插入件2 1 4 2 1 4與溝槽 槽204向外 蓋218蓋在 視需要，可 改善用於支 800在不同 般包括機體 ，成。發熱元 件800之溫 材料製造， 類似之材料 底部8 1 4。 實質上垂直 階梯808係 t下部份8 1 0 交狹窄部份。 内而與底部 16There is a net positive force. As described in the embodiment illustrated in FIG. 6, after step 306, the upper surface 134 of the upper surface 138 of the insert 214 is inserted. 61 〇 is maintained slightly above the substrate support assembly to take a stupid 2〇4, | shepherd step 3〇8, a trench cover 218 (as shown in Figure 7) is the broadcast gully cover 218 can be used the same as steps 304 and 308 The square is inserted into the groove. Ditch sign # s The cover 218 presses the insert 214 and adds a t-direction force to the heating element 1. Pressing the insert 214 _, the protruding portion of the insert 214 is expanded to contact the plurality of walls 2 () 6 of the groove 2G4. The insert 15 1589610 provides the amount of protrusion of the upper portion 604 and the surface of the insert 214 The extent of the upper surface 134 of the sub-assembly 138 can be calculated based on the deformation that would occur when the trench cover 218 was fully inserted into the trench 204 to be flush with the substrate upper surface 134. The degree of expansion to be calculated enables the trench to be filled. 204, to ensure that the plurality of walls 206 of the insert 204 have integral contact rather than forcing the groove to open, widen, or deform. The step of inserting the trench cover 218 into the groove 204 is to align the body of the trench substrate support assembly 138. Finished above 124. The substrate support assembly upper surface 134 and the trench cover 218 are trimmed to support the upper surface 134 of the substrate. Figures 8A-E show the portion of the substrate support manufacturing stage in another embodiment. The cross-section of the material support assembly 8 830 has at least one groove on its support surface 134. The 〇2 member 804 is disposed in the groove 8〇2 to control the substrate support group. It is the same as the above-mentioned body 124, and the heater 804 is generally the same as the above The heat element 132 is fabricated. The trench 802 generally includes a plurality of sidewalls 806 and a plurality of sidewalls 806 that may be flared outwardly from the bottom 814 or formed on the support surface 134 as shown in Figures 8A-E. Formed at 806, the side wall upper portion 812 is separated from the side coil. The lower side wall portion 81 〇 generally defines a groove 8 〇 2 of the symmetrical first heat sink 816 is disposed on the groove 8 〇 2 surface 6 1 0 extension The pressing strength and the inserting member 2 1 4 2 1 4 of the assembly 1 3 8 and the grooved groove 204 are covered by the outer cover 218 as needed, which can improve the temperature of the heating element 800 for the branch 800 to be differently included. Material manufacturing, similar to the bottom of the material 8 1 4. Substantially vertical step 808 is the lower part of the 8 1 0 intersecting narrow part. Inner and bottom 16
1289610 814接觸。第一展性散熱片816可使用適用於製 覆層210之材料製造。第一展性散熱片816之上 在其中形成之凹部832。凹部832 —般可在溝槽 收及置放發熱元件8 04之一部份。 第二展性散熱片818係配置在溝槽802内， 一散熱片816之間夾著熱元件8〇4，如第8B圖顯 散熱片818可經過量取以產生一種與溝槽8〇2之 812配合的障礙。第二散熱片818可包含一在其 成之凹部836以接受並置放發熱元件804之一部 散熱片818可用適於生產上述包覆層210之材料 在在一實施例中，第一及第二散熱片816、818係 材料製造。在另一實施例中，第一及第二散熱片 其中至少一者可以高純度、特級塑膠鋁材料可製 鋁1100至約鋁3000100系列，且可額外充分退火 實施例中，包覆層816、818可由任何能承受冷 XXX系列材料製成，其中X是整數。在另一實施 一及第二散熱片816、818係由鋁1100-0形成。 二散熱片8 16、818 —般係包圍發熱元件8 04並將 830隔開。 第二散熱片818之上表面834 —般延伸到階 上的高度。如第8C圖顯示，工具820可插入溝； 以便對散熱片816、818施壓。工具820造成展七 含散熱片816、818)變形並與機體830之多個側J 發熱元件804緊密接觸。