TWI280544B - Display - Google Patents
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- TWI280544B TWI280544B TW094108038A TW94108038A TWI280544B TW I280544 B TWI280544 B TW I280544B TW 094108038 A TW094108038 A TW 094108038A TW 94108038 A TW94108038 A TW 94108038A TW I280544 B TWI280544 B TW I280544B
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1280544 九、發明說明: 【發明戶斤屬之技術領域3 本發明一般是有關於一種顯示裝置,尤其是一種使用 電流驅動型發光元件之顯示裝置。 5 【先前技術】 習知之顯示裝置主要是藉液晶顯示裝置所構成者,最 近則開始使用藉電漿顯示裝置所構成之顯示裝置。進而, 亦實現了藉有機EL顯示裝置構建成顯示裝置者。 ® 為提供廉價之如此顯示裝置,宜使用被動矩陣驅動結 10 構。藉用被動矩陣驅動結構,可將動態矩陣驅動結構上所 需之薄膜電晶體予以省略。 第1圖係如此被動矩陣驅動結構之顯示裝置10之概略 結構示意圖。 參考第1圖,顯示裝置10係含有一形成有顯示區11A 15 之顯示基板11,該基板11上沿X方向及Y方向有多數掃 瞄線11a及資料線lib延伸形成。 ® 進而,前述基板11係連接有:一可選擇其中一條前述 掃瞄線11a予以驅動之驅動電路12a及,一可選擇一條或 多條前述資料線lib予以驅動之驅動電路12B。 20 在此,藉前述驅動電路12A,選擇一條掃瞄線11a,且 藉驅動電路12B,選擇一條或多條資料線lib,使與前述業 經選擇之掃瞄線11a及資料線lib之交點相對應之一個或 多數像素同時發光。 前述驅動電路12A、12B —般是形成積體電路晶片之 1280544 fty心與如述顯示基板11之間,為使顯示裝置的小型化時, 疋藉印刷有佈線圖案之軟性基板而連接者。如此安裝形蘇 習知有Chip 〇n nim(COF)之形態。尤其是藉c〇F安裝技 術安裝驅動電路時,大多採用適用軟性基板壓著之仃〇 5 伽2〇3 · Sn02)圖案。 本發明之發明人發現到··在驅動尤其是有機E L元件或 電漿顯示裝置等電流驅動型顯示裝置之時,令用以將驅動 電路連接於掃瞄線或資料線之佈線圖案的長度在每一條下 相異時,便有驅動不均之問題衍生。 0 ^ 第2及3圖係顯示用以連接第i圖之顯示裝置1〇之驅 動電路12A及掃瞄線11a之連接部11C之結構者。 參考第2及3圖可知:前述連接部11C係由A1形成且 由與掃瞄線11a連接之ΓΓΟ佈線圖案llc構造成者,但前 $魂ITO佈線圖案lie之間距,在與前述驅動電路12八連接 <側,與前述顯示區11A相比,對應於驅動電路12A之電 蓬間距有較為縮小者。又,在第2圖中,前述連接部 中珂述ITO佈線圖案lie呈直線延伸形成,結果前述IT〇 布線圖案lie之圖案間隔在與驅動電路12Α連接之側及顯 區11Α之側不同,但在第3圖中,前述圖案間隔則維持 變。 即使在第2圖或第3圖之形態下,仍然無法避免前述 了〇佈線圖案lie位於前述連接部11(:之長度係於基板中 失部及基板周邊部不同,且在基板周邊部比基板中央部還 長者。為此,在W述連接部llc上,基板中央部及基板周 1280544 邊部之ITO佈線圖案lie之阻抗相異,因此有此可能性, 即’對於基板中央部及基板周邊部,其等發光強度亦有不 同。 例如’令用以構成前述掃瞄線引出部lla之IT〇佈線 5 圖案He之薄層電阻(sheet resistance)為10Ω/□時,在佈線 長度為5mm、佈線寬度為50//m時,前述ΓΓΟ佈線圖案 11c之佈線電阻則為ikQ,藉上述i〇mA之驅動電流,可 知沿著ITO佈線圖案He發生有達1〇v之電壓降低者。 除了如此電壓下降,如第2圖或第3圖所示,在連接 10部nc中,ITO佈線圖案llc之間距亦有改變,為此,在 基板中央部及周邊部上用以構成掃瞄線lla之IT〇佈線圖 案He之長度相異之構造上便無法避免—位於基板中央之 掃晦線lla之佈線電阻變成最小,而在上下端之掃猫線⑴ 上’ ΠΌ佈線圖案11(:之佈線電阻則變成最大之情況。在 ^此,例如使用前述IT0佈線圖案llc之薄層電阻為動 □ ’佈線寬度1〇_之結構時可知:如果前述ιτ〇佈線圖 案lie之長度差為10mm,在基板中央部之掃瞒線iia及基 板周邊部之掃晦線lla間驅動電壓衍生有高達肅之差異 即,依本發明之發明人之調查結果明白:在如此結構 之顯:裝置中,施有蕭之驅動電壓亦不亮之像素是發生 在择員示基板11之周邊部者。1280544 IX. Description of the Invention: [Technical Field 3 of Invention] The present invention generally relates to a display device, and more particularly to a display device using a current-driven light-emitting element. 5 [Prior Art] A conventional display device is mainly constituted by a liquid crystal display device, and recently, a display device constituted by a plasma display device has been used. Further, it is also realized that the organic EL display device is constructed as a display device. ® In order to provide such a display device at a low cost, a passive matrix drive junction structure should be used. By using the passive matrix driving structure, the thin film transistor required for the dynamic matrix driving structure can be omitted. Fig. 1 is a schematic view showing the schematic configuration of a display device 10 of such a passive matrix driving structure. Referring to Fig. 1, the display device 10 includes a display substrate 11 on which a display area 11A 15 is formed, and a plurality of scanning lines 11a and data lines lib are formed extending in the X direction and the Y direction. Further, the substrate 11 is connected to a driving circuit 12a which can select one of the scanning lines 11a to be driven, and a driving circuit 12B which can be driven by one or more of the above-mentioned data lines lib. Here, by the driving circuit 12A, a scanning line 11a is selected, and one or more data lines lib are selected by the driving circuit 12B to correspond to the intersection of the selected scanning line 11a and the data line lib. One or more of the pixels emit light at the same time. The drive circuits 12A and 12B are generally connected between the 1280544 fty core of the integrated circuit chip and the display substrate 11 as described above, and are connected by a flexible substrate on which a wiring pattern is printed in order to reduce the size of the display device. This is the form of Chip 〇n nim (COF). In particular, when the driver circuit is mounted by the c〇F mounting technology, the 仃〇 5 〇 2 〇 3 · Sn02) pattern applied to the flexible substrate is often used. The inventors of the present invention have found that when driving a current-driven display device such as an organic EL element or a plasma display device, the length of the wiring pattern for connecting the driving circuit to the scanning line or the data line is When each one is different, there is a problem of uneven driving. 0 ^ The second and third views show the structure for connecting the driving portion 12A of the display device 1A of Fig. i and the connecting portion 11C of the scanning line 11a. Referring to FIGS. 2 and 3, the connecting portion 11C is formed of A1 and is configured by a meandering wiring pattern llc connected to the scanning line 11a, but the distance between the front and the soul ITO wiring patterns lie is in the same manner as the driving circuit 12 described above. The eight-connected < side has a smaller pitch corresponding to the driving circuit 12A than the display area 11A. Further, in the second drawing, the ITO wiring pattern lie is linearly extended in the connection portion, and as a result, the pattern interval of the IT〇 wiring pattern lie is different from the side connected to the driving circuit 12A and the side of the display region 11A. However, in the third figure, the aforementioned pattern interval is maintained. Even in the form of FIG. 2 or FIG. 3, it is unavoidable that the above-described tantalum wiring pattern lie is located at the above-mentioned connecting portion 11 (the length of the substrate is different from the peripheral portion of the substrate, and the peripheral portion of the substrate is different from the substrate. The center portion is also an elder. For this reason, the impedance of the ITO wiring pattern lie at the center portion of the substrate and the side of the substrate 1280544 is different in the connection portion llc, and thus there is a possibility that the center portion and the substrate periphery of the substrate are different. For example, when the sheet resistance of the IT 〇 wiring 5 pattern He constituting the scanning line lead-out portion 11a is 10 Ω/□, the wiring length is 5 mm. When the wiring width is 50/m, the wiring resistance of the ΓΓΟ wiring pattern 11c is ikQ, and it is understood that the voltage of the ITO wiring pattern He is reduced by 1 〇v. The voltage drop is as shown in FIG. 2 or FIG. 3, and the distance between the ITO wiring patterns llc is also changed in the connection of 10 nc. For this purpose, the scanning line 11a is formed on the central portion and the peripheral portion of the substrate. IT〇 wiring pattern He long The structure of the difference is unavoidable—the wiring resistance of the broom line 11a at the center of the substrate becomes the smallest, and the wiring pattern of the ΠΌ wiring pattern 11 (the wiring line 11 at the upper and lower ends of the squirrel line (1) becomes maximum. Here, for example, when the sheet resistance of the IT0 wiring pattern llc is used as the structure of the wiring width 1 〇 _, it can be seen that if the length difference of the ιτ〇 wiring pattern lie is 10 mm, the broom line iia at the center portion of the substrate And the driving voltage between the broom line 11a of the peripheral portion of the substrate is highly different. That is, according to the findings of the inventors of the present invention, it is clear that in the device of such a structure, the driving voltage applied to Xiao is not bright. The pixel is generated in the peripheral portion of the candidate substrate 11.
