TWI285576B - Conductive polishing article for electrochemical mechanical polishing - Google Patents

Abstract

Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.

Description

1285576 发明, DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to an article and apparatus for planarizing a surface of a substrate. [Prior Art] The second quarter of a multi-layer metal is one of the key technologies of the next generation of ultra-large integrated circuits (ULSI). The multi-layer interconnect structure at the heart of this technology requires planarization of the interconnect features that are formed in the high aspect ratio holes, including contacts, vias, and other features. The reliable formation of these interconnect features is very important for the success of ULSI and for continuous efforts to improve circuit density and quality on each substrate or die. In the fabrication of integrated circuits and other electronic components, dielectric materials are deposited on or removed from the surface of a substrate. Conductors, semiconductors, and dielectric materials can be deposited using a variety of techniques. Deposition techniques commonly used in modern processes include physical vapor deposition (PVD), also known as sputtering, chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (Pecvd), and electrochemical plating (ECP). ). When the substance layers are sequentially deposited and removed, the entire surface of the uppermost surface of the substrate is rendered non-planar and thus needs to be planarized. Flattening a surface or "grinding" a surface is a treatment that removes material from the surface of the substrate to form a substantially uniform, flat surface. Flattening In the removal of unwanted second-surface topography and surface defects, such as rough surfaces, the junction of the 3 1285576 block is useful for deposition in the subsequent {cannedness of a mud removal. - Remove the chemical action on the substrate at the point of contact. It has the problem. Example Fill in or after processing. In the town of copper is guaranteed. The copper is not damaged, the crystal lattice is damaged, and the traces and contaminated layers or substances are on. Flattening is also useful in removing metallization and processing that is used to fill the features to form features on a substrate and to provide a uniform surface. Dropout mechanical flattening, or chemical mechanical polishing (CMp), is a technique often used for substrate flattening. CMP uses a chemical composition, typically or other fluid medium, to selectively remove material from the substrate. In conventional CMP techniques, a substrate carrier or polishing head is mounted on the component and positioned A polishing pad in the CMP apparatus is coupled to the substrate. The carrier head assembly provides a controlled pressure on the substrate against the polishing pad. The polishing pad is moved by an external driving force substrate. The CMP apparatus performs a grinding or rubbing movement between the surface and the polishing pad while applying a polishing composition for performing and/or mechanically acting and removing material from the surface of the substrate. One substance used is copper because of the desired electronic properties. However, copper has its special manufacturing problems such as copper being difficult to form patterns and etching and new processes and techniques such as double-doping processing are used to form copper substrate features. In the case of a funnel, a feature structure is defined in a dielectric material and is followed by a low dielectric constant of copper. For example, a dielectric material of less than 3 is used in the fabrication of the embedded structure. The barrier layer material is deposited on the surface of the features formed on the dielectric layer prior to deposition of the copper material and then deposited over the barrier layer and surrounding regions. however,

4 1285576 The copper filling of the feature structure often forms too much copper on the surface of the substrate, which must be removed to form a copper-filled feature on the dielectric layer and prepare the surface for subsequent processing. Use. One challenge in grinding copper materials is that the interface between the conductive material and the barrier layer is typically non-planar and the residual copper material is retained in the irregularities formed by the non-clear interface. Moreover, the conductive material and the barrier material are usually removed from the substrate at different rates. In both cases, too much conductive material is left behind to form a residue on the surface of the substrate. Therefore, as the density and size of the features formed on the surface of the substrate are different, the surface of the substrate will have a different surface topography. The rate at which the copper material is applied to different surface topography on the surface of the substrate is also different, which will make the effective copper removal on the surface of the substrate and the final flatness of the substrate surface difficult to achieve. . One solution to remove all unwanted copper material from the surface of the substrate is to over-grind the surface of the substrate. However, excessive grinding of certain materials can cause the formation of defects on the topography, such as under the feature structure. Recesses and depressions, which are referred to as disc formation, or excessive removal of dielectric materials, are referred to as erosion. Topological defects caused by disc formation or erosion can further lead to additional materials, such as the barrier material underneath, uneven removal, and produce a poorer quality than desired. The surface of the substrate. Another problem with copper surface grinding is the use of dielectric materials with low dielectric constant (k) to create copper inlays on the surface of the substrate. Low seven dielectric materials, such as carbon doped yttrium oxide, under conventional grinding pressure (ie, 6pSi), which is called downforce, will deform or crack, which will grind the substrate 1285576 It has adverse effects and has an adverse effect on the formation of components. For example, the relative rotational motion between the substrate and the polishing pad induces a shear force on the surface of the substrate and deforms the low material to form a topography = defect which will adversely affect subsequent grinding. One solution to grinding steel in low dielectric constant materials is to use electromechanical grinding (ECMP) technology to grind copper. The ECMp technology removes the conductive material from the surface of the substrate by chemically decomposing and simultaneously grinding the substrate with a mechanical grinding force smaller than that of a conventional CMP process. The electrochemical decomposition is carried out by applying a bias between a cathode and the surface of the substrate to remove the conductive material from the surface of the substrate into the surrounding boundary solution. In an embodiment of an ECMP system, the bias voltage is applied by a loop of conductive contacts in electrical communication with the surface of the substrate on a substrate support device. However, the contact ring has been observed to exhibit a non-uniform current distribution on the surface of the substrate, resulting in uneven decomposition results. Mechanical grinding is carried out by placing the substrate in contact with a conventional polishing pad and providing relative motion between them. However, conventional polishing pads can limit the flow of electrolyte to the surface of the base color. "In addition, the polishing pad may contain an insulating material which would interfere with the application of a bias to the surface of the substrate and result in a surface of the substrate. An uneven decomposition of the conductive material. Therefore, there is a need for an improved abrasive for the removal of conductive materials on the surface of a substrate. SUMMARY OF THE INVENTION The present invention generally provides an article of manufacture and an apparatus for planarizing a layer of 6 1285576 on a substrate using electrochemical deposition techniques, electrochemical decomposition techniques, grinding techniques, and combinations thereof. . In one aspect, an abrasive for polishing a substrate includes a body having a surface adapted to polish the substrate and at least one electrically conductive element that is at least partially embedded in the body. The component may comprise a plurality of fibers coated with a conductive material, a conductive filler or a combination thereof which may be disposed in the binder. The conductive element may include a hybrid fiber coated with a conductive material, and at least partially embedded in the body, a synthetic fiber coated with a conductive material, a conductive filler, or a mixture thereof, and a binder partially embedded. In the body, or a mixture thereof. The electrically conductive element can have a contact surface that extends beyond a plane defined by the abrasive surface and can include a coil, one or more loops, one or more strands, a hybrid fiber material, or Its mixture. A plurality of perforations may be formed in the abrasive to facilitate the flow of material therethrough. In another aspect, a abrasive for treating a surface of a substrate, such as a conductive layer deposited on the substrate, is provided. The abrasive comprises a body having at least a plurality of fibrous portions coated with a conductive material, a plurality of electrically conductive fillers or combinations thereof, and which are suitable for grinding the substrates. A plurality of perforations and a plurality of grooves may be formed in the abrasive to facilitate the flow of material therebetween. In still another aspect, the abrasives can be placed in a device to process a substrate, the device comprising a carrier, a permeable disk disposed in the carrier, the abrasive or article of manufacture On the permeable plate, an electrode disposed in the retainer between the permeable plate and the bottom of the retainer, and a polishing head adapted to maintain the substrate during a process. In another aspect, the abrasives can be used as a conductive abrasive for treating a substrate, the method comprising: providing a device containing a seal; placing a conductive abrasive on the enclosure Providing a conductive solution to the enclosure at a flow rate of approximately 20 gallons per minute (GPM); positioning the substrate adjacent to the conductive abrasive in the conductive solution; A surface is in contact with the electrically conductive abrasive in the electrically conductive solution; a bias is applied between the electrode and the electrically conductive abrasive; and at least a portion of the surface of the surface of the substrate is removed. In another embodiment of the invention, an abrasive for processing a substrate includes at least an interposer layer coupled between a dielectric support layer and a conductive layer. The conductive layer has an exposed surface adapted to grind a substrate. The support layer has a hardness less than that of the conductive layer, and the hardness of the intervening layer is greater than the support layer.

In still another embodiment of the invention, an abrasive for treating a substrate includes at least one intervening layer coupled between a conductive layer and a support layer. The conductive layer is penetrated by at least one of the pores, and the insert layer and the support layer comprise a first hole formed in the conductive layer, the diameter of which is larger than a diameter of the second hole formed in the insert layer and the support layer . [Embodiment] The sub- and § divisions used herein should be given the meanings generally known to those skilled in the art unless they are otherwise defined. Chemical mechanical polishing should include, but is not limited to, grinding a substrate surface by chemical action, mechanical action, or a combination of chemical and mechanical action. Electro-grinding should include, but not limited to, 1 1285576 平坦, by Iα plaque flattening. The application of a spin-drying action, such as anodic decomposition, to include a group of electrochemical mechanical polishing (ECMP), but limited by the application of electrochemistry, by combining electrochemical machines that combine substances from one code to the other. The removal is to flatten the substrate. Electrochemical to mechanical key treatment (Op pp) should be included in the electrochemically π-contact of the object + - the kernel is not limited to m ^ quality, the product is accumulated on a substrate and at the same time by the action of thunder, mechanical action Or the application of a combination of mechanical action to decompose the dilute dipole should include, but is not limited to, direct or indirect application of a substrate to It causes the conductive material to be removed from the surface of a substrate and the junction I in the electrolyte surrounding the stomach. An abrasive surface is defined broadly as a portion of a article of manufacture that is at least partially in contact with a substrate during the processing process or electrically couples the article to a substrate surface (either in direct contact or indirect contact through a conductive medium). . The grinding apparatus section shows a processing apparatus 100 having at least one station suitable for electrochemical deposition and chemical mechanical polishing, such as an electrochemical mechanical polishing (ECMp) station 102 and at least one conventional grinding station 1-6 which is disposed in a On a single platform or tool. One type of abrasive tool that can benefit from the present invention is the MIRRA® chemical mechanical mill manufactured by Applied Materials, Inc., located in Santa Clara, California. The exemplary apparatus 100 in FIG. 1 generally includes two ECMp 1285576 stations 102 and a grinding station 1〇6. The stations can be used to treat a substrate surface Y, for example, a base having a feature defined thereon and filled with a barrier layer and then placed on the barrier layer with a conductive material, which can be in two stations 102 The two steps remove the conductive material and the barrier layer is removed by the polishing station 1〇6 to form a planarized surface. The exemplary device 100 includes a base 108, a branch or an ECMP station 1〇2, one or more grinding stations 1〇6, a transfer station 11〇, and a turret 112. The substrate 114 is transported back and forth to the apparatus 1 by a loading robot 116. The loading robot 116 typically transports the substrate 114 between the transfer station 11 and a factory interface 12A. The work waste interface includes a cleaning module 122, a metering device 1〇4 and one or more substrates. Store 匡118. An example of such a metrology device 104 is the NovaScamTM Integrated Thickness Monitoring system from Nova Measuring Instruments, Inc., located in Magic City, Arizona, USA.

Alternatively, the loading robot 116 (or factory interface 120) can transport the substrate to one or more other processing tools (not shown), such as a chemical vapor deposition tool, a physical vapor deposition tool, an etching tool, and the like. By. In one embodiment, the transfer station 110 includes at least one input buffer station 124', an output buffer station 126, a transport robot arm 132, and a load cup assembly 128. The loading robot 116 places the substrate 114 on the input buffer station 124. The transfer robot arm 132 has two gripper assemblies, each having a pneumatic gripper finger that grips the edge of the substrate. The transport robot 132 lifts the substrate 114 from the input buffer station 124 and rotates the grip 10 1285576 holder and substrate 114 for moving the substrate 114 onto the loading cup assembly 128, and then the substrate 114 Drop onto the loading cup assembly 128. The turret 112 supports a plurality of polishing heads 130, each of which houses a substrate 1 14 during processing. The turret 11 2 will be transported by the grinding head 130 to the transfer station 110, between the one or more ECMP stations 1〇2 and the one or more grinding stations 106. A turret 1 1 2 that can benefit from the present invention is disclosed

U.S. Patent No. 5,804,507, the entire disclosure of which is incorporated herein by reference. Typically, the turret 112 is placed in the center of the pedestal log. The turret 112 typically includes a plurality of arms 138. Each arm 138 generally supports a polishing head 130. An arm 138 is not shown in Figure 1 to enable a clear view of the transport station 110. The turret 11 2 is markable such that the abrading head 130 can be moved between the stations 1 〇 2, 106 and the transport station 110 in the order defined by the user.

Typically, the polishing head 130 receives the substrate 114 when the substrate 114 is disposed in the ECMP station 102 or the polishing station 106. The arrangement of the ECMP station 1〇2 and the polishing station 106 on the device 1 enables the substrate 114 to be moved between the station and the station while being held in the same polishing head 130 while being held between the station and the station. It is electroplated or ground. One type of polishing head that can be used in the present invention is a TITAN HEADTM substrate carrier manufactured by Applied Materials, Inc., Santa Clara, California. An example of a polishing head 130 that can be used in the grinding apparatus 100 described herein is described in U.S. Patent No. 6,024,630, issued toS. 1285576 This article.

In order to facilitate the control of the polishing apparatus 100 and the processing performed thereon, a controller 140 including a central processing unit (CPU) 142, a memory 144, and a support circuit 146 is coupled to the polishing apparatus. The CPU 142 can be any form of computer processor that can be used in an industrial facility to control different devices and pressures. The memory 144 is connected to the CPU 142. The memory 144 or the computer readable medium may be one or more commercially available memories such as dynamic access memory (RAM), read memory (ROM), floppy disk, hard disk, or other line. The digital storage, local or remote "support circuit 146 is coupled to the CPU 142 for use in supporting the processor in a conventional manner. These circuits include caches, power supplies, clock circuits, input/output circuits, subsystems, and the like.

The power source for operating the grinding apparatus 100 and/or the controller 1 40 is provided by a power supply 150. Illustratively, the power supply 150 is shown coupled to a plurality of components of the polishing apparatus 100, including the delivery station 110, the factory interface 120, the loading robot 116, and the controller 140. In these embodiments, different power sources are supplied to two or more components of the abrasive device 100. Figure 2 shows a cross-sectional view of the polishing head 130 supported above an ECMP station 102. The ECMP station 1 2 generally includes a retainer 202, an electrode 204, an abrasive 205, a disc 206 and a cover 208. In one embodiment, the retainer 202 is coupled to the base 1 8 of the grinding apparatus 1 . The retainer 202 generally defines a container or cell in which a conductive fluid such as an electric 12 1285576 solution 220 is contained. The electrolyte 2 20 used to treat the substrate 114 may comprise a metal such as copper, aluminum, tungsten, gold, silver or other material that may be deposited on the substrate 114 or electrochemically removed from the substrate 114. .

