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TWI287700B - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
TWI287700B
TWI287700B TW093108925A TW93108925A TWI287700B TW I287700 B TWI287700 B TW I287700B TW 093108925 A TW093108925 A TW 093108925A TW 93108925 A TW93108925 A TW 93108925A TW I287700 B TWI287700 B TW I287700B
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TW
Taiwan
Prior art keywords
heat dissipation
heat
air
dissipation module
module
Prior art date
Application number
TW093108925A
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Chinese (zh)
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TW200532425A (en
Inventor
Li-Kuang Tan
Yi-Sheng Lee
Original Assignee
Delta Electronics Inc
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Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW093108925A priority Critical patent/TWI287700B/en
Priority to JP2004362555A priority patent/JP2005294802A/en
Priority to US11/090,223 priority patent/US20050219815A1/en
Publication of TW200532425A publication Critical patent/TW200532425A/en
Application granted granted Critical
Publication of TWI287700B publication Critical patent/TWI287700B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/04—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being formed by spirally-wound plates or laminae
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation module includes an air-transportation device and a cooling chamber having an air inlet and an air vent. An inside wall surface of the cooling chamber is formed with a structure for enhanced heat transfer, and an outside wall surface of it covers a heating element. An air flow is induced by the air-transportation device to pass in and out of the cooling chamber, and the structure for enhanced heat transfer is formed as a flow channel through which the air flow travels inside the cooling chamber.

Description

1287700 九、發明說明： 【發明所屬之技術領域】 曰 本發明係關於一種散熱模組，尤有關一種能有效提 昇散熱效率之散熱模組。 【先前技術】 隨著電子裝置效能的提昇，搭配電子裝置之散熱結 構其散熱能力亦需同時增大，以有效散逸發熱元件所產 生之大量熱能。 圖1為一示意圖，顯示一安裝於發熱電子元件（未圖 示）上之散熱裝置100。散熱裝置10〇包含一熱沉（heat sink) 102及一軸流風扇104，當熱沉1〇2藉由熱傳導吸收 發熱元件產生之熱能時，軸流風扇1〇4運轉所產生之氣流 可將熱沉102吸收之熱能散逸。 然而，如圖1所示之習知風扇與熱沉搭配方式，因 風扇104引致之氣流係由鄰近熱沉1〇2空氣 生，故風扇刚吹入熱請之空氣溫度約 之高溫。因此，熱源（發熱電子元件）表面溫度（例如一中 央處理益表面約為65-7(TC)與冷卻空氣溫度相差僅約 25°C，使熱傳遞效率受到極大限制。再者，受限於風戶 馬達之設計，馬収子下方對應之熱;冗1〇2巾心點的: 量最小，然而此處卻是熱源最集中且溫度最高的地方， 如此不僅使熱傳遞率降低且容易導致散熱不均勻 題。 口 1 1287700 【發明内容】 因此，本發明之目的在提供一種散熱模組，其能有 效解決習知技術之上述種種問題。 依本發明之設計散熱模組，包含一空氣輸送裝置與 一具有進氣口及排氣口之散熱腔室。散熱腔室之内側壁 面上形成有一熱傳增強結構且其外側壁面貼覆於一發熱 元件。空氣輸送裝置引致氣流進出該散熱腔室，其可採 用一空氣壓縮機（air compressor)、鼓風機（blower)或 抽氣泵（air pump)，且熱傳增強結構形成為氣流於散熱 腔室内部行進之一流道。散熱腔室可藉由一板狀構件與 熱沉緊密結合而形成。 藉由本發明之設計，熱沉表面形成之熱傳增強結構 其形狀及位置係預先搭配板狀構件之通孔位置形成一連 續且可行經散熱腔内各部分之空氣流道，如此當壓縮機 將高壓氣體經由該通孔灌入散熱腔室後，由壓縮機而來 的低溫冷卻空氣可循散熱腔室内預設之流道，與鰭片各 部分充分接觸後，最後再由一排氣口排出。如此一方面 低溫冷卻空氣可與熱沉表面各部分、熱沉表面上的熱傳 增強結構各部分充分接觸，所以熱沉的任何一部份均有 大量低溫空氣流過，而可均勻地攜走熱量，完全不會有 習知散熱裝置熱源最集中且溫度最高之中心點風量卻最 1287700 小的問題。另一方面，因持續補充之低溫冷卻空氣其溫 度與熱沉表面溫度的差距極大，故可有效增加空氣所能 移除之熱量而大幅提昇散熱效率。 【實施方式】 圖2為依本發明一實施例之示意簡圖，以顯示本發 明散熱模組之設計原理。 如圖2所示，依本實施例之散熱模組主要係由一空 氣壓縮機（air compressor) 10及預先設計之散熱構件12 所構成。空氣壓縮機10與散熱構件12係以一氣密管路連 接，空氣經壓縮機10壓縮後可如箭頭所示方向，由散熱 構件12之一進氣口高速進入其中再由一排氣口排出，且 一壓力控制器30可設置於該氣密管路上，以調節空氣壓 力及空氣流量。 依本實施例，散熱構件12係由一板狀構件14及熱沉 16(heat sink)兩者緊密結合而形成。熱沉16係由具高熱 傳導係數之材質所構成，其底面貼覆於一發熱元件28上。 圖3A及圖3B顯示本發明板狀構件14設計之一例。板 狀構件14中心形成有一通孔18，且邊緣設有一至數個固 定孔20。 圖4A及圖4B顯示本發明熱沉16設計之一例，如圖所 示，熱沉16表面形成有一熱傳增強結構，依本實施例該 1287700 熱傳增強結構係由各部分均具相同高度H之鰭U卷繞 形成’其㈣片22之卷繞形式例如是逆時針卷繞或順時 針卷繞均可。熱沉16邊緣亦設有複數侧定孔24。 因此’利用螺絲之類的固定件，經由位置相互對應 之固定孔2G及24將板狀構件14與熱沉_者鎖合，板狀 構件14即可緊密覆蓋於熱沉16上方，使兩構件中間形成 具有一進氣口（即板狀構件14上之通孔18)及—排氣口 (鰭片22卷繞形成之通道的最後出口 26)之封閉散熱腔 室。因本發明之卷繞鰭片22具相同之高度H，且當板狀 構件14緊密覆蓋於熱沉16上方時，鰭片22之頂面可與板 狀構件14其面向熱沉16之一表面19緊密接觸，如此當空 虱壓縮機ίο將高壓空氣經由板狀構件上之通孔18灌入散 熱腔室時，原本作為熱傳增強結構之鰭片22即同時成為 虱流於散熱腔室内部行進之流道，此時氣流會沿圖4八箭 貝所b方向，由P點開始沿鰭片2 2卷繞形成之通道快速流 經封閉之散熱腔室各部分，最後再由通道出口 26排出。 藉由本發明之設計，熱沉16表面形成之續片Μ，其 形狀及位置係預先搭配覆蓋於其上之板狀構件14的通^ 18，形成一連續且可行經散熱腔内各部分之空氣流道， 如此當壓縮機10將高壓氣體經由該通孔18灌入散熱腔室 後，由壓縮機10持續而來的低溫冷卻空氣可循該散熱腔 1287700 室内預設之流道與鰭片各部分充分接觸後，最後再由一 排氣口排出。