1281218 A7 _ B7 _ 五、發明說明（/ ) [技術領域] 本發明，係關於接合裝置中所使用之轉換器，及包含 該轉換器所構成之接合裝置。 [習知技術] 打線裝置等之接合裝置中，使用超音波放大器等之轉 換器，一邊藉由振動器之動作使轉換器振動於其長邊方向( 軸心方向）’ 一邊使其_端所安裝之工具朝處理對象下降以 施加載重，據以對接合部賦予載重與超音波來進行接合。 此種轉換器之習知支撐構造，例如，於接合裝置中係 如圖10所示之構造。作爲轉換器之超音波放大器 (hora)151之前端部，安裝有作爲插通引線（未圖示）之工具 的爸細_管166，此外，於基端部固定有超音波振動器1〇9。 超音波放大器151，於作爲其長邊方向之軸心方向壓縮波( 縱波)所賦予之超音波振動之波節（變形最大的部分），設有 一圓筒形、於其前端與超音波放大器151接觸之凸緣部 154。凸緣部154係連接於圓筒狀之放大器支撐部155，放 大器支撐部155固定於保持具156，保持具156則固定於 支軸157。支軸157，係直接或透過揚升臂旋轉自如的支承 於未圖示之接合頭。又，作爲此種打線裝置，例如日本專 利特開平5-347334號公報、特開平6-196532號公報、特 開平10-303240號公報中皆有揭示。 此種習知技術，由於凸緣部154係設於超音波放大器 151之超音波振動之波節，因此經由此凸緣部154之能量 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公S ) (請先閱讀背面之注意事項再填寫本頁)1281218 A7 _ B7 _ V. DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a converter used in a bonding apparatus, and a bonding apparatus including the converter. [Conventional Technology] In a bonding device such as a wire bonding device, a converter such as an ultrasonic amplifier is used, and the converter is vibrated in the longitudinal direction (axial direction) by the operation of the vibrator. The mounted tool is lowered toward the processing target to apply a load, and the load is applied to the joint portion to superimpose the ultrasonic wave. A conventional support structure for such a converter, for example, is constructed as shown in Fig. 10 in the joint device. As the front end portion of the ultrasonic amplifier (hora) 151 of the converter, a daddy tube 166 as a tool for inserting a lead wire (not shown) is attached, and an ultrasonic vibrator 1〇9 is fixed to the base end portion. . The ultrasonic amplifier 151 is provided with a cylindrical shape at its front end and an ultrasonic amplifier 151 in a node (the portion where the deformation is the largest) of the ultrasonic vibration given by the compression wave (longitudinal wave) in the axial direction of the longitudinal direction. Contact the flange portion 154. The flange portion 154 is connected to the cylindrical amplifier supporting portion 155, the amplifier supporting portion 155 is fixed to the holder 156, and the holder 156 is fixed to the support shaft 157. The support shaft 157 is rotatably supported by a joint head (not shown) directly or through a lift arm. Further, as such a wire splicing device, for example, Japanese Laid-Open Patent Publication No. Hei 5-347334, No. Hei. In the prior art, since the flange portion 154 is attached to the ultrasonic vibration of the ultrasonic amplifier 151, the energy of the flange portion 154 is applied to the Chinese National Standard (CNS) A4 specification (210 X). 297 s S) (Please read the notes on the back and fill out this page)
C I H 一 I n ii ill i 線丨 A7 1281218 五、發明說明（> ) 損失（所謂之漏洩）少，其結果，能防止接合結束後因持續 受到不需之超音波能量的施加所導致之球體破壞之不良形 狀、球體之剝離、底層損傷等。 然而’隨者接合裝置動作的高速化，轉換器上下動作 時之搖動成爲一問題。此點，於上述習知技術中，由於作 爲轉換器之超苜波放大器1 5 1僅以1點加以支撐，因此欲 有效的抑制隨著接合頭動作所產生之轉換器搖動，是非常 困難的。當產生此動時，於接合中球體即會承受額外的力 量，而發生球體之壓漬形狀之不良情形。此問題，就半導 體裝置之間距精密化而變小之壓接球體直徑而言，特別的 顯著。 爲處理此上下動作時轉換器之搖動，申請人提出了一 種如圖11所示，透過不同於作爲轉換器之超音波放大器 201的其他構件而成之2個放大器支撐構件2〇5，將超音波 放大器201安裝於保持具206，且能調整放大器支撐得件 205在超音波放大器201之軸心方向安裝位置的構成（日本 專利特開平2001-24025號公報）。根據此構成，因支撐點 變成2處，故能有效防止上下動時之搖動，又，藉由使放 大器支撐構件205對超音波放大器2〇1之安裝位置，與超 音波放大器201之振動之波節一致’亦能防止軸心方向之 超音波振動(壓縮波)之損失。 [發明欲解決之課題] 然而，由於放大器支撐構件（圖11之例中，係放大器 4 ---— — 本纸張尺度適用中國國家標車（CNS)A4規格（210 x 297公楚） (請先閱讀背面之注意事項再填寫本頁) 訂*丨 線 1281218 五、發明說明（巧） 支撐構件205)與超音波放大器連接之區域，於超音波放大 器之長邊方向越大（厚），該區域中偏離振動波節之部分就 越大，因此會增加此部分之能量損失。亦即，爲減少經過 放大器支撐構件之能量損失，最好是將放大器支撐構件形 成爲於超音波放大器之軸心方向盡量薄的構造。然而，若 放大器支撐構件變薄，放大器支撐構件之強度卻也會跟著 降低。 又，如圖10之習知例，在以1處支撐超音波放大器 151之構成中，將圓筒形之凸緣部154形成爲一方開口之 圓筒形的切削加工非常煩雜，且超音波放大器151之小型 化亦困難，又，如圖11之習知例般，若爲使用不同於超音 波放大器201之2個放大器支撐構件105之構成，則有構 件數增加且裝配煩雜之缺點。 因此，本發明之目的，在於提供一種轉換器，其不僅 能對轉換器之支撐構件賦予強度，亦能盡可能的使支撐構 件於轉換器之軸心方向形成的較薄。 [用以解決課題之手段] 爲解決上述課題，本案第1發明之轉換器，係利用振 動器之動作而振動，其特徵在於，具備：設置在包含該轉 換器本體之振動之波節的至少2處的保持部；將前述各保 持部與前述轉換器本體側之連接處不同的地方互相連結的 連結部；前述轉換器本體、前述保持部及前述連結部由同 一構件形成爲一體。 (請先閱讀背面之注意事項再填寫本頁)CIH-I n ii ill i 丨 A7 1281218 V. Description of the invention (>) The loss (so-called leakage) is small, and as a result, it is possible to prevent the sphere from being continuously subjected to the application of unnecessary ultrasonic energy after the end of the joint. Defective shape of the damage, peeling of the sphere, damage to the underlayer, and the like. However, the speed of the operation of the splicing device becomes a problem when the converter is moved up and down. In this regard, in the above-described prior art, since the super chopper amplifier 15 1 as a converter is supported only by one point, it is extremely difficult to effectively suppress the converter from being shaken by the action of the bonding head. . When this motion occurs, the sphere will be subjected to additional force during the engagement, and the spherical shape of the sphere will be inferior. This problem is particularly remarkable in terms of the diameter of the crimping sphere which is smaller in precision between the semiconductor devices. In order to handle the shaking of the converter when the up and down motion is applied, the applicant proposes a two-amplifier supporting member 2〇5 which is formed by using other components different from the ultrasonic amplifier 201 as a converter as shown in FIG. The sound wave amplifier 201 is attached to the holder 206, and can adjust the mounting position of the amplifier supporting member 205 in the axial direction of the ultrasonic amplifier 201 (Japanese Patent Laid-Open Publication No. 2001-24025). According to this configuration, since the support point becomes two, it is possible to effectively prevent the shaking during the up and down movement, and the vibration of the ultrasonic amplifier 201 by the position where the amplifier supporting member 205 is attached to the ultrasonic amplifier 2〇1. The same section 'can also prevent the loss of ultrasonic vibration (compression wave) in the axial direction. [The subject to be solved by the invention] However, due to the amplifier supporting member (in the example of Fig. 11, the amplifier 4 --- - this paper scale applies to the China National Standard Vehicle (CNS) A4 specification (210 x 297 public Chu) ( Please read the precautions on the back and fill out this page.) *丨线1281218 V. Invention Description (Smart) The area where the support member 205) is connected to the ultrasonic amplifier is larger (thick) in the longitudinal direction of the ultrasonic amplifier. The larger the portion of the region that deviates from the vibration node, the greater the energy loss of this portion. That is, in order to reduce the energy loss through the amplifier supporting member, it is preferable to form the amplifier supporting member to be as thin as possible in the axial direction of the ultrasonic amplifier. However, if the amplifier support member is thinned, the strength of the amplifier support member will also decrease. Further, as in the conventional example of FIG. 10, in the configuration in which the ultrasonic amplifier 151 is supported at one place, the cylindrical shape in which the cylindrical flange portion 154 is formed as one opening is very complicated, and the ultrasonic amplifier is superimposed. The miniaturization of 151 is also difficult. Further, as in the conventional example of Fig. 11, if the configuration of the two amplifier supporting members 105 different from the ultrasonic amplifier 201 is used, there are disadvantages in that the number of components is increased and the assembly is complicated. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a converter which not only imparts strength to a support member of a converter, but also makes the support member as thin as possible in the axial direction of the converter. [Means for Solving the Problem] In order to solve the above problem, the converter according to the first aspect of the present invention is characterized in that it is vibrated by the operation of the vibrator, and is provided to be provided at least in a node including the vibration of the converter body. a holding portion at two places; a connecting portion that connects the different holding portions to the connection portion on the converter main body side; the converter main body, the holding portion, and the connecting portion are integrally formed by the same member. (Please read the notes on the back and fill out this page)
本紙張尺度適闬中國國家標準（CNS)A4規格（210 X 297公t ) A7 1281218 五、發明說明（斗） 本案之第1發明，由於保持部係設置於包含該轉換器 本體之振動之波節的至少2處，故不會導致軸心方向之振 動之能量損失而能防止轉換器之搖動。此外，由於具備連 結部，將各保持部之與轉換器本體側之連接處不同的地方 互相連結，故施加在一保持部之外力，會分散至以連結部 結合之各保持部，藉此能抑制保持部之變形，進而能使各 保持部於轉換器本體之軸心方向形成爲極薄。 又，由於轉換器本體、保持部及連結部係由同一構件 形成爲一體，故能使保持部與轉換器本體之結合極爲牢牢 固，進而使保持部能更爲薄型化。 本案第2發明之轉換器，係第1發明之轉換器中，前 述保持部，係板狀，且沿前述轉換器本體之處理作用方向 配置。 本案第2發明中，由於板狀之保持部，係沿轉換器本 體之處理作用方向配置，因此轉換器本體與保持部之連接 截面，成爲以處理作用方向爲長邊之形狀。因此，即使在 有大負荷之接合時，因能使轉換器本體與保持部之連接截 面大，故能提高對切斷之耐久力。 本案第3發明之轉換器，係第1或第2發明之轉換器 之前述保持部中，1個保持部係設置於從前述轉換器本體 之基端起第η波節(η係自然數），其他保持部則設置於第 n+m波節(m係奇數），在前述連結部設置用以固定該連結 部於保持具之固疋機構。 轉換器之振動特性，特別是其固有頻率或其倒數之振 _____6 ____ _ 1紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) ~ 一 (請先閱讀背面之注意事項再填寫本頁) --------訂·--- 線' 1281218 A7 ——---------- -B7 ____ 五、發明說明（S ) 動周期，於各個轉換器之間不一定爲固定，有可能因加工 精度等而產生若干偏差。這一點，在本案第3發明中，因 1個保持部係設置於從前述轉換器本體之基端起第n波節 〇係自然數），其他保持部則設置於第n+m波節(m係奇數) ’故即使是由於振動特性之偏差使實際振動波節從設計上 之位置偏移時’作用於各保持部之力量彼此成反相位，而 該等力量在連結部彼此抵消。因此，本案第3發明，能回 避從轉換器本體經過各保持部漏出之能量變爲振動，對以 固定機構所固定之保持具或該保持具所固定之接合頭驅動 機構，作爲振動來傳遞之情形。 本案第4發明之轉換器，係第3發明之轉換器中，前 述固定機構，係設置在前述連結部之長邊方向上位置不同 的至少2點。 本案之第4發明，由於固定機構係設置在連結部之長 邊方向上位置不同的至少2點，故能有效防止轉換器之處 理作用方向之振動。 本案第5發明之轉換器，係第4發明之轉換器中，前 述各固定機構，係配置在由前述保持部及前述連結部所構 成之振動傳遞路徑之路徑長度彼此等距的位置。 本案之第5發明，由於各固定機構’係分別配置在由 保持部及連結部所構成之振動傳遞路徑之路徑長度彼此等 距的位置，故能使從轉換器本體作用於各保持部之力量， 在固定機構之位置，成爲彼此相反的相位。 本案第6發明之轉換器，係第1至第5中任一發明之 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） (請先閱讀背面之注意事項再填寫本頁) Γ 1-— I 1-i n f νϋ ϋ HI 1¾ igg i 5i=_ 1 A7 1281218 五、發明說明（。） 轉換器中，前述保持部及前述連結部，係在包挾前述轉換 器本體軸心之兩側，相對於前述軸心呈對稱設置。 本案之第6發明，由於保持部及連結部，係在包挾轉 換器本體軸心之兩側，相對於軸心呈對稱設置，故就相對 某一波節呈對稱配置之2個保持部而言，因振動器之振動 漏出而形成之力量之方向彼此相反。因此，若將此等保持 部之兩者一體固定於保持具時，漏出之能量即彼此抵消， 能防止振動往保持具、固定其之接合頭驅動機構傳遞。 本案第7發明之轉換器.，係第1至第6中任一發明之 轉換描1中’則述保持部及刖述連結部’係設置於與前述轉 換器之處理作用方向交叉之方向上。 本案之第7發明，由於保持部及連結部，係設置於與 轉換器之處理作用方向交叉之方向上，故利用連結部將轉 換器本體固定於保持具或接合頭驅動機構，即能縮小轉換 器本體於處理作用方向之尺寸，例如在使處理作用方向朝 向下時，能使轉換器本體下側之間隙加大。 本案第8發明之轉換器，係第1至第7中任一發明之 轉換器中，在前述保持部及前述連結部之間，進一步具備 用以吸收前述振動之薄料部。 本案之第8發明，即使從轉換器本體漏出振動能量時 ，亦能藉由薄料部之彈性變形，來緩衝從保持部傳遞至連 結部的振動能量。 本案第9發明之轉換器，係第1至第8中任一發明之 轉換器中，在與前述轉換器本體爲相同構件之母材中設置 (靖先閱讀背面之注意事項再填寫本頁) 零裝--------訂i flu In m 2-5 n •丨線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1281218 五、發明說明（） 通孔，在該通孔之周圍形成前述保持部及前述連結部。 本案之第9發明，由於係藉由在與轉換器本體爲相同 構件之母材中設置通孔，而能形成保持部及連結部而能_ 造轉換器，故使用切削加工、鑄造或其他任何加工方法時 ，均能使加工容易化。 本發明之轉換器中之處理作用構件，雖然以設在振動 之波腹位置較爲合適，其位置無論是如第10發明般在被至 少2個保持部所挾區域之外側，或如第11發明般在被至少 2個保持部所挾區域之內側皆可。又，若係後者時，如第 12發明般設置· 2保持部，於兩保持部設置點之中間點裝備 晶片吸附口的話，即能使對晶片吸附口之載重分佈平均化 ，因此較爲適宜。 本案第13發明之接合裝置，係包含第1至第12中任 一發明之轉換器所構成之接合裝置。本案之第13發明，能 獲得與本案第1至第12發明相同之效果。 [圖式之簡單說明] 圖1 ’係同時顯示本發明第1實施形態之放大器本體 之俯視圖與振動之波節位置的圖表。 圖2，係顯示第1實施形態之放大器本體的側視圖。 圖3’係安裝於保持具之狀態下第丨實施形態之放大 器本體的C-C線截面圖。 圖4’係槪略顯示第1實施形態之放大器本體的立體 圖。 Γ%先閱請背面之注音Μ事項再填寫本頁> --------訂---------線. 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公t ) 1281218 A7 B7 五、發明說明（/ ) 圖5，係槪略顯示安裝於保持具之狀態下第1實施形 態之放大器本體下面側的立體圖。 圖6，係同時顯示第2實施形態之放大器本體之俯視 圖與振動之波節位置的圖表。 圖7，係安裝於保持具之狀態下第2實施形態之放大 器本體的F-F線截面圖。 圖8 ’係顯示安裝於保持具之狀態下第2實施形態之 放大器本體的側視圖。 圖9 ’係顯示安裝於保持具之狀態下第2實施形態之 放大器本體的立體圖。 圖10，係顯示習知超音波放大器之安裝構造的側視圖 〇 圖11 ’係顯示習知其他例之超音波放大器之安裝構造 的側視圖。 (請先閱讀背面之注意事項再填寫本頁) ▼裝 » I I I 1 [符號說明] 1，101，151，201 4, 104 4a 4b， 104b 5A1，5A2, 5B1，5B2， 105A1，105A2, 105B1， 105B2 6A，6B，106A，1〇6Β 超音波放大器 放大器本體 錐形部 軸心 保持部 連糸吉咅6 -線 10 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 1281218 __B7 五、發明說明（1 ) 7A1，7A2, 7B1，7B2, 17 螺孔 8 安裝孔 9 前端部 10 後端部 11 上部平面 12 下部平面 13 側部平面 14 薄料部 16，166 毛細管 20, 107 通孔 30, 130, 156, 206 保持具 35, 135 螺栓 40, 140, 190 超音波振動器 108 吸附嘴 108a 通孔 108b 晶片吸附口 154 凸緣部 155,205 放大器支撐部 157 支軸 pl，p2, p3, p4, pla，p2a， 波節 (請先閱讀背面之注意事項再填寫本頁) ▼裝--------訂---------線 pi 1，pl2 [發明之實施形態] 顯 係 以下，參照圖式說明本發明之實施形態。圖1 _π_ $紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐1 !281218 A7 ---— — _B7_一 五、發明說明（一） 示作爲第1實施形態之轉換器的超音波放大器1。，超音 波放大器1，係將前端側形成有錐形部4a之略圓柱形的放 大器本體4，於放大器本體4之左右各各2處共4處所設 的保持部5A1，5A2，5B1，5B2(以下，適當稱爲保持部5)， 以及將前後2個保持部5之側端彼此連結的連結部6A，6B( 以下，適當稱爲連結部6)，以相同構件形成爲一體而構成 。在超音波放大器1之基端部，設有螺孔17，以固定產生 超音波振動之超音波振器40(參閱圖5)。 錐形部4a之形狀，係周知之圓錐形。於錐形部4a之 前端部，穿設用以安裝毛細管16(參照圖5)之安裝孔8。 保持部5，均爲平板狀。4個保持部5，係以各2個爲 一組彼此設在放大器本體4之長邊方向（超音波振動之傳遞 方向）的相異位置，放大器本體4後方側之保持部5A1，5B1 ’係設置在從放大器本體4之基端起第1個波節pi之位置 ，放大器本體4前方側之保持部5A2, 5B2，係設置在從放 大器本體4之基端起第2個波節P2之位置。另一方面，安 裝孔8，如圖所示的，係設在2個保持部5所挾區域之外 側，且安裝於此之毛細管16之軸心係設定成與振動之波腹 (速度絕對値爲最大的部分)一致。 保持部5，雖係設計成其厚度方向之中間點，能正確 的與超音波放大器1設計上之振動波節pl，p2 —致，但由 於視超音波放大器1之實際振動之波節位置，會視超音波 放大器1之工作精度而有一定偏差，因此實際振動之波節 位置或有從設計上位置偏移之情形。又，各保持部5之厚 _12_ 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂-------------線 1281218 A7 ____^B7______ 五、發明說明（丨） 度約爲〇.5mm。 連結部6A，6B上，設有螺孔7A1，7A2, 7B1，7B2(以下 ，適當稱爲螺孔7)，此等螺孔係用以將連結部6A，6B固定 於保持具30(參照圖3、圖5)之固定機構。 螺孔7，係分別設於連結部6A，6B之長邊方向的2相 異位置。 在連結部6A，6B之後方部分及前方部分，分別形成有 平板上之薄料部14。各薄料部14之厚度約爲0.5mm。 各保持部之長度（圖1中上下方向之長度)彼此相等。 又，連結部6A及連結部6B之長度（圖1中左右方向之長 度）亦彼此相等。此外，螺孔7A1與螺孔7A2，以及螺孔 7B1與螺孔7B2係設置成彼此對稱(亦即，從連結部6之前 端或後端起之距離相等之位置）。因此，螺孔7A1與螺孔 7A2，及螺孔7B1與螺孔7B2，係配置在由保持部5及連 結部6所構成之振動傳遞路徑之路徑長度中，彼此等距之 位置。 如圖1及圖3所示，保持部5八1，5人2及連結部6八， 與保持部5B1，5B2及連結部6B，係在挾著放大器本體4 之軸心4b兩側，相對軸心4b呈對稱設置。 又，保持部5A1，5A2及連結部6A，與保持部5B1， 5B2及連結部6B，係分別突設於與超音波放大器1之處理 作用方向之垂直下方（圖3之D方向）交叉之方向的水平方 向（圖3之E-E方向）。 此超音波放大器1之製造步驟，如下所述。首先在圓 ___ 13____ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) --------^ --------- 1281218 A7 ___ B7_______ 五、發明說明（、/) 棒(母材料）之前端部，以拉床穿設安裝孔8。又，在圓棒之 基端部穿設螺孔17。其次，以車床朝軸心4b車削圓棒之 前端側及後端側，來形成前端部9及後端部1〇。其次，以 銑床分別形成平坦之上部平面11、下部平面12、側部平面 13，又形成薄料部14之外面。又，以立銑刀及螺絲攻形成 螺孔7。 然後，在包挾軸心4b之兩側，以立銑刀向垂直方向穿 設通孔2 0。因此’通孔2 0之平面形狀’㈣垂直方向不變 。藉由該通孔20之穿設，在通孔20之周圍，將放大器本 體4、保持部5及連結部6形成爲一體。 以上述方式製造之超苜波放大器1 ’係錯由將螺检35 分別鎖入螺孔7A1〜7B2，據以固定於朝下方開口之截面 呈C字狀之保30(參照圖3、圖5)。藉此，超音波放大器1 ’在圖3中E - E線所不之水平面上之4處’固疋於保持具 30。保持具30，在其基部側端面之適當處，固定於未圖示 之打線機本體之接合頭驅動機構。接合頭驅動機構，係將 超音波放大器1移送至水平面上之任意之位置，並對超音 波放大器1賦予垂直向下之任意負載者。