由散熱片816、818形變 作上述包 表面可包 802内接 且在與第 不。笫一 下方部位 下表面形 份。第二 製造，且 使用相同 816 、 818 造，例如 。在另一 或熱之1 例中，第 第一及第 其與機體 梯8 08以 滑802内 t材料（内 堅806及 引起的緊 17 1289610 密接觸破壞接觸表面上原有的氧化層，因此，改善了發熱 元件804以及機體83 0之熱傳遞。在形變過程中，上散熱 月818(第二散熱片818)之頂部834 一般便與階梯8〇8齊 平 ° 其後將溝蓋822插入溝槽802内，蓋住散熱片816、 818以及發熱元件804。溝蓋822 —般而言是利用適於製造 上述溝蓋218之材料製造。溝蓋822可由一層或多層相隔 的材料層組成。第8D圖描述之實施例中，溝蓋822包含 三層。 溝蓋822大致是密封溝槽8〇2内之發熱元件8〇4，並 提供壓力屏障將發熱元件804與溝槽802外之環境隔離。 在一實施例中，溝蓋822是焊接或鍛造在位置上。亦可考 慮以其他適合的方法將溝蓋822密封在機體83〇上。在第 8D-E圖之實施例中，溝蓋是藉由連續焊接處824與機體 830輕合。焊接之後，溝蓋之上表面838可加以修整或使 其與機體830之上表面134齊平。在第8E圖之實施例中， 溝蓋8 22之上表面138是修整成與支撐表面134齊平。 第9A-E圖係顯示另一實施例中基材支撐9〇〇在不同 製造階段内之部份剖面圖。基材支撐組件900 —般包括機 體 〇在其支標表面134上至少有一溝槽802形成。發 熱疋件804係配置在溝槽802内以管控基材支撐組件900 之溫度。 第—展性散熱片916係配置在溝槽802内而與底部 哪。第一展性散熱片916 —般是以適用於製造上述 18 !28961〇1289610 814 contact. The first stretch fin 816 can be fabricated using materials suitable for the coating 210. A recess 832 is formed in the first stretch fin 816. The recess 832 can generally receive and place a portion of the heat generating component 804 in the trench. The second heat sink 818 is disposed in the trench 802. A heat sink 8 Δ4 is sandwiched between the heat sinks 816. As shown in FIG. 8B, the heat sink 818 can be measured to generate a groove 8 〇 2 . The obstacle of 812 coordination. The second heat sink 818 can include a recess 836 formed therein to receive and place one of the heat generating elements 804. The heat sink 818 can be used to produce the material of the cladding layer 210. In one embodiment, the first and second The fins 816 and 818 are made of a material. In another embodiment, at least one of the first and second heat sinks can be made of high-purity, extra-grade plastic aluminum material from aluminum 1100 to about aluminum 3000100 series, and can be additionally fully annealed in the embodiment, the cladding layer 816, 818 can be made of any material that can withstand cold XXX series, where X is an integer. In another embodiment, the first and second fins 816, 818 are formed of aluminum 1100-0. The two heat sinks 8 16, 818 generally surround the heating element 8 04 and separate the 830. The upper surface 834 of the second heat sink 818 generally extends to the height of the step. As shown in Figure 8C, the tool 820 can be inserted into the groove to apply pressure to the fins 816, 818. The tool 820 deforms the heat sink 816, 818) and is in intimate contact with the plurality of side J heat generating elements 804 of the body 830. The heat sinks 816, 818 are deformed into the above-mentioned package surface 802 can be inscribed and in the first.笫 One lower part of the lower surface. The second is manufactured and made using the same 816, 818, for example. In another case of heat or heat, the first and the first and the body ladder 8 08 are in contact with the material t in the sliding 802 (the inner 806 and the tight 17 1289610 are in contact with each other to break the original oxide layer on the contact surface, therefore, The heat transfer of the heating element 804 and the body 83 0 is improved. During the deformation process, the top 834 of the upper heat dissipation month 818 (second heat sink 818) is generally flush with the step 8〇8. Thereafter, the groove cover 822 is inserted into the groove. In the slot 802, the heat sinks 816, 818 and the heat generating component 804 are covered. The trench cover 822 is generally fabricated from a material suitable for fabricating the trench cover 218. The trench cover 822 may be comprised of one or more spaced apart layers of