一般藉於ITO圖案上疊層Cr耸+ V 且增寺之低電阻材料以減少 ITO圖案之電阻值之技術是公知的 限,依如此方法,是 20 1280544 不能將如第2圖及第3圖之連接部nc中顯示基板上之ιτ〇 佈線圖案之長度差所引起之電阻變化,對應顯示基板上之 ΙΤΟ佈線圖案予以補償。 可補償如此因各個1 Τ 0佈線圖案之長度所引起之電阻 5 、交化之方法亦可考慮採用諸如··對應ΙΤΟ佈線圖案之長度 以改變圖案寬度者。例如假設100條掃瞄線lla中,位於 中央之掃瞄線11a之前述連接部11C中,IT〇佈線圖案lic 的佈線長度為5mm、圖案寬度為20从m,位於基板上端或 下端之佈線長度為l〇mm時,由前述中央之掃瞄線lla向 10上端或下端之掃瞄線lla,將ΓΓΟ佈線圖案lie之寬度以 〇·4 // m刻度逐一增加到40/z m時,可使前述連接部nc中 之佈線長度差異所造成之電阻值變化獲得補償。 惟,實際的ITO圖案之圖案寬度精度亦有iivm程 度,電阻值的誤差為圖案寬度20//m時,便成為±5%,在 15 4〇時,則變成±2.5%,要實際執行如此工程是有其困難 存在。又,用以調整如此之圖案寬度之方法是需要龐大的 設計工數。 [專利文獻1]美國專利公開公報第2001-050799號 [專利文獻2]曰本專利公開公報第2002-162647號 2〇 [專利文獻3]日本專利公開公報第2002-221536號 [專利文獻4]曰本專利公開公報第S62-124529號 【發明内容】 依本發明之一觀點,可提供一種顯示裝置,該顯示裝 置係包含有:基板;第1電極群,係與前述基板上鄰接配 1280544 列,由沿第1方向延伸形成之多數電極圖案構建成者;第2 電極群,係與前述基板上鄰接配列,由沿與第1方向不同 之第2方向延伸形成之多數電極圖案構建成者;及,多數 顯示要素,係個別與前述第1電極群中一個電極圖案與前 5 述第2電極群中一個電極圖案之交點相對應形成者;至少 前述第1電極群係具有多數電極圖案,其等多數電極圖案 係於各一端與驅動電路連接,且前述一端迄至另一端間之 長度相互不同者;前述多數電極圖案每一個具有積層構 造,該積層構造係由具有第1薄層電阻之第1導電體及具 10 有較前述第1薄層電阻還小之第2薄層電阻之第2導電體 所構建成者;前述多數電極圖案各設有業已將前述第2導 電體除去之高電阻區;前述高電阻區之長度係於前述多數 電極圖案之每一圖案因應前述電極圖案之長度而相異者。 [發明之效果] 15 依本發明,前述區間長度係於用以構成前述第1電極 群之每一個電極圖案下各異,結果在諸如用以構成前述第1 電極群之電極圖案之全長上之電阻值依每一電極圖案有所 變化時,亦使前述第2導電體之長度可因應前述區間長度 予以變化,便可補償如此電阻值的變化,在顯示裝置中實 20 現更加均勻之顯示者。 如下,有關本發明之其他課題及特徵可藉一邊參考所 附圖式一邊進行之本發明的詳細說明而明瞭矣。 [圖式簡單說明] 第1圖係顯示習知被動矩陣驅動型顯示裝置之概略結 1280544 構圖。 第2圖係顯示本發明欲解決之課題的示意圖。 第3圖係顯示本發明欲解決之課題之示意圖。 第4圖係顯示本發明第1實施例之被動矩陣驅動型有 5 機EL顯示裝置之概略結構圖。 第5圖係顯示第4圖之有機EL顯示裝置之部分剖視 圖。 第6圖係顯示第4圖之有機EL顯示裝置之連接部之詳 細結構圖。 10 第7A圖係顯示第4圖之有機EL顯示裝置之連接部之 剖面結構圖。 第7B圖係顯示第4圖之有機EL顯示裝置之連接部之 剖面結構圖。 第8圖係顯示本發明第2實施例之被動矩陣驅動型有 15 機EL顯示裝置之概略結構圖。 第9圖係顯示第8圖之有機EL顯示裝置之連接部之詳 細結構圖。 第10A圖係顯示第8圖之有機EL顯示裝置之連接部 之剖面結構圖。 20 第10B圖係顯示第8圖之有機EL顯示裝置之連接部 之剖面結構圖。 第11圖係顯示本發明之有機EL顯示裝置之特性圖。 第12圖係第6圖之有機顯示裝置之一變形例之示意 圖。 10 1280544 第13圖係本發明第3 EL顯示裝置之部分圖。 第14圖係本發明第4 EL顯示裝置之部分圖。 5 第15圖係本發明第4 EL顯示裝置之部分圖。 第16圖係本發明第5 EL顯示裝置之部分圖。 [元件符號說明] 10 10,20,40…有機EL顯示裝置 11,21...基板 11A,21A···顯示區 11C,21C,41C···連接部 1 la,21a· ··才帚目苗、線 15 llb,21b···資料線 11c...佈線圖案 12A,12B,22A,22B··.驅動電路 20A...電洞輸送層 實施例之被動矩陣驅動型有機 實施例之被動矩陣驅動型有機 實施例之被動矩陣驅動型有機 實施例之被動矩陣驅動型有機 20B...發光層 20 20C...電子輸送層 20D...陰極 20E...有機EL元件 21T,41T...端子部 圖案 25 21a2,41a2. · .Cr 圖案 21c...佈線圖案 I:實施方式3 [第1實施例] 30 第4圖係顯示本發明第1實施例之被動矩陣驅動型有 機EL顯示裝置20之結構圖。 參考第4圖,顯示裝置20整體上係具有與第1圖之顯 11 180544 :衣置1G同樣之結構,含有_形成有顯示區21A之顯示基 在别述基板21上沿X方向及Y方向有多數掃目苗線 以及資料線21b延伸形成。 進而,則述基板21上連接有可選擇驅動前述掃目苗線 次n條之驅動魏22A及選擇驅動—條或多數前述 貝料線21b之驅動電路22B。 #在此,藉前述驅動電路22A選擇其中一條掃目苗線叫, =動電路22B選擇-條或多數資料線⑽,俾使對應於 10 』述所廷擇之知瞒線2la及資料線21b之交點之_或多數 像素同時發光。 第5圖係顯示處於沿第4圖顯示裝置20之資料線21b 上之剖視圖。 ,如第5圖所示,前述資料線21b係於玻璃基板21上進 行平行圖案化,構成陽極。各資料線21b上疊層有電洞輸 15送層20A、發光層20B及電子輸送層2〇c之有機EL元件 20E,基本上是藉使用有光罩之蒸鑛法反復形成,如此形成 之有機EL元件20E係於前述玻璃基板21上呈矩陣狀排列 者。 如此矩陣排列之有機EL元件20E間之空間係藉絕緣 20膜(圖中未示)填滿,進而在前述有機EL·元件20E中,形成 有可使沿X方向齊列之一群有機EL元件連結之由A1等構 成之陰極20D。前述陰極20D係構造成第4圖結構中之掃 猫線21 a。 第6圖係顯示與第1圖及第2圖之連接部11C相對應 12 128〇544 之連接前述掃瞄線 細結構。 21a及驅動電路22A之連接部21C之詳 “A參考第6圖,前述連接部21C中,延伸到前述顯示區 5 之掃瞄線21a之重複間隔係配合用以構成前述驅動電 〜22八之積體電路晶片之端子間隔予以縮小,為此,由平 ^延伸到前述顯示區21A之掃瞄線21a之端部延伸形成之 布線圖案21c在前述連接部21C呈彎曲之狀態。又,如以 • =明,前述佈線圖案21〇係藉1丁〇圖案21ai及形成在前 1〇述ΙΤ〇圖案21a】上之低電阻Cr圖案叫之積層所構成者。 更具體地說明,前述連接部21C係包含有區間 間ft 一 ,即,關A係指由前述掃猫線2la之端部延伸形成 佈線圖案21c相對於前述顯示區21A中之延伸方向(χ方 3)斜向延伸形成者;而區間Β則指:前述佈線圖案〜在 Μ。魏間A切再沿χ方向延伸形成,連制用以盘前述 驅動電路22A連接之端子部爪者,在區間a、b中之每 _ ^ ’對應不同的掃瞄、線21a之佈線圖案21c相互平It is a well-known limitation that the technique of laminating a low-resistance material of the ITO pattern on the ITO pattern to reduce the resistance value of the ITO pattern is a well-known limitation. According to this method, 20 1280544 cannot be as shown in FIG. 2 and FIG. The connection portion nc displays a change in resistance caused by a difference in length of the wiring pattern on the substrate, and is compensated for the mean wiring pattern on the display substrate. The resistance caused by the length of each of the 1 Τ 0 wiring patterns can be compensated for. 5. The method of arranging can also be considered by using a length such as a corresponding ΙΤΟ wiring pattern to change the pattern width. For example, assuming that among the 100 scanning lines 11a, in the connecting portion 11C of the central scanning line 11a, the wiring length of the IT〇 wiring pattern lic is 5 mm, the pattern width is 20 m, and the wiring length at the upper or lower end of the substrate is When it is l〇mm, the scanning line lla of the upper or lower end of the scanning line 11a of the center is increased to 40/zm by the width of the ΓΓΟ4/m scale by the scanning line lla of the upper or lower end of the 10th. The change in resistance value caused by the difference in wiring length in the aforementioned connection portion nc is compensated. However, the pattern width accuracy of the actual ITO pattern is also iivm, and the error of the resistance value is ±5% when the pattern width is 20//m, and becomes ±2.5% at 15 4〇, which is to be practically performed. Engineering has its own difficulties. Moreover, the method for adjusting the width of such a pattern requires a large number of designs. [Patent Document 1] US Patent Publication No. 2001-050799 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2002-162647 No. 2002-221536 [Patent Document 4] According to one aspect of the present invention, a display device including: a substrate; a first electrode group adjacent to the substrate and having 1280544 columns a second electrode group is formed by a plurality of electrode patterns extending in the first direction; the second electrode group is adjacent to the substrate, and is formed by a plurality of electrode patterns extending in a second direction different from the first direction; And a plurality of display elements are formed separately corresponding to an intersection of one of the first electrode group and one of the first electrode groups of the first and second electrode groups; at least the first electrode group has a plurality of electrode patterns. a plurality of electrode patterns are connected to the driving circuit at each end, and the lengths of the one ends to the other end are different from each other; each of the plurality of electrode patterns has a laminated structure The build-up structure is constructed by a first conductor having a first sheet resistance and a second conductor having a second sheet resistance smaller than the first sheet resistance; the plurality of electrode patterns Each of the high-resistance regions in which the second conductor is removed is provided; and the length of the high-resistance region is such that each of the plurality of electrode patterns differs depending on the length of the electrode pattern. According to the present invention, the length of the section is different for each of the electrode patterns for constituting the first electrode group, and as a result, for example, on the entire length of the electrode pattern for constituting the first electrode group. When the resistance value changes according to each electrode pattern, the length of the second electric conductor can be changed according to the length of the interval, so that the change of the resistance value can be compensated, and the display device is more uniform in the display device. . Other objects and features of the present invention will become apparent from the following detailed description of the invention. [Simple description of the drawing] Fig. 1 shows a schematic diagram of a conventional passive matrix driving type display device 1280544. Fig. 2 is a schematic view showing the subject to be solved by the present invention. Figure 3 is a schematic diagram showing the subject matter to be solved by the present invention. Fig. 4 is a schematic block diagram showing a passive matrix drive type five-electrode EL display device according to a first embodiment of the present invention. Fig. 5 is a partial cross-sectional view showing the organic EL display device of Fig. 4. Fig. 6 is a detailed structural view showing a connection portion of the organic EL display device of Fig. 4. 