如此一方面低溫冷卻空氣可與熱沉16表面 各部分、熱沉16表面上的熱傳增強結構各部分充分接 觸，使散熱腔室任何一部份均有大量低溫空氣流過，而 可均勻地攜走熱量，完全不會有習知散熱裝置熱源最集 中且溫度最高之中心點風量卻最小的問題。另一方面， 持續補充之低溫冷卻空氣其溫度與熱沉16表面溫度的差 距極大，故空氣所能移除之熱量將大幅增加，而可大幅 提昇散熱效率。 另外，依本發明板狀構件14之通孔18的數量及配置 方式完全不限定，例如亦可如圖3C所示，於板狀構件14 上形成陣列形式配置之複數個通孔。 圖5為一示意圖，分別顯示板狀構件14與熱沉16兩 者將緊密接觸之表面，以說明本發明板狀構件14與熱沉 16之另一搭配結合方式。如圖5所示，板狀構件14面向熱 沉16之一表面19上，可另外形成對應該卷繞鰭片22兩兩 壁間之空隙分佈的卷繞凸塊結構21。如此當板狀構件14 與熱沉16結合時，凸塊結構21可緊密嵌入鰭片22兩兩壁 間而緊密覆蓋於空氣流道之上方，而可更進一步獲得板 狀構件14與熱沉16兩者精確對位及密閉的效果。 再者，欲獲得上述精確對位及密閉效果，並不限定 1287700 為運用上述之凸塊結構21。如圖6所示，亦可於板狀構件 14面向熱沉16之一表面19上，對應卷繞鰭片22兩兩壁間 之空隙分佈，形成一门字形之封閉鰭片薄壁23，來嵌合 熱沉16上之鰭片22以覆蓋整個空氣流道。亦即，僅需於 板狀構件14其面向熱沉16之一表面19，形成與該熱傳增 強結構分佈圖案互補之嵌合結構，即可獲得板狀構件14 與熱沉16兩者結合時精確對位及密閉的效果。 如圖7所示，本實施例之空氣壓縮機10亦可以一高 效率之鼓風機（blower)32替代，將鼓風機32出口以一氣 密管路連接至散熱構件12,同樣可獲得輸送低溫冷卻空 氣至封閉之散熱腔室内循預設流道流動的效果。再者， 本實施例平板構件14上開設之通孔18僅需搭配預設流道 來設計，其外形及開口面積並不限定。 圖8為顯示本發明另一實施例之示意簡圖。於此實 施例中係利用一抽氣泵（air pump)34取代空氣壓縮機， 將抽氣泵34以一氣密管路連接至散熱腔室由鰭片構成之 通道出口 26，其中抽氣泵34例如可為一真空泵（vacuum pump)。該設計原理係利用抽氣泵34將散熱腔室内之空氣 抽出至呈負壓狀態，此時外界空氣由於壓力高於散熱腔 室内之壓力，故空氣可經由進氣孔快速進入散熱腔室内 沿預設流道流動進行冷卻，同樣可達到本發明之效果。 1287700 於此實施例中，板狀構件14上之進氣孔以設計為其截面 積由外界朝散熱腔内漸縮之喷嘴孔18’較佳，如此當空氣 進入散熱腔室時，因喷嘴孔18’之截面漸漸縮小而使空氣 流動速率加快，使流體本身内能轉換為流體動能，故通 過喷嘴孔18’之空氣本身溫度會更形降低，進一步提升熱 傳效率。當然，板狀構件14上之進氣孔形式並不限定， 例如亦可如圖9所示設成一由外界朝散熱腔内漸縮再漸 開之喷嘴孔18’ ’形式。 Φ 本發明形成於熱沉表面上之熱傳增強結構，完全不 限定為一鰭片結構，而僅需配置使當板狀構件14緊密覆 蓋於熱沉16上方而形成一封閉腔室時，能於該封閉腔室 内形成一氣流可充分接觸該封閉腔室各部分之流道即 可。舉例而言，如圖10所示，亦可於熱沉3 6表面形成大 量微小凸塊（bump)40，作為增大散熱面積之熱傳增強結 構，且凸塊40同時排列出讓氣流充分接觸封閉腔室各部 $ 分之流道，當空氣由進氣孔38進入後可依箭頭方向循該 流道行進，再由複數個排氣口排出，而可提高散熱效果。 再者，本發明之進氣孔數量及位置可任意選擇，僅 需將熱傳增強結構搭配設計出相應流道即可。舉例而 言，如圖11所示，亦可採用複數個進氣孔48a及48b之設 計，再將鰭片42a及42b對應各該進氣孔形成不同流道。 11 1287700 由此可知’本發明可進—步提供如下優點：若發熱元件 之各個區域有不同的散熱需求’本發明即可利用進氣孔 數量、位置及相應流道配置可任意選擇之彈性，進行針 •對該不同區域散熱需求之最佳化流道設計。 _ “又’例示之板狀構件14僅用以提供通孔，且作為覆 盖熱沉16以形成一封閉空腔之用，其外形並不限定。亦 蓋熱―成—封㈣腔之構件衫限定為上 :^狀構#❿可為任何能達成緊密覆蓋熱沉Μ目的 <、、、。構，且覆蓋於埶 接合效果之方式與熱·结合構==何能達到緊密 =式、卡扣方式、焊接方式結合等等均可。 離本發明之精神為限制性者。任何未脫 更，均應包含於後附範=之等效修改或變 _ 【圖式簡單說明】 :為顯示習知散熱裝置之 圖2為依本發明— 丁心圖。 熱模組之設計原理。&例之7圖’以顯示本發明散 圖3A及圖犯黏一 為=構件，-例， 图3c顯，⑽構件設計 12 1287700 圖4A及4B顯示本發明熱沉設計之一例，圖4A為熱沉 之剖面圖及圖4B為熱沉之前視圖。 圖5為一示意圖，分別顯示板狀構件與熱沉兩者將緊 密接觸之表面，以說明本發明板狀構件與熱沉之另一搭 配結合方式。 圖6為一示意圖，分別顯示板狀構件與熱沉兩者將緊 密接觸之表面，以說明本發明板狀構件與熱沉之另一搭 配結合方式。 ® 圖7為顯示本發明另一實施例之示意圖。 圖8為顯示本發明另一實施例之示意圖。 圖9為顯示本發明另一實施例之示意圖。 圖10為顯示本發明板狀構件與熱沉搭配設計之一變 化例。 圖11為顯示本發明板狀構件與熱沉搭配設計之另 一變化例。 【主要元件符號說明】 10 空氣壓縮機 12 散熱構件 14 板狀構件 16、3 6 熱沉 18 通孔 18’、18’，喷嘴孔 13 1287700 19 板狀構件表面 20 > 24固定孔 21 卷繞凸塊結構 22、 42a、42b 鰭片 23 鰭片薄壁 26 通道出口 28 發熱元件 30 壓力控制器 32 鼓風機 34 抽氣泵 38 ^ 48a、48b 進氣孔 40 凸塊 100 散熱裝置 102 熱沉 104 風扇1287700 IX. Description of the invention: [Technical field to which the invention pertains] 曰 The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module capable of effectively improving heat dissipation efficiency. [Prior Art] As the performance of the electronic device is improved, the heat dissipation capability of the heat dissipation structure of the electronic device needs to be simultaneously increased to effectively dissipate a large amount of heat energy generated by the heat generating component. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing a heat sink 100 mounted on a heat-generating electronic component (not shown). The heat sink 10 includes a heat sink 102 and an axial fan 104. When the heat sink 1 〇 2 absorbs heat generated by the heat generating component by heat conduction, the airflow generated by the axial fan 1 〇 4 can be The heat absorbed by the heat sink 102 is dissipated. However, as shown in Fig. 1, the conventional fan and the heat sink are arranged in such a manner that the air flow caused by the fan 104 is air generated by the adjacent heat sink 1〇2, so that the air temperature of the fan just blown into the hot air is about the high temperature. Therefore, the surface temperature of the heat source (heated electronic component) (for example, a central processing benefit surface of about 