material. In the embodiment depicted in the 8D diagram, the trench cover 822 comprises three layers. The trench cover 822 is substantially a heat generating component 8〇4 in the sealing trench 8〇2 and provides a pressure barrier to isolate the heat generating component 804 from the environment outside the trench 802. In one embodiment, the trench cover 822 is soldered or forged in position. It is also contemplated to seal the trench cover 822 to the body 83 by other suitable means. In the embodiment of Figures 8D-E, the trench cover It is lightly coupled to the body 830 by the continuous welding place 824. Welding The upper surface 838 of the trench cover may be trimmed or flush with the upper surface 134 of the body 830. In the embodiment of Figure 8E, the upper surface 138 of the trench cover 82 is trimmed to be flush with the support surface 134. 9A-E are partial cross-sectional views showing the substrate support 9 in another embodiment at various stages of manufacture. The substrate support assembly 900 generally includes a body having at least one groove on its surface 134. 802 is formed. The heat generating element 804 is disposed in the groove 802 to control the temperature of the substrate supporting assembly 900. The first spreading fin 916 is disposed in the groove 802 and the bottom portion. The first spreading fin 916 Generally used to manufacture the above 18 !28961〇
散熱片816之材料製造。第一展性散熱片916 —般具有「C」 形狀之剖面。在第9 A-E圖之實施例中，第一散熱片916 包括中央主部份904以及二個延伸柱腳902。柱腳902各 包括一頂部906、一内壁910及一外牆908。外牆908之結 構是用於接合溝槽802之下方部位812。第一展性散熱片 916之頂部906可延伸至在溝槽802多個側壁806形成之 階梯8 08之上方。凹部93 2可在第一展性散熱片916中央 部份904之上表面形成。凹部932 —般可在溝槽802内接 收及置放發熱元件804之一部份。 第二展性散熱片918係配置在溝槽8〇2内介於第一 展性散熱片916之柱腳902之間，如第9B圖顯示。第一 及第二散熱片916、918之間失著發熱元件8〇4。第二散熱 片918可包含一在其下表面形成之凹部936以接受並置放 發熱元件804之一部份。第二散熱片918可用適用於製作 上述包覆層916之材料製造’且在在一實施例中，第一以 及第二散熱片916、918係使用相同材料製造。例如，第一 及第二散熱片916、918其中至少一者可以高純度、特級塑 膠鋁材料製造，例如鋁11〇〇至約鋁3〇〇〇-1 〇〇系列，且可 額外充分退火。在另一實施例中，包覆層916、918可由任 何能承受冷或熱之1 XXX系列材料製成，其中X是整數。 在另一實施例中，第一及第二散熱片916、918係由鋁 1100-0形成。第一及第二散熱片916、918 一般包圍發熱 元件804並使其與機體830隔開。 第二散熱片918之一上表面934通常延伸到階梯8〇8 19 1289610 以上的南度。如第9C圖顯示，一工具820可插入該溝槽 802内以便對散熱片916和918施壓。該工具820導致展 性材料（包含散熱片916、91 8)變形，且與機體830之多個 j則壁806和發熱元件804緊密接觸，因此改善了發熱元件 以及機體830之間的熱傳遞。在變形過程中，第一及第二 散熱片916、918之上部906、934通常與階梯808齊平。 將第二散熱片918插入溝槽802會導致第一散熱片916柱 _ 腳902和機體830及第二散熱片918彼此交互作用，進而 破壞了接觸表面上既有的氧化層。氧化層的破壞及/或去除 會改善發熱元件804以及機體803之間的熱傳遞。 其後將溝蓋822插入溝槽802内，蓋住散熱片916、 918以及發熱元件804。溝蓋822可由一層或多層分隔的材 料層組成，在第9D圖之實施例中，溝蓋包含三層。溝蓋 822密封溝槽802内之發熱元件8〇4，並提供壓力屏障將發 熱元件804與溝槽802外之環境隔離。 在第9D-E圖之實施例中，溝蓋是藉由連續焊接處824 • 輕合機體830。焊接之後，溝蓋之上表面83 8可加以修整 或使其與機體之上表面134齊平。在第9E圖之實施例中， 溝蓋822之上表面138是修整成與支撐表面134齊平。 因此，所提供之基材支撐組件實施例在包埋的發熱 元件和基材支樓機體之間具有良好熱傳導性。利用一展性 材料之作用使發熱元件及基材支撐機體之間緊密接觸，並 未要求置放發熱元件之溝槽對機械製造具有精密的容許偏 差’因此可降低基材支撐組件之成本並提高加熱器之效能。 20The material of the heat sink 816 is manufactured. The first stretch fin 916 generally has a "C" shape profile. In the embodiment of Figures 9A-E, the first fin 916 includes a central main portion 904 and two extended legs 902. The legs 902 each include a top portion 906, an inner wall 910, and an outer wall 908. The structure of the outer wall 908 is used to engage the lower portion 812 of the trench 802. The top 906 of the first spread fin 916 can extend above the step 808 formed by the plurality of sidewalls 806 of the trench 802. The recess 93 2 can be formed on the upper surface of the central portion 904 of the first stretch fin 916. The recess 932 can generally receive and place a portion of the heat generating component 804 within the trench 802. The second spread