10 Fig. 7A is a cross-sectional structural view showing the connection portion of the organic EL display device of Fig. 4. Fig. 7B is a cross-sectional structural view showing the connection portion of the organic EL display device of Fig. 4. Fig. 8 is a schematic block diagram showing a passive matrix drive type 15-electrode EL display device according to a second embodiment of the present invention. Fig. 9 is a detailed structural view showing a connection portion of the organic EL display device of Fig. 8. Fig. 10A is a cross-sectional structural view showing a connection portion of the organic EL display device of Fig. 8. 20 Fig. 10B is a cross-sectional structural view showing a connection portion of the organic EL display device of Fig. 8. Fig. 11 is a view showing the characteristics of the organic EL display device of the present invention. Fig. 12 is a schematic view showing a modification of one of the organic display devices of Fig. 6. 10 1280544 Fig. 13 is a partial view of a third EL display device of the present invention. Figure 14 is a partial view of a fourth EL display device of the present invention. 5 Fig. 15 is a partial view of a fourth EL display device of the present invention. Figure 16 is a partial view of a fifth EL display device of the present invention. [Explanation of component symbols] 10 10, 20, 40...Organic EL display device 11, 21...substrate 11A, 21A···Display area 11C, 21C, 41C···Connecting unit 1 la, 21a··· Mesh seedlings, wires 15 llb, 21b·.* data lines 11c...wiring patterns 12A, 12B, 22A, 22B·. drive circuit 20A... hole transport layer embodiment passive matrix drive type organic embodiment Passive Matrix Drive Type Organic Embodiment Passive Matrix Drive Type Organic Embodiment Passive Matrix Drive Type Organic 20B Light Emitting Layer 20 20C... Electron Transport Layer 20D... Cathode 20E... Organic EL Element 21T, 41T Terminal portion pattern 25 21a2, 41a2. . . Cr pattern 21c: wiring pattern I: Embodiment 3 [First embodiment] 30 Fig. 4 shows a passive matrix driving type organic body according to the first embodiment of the present invention. A structural diagram of the EL display device 20. Referring to Fig. 4, the display device 20 as a whole has the same structure as the display 11180544 of the first drawing: the display unit 1G, and the display base including the display area 21A is formed on the substrate 21 in the X direction and the Y direction. There are a large number of sweeping lines and a data line 21b extending. Further, the substrate 21 is connected to a drive circuit 22B which is capable of selectively driving the driving force 22A of the n-th sweeping line and the selection driving strip or the plurality of the feeding lines 21b. # 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The intersection or the majority of the pixels emit light at the same time. Fig. 5 is a cross-sectional view showing the data line 21b along the display device 20 of Fig. 4. As shown in Fig. 5, the data line 21b is parallel-patterned on the glass substrate 21 to constitute an anode. The organic EL element 20E on which the hole-transporting 15-feed layer 20A, the light-emitting layer 20B, and the electron transporting layer 2〇c are laminated on each of the data lines 21b is basically formed by a steaming method using a photomask, and is thus formed. The organic EL elements 20E are arranged in a matrix on the glass substrate 21. The space between the organic EL elements 20E arranged in a matrix is filled with an insulating film 20 (not shown), and further, in the organic EL element 20E, a group of organic EL elements can be connected in the X direction. The cathode 20D is composed of A1 or the like. The cathode 20D is constructed as a cat line 21a in the structure of Fig. 4. Fig. 6 is a view showing the connection of the scanning line fine structure corresponding to the connecting portion 11C of Figs. 1 and 2, 12 128 〇 544. 21A and the connection portion 21C of the driving circuit 22A. Referring to FIG. 6, in the connecting portion 21C, the overlapping intervals of the scanning lines 21a extending to the display area 5 are matched to form the driving power. The terminal interval of the integrated circuit chip is reduced. For this reason, the wiring pattern 21c extending from the end portion of the scanning line 21a extending to the display region 21A is bent in the connecting portion 21C. The wiring pattern 21 is formed by a laminate of a 1 〇 pattern 21ai and a low-resistance Cr pattern formed on the first 〇 pattern 21a. The connection portion is more specifically described. The 21C system includes an interval ft 1 , that is, the closed A system is formed by extending the end portion of the sweeping cat line 2la to form a wiring pattern 21c extending obliquely with respect to the extending direction (square 3) in the display region 21A; The interval Β means that the wiring pattern 〜 Μ 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏 魏'Corresponding to different scan lines 21a wiring pattern 21 c mutually flat
伸形成。 丁 I 在第6圖中,前述區間A係定義為:於前述多數佈線 位於中央部之佈線長度最短之圖案中之長度成 者-在取外側佈線長度最長之圖案之長度為最大(U_) 又則逑區間B係定義為:在前述多數肋 21c中位於中央部之佈線長度最短之圖案中之長 灿_),位於最外側之佈線長度最長之佈線圖案中^二 為零者。 瓦反 13 1280544 相關結構之結果,前述區鬥Λ η 疋^間Α中之佈線長度係由位於 袁外側之ΙΤΟ佈線圖案21c 6 ^ #丄 iC向位於中央部最短之佈線圖案 21c呈直線減少,又,區間 匕間B之佈線長度係由位於最外側 之佈線圖案21c向位於中央邱畀卜 ^ 天邻取紐之佈線圖案21c呈直線 5 增加。 在本實施例中,將前述區間B進而劃分成第i區間B1 及第2區間B2,如第7A、7B圖所示,在前述第2區間B2 中’選擇除去前述低電阻Cr膜21 :¾ //. ^ φ 1胰21k,修整位於區間匕之 佈線圖案21c中之Cr圖幸21a沾且☆ ^ ui木ZU2的長度,使佈線圖案21c 10之電阻值配成固定值。惟,第7a同#租一、, ^乐/A圖係顯不前述區間Bi中 之佈線圖案21c之剖面,第7B阊目,丨甘s -丄 矛/·«圖則頦不丽述區間B2中之 佈線圖案21c之剖面。 如此,依本發明,在前述區㈤B2中選擇除去低電阻 &膜2la2,在前述區間B2插人等效的電阻要素。此時, 15在本實施例中,對於前述電阻要素之電阻值,如第从、1^ % ®所7F ’不是調整圖案21a之寬度Wa,而是調整前述區間 B2之長度,便可予以設定使之具有良好精度。 以下,具體說明如此修整之程序。 再次荼考第6圖,如先前所述,在用以構成前述掃瞄線 20 2ia之電極群之中央部上,區間A之長度La(mm)為零。在 此,令位於前述佈線群之最外側之前述佈線圖案之長度u 為Lamax(mm)時,在佈線群的中央部與最外部之間,饰線圖 案之長度La(Lak)呈直線變化,苐k條之佈線長度Lak可由[數 1J及[數2]所得者。 