另一方面，在放 大器本體4之基端部之螺孔17，固定由電伸縮元件積層於 軸方向所構成之周知的超音波振動器40 °又’在安裝孔8 安裝毛細管16。 以上述方式構成之本實施形態中，超音波振動器40所 產生之超音波振動，即以壓縮波（縱波）之形態，沿超音波 放大器1之長邊方向，即沿軸心4b之方向’從基5而側傳遞 _14_____ 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 x 29/公复） -------------------訂---------i^w. (請先閱讀背面之注意事項再填寫本頁) A7 1281218 五、發明說明（) 向前端側。 此處，本實施形態中，由於保持部5係設於包含放大 器本體4之振動之波節pl，p2的2處，由於波節係不振動 之點，因此不會導致沿軸心4b方向之壓縮波(縱波)之振動 損失，而能防止超音波放大器1之搖動。此外，由於具備 將各保持部5中與放大器本體4側之連接處不同位置之保 持部5側端相互連結之連結部6，因此施加在一保持部5( 例如保持部5A1)之外力，即會分散至以連結部6結合之各 保持部5(例如保持部5A1，5A2)，藉此能抑制保持部5之 變形，進而能將各保持部5在放大器本體4之軸心4b之方 向形成爲極薄。、 又，放大器本體4、保持部5及連結部6，由於係以同 一構件之圓棒材料切削出而成一體，因此保持部5與放大 器本體4之結合爲金屬結合而極爲強固，據此能使保持部 5更爲薄型化。 又，本實施形態中，由於平板狀之保持部5，及平板 狀之薄料部14，皆係設置在沿超音波放大器1之處理作用 方向（上下方向）之上下方向，因此放大器本體4與保持部5 之連接截面，及保持部5與薄料部14之連接截面均爲上下 之長形狀。因此，即使是在施加大負載之接合時，亦不易 因超音波放大器1之上下動作而產生保持部5及薄料部14 的塑性變形，此外，由於能將各連接截面取大，故能提高 對切斷之耐久力。又，保持部5之形狀除平板狀外，例如 亦可是以超音波振動器40之中心點爲中心之圓弧狀、或球 __15______ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)This paper size is suitable for China National Standard (CNS) A4 specification (210 X 297 metric tons) A7 1281218 V. Invention Description (Draft) The first invention of the present invention, the holding portion is disposed in a wave including the vibration of the converter body At least two of the knots do not cause energy loss in the vibration of the axial direction and prevent the converter from shaking. Further, since the connection portion is provided and the portions of the respective holding portions that are different from the connection portion on the converter main body side are connected to each other, the force is applied to the holding portion, and is dispersed to the respective holding portions joined by the joint portion. The deformation of the holding portion is suppressed, and each of the holding portions can be formed to be extremely thin in the axial direction of the converter body. Further, since the main body of the converter, the holding portion, and the connecting portion are integrally formed by the same member, the bonding between the holding portion and the main body of the converter can be made extremely strong, and the holding portion can be made thinner. According to a second aspect of the invention, in the converter of the first aspect of the invention, the holding portion is formed in a plate shape and disposed along a processing direction of the converter body. According to the second aspect of the invention, since the plate-shaped holding portion is disposed in the processing direction of the converter body, the connecting cross section between the converter main body and the holding portion has a shape in which the processing action direction is a long side. Therefore, even when there is a large load, the connection between the main body of the converter and the holding portion can be made large, so that the durability against cutting can be improved. In the above-described holding portion of the converter according to the first or second aspect of the present invention, the holding unit is provided in the n-th node (n-number natural number) from the base end of the converter main body. The other holding portion is provided at the n+m node (m is an odd number), and the fixing portion is provided with a fixing mechanism for fixing the connecting portion to the holder. The vibration characteristics of the converter, especially its natural frequency or its reciprocal vibration _____6 ____ _ 1 paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ~ one (please read the note on the back first) Fill in this page) --------Book·--- Line '1281218 A7 ——---------- -B7 ____ V. Invention Description (S) Cycle, in each converter There is not necessarily a fixed relationship between them, and there may be some deviation due to machining accuracy and the like. In the third aspect of the invention, the one holding portion is provided at the n-th node of the converter main body, and the other holding portion is provided at the n+m node ( m is an odd number. Therefore, even if the actual vibration nodes are shifted from the design position due to the deviation of the vibration characteristics, the forces acting on the respective holding portions are opposite to each other, and the forces cancel each other at the joint portion. Therefore, according to the third aspect of the present invention, the energy leaked from the converter main body through the respective holding portions can be prevented from being vibrated, and the holder fixed by the fixing mechanism or the joint head driving mechanism fixed to the holder can be transmitted as vibration. situation. According to a fourth aspect of the invention, in the converter according to the third aspect of the invention, the fixing mechanism is provided at least two points different in position in the longitudinal direction of the connecting portion. According to the fourth aspect of the invention, since the fixing mechanism is provided at least two points different in position in the longitudinal direction of the connecting portion, the vibration in the direction of the transducer action can be effectively prevented. According to a fifth aspect of the invention, in the converter according to the fourth aspect of the invention, each of the fixing means is disposed at a position equidistant from a path length of a vibration transmission path formed by the holding portion and the connecting portion. According to the fifth aspect of the invention, since the respective fixing mechanisms are disposed at positions equidistant from each other in the path length of the vibration transmission path formed by the holding portion and the connecting portion, the force acting on the holding portions from the converter body can be obtained. At the position of the fixing mechanism, they become opposite phases to each other. In the converter of the sixth invention of the present invention, the paper size of any one of the first to fifth inventions is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 publicity) (please read the notes on the back and then fill in the page) Γ 1-— I 1-inf νϋ ϋ HI 13⁄4 igg i 5i=_ 1 A7 1281218 V. In the converter, the holding portion and the connecting portion are included in the axis of the converter body Both sides are symmetrically arranged with respect to the aforementioned axis. According to the sixth aspect of the present invention, since the holding portion and the connecting portion are symmetrically disposed on the both sides of the axis of the package converter main body with respect to the axial center, the two holding portions are symmetrically arranged with respect to a certain node. In other words, the directions of the forces formed by the vibration of the vibrator leaking are opposite to each other. Therefore, when both of the holding portions are integrally fixed to the holder, the leaked energy cancels each other, and vibration can be prevented from being transmitted to the holder and the joint head driving