65-7 (TC) differs from the cooling air temperature by only about 25 ° C, which greatly limits the heat transfer efficiency. Furthermore, it is limited by The design of the wind turbine motor, the heat corresponding to the horse's income; the length of the 1〇2 towel point: the smallest amount, but here is the place where the heat source is the most concentrated and the temperature is the highest, which not only reduces the heat transfer rate but also easily leads to SUMMARY OF THE INVENTION Accordingly, the object of the present invention is to provide a heat dissipation module that can effectively solve the above problems of the prior art. The heat dissipation module according to the present invention includes an air delivery system. The device and a heat dissipation chamber having an air inlet and an air outlet. A heat transfer enhancement structure is formed on the inner wall surface of the heat dissipation chamber, and an outer wall surface of the heat dissipation chamber is attached to a heat generating component. The air conveying device causes airflow into and out of the heat dissipation chamber. It can use an air compressor, a blower or an air pump, and the heat transfer enhancement structure is formed into a flow of air inside the heat dissipation chamber. One of the flow passages. The heat dissipation chamber can be formed by a plate member and a heat sink. The heat transfer enhancement structure formed by the surface of the heat sink is shaped and positioned in advance with the through hole of the plate member. The position forms a continuous and feasible air flow path through each part of the heat dissipation cavity, so that when the compressor injects high pressure gas into the heat dissipation chamber through the through hole, the low temperature cooling air from the compressor can be pre-processed in the heat dissipation chamber The flow channel is fully contacted with the fins and finally discharged by an exhaust port. On the one hand, the low-temperature cooling air can be in full contact with various parts of the surface of the heat sink and the heat transfer enhancement structure on the surface of the heat sink. Therefore, any part of the heat sink has a large amount of low-temperature air flowing through it, and the heat can be uniformly carried away. There is no problem that the heat source of the conventional heat sink is the most concentrated and the temperature at the center of the highest temperature is 1287700. On the other hand, because the temperature of the cryogenic cooling air that is continuously supplemented is extremely different from the surface temperature of the heat sink, it can effectively increase the heat that can be removed by the air and greatly increase the dispersion. [Embodiment] Fig. 2 is a schematic diagram showing the design principle of the heat dissipation module of the present invention according to an embodiment of the present invention. As shown in Fig. 2, the heat dissipation module according to this embodiment is mainly composed of an air. An air compressor 10 and a pre-designed heat dissipating member 12. The air compressor 10 and the heat dissipating member 12 are connected by a gas-tight pipe, and the air is compressed by the compressor 10 in the direction indicated by the arrow, and is composed of a heat dissipating member. One of the air inlets enters the high speed and is discharged by an exhaust port, and a pressure controller 30 can be disposed on the airtight line to adjust the air pressure and the air flow. According to the embodiment, the heat dissipating member 12 is A plate member 14 and a heat sink 16 are formed in close contact with each other. The heat sink 16 is made of a material having a high heat transfer coefficient, and its bottom surface is attached to a heat generating component 28. 