14 1280544 【數1】 及Stretched out. In the sixth diagram, the interval A is defined as the length of the pattern in which the majority of the wirings are located at the center of the wiring having the shortest wiring length - the length of the pattern having the longest outer wiring length is the largest (U_) Then, the 逑 interval B is defined as a length _) in the pattern in which the wiring length of the center portion is the shortest among the plurality of ribs 21c, and is located at the outermost wiring pattern having the longest wiring length. As a result of the related structure of the tiling 13 1280544, the wiring length in the Λ 疋 疋 Α 系 系 系 系 系 系 ΙΤΟ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Further, the wiring length of the interval B is increased by a straight line 5 from the wiring pattern 21c located at the outermost side to the wiring pattern 21c located at the center. In the present embodiment, the section B is further divided into the i-th section B1 and the second section B2, and as shown in FIGS. 7A and 7B, the low-resistance Cr film 21 is selectively removed in the second section B2: 3⁄4 //. ^ φ 1 pancreas 21k, trimming the length of the Cr pattern of 21a and ☆ ^ ui wood ZU2 in the wiring pattern 21c of the interval ,, so that the resistance value of the wiring pattern 21c 10 is set to a fixed value. However, the 7th and the #1 rent one, the music/A map shows the section of the wiring pattern 21c in the aforementioned section Bi, the 7th item, the 丨 s 丄 丄 / · · · · 区间 区间 区间 区间 区间A cross section of the wiring pattern 21c in B2. As described above, according to the present invention, the low resistance & film 2la2 is selectively removed in the above-mentioned region (5) B2, and an equivalent resistance element is inserted in the interval B2. At this time, in the present embodiment, the resistance value of the resistance element, such as the first, 1%, and 7F' is not the width Wa of the adjustment pattern 21a, but the length of the interval B2 is adjusted, and can be set. Make it with good precision. Hereinafter, the procedure for such trimming will be specifically described. Referring again to Fig. 6, as described earlier, the length La (mm) of the section A is zero at the central portion of the electrode group for constituting the scanning line 20 2ia. Here, when the length u of the wiring pattern located at the outermost side of the wiring group is Lamax (mm), the length La (Lak) of the trim pattern changes linearly between the center portion and the outermost portion of the wiring group. The wiring length Lak of 苐k can be obtained by [1J and [2]. 14 1280544 [Number 1] and
2La —^ +La η 咖 52La —^ +La η coffee 5
另:方面,區間B之長度Lb(mm)亦同樣呈直線變化, 在佈線群中央為最大,在佈線群之最外端部則成為零。在 於佈線群中央之Lb為Lbmax時,第k條之佈線長度仏 可由[數3]及[數4]所得者。 【數3】 及 η H)【數4】碑今,丸,〔f〈叫 此外,在第6圖之結構中,為避免在端子部爪設置& 膜等低電阻補助佈線而產生機械強度降低之情況發生時, 々口又置鈾述Cr膜21b之部分為前述區間Bi,前述 形成為由前述區間A連續延伸形成者為佳。 15 亦如先鈾之說明,區間B是包含有:疊層有對應於第7A 圖之ITO膜21a!及Cr膜21a〗之區間B1 ’及,只有對應於第7B 圖之ITO膜21a!之區間B2,令前述掃瞄線2ia各自之延伸部 長度在前述區間B1中為Lblk (mm),在前述區間B2中則為 Lb2k(mm) 〇 令前述ITO膜21ai之薄層電阻為Rit0(i2/〇),Cj^2ia2 15 20 1280544 之薄層電阻為υΩ/Ε]),前述區間a之線寬為Wa(mm), 區間B之線寬為Wb(mm)時’前述區間a及區間B之佈線電阻 Rak、Rbk係可由【數5】所得者。On the other hand, the length Lb (mm) of the section B also changes linearly, and is the largest in the center of the wiring group, and becomes zero at the outermost end of the wiring group. When Lb in the center of the wiring group is Lbmax, the wiring length 第 of the kth strip can be obtained by [Number 3] and [Number 4]. [Number 3] and η H) [Number 4] The monument, the pill, and the f. In addition, in the structure of Fig. 6, the mechanical strength is generated in order to avoid the provision of a low-resistance auxiliary wiring such as a film in the terminal claw. When the reduction occurs, the part of the Cr film 21b in which the uranium is further described is the above-mentioned section Bi, and it is preferable that the above-described section A is continuously extended. 15 is also the description of the first uranium, and the interval B includes: a section B1' in which the ITO film 21a! and the Cr film 21a corresponding to the 7A drawing are laminated, and only the ITO film 21a corresponding to the 7B drawing; In the section B2, the extension length of each of the scanning lines 2ia is Lblk (mm) in the section B1, and Lb2k (mm) in the section B2. The sheet resistance of the ITO film 21ai is Rit0 (i2). /〇), Cj^2ia2 15 20 1280544 The sheet resistance is υΩ/Ε]), the line width of the interval a is Wa (mm), and the line width of the interval B is Wb (mm) 'the aforementioned interval a and interval The wiring resistances Rak and Rbk of B can be obtained by [5].
Rito · Rr La __aux ^ 【數5】Rito · Rr La __aux ^ [Number 5]
Rbk =Rbk =
Rito + R aux ¥YwRito + R aux ¥Yw
Rito RRito R
队+zi?2JTeam +zi?2J
5 在此,可得到一與第k條掃瞄線21a相對應之連接部21C 之佈線電阻Rk為^= Rak +Rbk。 其次,以上述為基礎,檢討使用Cr膜21a2為輔助佈線 圖案之佈線電阻之均一化(修整)。 如此佈線之電阻均一化係於上式中歸諸如何在Rk不管 10 k為何值而始終保持固定之Lblk、Lb2k之問題上。 在此’先簡單來看,假設在0Sk$n/2範圍内,在k = n/2,即位於佈線群中央部之圖案iLb2k,亦即。‘⑺係由 Lblk + Lb2k = Lbmax之關係可示為: 【數6】 "{nil)=5 Here, the wiring resistance Rk of the connection portion 21C corresponding to the kth scanning line 21a is obtained as ^= Rak + Rbk. Then, based on the above, the uniformity (trimming) of the wiring resistance using the Cr film 21a2 as the auxiliary wiring pattern was examined. The uniformity of the resistance of such a wiring is attributed to the problem of how to use Lblk and Lb2k which are always fixed regardless of the value of Rk regardless of the value of 10 k in the above formula. Here, in the simpler case, it is assumed that in the range of 0Sk$n/2, at k = n/2, that is, the pattern iLb2k located at the central portion of the wiring group, that is, . The relationship between ‘(7) and Lblk + Lb2k = Lbmax can be expressed as: [Number 6] "{nil)=
RR
Wb 1 +Wb 1 +
RR
Rit〇^Raux Wa V 馳 •LanRit〇^Raux Wa V Chi •Lan
Ku, Rito ^Lh 15 惟’在此是進行如下之導出。 在k=n/2時,有如下關係式成立;即 [數7】Rbk=^ 在此’先令 【數8】Ku, Rito ^Lh 15 but here is the following export. When k=n/2, the following relationship holds; that is, [7] Rbk=^ is in this shilling [8]
Cl =Cl =
RR
Rito + R IMk+Lb2kRito + R IMk+Lb2k
Rito^ ^Wb C2 D ^aux Rito + Rau 16 1280544 時,則得到一關係式,即Rito^ ^Wb C2 D ^aux Rito + Rau 16 1280544, then get a relation, ie
Rbk=CKC2.Lblk+Lb2k) 【數9】Rbk=CKC2.Lblk+Lb2k) [9]
Lb2k Lblk Lb2hLb2k Lblk Lb2h
Cl -C2.Lblk=Lbmax-Lblk (RKm 、 C2 -1 ,^(2/n) ClCl -C2.Lblk=Lbmax-Lblk (RKm , C2 -1 ,^(2/n) Cl
Ci Lbmaz 一 C2.LbhCi Lbmaz a C2.Lbh
Rh (n/2) C2Rh (n/2) C2
RK 12)RK 12)
Cl C2-1Cl C2-1
Cl -Lh 因為課有一全部圖案上電阻相同之條件,所以在修整 後必須令第〇條之Rak,即Ra⑼及第n/2條之Rbj^pRb(n/2)為相 5 等。意即,有一關係式成立: [數 10】仙(n/2)=Rb⑼=C1 Λ〇)Cl -Lh Because the class has the same resistance on all patterns, it is necessary to make Rak of the third strip, that is, Ra(9) and Rbj^pRb(n/2) of the n/2, be phase 5 after trimming. That is, there is a relationship established: [number 10] sen (n/2) = Rb (9) = C1 Λ〇)
LanLan
Wa 、Rito 由此,可得到一關係式:Wa, Rito, you can get a relationship:
Lb2h C2.Rito La„Lb2h C2.Rito La„
Cl (C2· Rito Lan 【數11】Cl (C2· Rito Lan [number 11]
ClCl
WaWa
Wb f Raux -·-· lH—— Wa I Rito C2-1V •LaWb f Raux -·-· lH—— Wa I Rito C2-1V •La
Cl RCl R
Wa 一Wa one
Rito •LhRito • Lh