mechanism fixed thereto. According to a seventh aspect of the invention, in the conversion of the first aspect of the invention, the holding unit and the connecting unit are disposed in a direction intersecting with the processing direction of the converter. . According to the seventh aspect of the invention, since the holding portion and the connecting portion are provided in a direction intersecting the processing action direction of the converter, the converter body can be fixed to the holder or the bonding head driving mechanism by the connecting portion, that is, the conversion can be reduced. The size of the device body in the direction of the processing action, for example, when the processing action direction is directed downward, the gap on the lower side of the converter body can be increased. According to a third aspect of the invention, in the converter according to any one of the first to seventh aspect of the present invention, further comprising a thin portion for absorbing the vibration between the holding portion and the connecting portion. According to the eighth aspect of the invention, even when the vibration energy is leaked from the converter main body, the vibration energy transmitted from the holding portion to the joint portion can be buffered by the elastic deformation of the thin portion. According to a ninth aspect of the present invention, in the converter according to any one of the first to eighth aspects of the present invention, the converter is provided in a base material which is the same member as the converter body (Just first reads the back surface and then fills in this page) Zero--------Book i flu In m 2-5 n • 丨 line · This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) 1281218 V. Invention Description () The hole forms the holding portion and the connecting portion around the through hole. According to the ninth aspect of the present invention, since the through hole is provided in the base material of the same member as the main body of the converter, the holding portion and the connecting portion can be formed, and the converter can be formed, so that cutting, casting, or the like is used. When the processing method is used, the processing can be facilitated. The processing member in the converter of the present invention is preferably provided at the antinode position of the vibration, and the position thereof is outside the region surrounded by at least two holding portions as in the tenth invention, or as in the eleventh In the invention, it is possible to be inside the area enclosed by at least two holding portions. Further, in the case of the latter, if the holding portion is provided as in the twelfth invention, and the wafer adsorption port is provided at the intermediate point between the two holding portion installation points, the load distribution on the wafer adsorption port can be averaged, which is preferable. . The bonding apparatus according to a thirteenth aspect of the invention is the bonding apparatus comprising the converter according to any one of the first to twelfth aspects. According to the thirteenth invention of the present invention, the same effects as the first to twelfth inventions of the present invention can be obtained. [Brief Description of the Drawings] Fig. 1 is a graph showing the top view of the amplifier main body and the node position of the vibration in the first embodiment of the present invention. Fig. 2 is a side view showing the main body of the amplifier of the first embodiment. Fig. 3' is a cross-sectional view taken along line C-C of the amplifier body of the third embodiment in a state in which the holder is attached. Fig. 4' is a perspective view showing the main body of the amplifier of the first embodiment. Γ%Please read the notes on the back and fill in this page again> --------Book---------Line. This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 s t) 1281218 A7 B7 V. (Description of the Invention) FIG. 5 is a perspective view showing the lower surface side of the amplifier main body according to the first embodiment in a state of being attached to the holder. Fig. 6 is a graph showing both the plan view of the amplifier main body and the node position of the vibration in the second embodiment. Fig. 7 is a cross-sectional view taken along line F-F of the amplifier main body of the second embodiment in a state of being attached to a holder. Fig. 8 is a side view showing the main body of the amplifier of the second embodiment in a state of being attached to the holder. Fig. 9 is a perspective view showing the main body of the amplifier of the second embodiment in a state of being attached to the holder. Fig. 10 is a side view showing a mounting structure of a conventional ultrasonic amplifier. Fig. 11 is a side view showing a mounting structure of a conventional ultrasonic amplifier. (Please read the notes on the back and fill out this page) ▼Installation» III 1 [Symbol description] 1,101,151,201 4, 104 4a 4b, 104b 5A1,5A2, 5B1,5B2, 105A1,105A2, 105B1, 105B2 6A, 6B, 106A, 1〇6Β Ultrasonic Amplifier Amplifier Body Conical Part Axis Retention Unit 糸 糸 咅 6 - Line 10 This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) A7 1281218 __B7 V. INSTRUCTIONS (1) 7A1, 7A2, 7B1, 7B2, 17 Screw hole 8 Mounting hole 9 Front end portion 10 Rear end portion 11 Upper flat surface 12 Lower flat surface 13 Side flat surface 14 Thin material portion 16, 166 Capillary tube 20 107 through hole 30, 130, 156, 206 holder 35, 135 bolt 40, 140, 190 ultrasonic vibrator 108 suction nozzle 108a through hole 108b wafer adsorption port 154 flange portion 155, 205 amplifier support portion 157 support shaft pl, p2, P3, p4, pla, p2a, knots (please read the notes on the back and fill out this page) ▼ Install -------- Order --------- Line pi 1,pl2 [Invention Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figure 1 _π_ $ paper scale applies Chinese National Standard (CNS) A4 specification (210 X 297 mm 1 !281218 A7 ----- _B7_ 1-5, invention description (1) shows the converter as the first embodiment Ultrasonic Amplifier 1. The ultrasonic amplifier 1 is a slightly cylindrical amplifier body 4 having a tapered portion 4a formed on the front end side, and holding portions 5A1, 5A2 provided at four places on the left and right sides of the amplifier body 4 5B1, 5B2 (hereinafter referred to as "holding portion 5" as appropriate), and connecting portions 6A, 6B (hereinafter referred to as "connecting portion 6" as appropriate) for connecting the side ends of the two holding portions 5 in the front and rear, and forming the same member as The base end portion of the ultrasonic amplifier 1 is provided with a screw hole 17 for fixing the ultrasonic vibration oscillator 40 that generates ultrasonic vibration (see Fig. 5). The shape of the tapered portion 4a is a well-known conical shape. A mounting hole 8 for attaching the capillary tube 16 (see Fig. 