The retainer 202 can be a bowl made of a plastic such as a fluoropolymer, TELFON, PFA, PE, PES, or other material that is compatible with electroplating or electrogrinding chemicals. The retainer 202 has a bottom portion 210 that includes a bore 216 and a drain 214. A hole 216 is provided in the center of the bottom portion 210 to allow a shaft 2 1 2 to pass therethrough. A seal 2 18 is disposed between the bore 216 and the shaft 212 and allows the shaft 212 to rotate while preventing fluid within the retainer 202 from flowing out of the bore 216. The retainer 202 typically includes the electrode 204, the disc 206, and the abrasive 205 disposed therein. An abrasive 205, such as a polishing pad, is disposed and supported on the disk 206 within the retainer 102.

Electrode 204 is an opposite electrode of substrate 145 and/or abrasive 205 that is in contact with a substrate surface. The abrasive 205 is at least partially electrically conductive and can be used as an electrode together with the substrate during electrochemical processing, such as electrochemical mechanical plating (ECMPP) including electrochemical deposition and chemical mechanical polishing or electrochemical decomposition. Electrode 206 can be an anode or a cathode, depending on whether a positive bias (anode) or a negative bias (cathode) is applied between electrode 204 and abrasive 205. For example, in the process of depositing a substance from an electrolyte onto the surface of the substrate, the electrode 204 acts as an anode and substrate surface and/or the abrasive 205 acts as a cathode. When the substance is to be removed from the surface of a substrate, such as by application of a bias, the electrode 204 acts as a cathode and the surface of the substrate 13/285 or the abrasive 205 acts as the anode in the decomposition process. .

The electrode 204 is disposed between the disk 206 and the bottom portion 21 of the carrier disk 2 and is immersed in the electrolyte 220. The electrode 2〇4 may be a plate member, a plate having a plurality of holes formed therein, or a plurality of electrode members disposed in a permeable membrane or container. A permeable membrane (not shown) may be disposed between the disc 20$ and the electrode 204 or between the electrode 204 and the abrasive 205 to filter out bubbles, such as hydrogen bubbles, from the surface and reduce defect formation. And a more even current or power is applied between them. Electrode 204 is made of a material to be deposited or removed, such as copper, inscriptions, gold, silver, tungsten, and other materials that can be electrochemically deposited on substrate 114. For electrochemical removal processes, such as anodic decomposition, electrode 2 〇4 includes an inexhaustible electrode in addition to the material to be deposited, such as stainless steel, platinum, carbon or aluminum for copper decomposition.

Figure 18 is a plan view showing an embodiment of an electrode 204 having a plurality of independently electrically biasable regions. These regions help control the lateral width of the current through the processing bath to control the removal of material (or deposition) through the diameter of the substrate. In the embodiment illustrated in Figure 18, the electrode 204 includes three concentric regions 1902, 1904, 1906 that are independently biased by a power source 1910. The regions 1902, 1904, 1906 can be separated by a dielectric spacer. Although the regions 1902, 1904, and 1906 are not arranged in a common center ring shape in FIG. 18, the regions may be replaced by a configuration such as a radial configuration, a sector configuration, an arc configuration, a lattice configuration, and a strip. One of a configuration, an island configuration, and a wedge configuration. The abrasive 205 can be a 14 1285576 mat, mesh or tape that is compatible with the fluid environment and processing specifications. The embodiment shown in Fig. 2 is circular and is placed at the upper end of the retainer 202, supported by the lower portion 206. The abrasive 205 includes a conductive material conductive surface, such as one or more conductive elements, for contacting the surface. The abrasive 205 can be a conductive abrasive - a synthetic abrasive material on a conventional abrasive material. The conductive material can be deposited on a "support" material between the disk 206 and the abrasive material for processing during processing. And / or hardness tester. The retainer 202, cover 208, and disc 206 are attached to the base 108. The retainer 202, the cover 208 and the disk 206 are moved toward the base 108 for providing the polishing head 13 被 disposed in the retainer 202 and coupled to the turret 112 when the substrate is positioned between the polishing stations 102, 106. Axis 212. The shaft is coupled to a motor 224 disposed beneath the base 108. The disc 206 is rotated at a predetermined speed in response to a control signal. Disc 2 06 can be a perforated support which is a material that is compatible with 220 and does not adversely affect grinding: can be made from a polymer such as fluoropolymer, PE, TELFON HDPE, UHMW or the like. . The disc 206 can be press-fitted with a housing such as a screw, or other mechanism, and the fixed name disc 206 is preferably spaced apart from the electrode 204 for use in the window, thereby reducing deposition and removal of material for the object 7, the abrasive 2 The surface of the 〇·5 is deposited with the base material or at least during a portion of the disc. For example, the compatibility of the 205 of the abrasive 205 is movably disposed such that the base can be axially directed toward the ECMP and the margin disk 206 2 1 2 is substantially controlled by the motor 2 2 4 Made with electrolyte. Disc 206, PFA, PES, using a retaining member, in the retainer 202. For a wider area of the electrode 204

15 1285576 inch sensitivity. Disk 206 is substantially permeable to electrolyte 220. In one embodiment, the disc 2〇6 includes a plurality of perforations or channels 222 formed thereon. perforation. An aperture, a hole, an opening, or a passageway that partially or completely penetrates the object (e.g., abrasive). The size and density of the perforations are selected to provide a distribution of 払a'', uniformity, across the substrate 114 via the disk 206. In one aspect of the disc 9 Λ < 06, it includes perforations having a diameter of between about 〇 2 吋 (0.5 mm, 展) to about 0.4 吋 (10 mm). The perforation of the perforation is about 3 〇〇 / of about w of the abrasive. To about 80%. 50〇/. The perforation density provides the electrolyte flow to the devil. The adverse effect on the grinding process is minimal. Usually, the wear of the disc 206

The perforations are aligned with the abrasive 2〇5 to provide sufficient electrolyte mass flow through the wA through disc 206 and the abrasive 205 to the surface of the substrate. The abrasive 205 can be placed on the disc 206 using a 4&k»1 π mechanical clip or a conductive adhesive. The abrasive is described for use in an electrochemical mechanical polishing (ECMP) process, v

^ However, the present invention can also be practiced in other processes involving the use of conductive abrasives in electrochemical and A & A & 。. Examples of such processes using electrochemical processes include electrochemical deposition which involves grinding The material 2 05 is used to apply a uniform dusting to a substrate surface for deposition of a conductive material under the bias application device of & $, and electrochemical mechanical plating treatment (ECMPP) including electrochemical deposition And a combination of chemical mechanical polishing. In operation, the abrasive 205 is disposed on the disc 206 in the electrolyte in the retainer 202. A substrate 114 on the polishing head is placed in the electrolyte and The abrasive 205 is in contact. The electrolyte flows through the perforations in the disc 206 and the abrasive 205 and is distributed on the surface of the substrate by the grooves. 16 !285576 The electric power from a power source is then applied to the conductive polishing. The conductive material on the object 205 and the electrode 204 and in the electrolyte, such as copper, is removed by one of the aforementioned methods of anodic decomposition.

The electrolyte 220 flows from a vessel 233 through a nozzle 270 to a volume 232. The electrolyte 220 is prevented from overflowing onto the processing zone 232 by a plurality of apertures 134 disposed in the skirt 254. The aperture 234 generally provides a path through the cover 208 for the electrolyte 220 to exit the processing zone 232 and flow into the lower portion of the retainer 202. The aperture 234 is generally positioned between a lower surface of the recess 258 and the central portion 252. Because at least a portion of the apertures 234 are typically higher than the surface of the substrate 114 at the processing location, the electrolyte 220 fills the processing zone 232 thereby contacting the abrasive 205 with the substrate. Thus, substrate 114 is in contact with electrolyte 220 via a complete relative spacing between cover 208 and disk 206.

The electrolyte 220 collected within the retainer 202 generally flows through the drain 214 located on the bottom 210 into the fluid delivery system 272. The fluid delivery system 272 typically includes a container 233 and a pump 242. The electrolyte 22 flowing into the fluid delivery system 272 is collected in the container 233. The pump 242 transfers the electrolyte 22 from the vessel 233 through a supply line 244 to the nozzle 270 where it is recovered through the ECMP station 102. A filter 240 is disposed between the container 233 and the nozzle 2 70 for removing particles and accumulated substances which may be present in the electrolyte 22. The electrolytic solution may include a commercially available electrolyte. For example, on the removal of the copper-containing material, the electrolyte may include a sulfate-based electrolyte or a phosphoric acid 17 1285576-based electrolyte such as a phosphate chain (K3P04), or a combination thereof. The electrolyte may also contain a derivative of a sulfate-based electrolyte such as copper sulfate and a derivative of a dish-based electrolyte such as copper phosphate. An electrolyte having a perchloric acid-acetic acid solution and a derivative thereof can also be used.

Furthermore, the present invention can be carried out using an electrolyte component (e.g., a brightener) conventionally used in electroplating or electrogrinding additives. One source of electrolyte is an electrolyte produced by Shipley Leonel, a subsidiary of Rohm and Hass, Inc., based in Philadelphia, PA, under the trade name Ultrafill 2000. An example of a suitable electrolyte composition is described in U.S. Patent Application Serial No. 10/038,066, filed on Jan. 3, 2002, which is incorporated herein by reference.