Rito + Ra惟,k=0時,位於佈線群最外端部之Lb2k,即1^2(1)成 10 為0,而Lb2k則於0到Lb2(n/2)間呈直線變化者。因此,在修 整後之第k條之佈線長度Lb2k可由【數12】及【數13】求得 者0 【數12】 Lb2k: _ 2Lb2(n/2) ^ , η 【數13】 Lb2k : 2Lb2(tin、 ---^-k^2Lb2(n/2) )<k< η 2 rk-\ 15 如此,本實施例中,前述連接部21C中由掃瞄線21a延 17 1280544 伸形成之佈線群中,在中央部求取佈線圖案之佈線長度, 便可輕易進行電阻值之修整者。 進行如此電阻值之修整時,可將前述區間B2中之前述 佈線圖案之光罩按照由上式求取之佈線圖案資料作成即 5可,不須特別的工數。 例如’上述參數在Lamax=l〇mm、Lbmax=5mm、Wa = 2〇//m、Wb = 20//m、Rito=l〇D/[I]、Raux = 2D/E]、n = 1〇〇日$,由上述式子可知,位於區間B之中央部(第n/2條)之 佈線長度Lbl(n/2)、Lb2(n/2)則成為,Lbl(n/2) = 4mm、Lb2(n/2) 10 — lmm ’又,Rit0及Raux之合成薄層電阻成為1.67Ω/□,前 述區間β之佈線電阻則成為:Rbl(n/2)= 1.67x4000/20=334 Ω、Rb2(n/2)= ιοχι 000/20 = 500 Ω。 其次’在本實施例中,評價產生±1//in之圖案誤差時之 電阻之差異。 15 對於以上求取iLbl(n/2)、Lb2(n/2)值,在前述區間B1中, 對Cr膜21a2圖案化只有1 # m之短,LM(n/2)= 3 999mm、 Lb2(n/2)=l.〇〇imm時,Rbl(n/2)=1 67χ3999/2〇 = 333 92Ω、Rito + Ra, when k = 0, Lb2k at the outermost end of the wiring group, that is, 1^2(1) becomes 10, and Lb2k changes linearly from 0 to Lb2(n/2). Therefore, the wiring length Lb2k of the kth strip after trimming can be obtained by [number 12] and [number 13] 0 [number 12] Lb2k: _ 2Lb2(n/2) ^ , η [number 13] Lb2k : 2Lb2 (tin, ---^-k^2Lb2(n/2))<k< η 2 rk-\ 15 Thus, in the present embodiment, the connecting portion 21C is formed by the scanning line 21a extending 17 1280544. In the wiring group, the wiring length of the wiring pattern is obtained at the center portion, and the resistor value can be easily trimmed. When the resistance value is trimmed, the mask of the wiring pattern in the section B2 can be formed in accordance with the wiring pattern data obtained by the above formula, and no special number of operations is required. For example, 'the above parameters are Lamax=l〇mm, Lbmax=5mm, Wa=2〇//m, Wb=20//m, Rito=l〇D/[I], Raux = 2D/E], n = 1 According to the above formula, the wiring lengths Lb1(n/2) and Lb2(n/2) in the central portion (n/2th) of the section B become Lbl(n/2) = 4mm, Lb2(n/2) 10 - lmm 'again, the combined sheet resistance of Rit0 and Raux becomes 1.67 Ω/□, and the wiring resistance of the above interval β becomes: Rbl(n/2) = 1.67x4000/20=334 Ω, Rb2(n/2)= ιοχι 000/20 = 500 Ω. Next, in the present embodiment, the difference in resistance when a pattern error of ±1/1/in is generated is evaluated. 15 For the above values of iLbl(n/2) and Lb2(n/2), in the interval B1, the pattern of the Cr film 21a2 is only 1 #m short, LM(n/2) = 3 999mm, Lb2 (n/2)=l.〇〇imm, Rbl(n/2)=1 67χ3999/2〇= 333 92Ω,
Rb2(n/2)= i〇xiGOi/2〇= 50〇·5Ω,電阻值之改變則成為一 0.05%。同樣,在前述區間61中,對由前述&膜21七構成之 20輔助佈線進行圖案化,有l//m之長,在Lbl(n/2) = 4001mm、 Lb2(n/2) = 〇.999mm時,則電阻值的變化則變成+ 〇 〇5%者。 如此’依本發明’藉佈線寬度之調整,與電阻調整相 比’達成提高2位數之精度。 [第2實施例] 18 1280544 第8圖係顯示本發明第2實施例之有機顯示裝置4〇之 概略、纟°構圖,第9圖則是位於前述顯示裝置40之掃瞄電極 之剖視圖。惟,圖中針對先前已說明之部分同一之部分付 與同一參考符號,並省略說明。 5 參考第8圖,顯示裝置40亦是與第4圖之顯示裝置20 同樣之被動矩陣驅動型之顯示裝置,在連接前述驅動電路 22A及前述掃瞄線21a上,使用第9圖所示之連接部4ic 代替第6圖之連接部21C。 參考第9圖,前述連接部41C係於俯視圖上,具有與 10第6圖連接部21C約略同樣之結構,但代替前述掃瞄線21c 之延伸部構成之佈線圖案21c的是具有:連接前述掃瞄線 21a之端部而收斂於對應前述驅動電路22A之端子形成之 端子部41T之佈線圖案41c者。 4¾述佈線圖案41c係與前述佈線圖案21c同樣,沿其 15 延伸方向分成區間A及區間B,區間A之區間長度!^^係 於對應於最外部之掃瞄線41a之佈線圖案41c中成為最 大,對應於中央部之掃瞄線41a之佈線圖案4lc中則成為 零者。 又,前述區間B係分成區間B1及區間B2,在區間B1 2〇 上,如第l〇A圖所示,佈線圖案41c係具有與掃瞄線41a 同樣之ITO膜41a〗及銀合金膜41a〗之疊層構造,而在前述 區間B2中,如第10B圖所示,佈線圖案41c只由ITO膜 41a〗所構造成者。進而延伸形成有該區間B2之ITO圖案 41a!,構建成包含有驅動電路22A之電極及所壓延之前述 19 128〇544 端子部41T。 在本實施例中,亦與先前的實施例同樣,修整前 線圖案41c之前述區間B1之區間長度w,便可除去前述 連接。卩41C中知0¾線41a相互產生之電阻差。 ^ W述銀合金係使用諸如銀及把或銅之合金,藉此,可 實現-較Q*還低之薄層電阻。另—方面,由於銀合全比 &還容易發生因電遷移或氧化所引起之特性劣化,因如第 _圖所示’前述區間B1巾,前述銀合錢叫係於藉 前述玻璃基板21及ITO臈41ai保護之狀態下形成於前^ 10 ITO膜41ai之下層者。 以下,詳細說明第11圖之連接部11C之修整。 如前面所述,在於中央部之掃猫線化所對應之佈線 圖案41c中,前述區間A中之佈線長度La變成零,而該佈 線長度La則在外側之掃瞄線41a上則與距離前述中央部之 15 間隔成比例’主直線增加者。 在此,令位於最外端之佈線圖案4lc之長度為 Lamax(mm)時,由中央(k=〇)迄至第k條之佈線圖案4ic之 前述區間A的佈線長度Lak可以下列式子表示。Rb2(n/2)= i〇xiGOi/2〇= 50〇·5Ω, and the change in resistance value becomes 0.05%. Similarly, in the above-described section 61, the 20 auxiliary wirings composed of the above & film 21 are patterned to have a length of l//m, and Lbl(n/2) = 4001 mm, Lb2(n/2) = When 〇.999mm, the change in resistance value becomes + 〇〇5%. Thus, according to the present invention, the adjustment of the wiring width is compared with the resistance adjustment to achieve an improvement of the accuracy of two digits. [Second Embodiment] 18 1280544 Fig. 8 is a schematic view showing the organic display device 4 according to the second embodiment of the present invention, and Fig. 9 is a cross-sectional view showing the scanning electrode of the display device 40. In the drawings, the same reference numerals are given to the same parts in the drawings, and the description is omitted. 5 Referring to FIG. 8, the display device 40 is also a passive matrix drive type display device similar to the display device 20 of FIG. 4, and is connected to the drive circuit 22A and the scan line 21a, as shown in FIG. The connecting portion 4ic replaces the connecting portion 21C of Fig. 6. Referring to Fig. 9, the connecting portion 41C has a structure similar to that of the connecting portion 21C of Fig. 6 in plan view. However, instead of the wiring pattern 21c formed by the extending portion of the scanning line 21c, the wiring pattern 21c is connected to the scan. The end portion of the line 21a is converge to converge on the wiring pattern 41c of the terminal portion 41T formed by the terminal of the drive circuit 22A. Similarly to the wiring pattern 21c, the wiring pattern 41c is divided into the section A and the section B along the direction in which the 15 is extended, and the section length of the section A! ^^ is the largest among the wiring patterns 41c corresponding to the outermost scanning line 41a, and becomes zero in the wiring pattern 41c corresponding to the scanning line 41a of the central portion. Further, the section B is divided into the section B1 and the section B2, and in the section B1 2〇, as shown in the first diagram, the wiring pattern 41c has the same ITO film 41a and the silver alloy film 41a as the scanning line 41a. In the above-described section B2, as shown in FIG. 10B, the wiring pattern 41c is constructed only by the ITO film 41a. Further, the ITO pattern 41a! in which the section B2 is formed is extended, and the electrode including the driver circuit 22A and the 19128〇544 terminal portion 41T which is rolled are formed. Also in this embodiment, as in the prior embodiment, the length w of the section B1 of the front line pattern 41c is trimmed to remove the aforementioned connection.卩41C knows that the resistance of the line 04a is mutually generated. ^W The silver alloy is made of an alloy such as silver and copper or copper, whereby a sheet resistance lower than Q* can be achieved. On the other hand, since the silver-to-silver ratio & is also prone to deterioration in characteristics due to electromigration or oxidation, the aforementioned banknotes are attached to the glass substrate 21 as shown in the above section. And the ITO 臈41ai protection state is formed in the lower layer of the ITO film 41ai. Hereinafter, the trimming of the connecting portion 11C of Fig. 11 will be described in detail. As described above, in the wiring pattern 41c corresponding to the brushing of the center portion, the wiring length La in the section A becomes zero, and the wiring length La is on the outer scanning line 41a and the distance is as described above. The central part of the 15 interval is proportional to the 'main line increaser. Here, when the length of the wiring pattern 4lc located at the outermost end is Lamax (mm), the wiring length Lak of the section A from the center (k=〇) to the wiring pattern 4ic of the kth line can be expressed by the following expression .
