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TWI267138B - Plasma processing apparatus and plasma processing method - Google Patents

Plasma processing apparatus and plasma processing method

Info

Publication number
TWI267138B
TWI267138B TW094105665A TW94105665A TWI267138B TW I267138 B TWI267138 B TW I267138B TW 094105665 A TW094105665 A TW 094105665A TW 94105665 A TW94105665 A TW 94105665A TW I267138 B TWI267138 B TW I267138B
Authority
TW
Taiwan
Prior art keywords
plasma
processing chamber
plasma processing
wall
electrode
Prior art date
Application number
TW094105665A
Other languages
Chinese (zh)
Other versions
TW200540987A (en
Inventor
Tsutomu Satoyoshi
Ryo Sato
Kazuo Sasaki
Hitoshi Saito
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200540987A publication Critical patent/TW200540987A/en
Application granted granted Critical
Publication of TWI267138B publication Critical patent/TWI267138B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • GPHYSICS
    • G04HOROLOGY
    • G04BMECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B37/00Cases
    • G04B37/12Cases for special purposes, e.g. watch combined with ring, watch combined with button
    • G04B37/122Cases for special purposes, e.g. watch combined with ring, watch combined with button used as a mirror
    • GPHYSICS
    • G04HOROLOGY
    • G04BMECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B37/00Cases
    • G04B37/0008Cases for pocket watches and wrist watches
    • GPHYSICS
    • G04HOROLOGY
    • G04BMECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B45/00Time pieces of which the indicating means or cases provoke special effects, e.g. aesthetic effects
    • G04B45/0069Cases and fixed parts with a special shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32174Circuits specially adapted for controlling the RF discharge
    • H01J37/32183Matching circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

A plane parallel plasma processing apparatus includes an impedance adjustment unit having a capacitive component, which is disposed between a lower electrode and a processing chamber. The impedance adjustment unit adjusts the value of the impedance over the path extending from an upper electrode to a grounded casing of a matching circuit via plasma, the lower electrode and the wall of the processing chamber to a level lower than the value of the impedance over the path extending from the upper electrode to the grounded casing of the matching circuit via the plasma and the wall of the processing chamber, and thus, highly uniform plasma can be generated by minimizing the generation of plasma in the space between the cathode electrode and the processing chamber wall.
TW094105665A 2004-04-30 2005-02-24 Plasma processing apparatus and plasma processing method TWI267138B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004136566 2004-04-30
JP2004381290A JP4553247B2 (en) 2004-04-30 2004-12-28 Plasma processing equipment

Publications (2)

Publication Number Publication Date
TW200540987A TW200540987A (en) 2005-12-16
TWI267138B true TWI267138B (en) 2006-11-21

Family

ID=35185885

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105665A TWI267138B (en) 2004-04-30 2005-02-24 Plasma processing apparatus and plasma processing method

Country Status (4)

Country Link
US (1) US20050241769A1 (en)
JP (1) JP4553247B2 (en)
KR (1) KR100623829B1 (en)
TW (1) TWI267138B (en)

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TWI747998B (en) * 2016-11-18 2021-12-01 美商帕斯馬舍門有限責任公司 Ion filter

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JP6218650B2 (en) * 2014-03-11 2017-10-25 東京エレクトロン株式会社 Plasma processing equipment
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CN105555002A (en) * 2016-02-01 2016-05-04 江苏微导纳米装备科技有限公司 Dynamic parallel-plate plasma generator
JP6769127B2 (en) 2016-06-21 2020-10-14 東京エレクトロン株式会社 Plasma processing equipment
JP7017306B2 (en) * 2016-11-29 2022-02-08 株式会社日立ハイテク Vacuum processing equipment
JP7061511B2 (en) * 2018-05-10 2022-04-28 東京エレクトロン株式会社 Filter device and plasma processing device
JP2019212648A (en) * 2018-05-31 2019-12-12 東京エレクトロン株式会社 Film forming apparatus and film forming method
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KR102603429B1 (en) * 2020-10-30 2023-11-16 세메스 주식회사 Apparatus for controlling impedance and system for treating substrate with the apparatus
CN112501591B (en) * 2020-11-12 2022-10-21 北京北方华创微电子装备有限公司 Semiconductor process chamber
JP7071008B2 (en) * 2020-12-04 2022-05-18 株式会社日立ハイテク Plasma processing equipment and plasma processing method
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CN114695065B (en) * 2022-03-31 2025-06-24 北京北方华创微电子装备有限公司 Semiconductor processing equipment

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI747998B (en) * 2016-11-18 2021-12-01 美商帕斯馬舍門有限責任公司 Ion filter

Also Published As

Publication number Publication date
KR20060047589A (en) 2006-05-18
JP4553247B2 (en) 2010-09-29
TW200540987A (en) 2005-12-16
JP2005340760A (en) 2005-12-08
US20050241769A1 (en) 2005-11-03
KR100623829B1 (en) 2006-09-13

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