3A and 3B show an example of the design of the plate member 14 of the present invention. A through hole 18 is formed in the center of the plate member 14, and one or a plurality of fixing holes 20 are provided at the edge. 4A and 4B show an example of the design of the heat sink 16 of the present invention. As shown in the figure, a heat transfer enhancement structure is formed on the surface of the heat sink 16. According to the embodiment, the 1287700 heat transfer enhancement structure has the same height H from each part. The fin U is wound to form a winding form of the (four) sheet 22 such as counterclockwise winding or clockwise winding. The edge of the heat sink 16 is also provided with a plurality of side holes 24. Therefore, by using a fixing member such as a screw, the plate-like member 14 is locked with the heat sink via the fixing holes 2G and 24 which are mutually corresponding to each other, and the plate-like member 14 can be tightly covered over the heat sink 16 to make the two members A closed heat dissipation chamber having an air inlet (i.e., a through hole 18 in the plate member 14) and an exhaust port (the last outlet 26 of the passage in which the fin 22 is wound) is formed in the middle. Since the wound fins 22 of the present invention have the same height H, and when the plate member 14 is tightly covered over the heat sink 16, the top surface of the fins 22 may face the surface of the heat sink 16 with the plate member 14 19 is in close contact, so that when the air compressor is filled into the heat dissipation chamber through the through hole 18 in the plate member, the fin 22 originally serving as the heat transfer enhancement structure simultaneously flows into the interior of the heat dissipation chamber. The flow path, at this time, the airflow will follow the direction of the arrow b of Fig. 4, and the channel formed by the winding of the fin 22 from the point P will rapidly flow through the closed portion of the heat dissipation chamber, and finally discharged from the channel outlet 26. . With the design of the present invention, the slab formed on the surface of the heat sink 16 is shaped and positioned in advance with the passage of the plate member 14 overlying it, forming a continuous and feasible air through the various portions of the heat dissipation cavity. a flow path, such that when the compressor 10 injects high-pressure gas into the heat-dissipating chamber through the through-hole 18, the low-temperature cooling air continued by the compressor 10 can follow the preset flow path and fins of the heat-dissipating chamber 1287700 After partial contact, it is finally discharged by an exhaust port. In this way, the low-temperature cooling air can be in full contact with each part of the surface of the heat sink 16 and the heat transfer enhancement structure on the surface of the heat sink 16, so that any part of the heat dissipation chamber has a large amount of low-temperature air flowing, and can be uniformly Carrying away the heat, there is no problem that the heat source of the heat sink is the most concentrated and the temperature at the center of the highest temperature is the smallest. On the other hand, the temperature of the cryogenic cooling air that is continuously replenished is extremely different from the surface temperature of the heat sink 16, so that the amount of heat that can be removed by the air is greatly increased, and the heat dissipation efficiency can be greatly improved. Further, the number and arrangement of the through holes 18 of the plate-like member 14 according to the present invention are not limited at all. For example, as shown in Fig. 3C, a plurality of through holes arranged in an array may be formed on the plate member 14. Figure 5 is a schematic view showing the surface in which the plate member 14 and the heat sink 16 will be in intimate contact, respectively, to illustrate another manner in which the plate