5) is bored at an end portion of the tapered portion 4a. The holding portions 5 are each in the form of a flat plate. The four holding portions 5 are each in a group of two. The mutually different positions of the long side direction of the amplifier body 4 (the direction of transmission of the ultrasonic vibration) are placed at different positions. The holding portions 5A1, 5B1' on the rear side of the main body 4 are provided at the position of the first node pi from the base end of the amplifier main body 4, and the holding portions 5A2, 5B2 on the front side of the amplifier main body 4 are provided in the slave amplifier. The base end of the body 4 is at the position of the second node P2. On the other hand, the mounting hole 8, as shown in the figure, is provided on the outer side of the region where the two holding portions 5 are located, and the capillary 16 is mounted thereon. The axis is set to match the antinode of the vibration (the portion where the absolute speed is the maximum). The holding portion 5 is designed to have an intermediate point in the thickness direction thereof, and can accurately design the vibration wave with the ultrasonic amplifier 1 Section pl, p2 is the same, but since the node position of the actual vibration of the ultrasonic amplifier 1 depends on the working accuracy of the ultrasonic amplifier 1, there is a certain deviation, so the actual vibration node position may be biased from the design position. In addition, the thickness of each holding part 5 _12_ This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page) ----------- Line 1281218 A7 ____^B7_________ V. Invention The brightness is about 55 mm. The connecting portions 6A and 6B are provided with screw holes 7A1, 7A2, 7B1, and 7B2 (hereinafter, referred to as screw holes 7 as appropriate), and these screw holes are used to connect the joint portions. 6A, 6B are fixed to the fixing mechanism of the holder 30 (refer to Figs. 3 and 5). The screw holes 7 are respectively provided at two different positions in the longitudinal direction of the connecting portions 6A, 6B. After the connecting portions 6A, 6B The square portion and the front portion are respectively formed with thin portions 14 on the flat plate. The thickness of each thin portion 14 is about 0.5 mm. The length of each holding portion (the length in the vertical direction in Fig. 1) is equal to each other. Further, the lengths of the connecting portion 6A and the connecting portion 6B (the length in the left-right direction in Fig. 1) are also equal to each other. Further, the screw hole 7A1 and the screw hole 7A2, and the screw hole 7B1 and the screw hole 7B2 are disposed to be symmetrical with each other (i.e., a position at which the distance from the front end or the rear end of the joint portion 6 is equal). Therefore, the screw hole 7A1 and the screw hole 7A2, and the screw hole 7B1 and the screw hole 7B2 are disposed at equal positions from each other in the path length of the vibration transmission path formed by the holding portion 5 and the joint portion 6. As shown in FIGS. 1 and 3, the holding portion 5, the occupant 5, the occupant 6b, and the holding portion 5B1, 5B2 and the connecting portion 6B are flanked by the axial center 4b of the amp main body 4, and are opposed to each other. The axis 4b is symmetrically arranged. Further, the holding portions 5A1, 5A2 and the connecting portion 6A and the holding portions 5B1, 5B2 and the connecting portion 6B are respectively protruded in a direction perpendicular to the processing direction of the ultrasonic amplifier 1 (the direction D in FIG. 3). The horizontal direction (EE direction of Figure 3). The manufacturing steps of this ultrasonic amplifier 1 are as follows. First, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applied to the paper size of ___ 13____ (please read the notes on the back and fill out this page) --------^ --- ------ 1281218 A7 ___ B7_______ V. Description of the invention (, /) The front end of the rod (mother material) is provided with a mounting hole 8 in a broaching machine. Further, a screw hole 17 is bored in the base end portion of the round bar. Next, the front end portion 9 and the rear end portion 1 are formed by turning the front end side and the rear end side of the round bar toward the shaft center 4b by the lathe. Next, the flat upper flat surface 11, the lower flat surface 12, and the side flat surface 13 are respectively formed by the milling machine to form the outer surface of the thin material portion 14. Further, the screw hole 7 is formed by an end mill and a tap. Then, on both sides of the wrapping core 4b, the through hole 20 is bored in the vertical direction by the end mill. Therefore, the 'planar shape of the through hole 20' (four) does not change in the vertical direction. By the passage of the through hole 20, the amplifier body 4, the holding portion 5, and the connecting portion 6 are integrally formed around the through hole 20. The super chopper amplifier 1' manufactured in the above manner is locked by the screw check 35 into the screw holes 7A1 to 7B2, and is fixed to the C-shaped section of the opening which is opened downward (refer to Figs. 3 and 5). ). Thereby, the ultrasonic amplifier 1' is fixed to the holder 30 at four places on the horizontal surface where the E-E line is not shown in Fig. 3. The holder 30 is fixed to a bonding head driving mechanism of a wire bonding machine body (not shown) at an appropriate position on the base side end surface. The bonding head driving mechanism transfers the ultrasonic amplifier 1 to an arbitrary position on the horizontal plane, and gives the ultrasonic amplifier 1 an arbitrary load vertically downward. On the other hand, in the screw hole 17 at the base end portion of the amplifier main body 4, a well-known ultrasonic vibrator 40 which is formed by laminating the electrostrictive element in the axial direction is fixed, and the capillary 16 is attached to the mounting hole 8. In the present embodiment configured as described above, the ultrasonic vibration generated by the ultrasonic vibrator 40 is in the form of a compression wave (longitudinal wave) along the longitudinal direction of the ultrasonic amplifier 1, that is, in the direction of the axis 4b. Passing from the base 5 side _14_____ This paper scale applies to the Chinese National Standard (CNS) A4 specification (21〇x 29/ public) ------------------- --------i^w. (Please read the notes on the back and fill out this page) A7 1281218 V. Invention description () to the front side. Here, in the present embodiment, since the holding portion 5 is provided at two points of the nodes pl and p2 including the vibration of the amplifier main body 4, since the node does not vibrate, it does not cause the direction along the axis 4b. The vibration loss of the compression wave (longitudinal wave) can prevent the ultrasonic amplifier 1 from