【數14】 Lak = ~armx k^-La , n 職 f 0</:< V 20 及 【數15】 -- —k - La^ , η 職 、i、一 的朽 r η 一〈k S 另一方面,前述區間B之前述佈線圖案4ic之長度 20 1280544[Number 14] Lak = ~armx k^-La , n job f 0</:< V 20 and [number 15] --k - La^ , η job, i, one of the decay r η a <k On the other hand, the length of the aforementioned wiring pattern 4ic of the aforementioned section B is 20 1280544
Lb(mm)亦同樣由基板中央部向外側呈直線變化,對應於中 央之掃瞄線41a之佈線圖案41c為最大,在最外端則成為 零。在此,令位於前述中央部之區間長度Lb為Lbmax時, 由中央部開始第k條佈線長度Lbk可以下列式子表示者。 【數16】 Lbk = _ 2L&max / ,0<k<- V /V η 及 【數17】 Lbk- :-2Lb;k + 2Lb· ,〔量 <“Similarly, Lb (mm) linearly changes from the central portion of the substrate to the outer side, and the wiring pattern 41c corresponding to the center of the scanning line 41a is the largest, and becomes zero at the outermost end. Here, when the section length Lb located in the center portion is Lbmax, the k-th wiring length Lbk from the center portion can be expressed by the following expression. [16] Lbk = _ 2L & max / , 0 < k < - V / V η and [Number 17] Lbk- : -2Lb; k + 2Lb · , [quantity <"
10 在此,令前述ITO膜41ai之薄層電阻為Rito(D/Cl), 銀合金膜41a2之薄層電阻為Raux(Q/E]),區間A中之前述 ITO膜41ai之寬度即佈線圖案41c之寬度為Wa,又,區間 A中之銀合金膜41a2之寬度為Wa’,區間B中之前述ITO 膜41ai之寬度即佈線圖案41c之寬度為Wb,又,區間B 中之銀合金膜41&2之寬度為Wb’時,區間A及區間B之佈 線電阻Rak、Rbk各為:Here, the sheet resistance of the ITO film 41ai is Rito (D/Cl), the sheet resistance of the silver alloy film 41a2 is Raux (Q/E), and the width of the ITO film 41ai in the section A is wiring. The width of the pattern 41c is Wa, and the width of the silver alloy film 41a2 in the section A is Wa', and the width of the ITO film 41ai in the section B, that is, the width of the wiring pattern 41c is Wb, and the silver alloy in the section B When the width of the film 41 & 2 is Wb', the wiring resistances Rak and Rbk of the section A and the section B are each:
Rah 15 【數18】Rah 15 [Number 18]
Rito.Raia Rit〇~^RailRito.Raia Rit〇~^Rail
WaWa
Lak ~WaLak ~Wa
RbhRbh
Rito ~Wb{Rito ~Wb{
R -Lblk+Lb2k)R -Lblk+Lb2k)
Wb ,前述連接部41T中之第k條佈線圖案41c之電阻Rk可為: Rk = Ra^+ Rbk。在此’ Lblk、Lb2k係指·前述佈線圖案41c 之前述區間B1及B2中之佈線長度。 其次,針對前述佈線長度Lblk、Lb2k之修整(trimming) 21 1280544 進行說明。 與先前之實施例之形態同樣,修整目的在於在所有的 圖案上將前述電阻Rk設定為同一值者。以下,為簡單說明, 以〇SkSn/2之形態來處理。 k = n/2時,即考慮中央部之佈線圖案41c時,該長度 Lb2k 即 Lb2(n/2) 係由關係 Lblk + Lb2k = Lbmax 表之。 【數19】Wb, the resistance Rk of the kth wiring pattern 41c in the connection portion 41T may be: Rk = Ra^ + Rbk. Here, 'Lblk and Lb2k refer to the wiring lengths in the sections B1 and B2 of the wiring pattern 41c. Next, trimming 21 1280544 of the aforementioned wiring lengths Lblk and Lb2k will be described. As in the form of the previous embodiment, the purpose of the trimming is to set the aforementioned resistance Rk to the same value on all the patterns. Hereinafter, for the sake of simple explanation, it is processed in the form of 〇SkSn/2. When k = n/2, that is, considering the wiring pattern 41c at the center portion, the length Lb2k, that is, Lb2(n/2) is expressed by the relationship Lblk + Lb2k = Lbmax. [Number 19]
Lbl (n/2) D 1+_舰Lbl (n/2) D 1+_ship
WbWb
Rito Wb' ^ LanRito Wb' ^ Lan
RR
WbWb
Rito Wb' ^Lh k = n/2時,在上述關係 10【數20】飑=¾ 中,令【數21】Cl:When Rito Wb' ^Lh k = n/2, in the above relationship 10 [number 20] 飑 = 3⁄4, let [number 21] Cl:
Wb + RauWb + Rau
Rito ~Wb C2Rito ~Wb C2
RR
Rit〇- —+RaaRit〇--+Raa
Wb 時,可得到如下之表現:Rbk=Cl(C2 · Lblk + Lb2k)When Wb, the following performance is obtained: Rbk=Cl(C2 · Lblk + Lb2k)
Lb2k 【數22】 Lb2k 在此,令 【數23】C3 =Lb2k [number 22] Lb2k Here, let [number 23] C3 =
Rh ci -C2*LM, =L^ -Lbh C2-1 .Rb、n/2) ClRh ci -C2*LM, =L^ -Lbh C2-1 .Rb,n/2) Cl
Cl -C2^Lb\h j Rbt (n/2) C2 (Rb^-Lb、Cl -C2^Lb\h j Rbt (n/2) C2 (Rb^-Lb,
Cl C2-1V ClCl C2-1V Cl
RR
Rit〇- — ^RaiLRit〇-- ^RaiL
Wa 時,電阻Rak可表為: 22 15 1280544 ί 數 24】Rak=C3*Rit。·^For Wa, the resistance Rak can be expressed as: 22 15 1280544 ί number 24] Rak=C3*Rit. ·^
Wa ,由修整後使全部的佈線圖案41c上電阻相等之條件,須 使第〇條之R&k即Ra⑼與第n/2條之Rbk即Rb(n/2)相等。 即,有【數25】式成立: ((〇)Wa, under the condition that the resistances of all the wiring patterns 41c are equalized after trimming, the R&k, that is, the Ra(9) of the third strip is equal to the Rbk of the n/2th strip, that is, Rb(n/2). That is, there is a formula [25]: ((〇)
LanLan
Wa · Rito ,但由此導出: 【數26】Wa · Rito, but derived from this: [Number 26]
Lb2h C3· Rito _Lan C2Lb2h C3· Rito _Lan C2
ClCl
RR
Wa C2-\^ Cl Wb (Λ Raux Wa Wa { Rito Wb,Wa C2-\^ Cl Wb (Λ Raux Wa Wa { Rito Wb,
C3.SC3.S
Wa 、La„Wa, La„
RR
LbLb
Rito Wb,Rito Wb,
Wa ,可得到上述關係。 10 另一方面,k=0時,即考慮最外端之佈線圖案41c時, 長度Lb2k( = Lb2(0))則成為零,使Lb2k*零迄至Lb2(n⑺呈 直線變化。 因此,修整後之第k條之佈線長度便可求出,即: 【數27】 Lb2k = 2Lb2{n/2) k , η V 2; 及 【數28】 Lb2k = k + 2Lb2{nll) ,〔音〈灸 在此’令上述式子的蒼數各為· Lamax = 10mm、Lbmax =5mm、Wa= 20 // m、Wb = 20 // m、Wa, = 15 从 m、Wb,= 23 1280544 15//m、Rit〇=l〇n/[D、R_ = 〇.2n/[I]、n=100 時’ 所求出之前述佈線長度各為Lbl(n/2) = 4.867(mm)、Lb2(n/2) = 0.133(mm) 0 進而,Rito及Raux之合成薄層電阻變成0·196Ω/[], 5 因此可求出前述區間Β中之佈線圖案41c之佈線電阻,各 為:Wa, can get the above relationship. On the other hand, when k=0, that is, when the outermost wiring pattern 41c is considered, the length Lb2k (= Lb2(0)) becomes zero, and Lb2k* is zero-to-Lb2 (n(7) changes linearly. Therefore, trimming The length of the wiring of the kth strip can be obtained, ie: [27] Lb2k = 2Lb2{n/2) k , η V 2; and [28] Lb2k = k + 2Lb2{nll) , [音〈 Moxibustion here makes the number of the above formulas Lamax = 10mm, Lbmax = 5mm, Wa = 20 // m, Wb = 20 // m, Wa, = 15 from m, Wb, = 23 1280544 15/ /m, Rit〇=l〇n/[D, R_ = 〇.2n/[I], n=100' The aforementioned wiring lengths are each Lbl(n/2) = 4.867(mm), Lb2 (n/2) = 0.133 (mm) 0 Further, the combined sheet resistance of Rito and Raux becomes 0·196 Ω/[], so that the wiring resistance of the wiring pattern 41c in the above-described interval 可 can be obtained, each of which is:
Rbl(n/2) = 0-260x4897/20 = 63.21 Ω ^Rbl(n/2) = 0-260x4897/20 = 63.21 Ω ^