The dynamic flow rate, or a flow rate of approximately 20 gallons per minute (GPM), such as by about 0.5 GPM and about 20 GPM (e.g., about 2 GPM), is provided between the surface of the substrate and an electrode. We believe that the above electrolyte flow rate is sufficient to evacuate the abrasive material and chemical by-products from the surface of the substrate and replenish the electrolyte to improve the polishing rate. When mechanical abrasion is used in the polishing process, the substrate 114 and the abrasive 205 are rotated relative to each other to remove the substance from the surface of the substrate. Mechanical abrasion can be carried out by physically contacting the electrically conductive abrasive and the conventional abrasive material. The substrate 114 and the abrasive 205 are each rotated at a speed of about 5 rpm or higher, for example, between about 1 rpm and about 50 rpm. In one embodiment, a high speed grinding process can be used. The high speed system 18 1285576 includes rotating the abrasive 205 at a platform speed of about 150 rPm or higher (eg, about 150 rPm and about 750 ipm); and the substrate 114 can be at about 150 rpm. Rotation was carried out at a speed of about 500 rpm (e.g., at about 300 rpm and about 500 rpm). Further descriptions of the use of abrasives, processes, and high-speed grinding processes for the apparatus described herein are disclosed in U.S. Patent Application Serial No. 60/308,330, entitled "Method and Apparatus for Chemical Mechanical Polishing of Semiconductor Substrate" Applyed on July 25, 001. Other movements, including orbital movement or bending movement through the surface of the substrate, can also be performed during the manufacturing process. When contacting the surface of the substrate, a pressure of about 6 psi or less may be applied between the abrasive 205 and the surface of the substrate, such as about 2 psi or less. For substrates having a low dielectric constant material, the pressure applied between the substrate 114 and the abrasive 205 during the grinding of the substrate can be about 2 psi or less. In one aspect, a conductive abrasive pressure between about 0.1 psi and about 0.2 pSi can be used to grind the substrate as previously described. In the anodic decomposition, a potential difference or a bias voltage is applied to the electrode 204 (as a cathode) and the polishing surface 31 of the abrasive 205 (as a % pole) (see Fig. 3). The substrate in contact with the abrasive is ground by the electrically conductive abrasive surface 310 while the bias is applied to the electrically conductive support member. The biasing can remove the conductive material, such as a copper-containing material that travels over the surface of the substrate. The manner in which the bias is established can include applying a voltage of about volts or less to the surface of the substrate. A voltage between about 0.1 volts and about 1 volt volt can be used to decompose the copper-containing material from the surface of the substrate into the electrolyte. The bias voltage can also produce a current density of about 19 285 576 degrees from about 0.1 mA/cm2 to about 50 mA/cm2, or a current of from about 〇" to about 2 amps for a 200 mm substrate. The signal used by the power supply 150 to establish the potential difference and perform the anodization process may vary depending on the requirements for material removal from the substrate surface. For example, an anode potential which changes with time can be supplied to the conductive abrasive 2〇5. The signal can also be applied by an electronic pulse modulation technique. The electronic pulse modulation technique includes applying a fixed current density or voltage to the substrate for a first period of time, and then applying a fixed reverse voltage to the substrate for a second period of time, repeating the first The second step. For example, the electronic pulse modulation technique can use a "variable potential" from about volts to about -15 volts to about 〇 J volts to 15 volts. In relation to correcting the penetration pattern and density on the abrasive medium, it is generally believed that the substrate is formed relative to the abrasive 205 when compared to the higher edge removal rate and lower central removal rate of conventional edge contact pins. The bias voltage can cause a conductive material, such as a metal, to be uniformly decomposed from the surface of the substrate into the electrolyte. Conductive materials, such as copper-containing materials, can be at a rate of about 15 angstroms per minute or less, such as between about 100 angstroms/minute to about 15 angstroms (Å angstroms per minute) at a rate from the surface of the substrate to part J. It was removed. In an implementation of the invention, wherein the copper species to be removed is less than 12,000 angstroms thick, a voltage can be applied to the conductive abrasive 205 to provide a removal rate of between 100 angstroms/minute and about 8000 angstroms/minute. . In the subsequent electrical polishing process, the substrate can be further ground or wiped to remove the barrier layer material, remove surface defects from the dielectric material, or utilize conductive abrasives to improve the flatness of the polishing process. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The abrasive material can be formed from a conductive material comprising at least one electrically conductive abrasive material or a conductive element formed of a dielectric or electrically conductive material. In one embodiment, the electrically conductive abrasive material is a plurality of electrically conductive fibers, electrically conductive fillers, or combinations thereof. The electrically conductive fibrous fillers or combinations thereof may be distributed in the abrasive material. The electrically conductive fibers may comprise at least a conductive or dielectric material (for example or a conductive polymer or a carbon-based material), at least partially coated or covered with a conductor (including a metal, a carbon-based material, a conductive ceramic material, a conductive alloy). The electrically conductive fibers may be in the form of fibers or fine threads, electrically conductive fibers or articles, one or more loops, coils or conductive fiber rings, etc. Multi-materials (eg, multilayer conductive fabrics or fibers) may be used to form the conductive material. A dielectric or material coated with a conductive material. A dielectric polymeric material can be used as the fibrous material. Examples of suitable materials include polymeric materials (such as polyamine, polyurethane, poly A vinegar, poly vinegar, polypropylene). , polyethylene, polystyrene, diene-containing polymers (such as propylene / ethylene / styrene (AES), acrylic polymers or combinations thereof), etc. The invention is used as an organic or inorganic material of the aforementioned fibers The conductive fiber material may comprise a conductive material which is electrically conductive in nature. The abrasive material may comprise a dimension, a conductive material such as a dielectric material or a conductive conductive layer thereof. Dimensional fiber-polymeric polycarbonate copolymers include, for example, 21 1285576 polyacetylene, solid polymer conductors (PEDT), which are marketed under the trade names BaytornTM, polyaniline, polylocene, polyphenylene, carbon-based fibers. Another example of a conductive polymer is a polymer-precious metal mixture. The polymer-precious metal mixture is generally chemically passive to the surrounding electrolyte, such as a noble metal with a resistance to oxidation, a polymer-precious metal composite. An example of a turn-polymer blend. An example of a conductive abrasive material (including conductive fibers) is disclosed in detail in the current application, U.S. Patent Application Serial No. 10/033,732, filed on December 27, 2001. The title is "Conductive Polishing Article For Electrochemical Mechanical Polishing", the entire contents of which are incorporated herein by reference. The present invention also includes the use of such organic or inorganic materials as fibrous materials. The fibrous material may be solid or naturally hollow. The fiber has a length ranging from about ιμιη to about 1000 mm, and the diameter is about μ1μηι to about Imm. In one aspect, for conductive polymeric composites and foams (such as conductive fibers deposited in polyurethane), the fiber diameter may range from about 5 μm to about 200 μm, and the length to width ratio is about 5 or Higher, for example about 1 〇 or higher. The cross-sectional area of the fiber may be a circular, elliptical, star-shaped pattern, snow flake or any other shape of processed dielectric or conductive fiber. It has a length of about 5 mm and about High aspect ratio fibers between 1000 mm and having a diameter ranging from about 5 μm to about 1000 μm can be used to form webs, loops, fibers or fabrics of electrically conductive fibers. The fibers can also have a range of between about 104 psi and about 1 〇 8 psi. Elastic coefficient. However, the present invention should cover any elastomeric coefficient sufficient to provide abrasives and smooth, elastic fibers in the foregoing processes. 22 1285576 Conventional materials deposited on the conductive or dielectric fiber material generally comprise a conductive inorganic compound such as a metal, a metal alloy, a carbon based material, a conductive ceramic material, a metal inorganic compound or a combination thereof. Examples of metals that can be used in the coating of conductive materials herein include metals, tins, boats, copper, magnets, and compositions. Precious metals include gold, platinum, palladium, rhodium, ruthenium, osmium, iridium, hunger, and combinations thereof, with gold and platinum being preferred. In addition to the foregoing, the present invention also encompasses the use of other metals for coatings of conductive materials. The carbon-based material includes carbon black, graphite, and carbon particles that can be fixed to the surface of the fiber. Examples of ceramic materials include NbC, ZrC, TaC, TiC, WC, and combinations thereof. The present invention encompasses, in addition to the foregoing, Other metals, other carbon-based materials, and other ceramic materials that can be used for coating conductive materials. The metal inorganic compound includes copper sulfide such as danjenite or Cu9S5 deposited on a polymer fiber such as acrylic or nylon fiber. The danjenite coated fiber system Thunder〇n8 (trade name) was marketed by Ni本Nihon Sanmo Dyeing Co., Ltd. The Thunderon 8 fiber generally has a coating of about 3 μm and about dan danjenit WCud 5 and has been found to have an electrical conductivity of about 4 (m/cm. The conductive coating can be electroplated, coated, and physically gas-treated. Phase deposition, chemical deposition, adhesion, junction or crucible materials are deposited directly on the fiber. In addition, layers of conductive materials such as copper may be deposited by nucleation, splicing, and sowing. Recording or recording, etc. can be used to improve the conductivity of the lead Α & & & II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II II Ion electrical or electrically conductive fibers of different lengths, as well as on loops, foams, and fabrics or fibers of a shape made of dielectric or electrically conductive fiber materials. 23 1285576 Coated polyethylene fibers. Acrylic fiber (acrylic fiber suitable for conductive fiber 雉 系 一 一 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适 合适Conductive fiber Deposited in the copper layer, the nylon fiber is coated with a steel seed layer, and the conductive filler may include carbon-based materials or conductive particles and fibers. Examples of conductive base materials include carbon bubble beds, carbon fibers, carbon. Nanobubone carbon foam ((10). n nonofoam), carbon gas glue (earbQn coffee (10), graphite and combinations thereof. Examples of conductive particles or fibers include polymers that are electrically conductive, dielectric or The conductive material coated conductive particles, the conductive material coated with the dielectric filler material, and the conductive inorganic particles include metal particles (such as gold, platinum, tin, lead, and other metal or metal alloy particles), conductive ceramic particles, and combinations thereof The conductive filler may be partially or completely coated with a metal (such as a precious metal), a carbon-based material, a conductive ceramic material, a metal inorganic compound or a junction thereof (as described in the text). The example of the filler material is a carbon fiber. Or graphite coated with copper or nickel. The conductive filler may be round, elliptical, straight strip with a specific aspect ratio (for example, 2 or higher), or processed filler of any other shape. Broadly defined herein as a material that can be deposited on a second material to alter the physical, chemical, or electronic properties of the first material. As such, the filler material can also include a dielectric or be partially or completely coated with a conductive metal. The conductive fiber material, or the conductive polymer described herein, may be a complete fiber or a fiber sheet. The dielectric filler or the conductive fiber material partially or completely coated in the conductive metal or the conductive polymer may also be a complete fiber or a fiber sheet. The material is used to coat the dielectric and conductive fibers, and the filler can provide the desired conductive height to form the conductive abrasive material. In general, the coating of the cough conductive material is deposited on the fiber and/or filler material. The coating has a thickness between about ΟΙ.ΟΙμιη and about 50 μm, for example between about 0·02 μm and about 1 Ομιη. The coating generally forms fibers or has a resistivity of less than about ΙΟΟΩ-cm (eg, Ο. ΟΟΙ Ω-cm and about 32Q-cm) of filler. The resistivity encompassed by the present invention depends on the fiber or filler and the coating used, and includes the resistivity of the coating of the cover conductive material, such as platinum, which has a resistivity of 9.81 μΩοπι. Examples of suitable conductive fibers include nylon fibers coated with about 1 μm of copper, nickel or cobalt, and nylon fibers deposited on copper, nickel or a layer of about 2 μm gold with a total fiber diameter of about 3 〇μιη and about 90μιη. The electrically conductive abrasive material can comprise a combination of electrically conductive or dielectric fibers (wherein the dielectric fibers are at least partially coated or covered with additional electrically conductive material and electrically conductive fibers) to achieve the desired electrical conductivity or other abrasive characteristics. An example of a composition is the use of gold coated nylon fibers and graphite as the electrically conductive material, which includes at least a portion of the electrically conductive abrasive material. The electrically conductive fibrous material, the electrically conductive filler material, or a combination thereof may be dispersed in the bonding material or form a composite electrically conductive abrasive material. Traditional abrasive materials are a form of bonded material. Conventional abrasive materials are typically dielectric materials such as dielectric polymeric materials. Examples of dielectric polymer abrasive materials include polygas Sa and polyglycols mixed with fillers, polycarbonate, polyphenylene sulfide (PPS), Teflon polymer, polystyrene, EPDM or Its composition' and other abrasive materials used to grind the surface of the material. Conventional abrasive materials can include cooked 25 1285576 fibers impregnated in amino phthalate or in a swell state. The present invention contemplates any abrasive material that can be used in conjunction with the electrically conductive fibers and fillers described herein as a bonding material (known as a polymeric substrate).

Additives can be added to the bonding material to aid in the distribution of the electrically conductive fibers, electrically conductive fillers, or combinations thereof in the polymeric material. Additives can be used to improve the electrical properties of the machine, heat, and abrasive materials formed from fibers and/or fillers and bonding materials. Additives include crosslinkers for improving cross-linking of polymers for use in distributing conductive fibers or conductive fillers to provide a more uniform dispersant in the bonding material. Examples of the cross-linking substance include an amino compound, a decane cross-linking compound, a polyisocyanate compound, and a composition thereof. Examples of the dispersing agent include an N-substituted long-chain alkenyl butyl dithioimide, a polymer weight. An amine salt of an organic acid, a methacrylic acid or an acrylic acid derivative containing a polar functional group (for example, an amine, an amino compound, an imine, a sulfilimine, a hydroxide, or an ether). Further, sulfur-containing compounds such as mercaptoacetic acid and related esters have been found to be effective dispersants for fillers in gold-coated fibers and bonding materials. The amounts and types of additives encompassed by the present invention may be adjusted for the fibers or filler materials and the bonding materials used, and the foregoing examples are illustrative and are not to be considered or construed as limiting. Furthermore, the web of electrically conductive fibers and/or filler material can be formed in the bonding material by providing a sufficient amount of electrically conductive fibers and/or electrically conductive filler material to form a physical continuous or electronic continuous medium or phase in the bonding material. . The electrically conductive fibers and/or electrically conductive fillers generally comprise at least about 2% to about 85% by weight, such as about 5% and about 60% by weight of the abrasive material when combined with a polymeric bonding material. The blended fibers or fabric coated with a conductive material and optionally coated with a conductive filler material may be placed in a binder. The fibrous material coated with a conductive material may be blended to form a yarn. The yarns can be polymerized into a conductive mesh by means of a binder or coating. The yarn can be provided as a conductive element in the pad material or can be mixed into the fabric or fiber. Alternatively, the electrically conductive fibers and/or fillers can be combined with a bonding agent to form a combined electrically conductive abrasive material. Examples of suitable binders include epoxy resins, silicones, urethanes, polyimines, polyamines, fluoropolymers, fluorocarbon-added derivatives thereof, or combinations thereof. Additional conductive materials, such as conductive polymers, additional conductive fillers, or combinations thereof, can be used with the bonding agent to achieve the desired conductivity or other abrasive characteristics. The electrically conductive fibers and/or fillers can comprise from about 2% to about 85%, for example from about 5% to about 60%, of the abrasive material. The electrically conductive fibers and/or filler materials can be used to form electrically conductive abrasive materials or abrasives, and such abrasive materials or abrasives have a volume or surface resistance of about 5 〇 n_cin or less (e.g., about 3 Q-cm or less). In one embodiment of the abrasive, the abrasive surface of the abrasive or abrasive has an electrical resistance of about Ι Ω-cm or less. In general, the conductive abrasive or a component of the electrically conductive abrasive material and the conventional abrasive material can provide a conductive abrasive having a volume resistivity or a volumetric surface resistance of about 50 Ω-cm or less. Examples of the composition of the electrically conductive abrasive material and conventional abrasive materials include carbon or a carbon-based fiber having a resistance of 1 Ω - cm or less, which is deposited in a sufficient amount in a conventional polyurethane abrasive material to thereby have a volume resistance of about ΙΟΩ -cm or lower abrasive. The conventional Grinding material made of the conductive fibers and/or fillers described herein generally has mechanical properties that do not degrade under a stable electric field and avoid degradation in an acid or alkaline electrolyte. The electrically conductive material and any bonding materials are combined to provide the same mechanical properties. If desired, conventional abrasive materials for use in conventional abrasives can also be used. For example, an electroabrasive material, either alone or in combination with a bonding material, has a hardness value of about 100 or less for a polymeric material, which is based on the total US test in Philadelphia, Philadelphia. And materials society (ASTM) measured. In the _ aspect, the electrically conductive material has a Shore D hardness value of about 80 degrees or less to the polymer material. The electrically conductive abrasive portion 310 generally comprises a surface roughness of about 5 mm or less. The polishing pad is generally designed to reduce or minimize the abrasive structure of the substrate surface during mechanical polishing and when biasing to the surface of the substrate, in which the abrasive is A single layer of electrically conductive abrasive material can comprise a plurality of layers of material, including materials or providing a conductive surface to contact the substrate. A paper placed on the support is constructed. In another aspect, the at least one electrically conductive material and the at least one support portion or the bottom surface of the substrate are deposited as a partial cross-sectional view of one embodiment of the abrasive 2〇5. The abrasive 205 shown in Fig. 3 includes a composite abrasive having a conductive polishing portion for polishing the substrate surface and the substrate portion or the bottom portion 320. A conductive abrasive portion 31A can include a conductive abrasive material comprising 28 1285576 conductive fibers and/or conductive fillers as described herein. 310 can include a conductive material dispersed in a polymeric material and comprising a filler. The conductive fiber may be disposed on the third conductive fiber and may be included in the polymer spotting agent; the conductive conductive material generally has a hardness and a coefficient lower than that of the south. In addition to other conductive metals that are softer than copper, the gold and tin are included. The palladium-tin alloy, platinum, and the like do not scratch the abrasive substrate, and the present invention also covers the primary filler. Further, the conductive material grinding portion may comprise a conductive fiber loop or a conductive fiber blended isoform 3 fabric. The electrically conductive abrasive portion 31 can also be composed of a plurality of layers of electrically conductive fabric or fibers. One example of the electrically conductive abrasive portion 310 is a phase of gold and graphite placed in a polyurethane. Other examples, graphite particles and/or carbon fibers in Shixi gum. Other ammonia or gold particles in the substrate. In another embodiment, the electrically conductive abrasive portion describes abrasive particles 366. The abrasive particles 36 are exposed above the conductive abrasive portion 310. The abrasive table 3 60 is generally configured to remove the ground substrate layer ' to expose the underlying metal to the electrolyte and enhance the polishing rate during the process. The particles 360 are ground to destroy the ceramic polymer particles formed in the passive layer on the metal surface. The polymer particles may be solid or may be in the conductive abrasive portion of the conductive fibers and/or the conductive binder. The soft conductive material. - Soft. Soft conductive materials Gold and ceramic composites are inclined. If the size is small enough and the hardness is higher than that of the copper, the conductive loop is lacking, and the coil is formed to form a conductive cloth or an electrical material (for example, the multilayer coated with the nylon fiber is included in the polyurethane or the sample includes the distribution in the poly 3 10 0 a pure state electrochemical reaction having at least some portions of the surface of the abrasive surface of the abrasive particles, examples of which include strength foot porcelain, inorganic, organic or sponges which reduce the wear rate of the ground portion 3 1 0 29 1285576 The material selection unit 320 generally has a smaller direct 彳 导电 导电 导电 导电 导电 导电 导电 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 The system illustrates the ring guide V3 1 〇 and the object support portion 320, but the present invention also covers the electric grind portion 31 〇, the object support portion ^ ^, U rain is not a shape, or an elliptical surface. The invention further covers the guide material supporting the Qiu I month and the conductive polishing part 310,

• β or both can form a linear mesh or ribbon material. - ι物 Support &quot;Ρ 320 can include pure substances that can be consumed or damaged during ECMP during the grinding process. For example, the material support portion may be composed of a conventional abrasive material 'including a polymer material such as polyurethane, and a mixture of polyammonium carbonate, polycarbonate, polyphenylene sulfide (pps), EPDM rubber. (EPDM), TeflGnTM polymer or composition thereof, and other abrasive materials used to grind the surface of the material. The material supporting portion 32 can be a conventional soft material, for example, a felt fiber which is compressed and impregnated in a urethane for application to the polishing material 2〇5 and the polishing head 13 during the adsorption process. Several

pressure. The soft material may have a hardness value of about 2 〇 and a hardness of about 9 萧. Alternatively, the object support portion 3 20 may be made of a conductive material that is adapted to surround the electrolyte without damaging the grinding, and includes a conductive noble metal or conductive polymer to provide electrical conductivity throughout the abrasive. Examples of precious metals include gold, platinum, palladium, rhodium, ruthenium, osmium, iridium, osmium, and combinations thereof, of which gold and Gu are preferred. The material will interact with the surrounding electrolyte, such as copper, which can be used when the materials are insulated from the surrounding electrolyte by inert metals such as conventional abrasive materials 30 1285576 or precious metals.