shaking. In addition, since the connecting portion 6 that connects the side of the holding portion 5 at different positions of the connection portion between the respective holding portions 5 and the amplifier main body 4 is provided, the force is applied to the holding portion 5 (for example, the holding portion 5A1), that is, The holding portions 5 (for example, the holding portions 5A1 and 5A2) joined by the joint portion 6 are dispersed, whereby the deformation of the holding portion 5 can be suppressed, and the respective holding portions 5 can be formed in the direction of the axis 4b of the amplifier main body 4. It is extremely thin. Further, since the amplifier main body 4, the holding portion 5, and the connecting portion 6 are integrally formed by cutting out the round bar material of the same member, the combination of the holding portion 5 and the amplifier main body 4 is extremely strong by metal bonding, and accordingly The holding portion 5 is made thinner. Further, in the present embodiment, the flat-shaped holding portion 5 and the flat-shaped thin portion 14 are disposed above and below the processing action direction (up-and-down direction) of the ultrasonic amplifier 1, so that the amplifier body 4 and The connection cross section of the holding portion 5 and the connection cross section of the holding portion 5 and the thin material portion 14 are both long and vertical. Therefore, even when a large load is applied, it is difficult to cause plastic deformation of the holding portion 5 and the thin portion 14 due to the upper and lower operations of the ultrasonic amplifier 1, and since the connection cross section can be made large, it can be improved. Durability against cutting. Further, the shape of the holding portion 5 may be, for example, a circular arc centered on the center point of the ultrasonic vibrator 40, or the ball __15______. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X). 297 mm) (Please read the notes on the back and fill out this page)
A7 1281218 五、發明說明（〜） 面狀之板狀體。 又’超首波放大益1之振動特性，特別是固有頻率或 其倒數之振動周期，在個別之超音波放大器1間並非爲一 定，有可能因加工精度等而產生若干偏差。此點，本實施 形態中，由於係將保持部5A1，5B1設在從放大器本體4之 基端起第1波節之點pi，又，將保持部5A2, 5B2設在第2 波節之點p2，因此假設某一超音波放大器1之實際之振動 波節，係偏移設計位置之點pla，p2a(參照圖1)時，施加在 基部側之保持部5A1，5B1之振幅即爲正，而施加在前端側 之保持部5A2, 5B2之振幅爲負般，在基部側與前端側作用 於各保持部5之力量彼此成爲逆相位。而此等基部側與前 端側之保持部5係以連結部6相互連結，因此此等力量即 會在連結部6彼此抵消。因此，本實施形態，即能回避從 放大器本體4經過各保持部5漏出之能量，作爲振動傳遞 至透過連結部6及螺絲35所固定之保持具30或接合頭驅 動機構。 又，除了使2個保持部之位置位於互相鄰接之波節之 情形外，例如以第1波節pi與第4波節p4，第3波節p3 與第4波節P4之方式，將一保持部5設在從放大器本體4 基端起之第η波節(η係自然數），將另一保持部5設在從放 大器本體4基端起之第n+m波節(m係奇數)的話，即能期 待與本實施形態同樣之作用所產生之振動能量之相抵。又 ，雖然亦可將從放大器本體4之基部側起之第1個保持邰 5不設於第1波節，而設在其他任意波節，然而，爲減少 ^__16 ___ 太紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) --------訂--------- A7 1281218 _____B7_ ___ 五、發明說明（J ) 上述振動特性之偏差所伴隨之振動能量向保持部5漏出’ 最好是將從放大器本體4之基部側起第1個保持邰5設在 離超音波振動器40最近之波節(第1波節pl)。 又，本實施形態中，由於係將固定機構之螺孔7設在 連結部6長邊方向不同位置的2點，故能有效防止超音波 放大器1朝處理作用方向（上下方向）之搖動。又，螺孔7 之固定處，亦可爲3點以上，能期待同樣之效果。又，雖 可使用螺孔以外之其他固定機構，然而本實施形態由於係 使用螺孔7及螺栓35，並且將螺栓35朝向軸心4b之方向 鎖緊，故與朝向其他方向鎖緊者相較，能對振動維持高的 尺寸精度。 又，本實施形態中，由於係將各固定機構之螺孔7， 分別配置在由保持部5及連結部6所構成之振動傳遞路徑 之路徑長度(具體而言，係從保持部5與放大器本體4之連 接點起，沿保持部5與連結部6之路徑至螺孔7之軸心位 置的距離)上彼此等距的位置，因此在固定機構之螺孔7之 位置，能使從放大器本體4作用於各保持部5之力量互爲 相反的相位。 又，本實施形態中，由於係將保持部5及連結部6， 在挾著放大器本體4軸心4b之兩側，相對軸心4b呈對稱( 圖1、圖3)設置，因此就挾著某一波節呈對稱配置之2個 保持部5(例如保持部5A1，5B1)而言，因振動漏出而產生 之力量的方向，即爲同相位且彼此相反。因此，在將此等 保持部5之兩者以保持具3 0 —體固疋於接合頭驅動機構時 ___17 _ (請先閱讀背面之注意事項再填寫本頁) · an n n flu n fn n 訂---------線. 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 1281218 五、發明說明（；） ，漏出之能量即在保持具30互相抵消，而能防止振動傳遞 至接合頭驅動機構。 又，本實施形態中，由於係將保持部5及連結部6， 設在與超音波放大器1之處理作用方向（上下方向）交叉之 方向（水平方向），因此利用連結部6將超音波放大器1固 定於保持具30或接合頭驅動機構，即能縮小超音波放大器 1之處理作用方向之尺寸，據此，例如在處理作用方向朝 向下時，能加大超音波放大器1下側之間隙，避免與處理 對象之半導體元件或元件搬送軌等彼此干涉。 又，本實施形態中，由於在連結部6之後端側及前端 側形成薄料部14，因此藉由該薄料部14之彈性變形，能 緩衝從保持部5漏出之振動能量傳遞至連結部6。又，由 •於係將薄料部14形成平板狀，因此其截面2次矩極小，易 產生彈性變形，因此非常適合於緩衝振動能量。 又，本實施形態中，由於係藉由在與放大器本體4相 同構件之作爲母材料的圓棒材上設置通孔20，而能形成保 持部5及連結部6來製造超音波放大器1，因此無論在使 用切削加工、鑄造、鍛造及其他任何加工方法時，亦能使 加工容易化。又，通孔20之加工，與上述習知例之凸緣部 54之加工情形相較’由於能以較小之工具實行，因此亦能 使超音波放大器1全體更爲小型化。 又，本實施形態中，以連結部6所連接之各保持部5 之部分雖爲各保持部5之側端，然而本發明中以連結部所 連接之各保持部之部分並不限於側端，只要是各保持部中 ____18 ___ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） (請先閱讀背面之注意事項再填寫本頁) --^ ---------' 1281218 五、發明說明（β) 與放大器本體側之連接處相異之處，即能期待同樣之效果 。又，本實施形態中，將保持部5構成爲每1邊側設置2 處，然而本發明之保持部亦可在每1邊側設置3處以上。 又，保持部5及連結部6之配置，亦可相對放大器本體4 呈左右非對稱。 接著，說明第2實施形態。第2實施形態，係將本發 明應用於覆晶接合裝置者。圖6及圖7中，第2實施形態 之轉換器之超音波放大器101，取代上述第1實施形態中 之錐形部4a、安裝孔8及連結部6，係將吸附嘴1〇8、管 連接部109及連結部106A，106B(以下，適當稱爲連結部 106) ’皆以和放大益本體104相问之構件一'體形成(例如， 從與第1實施形態相同之圓棒材削出)者。 吸附嘴108爲角錐狀、管連接部109(參照圖7)爲圓柱 狀，貫穿兩者之中央穿設垂直方向之通孔l〇8a，此通孔 l〇8a之下端部即爲晶片吸附口 108b。 4 個保持部 105A1，105A2，105B1，105B2(以下，適當 稱爲保持部105)中，放大器本體104後方側之保持部 105A1，105B1，係設在自放大器本體1〇4基端起第1個波 節pll之位置，而放大器本體1〇4前方側之保持部l05A2, 105B2，係設在自放大器本體1〇4基端起第2個波節pl2 之位置。另一方面，晶片吸附口 l〇8b，如圖所示，係設在 2個保持部105之設置點之中間點，且其中心與振動之波 腹(速度絕對値爲最大的部分)一致。 此等保持部105，雖係設計成其厚度方向之中間點， _ 19__----- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------丨！？--------1T---------i. (請先閱讀背面之注意事項再填寫本頁) 1281218 五、發明說明（4) 能正確的與超音波放大器10 1設計上之振動波節P 11，P 12 一致，但由於視超音波放大器101之實際振動之波節位置 ，會視超音波放大器101之工作精度而有一定偏差，因此 實際振動之波節位置或有從設計上位置偏移之情形。又， 各保持部105之厚度約爲0.5mm。 連結部106上，設有藉螺栓135而螺固之垂直方向之 通孔107A1，107A2，107B1，107B2(以下，適當稱爲通孔 107)。 如圖7至圖9所示，超音波放大器101係固定於保持 具130來使用。保持具130，係橫跨管連接部109將左右 連結部106連結爲一體之構造，其上面，設有安裝孔130a ，以將保持具130安裝於未圖不之打線器本體之接合頭驅 動機構。安裝孔130a之中心，係位於放大器本體104之軸 心104b正上方。於保持具130，分別設有垂直方向之螺孔 130b，以和對應4個通孔107所設之螺栓135螺合。 於放大器本體104基端部之螺孔117(參照圖6)，固定 由電伸縮元件積層於軸方向所構成之周知的超音波振動器 140(參照圖8、圖9)。又，於管連接部109，連接橡膠製的 撓性管131(參照圖8)。又，第2實施形態之其他構造成， 由於與上述第1實施形態相同，因此對該部分係賦予相同 符號，並省略其說明。 以上述方式構成之第2實施形態中，超音波放大器 1〇1，藉由透過撓性管131及通孔l〇8a之吸引，將半導體 元件（未圖示）吸附於晶片吸附口 l〇8b以搬送至接合位置， ____20 _____ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 零裝--------訂---------線· 1281218 五、發明說明（q) 於此狀態下藉接合頭驅動機構潮下方驅動。然後’超音波 振動器H0所產生之超音波振動’即以壓縮波(縱波）之形 態，沿超音波放大器丨〇丨之長邊方向’即沿軸心104b之方 向，從基端側傳遞向前端側，藉由此超音波振動及接合頭 驅動機構之負載，來進行接合。 經由上述方式，第2實施形態，除了能獲得與上述第 1實施形態相同之上述各種效果外’由於係將晶片吸附口 l〇8b配置在保持部105A1，105B1與保持部105A2，105B2 之設置點之中間點，因此，能使對晶片吸附口 l〇8b之載重 分佈、進而使對半導體元件之載重分佈’於超音波放大器 101之長邊方向平均化。 又，第2實施形態中，雖然在放大器本體104之基端 部設置了超音波振動器117，而未在放大器本體104之前 端部設置任何構件，但若能在放大器本體104之前端部固 定與超苜波振動器11·7相等質量之联碼（counterweight)的 話，即能使超音波放大器101全體之重量平均，而謀求載 重分佈更進一步的均等化。 又’上述各實施形態，雖係說明了將本發明應用於打 線裝置及覆晶接合裝置之例，然而本發明不限定於該等接 合裝置’亦能應用於晶粒接合裝置等以轉換器之振動來進 行處理作用的各種處理裝置，凡此均屬於本發明之範疇。 又轉換器之形狀’亦不限於上述各實施形態之形狀，可視 其用途或目的來選擇各種形狀。 