member 14 of the present invention and the heat sink 16 are combined. As shown in Fig. 5, the plate member 14 faces one surface 19 of the heat sink 16, and a winding bump structure 21 corresponding to the gap distribution between the walls of the fins 22 can be additionally formed. Thus, when the plate member 14 is combined with the heat sink 16, the bump structure 21 can be tightly embedded between the two walls of the fin 22 to closely cover the air flow path, and the plate member 14 and the heat sink 16 can be further obtained. The exact alignment and sealing effect of the two. Furthermore, in order to obtain the above-described precise alignment and sealing effect, 1287700 is not limited to use the above-described bump structure 21. As shown in FIG. 6 , on the surface 19 of the plate-shaped member 14 facing the heat sink 16 , corresponding to the gap distribution between the two walls of the winding fin 22 , a gate-shaped closed fin thin wall 23 is formed. The fins 22 on the heat sink 16 are fitted to cover the entire air flow path. That is, only when the plate member 14 faces the surface 19 of the heat sink 16 to form a fitting structure complementary to the heat transfer enhancing structure distribution pattern, the combination of the plate member 14 and the heat sink 16 can be obtained. Precise alignment and sealing effect. As shown in FIG. 7, the air compressor 10 of the present embodiment can also be replaced by a high-efficiency blower 32. The outlet of the blower 32 is connected to the heat dissipating member 12 by a gas-tight pipe, and the low-temperature cooling air can also be transported to The effect of the flow in the closed cooling chamber following the preset flow path. Moreover, the through hole 18 formed in the flat member 14 of the embodiment only needs to be designed with a preset flow path, and the outer shape and the opening area are not limited. Figure 8 is a schematic view showing another embodiment of the present invention. In this embodiment, an air pump 34 is used in place of the air compressor, and the air pump 34 is connected to the air outlet duct 26 by a fin line. The air pump 34 can be, for example, A vacuum pump. The design principle utilizes the air pump 34 to draw the air in the heat dissipation chamber to a negative pressure state. At this time, since the external air is higher than the pressure in the heat dissipation chamber, the air can quickly enter the heat dissipation chamber through the air inlet hole. The flow path is cooled to achieve the same effect of the present invention. 1287700 In this embodiment, the air inlet hole on the plate member 14 is preferably designed as a nozzle hole 18' whose cross-sectional area is tapered from the outside toward the heat dissipation cavity, so that when the air enters the heat dissipation chamber, the nozzle hole The cross section of 18' is gradually reduced to increase the air flow rate, so that the fluid itself can be converted into fluid kinetic energy, so the temperature of the air passing through the nozzle hole 18' is further reduced, further improving the heat transfer efficiency. Of course, the form of the air inlet hole on the plate member 14 is not limited. For example, as shown in Fig. 9, it may be in the form of a nozzle hole 18'' which is tapered from the outside into the heat dissipation cavity. Φ The heat transfer enhancement structure formed on the surface of the heat sink of the present invention is not limited to a fin structure at all, but only needs to be configured such that when the plate member 14 is tightly covered over the heat sink 16 to form a closed chamber, Forming a gas flow in the closed chamber can sufficiently contact the flow passages of the respective portions of the closed chamber. For example, as shown in FIG. 10, a large number of tiny bumps 40 may be formed on the surface of the heat sink 36 as a heat