When the object branch portion 320 is electrically conductive, the object supporting portion 32 may have a higher conductivity (that is, a lower resistivity) than the conductive polishing mn). For example, the conductive polishing portion # 31〇 and Ming's object support 32 &quot; mesh ratio, can have! · Ο Ω_ 〇ΓΠ or lower resistivity (since the support resistance of the material is 9.81μΩ · conductive. The material support 胄 32 () can provide uniform bias or current during grinding to minimize the edge The conductive resistance of the surface of the object (e.g., the radius of the object) is decomposed by an anode uniformly distributed over the surface of the substrate. The conductive support portion 32 can also be coupled to a power source to transfer power to the conductive abrasive portion. The conductive polishing portion 3 is suitably bonded to the material support portion 320 by a bonding agent used in the polishing process and used in the polishing process. The present invention contemplates that the conductive polishing portion 31 can be bonded to the object to be ground. The device on the portion 320 is, for example, stamped or laminated. The potting agent may be electrically conductive or dielectric as desired by the process or desired by the manufacturer. The support portion 3 2 0 may be bonded by a bonding agent or The mechanical clip is fixed to a support portion, such as the disk 206. Alternatively, if the abrasive 205 may include only one conductive polishing portion 31,

The electrically conductive abrasive portion can be secured to the yoke (e.g., disk 206) by a bonding agent or mechanical clip. The conductive polishing portion 310 and the object supporting portion 32 of the abrasive 205 can generally pass through the electrolyte. A plurality of perforations may be formed in the conductive polishing portion 3 10 and the object supporting portion 320, respectively, to help the liquid helium flow therebetween. The plurality of perforations allow electrolyte to flow through and contact the surface during processing. The perforations may be provided during manufacture, such as between woven fabrics in electrically conductive fibers or fabrics, or may be mechanically disposed and molded to penetrate the materials. The holes 31 1285576 can partially or completely form a layer of 205 through the abrasive. The perforations of the 310 and the support of the object support portion 3 20 are adapted to facilitate the flow of liquid therebetween. A hole formed in the abrasive of the perforations 350 of the abrasive 205, wherein the hole has a diameter of between about 10,000 Å and about 4 Å (10 mm). The abrasive is between about 0 · 1 m m and about 5 m m. For example, the distance between the perforations and the ο. 1 inch and about 1 inch. The abrasive 205 has a flow of from about 20% to about 80% R to provide a sufficient electrolyte flow throughout the abrasive article. The invention also encompasses a perforation density that is less than or greater than the perforation density used herein. In one example, about 50% of the electrolyte is now available to provide decomposition from the substrate. The perforation density described herein is broadly described as the volume of the abrasive. The perforation density includes the total count perforation size of the surface or the body of the abrasive as it is in the perforations 205. The perforation size and density are selected to provide a uniform electrolyte distribution of i 2〇5 to the surface of the substrate. Generally, the perforated ruler of both the abrading portion 310 and the object support portion 320 and the perforated tissue are configured and calibrated to each other with the electrically conductive abrasive portion 31 and the object support portion 320 to the solution stream. The grooves may be disposed in the abrasive 205 to facilitate alignment of the conductive polishing holes with each other. The example includes a thickness of 0.02 inch (the thickness of the film may be a distance of one hole, the surface. However, In order to control the liquid flow perforation density to the surface of the uniform anode, the perforations are formed in the amount of grinding and diameter or

I. The abrasive, the density of the perforations provides sufficient flow of electrolyte through the surface of the substrate through the 32 1285576 abrasive 205 to provide an effective or uniform flow of electrolyte for the anodic decomposition or electroplating process. The trenches may be formed partially in a single layer or in multiple layers. The invention also encompasses grooves that may be formed in the upper layer or at the polishing surface that contacts the surface of the substrate. To provide an increased or controlled flow of electrolyte to the surface of the abrasive, one or more portions of the perforations may be in communication with the grooves. Alternatively, all or none of the perforations communicate with the grooves provided in the abrasive 205. Examples of the grooves used to promote the flow of the electrolyte include straight grooves, curved grooves, concentric grooves, radial grooves, and spiral grooves. The grooves formed in the abrasive 205 have a square, circular, semi-circular or other shape that facilitates flow through the surface of the abrasive. The grooves can intersect each other. The grooves may be arranged in a pattern such as a 丫 pattern disposed on the abrasive surface or a triangular pattern formed on the abrasive surface, or a combination thereof to improve electrolysis on the surface of the substrate Liquid flow. The trenches may be spaced apart from one another by a distance of from about 30 mils to about 300 mils. Typically, the width of the grooves formed on the abrasive is between about 5 mils and about 30 mils, but the size can vary as needed for grinding. An example of a trench pattern includes trenches of about 1 mil mil width, about 60 mils apart from one another. Any suitable groove configuration, size, diameter, and spacing can be used to provide the desired electrolyte flow. Other sections and trenches are described in detail in the October 11, 2001 application. The current US Patent Application Serial No. 60/328,434, entitled "Method And Apparatus For Polishing Substrates", full text This is incorporated herein by reference. The delivery of the electrolyte can be enhanced by forming a perforation in at least a portion of the trenches to improve the flow of the electrolyte, even if the trenches for processing the substrate are more evenly distributed over the surface of the substrate and processed The electrolyte will be renewed by the additional electrolyte flowing through the perforations. An example of a perforation of a pad and a groove are disclosed in more detail in U.S. Patent Application Serial No. 1/26,8, filed on Dec.

The range of abrasives with perforations and grooves is described below. Figure 4 is a top plan view of an embodiment of a grooved abrasive. The circular pad 440 of the abrasive 205 is illustrated with a plurality of perforations 446 of sufficient size and organization to allow electrolyte to flow to the surface of the substrate. The perforations 446 are spaced about 1 inch apart and about 1 inch apart. The perforations may be annular perforations having a diameter of between about 2 inches (〇 5 mm) and about 4 inches (10 mm). Also, the number of perforations may vary depending on the equipment used, the processing parameters, and the ECmp composition.

A groove 442 is formed in the abrasive surface 448' of the abrasive 205 to assist in the transfer of fresh electrolyte from the volume of the header 202 to the void between the substrate and the abrasive. The trenches 442 may have different patterns, including a substantially circular concentric circular groove on the polishing surface 448 shown in FIG. 4, one of the XY patterns shown in FIG. 5, and the triangular pattern shown in FIG. . Figure 5 is a top plan view of another embodiment of an abrasive article having grooves 542 disposed in a χ-gamma pattern on a polishing portion 548 of a polishing pad 540. The perforations 546 can be disposed at the intersection of the vertical and horizontal grooves, and can also be disposed in a vertical groove, a horizontal groove, or on the abrasive 548 beyond the groove 542. The perforations 546 and the grooves 34 1285576 5 42 are disposed on the inner diameter 55 of the abrasive and the outer diameter 5 50 of the polishing pad 544 is free of perforations and grooves. The second figure is another embodiment of a patterned abrasive 640. In this embodiment, the grooves are arranged in a Χ-Υ pattern and have diagonally disposed grooves 645 which intersect the grooves 642 of the Χ-Υ pattern. The diagonal groove 645 can be configured to clip the Χ-Υ groove $42 by an angle of about 3 degrees to about 6 degrees. The perforations 646 can be disposed at the intersection of the χ-γ trenches 642, the intersection of the χ-γ trenches 642 with the diagonal trenches 645, along the trenches 642 and 645, or disposed on the abrasive 648 Where the grooves 642, 645 are. Perforations 6 46 and grooves 642 are disposed on the inner diameter 650 of the abrasive and the outer diameter 650 of the abrasive pad 644 is free of perforations and grooves. Other examples of trench patterns (such as spiral trenches, layered trenches, and turbine trenches) are described in more detail in the US application for the 1st, 1st, and 1st year. Patent Provisional Application Serial No. 6/328,434, entitled "Method And Apparatus For Polishing Substrates", the entire disclosure of which is incorporated herein by reference. In addition to the perforations and grooves in the abrasive 205, the conductive polishing portion 310 can also be embossed to include the surface texture. Embossing also improves the delivery of electrolytes, removed substrates, by-products, and microparticles. The relief also reduces scratches in the abrasive substrate and changes the friction between the abrasive substrate and the abrasive 205. The surface texture of the relief can be evenly distributed on the conductive polishing portion 310. The surface texture of the relief may include, for example, pyramids, islands, structures that intersect in a circle, a rectangle, and a square and other geometric shapes. The present invention encompasses other texture structures that are embossed on the conductive polishing portion 310. The embossed surface may cover a surface area of five to ninety-five percent of the electrically conductive portion 310 of the guide 35 1285576, such as a surface area of fifteen to ninety percent of the electrically conductive abrasive portion 310. Conductive abrasive surface

Figure 7A is a top plan view of one embodiment of a conductive fabric or fabric 700 that can be used to form the electrically conductive abrasive portion 3 1 of the abrasive 205. The conductive fabric or fabric is composed of an interwoven fabric 710 which is coated with a conductive material as previously described.

In one embodiment, the woven or basket-weave pattern of the interwoven fabric 710 in the vertical 720 and horizontal 730 directions (shown in Figure 7A plane) is illustrated in Figure 7A. Other fabrics, such as yarns or different interwoven, woven mesh or screen patterns, used to form the electrically conductive fabric or fabric 700 are also contemplated by the present invention. In one aspect, the fabric 710 is interwoven to provide a channel 740 in the fabric 700. The channels 740 allow electrolyte or fluid (including ions and electrolyte compounds) to flow through the fabric 700. The electrically conductive fabric 700 can be placed in a polymeric binder such as polyurethane. Conductive fillers can also be placed in the polymeric binders described above. Figure 7B is a partial cross-sectional view of the electrically conductive fabric or fabric 700 placed on the object support portion 320 of the article 205. The conductive fabric or fabric 700 can be placed in one or more continuous layers disposed above the boot support portion 320, the object support portion including any of the perforations 350 formed in the object support portion 320f. The fabric or woven fabric 700 can be secured to the article support portion 320 by a bond. When immersed in the electrolyte, the fabric 700 is adapted to allow electrolyte to flow through the fibers 'wovens or channels formed in the fabric or woven 700 of 36 1285576. The intermediate layer may also be selectively disposed between the fabric or the crucible (10) 700 and the object support portion 3 2 . The intermediate layer is permeable or may include a plurality of perforations aligned with the perforations 32 以 for the electrolyte to flow through the 205 〇 or if the channels 74 〇 are determined to be insufficient for the electrolyte to flow effectively The weaving. At 700 o'clock (for example, if the 'metal ions cannot diffuse between them), the fabric 7 can also be used. Also perforated to increase the flow of electrolyte therebetween. The fabric 7 〇〇 generally increases the flow rate of the electrolyte by about 2 每 per minute. Figure 7C is a partial cross-sectional view of the fabric or fabric 7 which may be patterned with a plurality of perforations 75 to match the pattern of perforations 3 50 in the support 32 〇. Alternatively, some or all of the perforations may not be aligned with the perforations 350 of the substrate support 320. The alignment or misalignment of the perforations allows the operator or manufacturer to control the flow rate or volume of electrolyte flowing through the grind to contact the surface of the substrate. An example of the fabric 700 is a woven interwoven blue woven fabric having a media width of about 10 and a fiber comprising at least one nylon coated nylon fiber. The fiber is, for example, a nylon fiber having about ohm of cobalt, copper or nickel on the nylon fiber and having about 2 μm of gold placed on the cobalt, copper or nickel. Alternatively, a special electric mesh can be used for the conductive fabric or fabric. The electrically conductive web may comprise at least a conductive fiber, a conductive filler or at least a portion of the electrically conductive fabric 700 or coated with a conductive bonding agent. The electrically conductive bonding agent comprises at least a non-metallic electrically conductive polymer or a composite of electrically conductive materials disposed in a polymeric compound. Conductive fillers (such as graphite powder, graphite sheet, graphite fiber 37 1285576 dimension, broken fiber, carbon powder, black carbon, metal particles or fibers coated in conductive materials) and polymer materials (such as polyaminophthalic acid B) A mixture of esters and the like can be used to form the conductive binder. The fibers coated with the electrically conductive material described herein can also serve as electrically conductive fillers for the electrically conductive bonding agents. For example, carbon fibers or gold coated nylon fibers can also be used to form conductive bonding agents. The lead bonding agent may also include a plurality of additives to assist in the dispersion of the conductive filler and/or fibers, improve the adhesion between the polymer and the filler and/or fibers, and improve the mechanical and thermal properties of the conductive bonding agent, if desired. Electrical characteristics. Examples of additives that can be used to improve adhesion include epoxy resins, silicones, urethanes, polyamides or combinations thereof. The conductive filler and/or fiber and the composition of the polymeric material can also be used to provide specific characteristics such as electrical conductivity, adhesion, and durability. For example, the electrically conductive bonding agent comprises at least a conductive filler which can be used in conjunction with the materials and processes described herein at a weight percentage of between about 2 and about 85. The materials which can be used as the conductive filler and the conductive bonding agent are described in detail in the U.S. Patent Application Serial No. 1/33,732, filed on Jan. 27, 2011, which is incorporated herein by reference. The thickness of the conductive bonding agent is between about 1 mm and about 丨〇, for example, between about 1 〇 _ mm and about 1 mm. A multilayer conductive bond can be applied to the conductive web. The conductive web can be made in the same manner as the conductive fabric or fabric 700 shown in Figures 7B and 7C. The electrically conductive bonding agent can be applied to the electrically conductive woven mesh in a multilayer manner. In one aspect, the electrically conductive bonding agent is applied to the electrically conductive web after perforation of the web to protect the exposed web portion during the perforating process. 38 1285576 In addition, a conductive primer may also be placed on the conductive web prior to the application of the conductive bond to improve the adhesion of the conductive bond to the conductive web. The conductive primer can be made of the same material as the conductive bonding fibers, and the composition is changed to have a bonding property larger than that of the conductive bonding agent. Suitable conductive primer materials can have a resistance of less than about 10 ft Q/cm, such as a resistance of between about 0.001 Q/cin and about 32 Q/cm, or a 'foil' can be used for the conductive fabric or fabric 700. As shown in Figure 7D. The conductive foil generally comprises a metal foil 78〇, which is disposed in a conductive bonding agent 790 or coated with a conductive bonding agent on the supporting layer 320. 90°. Examples of forming a metal foil include a metal coated fabric, a conductive material, etc. Materials include copper, nickel, and cobalt and precious metals (such as gold, platinum, palladium, silver, chain, ruthenium, osmium, iron, tin, lead, and combinations thereof, of which gold, tin, and melamine are preferred). The conductive foil may also comprise a non-metallic conductive foil sheet, such as a copper sheet, a carbon fiber woven mesh foil. The conductive foil may also comprise a metal coated fabric of a dielectric or conductive material, such as copper, nickel, tin or gold coated with a nylon fiber fabric. The conductive foil may also comprise a conductive or tantalum coated with the aforementioned conductive bonding material. Material fabric. The conductive foil also includes a metal frame, a metal mesh or a metal mesh in which a conductive metal wire or a metal strip (e.g., a copper metal wire) is connected, which may be coated with a conductive bonding material as described above. The present invention also encompasses the use of other materials in this form to form the Golden Manuscript &gt; Ganyi Lt. Here, the silver s, ^, s agent 790 can encapsulate the gold so that the metal 羯 780 becomes observable to be able to react with the surrounding electrolyte 39 1285576