本紙張尺度適用中國國家標準（CNS)A4規格 (請先閱讀背面之注意事項再填寫本頁) 裝 訂---------線一·A7 1281218 V. INSTRUCTIONS (~) Faceted plate-shaped body. Further, the vibration characteristics of the super first wave amplification factor 1, particularly the natural frequency or the reciprocal vibration period, are not necessarily between the individual ultrasonic amplifiers 1, and there may be some variations due to the machining accuracy and the like. In this regard, in the present embodiment, the holding portions 5A1, 5B1 are provided at the point pi of the first node from the base end of the amplifier main body 4, and the holding portions 5A2, 5B2 are provided at the second node. P2, therefore, assuming that the actual vibration node of a certain ultrasonic amplifier 1 is offset from the design point pla, p2a (see FIG. 1), the amplitude of the holding portions 5A1, 5B1 applied to the base side is positive. On the other hand, the amplitudes of the holding portions 5A2 and 5B2 applied to the distal end side are negative, and the forces acting on the respective holding portions 5 on the base side and the distal end side are opposite to each other. Further, since the base portion side and the front end side holding portion 5 are coupled to each other by the joint portion 6, the forces are canceled at the joint portion 6 at the same time. Therefore, in the present embodiment, the energy leaked from the amplifier main body 4 through the respective holding portions 5 can be avoided, and the vibration can be transmitted to the holder 30 or the joint head driving mechanism that is fixed to the transmission connecting portion 6 and the screw 35. Further, in addition to the case where the positions of the two holding portions are located adjacent to each other, for example, the first node pi and the fourth node p4, the third node p3 and the fourth node P4 are one. The holding portion 5 is provided at the nth node (n-number natural number) from the base end of the amplifier main body 4, and the other holding portion 5 is provided at the n+m node from the base end of the amplifier main body 4 (m is an odd number) In addition, it is expected that the vibration energy generated by the same action as in the present embodiment can be offset. Further, although the first holding 邰 5 from the base side of the amplifier main body 4 may not be provided in the first node, but may be provided in other arbitrary nodes, the Chinese paper is applied to reduce the paper size of ^__16 ___. Standard (CNS) A4 specification (210 X 297 mm) (Please read the note on the back and fill out this page) --------Book --------- A7 1281218 _____B7_ ___ V. (J) The vibration energy accompanying the variation of the vibration characteristics leaks into the holding portion 5. Preferably, the first holding 邰5 is provided from the base side of the amplifier main body 4 to the nearest wave from the ultrasonic vibrator 40. Festival (1st wave pl). In the present embodiment, the screw holes 7 of the fixing mechanism are provided at two points at different positions in the longitudinal direction of the connecting portion 6, so that the ultrasonic amplifier 1 can be prevented from being shaken in the processing direction (vertical direction). Further, the fixing portion of the screw hole 7 may be three or more points, and the same effect can be expected. Further, although a fixing mechanism other than the screw hole can be used, in the present embodiment, since the screw hole 7 and the bolt 35 are used and the bolt 35 is locked in the direction of the axis 4b, it is compared with the one that is locked in the other direction. It maintains high dimensional accuracy for vibration. Further, in the present embodiment, the screw holes 7 of the respective fixing mechanisms are disposed in the path length of the vibration transmission path formed by the holding portion 5 and the connecting portion 6 (specifically, the holding portion 5 and the amplifier) The connection point of the body 4 is at a position equidistant from each other along the distance between the path of the holding portion 5 and the connecting portion 6 to the axial center of the screw hole 7, so that the position of the screw hole 7 of the fixing mechanism enables the slave amplifier The forces acting on the respective holding portions 5 of the body 4 are opposite to each other. Further, in the present embodiment, the holding portion 5 and the connecting portion 6 are disposed symmetrically with respect to the axis 4b on both sides of the axis 4b of the amplifier main body 4 (Fig. 1, Fig. 3). In the two holding portions 5 (for example, the holding portions 5A1 and 5B1) in which a certain node is symmetrically arranged, the directions of the forces generated by the vibration leakage are the same phase and opposite to each other. Therefore, when both of the holding portions 5 are fixed to the bonding head driving mechanism by the holder 30, ___17 _ (please read the back sheet and read the page again) · an nn flu n fn n Order ---------line. This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) A7 1281218 V. Invention description (;), the leakage energy is in the holder 30 Offset to prevent vibration from being transmitted to the bond head drive mechanism. In the present embodiment, since the holding portion 5 and the connecting portion 6 are provided in a direction (horizontal direction) intersecting with the processing operation direction (vertical direction) of the ultrasonic amplifier 1, the ultrasonic amplifier is connected by the connecting portion 6. 1 is fixed to the holder 30 or the bonding head driving mechanism, that is, the size of the processing direction of the ultrasonic amplifier 1 can be reduced, whereby the gap on the lower side of the ultrasonic amplifier 1 can be increased, for example, when the processing direction is downward. It is avoided that the semiconductor element or the element transfer rail or the like of the processing object interferes with each other. Further, in the present embodiment, since the thin portion 14 is formed on the end side and the distal end side of the connecting portion 6, the elastic energy of the thin portion 14 can be used to buffer the vibration energy leaked from the holding portion 5 to the connecting portion. 6. Further, since the thin portion 14 is formed into a flat plate shape, the second-order moment of the cross section is extremely small, and elastic deformation is liable to occur, so that it is suitable for buffering vibration energy. Further, in the present embodiment, since the through hole 20 is provided in the round bar as the base material of the same member as the amplifier main body 4, the ultrasonic wave amplifier 1 can be manufactured by forming the holding portion 5 and the connecting portion 6. It can also be easily processed when using cutting, casting, forging and any other processing methods. Further, since the processing of the through hole 20 is performed by a smaller tool than the processing of the flange portion 54 of the above-described conventional example, the entire ultrasonic amplifier 1 can be further miniaturized. Further, in the present embodiment, the portions of the respective holding portions 5 to which the connecting portion 6 is connected are the side ends of the respective holding portions 5. However, in the present invention, the portions of the respective holding portions to which the connecting portions are connected are not limited to the side ends. As long as it is ____18 ___ in each holding section, the paper size applies to China National Standard (CNS) A4 specification (210 X 297 public) (please read