Rb2(n/2)= 10x133/20 = 66,5Ω。 其次,評價對於本實施例之修整之圖案誤差之影響。 10 考慮上述最佳佈線長度Lb 1 (n/2)、Lb 1 (n/2)中有一1 // m之 圖案誤差產生時,則變成Lbl(n/2)=3.999(mm)、Lbl(n/2)= l.OOl(mm),但此時則變成:Rb2(n/2)= 10x133/20 = 66,5Ω. Next, the influence on the pattern error of the trimming of this embodiment was evaluated. 10 Considering that the pattern error of 1 // m is generated in the above-mentioned optimum wiring lengths Lb 1 (n/2) and Lb 1 (n/2), it becomes Lbl(n/2)=3.999 (mm), Lbl( n/2)= l.OOl(mm), but at this point it becomes:
Rbl(n/2) = 0.260x4866/20 = 63.26Ω、Rbl(n/2) = 0.260x4866/20 = 63.26Ω,
Rb2(n/2)= 10x134/20 = 67 Ω, 15預料有一〇·5%之電阻變化產生。 同樣考慮在上述最佳佈線長度Lbl(n/2)、Lbl(n/2)中有+ 1 // m之圖案誤差產生時,則變成Lb i _)=4 ·〇〇 i (mm)、Lb i _) —0.999(mm),但此時則預料有+〇 5%之電阻變化產生。 如此’依本實施例所進行之修整,與調整圖案寬度後 再進行修整之形態相比之下,較能確保1〇倍以上之修整精 度者。 第11圖係連同比較例!及2,顯示進行前述實施例i 、之仏:日才掃目田線21a或4la整體之佈線電阻及隨之所 包^下卩牛’還有别述佈線電阻之最大值與最小值間 24 1280544 及Γ△广發生之電壓下降之最大值與最小值 輔助佈後,J 較例十不設置Cr膜或銀合金等 5 較例2中’設扣膜作為輔助佈線二阻 者入仍疋错调整佈線圖案21c之寬度進行的。對此, 、,j係對應於先前說明之實施例1,修整則是萨第6 圖區間B1中之輔助佈線即Cr圖案21a2之佈線長度之調整 進了tL又,實驗例2是對應於先前說明之實施例2,修整 則是藉第U®之區間B1中之輔助佈線即Ag合金圖_2 10之佈線長度調整進行者。 參考第11圖,比較例中,電阻值的變動達乃〇Ω 或125.1Ω之多,對應該變動,電塵下降之差△黯叩亦於 有10mA之驅動電流流過時,則達7 5V或ΐ 25ν之多。對 此,在本發明中,因連接部21C或批之佈線長度差所引 15起之佈線圖案21c或41c的電阻值之變動Ar係於實驗例i 時減少到83.4Ω,又在實驗例2時則減少到l5 iQ,因此 可知,電壓下降差謂―亦減少到〇.83ν ’在實驗例2時 可減少到0.15V者。 此外,在以上說明中是考察前述區間B1及區間Β2中 20佈線長度Lblk及佈線長度Lb2k與編號k 一同呈直線變化之 形態,但如同本發明,以佈線長度進行修整時,由第n圖 亦可明白,即使產生有多少圖案誤差,對於電阻值變動並 沒有多大影響’如第12圖所示’亦可對區間bi之佈線長 度LMk及區間们之佈線長&Lb2k進行階梯狀或圓弧狀的 25 1280544 變化。惟,第12圖中,針對先前說明之部分附上同_ 符號,並省略說明。 ^ 又’在第6圖或第n圖之連接部uc或加亦可按情 況’汉於連接資料電極训及驅動電路2扭之連接部。 5 [第3實施例] ° 第13圖係顯示本發明第3實施例之被動矩陣驅動型有 機EL顯示裝置之部分結構。惟,在第13圖中,對於先前 說明過之部分附上同一參考符號,並省略說明。、則 第13圖係與先前說明之第7A圖同樣,位於區間扪 10之剖視圖,但本實施例之被動矩陣驅動型有機EL顯示裝置 係指先前在第6圖所說明之有機£乙顯示裝置2〇之一變形 例,雖具有與其等約略同一之結構,但不同的是,前述IT0 圖案21ai及低電阻圖案21a〗的位置是呈相對位移之狀態 者。 15 在如此情況下,前述端子部21T中,亦將前述低電阻Rb2(n/2) = 10x134/20 = 67 Ω, 15 is expected to have a 〇·5% change in resistance. Similarly, when a pattern error of + 1 // m is generated in the above-mentioned optimum wiring lengths Lb1(n/2) and Lb1(n/2), it becomes Lb i _)=4 ·〇〇i (mm), Lb i _) —0.999 (mm), but at this time it is expected that a resistance change of +〇5% will occur. Thus, the trimming performed in accordance with the present embodiment can ensure a trimming accuracy of 1 or more times as compared with the case of adjusting the width of the pattern and then trimming. Figure 11 is a comparison with the comparison! And 2, showing the implementation of the foregoing embodiment i, the 仏 日 日 扫 扫 扫 扫 扫 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 After the maximum and minimum voltage drop of 1280544 and Γ△ widespread, J is not set to Cr film or silver alloy, etc. Example 5 is better than the case where the buckle film is used as the auxiliary wiring and the second resistance is still wrong. The width of the wiring pattern 21c is adjusted. In this regard, j is corresponding to the first embodiment described above, and the trimming is the adjustment of the wiring length of the auxiliary wiring, that is, the Cr pattern 21a2 in the section B1 of the sixth drawing, into the tL, and the experimental example 2 corresponds to the previous In the second embodiment, the trimming is performed by adjusting the wiring length of the Ag alloy pattern _2 10 in the auxiliary wiring B1 of the U®. Referring to Figure 11, in the comparative example, the variation of the resistance value is as much as 〇 Ω or 125.1 Ω, which should be changed. The difference Δ 电 of the electric dust drop is also 7 5 V when the driving current of 10 mA flows. ΐ 25ν. On the other hand, in the present invention, the variation Ar of the resistance value of the wiring pattern 21c or 41c which is caused by the difference in the wiring length of the connection portion 21C or the batch is reduced to 83.4 Ω in the experimental example i, and in Experimental Example 2 When it is reduced to l5 iQ, it can be seen that the voltage drop difference is also reduced to 〇.83 ν ' can be reduced to 0.15 V in Experimental Example 2. Further, in the above description, it is considered that the wiring length Lblk and the wiring length Lb2k in the interval B1 and the interval Β2 are linearly changed along with the number k. However, as in the present invention, when the wiring length is trimmed, the nth image is also It can be understood that even if there is a pattern error, there is not much influence on the resistance value variation. As shown in Fig. 12, the wiring length LMk of the interval bi and the wiring length & Lb2k of the interval may be stepped or arc-shaped. The shape of 25 1280544 changes. However, in the twelfth figure, the same reference numerals are attached to the portions described above, and the description is omitted. ^ Further, in the connection portion uc of Fig. 6 or Fig. n, it is also possible to connect the data electrode training and the driving circuit 2 to the connection portion. [Third Embodiment] Fig. 13 is a view showing a partial configuration of a passive matrix drive type organic EL display device according to a third embodiment of the present invention. However, in the drawings, the same reference numerals are attached to the portions already described, and the description is omitted. 13 is a cross-sectional view of the section 扪10 as in the previous description of FIG. 7A, but the passive matrix driving type organic EL display device of the present embodiment refers to the organic display device previously described in FIG. The modification of the second embodiment has a configuration similar to that of the first embodiment, but the position of the IT0 pattern 21ai and the low resistance pattern 21a is relatively displaced. In this case, the aforementioned low resistance is also included in the terminal portion 21T.