A conductive metal that acts, such as copper. The conductive foil may be provided with a plurality of perforations as described above. Although not illustrated herein, the conductive foil can be coupled to a conductive metal wire to provide a power supply to bias the abrasive surface. The conductive bonding agent 790 can be applied as a conductive mesh or fabric 700 and can be applied to the metal foil 780 in a multilayer manner. In one aspect, the conductive bonding agent 7 9 〇 is applied to the metal foil 780 after the metal foil 780 is perforated to protect the portion of the metal foil 78 0 exposed by the perforation process.

The electrically conductive bonding agent described herein can be applied to the electrically conductive fabric 700, pig 780 or web. The binder will then cure on the fabric, foil or web after drying and curing. Other suitable process methods including injection molding, compression molding, lamination, pressure cooker, extrusion or a combination of such methods can also be used to encapsulate the electrically conductive fabric, web or foil. Thermoplastic and thermosetting binders are also suitable.

The bonding agent between the conductive bonding agent and the metal foil compound of the conductive foil may also be formed by a plurality of perforations (diameter or width of about 1 mm) or by the metal foil and the conductive material. The bonding agent is reinforced by means of a conductive primer. The conductive primer can be the same material as the conductive primer used for the woven mesh described above. Figure 7E is a cross-sectional view of another embodiment of a conductive fabric or fabric 798 that can be used to form an underlying layer 792 of one of the abrasive pads 310 of the abrasive article 2 - the conductive fabric or fabric can be interwoven Or the composition of the non-woven fabric 710. The fibers 71 can be formed or coated from a previously described electrically conductive material. Examples of non-woven fabrics include spun-b〇nd or melt blown polymers, as well as other nonwoven fabrics. 40 1285576 The conductive polishing portion 310 includes an upper layer 7 94 of electrically conductive material. The upper layer 794 includes an abrasive surface 796 opposite the lower layer 792. The upper layer 794 can have a thickness sufficient to lower the lower layer 792. The unevenness is smoothed to provide a flat and flat abrasive surface 796 for contacting the substrate during processing. In one embodiment, the abrasive surface 796 has a thickness ranging from less than or equal to about 1 mm, and a surface roughness ranging from less than or equal to about 500 mm. The upper layer 794 can be comprised of any electrically conductive material. In one embodiment, the upper layer 794 is formed of a soft material such as gold, tin, palladium, palladium-tin alloy, or other ceramics that are softer than copper, conductive metals, alloys. The upper layer 794 can optionally include the foregoing bonding material therein to aid in the removal of the pure layer on the metal surface of the substrate during polishing. Alternatively, the upper layer 794 may be composed of a non-conductive material that substantially covers the conductive polishing portion 310 but leaves at least a portion of the conductive polishing portion to electrically connect the conductive polishing portion 310 to the upper layer. 794 Previously ground substrate. In the above configuration, the upper layer 794 can help reduce scratches and prevent the conductive portion 310 from entering any exposed features during grinding. A non-conductive upper layer 794 can include a plurality of perforations to maintain exposure of the electrically conductive abrasive portion 310. Fig. 7F is another embodiment in which a window 702 is formed to form the abrasive 2〇5 therein. The window 702 is configured to position a sensor 7〇4 under the abrasive 205 to sense the methe indicator of the polishing performance. For example, the inductor 704 can be an eddy current sensor or a 41 1285576 interferometer or other inductor. In one embodiment, the interferometer sensor that produces a collimated beam is incident on one side of the substrate 14 to be ground during the process. The interference between the reflected signals is an indicator of the thickness of the material layer to be ground. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

The window 702 includes a fluid grid 706 that substantially prevents process fluid from flowing out of the area of the disk 206 that contacts the mask 704. The fluid grid 706 is generally selected to be transparent to the transmitted signal (e.g., with minimal or no effect or interference). The fluid grid 706 can be a separate component, such as a polyurethane coupled to the abrasive 205 in the window 702, or can comprise one or more layers including the abrasive 205, for example, a piece located at the conductive portion 310 or the object A polyester film sheet under the support portion or the sub-pad portion 320. Alternatively, fluid grid 706 can be disposed between the layers of abrasive 205 and disc 206, such as electrode 204 or other layers. In another alternative configuration, the fluid grid 706 can be disposed in a channel 708 that is aligned with the window 702 (with an inductor disposed therein). In the embodiments, the conductive portion 310 includes at least several layers, such as an upper layer 794 and a lower layer 792. The penetrating material 706 may be disposed in at least one layer including the conductive portion 310, as shown in FIG. Shown. It should be understood that other configurations of the electrically conductive abrasive, including the embodiments and other configurations described herein, can be designed to include a window. Conducting elements in the ground surface 42 1285576

In another aspect, the electrically conductive fibers and fillers described herein can be used to form distinct electrically conductive elements that are disposed in an abrasive material to form the electrically conductive abrasive 205 of the present invention. The abrasive material may be a conventional abrasive material or a conductive abrasive material, such as a conductive composition of conductive fibers or fillers placed in a polymer as described above. The surface of the conductive member may form a surface having an abrasive. The plane may extend over a plane of the surface of the abrasive. The electrically conductive element can extend over approximately 5 mm of the surface of the abrasive. Although the following illustrates the use of conductive elements having a particular configuration and configuration in the abrasive material, the present invention may also encompass individual conductive fibers and fillers, as well as materials made therefrom, such as fabrics, which may also be considered conductive. element. In addition, although not illustrated herein, the abrasive description described below may include an abrasive having the aforementioned perforations and groove patterns (illustrated in FIGS. 4 and 6). The conductive elements described are combined and are described in detail below.

8A to 8B are views showing an upper side of one of the embodiments of the abrasive article 8 and a schematic view of the wearing surface in which the conductive member is provided. The abrasive 800 generally includes a body 810 having an abrasive surface 82 for contacting the substrate during processing. The body 810 typically comprises at least a dielectric or polymeric material such as a dielectric polymeric material such as polyurethane. The abrasive surface 820 has one or more openings, grooves, trenches or dimples 83 formed therein to at least partially receive the conductive elements 84A. The conductive element 840 can generally be configured to have a coplanar contact surface 850 or extend over a plane defined by the abrasive surface 820 by a 43 1285576. The contact surface 850 is generally configured (e.g., provided with a flex, resilient, bendable or compressive plastic surface) to provide maximum electrical contact with the conductive member 840 when in contact with the substrate. The contact pressure used during the grinding can force the contact surface 850 into a position coplanar with the abrasive surface 820.

The body 810 is typically fabricated such that it can penetrate into the electrolyte through a plurality of perforations 860 formed therein. The abrasive 800 can have a perforation density that is between about 20% and 80% of the surface area of the abrasive 81 to provide sufficient electrolyte flow to aid in the dissolution of the uniform anode from the surface of the substrate.

The body 810 generally includes a dielectric material such as the conventional abrasive materials described above. The dimples 830 formed in the body 810 are generally configured to maintain the conductive element 840 during processing and thus can vary in shape and orientation. In the embodiment shown in FIG. 8A, the pits 830 are a plurality of "X" or intersections having a rectangular cross section (provided over the surface of the polishing object) and forming an interactive connection at the center of the abrasive 800. The groove of pattern 870 is again. Other cross-sections are also contemplated by the present invention, such as anti-trapezoidal and circular curved shapes, wherein the grooves can contact the surface of the substrate (as previously described). Alternatively, the dimples 830 (and the conductive elements 840 disposed therein) may be disposed at irregular intervals, or may be oriented in a radial, lateral, or vertical orientation, or may be linear, curved, concentric, or involute curves. Or other cross-section areas. 8C is a schematic view of a series of conductive elements 840 disposed radially above the body 810, each element 840 being physically or electrically separated by a spacer 875. The spacers 875 can be a portion of the dielectric abrasive 44 1285576 material or a dielectric interconnect for the components, such as a plastic interconnect. Alternatively, the spacer 875 can be a length of abrasive that lacks the abrasive material or conductive element 840 to avoid physical contact between the conductive elements 840. In the above described arrangement of the spacer elements, each of the conductive elements 840 can be individually connected to a power supply via a conductive path 890 (e.g., a metal line).

Referring again to Figures 8A and 8B, the conductive element 840 is typically disposed in the body 810 to form a primary resistance of one of the abrasives or a major surface resistance of about 20 Ω-cm or less. In one aspect of the abrasive, the abrasive has a resistance of about 2 Ω-cm or less. The conductive element 840 generally has mechanical properties that do not degrade under a sustained electric field and is resistant to degradation in an acidic or organic electrolyte. The conductive element 840 can be retained in the pockets 830 by mounting, clamping, bonding, or any other means.