the notes on the back and fill in this page) --^ ----- ----' 1281218 V. Inventive Note (β) The difference between the connection with the amplifier body side can expect the same effect. In the present embodiment, the holding portion 5 is provided in two places on one side. However, the holding portion of the present invention may be provided in three or more places on one side. Further, the arrangement of the holding portion 5 and the connecting portion 6 may be asymmetric with respect to the amplifier body 4 in the left and right directions. Next, a second embodiment will be described. In the second embodiment, the present invention is applied to a flip chip bonding apparatus. In the ultrasonic amplifier 101 of the converter of the second embodiment, in place of the tapered portion 4a, the mounting hole 8 and the connecting portion 6, in the first embodiment, the nozzles 1 and 8 are attached. The connecting portion 109 and the connecting portions 106A and 106B (hereinafter referred to as "connecting portions 106" as appropriate) are formed by a member that is in contact with the magnifying body 104 (for example, the same round bar material as that of the first embodiment) Out). The suction nozzle 108 has a pyramidal shape, and the pipe connecting portion 109 (see FIG. 7) has a cylindrical shape. The through hole l 8a of the vertical direction is penetrated through the center of the two, and the lower end of the through hole l 8a is a wafer adsorption port. 108b. In the four holding portions 105A1, 105A2, 105B1, and 105B2 (hereinafter referred to as the holding portion 105 as appropriate), the holding portions 105A1 and 105B1 on the rear side of the amplifier main unit 104 are provided first from the base end of the amplifier main body 1〇4. The position of the node p11 is set, and the holding portions 105A2, 105B2 on the front side of the amplifier main body 1?4 are disposed at the position of the second node pl2 from the base end of the amplifier main body 1?4. On the other hand, the wafer suction port 8b, as shown in the figure, is provided at an intermediate point between the set points of the two holding portions 105, and its center coincides with the corona of the vibration (the portion where the absolute speed is the largest). These holding portions 105 are designed to be intermediate points in the thickness direction thereof. _ 19__----- This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------- Hey! ? --------1T---------i. (Please read the notes on the back and fill out this page) 1281218 V. Invention Description (4) Correct with Ultrasonic Amplifier 10 1 The vibration nodes P 11, P 12 are identical in design, but since the node position of the actual vibration of the ultrasonic amplifier 101 is different depending on the working precision of the ultrasonic amplifier 101, the actual vibration node position or There are situations where the position is offset from the design. Further, each of the holding portions 105 has a thickness of about 0.5 mm. The connecting portion 106 is provided with through holes 107A1, 107A2, 107B1, 107B2 (hereinafter, referred to as "through holes 107" as appropriate) which are screwed in the vertical direction by bolts 135. As shown in Figs. 7 to 9, the ultrasonic amplifier 101 is fixed to the holder 130 for use. The holder 130 is a structure in which the left and right connecting portions 106 are integrally coupled across the pipe connecting portion 109, and an upper surface thereof is provided with a mounting hole 130a for attaching the holder 130 to the joint head driving mechanism of the wire cutter body not shown. . The center of the mounting hole 130a is located directly above the axis 104b of the amplifier body 104. In the holder 130, screw holes 130b in the vertical direction are respectively provided to be screwed with the bolts 135 provided in the corresponding four through holes 107. At a screw hole 117 (see Fig. 6) at the proximal end portion of the amplifier main body 104, a well-known ultrasonic vibrator 140 (see Figs. 8 and 9) in which an electrostrictive element is laminated in the axial direction is fixed. Further, a flexible pipe 131 made of rubber is connected to the pipe connecting portion 109 (see Fig. 8). In the second embodiment, the same components as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted. In the second embodiment configured as described above, the ultrasonic amplifier 1〇1 attracts a semiconductor element (not shown) to the wafer adsorption port 10b by the suction through the flexible tube 131 and the through hole 8a. To transfer to the joint position, ____20 _____ This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the note on the back and then fill out this page) Zero-------- Order ---------line · 1281218 V. Invention description (q) In this state, the head drive mechanism is driven by the tide. Then, the ultrasonic vibration generated by the ultrasonic vibrator H0 is transmitted in the longitudinal direction of the ultrasonic amplifier ' in the form of a compression wave (longitudinal wave), that is, in the direction along the axis 104b, from the base end side toward The front end side is joined by the ultrasonic vibration and the load of the bonding head driving mechanism. According to the above-described embodiment, in addition to the above-described various effects similar to those of the first embodiment, the wafer adsorption port 10b is disposed in the holding portions 105A1, 105B1 and the holding portions 105A2 and 105B2. The intermediate point is such that the load distribution to the wafer adsorption port 10b and the load distribution of the semiconductor element can be averaged in the longitudinal direction of the ultrasonic amplifier 101. Further, in the second embodiment, the ultrasonic vibrator 117 is provided at the base end portion of the amplifier main body 104, and no member is provided at the front end portion of the amplifier main body 104, but the front end portion of the amplifier main body 104 can be fixed and fixed. When the super-chopping vibrator 11·7 has a counterweight of equal mass, the weight of the entire ultrasonic amplifier 101 can be averaged, and the load distribution can be further equalized. In the above embodiments, the present invention has been described as being applied to the wire bonding device and the flip chip bonding device. However, the present invention is not limited to the bonding device, and can be applied to a die bonding device or the like. Various processing means for vibrating to perform the treatment are all within the scope of the present invention. Further, the shape of the converter is not limited to the shape of each of the above embodiments, and various shapes can be selected depending on the purpose or purpose. This paper scale applies to China National Standard (CNS) A4 specifications (please read the notes on the back and fill out this page). Binding---------Line 1·