transfer enhancement structure for increasing the heat dissipation area, and the bumps 40 are simultaneously arranged to allow the airflow to be sufficiently closed. The flow channel of each part of the chamber can follow the flow path in the direction of the arrow when the air enters through the air inlet hole 38, and then is discharged by a plurality of exhaust ports, thereby improving the heat dissipation effect. Furthermore, the number and position of the air inlet holes of the present invention can be arbitrarily selected, and only the heat transfer enhancement structure is required to design the corresponding flow path. For example, as shown in Fig. 11, the design of the plurality of intake holes 48a and 48b may be employed, and the fins 42a and 42b may be formed into different flow paths corresponding to the respective intake holes. 11 1287700 It can be seen that the present invention provides the following advantages: if the various regions of the heating element have different heat dissipation requirements, the present invention can utilize the number of intake holes, the position and the corresponding flow channel configuration to be arbitrarily selected. Needle • Optimized flow path design for heat dissipation requirements in different areas. _ "The exemplified plate member 14 is only used to provide a through hole, and as a cover for the heat sink 16 to form a closed cavity, the shape is not limited. Also, the heat-forming-sealing (four) cavity member shirt is also covered. It is limited to: ^形结构#❿ can be any way to achieve close coverage of heat sinks, and to cover the effect of 埶 jointing and heat and combination == how can it be tight = The snapping method, the welding method, and the like can be combined. The spirit of the present invention is limited. Any unremovable and optional ones should be included in the equivalent modification or change of the following formula _ [Simple description of the drawing]: Figure 2 shows a conventional heat sink device according to the present invention - Ding Xintu. The design principle of the thermal module. & Example 7 Figure ' shows the scattered image of the present invention 3A and the figure is a member, - for example, Figure 3c shows, (10) member design 12 1287700 Figures 4A and 4B show an example of the heat sink design of the present invention, Figure 4A is a cross-sectional view of the heat sink and Figure 4B is a front view of the heat sink. Figure 5 is a schematic view showing the plate-like member a surface that will be in intimate contact with the heat sink to illustrate another of the plate member and heat sink of the present invention Figure 6 is a schematic view showing the surface of the plate member and the heat sink in close contact with each other to illustrate another combination of the plate member of the present invention and the heat sink. Fig. 7 is a view showing the present invention. Fig. 8 is a schematic view showing another embodiment of the present invention. Fig. 9 is a view showing another embodiment of the present invention. Fig. 10 is a view showing a change of the design of the plate member and the heat sink of the present invention. Fig. 11 is a view showing another variation of the design of the plate member and the heat sink of the present invention. [Main component symbol description] 10 Air compressor 12 Heat dissipating member 14 Plate member 16, 3 6 Heat sink 18 Through hole 18' , 18', nozzle hole 13 1287700 19 plate member surface 20 > 24 fixing hole 21 winding projection structure 22, 42a, 42b fin 23 fin thin wall 26 passage outlet 28 heating element 30 pressure controller 32 blower 34 Air pump 38 ^ 48a, 48b Intake hole 40 Bump 100 Heat sink 102 Heat sink 104 Fan

Claims (1)