Cr膜21as除去,只有IT0圖案21ai裸露,可得到與第7B 圖同一之剖面構造。因此,依本實施例,亦可實現一以IT〇 圖案為中介而壓延於軟性基板之良好壓延狀態。 [第4實施例] 20 弟14圖係顯示本發明第4實施例之被動矩陣驅動型有 機EL顯示裝置之部分結構。惟,在第14圖中,對於先前 說明過之部分附上同一參考符號,並省略說明。 第14圖係與先前說明之第7Α圖同樣,位於區間Β1 之剖視圖,但本實施例之被動矩陣驅動有機EL顯示裝置係 26 !28〇544 指先前在第6圖所說明之有機el顯示裝置2〇之一變形 例’雖具有與其等約略同一之結構,但不同的是,前述ιΤ〇 圖案21a!及低電阻圖案21“的位置是上下顛倒者。即,前 述Cr圖案21a2形成上側圖案,IT〇圖案21心則成為下側 5圖案者。 在如此情況下,前述端子部21T中,亦將前述低電阻 Cr膜21a2除去,只有ΙΤΟ圖案21a!裸露,可得到與第7Β 圖同一之剖面構造。因此,依本實施例,亦可實現一以ΙΤΟ 圖案為中介而壓延於軟性基板之良好壓延狀態。 第15圖係第14圖之另一變形例,顯示第14圖中之上 側ΠΌ圖案21ai與下側Cr圖案心的關係是呈相對移位 之形態。 〇 #在如此情況下,前述端子部21T中,亦將前述低電阻 ' 2除去,只有ΙΤΟ圖案21ai裸露,可得到與第7Β 圖同、之剖面構造。因此,依本實施例,亦可實現一以汀〇 圖木為中介而壓延於軟性基板之良好壓延狀態。 [第5實施例] 20 弟16圖係顯示本發明第5實施例之被動 ^顯示裝置之部分結構。惟,在第16圖中,對於先前 祝n卩分附上同-參考賴,並省略說明。 /考罘16圖,在本實施例中,在前述區間B1 二t =形成在前述1T〇圖案Μ上之低電阻a圖 错此,使該部分產生電阻。 在此’將如此形成電阻用之電阻形成部位按所對應之 27 1280544 掃瞄線21a之位置而設置於每一佈線圖案21c上,即調整 其個數或長度,便可按所對應之掃瞄線21a,調整前述佈線 圖案21c之電阻值。 進而,本發明不僅可應用於有機EL顯示裝置,亦可應 5 用於除被動矩陣驅動外之其他電流驅動型顯示裝置,例如 電漿顯示裝置(PDP)、LED陣列顯示裝置,或光源等等方面。 進而,本發明不僅可應用在電流驅動型顯示裝置亦可 應用於被動矩陣驅動型或主動矩陣驅動型之液晶顯示裝 置。 10 [產業可利用性] 依本發明,在將延伸到顯示裝置之顯示區之驅動電極 收斂後連接於驅動電路之連接部中,使輔助電極之長度對 應該連接部之佈線圖案之長度而變化時,可使連接部中相 異之佈線圖案間所產生之電阻差即電壓下降量的差距不受 15 佈線圖案之位置的影響下設定為固定值,可實現顯示裝置 之均一驅動者。 【圖式簡單說明3 第1圖係顯示習知被動矩陣驅動型顯示裝置之概略結 構圖。 20 第2圖係顯示本發明欲解決之課題的示意圖。 第3圖係顯示本發明欲解決之課題之示意圖。 第4圖係顯示本發明第1實施例之被動矩陣驅動型有 機EL顯示裝置之概略結構圖。 第5圖係顯示第4圖之有機EL顯示裝置之部分剖視 28 1280544 圖。 第6圖係顯示第4圖之有機EL顯示裝置之連接部之詳 細結構圖。 第7A圖係顯示第4圖之有機EL顯示裝置之連接部之 5 剖面結構圖。 第7B圖係顯示第4圖之有機EL顯示裝置之連接部之 剖面結構圖。 第8圖係顯示本發明第2實施例之被動矩陣驅動型有 機EL顯示裝置之概略結構圖。 10 第9圖係顯示第8圖之有機EL顯示裝置之連接部之詳 細結構圖。 第10A圖係顯示第8圖之有機EL顯示裝置之連接部 之剖面結構圖。 第10B圖係顯示第8圖之有機EL顯示裝置之連接部 15 之剖面結構圖。 第11圖係顯示本發明之有機EL顯示裝置之特性圖。 第12圖係第6圖之有機顯示裝置之一變形例之示意 圖。 第13圖係本發明第3實施例之被動矩陣驅動型有機 20 EL顯示裝置之部分圖。 第14圖係本發明第4實施例之被動矩陣驅動型有機 EL顯示裝置之部分圖。 第15圖係本發明第4實施例之被動矩陣驅動型有機 EL顯示裝置之部分圖。 29 1280544 第16圖係本發明第5實施例之被動矩陣驅動型有機 EL顯示裝置之部分圖。 【主要元件符號說明】 10,20,40...有機EL顯示裝置 20B...發光層 11,21...基板 20C...電子輸送層 11A,21A···顯示區 20D...陰極 11C,21C,41C··.連接部 20E…有機EL元件 11 a,21 a· · ·掃'暗、線 21T,41T.··端子部 llb,21b···資料線 圖案 11c...佈線圖案 213_2,41 a]…Cr 圖案 12 A,12B,22 A,22B…驅動電路 20A...電洞輸送層 21c...佈線圖案 30When the Cr film 21as is removed, only the IT0 pattern 21ai is exposed, and the same cross-sectional structure as that of Fig. 7B can be obtained. Therefore, according to this embodiment, it is also possible to realize a good rolling state in which the IT substrate is rolled over the flexible substrate. [Fourth Embodiment] FIG. 14 shows a partial configuration of a passive matrix drive type organic EL display device according to a fourth embodiment of the present invention. However, in the above, the same reference numerals will be given to the portions already described, and the description will be omitted. Figure 14 is a cross-sectional view of the interval Β1 as in the seventh embodiment described above, but the passive matrix driven organic EL display device 26! 28〇544 of the present embodiment refers to the organic EL display device previously described in Fig. 6. The second modification of the second embodiment has a structure similar to that of the same, but the position of the ιΤ〇 pattern 21a! and the low resistance pattern 21 is reversed. That is, the Cr pattern 21a2 forms an upper pattern. In this case, the low-voltage Cr film 21a2 is removed from the terminal portion 21T, and only the meander pattern 21a! is exposed, and the same profile as that of the seventh figure can be obtained. Therefore, according to the present embodiment, a good rolling state in which the ruthenium pattern is used for rolling on the flexible substrate can be realized. Fig. 15 is another modification of Fig. 14, showing the upper side ΠΌ pattern in Fig. 14. The relationship between 21ai and the lower Cr pattern core is a relative displacement. In this case, in the terminal portion 21T, the low resistance '2 is also removed, and only the ΙΤΟ pattern 21ai is exposed, and the ΙΤΟ pattern is obtained. The seventh embodiment is the same as the cross-sectional structure. Therefore, according to the present embodiment, a good rolling state in which the soft substrate is rolled by the Tingyu wood can be realized. [Embodiment 5] 20 Part of the structure of the passive display device of the fifth embodiment of the present invention. However, in the sixteenth embodiment, the same reference frame is attached to the prior art, and the description is omitted. In the present embodiment, In the above-mentioned interval B1, two t = the low-resistance a pattern formed on the aforementioned 1T-turn pattern 错 causes the portion to generate a resistance. Here, the resistance forming portion of the resistor is formed so as to correspond to the 27 1280544 scan. The position of the line 21a is set on each of the wiring patterns 21c, that is, the number or length thereof is adjusted, and the resistance value of the wiring pattern 21c can be adjusted according to the corresponding scanning line 21a. Further, the present invention can be applied not only to The organic EL display device may also be used for other current-driven display devices other than passive matrix driving, such as a plasma display device (PDP), an LED array display device, or a light source, etc. Further, the present invention can be used not only Applied in current The movable display device can also be applied to a passive matrix drive type or an active matrix drive type liquid crystal display device. 10 [Industrial Applicability] According to the present invention, a drive electrode extending to a display area of a display device is converged and connected to a drive When the length of the auxiliary electrode is changed in accordance with the length of the wiring pattern of the connection portion in the connection portion of the circuit, the difference in resistance between the wiring patterns in the connection portion, that is, the voltage drop amount is not affected by the 15 wiring. The uniform value of the display device can be realized by the influence of the position of the pattern, and the uniform driver of the display device can be realized. [Simplified Drawing 3] FIG. 1 is a schematic structural view showing a conventional passive matrix driving type display device. 20 Fig. 2 is a schematic view showing the problem to be solved by the present invention. Figure 3 is a schematic diagram showing the subject matter to be solved by the present invention. Fig. 4 is a view showing a schematic configuration of a passive matrix drive type organic EL display device according to a first embodiment of the present invention. Fig. 5 is a partial cross-sectional view showing the organic EL display device of Fig. 4, Fig. 28 1280544. Fig. 6 is a detailed structural view showing a connection portion of the organic EL display device of Fig. 4. Fig. 7A is a cross-sectional structural view showing a connection portion of the organic EL display device of Fig. 4. Fig. 7B is a cross-sectional structural view showing the connection portion of the organic EL display device of Fig. 4. Fig. 8 is a view showing a schematic configuration of a passive matrix drive type organic EL display device according to a second embodiment of the present invention. 10 Fig. 9 is a detailed structural view showing a connection portion of the organic EL display device of Fig. 8. Fig. 10A is a cross-sectional structural view showing a connection portion of the organic EL display device of Fig. 8. Fig. 10B is a cross-sectional structural view showing the connecting portion 15 of the organic EL display device of Fig. 8. Fig. 11 is a view showing the characteristics of the organic EL display device of the present invention. Fig. 12 is a schematic view showing a modification of one of the organic display devices of Fig. 6. Figure 13 is a partial view of a passive matrix drive type organic 20 EL display device according to a third embodiment of the present invention. Figure 14 is a partial view showing a passive matrix driving type organic EL display device of a fourth embodiment of the present invention. Figure 15 is a partial view showing a passive matrix driving type organic EL display device of a fourth embodiment of the present invention. 29 1280544 Fig. 16 is a partial view of a passive matrix drive type organic EL display device according to a fifth embodiment of the present invention. [Description of main component symbols] 10, 20, 40... Organic EL display device 20B... Light-emitting layer 11, 21... Substrate 20C... Electron transport layer 11A, 21A··· Display area 20D... Cathode 11C, 21C, 41C.. connection portion 20E... organic EL element 11 a, 21 a · · · sweep 'dark, line 21T, 41T. · terminal portion 11b, 21b · data line pattern 11c... Wiring pattern 213_2, 41 a]...Cr pattern 12 A, 12B, 22 A, 22B... drive circuit 20A... hole transport layer 21c... wiring pattern 30
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