In one embodiment, the conductive element 840 has sufficient flexure, elasticity, or bendability to maintain electrical contact between the contact surface 85 and the substrate during processing. Sufficient flexural, elastic or bendable material has a similar hardness of about or less than that of the abrasive element 840. For the polymer material, a conductive member 84 having a hardness similar to a hard hardness D of about 80 or less can also be used. A flexible material, such as a fibrous material that can be bent or bent, can also serve as the conductive member 84. The swallowing conductive element 840 can be more compliant than the abrasive material to avoid the high localized pressure caused by the conductive element 84 during grinding. Embedded in the embodiment shown in Figures 8B, the conductive member 84 is embedded in a polishing surface 81A placed on the component support or subpad 815. The 45 working 285576 hole 860 system passes through the grinding surface 810 and the object supporting portion 8 1 5 surrounding the conductive member 840. An example of the conductive member 840 includes a dielectric material coated with a conductive material or a conductive material mixed with a polymer material. Or conductive fibers, such as polymer based binders, are used to make the aforementioned conductive (and abrasion resistant) composites. The conductive element 840 can also include a conductive polymer material or other conductive material as previously described to improve electrical characteristics. For example, the conductive element comprises at least a composite of conductive epoxide and a coating comprising at least gold and carbon or graphite filler on the nylon fiber (such as coating about 0.1 μm of cobalt, copper or nickel on the nylon fiber, and Conductive fibers of about 2 μπι gold on nylon fibers, thereby improving the conductivity of the composites' and the foregoing are provided in the polyurethane body. Figure 8D is a schematic cross-sectional view of another embodiment of an abrasive 800 having a plurality of electrically conductive elements disposed therein. The conductive element 840 can generally be provided with a coplanar contact surface or extending in a plane defined by the abrasive surface 820. The conductive element 840 can include a conductive fabric 70 (as described above) and be placed, packaged, or wrapped around the conductive component 845. Or each conductive fiber and/or filler may be placed, packaged or wound on the conductive component 845. The conductive component 845 may include at least one metal, such as a precious metal as described above, or other conductive material suitable for use in an electrical polishing process. For example, the conductive element 8040 may also comprise a composite of the fabric and the aforementioned bonding material, wherein the fabric forms a contact portion of the conductive member 840, and the adhesive generally forms an inner support structure. The conductive element 840 can also include a hollow tube having a rectangular cross-sectional area wherein the tube wall 46 1285576 is formed of a hard conductive article 7 Ο 0 and a bond as described above. A connector 890 is used to couple the conductive element 840 to a power source (not shown) to electrically bias the conductive element 84A during processing. The connector 890 is typically a metal wire, tape or other process fluid compatible with the process fluid' or has a cover layer or a coating that protects the connector 890 from process liquids. The connector 890 can be coupled to the conductive element 840 by compression molding, soldering, stacking, brazing, clamping, crimping, riveting, securing, conductive bonding or otherwise. Examples of materials that can be used in connector 890 include insulated copper, graphite, chin, turn, gold, ingot, stainless steel, and HASTELOY® conductive materials and other suitable materials. The coating surrounding the connector 890 can include polymers such as fluorocarbons, polyvinyl chloride (PVC), and polyamidamine. In the embodiment shown in Fig. 8A, a connector 890 can be lightly attached to each of the conductive members 840 at the edge of the abrasive 800. Alternatively, the connectors 890 can be disposed through the body 810 of the abrasive goo. In another embodiment, the connector 890 can be coupled to a conductive grid (not shown) disposed in the receiving slot and/or electrically coupled to the conductive member 840 through the body 810. Figure 9A depicts another embodiment of an abrasive material 900. The abrasive material 900 includes a body 902 having one or more elements 904 disposed on an abrasive surface 906 and at least partially electrically conductive. The conductive member 904 generally includes a plurality of flexible members that are flexible or stretchable, and are adapted to simultaneously contact the surface of a substrate during the process, and the portion of the material to be discharged is less electrically conductive to the material. The coating is made of a piece of fiber such as a bend, or a fiber composed of a wire and a material of a wire. The fiber may also be solid or hollow in the natural state to reduce or increase the compliance or variability of the fiber. In the embodiment shown in Fig. 9A, the conductive elements 9〇4 are coupled to the conductive sub-element 91 of a susceptor 909; the conductive sub-element 913 includes the at least partially conductive fibers. An example of the secondary member 9A3 comprises a gold coated nylon or carbon fiber (as previously described). The pedestal 909 also includes a conductive material and is coupled to a connector 99A. The pedestal 909 can also be coated with a layer of electrically conductive material (e.g., copper) that can be decomposed by the polishing pad during polishing&apos; and is generally believed to extend the processing time of the electrically conductive fiber. The conductive element 904 is typically placed in a recess 908 formed in the abrasive surface 9〇6. The conductive element 9〇4 is oriented between 0 and 90 degrees with respect to the abrasive surface 9〇6. In these embodiments, the orientation of the conductive element 〇4 is perpendicular to the abrasive surface 906, and the conductive element 〇4 can be partially disposed on the abrasive surface 906. The recesses 908 have a lower mounting portion 91〇 and an upper gap portion 9 12 . The mounting portion 9 is configured to receive the base 909 of the conductive member 9〇4, and is mounted and clamped. The conductive element grinding surface 906 intersection portion 910 is maintained, adhesively or otherwise maintained to allow the guide to be ground without being provided at 904. The void portion 912 is provided at the pit 9〇8 and there. The void portion 912 is generally larger in cross-section than the mounting electrical component 904 can be bent while contacting a substrate while the substrate and the abrasive surface 906. Figure 9B depicts another embodiment of an abrasive 9 having a 48 1285576 conductive surface 940 and a plurality of discrete conductive elements 920 formed therein. The conductive element 902 includes at least a plurality of dielectric material fibers coated with a conductive material, which are disposed perpendicularly to the conductive surface 940 of the abrasive 205 and are horizontally disposed from each other. The conductive member 920 of the abrasive 9 is generally oriented at 0 to 90 degrees with respect to a conductive surface 940 and may be inclined to the direction of either pole with respect to a line orthogonal to the conductive surface 940. on. The conductive element 920 is formed over the length of the polishing pad (as shown in Figure 9B) or may be placed only in selected areas of the polishing pad. The contact height of the conductive member 920 on the abrasive surface can be approximately 5 mm. The material comprising the conductive element 92 0 has a diameter of between about 1 mil (thousandths of an inch) and about 10 mils. The height of the polishing surface and the diameter of the conductive member 92 0 can vary depending on the polishing process being performed. The conductive element 920 is sufficiently flexible or resilient to deform under contact pressure while maintaining electrical contact with a substrate surface to reduce or minimize scratches on the surface of the substrate. In the embodiment illustrated in Figures 9A and 9B, the surface of the substrate may only contact the conductive element 920 of the abrasive 205. The conductive member 920 is positioned to provide a uniform current density across the surface of the abrasive 2〇5. The conductive element 920 is adhered to the conductive surface by a non-conductive or dielectric material, a binder or a bonding agent. The non-conductive adhesive provides a dielectric coating to the conductive surface 940 to provide an electrochemical barrier layer between the conductive surface 940 and any surrounding electrolyte. The contact surface 940 can be a circular abrasive or a linear mesh or strip of abrasive 2〇5. A series of holes 49 I285576 holes (not shown) may be provided in the conductive surface 940 to provide electrolyte flow therebetween. Although not shown here, the conductive plate may be disposed on a support pad of a conventional abrasive material to position and process a rotating or linear polishing platform. The workpiece is described by a conductive member 10 A schematic perspective view of one embodiment of the abrasive 1〇〇G composed of 〇4. Each of the conductive elements 1004 generally includes a loop or ring 1 006 having a first end disposed within a recess 1012 formed in the abrasive surface 1024; a first end and a second end. Each of the electrically conductive elements 1004 can be coupled to a bonded electrically conductive element for forming a plurality of loops 1〇〇6 extending above the abrasive surface 1024. In the embodiment illustrated in Fig. 10A, each loop 1〇〇6 is made of a fiber coated with a conductive material, and by a system adhered to the pit 1012. The line bases 1〇14 are connected. An example of this loop 1〇〇6 is a nylon-coated nylon fiber. The contact height of the loop 1006 above the contact surface is between about 公5 gong to about 2 mm and the diameter of the material including the loop is about 1 mil (one thousandth Inches) to between about 5 mils. The tether base 1014 can be a conductive material such as titanium, copper, platinum or copper plated platinum. The susceptor base 1014 can also be plated with a layer of electrically conductive material, such as copper, which can be decomposed from the abrasive raft during grinding. The conductive material layer used on the susceptor base i 〇i 4 can be used as a sacrificial layer for decomposing the lower loop 1 〇〇 6 material or the susceptor base 101 4 material to extend the conductive element 1 〇〇 4 life. The conductive member 1 004 of the 50 1285576 or the like can be oriented to be clamped to an angle of 90 degrees with respect to an abrasive surface 1 〇 24 and can be inclined to the direction of either pole with respect to a line orthogonal to the conductive surface 1 〇 24 on. The conductive element 1〇〇4 is coupled to a power source by an electrical connector 1〇3〇. Fig. 10 is a schematic perspective view showing another embodiment of an abrasive 1 consisting of a conductive member 1?4. The conductive member 丨〇〇4 includes at least a single-wire coil 1〇〇5 of a metal wire composed of a fiber coated with a conductive material (as described above). The coil 1〇〇5 is coupled to a conductive component 1〇〇7 disposed on a susceptor 1014. The coil 1〇〇5 can surround the conductive component 1007, surround the base 1014, or adhere to the surface of the base 1〇14. The conductive strip may comprise at least one electrically conductive material, such as gold, and typically comprises a non-chemically reactive electrically conductive material, such as gold or platinum, and any electrolyte used in a polishing process. Alternatively, a sacrificial material layer 1 〇〇 9 (e.g., copper) may be disposed on the pedestal 1014. The sacrificial material layer 1009 is generally a material having a higher chemical reactivity than the conductive component 110, such as copper, whereby the chemically reactive material is preferentially removed during electro-grinding or during anodic decomposition of the polishing process (and The conductive component 1007 and the material of the coil 1〇〇5 can be coupled to a power source by an electrical connector 1030. A biasing member can be disposed between the conductive component and the body to provide a bias The conductive member is moved away from the body and contacts a surface of the substrate during polishing. An example of the biasing member 1 is shown in Figure B. However, the present invention also encompasses the conductive members described above, for example A biasing member can be used as shown in Figures 8A-8D, 9A, 10A-10D. The biasing member is formed of an elastic material 51 1285576 or a device and can be a compression spring or a flat spring. , a foamed polymer such as foamed polyglycolate (PO PORON 8 polymer), an elastomer, a bubble or other element or device that can force the component. The biasing member can also be a flexible or resilient material such as a flexible foam or a gas filled hose that can be used to bias the conductive element against the surface of the substrate during polishing. The biased conductive element has a plane with the surface of the abrasive or may extend above the surface of the abrasive. Figure 10C shows a volume diagram of another embodiment of an abrasive 100 having a plurality of electrically conductive elements 1004 having a radial pattern of center to edge of the substrate. The conductive elements are separated from each other by a combination of 15 degrees, 30 degrees, 45 degrees, 60 degrees, and 90 degrees. The conductive elements 1 004 are typically spaced apart to polish the substrate with a uniform current or power source. The conductive elements are spaced apart in one step to prevent contact with each other. A wedge portion 1004 of a dielectric of the body 1 026 can be constructed to electrically isolate the components 1004. A spacer or recessed region 1060 is also formed therein for spacing the conductive elements 1 〇〇 4 from each other. The conductive member is in the form of a loop as shown in Fig. 10A or a fiber extending as shown in Fig. 9B. Fig. 10D is a schematic perspective view showing an embodiment of the conductive member 1004 of Fig. 10A. The conductive element 1004 includes at least one of the woven mesh or fabric (as described above) having a first end 1008 of the abrasive surface 1024 disposed in the recess 1012, and a coil L, the conductive material, for example, the member may be formed by a flat profile to form a phase, or to provide a vertical interlacing guide that can be introduced into the abrasive conductive element abrasive 1004. Two ends 52 1285576 1010 to form - a continuous conductive surface for contacting the substrate. The woven net is a sergeant: a singer + + 丨, Μ · ·.

Above 1024, as shown in Figure 1. The conductive element 1〇〇4 can be coupled to a power source via a plurality of electrical connectors 1〇3 connected to the conductive base 1〇14. 1010, a first perspective view showing a partial schematic perspective view of another embodiment of forming the conductive element 1 004 having a body 丨〇 26 that can secure the conductive element to the abrasive. The channel 1〇5〇 is formed in the body 1024 of the abrasive to intersect the groove 1〇7〇 of the conductive member 1〇〇4. An insert 1055 is disposed in the channel 105A. The insert 1 〇 55 comprises a conductive material such as gold or the same material as the conductive element 1006. The connector 1〇3〇 can then be placed in the channel 1055 and brought into contact with the insert 1055. The connectors 1030 can be connected to a power source. The end of the conductive element loo# can be brought into contact with the insert 1055 for current to pass therethrough. The end 1075 of the conductive element 10Q4 and the connector 1〇3 are then secured to the conductive insert 1 055 by a dielectric insert 1〇6〇. The present invention also contemplates providing a channel of each of the loops 1006 of the conductive elements 1〇〇4 along the length of the conductive elements 1004, or a channel only on both ends of the conductive elements 1〇〇4. 11A-C are schematic side views showing the elastic properties of the loop or ring of the aforementioned series of conductive materials. The abrasive 1100 includes at least one spacer 1120 (formed in a groove or groove 1140). The polishing surface on the pad support portion 1130) is polished. A conductive element 42 comprising at least a dielectric material loop or 53 1285576 ring 1150 (which is coated with a conductive material) is placed on one of the recesses 11 70 and is in electrical contact with one of the recesses 110 Window 1145 is associated. The substrate 1160 is in contact with the abrasive 11〇〇 and moves relative to the surface of the abrasive 11〇〇. When the substrate contacts the conductive element η 42 , the loop ΐ 5 〇 is compressed into the recess 11 40 while maintaining electrical contact with the substrate 1160 (as shown in Figure 11). When the substrate is moved enough that the distance is no longer in contact with the conductive member 11 42 , the elastic loop 11 5 〇 returns to the uncompressed shape for additional processing, as shown in Figure 11C. A further example of a conductive polishing pad is described in U.S. Patent Application Serial No. 10/033,732, filed on Dec. Power Supply Application In the foregoing description, the power source can be coupled to the abrasive 205 by means of a connector or power transfer component. The power transfer component is disclosed in more detail in U.S. Patent Application Serial No. 10/033,732, filed on Dec. Returning now to the 11th-11th C chart, the power source can be coupled to the conductive element I1 40 by means of an electrical contact window 1145, the electrical contact window U 45 being disposed in the trench or recess 117 〇 (formed in a conductive plate or mounting portion in the polishing crucible. In the embodiment shown in Fig. 11A, the conductive member 11 40 is mounted on a metal plate (e.g., gold). The metal plate is mounted on a floor portion such as a disk 206. Alternatively, the electrical contact window may be disposed on a conductive pad and a polishing pad material between the pads of the material, for example, between the conductive component 804 and the body 8 10 (as shown in Figures 8 and 8). . The electrical contact windows are then coupled to a power source by wires (not shown) as shown in Figures 8A-8D.

Section 12A-1 2D is an upper and side schematic view of an embodiment of an abrasive having a plurality of extensions (not shown) coupled to a power source. The power supply can provide a current carrying capability 4, i.e., the anode biases a substrate surface for anodic decomposition in an ECMP process. The power source can be coupled to the abrasive by one or more conductive contact windows, wherein the contact windows are wound around the conductive polishing portion and/or the object support portion of the abrasive. One or more power sources may be coupled to the abrasive by the one or more contact windows to form different bias or currents on the surface portion of the substrate. Alternatively, one or more wires may be formed in the conductive polishing portion and/or the object support portion, and the wires are coupled to the power source.

Figure 12A is a top plan view of one embodiment of a conductive polishing pad coupled to a power source by a conductive connector. The conductive polishing portion may have a plurality of expansion portions (e.g., an abutment, a separate plug) formed on the conductive polishing portion 1210, and the conductive polishing portion has a width greater than the object supporting portion 1220. The extensions are coupled to a power source by a connector 1225 to provide current to the abrasive 205. In Fig. 12B, the expansion portion 1215 may be formed to extend parallel or laterally from the plane of the conductive polishing portion 1210 and extend beyond the diameter of the polishing support portion 1220. The pattern of the perforations and grooves is shown in Fig. 6. 12B is a schematic cross-sectional view of an embodiment of a connector 1225, 55 1285576. The connector 1 2 2 5 is coupled to a power source via a conductive path 1 2 3 2 (eg, a metal wire) (not shown) ). The connector includes an electrical connector 1234 that is coupled to the conductive path 1232 and electrically coupled to the conductive polishing portion 1210 of the extension 1215 by a conductive fixture 1230 (such as a screw). The bolt 123 8 can also be coupled to a conductive solid 1 2 3 0 for securing the conductive polishing portion 1210 therebetween. A plurality of spacers -1 2 3 6, such as washers, may be disposed between the conductive polishing portion 1210 and the fixture 1230 and the bolts 1238. The spacers 1 236 can comprise at least one electrically conductive material. The fixture 123, the electrical connector 1234, the spacers 1236, and the bolts 1238 can be made of a conductive material such as gold, metal, titanium, steel or steel. If a material (such as steel) reacts with the electrolyte used, the material may be coated with a material that is passive with the electrolyte, such as a turn. Although not illustrated herein, an alternative embodiment comprising the conductive fixture also includes a conductive clamp, a conductive adhesive tape or a conductive adhesive. Figure 12C is a cross-sectional view of an embodiment of a connector 1225 coupled to a power source (not shown) via a support portion ι 26 〇 (e.g., one of the platforms shown in Figure 2 or the upper surface of the disk 206) Figure. The connector 1225 includes at least one fixture 1240' such as a screw or bolt having a length sufficient to pass through the conductive polishing portion 121 of the expansion portion 1215 to couple the support portion 126. A spacer 1242 may be disposed between the conductive polishing portion 121A and the fixture 124A. The support is generally adapted to receive the fixture 12 40. Aperture 124 6 may be formed in the surface of the branch portion 126 to receive the fixture shown in Fig. 12C. Alternatively, an electrical connector can be recognized between the fixture 1240 and the conductive polishing portion 1210 by a fixture coupled to a support portion 126b. The support 56 1285576 P1260 can be connected to a power source by a conductive path 1232 (for example, a metal wire), or can be connected to a power supply provided on a grinding platform or a processing chamber, or integrated into a grinding platform or a processing chamber. An electrical connection is provided to the conductive polishing portion 121A. The conductive path 1232 can be integrated with or extended from the support portion 126 (as shown in Fig. 12B).

