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TWI265613B - Heat sink - Google Patents

Heat sink

Info

Publication number
TWI265613B
TWI265613B TW094128969A TW94128969A TWI265613B TW I265613 B TWI265613 B TW I265613B TW 094128969 A TW094128969 A TW 094128969A TW 94128969 A TW94128969 A TW 94128969A TW I265613 B TWI265613 B TW I265613B
Authority
TW
Taiwan
Prior art keywords
protruding portion
heat sink
molding flow
tunnel
flow inlet
Prior art date
Application number
TW094128969A
Other languages
Chinese (zh)
Other versions
TW200709368A (en
Inventor
Ching-Chun Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094128969A priority Critical patent/TWI265613B/en
Application granted granted Critical
Publication of TWI265613B publication Critical patent/TWI265613B/en
Publication of TW200709368A publication Critical patent/TW200709368A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

A heat sink is applied in a package structure. The heat sink includes a body, a first protruding portion and a second protruding portion. The body has a surface. The first protruding portion and the second protruding portion are disposed on the surface. A tunnel is formed between the first protruding portion and the second protruding portion. The tunnel is used for a molding flow passing therethrough. The body has a plurality of corners including a specific corner. The distance between the molding flow inlet and the specific corner is equal to or larger than that between the molding flow inlet and any of the other corners. The tunnel connects the molding flow inlet and the specific corner.
TW094128969A 2005-08-24 2005-08-24 Heat sink TWI265613B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094128969A TWI265613B (en) 2005-08-24 2005-08-24 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094128969A TWI265613B (en) 2005-08-24 2005-08-24 Heat sink

Publications (2)

Publication Number Publication Date
TWI265613B true TWI265613B (en) 2006-11-01
TW200709368A TW200709368A (en) 2007-03-01

Family

ID=38122262

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128969A TWI265613B (en) 2005-08-24 2005-08-24 Heat sink

Country Status (1)

Country Link
TW (1) TWI265613B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2002240C2 (en) * 2008-11-21 2010-05-25 Fico Bv DEVICE AND METHOD FOR AT LEAST PARTLY COVERING OF A CLOSED FLAT CARRIER WITH ELECTRONIC COMPONENTS.

Also Published As

Publication number Publication date
TW200709368A (en) 2007-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees