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TWI278149B - Land grid array electronic connector - Google Patents

Land grid array electronic connector Download PDF

Info

Publication number
TWI278149B
TWI278149B TW94103751A TW94103751A TWI278149B TW I278149 B TWI278149 B TW I278149B TW 94103751 A TW94103751 A TW 94103751A TW 94103751 A TW94103751 A TW 94103751A TW I278149 B TWI278149 B TW I278149B
Authority
TW
Taiwan
Prior art keywords
contacts
package
housing
grid array
land grid
Prior art date
Application number
TW94103751A
Other languages
Chinese (zh)
Other versions
TW200607170A (en
Inventor
Yao-Chi Huang
Nan-Hong Lin
Fu-Bin Xie
Fang-Jwu Liao
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38626117&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI278149(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from TW093212206U external-priority patent/TWM266621U/en
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW94103751A priority Critical patent/TWI278149B/en
Publication of TW200607170A publication Critical patent/TW200607170A/en
Application granted granted Critical
Publication of TWI278149B publication Critical patent/TWI278149B/en

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A land grid array connector for electrically connecting an IC package and a printed circuit board includes a housing and a number of contacts received in the housing. The housing has a number of passageways arrayed in matrix for receiving the contacts. The contact has a spring arm and a contacting portion formed at a free end of the spring arm. When being received in the housing, spring arms of some contacts are opposite with the spring arms of the others. When the IC package is mounted to the connector, the contacts each is pressed to apply an aclinic friction on the IC package. The frictions caused by opposite spring arms are rightabout. Thus a whole friction applied by the contacts can be reduced, and thereby a horizontal moving of the IC package is abated.
TW94103751A 2004-08-02 2005-02-04 Land grid array electronic connector TWI278149B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94103751A TWI278149B (en) 2004-08-02 2005-02-04 Land grid array electronic connector

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW093212206U TWM266621U (en) 2004-08-02 2004-08-02 Land grid array electrical connector
TW94103751A TWI278149B (en) 2004-08-02 2005-02-04 Land grid array electronic connector

Publications (2)

Publication Number Publication Date
TW200607170A TW200607170A (en) 2006-02-16
TWI278149B true TWI278149B (en) 2007-04-01

Family

ID=38626117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94103751A TWI278149B (en) 2004-08-02 2005-02-04 Land grid array electronic connector

Country Status (1)

Country Link
TW (1) TWI278149B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI755070B (en) * 2019-10-07 2022-02-11 英屬開曼群島商鴻騰精密科技股份有限公司 Electrical connector

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112467438A (en) * 2018-04-27 2021-03-09 富顶精密组件（深圳）有限公司 Electrical connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI755070B (en) * 2019-10-07 2022-02-11 英屬開曼群島商鴻騰精密科技股份有限公司 Electrical connector

Also Published As

Publication number Publication date
TW200607170A (en) 2006-02-16

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Legal Events

Date Code Title Description
MC4A Revocation of granted patent