In a further embodiment, the fixture 124 can be an integrated extension of the support portion 126 (extending through the conductive polishing portion 1215 and secured by a bolt 1248, as shown in FIG. 121).

12E and 12F are side elevational and exploded perspective views of another embodiment of providing a power source to a polishing material 127, the polishing material 〇27 〇 having a power supply disposed between a polishing portion 1280 and an object support portion 1290. Coupler 1285. The abrasive portion 1280 can be made of a conductive abrasive material as previously described, or can include a plurality of the aforementioned conductive elements 1275. The conductive elements 1275 can be physically insulated from one another as shown in Figure 12F. The conductive element 127 5 formed in the abrasive surface is adapted to electrically contact the electrical connector 1285, such as by a conductive base of the component. The electrical connector 1285 can include at least one metal interconnecting component 1275, a plurality of interconnecting wires of the interconnecting component 1275, a plurality of wires connecting the individual connecting components 1275, or a connecting component 1275 to one or more metal sources. Wire mesh components within the wire mesh. The separate power supplies coupled to the individual wires and components can have different applied power sources, and the inline wires and components can provide a uniform power supply to the components. The power connector 1 285 can cover part or all of the diameter or width of the abrasive. The power source 57 1285576 connector 1285 in Figure 1 2F is an example of a wire mesh interconnecting component of the connecting component 1275. The electrical connector 1 285 can be connected to a power source by a conductive path 1 287 (such as a metal wire), or can be connected to a power source disposed outside a polishing platform or a processing chamber, or integrated into a grinding platform or processing chamber to provide Electrically connected to the conductive polishing portion 1 2 10 ° grinding element in the polishing surface

13A-B are top and cross-sectional views of another embodiment of the electrical conductor 1400. The conductive 1400 includes a plurality of abrasive features extending over one of the abrasive surfaces 1402 of one of the conductive members 1400. The abrasive feature can be abrasive particles (see Figure 3) or can be an insignificant abrasive element 1406 as shown in Figures 14A-B.

In one embodiment, the polishing element 1406 is a plurality of rods received in respective slots 1408 (formed in the abrasive surface 1402 of the conductive material 1400). The abrasive element 1406 generally extends from the abrasive surface 142 and is configured to remove a pure layer of the metal surface of the substrate being grounded to expose the underlying metal to the electrolyte and electrochemical activity for processing Increase the grinding rate during the period. The abrasive element 1406 is formed of a strong enough material such as ceramic, inorganic, organic or polymeric material to destroy the pure layer formed on the surface of the metal. An example is a rod or strip made of a conventional polishing pad (e.g., a polyurethane-based polishing pad provided on the conductive material 1 4 〇 。). In the embodiment illustrated in Figures 13A-B, the abrasive element 1406 can have a dryness D of at least about 30 degrees, or a hard enough to wear the passive layer of the abrasive material. In an embodiment 58 1285576, the abrasive element 1406 is harder than copper. The polymer particles can be solid or elastic to adjust the wear rate of the abrasive element 1406 (relative to the surrounding conductive portion 1404). The abrasive elements 1406 can be configured to be in a variety of geometries or randomly disposed on the abrasive surface 1402. In one embodiment, the polishing element 14 〇 6 is radially on the smear surface 1 4 0 2 , however, other directions such as a spiral, a grid, a parallel and a center or other directions may also be used.

In one embodiment, an elastic member 1 4 10 may also be disposed in each of the slots 1408 between the polishing element 1406 and the conductive portion 1404. The resilient member 1410 allows the abrasive member 1406 to be moved relative to the conductive portion 1404 to provide greater flexibility to the substrate to evenly remove the passive layer during milling. In addition, the flexibility of the elastic member 110 can be selected to adjust the pressure applied to the substrate by the abrasive member 1406 and the polishing surface 1402 of the conductive portion 1404, thereby balancing the removal rate of the passive layer. The passivation layer forms a rate such that the abrasive metal can be minimally exposed to the abrasive element 1406 to minimize possible scratches. Conductive spheres extending from the abrasive surface 14A-B are an upper and cross-sectional view of an alternative embodiment of an electrical conductor 1500. The conductive material 1500 includes a plurality of conductive rolling elements 1506 that extend from the abrasive surface 1502 of the upper portion 1504 of the conductive material 1500. During the grinding process, the rolling elements 1506 can be forced down the substrate to the same plane of the abrasive surface 152. The conductive scroll 59 1285576 embedded in the conductive material 150 can be coupled to an external power source (not shown) at a high voltage to polish the substrate at a high removal rate during the process. The conductive scroll 1506 can be fixed relative to the upper portion 1504 or can be freely rolled. The conductive rolling material 1 506 can be a sphere, a cylinder, a pin, an ellipsoid or other shape that does not scratch the substrate during the process.

In the embodiment illustrated in Figure 14B, the conductive rolling elements 15〇6 are a plurality of spheres disposed in one or more of the conductive carriers 1520. Each of the conductive carriers 152 is disposed in a slot 1 508 formed in the abrasive surface 152 of the conductive member 15''. The electrically conductive rolling elements 156 are generally extended from the abrasive surface and are configured to provide electrical contact with the metal surface of the substrate. The conductive rolling material 156 may be formed of any conductive material or may be formed of a core portion 1522 of the conductive cover layer 1 525 by at least a portion thereof. In the embodiment illustrated in Figure 14B, the electrically conductive rolling material 1506 has a polymer core 1 522 that is at least partially coated with a flexible electrically conductive material 1 524. An example is a TORLONtm polymer core coated with a conductive gold layer (with copper as the seed layer between TORLONTM and the gold layer). In one embodiment, the polymer core 1 522 can be selected from an elastomeric material, such as polyurethane, which deforms as the rolling material 1 506 contacts the substrate during grinding. When the rolling object 1506 is deformed, the contact area between the rolling object 1506 and the substrate increases, so that the current flow between the rolling object 1 506 and the conductive layer can be improved, thereby improving the grinding result. The conductive rolling elements 1506 can be configured in different shapes or randomly configured on the polishing surface. In one embodiment, the conductive rolling material 1 5 06 may be radially disposed on the grinding surface 1 502 of 60 1285576, however, other directions such as a spiral, a grid, a parallel and a center or other directions may also be used. In the embodiment shown in FIG. 14B, an elastic component 丨5丨〇 may be disposed in each of the slots 1 508 between the conductive carrier 1520 and the conductive portion 15〇4. The elastic component 15 10 can move the conductive rolling materials 1 506 (and the carrier 1 520) relative to the conductive portion 1 504 to provide better flexibility to the substrate for more uniform electrical properties during grinding. contact. A contact window (not shown) may also be formed in the foregoing conductive material 1500 (refer to FIG. 7F) to facilitate process control 0. Conductive material having an insertion pad

Figure 15 is a cross-sectional view of another embodiment of a conductive material 16". The conductive material 1600 generally includes a conductive portion 1602 adapted to contact a substrate during polishing, an object supporting portion 16〇4, and an insertion pad 1606 sandwiched between the conductive portion 16〇2 and the object supporting portion 1604. The conductive portion 1602 and the object support portion 16 04 can be configured similarly to any of the foregoing embodiments or their equivalents. The bonding layer 608 can be disposed on each side of the insertion pad 1606 to couple the insertion pad 1606 to the object supporting portion 1604 and the conductive portion 1602. The conductive portion 1602, the object supporting portion 1604, and the insertion pad 1606 can be By means of several alternatives, the components of the conductive material 1600 can be more easily replaced with a single unit after the end of its useful life, simplifying the replacement, inventory and order management of the conductive material 160. Alternatively, the support portion 1604 can be coupled to an electrode 204 and replaced with the conductive material 1600 to form a single unit. The conductive material 61 1285576 1 6 00 (optionally including the electrode 2〇4) may also include a contact window formed therebetween as shown in the aforementioned Fig. 7F.

The insert pad 1606 is generally harder than the abrasive support portion 1604 and is rigid or harder than the conductive portion 1602. The present invention also contemplates that the insert pad 16 06 can be softer than the conductive portion 16 02 . The hardness of the insertion pad 1606 is selected to provide rigidity to the conductive material 1 600, so that the mechanical life of the conductive portion 1602 and the object supporting portion 1604 can be extended, and the wettability of the conductive material 1 600 can be improved, resulting in grinding. The surface has a higher level of flatness. In one embodiment, the insertion pad 1606 has a hardness less than or equal to a d-type hardness d value of about 80, and the object supporting portion 1604 has a hardness less than or equal to the 硬度-type hardness a value of about 80, and the conductive portion 1602 Has a hardness less than or equal to the D hardness of the crucible D of about 100. In another embodiment, the insertion pad 1606 has a thickness of less than or equal to 35 mils while the article support 1604 has a thickness less than or equal to about 100 mils.

The insertion pad 1606 can be fabricated from a dielectric material such that an electrical path can be established through the interlayer, and the laminate includes at least the conductive material 1600 (ie, the conductive portion 1602, the insertion pad 1606, and the object support portion) Stack of 16〇4). The electrical path allows the conductive material 1600 to be immersed or covered by a conductive fluid (e.g., an electrolyte). To facilitate establishing an electrical path through the electrical conductor 1600, the insertion pad 1606 can be at least one permeable or permeable property to allow electrolyte to flow therethrough. In one embodiment, the insert pad 1606 is made of a dielectric material (compatible with the electrolyte and electrochemical processes). The so-called compatible materials include polymeric 62 1285576 materials such as polyurethanes, polyesters, polyester films, ethylene oxide and polycarbonate fibers and the like. Alternatively, a conductive backing 1610 can be disposed between the insertion pad 1606 and the conductive portion 1602. The conductive backing 1610 is generally equal to the potential throughout the conductive portion 1602 to enhance polishing uniformity. Having the same potential on the polished surface of the conductive portion 16〇2 ensures good electrical contact between the conductive portion 16〇2 and the ground conductive material, especially when the conductive material is a residual material and is no longer a continuous layer. Time (ie, the separation island of the residual film). In addition, the conductive backing 1610 can provide mechanical strength of the conductive portion 16〇2 to increase the service life of the conductive material 1600. The use of the conductive backing 161 有 is of great benefit to the embodiments (e.g., by a mechanical integrator having a resistance of the conductive portion of greater than about 50,000 m-ohms and enhancing the conductive portion 1602). The conductive backing 1610 can also be used to increase the electrical conductivity uniformity and reduce the electrical resistance of the conductive portion 1602. The conductive back 1610 can be made of a metal crucible, a metal screen, a metal coated web or a non-woven fabric, and other suitable conductive metals that are compatible with the polishing process. In one embodiment, the conductive backing 丨 61 is embossed to the conductive portion 1602. The backing 1610 is configured to not affect the flow of electrolyte between the conductive portion 1 604 and the insertion pad 1 606. The conductive portion 丨6〇2 can be mounted to the conductive backing 1161 through a stamper, lamination, injection molding, and other suitable means. Figure 16 is a cross-sectional view of another embodiment of a conductive material 17?0. The conductive material 1700 generally includes a conductive portion 1602 that is adapted to contact a substrate during polishing; a conductive backing 1610; an object support portion 16A4 and an insert 63 1285576 塾 1706' sandwiched by a sandwich The conductive portion 16〇2 and the object supporting portion 1604 have a structure similar to the conductive material 16〇〇 described above. In the embodiment shown in Fig. 16, the insertion pad 17〇6 is made of a material having a plurality of cells 1708. The cells 1 708 are typically filled with air or other fluids and provide flexibility and flexibility to enhance the process. The nests may be open or closed in a size ranging from 0.1 micron to a few millimeters, such as between 1 micrometer and 1 millimeter. Other dimensions suitable for insertion of pad 1706 are also contemplated by the present invention. The insert pad 17A can be at least permeable or permeable to allow electrolyte to flow therethrough. The insertion pad 17 06 can be made of a dielectric material that is compatible with the electrolyte and electrochemical processes. Suitable materials include, but are not limited to, foamed polymers such as foamed polyurethanes and polyester films. The insertion pad 17〇6 generally has a compressibility of the upper support portion or the sub-pad 1604, and is more locally deformed when subjected to pressure. Figure 17 is a cross-sectional view of another embodiment of a conductive material 1800. The conductive material 1800 includes a conductive portion 18〇2 coupled to an object support portion 18〇4. Alternatively, the conductive material 1800 may include an insertion pad and a conductive backing (both not shown) disposed between the conductive portion is 〇2 and the object support portion 1804. The conductive material 1800 generally includes a plurality of through holes 18 〇 6 so that an electrolyte or other process fluid can pass between the polished surface 1 808 above the conductive portion 18 02 and the mounting surface under the object support portion 1 804 . The edge 1812 defined by the intersection of each of the apertures 1806 and the upper abrading surface 1808 is 1285576 - rim to eliminate any sharp corners, burrs or surfaces of the substrate. The contours of the edge 1812 may include spokes, grooves, cones, or other structures that may slid the edge 1812 and cause the trace to be minimized. In such embodiments where the conductive portion 1 802 is at least partially formed of a polymer, smoothing the edge 1812 can be accomplished by forming the aperture 1 806 prior to complete curing of the polymer. Thus, the edges 1812 will become rounded as the conductive portion 18〇2 contracts during the remaining polymer ring cure. In addition, or in the alternative, the edges 1812 can be rounded by applying at least one of heat or pressure during or after curing. In one example, the edges 1812 can be polished, heated, or flame treated to round the transition between the abrasive surface 1808 and the aperture 1806 at the edge 1812. In another example, a polymeric conductive portion 1802 can be made of a moldable material that is repelled by a mold or steel mold. The repulsive nature of the polymer conductive portion 18〇2 can form a surface tension such that the stamped stress applied to the polymer conductive portion 18〇2 can move the material away from the mold, thereby making the apertures 丨8 〇6 The edge 1 8 1 2 is rounded when cured. The apertures 1806 can be formed through the conductor 18 前 before or after assembly. In one embodiment, the aperture 18 〇 6 includes a first hole 1814 formed in the conductive portion 丨 8 〇 2 and a second hole 1 8 16 formed in the object support portion 1804. In such embodiments including an insert pad, the second aperture 1 8 16 is formed therein. Alternatively, at least a portion of the first hole 丨 8 丨 4 and the second hole 1 8 1 6 65 1285 576 may be formed in the conductive portion 1 802. The first hole 1814 has a diameter larger than the second hole 1816. The smaller diameter of the second hole 1 8 16 under the first hole 1814 can provide lateral support of the conductive portion 1 802 around the first hole i 8 i 4 , thereby improving the pad shear and torque during grinding. Resistance. Therefore, the aperture 丨8 〇6 including the larger hole at the surface 1 808 (which is concentric with the smaller hole below) causes the conductive portion ι 8 02 to have less deformation while minimizing the particle Forming, therefore, also minimizes substrate defects caused by pad damage. The pore sizes in the conductors can be formed by mechanical drilling (e.g., male/femal punching before or after all layers are combined). In one embodiment, the stamper of the conductive portion 1 802 on the conductive backing is first mounted on the interposer, and the conductive portion 18〇2 and the interposer having the conductive backing are mechanically perforated together. Or the secondary pads are mechanically perforated and calibrated together after perforation. In another embodiment, all layers are placed together for perforation. The invention also encompasses any other perforation technique and sequence. Thus various embodiments of electrical conductors suitable for electrochemical polishing of substrates are presented above. The conductive material provides good compliance to the surface of the substrate to promote uniform electrical contact to enhance the abrasive surface. In addition, the conductive material is configured to minimize scratches during the process, effectively reducing defect generation and reducing process cost. While the foregoing is a description of various embodiments of the present invention, the invention may be construed as the scope of the invention and the scope of the invention. 66 1285576 [Simultaneous Description of the Drawings] The foregoing description of the present invention can be readily appreciated by way of illustration, the description of which The way to get a more detailed description.