heat sink 918 is disposed between the legs 902 of the first heat sink 916 in the groove 8〇2 as shown in Fig. 9B. The heating element 8〇4 is lost between the first and second fins 916, 918. The second heat sink 918 can include a recess 936 formed in a lower surface thereof to receive and place a portion of the heat generating component 804. The second heat sink 918 can be fabricated from a material suitable for use in making the cladding layer 916' and in one embodiment, the first and second heat sinks 916, 918 are fabricated using the same material. For example, at least one of the first and second fins 916, 918 can be fabricated from a high purity, premium grade plastic aluminum material, such as aluminum 11 Torr to about aluminum 〇〇〇-1 〇〇 series, and can be additionally sufficiently annealed. In another embodiment, the cladding layers 916, 918 can be made of any 1 XXX series of materials that can withstand cold or heat, where X is an integer. In another embodiment, the first and second fins 916, 918 are formed from aluminum 1100-0. The first and second fins 916, 918 generally surround the heat generating component 804 and are spaced from the body 830. The upper surface 934 of one of the second fins 918 generally extends to a south extent above the step 8〇8 19 1289610. As shown in Figure 9C, a tool 820 can be inserted into the groove 802 to apply pressure to the fins 916 and 918. The tool 820 causes the malleable material (including the fins 916, 918) to deform and is in intimate contact with the plurality of walls 806 of the body 830 and the heat generating component 804, thereby improving heat transfer between the heat generating component and the body 830. The upper portions 906, 934 of the first and second fins 916, 918 are generally flush with the step 808 during the deformation process. Inserting the second heat sink 918 into the trench 802 causes the first heat sink 916 pillar 902 and the body 830 and the second heat sink 918 to interact with each other, thereby destroying the existing oxide layer on the contact surface. The destruction and/or removal of the oxide layer improves heat transfer between the heating element 804 and the body 803. The trench cover 822 is then inserted into the trench 802 to cover the heat sinks 916, 918 and the heat generating component 804. The trench cover 822 may be comprised of one or more spaced apart layers of material. In the embodiment of Figure 9D, the trench cover comprises three layers. The trench cover 822 seals the heat generating component 8〇4 within the trench 802 and provides a pressure barrier to isolate the heat generating component 804 from the environment outside the trench 802. In the embodiment of the 9D-E diagram, the groove cover is 824 by means of a continuous weld 840. After welding, the upper surface 83 8 of the trench cover may be trimmed or flush with the upper surface 134 of the body. In the embodiment of Figure 9E, the upper surface 138 of the trench cover 822 is trimmed to be flush with the support surface 134. Thus, the substrate support assembly embodiments provided have good thermal conductivity between the embedded heat generating component and the substrate support body. The use of a malleable material to make the heating element and the substrate support the close contact between the body, does not require the groove of the heating element to have a precise tolerance to the mechanical manufacturing', thus reducing the cost and improvement of the substrate supporting assembly The performance of the heater. 20