U日軸正本 包含： !2877〇〇 十、申請專利範圍： —種散熱模組， —空氣輸送裝置； 第—構件，其上形成有至少一進氣口； ^第一構件，貼覆於一發熱元件，且其表面形成有一熱傳增 強^構’該第二構件與該第—構件緊密結合產生—容置該熱傳增 強結構之散熱腔室及至少一排氣口；其中The original U-axis includes: !2877〇〇10, the scope of patent application: - a heat dissipation module, - air delivery device; a first member, at least one air inlet is formed thereon; ^ the first member is attached to one a heat generating component, and a heat transfer enhancement structure is formed on the surface thereof; the second component is tightly coupled with the first component to generate a heat dissipation chamber and at least one exhaust port for accommodating the heat transfer enhancement structure; 亥^氣輸达裝置引致—氣流進出該散熱腔室，該熱傳增強結 形成為該氣流於該散熱腔室内部行進之一流道，且該流道之出 口形成為該散熱腔室之該排氣口。 2· 物細細讀嫩f構件係為 .如申請專利範圍第！項之散熱模組，其中該 一熱沉(heat sink)。 午The air gas transmission device induces a gas flow into and out of the heat dissipation chamber, the heat transfer enhancement node is formed as one flow path of the air flow inside the heat dissipation chamber, and an outlet of the flow channel is formed as the row of the heat dissipation chamber Air port. 2· The item is carefully read and the f component is as follows. The heat dissipation module of the item, wherein the heat sink is used. Noon =申請專利範圍第1項之散熱模組，其__她 合::表面形成有與該熱傳增強結構分佈圖案互… 开r该弟一構件與該 * \如申請專利範圍第！項之散熱働 第二構件分細Μ有SI定孔。 6.如申請專利範圍第㈣之散熱模組， 第二構件係以選自螺接方式、薛接方式、柳接2^構件與該 組成之族群其中之—結合。 纟方式、卡扣方式所 15 128770ο 其中該第二構件係由 其中該熱傳增強結構 其中該熱傳增強結構= Patent application scope 1 of the thermal module, its __ her combination:: The surface is formed with the heat transfer enhancement structure distribution pattern ... Open r the brother a member with the * \ as claimed patent scope! The heat dissipation of the item 働 The second member is divided into fine holes with SI fixed holes. 6. The heat dissipating module of claim 4, wherein the second component is selected from the group consisting of a screwing method, a splicing method, and a splicing member.纟 、 、 15 128 128 128 128 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 且古7.如中請專利範_項之散熱模組， 巧熱傳導係數之材質所構成。 8.如中請專概_項之散熱模組， 頂面接觸該第一構件之底面。 ,9.如申請專纖圍第1項之散熱模組， 係為鰭片結構。 ’其中該鰭片結構係以 ，其中該熱傳增強結構 "1〇.如申請專利範圍第9項之散熱模組 卷繞方式形成於該第二構件表面。 ^ 11.如申請專利範圍第i項之散熱模組 係為凸塊結構。 12·如申請專利範圍第1項之散熱模組，更包含-壓力控制 設置於該空氣輸送裝置及該散熱腔室間之空氣流路。 為 … 13·如申請專利範圍第丨項之散熱模組，其中該空氣輪送 係為選自空紐縮機(air eQmpressQr)、鼓風齡1⑽er)、拙《 泵（air pump)、真空泵（vacuum pump)所組成之族群其中之—。氣 14·如申請專利範圍第i項之散熱模組，其中該進氣口係為一 喷嘴孔’制喷嘴孔之截面由外界向該散熱助輪。“、、 15·如申請專利範圍第i項之散熱模組，其中該進氣口係為一 喷嘴孔，且該喷嘴孔之截面由外界向該散熱腔内漸縮再漸開'。…、 16·如申請專利範圍第1項之散熱模組，其中該進氣口 16 1287700 17. —種散熱模組，包含·· 一空氣輸送裝置；及 八有至V-進氣口及至少—排氣口之散熱腔室，該散孰腔 室之-内側壁面上形成有—熱傳·結構且其—外趣面貼覆於 一發熱元件； ”中繩熱腔㈣藉由-第—構件與—第二構件緊密結合所 ϋ該第Γ構件戦有該至少—進氣孔’該排氣口係位於該第 置引致有該熱傳增強結構’該空氣輸送裝 於該散二成為該氣流 為==__17㈣細·^，財.構件係 嵌合結構。絲軸有與韻傳增強結構分佈圖案_之 為-L如申請專利範圍第17項之散熱模組，其中該第二構件係 其中該第一構件與 2丨.如申請專利範圍第17項之散熱模組 4二構件分卿成有固定孔。 22·如申請專利範圍第17項 °亥第二構件係以選自螺接方式、 17 !2877〇〇 所組成之族群其中之一結合。 +⑼專利範_17項之散熱模組，其巾該第二構件係 由具高熱傳導係數之材質所構成。 4’ *申清專利範圍第17項之散熱模組，其中該熱傳增強結 構之頂面接_第—構件之底面。 ，25.如申請專利範圍第17項之散熱模組，其中該熱傳增強結 構係為鰭片結構。And ancient 7. If you want to use the heat dissipation module of the patent model, the material of the thermal conductivity coefficient. 8. If you want to use the heat dissipation module, the top surface is in contact with the bottom surface of the first component. 9. If the heat dissipation module of the first item of the special fiber is applied, it is a fin structure. Wherein the fin structure is formed by the heat transfer enhancement structure "1. The heat dissipation module winding method of claim 9 is formed on the surface of the second member. ^ 11. The heat dissipation module of claim i is a bump structure. 12. The heat dissipation module of claim 1 further comprising - pressure control an air flow path disposed between the air delivery device and the heat dissipation chamber. 