It is to be understood, however, that the invention is not limited by the scope of the invention 1 is a plan view showing an embodiment of a processing apparatus of the present invention; FIG. 2 is a cross-sectional view showing an embodiment of an ECMP station; FIG. 3 is a partial cross-sectional view showing an embodiment of the abrasive; A top plan view of an embodiment of a grooved abrasive; FIG. 5 is a top plan view of another embodiment of the grooved abrasive; FIG. 6 is a further embodiment of the grooved abrasive Upper plan

Figure 7A is a plan view of one of the conductive fabrics or fabrics described herein; Figures 7B and 7C are partial cross-sectional views of the abrasive having an abrasive surface, wherein the abrasive surface comprises at least one electrically conductive fabric or fabric; Figure 1 is a partial cross-sectional view of an embodiment of an abrasive comprising a metal foil; Figure 7E is another embodiment of an abrasive comprising at least one fabric material; 67 1285576 Figure 7F shows a window having a window Another embodiment of the abrasive; the 8A and 8B drawings are respectively an embodiment of a polishing object having a conductive member and a schematic cross-sectional view; and the 8C and 8D drawings respectively have a conductive member. An upper and a cross-sectional view of one embodiment of the abrasive;

9A and 9B are perspective views of another embodiment of an abrasive having a conductive member; FIG. 10A is a partial perspective view of another embodiment of an abrasive; FIG. 10B is another embodiment of an abrasive. FIG. 10C is a partial perspective view of another embodiment of an abrasive; FIG. 10D is a partial perspective view of another embodiment of an abrasive; FIG. 10E is another embodiment of an abrasive. Portion 11 A-11C is a schematic side view of an embodiment of a substrate in contact with an embodiment of the abrasive described herein;

12A-1 2D is an upper and side schematic view of an embodiment of an abrasive having a plurality of extensions connected to a power source; and FIGS. 13A-B are another embodiment of an electrical conductor. Figure 14A-B is an upper and cross-sectional view of another embodiment of a conductive material; Figures 15 - 17 are cross-sectional views of an alternative embodiment of a conductive material; Figure 18 is a cross-sectional view of an alternative embodiment of a conductive material; A plan view of one embodiment of an electrode. For ease of understanding, the same reference numerals are used in the various figures for the reference 68 1285576. The same components are shown. [Main component symbol description] 100 Processing device 102 Electrochemical mechanical polishing station 104 Metric device 106 Grinding station 108 Base 110 Transfer station 112 Turret 114 Substrate 116 Loading arm 118 Substrate storage 匣 120 Factory interface 122 Cleaning module 124 Transport buffer station 126 Output buffer station 128 Loading cup assembly 130 Grinding head 132 Transfer robot 134 Hole 138 Arm 140 Control 142 CPU 144 Memory 146 Support Circuit 150 Power Supply 202 Reel 204 Electrode 205 Abrasive 206 Disc 210 Bottom 212 Shaft 214 Drainage Channel 216 Hole 218 Seal 220 Electrolyte 222 Channel 224 Motor 232 Volume 233 Container 234 Hole 240 Transmitter 242 pump 244 supply tube

69 1285576 252 Central portion 254 Skirt 258 Recess 270 Nozzle 272 Fluid delivery system 3 10 Abrasive surface 320 Bottom pad portion 350 Perforation 360 Abrasive particles 370 Upper abrading surface 440 Circular pad 442 Groove 446 Perforation 448 Abrasive surface 540 Abrasive pad 542 Groove Slot 544 Abrasive pad 546 Perforation 548 Abrasive 550 Inner diameter 640 Abrasive 642 Groove 644 Grinding m Pad 645 Groove 646 Perforation 648 Abrasive 650 Outer diameter 700 Fabric 710 Interwoven fabric 720 Vertical orientation 730 Horizontal orientation 740 Channel 750 Perforated 780 Metal Foil 790 Conductive Bond 792 Lower Layer 794 Upper Layer 796 Abrasive Surface 798 Fabric 800 Abrasive 810 Body 815 Sub Pad 820 Abrasive Surface 830 Pit 840 Conductive Element 845 Conductive Assembly 850 Contact Surface 860 Perforation

70 1285576 870 cross pattern 900 abrasive material 904 conductive element 9 0 8 pit 9 1 0 mounting portion 9 1 3 conductive sub-element 940 conductive surface 1004 conductive element 1006 loop 1 008 first end 1010 second end 1 0 1 4 Wire Base 1024 Abrasive Surface 1030 Connector 1 05 5 Channel I 070 Groove 1100 Abrasive II 2 0 Sub Pad 1140 Groove 1145 Electrical Contact Window 1155 Series Base 1170 Groove 1 2 1 5 Expansion 1 225 Connector 875 Pitch 902 body 906 grinding surface 909 pedestal 9 1 2 void portion 920 _ conductive element 1000 abrasive 1005 coil 1007 conductive assembly 1009 second end 1 0 1 2 pit I 0 1 8 biasing member 1026 body 1050 channel 1060 insertion Piece 1075 End 1110 Abrasive Surface II 3 0 Pad Support 1142 Conductive Element 1150 Loop 1160 Substrate 1210 Conductive Polishing 1220 Grinding Support 1230 Conductive Fixture

71 1285576 1 2 3 2 Conductive path 1 2 3 6 Pitch 1240 Fixture 1270 Abrasive 1 2 8 0 Grinding part 1 2 8 7 Conductive path 1400 Conductive 1404 Conductive part _ 1408 Slot 1 500 Conductor 1504 Upper part 1 5 1 0 elastic component 1 5 2 2 core 1600 conductive 1604 support 1 608 adhesive layer 1 700 conductive 1 708 cell 1 804 object support 1 8 1 2 edge 1 8 1 6 second hole 1904 common center area 1 9 1 0 power supply 1234 electrical connector 1238 bolt 1260 support 1275 conductive element 1285 electrical connector 1290 object support 1402 grinding surface 1406 grinding element 1 4 1 0 elastic element 1 502 grinding surface 1 506 rolling material 1 520 conductive carrier 1 524 soft conductive material 1602 conductive portion 1606 insertion pad 1 6 1 0 conductive backing 1706 insertion pad 1 8 0 0 conductive material 1 806 aperture 1 8 1 4 first hole 1902 common center area 1906 common center area

Claims (1)

1285576 Patent application: 1. An abrasive for treating a substrate, comprising at least: a fabric layer; and a conductive layer disposed on the fabric and having an exposed surface for grinding a substrate . 2. The abrasive article of claim 1, wherein the fabric is further a woven material. 3. The abrasive article of claim 2, wherein the woven material is coated with a soft conductive material or at least one made of a soft conductive material. 4. The abrasive article of claim 3, wherein the soft conductive material is composed of gold, tin, palladium, tin-tin alloy, start, ship and metal alloy, and copper-like soft ceramic composite. Selected from the group. 5. The abrasive article of claim 1, wherein the fabric further comprises a non-woven material. 6. The abrasive article of claim 1, wherein the conductive layer further comprises: 73 1285576 soft metal, which is composed of gold, tin, bismuth-tin alloy, turn-over, metal alloy, and Copper is at least one selected from the group consisting of soft ceramic composites. 7. The abrasive article of claim 1, wherein the conductive layer further comprises at least a modulus and a hardness less than the modulus and hardness of the copper. The abrasive article of claim 1, wherein the exposed surface of the conductive layer has a flatness of less than or equal to about plus or minus 1 mm and a surface roughness of less than about 500 microns. 9. The abrasive article of claim 1, wherein the electrically conductive layer further comprises: a plurality of abrasive particles disposed therein. 10. The abrasive article of claim 1, wherein the conductive layer further comprises: a raised upper surface. 11. The abrasive article of claim 1, wherein the electrically conductive layer further comprises: a plurality of perforations therethrough. 74 1285576 12. The abrasive article of claim 1, further comprising: a window through which the conductive layer and the fabric layer are passed. The abrasive article of claim 12, wherein the window further comprises: a transparent material disposed in at least one of the conductive layer or the fabric layer. 14. The abrasive article of claim 1, further comprising: a support layer made of a dielectric material having a hardness less than the hardness of the conductive layer; and an intervening layer coupled Connected between the support layer and the conductive layer, the hardness of the insert layer is greater than the hardness of the support layer. The abrasive according to claim 14, wherein the insert layer has a hardness of less than or equal to about 80 箫 hardness D; wherein the conductive layer has a hardness of less than about 80 deg" hardness D And wherein the jar support layer has a hardness less than or equal to about 80 箫 hardness A. 16. The abrasive article of claim 14, wherein the insert layer further comprises at least one polymeric material. 17. The abrasive article of claim 1, further comprising: 75 1285576 a conductive backing coupled to the woven fabric opposite the conductive layer. The at least one electrode is coupled to the fabric layer of the conductive layer. The abrasive article of claim 18, wherein the at least one of: the plurality of electrodes can be independently electrically biased. The area of pressure. The abrasive according to claim 1, further comprising at least a plurality of spheres extending partially over the storm of the conductive layer; and a soft conductive material at least partially covering the The abrasive article of claim 20, wherein at least one of the particles has a polymer core. 22. The abrasive article of claim 1, wherein the guide comprises at least: a polymer matrix having an electrical material disposed thereon. 2 3. The abrasive article of claim 22, wherein the layer is the layer. Contains: 〇 Electrode more Contains: Dew surface body. Sphere The electrical layer is more conductive. The conductive material 76 1285576 is selected from the group consisting of gold, tin, palladium, palladium, tin alloy, platinum, lead and metal alloys, and a ceramic composite which is softer than copper. 24. The abrasive article of claim 22, wherein the electrically conductive material is tin particles, and wherein the fabric layer further comprises: a copper clad fabric. _ The abrasive according to claim 22, wherein the hardness and modulus of the conductive material are less than or equal to the hardness and modulus of the steel. 26. The abrasive article of claim 22, wherein the electrically conductive material comprises at least: a plurality of electrically conductive particles comprising at least one of gold, tin, handle, tin-tin alloy, turn and lead. 27. The abrasive article of claim 22, wherein the electrically conductive material further comprises: a carbon based material. The abrasive article according to claim 22, wherein the conductive material is at least one of the following: conductive particles, carbon powder, carbon fiber, carbon nanotube, carbon nano foam, carbon Carbon aerogel, graphite, conductive fiber, polymer that is electrically conductive, dielectric material or conductive particles coated with conductive material 77 1285576, dielectric filler material coated with conductive material, conductive inorganic particles, metal Particles, conductive ceramic particles and compositions thereof 29. An abrasive for treating a substrate, comprising at least: a conductive layer having a polishing surface suitable for polishing a substrate; The layer 'made by a dielectric material having a hardness less than the hardness of the conductive layer; an intervening layer spliced between the support layer and the conductive layer, and the hardness of the intercalation layer is greater than the support layer Hardness; and a plurality of apertures penetrating through the conductive layer, the interposer layer, and the object support layer, at least one of the apertures having a first hole formed in a surface of the conductive layer and a lower layer formed thereon First Holes, wherein the first bore hole having a diameter larger than the second hole. The abrasive according to claim 29, wherein the conductive layer further comprises: an abrasive layer suitable for polishing a substrate thereon, and the polishing layer comprises at least one polymer A conductive material in the bonding agent. The abrasive according to claim 30, further comprising: a plurality of abrasive particles disposed in the polymer binder. 32. The abrasive article of claim 30, wherein the conductive layer 78 1285576 comprises at least: a fabric layer disposed below the abrasive layer. 3. The abrasive article of claim 29, further comprising: an electrode having a plurality of independently biasable regions. The abrasive article of claim 33, wherein the conductive layer, the support layer and the electrode are formed in a single piece replaceable component. 35. For processing a substrate An abrasive comprising at least: a conductive layer having a surface suitable for polishing a substrate; a support layer made of a dielectric material having a hardness less than a hardness of the conductive layer; a layer coupled between the support layer and the conductive layer, and the hardness of the insert layer is greater than the hardness of the support layer; an electrode coupled to the support layer opposite the insert layer; a window penetrating the electrode, the conductive layer, the interposer layer and the object support layer, wherein the electrode, the conductive layer, the interposer layer and the object support layer form a single replaceable unit. 36. The abrasive article of claim 35, further comprising: 79 1285576 a plurality of apertures penetrating through at least one of the conductive layer, the insertion layer, and the support layer, and the like At least one of the apertures has a first hole formed in the conductive layer, a second hole formed in the insertion layer, and a third hole formed in the object support layer, wherein the diameter of the first hole Greater than the diameter of the second hole. 37. The article of claim 36, wherein the electrode further comprises: a plurality of regions that are independently electrically biasable. The abrasive according to claim 36, wherein the conductive layer further comprises: a first layer disposed on the support layer; and a second layer including at least a conductive material in a polymer matrix, and the second layer is disposed on the first layer. 3. The abrasive according to claim 38, wherein the conductive material is composed of gold, tin, bismuth, tin-tin alloy, foreign metal alloy, and copper-soft ceramic composite. Selected from the group. 80