1289610 上述說明雖關於本發明之實施例，然而亦可經 飾成為其他及更多本發明實施例而仍未脫離其基本領 而其領域則由下述申請專利範圍界定。 【圖式簡單說明】 為了更詳盡解釋上述本發明之特色，可參照實 更進一步地說明上述本發明之概要，部份並以附圖說 值得一提的是，附圖只是說明本發明的典型具體實施 因此並非限制本發明之範圍，本發明可包含其他同等 的具體實施例。 第1圖是具有本發明基材支撐之製造處理室的 ISJ · 圖， 第2圖是第1圖之基材支撐組件實施例的部份剖召 第3圖是本發明用於製造基材支撐之流程圖； 第4-7圖為依第3圖說明之方法在不同製造步 配的基材支撐組件的部份剖面圖； 第8 A-E圖是另一基材支撐在不同製造階段内之 剖面圖；以及 第9A-E圖是另一基材支撐在不同製造階段内 份剖面圖。 為了幫助了解，各圖中共同的相同元件均使用相 編號。 【主要元件符號說明】 過修 域， 施例 明。 例， 有效 剖面 6圖； 驟裝 部份 之部 同的 21 1289610The above description of the embodiments of the present invention, however, may be modified as other and more embodiments of the invention without departing from the basic scope thereof, and the scope of the invention is defined by the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS In order to explain the features of the present invention in more detail, the summary of the present invention will be further described with reference to the accompanying drawings. The present invention is not intended to limit the scope of the invention, and the invention may include other equivalent embodiments. 1 is an ISJ diagram of a manufacturing process chamber having a substrate support of the present invention, and FIG. 2 is a partial cross-sectional view of a substrate support assembly embodiment of FIG. 1. FIG. 3 is a view of the present invention for manufacturing a substrate support Figure 4-7 is a partial cross-sectional view of the substrate support assembly in different manufacturing steps according to the method illustrated in Figure 3; Figure 8AE is a cross-section of another substrate supported at different stages of manufacture Figure; and Figure 9A-E are cross-sectional views of another substrate supported at different stages of manufacture. To help understand, the same components in each figure use phase numbers. [Main component symbol description] Overhaul field, example. Example, effective section 6 diagram; part of the assembly part of the same 21 1289610
100系統 102處理室 104氣體供應源 106壁 108底 11 0蓋組件 11 2操作室 114充氣機 120内部側邊 122電源 124機體 1 2 6下側邊 128 ?L 1 3 0電源 132發熱元件 1 3 8支撐組件 140基材 142柄軸 144柄蓋 146伸縮囊 148遮蔽架 1 5 0昇降銷 步驟 步驟 最後步驟 下方部位 上方部份 上表面 基材支撐組件 溝槽 發熱元件 多個側壁 階梯 側壁下部份 側壁上部份 底 第一展性散熱片 第二展性散熱片 工具 溝蓋 焊接處 上表面 機體 凹部 上表面 凹部 1289610 1 5 4昇降板 83 8上表面 160第一末端 900組件 162第二末端 902柱腳 190熱電偶 904中央主部份 204溝槽 906頂部 206壁 908外牆 210包覆層 910内壁 2 1 4插入件 916第一展性散熱片 2 1 8溝蓋 9 1 8第二展性散熱片 220鞘 932凹部 222電偶極 934上表面 224元件 226孔 228通道 230底部 232 —部份 234 —部份 300方法 302步驟 936凹部 23100 system 102 processing chamber 104 gas supply source 106 wall 108 bottom 11 0 cover assembly 11 2 operating room 114 inflator 120 internal side 122 power supply 124 body 1 2 6 lower side 128 ?L 1 3 0 power supply 132 heating element 1 3 8 support assembly 140 base material 142 stem 144 handle cover 146 bellows 148 shield frame 1 5 0 lift pin step step last step lower part upper part substrate support assembly groove heating element multiple side wall step side wall lower part Part of the bottom wall of the first stretchable fins second spread fins tool groove cover welds upper surface body recess upper surface recess 1289610 1 5 4 lift plate 83 8 upper surface 160 first end 900 assembly 162 second end 902 Column foot 190 thermocouple 904 central main part 204 groove 906 top 206 wall 908 outer wall 210 cladding layer 910 inner wall 2 1 4 insert 916 first expansion fin 2 1 8 groove cover 9 1 8 second malleability Heat sink 220 sheath 932 recess 222 electric dipole 934 upper surface 224 element 226 hole 228 channel 230 bottom 232 - portion 234 - portion 300 method 302 step 936 recess 23