13) The heat-dissipating module of the scope of the patent application, wherein the air-wheeling system is selected from the group consisting of air eQmpress Qr, blasting age 1 (10) er), 拙 "air pump", vacuum pump ( Vacuum pump) among the groups consisting of -. The heat dissipation module of the invention of claim i, wherein the air inlet is a nozzle hole, and the nozzle hole has a cross section from the outside to the heat dissipation wheel. [15] The heat dissipation module of claim i, wherein the air inlet is a nozzle hole, and the cross section of the nozzle hole is gradually tapered from the outside to the heat dissipation chamber. 16. The heat dissipation module of claim 1, wherein the air inlet 16 1287700 17. is a heat dissipation module comprising: an air delivery device; and an eight-to-V-air inlet and at least one row a heat dissipation chamber of the air port, wherein the heat dissipation structure is formed on the inner wall surface of the heat dissipation chamber, and the outer surface of the heat dissipation surface is attached to a heat generating component; the middle rope heat chamber (4) is coupled with the first member - the second member is tightly coupled to the second member, the at least one of the air intake opening is located at the first portion, and the air is provided in the heat transfer enhancement structure ==__17 (4) Fine · ^, Cai. Component is a chimeric structure. The wire shaft has a heat transfer structure with a rhyme-enhanced structure distribution pattern, such as the heat dissipation module of claim 17, wherein the second member is the first member and the second member. The two components of the heat dissipation module 4 are divided into fixed holes. 22·If the scope of patent application is 17th, the second component of °H is combined with one of the ethnic groups consisting of screwing and 17!2877〇〇. + (9) The heat dissipation module of the patent model -17, wherein the second member is made of a material having a high heat transfer coefficient. 4' * The heat dissipation module of claim 17 of the patent scope, wherein the top surface of the heat transfer enhancement structure is connected to the bottom surface of the first member. 25. The heat dissipation module of claim 17, wherein the heat transfer enhancement structure is a fin structure. ,26·如申睛專利範圍第25項之散熱模組，其中該鰭片結構係 以卷繞方式形成於該第二構件表面。 /7·如申請專利範圍第17項之散熱模組，其中該熱傳增強結 構係為凸塊結構。 β 28·如申請專利範圍第17項之散熱模組，更包含一壓力控制 器口又置於4空氣輸送裝置及該散熱腔室間之空氣流路。 ^、汝申β月專利範圍第17項之散熱模組，其中該空氣輸送The heat dissipation module of claim 25, wherein the fin structure is formed on the surface of the second member in a winding manner. /7. The heat dissipation module of claim 17, wherein the heat transfer enhancement structure is a bump structure. β 28· The heat dissipation module of claim 17 further includes a pressure controller port and an air flow path between the air delivery device and the heat dissipation chamber. ^, the heat dissipation module of the 17th patent scope of the patent, wherein the air delivery 置係為選自空氣壓縮機、鼓風機、減泵、真空泵所組成之族 其中之一。 、 洲·如申請專利範圍第17項之散熱模組，其中該進氣口係為 喷L且5亥喷鳴孔之截面由外界向該散熱腔内漸縮。 如申明專利範圍第17項之散熱模組，其中該進氣口係為 喷嘴孔’且該喷嘴孔之截面由外界向該散熱腔内漸縮再漸開。 陣列巾請專利細第17項之散熱模組，其中該進氣口係成 18 1287700 七、 指定代表圖： (一） 本案指定代表圖為：第2圖。 (二) 本代表圖之元件符號簡單說明： 10空氣壓縮機 12散熱構件 14 板狀構件 16 熱沉 28 發熱元件 30 壓力控制器 八、 本案若有化學式時，請揭示最能顯示發明特徵的化學式： (無）The system is one of a group consisting of an air compressor, a blower, a pump, and a vacuum pump.洲·································································· The heat dissipation module of claim 17, wherein the air inlet is a nozzle hole and the cross section of the nozzle hole is tapered from the outside to the heat dissipation cavity. For the array towel, please refer to the heat dissipation module of the 17th item, in which the air inlet is 18 1287700. 7. The designated representative figure: (1) The representative figure of the case is: Figure 2. (2) Brief description of the symbol of the representative figure: 10 Air compressor 12 heat dissipating member 14 Plate member 16 Heat sink 28 Heating element 30 Pressure controller 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention. : (none)
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